Abstract: Methods, apparatuses, and systems for improving gas detecting apparatuses are provided. An example gas detecting apparatus may comprise at least one imaging sensor; and a controller component, wherein the controller component is configured to: obtain image data comprising at least a first frame and a second frame, identify a number of matching features between the first frame and the second frame, and in an instance in which the number of matching features satisfies a predetermined threshold number of matching features, estimate a transformation between the first frame and the second frame, and perform one or more vibration correction operations.

Abstract: An imaging device capable of producing images or data with relatively high spectral diversity, allowing for creation of information-rich feature vectors, is provided. Among other things, such information-rich feature vectors may be applied to a range of artificial intelligence and machine learning applications. The imaging device may include a substrate having a baseline spectral responsivity function, multiple pixels forming a cell fabricated on the substrate, and spectral filters each configured to filter light based on a transmission function corresponding to a substantially broad portion of the baseline spectral responsivity function. The spectral filters may be notch filters. Each of the multiple pixels in the cell may be configured to receive light through each of the spectral filters. The transmission function of each of the spectral filters may be substantially different for each of at least a majority of the multiple pixels in the cell.

Abstract: A camera module of reduced overall height includes multiple electronic components embedded in a PCB, multiple first holes defined on the PCB, each first hole enables a connection with one electronic component. A sensor chip is attached to the PCB by anisotropic conductive adhesive, multiple conductive balls on the sensor chip enter the multiple first holes and connect with the multiple electronic components. The embedded electronic components and the PCB form an integrated and single structure, avoiding multiple installations of electronic components one by one into the board and simplifying the manufacturing process of the camera module. The multiple conductive balls sinking into the multiple first holes reduce overall size of the camera module. A method for manufacturing the camera is also disclosed.

Abstract: A display device can include a display panel to display an input image across a first subpixel region and a second subpixel region; a display panel driver to supply pixel data of the input image to subpixels of the display panel; a light source disposed under the display panel in an area overlapped by the second subpixel region; and a controller to drive the light source in an emission permitting section set within a non-driving period of a group of subpixels among the subpixels that are disposed in at least a portion of the second subpixel region.

Abstract: An optical imaging lens includes a first lens element, a second lens, an aperture stop, a third lens element and a fourth lens element from an object side to an image side in order along an optical axis, and each lens element has an object-side surface and an image-side surface. An optical axis of the image-side surface of the first lens element is convex and an optical axis of the image-side surface of the fourth lens element is concave. HFOV stands for the half field of view of the entire optical imaging lens and TTL is a distance from the object-side surface of the first lens element to an image plane along the optical axis to satisfy HFOV/TTL?1.500°/mm.

Abstract: An image sensor image sensor may include: a substrate; photo-sensing elements formed in the substrate, each photo-sensing element responsive to light to produce a photo-sensing electrical signal; an antireflection layer formed over of the photo-sensing elements and structured to reduce optical reflection to facilitate optical transmission of incident light to the photo-sensing elements through the antireflection layer; color filters formed over the antireflection layer and arranged to spatially correspond to the photo-sensing elements, respectively, each color filter structured to select a designated color in the incident light to transmit through to a corresponding photo-sensing element; and partition patterns formed over the antireflection layer and arranged to spatially correspond to the photo-sensing elements, respectively, to partition light receiving area above the photo-sensing elements into separate light receiving areas, each partition pattern surrounding a corresponding color filter to be separate f

Abstract: Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.

Abstract: To suppress image quality degradation due to artifacts. Electronic equipment includes a display unit, an imaging unit disposed on a side opposite to a display surface of the display unit, and a signal processing unit. The imaging unit includes a plurality of on-chip lenses and a plurality of pixels, in which the on-chip lens includes a first on-chip lens, the plurality of pixels includes a first pixel, the first pixel is disposed to overlap the first on-chip lens, and the first pixel includes a plurality of photoelectric conversion units. The signal processing unit processes signals output from the plurality of pixels.

Abstract: Provided is an endoscope lens, a camera module and an endoscope. From an object side to an image side, the endoscope lens sequentially includes: a first lens having a concave object side surface and a convex image side surface; a second lens with a positive or negative refractive power; and a filter arranged between the second lens and the image side. Each of the first lens and the second lens is a glass or plastic aspheric lens. The endoscope lens further includes a stop positioned between the first lens and the object side or between the first lens and the second lens.

