With Optics Peculiar To Solid-state Sensor Patents (Class 348/340)
  • Patent number: 10819899
    Abstract: An image acquisition device according to the present invention includes: an image-acquisition-optical-system; a microlens array having microlenses; a phase filter modulating a phase distribution to light incident on the microlenses via the image-acquisition-optical-system; a light receiving unit receiving the light focused by the microlenses by light receiving elements; an adjusting unit switching between a first arrangement state in which the light receiving elements are arranged at back focal positions of the microlenses and a second arrangement state in which the light receiving elements are arranged in vicinities of principal point positions of the microlenses; a memory storing a point image intensity distribution at the light receiving unit in each of the arrangement states; and an arithmetic operation unit generating a processed image by using the point image intensity distribution and image information at the light receiving unit in each of the arrangement states.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: October 27, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Satoshi Watanabe, Kazuaki Murayama
  • Patent number: 10782593
    Abstract: A lens module and a capturing module integrating a focusing mechanism and an assembly method therefor. A lens module (1010) comprises at least one optical lens (1011), a focusing mechanism (1012), and a supporting structure component (1013). Each optical lens (1011) is mounted in an accommodating cavity of the supporting structure component (1013) in a height direction of the supporting structure component (1013). The supporting structure component (1013) is connected inside of the focusing mechanism (1012) as a carrier of the focusing mechanism (1012). The supporting structure component (1013) moves as the focusing mechanism (1012) is powered, and is thereby suitable for focusing. By replacing a carrier and a lens cone of a conventional focusing mechanism with the supporting structure component (1013), an overall assembly process is simplified, the yield and quality of a module are improved, and the manufacturing costs are reduced.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: September 22, 2020
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Nan Guo, Hong Li, Bojie Zhao, Liang Ding
  • Patent number: 10778874
    Abstract: A plenoptic camera including an optical system receiving light issuing from an object field in which there is an object space intended to be processed via the camera. A matrix photosensitive sensor is composed of pixels arranged in rows and columns and such that each pixel receives the light of a single light ray via the system. The light rays, each associated with their pixel, form intersections in the object space, and the optics are configured so as to minimize the greatest distance between any point of the object space and the closest of the intersections of these light rays. Optical elements are aligned and arranged in rows and columns parallel respectively to the rows and columns of the matrix sensor, forming the intersections in the object field, the distances separating the rows and/or columns being irregular.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: September 15, 2020
    Assignee: SAFRAN
    Inventors: Yann Le Guilloux, Sylvaine Picard
  • Patent number: 10778879
    Abstract: An image sensor includes: a first pixel having a first photoelectric conversion unit that photoelectrically converts light having entered therein, and a first light blocking unit that blocks a part of light about to enter the first photoelectric conversion unit; and a second pixel having a second photoelectric conversion unit that photoelectrically converts light having entered therein and a second light blocking unit that blocks a part of light about to enter the second photoelectric conversion unit, wherein: the first photoelectric conversion unit and the first light blocking unit are set apart from each other by a distance different from a distance setting apart the second photoelectric conversion unit and the second light blocking unit.
