Refraction From Surfaces Of Different Refractive Index Patents (Class 356/504)
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Patent number: 11906281Abstract: The present disclosure relates to an apparatus and method for measuring the thickness and refractive index of a multilayer thin film by measuring angle-resolved spectral reflectance according to light polarization. According to an exemplary embodiment of the present disclosure, the apparatus and method for measuring the thickness and refractive index of a multilayer structure using angle-resolved spectroscopic reflectometry is capable of measuring and analyzing thickness and refractive index of each layer of a structure having a multilayer thin film through an s-polarized imaging and a p-polarized imaging of the reflective light located in a back focal plane of an objective lens which are acquired through an angle-resolved spectral imaging acquisition part.Type: GrantFiled: January 26, 2018Date of Patent: February 20, 2024Assignee: Korea Research Institute of Standards and ScienceInventors: Young-sik Ghim, Hyug-gyo Rhee
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Patent number: 11819975Abstract: A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.Type: GrantFiled: December 11, 2018Date of Patent: November 21, 2023Assignee: DISCO CORPORATIONInventors: Shinya Watanabe, Ichiro Yamahata, Katsuhiko Suzuki
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Patent number: 11688616Abstract: A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored.Type: GrantFiled: July 19, 2021Date of Patent: June 27, 2023Assignee: Applied Materials, Inc.Inventors: Upendra V. Ummethala, Blake Erickson, Prashanth Kumar, Michael Kutney, Steven Trey Tindel, Zhaozhao Zhu
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Patent number: 11639872Abstract: Systems, methods, and computer readable medium are provided for determining interferometric data and spectral data associated with combustion conditions of a flame in a combustion chamber using a sensor head including a first vacuum cavity, a diaphragm operatively interfaced to an inner portion of the combustion chamber, and an optical sensor interrogator configured on a computing device and coupled to the sensor head via optical fibers. The optical sensor interrogator including an interferometer configured to determine interferometric data associated with the flame based on light transmitted and reflected via a first optical fiber and a spectrometer configured to determine spectral data associated with the flame based on light transmitted via a second optical fiber.Type: GrantFiled: April 3, 2020Date of Patent: May 2, 2023Assignee: GE Inspection Technologies, LPInventor: Michael Charles Spalding
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Patent number: 11476081Abstract: A method, non-transitory computer readable medium and an evaluation system for evaluating an intermediate product related to a three dimensional NAND memory unit. The evaluation system may include an imager and a processing circuit. The imager may be configured to obtain, via an open gap, an electron image of a portion of a structural element that belongs to an intermediate product. The structural element may include a sequence of layers that include a top layer that is followed by alternating nonconductive layers and recessed conductive layers. The imager may include electron optics configured to scan the portion of the structural element with an electron beam that is oblique to a longitudinal axis of the open gap. The processing circuit is configured to evaluate the intermediate product based on the electron image. The open gap (a) exhibits a high aspect ratio, (b) has a width of nanometric scale, and (c) is formed between structural elements of the intermediate product.Type: GrantFiled: June 30, 2020Date of Patent: October 18, 2022Assignee: APPLIED MATERIALS ISRAEL LTD.Inventors: Roman Kris, Vadim Vereschagin, Assaf Shamir, Elad Sommer, Sharon Duvdevani-Bar, Meng Li Cecilia Lim
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Patent number: 11417010Abstract: Methods for detecting areas of localized tilt on a sample using imaging reflectometry measurements include obtaining a first image without blocking any light reflected from the sample and obtaining a second image while blocking some light reflected from the sample at the aperture plane. The areas of localized tilt are detected by comparing first reflectance intensity values of pixels in the first image with second reflectance intensity values of corresponding pixels in the second image.Type: GrantFiled: May 19, 2020Date of Patent: August 16, 2022Assignee: Applied Materials, Inc.Inventors: Mehdi Vaez-Iravani, Guoheng Zhao
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Patent number: 11413720Abstract: There is disclosed a polishing apparatus which allows for easy replacement of a light source with another type of light source. The light-source assembly includes: a base fixed to a polishing table and coupled to a light-emitting transmission line; and a light-source module having a lamp for emitting light. The light-source module is removably attached to the base. The base is a common base which is adapted to any of a plurality of light-source modules of different types including the light-source module. The base includes a positioning structure which achieves positioning of the light-source module relative to the base.Type: GrantFiled: October 16, 2018Date of Patent: August 16, 2022Assignee: EBARA CORPORATIONInventors: Nobuyuki Takahashi, Toshifumi Kimba, Masaki Kinoshita
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Patent number: 11402336Abstract: A system for detecting residue in a two-phase immersion cooling system based on changes in the intensity of energy reflected off a reflective surface. An energy source is positioned at an incident angle relative to a reflective surface and an intensity sensor is positioned at a target reflected energy angle relative to the reflective surface, wherein the intensity sensor detects light or other energy reflected off the reflective surface. If residues are deposited on the reflective surface, the reflectivity of the residue will change the reflected energy angle or otherwise change the amount of energy reflected toward the sensor. A heating element may generate more heat than existing components such that the system detects the presence of residues with sufficient time to allow less expensive and less intensive corrective measures.Type: GrantFiled: February 5, 2021Date of Patent: August 2, 2022Assignee: Dell Products L.P.Inventors: Jon Taylor Fitch, Steven Embleton, David Lyle Moss
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Patent number: 11320387Abstract: Techniques regarding one or more structures for checking the via formation are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a microfluidic channel positioned on a silicon substrate. The apparatus can also comprise a pattern of material comprised within the microfluidic channel and positioned on a surface of the silicon substrate. Further, the pattern of material can define a future location of a through-silicon via. An advantage of such an apparatus can be that the pattern of material can facilitate checking whether the through-silicon via is fully or partially formed.Type: GrantFiled: November 28, 2018Date of Patent: May 3, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Benjamin Wunsch, Sung-Cheol Kim, Stacey Gifford, Joshua T. Smith
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Patent number: 11015919Abstract: A thickness measuring apparatus includes a white light source for emitting white light, a dispersing mechanism for producing time differences corresponding to the wavelengths of light components of the white light to thereby generate spectral light, the spectral light being applied to the workpiece and then reflected on the upper surface and the lower surface of the workpiece to obtain return light, a two-dimensional image sensor having a photodetecting area for detecting the return light, the photodetecting area including a plurality of pixels, a storing section for storing the intensity of the return light detected by the plural pixels according to wavelength with time difference, the intensity of the return light detected by each pixel being stored as a spectral interference waveform, and a thickness computing section for computing the thickness of the workpiece from the spectral interference waveform stored in the storing section.Type: GrantFiled: December 16, 2019Date of Patent: May 25, 2021Assignee: DISCO CORPORATIONInventors: Nobuyuki Kimura, Keiji Nomaru
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Patent number: 10871400Abstract: Provided herein are systems and methods for monitoring radial stresses in glass tubing. In some embodiments, a measurement system includes a light source delivering a light to a tube, and a polarizer receiving the light after the light is refracted through a wall of the tube. The measurement system may further include a detector receiving the light from the polarizer, the detector operable to capture a first image of the light at a first polarization state and a second image of the light at a second polarization state. The system may further include a controller operable to determine a retardation profile related to the stress profile of the wall of the tube by determining a retardation magnitude of the light refracted through the wall of the tube based on a difference between the first image of the light and the second image of the light.Type: GrantFiled: August 7, 2019Date of Patent: December 22, 2020Assignee: Corning IncorporatedInventor: William John Furnas
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Patent number: 10861755Abstract: A system and method of use for simplifying the measurement of various properties of complex semiconductor structures is provided. The system and method supports reduction of structure complexity and modeling for optical monitoring and permits determination of film thicknesses and feature depths during semiconductor manufacturing processes.Type: GrantFiled: January 31, 2018Date of Patent: December 8, 2020Assignee: Verity Instruments, Inc.Inventor: Andrew Weeks Kueny
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Patent number: 10761032Abstract: Methods of and apparatus for inspecting composite layers of a first material formed on a second material are provided including providing an illumination source, illuminating at least a portion of the composite at the layer, receiving light reflected from the sample, determining a spectral response from the received light, and comparing the received spectral response to an expected spectral response.Type: GrantFiled: February 26, 2019Date of Patent: September 1, 2020Assignees: BWXT Nuclear Operations Group, Inc., BWXT NOG Technologies, Inc.Inventors: Aaron C. Havener, James D. Jogerst, Thomas C. Mohr, Keith B. Rider
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Patent number: 10626878Abstract: A method for inspecting a rotary machine having a flow path through which a fluid flows includes a step of measuring a width of the flow path by a non-contact sensor in a stationary component of the rotary machine at a position facing the flow path; and a step of determining whether or not the measured width of the flow path is less than a predetermined lower limit threshold.Type: GrantFiled: March 31, 2015Date of Patent: April 21, 2020Assignee: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATIONInventors: Yuji Masuda, Shinichiro Tokuyama
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Patent number: 10386173Abstract: This invention describes the structure and function of an integrated multi-sensing system. Integrated systems described herein may be configured to form a microphone, pressure sensor, gas sensor or accelerometer. The system uses Fabry-Perot Interferometer in conjunction with beam collimator, beam splitter, optical waveguide and a photodetector integrated. It also describes a configurable method for tuning the integrated system to specific resonance frequency using electrostatic actuators.Type: GrantFiled: November 18, 2016Date of Patent: August 20, 2019Inventors: Kris Vossough, Farhang Yazdani
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Patent number: 10156435Abstract: In one embodiment, a shape measuring apparatus includes a memory to store, as information regarding a pattern provided in a sample, two-dimensional information regarding a plane parallel with a surface of the sample, and an irradiation module to irradiate the surface of the sample with a beam. The apparatus further includes an irradiation controller to control an irradiation direction of the beam to the sample in accordance with the two-dimensional information, and an acquisition module to acquire scattering intensity data regarding the beam reflected by the surface of the sample. The apparatus further includes a calculator to calculate predicted scattering intensity data regarding the beam in accordance with a shape model that represents a three-dimensional shape of the pattern with a parameter, and a measurement module to measure the three-dimensional shape by adjusting the parameter and fitting the scattering intensity data and the predicted scattering intensity data.Type: GrantFiled: February 14, 2018Date of Patent: December 18, 2018Assignee: Toshiba Memory CorporationInventor: Rikiya Taniguchi
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Patent number: 10094955Abstract: A method for fabricating an optical element including selecting a lamp spectrum and bandpass filter spectrum, obtaining a spectral characteristics vector to quantify the concentration of a component in a sample and obtaining a target spectrum from the lamp spectrum, the bandpass filter spectrum, and the spectral characteristics vector, is provided. Further including selecting a number of layers less than a maximum value, and performing an optimization routine using the index of refraction and thickness of each of the number of layers until an error between a model spectrum and the target spectrum is less than a tolerance value, or a number of iterations is exceeded. And reducing the number of layers if the error is less than a tolerance and stopping the procedure if the number of iterations is exceeded. A device using an optical element for optically-based chemometrics applications fabricated using the method above is also provided.Type: GrantFiled: February 11, 2011Date of Patent: October 9, 2018Assignee: HALLIBURTON ENERGY SERVICES, INC.Inventors: Michael T. Pelletier, Christopher Michael Jones
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Patent number: 10041997Abstract: An apparatus and method for optical probing of a DUT is disclosed. The system enables identifying, localizing and classifying faulty devices within the DUT. A selected area of the DUT is imaged while the DUT is receiving test signals, which may be static or dynamic, i.e., causing certain of the active devices to modulate. Light from the DUT is collected and is passed through a rotatable diffracting element prior to imaging it by a sensor and converting it into an electrical signal. The resulting image changes depending on the rotational positioning of the grating. The diffracted image is inspected to identify, localize and classify faulty devices within the DUT.Type: GrantFiled: March 13, 2015Date of Patent: August 7, 2018Assignee: FEI EFA, Inc.Inventors: Herve Deslandes, Prasad Sabbineni, Regina Freed
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Patent number: 10020233Abstract: In a plasma processing method and apparatus for processing a film to be processed contained in a film structure preliminarily formed on an upper surface of a wafer mounted in a processing chamber, by using plasma, a residual film thickness at an arbitrary time is calculated using a result of comparing detective differential waveform pattern data with actual differential waveform pattern data. The detective differential waveform pattern data is produced by using two basic differential waveform pattern data which respectively use, as parameters, residual thicknesses of the films to be processed in film structures having underlying films with different thicknesses and the wavelengths of the interference light. The detective waveform pattern data being preliminarily prepared prior to processing of the wafer. Determination is made as to whether or not an object of the processing has been reached by using the residual film thickness.Type: GrantFiled: August 30, 2013Date of Patent: July 10, 2018Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Shigeru Nakamoto, Tatehito Usui, Satomi Inoue, Kousa Hirota, Kousuke Fukuchi
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Patent number: 10008530Abstract: Some embodiments of the present disclosure provide a back side illuminated (BSI) image sensor. The BSI image sensor includes a semiconductive substrate, a deep trench isolation (DTI) at a back side of the semiconductive substrate, and a dielectric layer. the dielectric layer includes a top portion over the back side, and a side portion lined to a sidewall of the DTI. The BSI image sensor includes a planarization stop layer disposed conformally on top of the dielectric layer. The planarization stop layer includes a top section on the top portion, a side section lined against the side portion, and a first transmittance. The BSI image sensor includes a low-transparent material inside the DTI, and the low-transparent material includes a second transmittance. The second transmittance is lower than the first transmittance.Type: GrantFiled: January 30, 2015Date of Patent: June 26, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Keng-Ying Liao, Chung-Bin Tseng, Cheng-Hsien Chou, Jiech-Fun Lu, Po-Zen Chen, Yi-Hung Chen
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Patent number: 9952034Abstract: An optical interferometric system for measurement of a full-field thickness of a plate-like object in real time includes two light sources, two screens, two image capturing devices, and an image processing module. The light sources radiate incident lights toward a reference point on the plate-like object in respective directions to produce respective interference fringe patterns (IFPs). The image capturing devices capture light intensity distribution images respectively of the IFPS imaged respectively on the screens. The image processing module calculates a fringe order at the reference point according to the light intensity distribution images, and obtains a full-field thickness distribution of the plate-like object according to the fringe order.Type: GrantFiled: May 31, 2017Date of Patent: April 24, 2018Assignee: NATIONAL TSING HUA UNIVERSITYInventors: Wei-Chung Wang, Po-Chi Sung
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Patent number: 9934946Abstract: A plasma processing device performing etching processing to a sample disposed in a processing chamber disposed in a vacuum vessel by using plasma formed in the processing chamber includes a light detector, a component detector, and a determination unit. The light detector detects light intensity of a plurality of wavelengths from the inside of the processing chamber at a plurality of times during the sample processing. The component detector detects, by using a result of a principal component analysis of time-series data, a highly correlated component between the time-series data of a plurality of the wavelengths at a certain time in a plurality of the times obtained from output of the light detector. The determination unit determines an amount or an end point of the etching processing based on a change in light intensity of at least one of a plurality of the wavelengths detected by using the time-series data from which the highly correlated component is removed.Type: GrantFiled: September 27, 2016Date of Patent: April 3, 2018Assignee: Hitachi High-Technologies CorporationInventors: Yohei Kawaguchi, Tatehito Usui, Masahito Togami, Satomi Inoue, Shigeru Nakamoto
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Patent number: 9927224Abstract: A thickness measuring apparatus and a thickness measuring method. The thickness measuring apparatus includes a light source outputting an extended monochromatic light with coherence; a collimating lens converting output light of the light source into incident beam of parallel ray; a beam splitter reflecting and providing the incident beam to a measurement target and transmitting first reflection light reflected on a top surface of the measurement target and second reflection light reflected on a bottom surface of the measurement target; an imaging lens disposed between the measurement target and the beam splitter with a predetermined focal distance to receive and provide the incident beam to a measurement position of the measurement target disposed on the focal distance; a camera photographing an interference fringe formed by the first and second reflection lights and outputting an interference fringe image; and a processing part.Type: GrantFiled: January 5, 2016Date of Patent: March 27, 2018Assignee: Korea Research Institute of Standards and ScienceInventors: Jong-Ahn Kim, Jae-Wan Kim, Jae-Yong Lee, Jae-Heun Woo
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Patent number: 9880377Abstract: A system microscopy system and method that enable obtaining high resolution 3D images in a single shot are presented. The system is an ultra-high speed, real time multi wavelength phase shift interference microscopy system that uses three synchronized color CCD cameras. Each CCD is equipped with a precision achromatic phase mask which in turn allows obtaining ?/2 phase shifted signals in three different wavelengths simultaneously.Type: GrantFiled: September 9, 2016Date of Patent: January 30, 2018Assignee: Photonicsys Ltd.Inventors: Avner Safrani, Michael Ney, Ibrahim Abdulhalim
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Patent number: 9859103Abstract: According to one embodiment, a process control device includes an emission amount calculation unit and a process control unit. The emission amount calculation unit selects light of a predetermined wavelength among light generated while a dry etching process is being executed on a substrate. The process control unit calculates an integral value which is obtained by integrating an emission intensity of the selected light with time of detecting the selected light. Further, the process control unit calculates a total amount of the integral value as a total emission amount at the substrate. Further, the process control unit outputs an instruction to stop the dry etching process when the total emission amount reaches a predetermined reference value.Type: GrantFiled: March 13, 2015Date of Patent: January 2, 2018Assignee: TOSHIBA MEMORY CORPORATIONInventor: Kazuhiro Ooshima
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Patent number: 9709385Abstract: The present invention provides a detection device and a detection method. The detection device comprises a light source module, a receiving module, an image generation module and a judgment module, wherein the light source module is configured to emit light towards a film at a predetermined angle, the receiving module is configured to receive interference light formed by first reflected light reflected by an upper surface of the film and second reflected light reflected by a lower surface of the film, the image generation module is configured to generate an interference fringe image according to the interference light, and the judgment module is configured to judge whether thickness of the film is uniform according to the interference fringe image. The detection device can perform high accuracy detection on uniformity of the thickness of a film, thereby facilitating improving display quality of a display panel.Type: GrantFiled: June 17, 2015Date of Patent: July 18, 2017Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Yangkun Jing, Changjun Jiang
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Patent number: 9599611Abstract: This disclosure provides methods and devices for the label-free detection of target molecules of interest. The principles of the disclosure are particularly applicable to the detection of biological molecules (e.g., DNA, RNA, and protein) using standard SiO2-based microarray technology.Type: GrantFiled: April 25, 2006Date of Patent: March 21, 2017Assignee: TRUSTEES OF BOSTON UNIVERSITYInventors: M. Selim Unlu, David A. Bergstein, Michael F. Ruane, Bennett B. Goldberg
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System and method for using laser scan micrometer to measure surface changes on non-concave surfaces
Patent number: 9470514Abstract: A method of comparing surface profiles of an object, the object being rotatable on an axis, such that the object has a longitudinal dimension and an axial dimension. The object is incrementally scanned with a laser scan micrometer, first in a pre-test scan procedure and then in a post-test scan procedure. The two scan procedures are performed in the same manner, by using the laser scan micrometer to scan the object in a longitudinal direction, rotating the object, re-scanning the object, measuring the scan length thereby obtaining a longitudinal height value, and repeating the preceding steps for a number of incremental rotations thereby obtaining one longitudinal height profile. This process is repeated by incrementally moving the object in an axial direction and acquiring additional longitudinal height profiles, thereby acquiring a set of longitudinal height profiles. The pre-test and post-test sets of profiles are then aligned and compared.Type: GrantFiled: February 11, 2015Date of Patent: October 18, 2016Assignee: SOUTHWEST RESEARCH INSTITUTEInventors: Eric Liu, Sean C. Mitchem, Kerry J. McCubbin -
Patent number: 9460973Abstract: A system including an index assigning section estimating the thickness of a thin film based on the intensity of light reflected on a substrate and a theoretical formula expressing a relationship between the thickness of the thin film and the intensity of an interference light when the spectrum is obtained for the first time, and assigning indexes for each candidate value for the layer thickness; a layer thickness wide-range estimating section estimating the layer thickness within the range of the value of a layer thickness wide-range estimation width including the previously estimated value of the layer thickness based on the theoretical formula; a selecting section selecting an index from the indexes; a determining section determining a layer thickness wide-range estimation result; and a layer thickness determining section determining the thickness of the thin film based on the theoretical formula after calculating the layer thickness wide-range estimation result.Type: GrantFiled: April 10, 2014Date of Patent: October 4, 2016Assignee: SHIMADZU CORPORATIONInventors: Rui Kato, Yuzo Nagumo, Hiroomi Goto
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Patent number: 9453795Abstract: The present invention relates to a method for determining the amount of total phosphate in a body of water from reflected light, and also includes systems for the measurement, calculation and transmission of data relating to or carrying out that method. In addition, the invention relates to methods and systems for determining other parameters of water quality from reflected light, for example, turbidity, dissolved oxygen and/or nitrogen.Type: GrantFiled: February 21, 2013Date of Patent: September 27, 2016Assignee: Bowling Green State UniversityInventors: Teagan Loew, Robert K. Vincent
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Patent number: 9409204Abstract: The present invention provides a mask, on which a preset pattern is provided. First test patterns for determining an amount of a position offset of the mask during its movement are provided on the mask at a first side of the preset pattern and a second side of the preset pattern opposite to the first side, respectively. When being moved in a direction from the first side to the second side by a standard distance, the mask can determine whether a position offset occurs to the mask during its movement, and determine an amount of the position offset if a position offset occurs. Thus, the position offset of the mask can be corrected, thereby obtaining an accurate predetermined pattern on a glass substrate.Type: GrantFiled: November 18, 2014Date of Patent: August 9, 2016Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventor: Jian Guo
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Patent number: 9390943Abstract: A substrate processing apparatus generates an electric field in a processing space between a lower electrode to which a high frequency power is supplied and an upper electrode facing the lower electrode and performs plasma processing on a substrate mounted on the lower electrode by using a plasma generated by the electric field. Distribution of a plasma density in the processing space is controlled by a magnetic field generated by controlling a plurality of electromagnets provided at a top surface of the upper electrode which is provided to be opposite to the processing space.Type: GrantFiled: February 14, 2013Date of Patent: July 12, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Kazuya Nagaseki, Etsuji Ito, Akihiro Yokota, Shinji Himori, Shoichiro Matsuyama
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Patent number: 9368713Abstract: There is provided a piezoelectric film-attached substrate, including a piezoelectric film having a specific thickness, wherein a reflection spectrum shows a relation between a light obtained in such a way that the surface of the piezoelectric film is irradiated with an irradiation light having a specific wavelength and the irradiation light is reflected on the surface of the piezoelectric film, and a light obtained in such a way that the irradiation light is transmitted through the piezoelectric film and is reflected on the surface of the lower electrode, which is the reflection spectrum at least at one point on a center part and an outer peripheral part of the piezoelectric film, and such a reflection spectrum has at least one of the maximum value and the minimum value respectively, wherein the reflectance at least in one maximum value is 0.4 or more.Type: GrantFiled: March 12, 2013Date of Patent: June 14, 2016Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Kazutoshi Watanabe, Kenji Shibata, Kazufumi Suenaga, Akira Nomoto, Fumimasa Horikiri
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Patent number: 9355442Abstract: Film thickness measured values obtained by measurement in advance at a plurality of points on a measurement preparation substrate and coordinates corresponding to the film thickness measured values are acquired. A pixel value at each coordinates is extracted from a preparation imaged image obtained by imaging the measurement preparation substrate in advance by an imaging device. Correlation data between the pixel value extracted at each coordinates and the film thickness measured value at each coordinates is generated. A substrate being a film thickness measurement object is imaged by the imaging device to acquire an imaged image, and a film thickness of a film formed on the substrate being the film thickness measurement object is calculated on the basis of a pixel value of the imaged image and the correlation data.Type: GrantFiled: April 17, 2015Date of Patent: May 31, 2016Assignee: Tokyo Electron LimitedInventors: Shuji Iwanaga, Tadashi Nishiyama, Kanzou Katou
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Patent number: 9190336Abstract: There is provided a plasma processing apparatus which compares a plurality of patterns detected using an interference light intensity pattern using a wavelength from at least one preset film of the plurality of film layers as a parameter and an intensity pattern using a wavelength of light from the other film as a parameter and an light intensity pattern from inside the processing chamber which is detected during processing of the film to be processed; and compares a film thickness corresponding to one of the plurality of patterns having a minimum difference obtained by the comparison and a target film thickness; and determines that the thickness of the film to be processed reaches the target film thickness.Type: GrantFiled: February 19, 2014Date of Patent: November 17, 2015Assignee: Hitachi High-Technologies CorporationInventors: Kousuke Fukuchi, Shigeru Nakamoto, Tatehito Usui, Satomi Inoue, Kousa Hirota
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Patent number: 9099350Abstract: An apparatus for inspecting an integrated circuit is an apparatus for inspecting an integrated circuit having a semiconductor substrate and a circuit portion formed on a front face a side of the semiconductor substrate. The apparatus comprises a light generation unit for generating light L for irradiating the integrated circuit, a wavelength width adjustment unit, for adjusting the wavelength width of the light irradiating the integrated circuit, an irradiation position adjustment unit for adjusting the irradiation position of the light irradiating the integrated circuit, and a light detection unit for detecting the light from the integrated circuit when the light from the light generation unit irradiates the circuit portion through a rear face of the semiconductor substrate.Type: GrantFiled: May 31, 2012Date of Patent: August 4, 2015Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Tomonori Nakamura, Nobuyuki Hirai
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Patent number: 9073169Abstract: A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.Type: GrantFiled: August 31, 2011Date of Patent: July 7, 2015Assignee: Applied Materials, Inc.Inventors: Kun Xu, Ingemar Carlsson, Feng Q. Liu, David Maxwell Gage, You Wang, Dominic J. Benvegnu, Boguslaw A. Swedek, Yuchun Wang, Pierre Fontarensky, Wen-Chiang Tu, Lakshmanan Karuppiah
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Patent number: 9030652Abstract: A method and apparatus for determining the synchronicity of a rotary platen (22) in a vacuum deposition chamber (24). A light source (64) projects a highly collimated light beam (66) onto the rotating platen (22), thereby tracing a circular swept path (67). The swept path (67) passes alternately through samples (20) on the platen (22) and intervening webs (58, 60). The samples (20) are significantly more reflective than the webs (58, 60). The platen (22) includes an asymmetry feature (60) along the swept path (67). A detector (62) measures light signals reflected from the platen (22) along the swept path (67), and generates a unique signal upon encountering the asymmetry feature (60). A microcontroller generates a trigger pulse synchronized to the unique signal.Type: GrantFiled: December 2, 2012Date of Patent: May 12, 2015Assignee: k-Space Associates, Inc.Inventors: Scott Hines, Darryl Barlett, Charles A. Taylor, II, Greg DeMaggio
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Patent number: 9007599Abstract: A measurement light having a predetermined wavelength bandwidth from a light source is radiated onto the structure to be measured in a specimen 50, light reflected from a first plane and second plane of the structure to be measured is made to interfere in an optical fiber, and a spectrum of the interference light is generated. This interference light spectrum is acquired by a spectrometric unit at two time points separated in time, and in data processing unit, absolute difference area computation unit determines the absolute difference area of the difference spectrum. This absolute difference area changes periodically each time the dimension of the structure to be measured changes by ?/4, making it possible to determine the dimension of the structure to be measured based on that change.Type: GrantFiled: April 9, 2013Date of Patent: April 14, 2015Assignee: Shimadzu CorporationInventors: Hiroomi Goto, Yuzo Nagumo, Rui Kato
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Patent number: 9001337Abstract: An etching monitor device capable of high precision measurement in the presence of a mask region capable of producing interference. The device including an interference optical system which acquires reflected interference light containing three interference component signals, which are due respectively to optical path differences of reflected light between three sets of surfaces. The three interference component signals include a first interference based on an optical path between light reflected off of a mask surface and light reflected off of a top surface of the substrate, a second interference based on an optical path between the light reflected off of the top surface of the substrate and light reflected off of a surface to be etched, and a third interference based on an optical path between the light reflected off of the surface to be etched and the light reflected off of the mask surface.Type: GrantFiled: May 8, 2013Date of Patent: April 7, 2015Assignee: Shimadzu CorporationInventors: Hiroomi Goto, Yuzo Nagumo, Rui Kato
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Patent number: 8947673Abstract: Disclosed is a method of measuring thickness or a surface profile of a thin film layer formed on a base layer through a white light scanning interferometry, the method including: preparing simulation interference signals corresponding to thicknesses by assuming a plurality of sample thin film layers different in thickness from one another and simulating interference signals with respect to the respective sample thin film layers; acquiring a real interference signal with respect to an optical-axis direction of entering the thin film layer by illuminating the thin film layer with white light; preparing a plurality of estimated thicknesses that the thin film layer may have on the basis of the real interference signal; comparing whether the simulation interference signal having thickness corresponding to the estimated thickness is substantially matched with the real interference signal; and determining the thickness of the simulation interference signal substantially matched with the real interference signal as tType: GrantFiled: January 16, 2009Date of Patent: February 3, 2015Assignee: Snu Precision Co., Ltd.Inventors: Heui Jae Pahk, Woo Jung Ahn, Seong Ryong Kim, Jun Hyeok Lee
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Patent number: 8885173Abstract: A film thickness measurement apparatus includes a measurement light source which supplies measurement light containing wavelength components over a predetermined band to a semiconductor film, a spectroscopic optical system and a photodetector which detect intensities of output light formed by superimposing reflected light components from an upper surface and a lower surface of the semiconductor film at each time point by wavelength, and a film thickness analysis section which obtains a temporal change in film thickness of the semiconductor film. The film thickness analysis section obtains a value corresponding to a peak wavelength where the intensity of interfering light generated by the reflected light from the upper surface and the reflected light from the lower surface interfering with each other is maximized or minimized or an interval of the adjacent peak wavelengths based on spectral waveforms of the output light detected at mutually different time points.Type: GrantFiled: July 27, 2010Date of Patent: November 11, 2014Assignee: Hamamatsu Photonics K.K.Inventors: Kenichi Ohtsuka, Tetsuhisa Nakano, Motoyuki Watanabe
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Patent number: 8873067Abstract: Provided herein is a TSV measuring interferometer that uses a variable field stop that adjusts such that a light is focused at an inlet and at a bottom surface of a TSV when measuring a diameter and depth of the TSV, thereby reducing a measurement time and result data, the interferometer also using a telecentric lens that adjusts the light injected into the TSV to be a straight line, so as to obtain a sufficient amount of light reaching the bottom surface to improve the accuracy of measurement even in a TSV having a large aspect ratio.Type: GrantFiled: April 13, 2012Date of Patent: October 28, 2014Assignee: Snu Precision Co., Ltd.Inventors: Ki Hun Lee, Heung Hyun Shin, Heui Jae Pahk
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Patent number: 8854628Abstract: A method for determining information about a test object includes combining two or more scanning interference signals to form a synthetic interference signal; analyzing the synthetic interference signal to determine information about the test object; and outputting the information about the test object. Each of the two or more scanning interference signals correspond to interference between test light and reference light as an optical path length difference between the test and reference light is scanned, wherein the test and reference light are derived from a common source. The test light scatters from the test object over a range of angles and each of the two or more scanning interferometry signals corresponds to a different scattering angle or polarization state of the test light.Type: GrantFiled: September 21, 2011Date of Patent: October 7, 2014Assignee: Zygo CorporationInventors: Xavier M. Colonna de Lega, Peter J. de Groot, Jan Liesener
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Patent number: 8804129Abstract: The invention relates to a method and an apparatus for measuring the thickness of a transparent film by broad band interferometry, comprising the steps of preparing a correlogram of the film by an interferometer, applying a Fourier transformation to said correlogram to obtain a Fourier phase function, removing a linear component thereof, applying a second integral transformation to the remaining non-linear component to obtain an integral amplitude function of said non-linear component, identifying the peak location of said integral amplitude function and determining the thickness of the film as the double value of the abscissa at said peak location considering a refractive index of a film which is dependent on wavelength. The last two steps may be replaced by identifying the peak locations of said integral amplitude function and determining the thickness of the films as the double values of the abscissas at the peak locations.Type: GrantFiled: May 4, 2012Date of Patent: August 12, 2014Assignee: Mitutoyo CorporationInventor: Ki-Nam Joo
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Patent number: 8797543Abstract: This invention relates to an apparatus for measuring a sample contact lens. In particular, the present invention has a housing to hold a sample contact lens to be measured, one or more movement stages connected to the housing, and an interferometer.Type: GrantFiled: June 23, 2009Date of Patent: August 5, 2014Assignee: Novartis AGInventor: William Jordan Hall
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Patent number: 8593640Abstract: This invention relates to an optical coherence tomography, in which a light source and an optical linear beam forming system are adopted to obtain two dimensional image of high quality resolution within short time without affection by any mechanical movements. For such purpose, the optical linear beam forming system (20) comprises semicy Under lens (21), convex lens (22) and slit (23) to implement the frequency domain optical coherence tomography. Parallel light beam from the light source is incident on the surface of the semicylinder lens (21), and focal line of the semicylinder lens (21) is located in front of the convex lens (22). The convex lens (22) has short focal point where the parallel light component converges and long focal point where the diverging light component converges. The slit (23) is located between the short focal point and the long focal point.Type: GrantFiled: October 17, 2008Date of Patent: November 26, 2013Assignees: Industrial-Academic Cooperation Foundation, Yonsei University, MTC Medical Co., Ltd.Inventors: Beop-Min Kim, Sang-Won Lee
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Patent number: 8514404Abstract: The invention discloses an optical interferometer which can be used to provide simultaneous measurements over multiple path lengths and methods to employ such an interferometer as to achieve a variety of functions covering simultaneous measurements at different depths separated by an increment of a multiple differential delay matched in the interferometer as well as imaging. