Abstract: Provided is a zoom lens including, in order from an object side to an image side: a first lens unit having a positive refractive power which does not move for zooming; a second lens unit having a negative refractive power which moves during zooming; and an N-th lens unit having a positive refractive power which does not move for zooming and is arranged closest to the image side. In the zoom lens, the N-th lens unit includes in order from an object side: a first sub-lens unit; and a second sub-lens unit which is movable, and a lateral magnification at a wide angle end of the N-th lens unit and a lateral magnification at a wide angle end of the second sub-lens unit of the N-th lens unit when an axial ray enters from infinity in a state in which focus is at the infinity are appropriately set.

Abstract: Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Abstract: Disclosed herein is a camera module including: a lens barrel including at least one lens L stacked and bonded therein and having a lower protrusion part formed on a bottom surface thereof; a housing having an internal space so as to receive the lens barrel therein and having a supporting surface supporting the lens barrel; and a substrate formed below the housing and having an image sensor mounted thereon.

Abstract: An imaging apparatus having an image formation optical system having a lens for focus adjustment of an optical image of an object and an imaging unit for picking up the formed optical image and generating a pixel signal from which a refocus image can be generated includes: a calculation unit for obtaining information of the object the optical image of which is picked up by the imaging unit and calculating, based on the obtained object information, a range of a lens position at which the refocus image of the object being in-focus can be generated; a prediction unit for predicting, based on the lens position range, a change of the calculated lens position at which the refocus image of the object being in-focus can be generated; and a determination unit for determining a drive position of the lens based on a prediction result.

Abstract: The invention discloses a five-piece lens set for capturing images. The lens set comprises a five-piece optical lens. In order from an object side toward an image side, the five-piece optical lens comprises a first lens element with positive refractive power having a convex image-side surface; a second lens element having a convex object-side surface, and at least one of both surfaces thereof being aspheric; a third lens element with positive refractive power having a concave image-side surface, and having one inflection point that is located away from the optical axis; a fourth lens element with positive refractive power, and at least one of both surfaces thereof being aspheric; a fifth lens element having a convex object-side surface and having two inflection points not closed to an optical axis on the object-side surface. The five-piece lens set further comprises an aperture stop and an image-plane.

Abstract: An exemplary embodiment of the present disclosure includes an array sensor arrayed with a plurality of image sensors, and a plurality of lens units respectively mounted on the plurality of image sensors.

Abstract: A spectroscope comprises a package provided with a light entrance part, a plurality of lead pins penetrating through a support part opposing the light entrance part in the package, a light detection unit supported on the support part within the package, and a spectroscopic unit supported on the support part within the package so as to be arranged on the support part side of the light detection unit. The light detection unit has a light transmission part for transmitting therethrough light incident thereon from the light entrance part. The spectroscopic unit has a spectroscopic part for spectrally resolving the light transmitted through the light transmission part while reflecting the light to a light detection part. The lead pins are fitted into fitting parts provided with the light detection unit and electrically connected to the light detection part.

Abstract: A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane.

Abstract: Present embodiments provide for a mobile device and an optical imaging lens thereof. The optical imaging lens comprises five lens elements positioned sequentially from an object side to an image side. Through controlling the convex or concave shape of the surfaces and/or the refracting power of the lens elements, the optical imaging lens shows better optical characteristics and the total length of the optical imaging lens is shortened.

Abstract: A microlens array substrate includes a substrate having transparency and having a plurality of concave portions provided on a first surface to correspond to a plurality of pixels, and a lens layer having a different refractive index from a refractive index of the substrate, which is provided on the first surface of the substrate to fill in the plurality of concave portions, in which each of the plurality of concave portions has a flat portion arranged at the center portion, a curved surface portion arranged to surround the flat portion, an edge portion arranged to surround the curved surface portion and connected to the first surface of the substrate, and an angle between the edge portion and the first surface in a cross section passing through the center portion is smaller than an angle between a virtual curved surface obtained by extending the curved surface portion toward the first surface and the first surface.

