Abstract: An imaging device includes objective optics configured to form an image at a focal plane and having an optical axis that intersects the focal plane at an optical center. An image sensor, which includes an array of sensor elements arranged in a matrix of rows and columns, is positioned in the focal plane with a center point of the matrix displaced transversely by at least ten rows relative to the optical center.

Abstract: Apparatus and methods for a light-field camera and display system. In one embodiment, a light-field camera and display apparatus is provided, which may include a display screen and photosensor layer. In one variant, the display screen includes a plurality of pinholes or microlenses and a plurality of pixels configured according to a certain configuration. Additionally, in one variant, the photosensor layer includes multiple arrays of photosensors implemented to capture light that travels through the pinholes or microlenses. Yet additionally, methods for operating and calibrating the light-field camera and display apparatus are provided. In one embodiment, logic is provided which subtracts leakage light from the generated image that is displayed to the user.

Abstract: A novel imaging system is provided for capturing imaging data. According to the disclosed embodiments, the imaging system comprises one or more cameras configured to capture the same scene within each camera's field of view. The imaging system also includes a plurality of bandpass filters that may be positioned in front of one or more cameras. Each bandpass filter may allow the transmission of incident electromagnetic signals between different pairs of first and second wavelengths. Accordingly, when the bandpass filters are positioned in front of the one or more cameras, each camera captures a different spectral image, i.e., containing only certain frequency components of the same scene being imaged in the cameras. The bandpass filters may be selectively aligned with one or more cameras by rotating and/or translating the filters relative to the cameras' positions in the imaging system.

Abstract: A system for the simultaneous videographic or photographic acquisition of images, in particular of samples in a plurality of sample chambers of a sample plate, preferably a microtiter plate, includes an array of microscopes having mutually parallel optical axes, wherein each microscope includes an imaging chip and an objective. The imaging chips are attached to a carrier board as an array of columns and rows. An electronics unit for processing image data for all the microscopes is associated with the carrier board.

Abstract: An image-capturing device includes: a plurality of micro-lenses disposed in a two-dimensional pattern near a focal plane of an image forming optical system; an image sensor that includes a two-dimensional array of element groups each corresponding to one of the micro-lenses and made up with a plurality of photoelectric conversion elements which receive, via the micro-lenses light fluxes from a subject having passed through the photographic optical system and output image signals; and a synthesizing unit that combines the image signals output from the plurality of photoelectric conversion elements based upon information so as to generate synthetic image data in correspondence to a plurality of image forming areas present on a given image forming plane of the image forming optical system, the information specifying positions of the photoelectric conversion elements output image signals that are to be used for generating synthetic image data for each image forming area.

Abstract: An image pickup apparatus capable of maintaining accuracy of positioning a sealing member and also applying a proper elastic repulsion force to an image pickup device. A first holding member holds an image pickup device, a first optical member is disposed forward of the device in a first direction orthogonal to an image pickup surface of the device, and a sealing member is sandwiched and held between the first optical member and the device. The first holding member has an opening portion for guiding light flux having passed through a photographing optical system to the device, and an abutment surface brought into contact with part of the first optical member. The sealing member has protrusions each extending forward in the first direction, along an outer shape of the first optical member inside the opening portion of the first holding member, as viewed in the first direction.

Abstract: The present disclosure relates to the field of display technologies, and provides a touch substrate and a display panel. Specifically, the touch substrate comprises: a pixel array and a light sensing device array arranged oppositely; a light shielding layer between the pixel array and the light sensing device array; and a lens array on a side of the light shielding layer remote from the light sensing device array. The pixel array comprises a plurality of pixel units, each pixel unit comprising a plurality of sub-pixels. The lens array comprises a plurality of lens units. The light sensing device array comprises a plurality of light sensing devices. The light shielding layer is provided with a plurality of via holes.

Abstract: An electronic device includes a lens system including four lens elements. the four lens elements are, in order from an outer side to an inner side, a first lens element, a second lens element, a third lens element and a fourth lens element. The second lens element has negative refractive power. The fourth lens element has positive refractive power. At least one surface of the four lens elements has at least one inflection point. A projection device and a detecting module of the electronic device including the lens system are also disclosed.

Abstract: A self-aligning lens holder includes elements that register against an image sensor chip to align the holder and lens with the chip. The elements may deflect or deform. A corresponding method aligns the lens holder and a fisheye lens to the image sensor.

Abstract: The present disclosure discloses a camera optical lens. The camera optical lens including, in an order from an object side to an image side, a first lens, a second lens having a positive refractive power, a third lens having a positive refractive power, a fourth lens, a fifth lens, and a sixth lens. The first lens is made of plastic material, the second lens is made of plastic material, the third lens is made of plastic material, the fourth lens is made of plastic material, the fifth lens is made of glass material, and the sixth lens is made of plastic material. The camera optical lens further satisfies specific conditions.

Abstract: An apparatus, system and method are disclosed for a manufactured imager system. The apparatus, system and method may include an imager comprising a plurality of photosites divisible into a plurality of subsections, and at least one wafer-level lens additively composed of a plurality of material layers successively deposited directly upon the imager to achieve a predetermined optical performance for each of the plurality of subsections. The material layers may comprise one or more of a photopolymer, a thermoplastic resin, a low temperature melting glass, and a glass sheet, and may be uniform or non-uniform.

Abstract: The present disclosure discloses an optical imaging lens assembly. The optical imaging lens assembly includes, sequentially from an object side to an image side along an optical axis, a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens. The first lens has a positive refractive power and a convex object-side surface. The second lens has a negative refractive power. The third lens has a positive refractive power. Each of the fourth lens and the fifth lens has a positive refractive power or a negative refractive power. The sixth lens has a positive refractive power. The seventh lens has a negative refractive power, a concave object-side surface and a concave image-side surface. A combined focal length f12 of the first and second lenses and a combined focal length f34 of the third and fourth lenses satisfy: |f12/f34|?0.3.

Abstract: The present technology relates to a solid-state imaging element, a manufacturing method of the same, and an electronic device that achieve the extension of a dynamic range by making a difference in light-receiving sensitivity between low-sensitivity pixels and high-sensitivity pixels without changing spectral characteristics. The solid-state imaging element includes a pixel array portion in which two kinds of pixels different in light-receiving sensitivity, high-sensitivity pixels and low-sensitivity pixels are arrayed. The low-sensitivity pixels have a gray filter on or under a color filter to decrease light transmission factor in a visible-light region by a predetermined ratio. The present technology is applicable to solid-state imaging elements and the like, for example.

Abstract: An camera optical lens is disclosed. The camera optical lens includes, in sequence from an object side to an image side: a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens. A focal length of the first lens is f1, an Abbe number of the first lens is v1, a focal length of the second lens is f2, an Abbe number of the second lens is v2, a curvature radius of an object side of the second lens is R3, a curvature radius of an image side of the second lens is R4, an on-axis distance from an image side of the first lens to the object side of the second lens is d2, a total optical length of the camera optical lens is TTL, and the following conditions are satisfied: ?15.0?f2/f1??4.9, 25.0?TTL/d2?47.0, 3.0?v1/v2?7.0, and 6.0?(R3+R4)/(R3?R4)?20.0.

Abstract: An image sensor and an image sensing method are provided. The image sensor may restore a high resolution image with respect to a high magnification based on sensing information corresponding to different fields of view (FOVs) and that is received through lens elements having a same focal length and different lens sizes.

Abstract: The present embodiment relates to a lens assembly comprising: a holder; a lens module disposed at an inner side of the holder; an optical module disposed at an upper side of the lens module; and an conductive substrate electrically connected to the optical module, wherein the conductive substrate includes: a body part disposed at an upper side of the holder; and an extension part extended from one end of the body part, and including a terminal part, the holder includes a second lateral surface formed by being recessed inwards from a portion of a first lateral surface, and at least a portion of the extension part is disposed at the second lateral surface.

Abstract: A camera module includes a fixed member, a movable member, a lens unit and a driving member. A top surface of the fixed member is provided with a through hole, and is a step surface and includes first and second sub-top-surfaces mutually connected, and the first sub-top-surface is inclined with respect to the second sub-top-surface and defines a notch together with the second sub-top-surface. The movable member is accommodated in the fixed member and corresponds to the through hole. The lens unit is accommodated in the movable member and corresponds to the through hole. The driving member is provided in the fixed member and located at a side of the fixed member away from the notch, and configured to drive the movable member to lead the lens unit to move along an optical axis of the lens unit. The present disclosure further discloses an electronic device.

Abstract: A rear adapter module for a finite conjugate optical assembly and camera is configured to couple with a core zoom module. A lens assembly of the rear adapter module includes three or more lens elements and has a positive focal length. The lens assembly exhibits a pupil size of between 16 and 25 mm and a pupil depth greater than 50 mm.

Abstract: Techniques for localized reduction of screen glare, the techniques including receiving data from a first camera and a second camera on a perimeter of a display, triangulating a first location of a first light source and a second location of a first user based on the data from the first camera and the second camera. The techniques can further include determining, based on the first location and the second location, that the first user experiences glare from the first light source when viewing the display, and generating a modified screen buffer by modifying pixel values in a glare area of the display. The techniques can further include providing the modified screen buffer to the display.

Abstract: A light-field camera may generate four-dimensional light-field data indicative of incoming light. The light-field camera may have an aperture configured to receive the incoming light, an image sensor, and a microlens array configured to redirect the incoming light at the image sensor. The image sensor may receive the incoming light and, based on the incoming light, generate the four-dimensional light-field data, which may have first and second spatial dimensions and first and second angular dimensions. The first angular dimension may have a first resolution higher than a second resolution of the second angular dimension.

Abstract: An imaging device having a substrate having an imaging unit mounted thereupon; a lens barrel holding a lens; a holder holding the lens barrel and being connected to the substrate; and a first elastic body impelling the substrate in a first direction perpendicular to the optical axis.

Abstract: An imaging system (200) for generating a measure of authenticity of an object (10) comprises a dispersive imaging arrangement (30) and an image sensor arrangement (60). They are positioned so that, when electromagnetic radiation (20) from the object (10) illuminates the dispersive imaging arrangement (30), the electromagnetic radiation is dispersed and imaged by the image sensor arrangement (60). The imaging system (200) is configured to then generate a measure of authenticity of the object (10) depending at least on a relation between the imaged dispersed electromagnetic radiation and reference spectral information. The invention also relates to imaging methods, computer programs, computer program products, and storage mediums.

Abstract: An optical image capturing system includes five lens elements, the five lens elements being, in order from an object side to an image side: a first lens element; a second lens element having positive refractive power; a third lens element having positive refractive power; a fourth lens element; and a fifth lens element having an image-side surface being concave in a paraxial region thereof and at least one convex critical point in an off-axis region of the image-side surface thereof.

Abstract: A first wide angle image, a second wide angle image, a first telephoto image, and a second telephoto image are acquired from a first imaging unit 11L and a second imaging unit 11R at the same time, and particularly, optical axes of the wide angle optical system and the telephoto optical system constituting the first imaging optical system 12L match each other, and the second imaging optical system is similarly configured, and therefore, it is possible to position the main subject at a center position of the first telephoto image and the second telephoto image by independently performing pan and tilt control on the first and the second imaging unit so that the main subject is captured on the respective optical axes of the first imaging optical system and the second imaging optical system on the basis of the first wide angle image and the second wide angle image.

Abstract: An array of diffraction-pattern generators employ phase anti-symmetric gratings to projects near-field spatial modulations onto a closely spaced array of photoelements. Each generator in the array of generators produces point-spread functions with spatial frequencies and orientations of interest. The generators are arranged in an irregular mosaic with little or no short-range repetition. Diverse generators are shaped and placed with some irregularity to reduce or eliminate spatially periodic replication of ambiguities to facilitate imaging of nearby scenes.

Abstract: An imaging device of the present invention includes: an imaging optical system that collects light from a subject and forms a primary image of the subject; a microlens array having a plurality of microlenses (5a) that are two-dimensionally arrayed at a position of the primary image formed by the imaging optical system or a position conjugate with the primary image; a relay optical system that relays light collected by the microlenses; a light-receiving part that receives, with a plurality of light-receiving elements, the light relayed by the relay optical system; and an adjusting unit that switches between a first layout state, in which the a plurality of light-receiving elements and back focal positions of the microlenses are conjugate with each other, and a second layout state, in which the plurality of light-receiving elements and principal-point positions of the microlenses are conjugate with each other.

Abstract: An image acquisition device according to the present invention includes: an image-acquisition-optical-system; a microlens array having microlenses; a phase filter modulating a phase distribution to light incident on the microlenses via the image-acquisition-optical-system; a light receiving unit receiving the light focused by the microlenses by light receiving elements; an adjusting unit switching between a first arrangement state in which the light receiving elements are arranged at back focal positions of the microlenses and a second arrangement state in which the light receiving elements are arranged in vicinities of principal point positions of the microlenses; a memory storing a point image intensity distribution at the light receiving unit in each of the arrangement states; and an arithmetic operation unit generating a processed image by using the point image intensity distribution and image information at the light receiving unit in each of the arrangement states.

Abstract: A lens module and a capturing module integrating a focusing mechanism and an assembly method therefor. A lens module (1010) comprises at least one optical lens (1011), a focusing mechanism (1012), and a supporting structure component (1013). Each optical lens (1011) is mounted in an accommodating cavity of the supporting structure component (1013) in a height direction of the supporting structure component (1013). The supporting structure component (1013) is connected inside of the focusing mechanism (1012) as a carrier of the focusing mechanism (1012). The supporting structure component (1013) moves as the focusing mechanism (1012) is powered, and is thereby suitable for focusing. By replacing a carrier and a lens cone of a conventional focusing mechanism with the supporting structure component (1013), an overall assembly process is simplified, the yield and quality of a module are improved, and the manufacturing costs are reduced.

Abstract: A backside illumination image sensor that includes a semiconductor substrate with a plurality of photoelectric conversion elements and a read circuit formed on a front surface side of the semiconductor substrate, and captures an image by outputting, via the read circuit, electrical signals generated as incident light having reached a back surface side of the semiconductor substrate is received at the photoelectric conversion elements includes: a light shielding film formed on a side where incident light enters the photoelectric conversion elements, with an opening formed therein in correspondence to each photoelectric conversion element; and an on-chip lens formed at a position set apart from the light shielding film by a predetermined distance in correspondence to each photoelectric conversion element. The light shielding film and an exit pupil plane of the image forming optical system achieve a conjugate relation to each other with regard to the on-chip lens.

Abstract: An image sensor includes: a first pixel having a first photoelectric conversion unit that photoelectrically converts light having entered therein, and a first light blocking unit that blocks a part of light about to enter the first photoelectric conversion unit; and a second pixel having a second photoelectric conversion unit that photoelectrically converts light having entered therein and a second light blocking unit that blocks a part of light about to enter the second photoelectric conversion unit, wherein: the first photoelectric conversion unit and the first light blocking unit are set apart from each other by a distance different from a distance setting apart the second photoelectric conversion unit and the second light blocking unit.

Abstract: A plenoptic camera including an optical system receiving light issuing from an object field in which there is an object space intended to be processed via the camera. A matrix photosensitive sensor is composed of pixels arranged in rows and columns and such that each pixel receives the light of a single light ray via the system. The light rays, each associated with their pixel, form intersections in the object space, and the optics are configured so as to minimize the greatest distance between any point of the object space and the closest of the intersections of these light rays. Optical elements are aligned and arranged in rows and columns parallel respectively to the rows and columns of the matrix sensor, forming the intersections in the object field, the distances separating the rows and/or columns being irregular.