    Type: Grant
    Filed: December 26, 2016
    Date of Patent: September 15, 2020
    Assignee: NIKON CORPORATION
    Inventor: Hiroaki Takahara
  • Patent number: 10777595
    Abstract: A backside illumination image sensor that includes a semiconductor substrate with a plurality of photoelectric conversion elements and a read circuit formed on a front surface side of the semiconductor substrate, and captures an image by outputting, via the read circuit, electrical signals generated as incident light having reached a back surface side of the semiconductor substrate is received at the photoelectric conversion elements includes: a light shielding film formed on a side where incident light enters the photoelectric conversion elements, with an opening formed therein in correspondence to each photoelectric conversion element; and an on-chip lens formed at a position set apart from the light shielding film by a predetermined distance in correspondence to each photoelectric conversion element. The light shielding film and an exit pupil plane of the image forming optical system achieve a conjugate relation to each other with regard to the on-chip lens.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: September 15, 2020
    Assignee: NIKON CORPORATION
    Inventor: Yosuke Kusaka
  • Patent number: 10768413
    Abstract: A camera device proofed against ghosting and light flare includes a printed circuit board, an image sensor mounted on the printed circuit board, a supporting bracket fixed on the printed circuit board, and a lens module. The supporting bracket includes supporting plate and perpendicular side wall, the supporting plate and the side wall together forming a receiving room over the image sensor. The supporting plate has a central through hole for light ingress and a flange barrier protruding. The protruding flange barrier surrounds the light through hole, the lens module is fixed on the supporting surface, and the protruding flange barrier locates inside an inner side surface of the lens module.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: September 8, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Xiao-Mei Ma, Shin-Wen Chen, Long-Fei Zhang, Kun Li
  • Patent number: 10768392
    Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: September 8, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Long-Fei Zhang, Shin-Wen Chen, Kun Li, Xiao-Mei Ma
  • Patent number: 10751993
    Abstract: A liquid discharge head includes a body to discharge liquid, a first wiring substrate extending from the body, and a second wiring substrate electrically connected to the first wiring substrate. The body includes a nozzle face in which a plurality of nozzles, from which the liquid is discharged, is formed. The second wiring substrate is disposed along a direction perpendicular to the nozzle face of the body, a principal surface of the first wiring substrate is disposed along a short side of the body, and a principal surface of the second wiring substrate is disposed along a longitudinal direction of the body.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: August 25, 2020
    Assignee: Ricoh Company, Ltd.
    Inventors: Hitoshi Kida, Hiroya Tokita
  • Patent number: 10756130
    Abstract: There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: August 25, 2020
    Assignee: Sony Corporation
    Inventors: Shinji Miyazawa, Yutaka Ooka
  • Patent number: 10750071
    Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
    Type: Grant
    Filed: March 20, 2016
    Date of Patent: August 18, 2020
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding, Heng Jiang
  • Patent number: 10750063
    Abstract: Provided herein is an image focusing adjustment method, system, and module. A first image of a reference object is received in response to an input signal when the image focusing adjustment module is operating in a first state. The first image of the reference object is analyzed, based on which a plurality of adjustments to the image focusing adjustment module is controlled. The plurality of adjustments, performed by a plurality of actuators controlled by control module, include rotating a lens barrel assembly relative to a neck member along a first axis that causes a translational adjustment of the lens barrel assembly, rotating the neck member relative to a top member around the first axis that causes a rotational adjustment of the lens barrel assembly, and positioning a tilt adjustment member that causes tilt adjustment of the top member relative to a frame member along a second axis.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: August 18, 2020
    Assignee: HAND HELD PRODUCTS, INC.
    Inventor: Chen Feng
  • Patent number: 10750112
    Abstract: A substrate structure for an image sensor module includes a module substrate including a sensor mounting hole, a reinforcing plate on a lower surface of the module substrate, an image sensor chip on the reinforcing plate within the sensor mounting hole, and a reinforcing pattern in the module substrate. The reinforcing plate covers the sensor mounting hole. An upper surface of the image sensor chip may be exposed by the module substrate. The reinforcing pattern is adjacent to the sensor mounting hole and extends in at least one direction.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: August 18, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-Hwang Kim, Hyo-Eun Kim, Jong-Bo Shim, Cha-Jea Jo, Sang-Uk Han
  • Patent number: 10750068
    Abstract: A camera module testing method is applied to a camera module including a camera lens and a photosensitive element. In a step (A), an original image is captured through the camera lens and the photosensitive element. In a step (B), the original image is converted into a gray scale image. In a step (C), the gray scale image is converted into a binary image according to a critical gray scale value. In a step (D), a boundary contour is obtained according to plural pixels of the binary image higher than or equal to the critical gray scale value. In a step (E), a contour center of the boundary contour is obtained. Then, a step (F) is performed to judge whether an optical axis of the camera lens is aligned with an imaging center of the photosensitive element according to the imaging center and the contour center.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: August 18, 2020
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Pei-Ming Chang, Pao-Chung Chao, Shih-Chieh Hsu, Wei-Lung Huang
  • Patent number: 10741604
    Abstract: A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: August 11, 2020
    Assignee: Sony Corporation
    Inventor: Yoshiharu Kudoh
  • Patent number: 10734437
    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: August 4, 2020
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Chia-Yang Chang, Yi Qin
  • Patent number: 10735856
    Abstract: A method of fabricating a piezoelectric transducer may include interleaving a plurality of layers of piezoelectric material with a plurality of conductive layers including a first conductive layer, one or more second conductive layers, and one or more third conductive layers, coupling the first conductive layer to a first electrode, wherein an electrical impedance of the first conductive layer varies as a function of a temperature internal to the piezoelectric transducer, and such that a measurement signal indicative of the electrical impedance is generated at the first electrode, coupling the one or more second conductive layers to a second electrode, and coupling the one or more third conductive layers to a third electrode, such that an electrical driving signal driven to the second electrode and the third electrode causes mechanical vibration of the piezoelectric transducer as a function of the electrical driving signal.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: August 4, 2020
    Assignee: Cirrus Logic, Inc.
    Inventors: Nicholas Roche, Anthony S. Doy, Itisha Tyagi
  • Patent number: 10715749
    Abstract: A glass substrate having an average thickness of the glass substrate from 0.01 to 1.2 mm and having a temperature dependence of refractive index at a wave-length of 850 nm in a temperature range from ?40° C. to 60° C. of not more than 10×10?6/K.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: July 14, 2020
    Assignee: Schott Glass Technologies (Suzhou) Co. Ltd.
    Inventor: Kazuyuki Inoguchi
  • Patent number: 10715753
    Abstract: The present disclosure relates to a solid-state image pickup element and an electronic apparatus each of which enables a phase difference in an arbitrary direction to be properly detected. A solid-state image pickup element as a first aspect of the present disclosure includes a pixel array, and a plurality of AD conversion portions. The pixel array is partitioned into a plurality of pixel blocks each including a normal pixel and a pixel for phase difference detection. The plurality of AD conversion portions correspond to the respective plurality of pixel blocks, and AD-convert pixel signals based on a plurality of pixels included in the corresponding pixel block. In this case, the pixel for phase difference detection included in one pixel block of the plurality of pixel blocks, and the pixel for phase difference detection included in the other pixel block of the plurality of pixel blocks are arranged in positions corresponding to each other.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: July 14, 2020
    Assignee: SONY CORPORATION
    Inventor: Mitsuaki Kita
  • Patent number: 10713487
    Abstract: Disclosed is an object determining system comprising an optical sensor, a kind determining circuit and an element analyzing circuit. The optical sensor comprises a kind determining region and an element analyzing region, wherein the optical sensor captures at least one object image of an object via the kind determining region, and acquires element analyzing optical data via the element analyzing region. The kind determining circuit is configured to determine an object kind of the object according to the object image. The element analyzing circuit is configured to analyze element of the object according to the element analyzing optical data and the object kind. An object determining system applying tow stage object sensing steps to determine an object kind is also disclosed.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: July 14, 2020
    Assignee: PixArt Imaging Inc.
