Composite Ejector Patents (Class 347/63)
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Patent number: 6598961Abstract: A bubble-jet type ink-jet printhead, includes a substrate, a nozzle plate, a wall, and a heater, wherein the heater is interposed between the substrate and the nozzle plate to divide an ink chamber into a main ink chamber and a secondary ink chamber, wherein a main bubble and a secondary bubble are generated. The printhead may further include an ink channel for introducing ink into the secondary ink chamber for supplying the ink to the main ink chamber. The printhead according to the present invention consumes less energy, prevents a backflow of ink, and operates at increased speed.Type: GrantFiled: November 29, 2001Date of Patent: July 29, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Keon Kuk, Doo-jin Maeng, Yong-soo Oh
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Patent number: 6598959Abstract: In an apparatus producing a high-quality and high-resolution image having high water and light resistances with an orifice having a diameter less than &phgr;25 &mgr;m (less than 500 &mgr;m2 in terms of cross-sectional area of the orifice) by use of a fine particle dispersion recording composition, nozzle clogging can be prevented. A recording is accomplished by a liquid jet recording apparatus for ejecting a recording composition including dispersed fine particles from a small orifice toward a receiving medium, wherein a size Dp of the fine particles and a diameter Do of the small orifice are determined by a relationship 0.001≦Dp/Do≦0.01.Type: GrantFiled: November 16, 2001Date of Patent: July 29, 2003Assignee: Ricoh Company Ltd.Inventor: Takuro Sekiya
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Patent number: 6595622Abstract: A liquid ejecting apparatus includes a plurality of liquid ejecting devices arranged in one direction on a silicon substrate and a plurality of liquid ejecting nozzles arranged in correspondence with the liquid ejecting devices. At least part of the silicon substrate has a thickness of not less than 700 &mgr;m. An ink jet printer using the liquid ejecting apparatus is also provided. The liquid ejecting apparatus has little warpage, can perform high quality image recording with high production yield and has a long service life. The ink jet printer enables system construction at low cost and high quality image recording.Type: GrantFiled: March 27, 2002Date of Patent: July 22, 2003Assignee: Fuji Photo Film Co., Ltd.Inventor: Ryoichi Yamamoto
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Publication number: 20030132990Abstract: An inkjet recording head and an apparatus including the inkjet recording head are provided for expelling a fine ink drop which is less than or equal to 1 pico-liter (pl). The inkjet recording head has a substrate having a heater for ejecting an ink drop, and an ink feed inlet formed thereon; a barrier layer having an ink passage which communicates the ink feed inlet with the heater; and an orifice plate having an ink nozzle formed facing the heater, the ink nozzle communicating with the ink passage. The barrier layer is made from a negative photosensitive resin. The orifice plate includes a metallic thin film having a thickness in a range of about 0.1 to 2.0 &mgr;m.Type: ApplicationFiled: January 16, 2003Publication date: July 17, 2003Inventor: Masao Mitani
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Patent number: 6592209Abstract: The invention provides a printer, a printer head, and a method of producing the printer head. In particular, the invention is applied to a printer which makes use of a process in which ink drops are caused to flow out by heating using a heater, so that an orifice plate can be bonded by sufficiently bringing it into close contact with what it is to be bonded to. In the invention, by disposing first, second, and third wiring patterns below partitions of corresponding ink chambers, thickness-direction stepped portions are prevented from being formed at least at the partitions of the corresponding ink chambers.Type: GrantFiled: November 7, 2001Date of Patent: July 15, 2003Assignee: Sony CorporationInventors: Takaaki Miyamoto, Minoru Kohno, Toru Tanikawa
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Publication number: 20030128255Abstract: A method for manufacturing a fluid injection head. The fluid injection head structure is formed on a substrate and has a manifold therein, bubble generators, a conductive trace, and at least two rows of chambers adjacent to the manifold in flow communication with the manifold. The conductive trace disposed on a top surface of the substrate and partially disposed between the two rows of the chambers above the manifold is used to drive the bubble generator.Type: ApplicationFiled: March 20, 2003Publication date: July 10, 2003Inventors: Tsung-Wei Huang , Chih-Ching Chen
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Patent number: 6582064Abstract: A fluid ejection device includes a substrate, a stack of thin film layers and a further substrate. The substrate has a first surface and a second surface, and defines a fluid supply conduit. The stack of thin film layers has a first surface and a second surface, with the first surface of the stack of thin film layers being affixed to the second surface of the substrate. In one embodiment, the stack of thin film layers includes at least one ink energizing element, and defines a plurality of fluid filter openings that are in fluid communication with the fluid supply conduit of the substrate. The fluid filter openings function as a fluid. The further substrate has a first surface coupled to the second surface of the stack of thin film layers, and an exterior second surface.Type: GrantFiled: April 3, 2002Date of Patent: June 24, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Antonio S. Cruz-Uribe, Naoto A. Kawamura
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Publication number: 20030112295Abstract: Pulse jet printhead assemblies having multiple reservoirs and multiple printhead dies, as well as methods for their use in the deposition of fluids, typically fluids containing a biopolymer or precursor thereof, onto a substrate surface, are provided. The subject printheads are characterized by having a multiple printhead die printhead and a multiple reservoir housing affixed to the multiple die printhead. In using the subject printhead assemblies, the firing chambers of the printhead assembly are loaded with a volume of fluid that includes a biopolymer or precursor thereof. The loaded printhead assembly is then placed in opposing relation to a surface of a substrate and actuated to deposit a volume of fluid on the substrate. The subject printhead assemblies find use in a variety of applications, including the production of biopolymeric arrays.Type: ApplicationFiled: December 18, 2001Publication date: June 19, 2003Inventors: Lawrence J. DaQuino, Yat-Kwong Ip
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Liquid discharging method, liquid discharge head and recording apparatus using liquid discharge head
Patent number: 6578952Abstract: The present invention provides a liquid discharging method that uses a heat generating member for generating thermal energy for generating a bubble in liquid, a discharge port for discharging the liquid, a flow path communicated with the discharge port and having a bubble generating area for generating the bubble in the liquid, a movable member having a free end and capable of being displaced as the bubble grows, and a regulating portion for regulating a displacement amount of the movable member. The flow path is formed by joining a substantially flat substrate including the heat generating body and the movable member to a top plate opposed to the substrate and including the regulating portion and the liquid is discharged from the discharge port by energy generated by generation of the bubble. When both a volume change ratio of the bubble and a displacement volume change ratio of the movable member tend to increase, the displacement of the movable member is regulated by the regulating portion.Type: GrantFiled: July 26, 2000Date of Patent: June 17, 2003Assignee: Canon Kabushiki KaishaInventors: Hiroyuki Sugiyama, Sadayuki Sugama, Hiroyuki Ishinaga -
Publication number: 20030098900Abstract: In order to provide a low-cost large substrate for full multi-bubble-jet head, a method for manufacturing an ink-jet head in which ink-discharge-pressure generation elements are provided on a substrate, discharge ports are disposed in a plate facing the ink-discharge-pressure generation elements, and ink is discharged from the discharge ports by generating bubbles within ink includes the steps of forming a threaded port, serving as an ink supply port, in a ceramic substrate, filling the threaded ports with a filler by melting the filler, flattening a portion of the threaded port filled with the filler in the substrate, depositing a silicon nitride film on the surface of the substrate in which the portion of the threaded port is flattened, depositing a layer made of a high-heat-conduction material on the silicon nitride film, forming the ink-discharge-pressure generation elements on the high-heat-conduction layer, forming ink discharge portions having the corresponding discharge ports on the substrate having tType: ApplicationFiled: November 22, 2002Publication date: May 29, 2003Applicant: Canon Kabushiki KaishaInventor: Hiroyuki Tokunaga
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Publication number: 20030095166Abstract: A method of forming a manifold through a substrate of a printhead substructure is disclosed. The substrate has an ink reservoir-facing side and an opposing transducer-supporting side. The transducer-supporting side of the substrate is introduced to an etchant. A laser bean is used to irradiate the etchant contacting side of the substrate. The irradiated areas of the substrate are thereby etched to define a first portion of the manifold therein. A second portion of the manifold is formed, preferably by sand blasting, to connect to the first portion. A printhead substructure that includes a substrate having a manifold formed according to the method is also disclosed.Type: ApplicationFiled: November 16, 2001Publication date: May 22, 2003Inventors: Kee Cheong Tan, Pean Lim, Kiong Chin Chng