Abstract: An optical image capturing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has a convex object-side surface. The second lens element has negative refractive power. The third lens element has negative refractive power. The fourth lens element with negative refractive power has a concave object-side surface and a convex image-side surface. The fifth lens element with refractive power has a concave image-side surface, wherein the fifth lens element has at least one inflection point formed on at least one surface thereof. Both of the object-side surface and the image-side surface of the fourth and fifth lens elements are aspheric. The optical image capturing lens assembly has a total of five lens elements with refractive power.

Abstract: Systems and methods of manufacturing compact camera modules for use in electronic device are provided. The camera module includes a lens housing and a substrate assembly. The substrate assembly includes a flexible substrate wrapped around a molded enclosure. The optical image stabilization components for the camera module may be enclosed within the molded enclosure.

Abstract: A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane.

Abstract: An optical assembly includes a solid spacing layer between a plenoptic microlens array (MLA) and a pixel-level MLA, avoiding the need for an air gap. Such an assembly, and systems and methods for manufacturing same, can yield improved reliability and efficiency of production, and can avoid many of the problems associated with prior art approaches. In at least one embodiment, the plenoptic MLA, the spacing layer, and the pixel-level MLA are created from optically transmissive polymer(s) deposited on the photosensor array and shaped using photolithographic techniques. Such an approach improves precision in placement and dimensions, and avoids other problems associated with conventional polymer-on-glass architectures. Further variations and techniques are described.

Abstract: An image capturing apparatus includes an image sensor having a first pixel group that photoelectrically converts an object image from a first exit pupil region, a second pixel group that photoelectrically converts an object image from a second exit pupil region, and a third pixel group for capturing that photoelectrically converts an object image from overall exit pupil region; a focus detection unit that detects focus information by performing a defocus calculation with use of a first image signal obtained from the first pixel group and a second image signal obtained from the second pixel group; an image processing unit that converts captured image data into an image file for recording and saving; and a data recording unit that records, in association with the image file, signals obtained from the first pixel group and the second pixel group such that the defocus calculation can be performed.

Abstract: Aspects of the disclosed technology relate to an imaging system and method in which an array camera is employed along with an image processor to make use of parallax convergence differences in color and luminance between different cameras or groups of cameras within an array camera to provide improved super resolution performance.

Abstract: This solid-state image sensor includes an array of photosensitive cells and an array of dispersive elements. The photosensitive cell array is comprised of a plurality of unit blocks 40, each including four photosensitive cells 2a, 2b, 2c and 2d. A condensing element 4c is further arranged to cover the photosensitive cells 2a and 2b and condenses incoming light onto the photosensitive cells 2a and 2b.

Abstract: Present embodiments provide for a mobile device and an optical imaging lens thereof. The optical imaging lens comprises five lens elements positioned sequentially from an object side to an image side and an aperture stop positioned before the first lens element. Through controlling the convex or concave shape of the surfaces of the lens elements and designing parameters satisfying two inequalities, the optical imaging lens shows better optical characteristics and the total length of the optical imaging lens is shortened.

Abstract: An image capture element includes phase difference pixel groups (first and second pixel groups) corresponding to first and second images with a phase difference according to a focus shift, includes a third pixel group corresponding to a normal third image, outputs a first image and a second image with Bayer arrays from the first and second pixel groups, and outputs a third image with the same color array as a RAW image from the third pixel group. A color split image is generated based on the first and second images acquired from the image capture element, a color image for display is generated based on the third image, and the color split image is synthesized with part of the generated color image for display to thereby display a live-view image in which the split image is synthesized.

Abstract: A solid-state imaging device includes an imaging element having a light receiving surface, and a cover member disposed over and opposite to the light receiving surface of the imaging element with a space therebetween. The cover member has a quartz plate, and the optical axis of the crystal of the quartz plate is parallel to the light receiving surface.

Abstract: An image capturing element 5 has a phase difference detecting region 50a in a light receiving region 50 in which pixel cells are arranged, in the region 50a, some of pixel cells mounted with G filters, among the pixel cells which are arranged in a Bayer pattern, serve as phase difference detecting pixel cells 51R and 51L, the pixel cell 51L and the pixel cell 51R receive light which passes through different pupil areas of the image capturing lens 1, the pixel cell 51L includes two types of pixel cells (3) and (4) having different arrangement patterns of the adjacent pixel cells 51 and the pixel cell 51R includes two types of pixel cells (1) and (2) having different arrangement patterns of the adjacent pixel cells 51.

Abstract: The present invention provides apparatus for an imaging system comprising a multitude of imaging elements upon a substrate. In some embodiments the substrate may be approximately round with a radius of approximately one inch. Various methods relating to using and producing an imaging system are discussed.

Abstract: A method for projection includes generating a pattern of illumination, and positioning an array of lenses so as to project different, respective parts of the pattern onto a scene.

Abstract: Methods and apparatus for actively aligning a first optical element, such as a lens, to a second optical element, such as an image sensor, use continuous scans, even absent a synchronization signal from one of the optical elements. During a scan, timed position information about the scanned optical element is collected, and then a relationship between position of the scanned optical element and time is estimated, such as by fitting a curve to a set of position-time pairs. This relationship can then be used to estimate locations of the scanned optical element at times when image data or other alignment quality-indicating data samples are acquired. From this alignment quality versus location data, an optimum alignment position can be determined, and the scanned optical element can then be positioned at the determined alignment position.

Abstract: According to one embodiment, in a first imaging mode, an imaging mode control unit allows a second imaging optical system to function in an optical path between an imaging unit and a first imaging optical system and stops focus adjustment. In a second imaging mode, the imaging mode control unit stops the function of the second imaging optical system and allows the focus adjustment to be performed. The first imaging optical system takes in a light from an object to the imaging unit. The second imaging optical system forms an image piece in each pixel block.

Abstract: A solid-state image sensor, comprising an image sensor chip including a pixel region where a plurality of pixels are arranged and a peripheral region arranged around the pixel region, and a fixing portion including a substrate which supports the image sensor chip and a joint portion which joins the substrate to an external base, wherein the peripheral region includes a first portion, and a second portion which is smaller in an amount of generated heat than the first portion, the substrate includes a first side and a second side, the first portion is arranged nearer the first side than the second side, the second portion is arranged nearer the second side than the first side, and the joint portion is arranged on the first side of the substrate.

Abstract: A coherent fiber array is used to optically detect a radiometric event. The coherent fiber array has a dome-shaped detection surface and a planar output surface. Optical energy from the radiometric event is detected at the dome-shaped detection surface and transferred to the output surface. The coherent fiber array retains directionality of the radiometric event while transferring the optical energy from the dome-shaped detection surface to the planar output surface.

Abstract: An imaging lens substantially consists of, in order from an object side, five lenses of a first lens that has a positive refractive power and has a meniscus shape which is convex toward the object side, a second lens that has a biconcave shape, a third lens that has a meniscus shape which is convex toward the object side, a fourth lens that has a meniscus shape which is convex toward the image side; and a fifth lens that has a negative refractive power and has at least one inflection point on an image side surface. Further, the following conditional expression (1) is satisfied. 1.

Abstract: A driving unit that may improve characteristics in a low temperature environment while implementing downsizing, and a lens module as well as an image pickup device with such a driving unit are provided. The driving unit includes one or a plurality of polymer actuator elements, and a voltage supply section supplying a driving voltage and a heating voltage to the polymer actuator element.

Abstract: An image sensor module has a filler of a low refractive index and thus prevents deterioration of image quality due to a flare and a ghost image. The image sensor module includes an image sensor, a housing covering the image sensor, a filter coupled to the housing and disposed on the image sensor, and a filler filled in between the image sensor and the filter inside the housing and having a refractive index that is less than a refractive index of the filter.

Abstract: An imaging lens system includes, from the object side, an aperture stop, a positive first lens convex to the object side, a negative second lens, a positive third lens convex to the object side, a positive meniscus fourth lens convex to the image side, and a negative biconcave fifth lens, and fulfills the conditional formulae 0.8<f/f1<1.30, 0.5<f4/f1<0.90, 0.6<d4/d3<2.0, and 0.80<R3_1/f<2.20, where f is the focal length of the entire imaging lens system, f1 and f4 are the focal lengths of the first and fourth lenses, d3 is the axial thickness of the second lens, d4 is the axial aerial distance between the second and third lenses, and R3_1 is the radius of curvature of the object-side surface of the third lens on the optical axis.