Abstract: The present invention provides a detection packaging structure and an in-vivo detection apparatus that are based on a flexible tube. A detection circuit board and a main circuit board that are perpendicular to each other are used, a first conducting material is disposed on a first side surface of the detection circuit board, a second conducting material capable of being conducted to the first conducting material is disposed on a second side surface, and when a detection component is connected to the first side surface of the detection circuit board, a wiring terminal of the detection component is capable of being welded to the first conducting material. In this way, based on the present invention, difficulty of welding operations is reduced, welding strength and reliability are enhanced, and welding stability in a plurality of motion statuses is satisfied.

Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.

Abstract: An endoscope distal end structure includes: an imager, a distal end frame that is a three-dimensional molded interconnect device including a housing portion and a cable connecting portion, the cable connecting portion including a cable connection electrode, the housing portion being formed by cutting out at least a part of an outer peripheral portion of the distal end frame, the housing portion having a bottom surface on which connection terminals are formed, and a first side surface and a second side surface which are continuous to each other and on which a ground pattern is formed, a through hole having electrical conductivity, the through hole penetrating from the bottom surface to the cable connecting portion, and an electrical conductive pattern connecting a cable connection electrode and the ground pattern, the electrical conductive pattern being arranged on a side surface of the distal end frame.

Abstract: A projection display apparatus includes an image light emitter that includes a light modulation element that emits image light, a projection lens unit that projects the image light on a projection target, an optical path separation element, an imaging element that images external light incident via the projection lens unit and the optical path separation element, and a condensing optical system. The optical path separation element transmits a part of the image light to the projection lens unit, and reflects a part of the external light emitted from the projection lens unit to the condensing optical system. The condensing optical system condenses the part of the external light reflected by the optical path separation element on the imaging element. A capturing angle of the external light in the condensing optical system is equal to or less than a condensing angle of a lens F-number of the projection lens unit.

Abstract: A 3D LED display panel that includes a substrate and an array light emitting devices mounted on the substrate. The array of light emitting devices includes a plurality of first light emitting devices and a plurality of second light emitting devices. Each first light emitting device has an LED chip/package electrically connected to the substrate and a piece of first circular polarizer attached to the LED chip/package. Likewise, each second light emitting device includes an LED chip/package electrically connected to the substrate and a piece of second circular polarizer attached to the LED chip/package. The first circular polarizer the second circular polarizer have opposite circular polarizations.

Abstract: An optical imaging lens assembly includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The object-side surface of the first lens element is convex in a paraxial region thereof, and at least one surface among the object-side surfaces and the image-side surfaces of the seven lens elements has at least one inflection point.

Abstract: An imaging lens assembly includes a plastic barrel and an optical element set. The optical element set includes an optical lens element, a light blocking sheet and a light-shielding layer. At least one surface of an object-side peripheral surface and an image-side peripheral surface of the optical lens element includes an annular side wall. An annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element are disposed correspondingly to each other. The light-shielding layer surrounds a central opening of the light blocking sheet and includes an annular concave-curved portion. The annular concave-curved portion is for retaining the light blocking sheet, so that there is no relative displacement in a direction parallel to an optical axis between the annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element.

Abstract: A grid structure in a pixel array may be at least partially angled or tapered toward a top surface of the grid structure such that the width of the grid structure approaches a near-zero width near the top surface of the grid structure. This permits the spacing between color filter regions in between the grid structure to approach a near-zero spacing near the top surfaces of the color filter regions. The tight spacing of color filter regions provided by the angled or tapered grid structure provides a greater surface area and volume for incident light collection in the color filter regions. Moreover, the width of the grid structure may increase at least partially toward a bottom surface of the grid structure such that the wider dimension of the grid structure near the bottom surface of the grid structure provides optical crosstalk protection for the pixel sensors in the pixel array.

Abstract: A solid-state image sensor according to the present disclosure includes a first semiconductor substrate having a photoelectric conversion element and a second semiconductor substrate facing the first semiconductor substrate with an insulating film interposed therebetween, in which the second semiconductor substrate has an amplification transistor that amplifies an electrical signal output from the photoelectric conversion element on a first main surface (MSa), has a region having a resistance lower than a resistance of the second semiconductor substrate on a second main surface (MSb) opposite to the first main surface (MSa), and is grounded via the region.

Abstract: Provided is an image sensor including a sensor substrate including a first photo-sensing cell and a second photo-sensing cell configured to sense light, a spacer layer that is transparent and disposed on the sensor substrate, and a color separating lens array disposed on the spacer layer and including a first region disposed opposite to the first photo-sensing cell in a vertical direction and having a first pattern, and a second region disposed opposite to the second photo-sensing cell in the vertical direction and having a second pattern that is different from the first pattern, and wherein the first pattern is configured to separate, from incident light, a first wavelength light and condense the first wavelength light to the first photo-sensing cell, and the second pattern is configured to separate, from the incident light, a second wavelength light and condense the second wavelength light to the second photo-sensing cell.

Abstract: A backside illumination image sensor that includes a semiconductor substrate with a plurality of photoelectric conversion elements and a read circuit formed on a front surface side of the semiconductor substrate, and captures an image by outputting, via the read circuit, electrical signals generated as incident light having reached a back surface side of the semiconductor substrate is received at the photoelectric conversion elements includes: a light shielding film formed on a side where incident light enters the photoelectric conversion elements, with an opening formed therein in correspondence to each photoelectric conversion element, and an on-chip lens formed at a position set apart from the light shielding film by a predetermined distance in correspondence to each photoelectric conversion element. The light shielding film and an exit pupil plane of the image forming optical system achieve a conjugate relation to each other with regard to the on-chip lens.

Abstract: In one example, a display includes an array of display pixels. Each display pixel includes at least one light-emitting diode. At least one of the display pixels includes an image sensor.

Abstract: A hyperspectral image sensor includes an optical irradiator configured to irradiate light to a partial region of an object, an optical detector configured to receive detection light generated in the partial region in response to the irradiated light and generate spectrum signals, each of the spectrum signals corresponding to a respective sub-region of a plurality of sub-regions included in the partial region, and a processor configured to generate a hyperspectral image of the partial region based on the spectrum signals.

Abstract: A lens assembly of a viewing element for an endoscope has lenses and a barrel containing the lenses. The internal surface of the barrel is shaped in accordance with the relative position and size of the lenses and a lens holder encompassing at least a portion of the barrel. The barrel and/or the lens holder are injection-molded and can be variably positioned relative to each other. An optional adhesive layer that reduces or eliminates small particles from the viewing element is positioned on an inner surface of the barrel and/or lens holder and used to remove any internal particulate matter that may otherwise obstruct the field of view.

Abstract: A method of forming an image sensor includes forming a photodiode within a semiconductor substrate. The method further includes disposing an interconnect structure over the semiconductor substrate. The interconnect structure includes a contact etch stop layer (CESL) over the photodiode; and a plurality of dielectric layers over the CESL, wherein at least one dielectric layer of the plurality of dielectric layers comprises a low dielectric constant (low-k) material. The method further includes patterning at least the plurality of dielectric layers, wherein patterning at least the plurality of dielectric layers comprises defining an opening above an active region of the photodiode. The method further includes depositing a cap layer on sidewalls of the opening, wherein the cap layer includes a dielectric material having a higher moisture resistance than the low-k dielectric material.

Abstract: An attachment optical system attachable to and detachable from an imaging optical system includes a first converter optical system attachable to an object side of the imaging optical system, and a second converter optical system attachable to an image side of the imaging optical system. The first converter optical system includes a first unit consisting of a dome-shaped cover. A predetermined condition is satisfied.

Abstract: A zoom lens system includes: a first lens group having positive power; a second lens group having negative power; a third lens group having positive power; a fourth lens group having positive power; a fifth lens group having negative power; and a following lens group following the fifth lens group. The first to fifth lens groups and the following lens group are arranged in this order such that the first lens group is located closest to an object and that the following lens group is located closest to an image. While the zoom lens system is zooming, intervals between the respective lens groups change. While the zoom lens system is focusing from an infinity focus point through a shortest shooting range, a plurality of negative lens groups included in the fifth lens group and the following lens group move.