    Inventor: Guo-Zhen Wang
  • Patent number: 10699387
    Abstract: Provided are an image processing device, an imaging device, and an image processing method which are capable of obtaining a captured image with desired image quality. An image processing unit functioning as an image processing device includes a point image restoration processing unit that performs point image restoration processing using a restoration filter based on a point spread function of a lens unit on image data obtained from an imaging element through imaging of a subject using an imaging unit having the lens unit including a lens and the imaging element, and a determination unit that determines to perform the point image restoration processing using the point image restoration processing unit in a case where a modulation transfer function in a predetermined spatial frequency in which the point image restoration processing contributes is smaller than a threshold value. Here, the modulation transfer function is changed by an imaging condition.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: June 30, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Kenkichi Hayashi, Yousuke Naruse, Yasunobu Kishine
  • Patent number: 10698176
    Abstract: An imaging lens includes a first lens group; and a second lens group, arranged from an object side to an image plane side. The first lens group includes a first lens having negative refractive power and a second lens. The second lens group includes a third lens having positive refractive power and a fourth lens having negative refractive power. The fourth lens is formed in a shape so that a curvature radius of a surface thereof on the image plane side is positive. The first lens, the second lens and the third lens have specific Abbe's numbers, the first lens is arranged to be away from the second lens, the second lens is arranged to be away from the third lens, and the third lens is arranged to be away from the fourth lens by specific distances on an optical axis so that the specific conditional expressions are satisfied.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: June 30, 2020
    Assignee: KANTATSU CO., LTD.
    Inventors: Yoji Kubota, Kenichi Kubota, Hitoshi Hirano, Hisao Fukaya
  • Patent number: 10695799
    Abstract: A control method for a vibration-type actuator which prevents the vibration-type actuator from becoming inoperable during operation. To drive the vibration-type actuator when a load for moving a vibrating body and a driven body relatively to each other is relatively high, a first frequency falling within a frequency range including a frequency at which thrust of the vibration-type actuator reaches its peak is set as a starting frequency of AC voltage applied to an electro-mechanical energy conversion element of the vibrating body. To drive the vibration-type actuator when the load is relatively low, a third frequency lower than the first frequency and higher than a second frequency is set as the starting frequency, the second frequency being a frequency at which a moving speed at which the driving body and the driven body move relatively to each other reaches its peak.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: June 30, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Yuki Oda
  • Patent number: 10690891
    Abstract: A wafer level camera module includes an image sensor including an imaging region formed on a top surface thereof, a first support layer disposed on the image sensor and having an opening, and first and second zooming units sequentially stacked having a second support layer interposed therebetween. Each zooming unit includes a piezoelectric thin film disposed on the first support layer and having an opening. Each zooming unit further includes a deformable layer disposed on the piezoelectric thin film. Each zooming unit additionally includes a lens attached to the deformable layer and positioned to overlap the imaging region. The wafer level camera module additionally includes a first conductive via penetrating through the camera module to be electrically connected to the first piezoelectric thin film. The camera module further includes a second conductive via penetrating through the camera module to be electrically connected to the second piezoelectric thin film.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: June 23, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Maohua Du
  • Patent number: 10686096
    Abstract: A lead frame includes a main plate and a side plate. The main plate has a support portion and a projecting portion. The support portion has two opposite first sides and a support face located between the first sides. The projecting portion projects upward from one of the first sides in a direction opposite to the support face. The side plate is disposed separately from the one of the first sides of the support portion and is spaced apart from the projecting portion.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: June 16, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORP.