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Patent number: 6561625Abstract: A bubble-jet type ink-jet printhead and manufacturing method thereof including a substrate integrally having an ink supply manifold, an ink chamber, and an ink channel; a nozzle plate having a nozzle on the substrate; a heater centered around the nozzle and an electrode for applying current to the heater on the nozzle plate; and an adiabatic layer on the heater for preventing heat generated by the heater from being conducted upward from the heater. Alternatively, a bubble-jet type ink-jet printhead may be formed on a silicon-on-insulator (SOI) wafer having a first substrate, an oxide layer, and a second substrate stacked thereon and include an adiabatic barrier on the second substrate. In the bubble-jet type ink-jet printhead and manufacturing method thereof, the adiabatic layer or the adiabatic barrier is provided to transmit most of the heat generated by the heater to ink under the heater, thereby increasing energy efficiency.Type: GrantFiled: December 17, 2001Date of Patent: May 13, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Doo-jin Maeng, Keon Kuk, Yong-soo Oh, Hyeon-cheol Kim, Sang-wook Lee
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Patent number: 6561630Abstract: An ink jet printhead including a thin film substructure including an elongated gold trace having openings formed therein. An ink barrier layer is disposed on the thin film substructure in contact with the gold trace and the regions exposed by the openings in the elongated gold trace. The openings are configured to provide for reliable adhesion between the ink barrier layer and the regions exposed by the openings in the elongated gold trace.Type: GrantFiled: April 12, 2002Date of Patent: May 13, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventor: Clayton L. Holstun
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Patent number: 6561626Abstract: An ink-jet print head preventing thermal accumulation on a nozzle plate includes a substrate, a channel formed in the substrate to supply ink, a nozzle plate connected to the substrate and including a nozzle corresponding to the channel, a heat element formed in the nozzle plate to surround the nozzle, a thermal conduction layer formed on an upper side of the heat element formed between the thermal conduction layer and the heat element, and a thermal shunt spaced-apart from the heat element by a predetermined distance not to overlap the heat element in a direction parallel to the nozzle plate and connecting the thermal conduction layer to the substrate. Redundant heat generated from the heat element is not accumulated on a membrane of the nozzle plate but is rapidly absorbed into an inorganic thermal conduction layer formed in the membrane and is transferred to the bulk silicon substrate through a metallic thermal bridge, such as the thermal shunt.Type: GrantFiled: April 15, 2002Date of Patent: May 13, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-sik Min, Seo-hyun Cho, Sang-wook Lee, Jun-hyub Park, Yong-shik Park, Kyong-il Kim
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Publication number: 20030085957Abstract: A fluid injection head structure and method for manufacturing the same are provided. The fluid injection head structure is formed on a substrate and has a manifold therein, bubble generators, a conductive trace, and at least two rows of chambers adjacent to the manifold in flow communication with the manifold. The conductive trace disposed on a top surface of the substrate and partially disposed between the two rows of the chambers above the manifold is used to drive the bubble generator.Type: ApplicationFiled: October 31, 2002Publication date: May 8, 2003Inventors: Tsung-Wei Huang, Chih-Ching Chen
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Publication number: 20030085958Abstract: An image forming method comprises steps of: ejecting charged matter applied an external force from a recording head placed opposed to a record medium; applying a voltage to an intermediate electrode installed between the recording head and the record medium and controlling flying of the ejected charged matter; applying a predetermined voltage to an auxiliary electrode placed between the intermediate electrode and the recording head, and controlling a potential gradient between the recording head and the intermediate electrode; and hitting the charged matter on the record medium.Type: ApplicationFiled: October 16, 2002Publication date: May 8, 2003Applicant: FUJI PHOTO FILM CO., LTD.Inventor: Koji Furukawa
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Patent number: 6557968Abstract: A fluid jetting apparatus for a print head employed in an output apparatus, and a manufacturing process thereof. The process for manufacturing a fluid jetting apparatus includes: (1) forming a heat driving part having a sacrificial layer; (2) forming a membrane on the heat driving part which includes the sacrificial layer; (3) forming a nozzle part on the membrane; and (4) removing the sacrificial layer. The step (1) further includes: (i) forming an electrode and an exothermic body on a substrate; (ii) laminating a working fluid barrier on the electrode and the exothermic body, and forming a working fluid chamber in the working fluid barrier; (iii) forming a protective layer on the working fluid barrier, the electrode, and the exothermic body; (iv) forming a sacrificial layer within the working fluid chamber at a same height as the working fluid barrier.Type: GrantFiled: January 11, 2002Date of Patent: May 6, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Byoung-chan Lee, Soon-cheol Kweon, Kyoung-jin Park