Abstract: There is provided an optical system including: a first lens having positive refractive power and having a convex object-side surface; a second lens having positive refractive power; a third lens having refractive power; a fourth lens having refractive power; a fifth lens having refractive power; a sixth lens having refractive power; and a seventh lens having negative refractive power and having a concave image-side surface, wherein the first to seventh lenses are sequentially disposed from an object side, whereby an aberration improvement effect may be increased and a high degree of resolution may be realized.

Abstract: The invention discloses an anti-shake camera module, an anti-shake photosensitive assembly, and manufacturing method thereof and an electronic device. The anti-shake photosensitive assembly includes a circuit board assembly, at least one driver, and at least one photosensitive element. The circuit board assembly provides at least one attachment surface. Each driver is correspondingly attached to each attachment surface of the circuit board assembly. Each photosensitive element is correspondingly arranged on each driver, and the driver is located between the photosensitive element and an attachment surface of the circuit board assembly, so that the corresponding photosensitive element is moved by the driver, thereby achieving the anti-shake function for the anti-shake photosensitive assembly.

Abstract: A camera optical lens includes, from an object side to an image side, a first lens having a positive refractive power; a second lens having a positive refractive power; a third lens; a fourth lens having a positive refractive power; and a fifth lens having a negative refractive power, and satisfies: 2.10?f1/f?4.00; 1.00?d4/d6?3.00; 0.20?d8/d9?0.90, and where f and f1 respectively denote focal lengths of the camera optical lens and the first lens; d4 denotes an on-axis distance between the second lens and the third lens; d6 denotes an on-axis distance between the third lens and the fourth lens; d8 denotes an on-axis distance between the fourth lens and the fifth lens; and d9 denotes an on-axis thickness of the fifth lens, thereby achieving good optical performance while satisfying design requirements for ultra-thinness, a wide angle and a large aperture.

Abstract: An imaging device having a superior light-shielding property for a charge-holding section is provided. The imaging device includes: an Si {111} substrate extending along a horizontal plane; a photoelectric conversion section provided in the Si {111} substrate and generating charges corresponding to a light reception amount by photoelectric conversion; a charge-holding section provided in the Si {111} substrate and holding charges transferred from the photoelectric conversion section; and a light-shielding section including a horizontal light-shielding part positioned between the photoelectric conversion section and the charge-holding section in a thickness direction and extending along the horizontal plane and a vertical light-shielding part orthogonal thereto.

Abstract: A camera module includes a lens holder having a hollow region; a first lens unit disposed in the hollow region and including at least one lens; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other. The adhesion unit includes an opening and a portion of an internal space formed by a coupling of the circuit board and the lens holder is to be open to an outside through the opening of the adhesion.

Abstract: The imaging device includes: a modulator configured to modulate a light intensity in accordance with a real pattern; an image sensor configured to create a sensor image in accordance with the modulated light; and a micro lens array including a plurality of micro lenses arranged to correspond to a plurality of pixels of the image sensor. The imaging device has a distribution property of a relative positional difference amount between a center position of a light receiver of each pixel of the plurality of pixels and a center position of each micro lens of the plurality of micro lenses of the micro lens array in a plane of the image sensor. This property has at least one point or more with a changing difference value of the difference amount between the adjacent pixels from a positive value to a negative value or from a negative value to a positive value.

Abstract: The present application discloses a protective film of electronic terminal configured to be attached to an electronic terminal mounted with a camera and protect a screen of the electronic terminal. The protective film of electronic terminal includes a protective film body and a shielding member. The protective film body is defined with an avoidance hole and an accommodating cavity. The avoidance hole is for avoiding the camera when the protective film body is attached to the electronic terminal and in communication with the accommodating cavity. The shielding member is movably arranged in the accommodating cavity for shielding or not shielding the camera.