    Inventors: Tsan-Yu Ho, Chen-Hsiu Lin, Meng-Sung Chou
  • Patent number: 10672816
    Abstract: Optical sensors including a light-impeding pattern are provided. The optical sensors may include a plurality of photoelectric conversion regions, a plurality of lenses on the plurality of photoelectric conversion regions, and a light-impeding layer extending between the plurality of photoelectric conversion regions and the plurality of lenses. The light-impeding layer may include an opening between a first one of the plurality of photoelectric conversion regions and a first one of the plurality of lenses. The optical sensors may be configured to be assembled with a display panel such that the plurality of lenses are disposed between the light-impeding layer and the display panel.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: June 2, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jonghoon Park, BumSuk Kim, Jung-Saeng Kim, Min Jang, Taesub Jung, Hyukjin Jung, Dongmin Keum, Changrok Moon
  • Patent number: 10666881
    Abstract: The present technology relates to a solid-state image sensor and an electronic device that can expand a dynamic range while suppressing degradation of image quality. A solid-state image sensor includes a pixel unit in which basic pattern pixel groups are arranged, each of the basic pattern pixel groups having output pixels of a plurality of colors arranged according to a predetermined pattern, the output pixel being a pixel based on an output unit of a pixel signal, the output pixel of at least one color among the output pixels having three or more types of sizes, and a signal processing unit configured to perform synthesis processing for a plurality of the pixel signals from a plurality of the output pixels having a same color and different sizes. The present technology can be applied to, for example, a CMOS image sensor.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 26, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Kazuaki Kaneko, Yoshinori Takagi, Katsumi Yamagishi, Naoki Kawazu
  • Patent number: 10666845
    Abstract: In one aspect of the present disclosure, a module is disclosed for use with a digital image capturing device (DICD) including an integrated sensor-lens assembly (ISLA). The module includes a cradle configured for connection to a housing of the DICD, and at least one dampener that is configured for positioning between the module and the housing of the DICD to reduce vibrations transmitted to the ISLA.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: May 26, 2020
    Assignee: GoPro, Inc.
    Inventors: Himay Shukla, Kielan Crow, Pascal Gohl
  • Patent number: 10650258
    Abstract: A system. The system may include a glare shield positioned between an exterior pane of an aircraft window and an interior portion of an aircraft. The glare shield may include at least one anti-reflective mask and at least one viewing aperture. Each of the at least one anti-reflective mask may be positioned adjacent one of the at least one viewing aperture.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: May 12, 2020
    Assignee: B/E Aerospace, Inc.
    Inventors: R. Klaus Brauer, John Warren, Simon Robert Lee, Ian L. Frost
  • Patent number: 10652518
    Abstract: A multi-lens based capturing apparatus and method are provided. The capturing apparatus includes a lens array including lenses and a sensor including sensing pixels, wherein at least a portion of sensing pixels in the sensor may generate sensing information based on light entering through different lenses in the lens array, and light incident on each sensing pixel, among the portion of the plurality of sensing pixels may correspond to different combinations of viewpoints.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: May 12, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yang Ho Cho, Dong Kyung Nam, Hyoseok Hwang, Young Ju Jeong, Jingu Heo
  • Patent number: 10643312
    Abstract: Provided is a smoothed image generating device which is capable of rapidly smoothing brightness information. A smoothed image generating device (1) includes: a reduced-size divided data generating section (11) which generates reduced-size divided data by extracting some of a plurality of regions from divided data, the divided data being obtained by dividing, into the plurality of regions, brightness data obtained by extracting brightness information from imaging data on a subject having uniform brightness; a smoothing processing section (12) which generates smoothed reduced-size divided data by carrying out a smoothing process with respect to the reduced-size divided data; and a smoothed image generating section (13) which generates smoothed image data, which is identical in size to the divided data, by interpolating between a plurality of regions constituting the smoothed reduced-size divided data.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: May 5, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Yasushi Ishii
  • Patent number: 10613291
    Abstract: A camera module is disclosed, the camera module including a lens barrel including more than one sheet of lens receiving an optical image of an object, an actuator moving the lens barrel, a PCB (Printed Circuit Board) formed with an image sensor at a bottom surface of the lens barrel for converting the optical image to an electrical signal, and a holder for supporting the lens barrel and the actuator and formed with a terminal electrically connected to the actuator, wherein an electrical contact point between the actuator and the terminal is formed with two or more tiers of coated layers.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: April 7, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Young Taek Oh
  • Patent number: 10613343
    Abstract: A camera module includes: an optical imaging system including a frontmost lens disposed closest to an object side, a rearmost lens disposed closest to an imaging plane, and at least one middle lens disposed between the frontmost lens and the rearmost lens. An image-side surface of the rearmost lens is concave and an inflection point is formed on the image-side surface of the rearmost lens. 0.2<D/TTL is satisfied, D being a shortest distance between the rearmost lens and the imaging plane, and TTL being a distance from an object-side surface of the frontmost lens to the imaging plane.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: April 7, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Ju Hwa Son
  • Patent number: 10613420
    Abstract: A camera system includes a camera with a lens assembly and image processing electronics internal to the camera housing. The lens assembly and image processing electronics are sensitive to thermal gradients within the camera body. The image processing electronics are coupled to a thermal management system that transfers thermal energy away from the electronics towards a heat diffuser. The thermal management system comprises a heat controller with a heat source, an offset arm, and a heat exchange. The thermal energy moves from the heat source to the heat exchange via the offset arm. The thermal management system also manages heat transfer between auxiliary electronic components and the image processing electronics. The thermal management system is constructed of materials that react to the compressive forces created on the system during camera assembly.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: April 7, 2020
    Assignee: GoPro, Inc.