Abstract: Various approaches to imaging involve selecting directional and spatial resolution. According to an example embodiment, images are computed using an imaging arrangement to facilitate selective directional and spatial aspects of the detection and processing of light data. Light passed through a main lens is directed to photosensors via a plurality of microlenses. The separation between the microlenses and photosensors is set to facilitate directional and/or spatial resolution in recorded light data, and facilitating refocusing power and/or image resolution in images computed from the recorded light data. In one implementation, the separation is varied between zero and one focal length of the microlenses to respectively facilitate spatial and directional resolution (with increasing directional resolution, hence refocusing power, as the separation approaches one focal length).

Abstract: A display is disclosed that comprises an array of display pixels, in which light sensing pixels are interspersed with the display pixels substantially across the area of the display. At least one color display sub-pixel is arranged to be switched off when the corresponding color light sensor pixel closest to that display sub-pixel is detecting light to generate an image. A portable electronic device is disclosed which comprises the display. The display is then operable to capture an image from the light sensing pixels, so that for example it can then operate as one or more of a digital mirror, scanner, biometric lock or touch panel. When a user looks at the display for a video call, the captured image of the user appears to look directly the other party.

Abstract: Systems and methods for performing photometric normalization in an array camera in accordance with embodiments of this invention are disclosed. The image data of scene from a reference imaging component and alternate imaging components is received. The image data from each of the alternate imaging components is then translated to so that pixel information in the image data of each alternate imaging component corresponds to pixel information in the image data of the reference component. The shifted image data of each alternate imaging component is compared to the image data of the reference imaging component to determine gain and offset parameters for each alternate imaging component. The gain and offset parameters of each alternate imaging component is then applied to the image data of the associate imaging to generate corrected image data for each of the alternate imaging components.

Abstract: An image capture module is disclosed, which includes a holder and a lens unit. A plurality of through holes are disposed on the holder, wherein at least one light blocking portion is disposed between the two adjacent through holes. The lens unit is disposed in the holder and has a plurality of light gathering regions and at least one non-light gathering region, wherein the light gathering regions respectively align with each of the through holes, and the non-light gathering region aligns with the light blocking portion.

Abstract: A camera module may include a substrate, and an image sensor mounted on the substrate. The camera module may also include a housing, and an electromagnetic interference (EMI) shield provided around the image sensor and within the module. The camera module may be particularly suited for use in a mobile telephone, for example.

Abstract: Various embodiments for extended defect sizing range for wafer inspection are provided. One inspection system includes an illumination subsystem configured to direct light to the wafer. The system also includes an image sensor configured to detect light scattered from wafer defects and to generate output responsive to the scattered light. The image sensor is also configured to not have an anti-blooming feature such that when a pixel in the image sensor reaches full well capacity, excess charge flows from the pixel to one or more neighboring pixels in the image sensor. The system further includes a computer subsystem configured to detect the defects on the wafer using the output and to determine a size of the defects on the wafer using the output generated by a pixel and any neighboring pixels of the pixel to which the excess charge flows.

Abstract: When the super-resolution processing is performed, loss of signal occurs due to the aperture effect, and adversely affects the image quality. In order to improve the image quality by suppressing the occurrence of loss of signal, a pixel aperture characteristic provided for some of image capturing units differs from a pixel aperture characteristic provided for the other image capturing units, and a plurality of digital images are captured by these image capturing units and are synthesized thereafter.

Abstract: A microlens array unit according to an embodiment includes: a substrate; a first group of microlenses including first microlenses having a convex shape and a first focal length, the first group of microlenses being arranged on the substrate; and a second group of microlenses including second microlenses having a convex shape and a second focal length different from the first focal length, the second group of microlenses being arranged on the substrate, a first imaging plane of the first group of microlenses and a second imaging plane of the second group of microlenses being parallel to each other, a distance between the first and second imaging planes in a direction perpendicular to the first imaging plane being 20% or less of the first focal length, and images of the first microlenses projected on the substrate not overlapping images of the second microlenses projected on the substrate.