Abstract: An image acquiring method includes: providing a camera module of an electronic device including a lens assembly, a microlens matrix and an image sensor, the microlens matrix is movable between a first position and a second position, the microlens matrix is between the image sensor and the lens assembly in the first position to enable the camera module as a light field camera, and the microlens matrix is away from the image sensor and the lens assembly in the second position to enable the camera module as a conventional camera; in response to detecting that the microlens matrix is in the first position, acquiring a three-dimensional image of an object by the light field camera of the electronic device; and in response to detecting that the microlens matrix is in the second position, acquiring a two-dimensional image of the object by the conventional camera.

Abstract: An apparatus includes a first sensor unit that includes a plurality of first sensors arranged in the first direction which include a first sensor configured to receive a first image formed by light with a first wavelength, a second sensor unit that includes a plurality of second sensors arranged in the first direction which include a second sensor configured to receive a second image formed by light with a second wavelength, and a controller configured to control the first and second sensor units. The controller controls the plurality of first sensors under a first common exposure condition, and controls the plurality of second sensors in the second sensor unit under a second common exposure condition.

Abstract: A zoom lens includes, in order from an object, a first lens group having a negative refractive power, a second lens group having a positive refractive power, a third lens group having a negative refractive power, and a fourth lens group. Zooming is performed by changing respective distances between the first and second lens groups, the second and third lens groups, and the third and fourth lens groups. The first lens group includes a negative lens disposed closest to the object, and a negative lens. Specified conditional expressions are satisfied.

Abstract: An image capture device includes an image sensor and a heat controller. The image capture device includes a heat spreader that extends between the image sensor and the heat controller. The heat spreader dissipates heat from the image sensor to the heat controller. The image capture device includes an electronics unit spaced from the image sensor. The image capture device includes a compressive insulator that contacts the heat spreader and the electronics unit, and the compressible insulator thermally separates the electronics unit and the heat spreader.

Abstract: A stacked light receiving sensor according to one embodiment includes a first substrate in a first layer, a second substrate joined with the first substrate and formed in a second layer, and a third substrate joined with the second substrate and formed in a third layer. An analog circuit reads a pixel signal from a pixel array. A logic circuit is connected to the analog circuit and outputs the pixel signal. A processing section executes processing based on a neural network computing model, on data based on the pixel signal. The pixel array is disposed on the first layer. The analog circuit is disposed on any one or more of the first to third layers. The logic circuit, the processing section, and a memory are disposed on any one or more of the second and third layers.

Abstract: The following relates to forming a combined image by an imaging system with a rotatable reflector. A reflector is rotated about an axis to a first position relative to an image sensor. At the first position, the reflector directs light from a first portion of a view corresponding to an external environment towards the image sensor. An image of the first portion of the view is captured by the image sensor. The reflector is rotated about the axis to a second position relative to the image sensor. At the second position, the reflector directs light from a second portion of the view corresponding to the external environment towards the image sensor. An image of the second portion of the view is captured by the image sensor. The image of the first portion and the image of the second portion are combined to form an image corresponding to the view.

Abstract: An image capturing assembly is provided and includes a fixture, a lens assembly, an image sensing device and a circuit board. The fixture includes a fixture body and at least one first contact. An accommodating space is formed on the fixture body. The at least one first contact is disposed on the fixture body. The lens assembly is engaged with the fixture body. The image sensing device is disposed inside the accommodating space. The image sensing device includes at least one second contact electrically connected to the at least one first contact. The circuit board includes a board body and at least one third contact. The board body is perpendicular to and affixed with the fixture body. The at least one third contact is disposed on the board body and electrically connected to the at least one first contact. Besides, a related endoscope is further provided.

Abstract: A camera optical lens includes first to fifth lenses. The camera optical lens satisfies: 0.75?f1/f?0.95; ?4.50?f3/f??3.00; 2.00?(R5+R6)/(R5?R6)?8.00; 3.00?d7/d5?5.00; and ?12.00?R3/R4??2.50, where f denotes a focal length of the camera optical lens; f1 denotes a focal length of the first lens; f3 denotes a focal length of the third lens; R3 and R4 respectively denote curvature radiuses of an object side surface and an image side surface of the second lens; R5 and R6 respectively denote curvature radiuses of an object side surface and an image side surface of the third lens; and d5 and d7 respectively denote an on-axis thickness of the third lens and an on-axis thickness of the fourth lens. The camera optical lens can achieve good optical performance while satisfying design requirements for ultra-thin, wide-angle lenses having large apertures.

Abstract: A camera module including a housing, a lens barrel disposed in the housing and configured to accommodate at least one lens, a first substrate including an image sensor configured to receive light passing through the lens, and a second substrate including a through-portion configured to pass the lens barrel.

Abstract: A sensor apparatus includes a first of a plurality of layers having a top layer, a bottom layer, and at least one intermediate layer having an electrical conductor layer, each of the top layer, the bottom layer, and the at least one intermediate layer is disposed in direct contact with a respective adjacent layer. A second of the plurality of layers is disposed in direct contact with the first plurality of layers such that the bottom layer of the second plurality of layers is disposed in direct contact with the top layer of the first plurality of layers. The first and second plurality of layers are productive of a piezoelectric voltage absent of an external current producing device and in response to being deformed, and are productive of a change in capacitance in response to being deformed.

Abstract: A photographing system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element with refractive power. The first lens element with positive refractive power has an object-side surface being convex in paraxial region. The second lens element with refractive power has an image-side surface being concave in paraxial region. The third, fourth and fifth lens elements all have refractive powers. The sixth lens element with refractive power has an image-side surface being concave in paraxial region, wherein the image-side surface has at least one convex shape in off-axis region, and both of two surfaces are aspheric. The seventh lens element with refractive power has an object-side surface being concave in paraxial region, and both of two surfaces are aspheric.

Abstract: Provided is a meta-optical device including a meta-lens including a plurality of nano-structures, a band pass filter configured to transmit light of predetermined wavelengths within an operation wavelength band of the meta-lens, and a spacer layer provided between the meta-lens and the band pass filter to support the plurality of nano-structures and to form a separation distance between the meta-lens and the band pass filter.

Abstract: An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.

Abstract: A five-piece optical lens system with a wide field of view includes, in order from the object side to the image side: a first lens element with a negative refractive power, a stop, a second lens element with a positive refractive power, a third lens element with a negative refractive power, a fourth lens element with a positive refractive power, a fifth lens element with a negative refractive power, wherein a central thickness of the first lens element along an optical axis is CT1, a central thickness of the third lens element along the optical axis is CT3, a central thickness of the fourth lens element along the optical axis is CT4, a central thickness of the fifth lens element along the optical axis is CT5, satisfying the relations: 0.69<CT4/(CT1+CT3+CT5)<1.32, 1.83<(CT1+CT5)/CT3<4.06. Such a system has a wide field of view, high resolution, short length, less distortion taking into account lens production.

Abstract: A laser beam steering system is disclosed. The system includes a laser source which produces a pulsed laser light beam with a frequency comb spectrum, a metasurface configured to i) receive the pulsed laser, ii) generate a diffracted pulsed laser output at different frequencies with a beam at a center frequency normal to the metasurface, and iii) directing light at different frequencies onto different foci at a focal plane, light propagating from the focal plane leads to generation of one or more optical beams that are controlled in space and time.

Abstract: Disclosed is a camera system included in a vehicle. The camera system comprises: a camera provided to a vehicle so as to capture the surroundings of the vehicle; and a processor for identifying an object present near the vehicle on the basis of an image captured by the camera, wherein the camera comprises a wide-angle lens, and a plurality of optical sensors for capturing a region within the viewing angle of the wide-angle lens, the wide-angle lens being designed so that the number of optical sensors for capturing a region corresponding to a predetermined angle range, among a plurality of angle ranges formed by dividing the viewing angle into predetermined angles, differs from the number of optical sensors for capturing a region corresponding to a different angle range.

Abstract: The present disclosure discloses an optical imaging lens assembly. The optical imaging lens assembly includes, sequentially from an object side to an image side along an optical axis, a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens. The first lens has a positive refractive power and a convex object-side surface. The second lens has a negative refractive power. The third lens has a positive refractive power. Each of the fourth lens and the fifth lens has a positive refractive power or a negative refractive power. The sixth lens has a positive refractive power. The seventh lens has a negative refractive power, a concave object-side surface and a concave image-side surface. A combined focal length f12 of the first and second lenses and a combined focal length f34 of the third and fourth lenses satisfy:|f12/f34|?0.3.