    Inventor: Ihab A. Ali
  • Patent number: 10605963
    Abstract: A telephoto camera lens sequentially includes from an object side to an image side, a first lens with positive optical power, an object-side face of the first lens being convex; a second lens with optical power; a third lens with optical power; a fourth lens with optical power; a fifth lens with optical power, an object-side face of the fifth lens being concave; and a sixth lens with optical power, an object-side face of the sixth lens being concave near an axis, and an image-side face of the sixth lens being convex near the axis. The telephoto lens satisfies: 0.75<TTL/f<1.0, and ImgH/f<0.55, wherein TTL represents a distance between the object-side face of the first lens and an imaging face along the axis, f represents an effective focal length of the telephoto camera lens, and ImgH is half of a diagonal line of an effective pixel region on the imaging face.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: March 31, 2020
    Assignee: ZHEJIANG SUNNY OPTICS CO., LTD.
    Inventors: Fujian Dai, Lin Huang
  • Patent number: 10605630
    Abstract: Provided are a tactile sensor, a method of manufacturing the tactile sensor, and a three-dimensional (3D) mapping method. The tactile sensor includes a total reflection layer; a pixel layer formed on the total reflection layer and including a microarray; and a tactile pad layer formed on the pixel layer.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: March 31, 2020
    Assignee: Ulsan National Institute of Science and Technology (UNIST)
    Inventors: Jiseok Lee, Hyunhyub Ko, Seonghyeon Ahn
  • Patent number: 10598918
    Abstract: Videoendoscope designs are provided including an objective and image sensor, preferably in the distal region, the image sensor having a micro-lens array with micro-lens offsets designed for a designated chief ray angle. The scope further includes a lens group having negative optical power optically arranged adjacent to the image sensor. The negative optical power serves to modify the chief ray angle characteristic of the lens group to more closely match that required by the image sensor and micro-lens array. Some designs include a non-linear distortion in the second lens group to compensate for non-linearly varying offsets in the sensor micro-lenses. Various lens group designs and sensor arrangements are provided.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: March 24, 2020
    Assignee: KARL STORZ Imaging, Inc.
