Abstract: A method for performing ranging measurements within a formation includes transmitting an asymmetric time-varying signal from a transmitter (114) disposed within a borehole (106) in the formation. The asymmetric time-varying signal may have a signal characteristic that is based at least in part on a downhole characteristic. A (receiver 110) disposed within the borehole (106) may measure a magnetic field induced on an object (103) within the formation by the asymmetric time-varying signal. A direction to the object (103) from the borehole (106) may be determined based at least in part on the measurement of the induced magnetic field.

Abstract: In one disclosed embodiment, the present test structure for determining gate-to-body current in a floating body FET includes a floating body FET situated over a semiconductor layer, where the floating body FET includes a first gate and first and second source/drain regions. The floating body test structure further includes a second gate and a first contact situated over the first source/drain region. A gate-to-channel current measured between the second gate and the first contact is utilized to determine the gate-to-body tunneling current. The gate-to-body tunneling current can be determined by subtracting the gate-to-channel current from twice a source/drain current of the floating body FET. The test structure may also include a second contact situated on a doped region in the semiconductor layer, where a diode current flow through the doped region determines a body voltage for the floating body FET.

Abstract: One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads.

Abstract: An optical irradiating apparatus for use in a display unit and an optical irradiating method thereof is disclosed. The apparatus includes an optical source lamp, a polarizer secured within a polarized light transducer and for separating light rays incoming from the optical source lamp, and an optical/video converting device for converting the reflected light rays (reflected by the polarizer) to video signals. The light rays which have undergone the above procedure pass through an optical irradiating lens, and then, are sent to a screen. The optical irradiating apparatus further includes first and second reflecting mirrors installed respectively above and below the polarizer within the optical polarizing device and for reflecting the light rays passed through the polarizer, and a .lambda./4 plate installed on the surface of the second reflecting mirror and for polarizing the light rays (reflected from the first reflecting mirror) to the same component as that of the initial reflected light rays.