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Publication number: 20030081071Abstract: An inkjet printhead includes a substrate having an ink feed slot formed therein. The inkjet printhead includes drop generators and ink feed channels. Each drop generator has a nozzle and a vaporization chamber. At least one ink feed channel is fluidically coupled to each vaporization chamber and is fluidically coupled to the ink feed slot. A thin-film structure is supported by the substrate and defines a first portion of each ink feed channel. An orifice layer supported by the substrate defines the nozzles and the vaporization chambers in the drop generators. The orifice layer defines a second portion of each ink feed channel.Type: ApplicationFiled: October 31, 2001Publication date: May 1, 2003Inventors: Matthew D. Giere, Colin C. Davis, James A. Feinn
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Publication number: 20030081073Abstract: A fluid ejection device comprising a composite substrate, wherein the composite substrate has two substrates with a patterned etch mask therebetween, and a fluid channel.Type: ApplicationFiled: October 31, 2001Publication date: May 1, 2003Inventors: Chien-Hua Chen, Charles C. Haluzak
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Publication number: 20030081072Abstract: A thermal-type drop generator for ejecting droplets of liquid having ultra-small volumes. In one embodiment the drop generator includes a chamber defined in part by an orifice member. The chamber is supported by a rigid substrate. Removable material is used in fabricating the chamber.Type: ApplicationFiled: October 31, 2001Publication date: May 1, 2003Inventor: Kenneth E. Trueba
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Patent number: 6554403Abstract: A substrate for a fluid ejection device includes a first side, a second side opposite the first side, spaced etch stops extending into the substrate from the first side, and a fluidic channel communicating with the first side and the second side, wherein a first portion of the fluidic channel extends from the first side toward the second side between the spaced etch stops and a second portion of the fluidic channel extends from the second side toward the first side to the spaced etch stops.Type: GrantFiled: April 30, 2002Date of Patent: April 29, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Kenneth Michael Kramer
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Patent number: 6540334Abstract: The invention provides a method for reducing ink corrosion of exposed metal layers on a chip surface of a semiconductor chip for an ink jet printhead. The method includes depositing a protective layer in a plasma process to the chip surface, the protective layer being deposited adjacent ink ejectors so that the protective layer substantially circumscribes an ink via in the chip. A thick film layer is applied to the protective layer and chip, whereby the protective layer and thick film layer are sufficient to promote increased adhesion between the thick film layer and a nozzle plate attached to the thick film layer thereby substantially reducing a tendency for the nozzle plate and thick film layer to delaminate from one another during printhead manufacture or use and interrupting contact between ink and the exposed metal layers on the chip surface.Type: GrantFiled: April 30, 2002Date of Patent: April 1, 2003Assignee: Lexmark International, Inc.Inventors: Jim Michael Mrvos, George Keith Parish, Kristi Maggard Rowe
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Patent number: 6536877Abstract: A printer and a printer head employing a thermal inkjet method are disclosed. A heater element is arranged so as to overlie a wiring pattern layer carried by a semiconductor substrate, or a wiring pattern portion for power supplying or a wiring pattern portion for grounding, the wiring pattern portions being carried by a semiconductor substrate. This arrangement allows heat generated by the heater element to be efficiently transferred to a liquid ink chamber.Type: GrantFiled: July 31, 2001Date of Patent: March 25, 2003Assignee: Sony CorporationInventors: Takaaki Miyamoto, Toru Tanikawa, Hideki Mori
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Publication number: 20030052947Abstract: This specification discloses a structure of an inkjet printhead chip and the method for making the same. A silicon substrate installed with a thermal element is covered with a photoresist layer or polymer material as a barrier layer. A sandblasting process is employed to make a slot on the silicon substrate as an ink channel. A photolithographic process is used to form a pattern on the barrier layer, which is then etched to form many ink cavities in fluid communications with the ink channel and pillars between the ink chambers. Finally, the barrier layer is attached onto a polymer nozzle plate by lamination. The pillars are formed between the ink cavities and the ink channel so that the polymer does not sink at the ink cavities or around the nozzles during lamination, thus ensuring the correction ejection direction of the nozzles.Type: ApplicationFiled: August 7, 2002Publication date: March 20, 2003Inventors: Chen-Hua Lin, Ming-Hsun Yang