    Inventor: George E. Duckett, III
  • Patent number: 10594907
    Abstract: One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical direction; a support unit arranged in the housing while accommodating the first printed circuit board therein, and having a stepped portion including a first loading portion at which the second printed circuit board is placed and a second loading portion at which the third printed circuit board is placed; and a fixing unit coupled to the housing by penetrating through a first groove portion and a second groove portion, which are respectively formed at the edge parts of the second printed circuit board and the third printed circuit board, and through a third groove portion formed at the edge part of the support unit.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: March 17, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Hwan Park, Myoung Jin An
  • Patent number: 10587860
    Abstract: An imaging element includes a plurality of photoelectric conversion units that output an image signal for each pixel through a micro lens. An imaging signal processing circuit separates image signals output from the imaging element into a left-eye image signal and a right-eye image signal. An image combining circuit generates combined image data by performing arithmetic average processing for left-eye image data and right-eye image data. A recording medium control I/F unit controls to record left-eye image data and right-eye image data for use in 3D display and combined image data for use in 2D display in different regions in an image file.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: March 10, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takuya Shintani, Yuuzou Aoyama, Takayuki Nakahama
  • Patent number: 10586307
    Abstract: Disclosed is a method of acquiring an image of a target to provide an output video image that has a plurality of frame images. The method includes the steps of receiving a series of frame images from a video camera, using a processor to manipulate the series of frame images, which includes determining a reference resolution for providing output frame images, and displaying and/or storing the manipulated series of frame images as the output video image without changing a resolution of the output frame images. Also disclosed is a document imaging apparatus that includes a digital imaging unit. The digital imaging unit contains optics that having an infinite focal length. The document imaging apparatus also includes a processor that is coupled to the digital imaging unit and that is configured to cause the digital imaging unit to zoom in or zoom out in real-time while maintaining a resolution value of stored images constant.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: March 10, 2020
    Assignee: Pathway Innovations and Technologies, Inc.
    Inventors: Ji Shen, Dongbing Zhang
  • Patent number: 10582123
    Abstract: An imaging apparatus includes a plurality of imaging optical systems, and an imaging device having a plurality of imaging regions, each corresponding to one of the plurality of imaging optical systems. The plurality of imaging optical systems are arranged such that (2M+1)×(2N+1) imaging optical systems are arranged two-dimensionally in a horizontal direction and a vertical direction, where M and N are integers of 1 or more. A difference between a shift amount of the reference imaging optical system and a shift amount of an imaging optical system other than the reference imaging optical system is 2×Km/(2M+1) pixels in a horizontal direction and 2×Kn/(2N+1) pixels in a vertical direction, where Km is an integer satisfying ?M?Km?M, and Kn is an integer satisfying ?N?Kn?N.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: March 3, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventor: Keiichiro Ishihara
  • Patent number: 10558009
    Abstract: The invention discloses an at least two optical lenses for capturing image and an optical module for capturing image. The optical image capturing system comprises at least three pieces of optical lenses, an image plane, a first positioning element and a second positioning element. In certain conditions, the design of said optical image capturing system can achieve effects of simultaneously increasing input light, field of view, illuminance and improving the imagining quality in compact cameras.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: February 11, 2020
    Assignee: ABILITY OPTO-ELECTRONICS TECHNOLGOY CO. LTD.
    Inventors: Yeong-Ming Chang, Chien-Hsun Lai, Yao-Wei Liu
  • Patent number: 10552942
    Abstract: In one aspect, a color plenoptic imaging system captures a plenoptic image of an object. The plenoptic image is made up of a plurality of superpixels, and each superpixel includes a center subpixel. The collection of center subpixels from the plurality of superpixels forms a set of captured center view data for the object. The sensor array includes at least two arrays of different color sensors that capture subpixels of different colors. The microlens array and the sensor array are positioned such that, within the set of captured center view data, for each of the different colors, adjacent center subpixels of that color are separated by not more than three intervening center subpixels of a different color.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: February 4, 2020
    Assignee: RICOH COMPANY, LTD.