Abstract: A smartphone is adapted for use as an imaging spectrometer, by synchronized pulsing of different LED light sources as different image frames are captured by the phone's CMOS image sensor. A particular implementation employs the CIE color matching functions, and/or their orthogonally transformed functions, to enable direct chromaticity capture. A great variety of other features and arrangements are also detailed.

Abstract: An image sensor device may include a bottom interconnect layer, an image sensing IC above the bottom interconnect layer and coupled thereto, and an adhesive material on the image sensing IC. The image sensor device may include an IR filter layer above the lens layer, and an encapsulation material on the bottom interconnect layer and surrounding the image sensing IC, the lens layer, and the IR filter layer. The image sensor device may include a top contact layer above the encapsulation material and including a dielectric layer, and a contact thereon, the dielectric layer being flush with adjacent portions of the IR filter layer.

Abstract: A compact electronic device may include a camera module having an image sensor. The image sensor may be controlled by storage and processing circuitry to capture image data from received light. The camera module may include a substrate having front and rear surfaces. The image sensor may be mounted to the rear surface of the substrate. The substrate may include optical focusing structures on the front surface of the substrate that focus light through an opening in the substrate to the image sensor. A flex circuit may be used to convey signals between the camera module and other electronic device components. The flex circuit may be mounted to the front surface of the camera module substrate to help reduce total height of the camera module. The flex circuit may be mounted to an extended portion of the substrate or may be mounted to surround the periphery of the image sensor.

Abstract: A multiband camera comprises: a band-pass filter having four or more optical filters; a microlens array having arrayed microlenses; a photoelectric conversion element including a plurality of pixels; and a measurement unit for measuring spectral intensity. The multiband camera satisfies the expression below, where Pl is a pitch between the microlenses, Ps is a pitch between the pixels, n is a number of pixels corresponding to one microlens, u is an effective dimension in a prescribed direction of the pixels, t is a dimension in the prescribed direction of a real image that the band-pass filter forms on a plurality of two-dimensionally arrayed pixels, Na is a number of microlenses arrayed in the prescribed direction, L is a distance from an exit pupil to the microlens, and f is a focal length of the microlens.

Abstract: An image pickup optical system made of five lenses, includes in order from an object side, an aperture stop, a first lens L1 having a positive refracting power, a second lens L2 having a negative refracting power, a third lens L3 having a positive refracting power, a fourth lens L4 having a positive refracting power, and a fifth lens L5 having a negative refracting power. Moreover, an image pickup apparatus includes this image pickup optical system.

Abstract: An optical member including a porous glass layer on a base member is provided, wherein the reflectance is reduced and a ripple is suppressed. The optical member is provided with a base member and a glass layer holding a transparent material in the inside of a porous structure disposed on the base member, wherein in the thickness direction of the glass layer, the porosity in the base member side with respect to the center line of the glass layer in the thickness direction is smaller than the porosity in the side opposite to the base member with respect to the center line of the glass layer in the thickness direction.

Abstract: An image sensor module includes a substrate, an image sensor, and a connecting plate. The substrate includes a supporting portion and an extending portion extending from one side of the supporting portion. The supporting portion includes an upper surface and a lower surface opposite to the upper surface. The supporting portion defines a through hole penetrating the upper surface and the lower surface and a receiving recess communicating the through hole on the lower surface. The thickness of the extending portion is less than the thickness of the supporting portion. The image sensor is received in the receiving recess and is electrically connected to the substrate. The connecting plate is electrically connected to the extending portion, the thickness of the connecting plate is less than or equal to the thickness difference between the extending portion and the supporting portion.

Abstract: A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

Abstract: The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area.

Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.

Abstract: Camera methods and apparatus are described where the camera device includes multiple optical chains. In various embodiments two or more of the optical chains include light redirection devices such as mirrors or prisms. Sensors corresponding to multiple different optical chains, but not necessarily all optical chains, are parallel to each other. In some embodiments sensors corresponding to different optical chains are located in the same plane at the front or rear of the camera. However other sensor mounting positions are also possible.