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Patent number: 6533400Abstract: There is disclosed a liquid discharge head comprising: a plurality of discharge ports for discharging a liquid; a plurality of liquid flow paths whose one end portion always communicates with each of the discharge ports and which comprise a bubble generating area for generating a bubble in the liquid; bubble generating means for generating an energy to generate and grow the bubble; a plurality of liquid supply ports, disposed in the liquid flow paths, for communicating with a common liquid supply chamber; and a movable member having a free end supported at a slight gap with respect to the liquid flow path of the liquid supply port, so that recording of a high quality level image is achieved at a high speed. When a volume of a liquid droplet discharged from the discharge port is Vd, and during discharge of the liquid from the discharge port, a drawing volume from the discharge port to a liquid surface retracted to maximum into the liquid flow path is Vm, a relation of Vd>Vm is established.Type: GrantFiled: August 31, 2000Date of Patent: March 18, 2003Assignee: Canon Kabushiki KaishaInventors: Kiyomitsu Kudo, Hiroshi Sugitani, Masanori Takenouchi, Masami Ikeda, Masahiko Kubota, Ryoji Inoue, Takashi Saito
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Patent number: 6527368Abstract: In one embodiment, a fluid ejection device comprises a substrate having a first surface, and a fluid slot in the first surface. The device further comprises a fluid ejector formed over the first surface of the substrate, and a chamber layer formed over the first surface of the substrate. The chamber layer defines a chamber about the fluid ejector, wherein fluid flows from the fluid slot towards the to be ejected therefrom. The chamber layer has a discontinuity, wherein the discontinuity is positioned over the fluid slot.Type: GrantFiled: April 30, 2002Date of Patent: March 4, 2003Assignee: Hewlett-Packard CompanyInventors: Manish Giri, Philip H. Harding, Mark Sanders Taylor, Jeffrey S. Hess
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Patent number: 6527371Abstract: The present invention provides an ink jet recording head in which the degree of freedom in the design of the arranged position of an electric signal input-output terminal is enhanced, its manufacturing method and an ink jet recording device, the invention is characterized as follows. The ink jet recording head is formed by laminating a heater element substrate in which a heater element and others are arranged and a passage substrate in which nozzles and others are formed. When the nozzles and others are formed by etching in the passage substrate, a cut-out portion for exposing an electric signal input-output terminal of the heater element substrate is also formed. Therefore, the degree of freedom in the design of the shape and the position of the cut-out portion in the head chip is enhanced.Type: GrantFiled: May 15, 2001Date of Patent: March 4, 2003Assignee: Fuji Xerox Co., Ltd.Inventors: Kenji Yamazaki, Masaki Kataoka, Yoshihisa Ueda, Michiaki Murata
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Publication number: 20030038864Abstract: A structure of a printhead for raising its product acceptance rate and improving its quality is provided. The structure of a printhead includes a base layer, a pattern layer disposed on the base layer, a channel barrier layer having a dry film, an ink channel, a flow channel and plural ink cavities on the pattern layer, and a nozzle plate adhered to the dry film of the channel barrier layer by thermal compression. The pattern layer further includes a flow pattern and a base pattern surrounding a central location for forming thereabove the ink channel.Type: ApplicationFiled: June 13, 2002Publication date: February 27, 2003Applicant: Microjet Technology Co., Ltd.Inventors: Tse-Chi Mou, Ying-Lun Chang, Cheng-Hung Yu, Chin-Yi Chou
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Patent number: 6520627Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.Type: GrantFiled: February 1, 2002Date of Patent: February 18, 2003Assignee: Hewlett-Packard CompanyInventors: Chien-Hau Chen, Donald E. Wenzel, Qin Liu, Naoto Kawamura, Richard W. Seaver, Carl Wu, Colby Van Vooren, Jeffery S. Hess, Colin C. Davis
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Patent number: 6513913Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.Type: GrantFiled: June 28, 2001Date of Patent: February 4, 2003Assignee: Hewlett-Packard CompanyInventors: Donald W Schulte, Richard Todd Miller, Susanne L Kumpf
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Patent number: 6513896Abstract: Inkjet printheads capable of printing smaller and larger drop-weight quantities of ink, and methods of manufacturing the inkjet printheads, are disclosed. The inkjet printhead includes a substrate. One or more portions of the substrate may be etched such that the substrate might have different thicknesses. A thin-film layer is connected to the substrate and contains independently addressable ink-energizing elements, preferably resistors. An orifice layer having a substantially planar exterior surface is applied directly to the thin-film layer. Consequently, the thickness of the orifice layer varies with the thickness of the substrate. At least one firing chamber is defined in each portion of the orifice layer with a different thickness and, preferably, different-sized resistors. Alternatively, the orifice layer has a substantially uniform thickness. In order to achieve the multiple drop-weight capability of the present invention, firing chambers of different volumes are provided.Type: GrantFiled: March 10, 2000Date of Patent: February 4, 2003Assignee: Hewlett-Packard CompanyInventor: Naoto Kawamura
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Patent number: 6513907Abstract: A printhead is formed from a plurality of ink ejectors mounted on an inner surface of a rigid substrate while protruding through holes provided in the substrate. Electrical contact is provided on a surface of the ink ejectors common with the ink ejecting nozzles thereby avoiding vias to another surface. The rigid substrate provides a conducting layer on its inner surface such that the ink ejectors may be connected thereto with solder reflow techniques.Type: GrantFiled: August 7, 2001Date of Patent: February 4, 2003Assignee: Hewlett-Packard CompanyInventors: Timothy E. Beerling, James W. Pearson, Antonio Cruz-Uribe
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Publication number: 20030016272Abstract: An ink jet print head is formed of a silicon substrate that includes an integrated circuit formed therein for controlling operation of the print head. The silicon substrate has one or more ink channels formed therein along the longitudinal direction of the nozzle array. An insulating layer or layers overlie the silicon substrate and has a series or an array of nozzle openings or bores formed therein along the length of the substrate and each nozzle opening communicates with an ink channel. The area comprising the nozzle openings forms a generally planar surface to facilitate maintenance of the printhead. A heater element is associated with each nozzle opening or bore for asymmetrically heating ink as ink passes through the nozzle opening or bore.Type: ApplicationFiled: September 12, 2002Publication date: January 23, 2003Inventors: Constantine N. Anagnostopoulos, John A. Lebens, David P. Trauernicht, James M. Chwalek, Christopher N. Delametter
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Patent number: 6505914Abstract: The invention relates to a microactuator arranged on a thermally insulating layer (2) and having a resistance layer (4) made from doped diamond, which is provided with an electrical supply and an electrical leakage (9).Type: GrantFiled: December 4, 2001Date of Patent: January 14, 2003Assignee: Merckle GmbHInventors: Eberhard P. Hofer, Erhard Kohn, Christian Rembe, Stefan Aus Der Wiesche, Peter Gluche, Rudiger Leuner
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Publication number: 20030007035Abstract: A passivation layer for a thermal ink jet printhead is provided. The material of the passivation layer can be a Co-based alloy with 25-30 wt % Cr or an Fe-based alloy with ≦10 wt. % Co, ≦20 wt. % Cr, ≦10 wt. % Mn. The passivation layer is amorphous and the surface is substantially atomically smooth or has a controlled surface roughness. The passivation layer displays resistance to cavitation and chemical corrosion and is conformally disposed over a resistor by sputtering or other physical vapor deposition techniques.Type: ApplicationFiled: June 6, 2001Publication date: January 9, 2003Inventor: Alfred I-Tsung Pan
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Patent number: 6502306Abstract: A method of fabricating a micro-electromechanical systems (MEMS) device that is positioned on a wafer substrate that incorporates drive circuitry includes depositing a first sacrificial layer of an organic material on the wafer substrate. The first sacrificial layer is patterned. A first layer of conductive material is deposited on the first sacrificial layer. The first layer of conductive material is patterned. A second sacrificial layer of organic material is deposited on the first layer of conductive material. The second sacrificial layer is patterned. A second layer of conductive material is deposited on the second sacrificial layer. The second layer of conductive material patterned. A third sacrificial layer of organic material is deposited on the second layer of conductive material. The third sacrificial layer is patterned. A structural layer of dielectric material is deposited on the third sacrificial layer. The structural layer is patterned.Type: GrantFiled: June 28, 2002Date of Patent: January 7, 2003Assignee: Silverbrook Research Pty LtdInventor: Kia Silverbrook
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Patent number: 6502926Abstract: The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a printhead body having a chip surface side, an ink surface side opposite the chip surface side and a first coefficient of thermal expansion (CTE). A semiconductor chip containing ink ejector devices is adhesively attached to the chip surface side of the printhead body. A stiffener is adhesively attached to the ink surface side to provide body stiffening during curing of the adhesive. The semiconductor chip has a second CTE and the stiffener has a third CTE wherein the second and third CTE's have a similar value. The invention provides an improved structure for printheads which resist warpage and/or breakage of the semiconductor chips during the manufacturing process used to make the printheads.Type: GrantFiled: January 30, 2001Date of Patent: January 7, 2003Assignee: Lexmark International, Inc.Inventors: William Paul Cook, Stephen Francis DeFosse, Curtis Ray Droege, Hrishikesh Pramod Gogate, Eric Spencer Hall
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Publication number: 20030001928Abstract: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.Type: ApplicationFiled: August 21, 2002Publication date: January 2, 2003Inventors: Richard Todd Miller, Susanne L. Kumpf
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Patent number: 6499835Abstract: An ink-firing element is provided. The ink-firing element has a resistor for generating ink droplets, a substrate atop which the resistor rests and a barrier layer atop the substrate. The barrier layer in a closed-loop design and at least partially defines an ink-firing chamber, which surrounds the resistor and temporarily contains ink. The ink-firing element also includes an orifice plate supported by the barrier layer for providing an orifice through which the ink droplets are ejected onto a medium and a trench in the substrate for replenishment of ink. The trench terminates at an outlet in the ink-firing chamber and is in fluid communication with an ink refill channel, which supplies ink from a reservoir to the ink-firing element.Type: GrantFiled: January 23, 2002Date of Patent: December 31, 2002Assignee: Hewlett-Packard CompanyInventors: Swee Guan Chee, Sieo Peng Clara Chua, Jiansan Sun, Wan Sin Ng
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Publication number: 20020191053Abstract: Fluid dispensing apparatus (10) for selectively dispensing desired quantities of a fluid under pressure. The apparatus includes a base plate (14) having a dispensing passage (16) extending about a first axis (18); a valve arrangement (20) associated with the dispensing passage (16), and a piezoelectric transducer (22) acting on the valve arrangement (20) to effect displacement of the valve arrangement between a first position in which the dispensing passage (16) is closed and a second position in which the dispensing passage is connected to a source of the fluid under pressure. The valve arrangement (20) includes a slide valve (24), with the slide valve and the piezoelectric transducer (22) being arranged such that during at least initial displacement of the valve arrangement from the second position towards the first position, the slide valve (24) is displaced in a direction transverse to the first axis (18).Type: ApplicationFiled: June 18, 2001Publication date: December 19, 2002Inventors: Patrik Jonasson, Lennart Sjostedt, Lennart Sven Thalin, Mats Pegelow, Goran Nybom, Ove Andersson, Elisabet Leijon, David Andersson
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Publication number: 20020186281Abstract: The inkjet recording head includes a head body and a metallic film is provided at least on a part of at least one side of the head body. The head body includes a plurality of orifices, an ink ejection unit arranged so as to correspond to each of the orifices, an independent ink flow path for supplying ink to each of the orifices and a common ink flow path for supplying ink to the independent ink flow path. The manufacturing method of the inkjet recording head forms the metallic film at least on a part of an opposite surface of a substrate to the individual ink flow paths, before adhering the orifice plate in which the orifices are formed. The inkjet printer uses the inkjet recording head.Type: ApplicationFiled: June 7, 2001Publication date: December 12, 2002Inventors: Ryoichi Yamamoto, Masao Mitani
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Patent number: 6485130Abstract: Disclosed is a process for bonding a first article to a second article which comprises (a) providing a first article comprising a polymer having photosensitivity-imparting substituents; (b) providing a second article comprising metal, plasma nitride, silicon, or glass; (c) applying to at least one of the first article and the second article an adhesion promoter selected from silanes, titanates, or zirconates having (i) alkoxy, aryloxy, or arylalkyloxy functional groups and (ii) functional groups including at least one photosensitive aliphatic >C═C< linkage; (d) placing the first article in contact with the second article; and (e) exposing the first article, second article, and adhesion promoter to radiation, thereby bonding the first article to the second article with the adhesion promote. In one embodiment of the present invention, the adhesion promoter is employed in microelectrical mechanical systems such as thermal ink jet printheads.Type: GrantFiled: April 27, 2001Date of Patent: November 26, 2002Assignee: Xerox CorporationInventors: Lisa A. DeLouise, David J. Luca
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Patent number: 6481828Abstract: An inkjet printhead includes a nozzle plate having a nozzle, a substrate having an ink feed hole, and an intermediate layer interposed between the nozzle plate and the substrate, wherein the intermediate layer includes an ink chamber connected to the ink feed hole and the nozzle and a heating element surrounding the ink chamber. In the present invention, the nozzle, the ink chamber, and the ink feed hole are formed in a straight channel, thereby providing a high density printhead.Type: GrantFiled: December 7, 2001Date of Patent: November 19, 2002Assignee: Samsung Electronics Co., Ltd.Inventors: Seog Soon Baek, Hyeon-cheol Kim, Yong-soo Oh
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Patent number: 6481831Abstract: An inkjet printhead and a method of fabricating an inkjet printhead is disclosed. The inkjet printhead includes a conducting material layer deposited on an insulative dielectric. The conducting material layer has a chamber formed between a first and a second section of the conducting material layer. A dielectric material is fabricated on the first and second sections of the conducting material layer and on the insulative dielectric in the chamber. The dielectric material has a planarized top surface. A first via is formed in the dielectric material, thereby exposing a portion of the first section of the conducting material layer. A second via is formed in the dielectric material, thereby exposing a portion of the second section of the conducting material layer. The first and second vias each having sidewalls sloped at an angle in the range of approximately 10-60 degrees.Type: GrantFiled: July 7, 2000Date of Patent: November 19, 2002Assignee: Hewlett-Packard CompanyInventors: Colin C. Davis, Eric L. Nikkel, Martha A. Truninger, Ronald L. Enck