    Inventors: Aashish Kumar, Manuel Martinello
  • Patent number: 10551595
    Abstract: A photographing optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has a convex object-side surface. The second lens element with negative refractive power has a convex object-side surface and a concave image-side surface. The third lens element has refractive power. The fourth lens element has refractive power, and an object-side surface and an image-side surface thereof are aspheric. The fifth lens element with negative refractive power has a concave image-side surface, wherein an object-side surface and the image-side surface thereof are aspheric, and at least one of the object-side surface and the image-side surface thereof has at least one inflection point.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: February 4, 2020
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Lin-Yao Liao, Hsin-Hsuan Huang
  • Patent number: 10551560
    Abstract: Arrays of tapered light-guides enable the development of snapshot multi-dimensional imaging systems, such as containing wavelength information in addition to spatial (x,y) image intensity-distribution information. As a result of the tapered guides, the input and output of the array can have the same overall dimension while producing greater total inter-guide free space at the output plane than present at the input plane for the introduction of optical elements, such as dispersers, as needed for particular applications. Individual guides may be tapered at different rates within the array and the array itself may be tapered as a whole.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: February 4, 2020
    Inventor: Tomasz S. Tkaczyk
  • Patent number: 10542229
    Abstract: The present disclosure relates to a solid-state imaging device, a signal processing method therefor, and an electronic apparatus enabling sensitivity correction in which a sensitivity difference between solid-state imaging devices is suppressed. The solid-state imaging device includes a pixel unit in which one microlens is formed for a plurality of pixels in a manner such that a boundary of the microlens coincides with boundaries of the pixels. The correction circuit corrects a sensitivity difference between the pixels inside the pixel unit based on a correction coefficient. The present disclosure is applicable to, for example, a solid-state imaging device and the like.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: January 21, 2020
    Assignee: Sony Corporation
    Inventors: Youji Sakioka, Masayuki Tachi, Hisashi Nishimaki, Taishin Yoshida
  • Patent number: 10520701
    Abstract: An optical lens of the present disclosure assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, an optical filter and a sensor. The optical lens also has an axis. The first lens element, the fourth lens element and the sixth lens element have negative power, the second lens element, the third lens element and the fifth lens element have positive power.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: December 31, 2019
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Cheng-Yi Lai
  • Patent number: 10516877
    Abstract: Embodiments of the present application disclose light field collection control methods and apparatuses and light field collection devices, wherein one light field collection control method comprises: acquiring an aperture parameter of a main lens of a light field camera; determining, according to the main lens aperture parameter, in an image sensor of the light field camera, a local part of an imaging region corresponding to at least one sub-lens in a sub-lens array of the light field camera as a first imaging region; adjusting pixel density distribution of the image sensor, to cause pixel density of the first imaging region after adjustment to be distinguished from that of other parts of the imaging region; and performing light field collection on a scene via the adjusted light field camera.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: December 24, 2019
    Assignee: BEIJING ZHIGU RUI TUO TECH CO., LTD.
    Inventor: Lin Du
  • Patent number: 10515252
    Abstract: An optical element fabrication method including following steps are provided. First, a micro-lens layer including a micro-lens and a first substrate is provided. Besides, a micro optical channel layer including a micro optical channel and a second substrate is provided. A first bonding process is performed to bond the micro-lens layer to the micro optical channel layer, wherein the micro-lens is corresponded to the micro optical channel in a direction that is perpendicular to the surface of the second substrate, and the first substrate of the micro-lens layer is removed later.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: December 24, 2019
    Inventors: Chih-Yen Wu, Chen-Ta Ho, Chien-Hung Wu
  • Patent number: 10510737
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park
  • Patent number: 10511754
    Abstract: An imaging device having a lens group having lenses; a lens frame that holds said lens group; a base that holds said lens frame; an imaging element that has an imaging area; and a compression coil spring that prescribes the position of the lens frame relative to the imaging element so as to keep the optical axis of the lens group perpendicular to the imaging area of the imaging element. The imaging-element side of the lens frame has an orthogonal surface that is orthogonal to the optical axis of the lens group. The compression coil spring keeps said orthogonal surface in surface contact with an area that surrounds and is parallel to the imaging area of the imaging element.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: December 17, 2019
    Assignee: Nidec Copal Corporation
    Inventors: Yuta Nakamura, Ryo Kikuta