Abstract: A camera device proofed against ghosting and light flare includes a printed circuit board, an image sensor mounted on the printed circuit board, a supporting bracket fixed on the printed circuit board, and a lens module. The supporting bracket includes supporting plate and perpendicular side wall, the supporting plate and the side wall together forming a receiving room over the image sensor. The supporting plate has a central through hole for light ingress and a flange barrier protruding. The protruding flange barrier surrounds the light through hole, the lens module is fixed on the supporting surface, and the protruding flange barrier locates inside an inner side surface of the lens module.

Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.

Abstract: A liquid discharge head includes a body to discharge liquid, a first wiring substrate extending from the body, and a second wiring substrate electrically connected to the first wiring substrate. The body includes a nozzle face in which a plurality of nozzles, from which the liquid is discharged, is formed. The second wiring substrate is disposed along a direction perpendicular to the nozzle face of the body, a principal surface of the first wiring substrate is disposed along a short side of the body, and a principal surface of the second wiring substrate is disposed along a longitudinal direction of the body.

Abstract: There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.

Abstract: Provided herein is an image focusing adjustment method, system, and module. A first image of a reference object is received in response to an input signal when the image focusing adjustment module is operating in a first state. The first image of the reference object is analyzed, based on which a plurality of adjustments to the image focusing adjustment module is controlled. The plurality of adjustments, performed by a plurality of actuators controlled by control module, include rotating a lens barrel assembly relative to a neck member along a first axis that causes a translational adjustment of the lens barrel assembly, rotating the neck member relative to a top member around the first axis that causes a rotational adjustment of the lens barrel assembly, and positioning a tilt adjustment member that causes tilt adjustment of the top member relative to a frame member along a second axis.

Abstract: A substrate structure for an image sensor module includes a module substrate including a sensor mounting hole, a reinforcing plate on a lower surface of the module substrate, an image sensor chip on the reinforcing plate within the sensor mounting hole, and a reinforcing pattern in the module substrate. The reinforcing plate covers the sensor mounting hole. An upper surface of the image sensor chip may be exposed by the module substrate. The reinforcing pattern is adjacent to the sensor mounting hole and extends in at least one direction.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A camera module testing method is applied to a camera module including a camera lens and a photosensitive element. In a step (A), an original image is captured through the camera lens and the photosensitive element. In a step (B), the original image is converted into a gray scale image. In a step (C), the gray scale image is converted into a binary image according to a critical gray scale value. In a step (D), a boundary contour is obtained according to plural pixels of the binary image higher than or equal to the critical gray scale value. In a step (E), a contour center of the boundary contour is obtained. Then, a step (F) is performed to judge whether an optical axis of the camera lens is aligned with an imaging center of the photosensitive element according to the imaging center and the contour center.

Abstract: A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.

Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.

Abstract: A method of fabricating a piezoelectric transducer may include interleaving a plurality of layers of piezoelectric material with a plurality of conductive layers including a first conductive layer, one or more second conductive layers, and one or more third conductive layers, coupling the first conductive layer to a first electrode, wherein an electrical impedance of the first conductive layer varies as a function of a temperature internal to the piezoelectric transducer, and such that a measurement signal indicative of the electrical impedance is generated at the first electrode, coupling the one or more second conductive layers to a second electrode, and coupling the one or more third conductive layers to a third electrode, such that an electrical driving signal driven to the second electrode and the third electrode causes mechanical vibration of the piezoelectric transducer as a function of the electrical driving signal.

Abstract: A glass substrate having an average thickness of the glass substrate from 0.01 to 1.2 mm and having a temperature dependence of refractive index at a wave-length of 850 nm in a temperature range from ?40° C. to 60° C. of not more than 10×10?6/K.

Abstract: The present disclosure relates to a solid-state image pickup element and an electronic apparatus each of which enables a phase difference in an arbitrary direction to be properly detected. A solid-state image pickup element as a first aspect of the present disclosure includes a pixel array, and a plurality of AD conversion portions. The pixel array is partitioned into a plurality of pixel blocks each including a normal pixel and a pixel for phase difference detection. The plurality of AD conversion portions correspond to the respective plurality of pixel blocks, and AD-convert pixel signals based on a plurality of pixels included in the corresponding pixel block. In this case, the pixel for phase difference detection included in one pixel block of the plurality of pixel blocks, and the pixel for phase difference detection included in the other pixel block of the plurality of pixel blocks are arranged in positions corresponding to each other.

Abstract: Disclosed is an object determining system comprising an optical sensor, a kind determining circuit and an element analyzing circuit. The optical sensor comprises a kind determining region and an element analyzing region, wherein the optical sensor captures at least one object image of an object via the kind determining region, and acquires element analyzing optical data via the element analyzing region. The kind determining circuit is configured to determine an object kind of the object according to the object image. The element analyzing circuit is configured to analyze element of the object according to the element analyzing optical data and the object kind. An object determining system applying tow stage object sensing steps to determine an object kind is also disclosed.

Abstract: Provided are an image processing device, an imaging device, and an image processing method which are capable of obtaining a captured image with desired image quality. An image processing unit functioning as an image processing device includes a point image restoration processing unit that performs point image restoration processing using a restoration filter based on a point spread function of a lens unit on image data obtained from an imaging element through imaging of a subject using an imaging unit having the lens unit including a lens and the imaging element, and a determination unit that determines to perform the point image restoration processing using the point image restoration processing unit in a case where a modulation transfer function in a predetermined spatial frequency in which the point image restoration processing contributes is smaller than a threshold value. Here, the modulation transfer function is changed by an imaging condition.

Abstract: A control method for a vibration-type actuator which prevents the vibration-type actuator from becoming inoperable during operation. To drive the vibration-type actuator when a load for moving a vibrating body and a driven body relatively to each other is relatively high, a first frequency falling within a frequency range including a frequency at which thrust of the vibration-type actuator reaches its peak is set as a starting frequency of AC voltage applied to an electro-mechanical energy conversion element of the vibrating body. To drive the vibration-type actuator when the load is relatively low, a third frequency lower than the first frequency and higher than a second frequency is set as the starting frequency, the second frequency being a frequency at which a moving speed at which the driving body and the driven body move relatively to each other reaches its peak.

Abstract: An imaging lens includes a first lens group; and a second lens group, arranged from an object side to an image plane side. The first lens group includes a first lens having negative refractive power and a second lens. The second lens group includes a third lens having positive refractive power and a fourth lens having negative refractive power. The fourth lens is formed in a shape so that a curvature radius of a surface thereof on the image plane side is positive. The first lens, the second lens and the third lens have specific Abbe's numbers, the first lens is arranged to be away from the second lens, the second lens is arranged to be away from the third lens, and the third lens is arranged to be away from the fourth lens by specific distances on an optical axis so that the specific conditional expressions are satisfied.

Abstract: A wafer level camera module includes an image sensor including an imaging region formed on a top surface thereof, a first support layer disposed on the image sensor and having an opening, and first and second zooming units sequentially stacked having a second support layer interposed therebetween. Each zooming unit includes a piezoelectric thin film disposed on the first support layer and having an opening. Each zooming unit further includes a deformable layer disposed on the piezoelectric thin film. Each zooming unit additionally includes a lens attached to the deformable layer and positioned to overlap the imaging region. The wafer level camera module additionally includes a first conductive via penetrating through the camera module to be electrically connected to the first piezoelectric thin film. The camera module further includes a second conductive via penetrating through the camera module to be electrically connected to the second piezoelectric thin film.

Abstract: A lead frame includes a main plate and a side plate. The main plate has a support portion and a projecting portion. The support portion has two opposite first sides and a support face located between the first sides. The projecting portion projects upward from one of the first sides in a direction opposite to the support face. The side plate is disposed separately from the one of the first sides of the support portion and is spaced apart from the projecting portion.