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Patent number: 6473966Abstract: A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is performed while cooling the printer head substrate by allowing a coolant gas to be intervened between the substrate and the stage. This allows multiple orifices of a desired and adequate shape to be simultaneously and quickly bored in the orifice plate even if a thin film sheet having adhesive layers adhered to both sides thereof is used as the orifice plate, thereby improving the working efficiency.Type: GrantFiled: January 27, 2000Date of Patent: November 5, 2002Assignee: Casio Computer Co., Ltd.Inventors: Ichiro Kohno, Junji Shiota, Hideki Kamada, Satoshi Kanemitsu, Yoshihiro Kawamura
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Publication number: 20020158945Abstract: 10006488 A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.Type: ApplicationFiled: April 30, 2001Publication date: October 31, 2002Inventors: Richard Todd Miller, Susanne L. Kumpf
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Publication number: 20020149650Abstract: Disclosed is an ink jet printhead having an integrated filter. The ink jet printhead includes a first substrate, a second substrate and an orifice layer. The first substrate defines an ink fluid supply conduit for the printhead. The second substrate of the printhead is affixed to an upper surface of the first substrate. The second substrate includes a plurality of individually addressable ink energizing elements, and defines a plurality of fluid filter openings that are in fluid communication with the ink fluid supply conduit of the first substrate. The fluid filter openings function as an ink fluid filter for the printhead. The orifice layer is coupled to an upper surface of the second substrate. The orifice layer defines a firing chamber in fluid communication with the fluid filter openings of the second substrate. The firing chamber is positioned over the ink energizing elements of the second substrate, with each firing chamber opening through a nozzle aperture in an exterior surface of the orifice layer.Type: ApplicationFiled: April 3, 2002Publication date: October 17, 2002Inventors: Antonio S. Cruz-Uribe, Naoto A. Kawamura
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Patent number: 6464342Abstract: A liquid discharge head at least comprises a discharge opening for discharging the liquid, a liquid flow channel in communication with the discharge opening and for supplying the liquid to the discharge opening, a substrate equipped with a heat generator for producing a bubble in the liquid that is filled in the liquid flow channel, and a movable plate supported and fixed onto the substrate at a position of the substrate opposed to the heat generator and with a gap from the substrate, with a free end on the discharge opening side. The liquid discharge head can discharge the liquid from the discharge openings by forcing the free end of the movable plate to be displaced toward the discharge opening around a fulcrum portion made near a support and fixing portion of the movable plate with the substrate due to pressure caused by produced bubble.Type: GrantFiled: December 3, 1999Date of Patent: October 15, 2002Assignee: Canon Kabushiki KaishaInventors: Masahiko Kubota, Ichiro Saito, Toshio Kashino, Yoshiyuki Imanaka, Teruo Ozaki, Muga Mochizuki
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Patent number: 6464343Abstract: A fluid drop ejecting apparatus including a thin film stack including a plurality of heater resistors formed on a substrate having a feed edge, a patterned fluid barrier layer disposed on the thin film stack, respective fluid chambers formed in the barrier layer over respective heater resistors, fluid feed features formed in the barrier layer between the fluid feed edge and the ink chambers, and a thin film metal structure in a metal layer of the thin film stack and located between the ink feed edge and the fluid chambers.Type: GrantFiled: October 31, 2001Date of Patent: October 15, 2002Assignee: Hewlett-Packard CompanyInventors: Laurie A. Coventry, Allen H. Smith, Dustin W. Blair
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Patent number: 6457814Abstract: A fluid-jet printhead has a substrate having at least one layer defining a fluid chamber for ejecting fluid. The printhead also includes a resistive layer disposed between the fluid chamber and the substrate wherein the fluid chamber has a smooth planer surface between the fluid chamber and the substrate. The printhead has a conductive layer disposed between the resistive layer and the substrate wherein the conductive layer and the resistive layer are in direct parallel contact. The conductive layer forms at least one void creating a planar resistor in the resistive layer. The planar resistor is aligned with the fluid chamber.Type: GrantFiled: December 20, 2000Date of Patent: October 1, 2002Assignee: Hewlett-Packard CompanyInventors: Genbao Xu, Zhizang Chen, Mark Alan Johnstone, John P. Whitlock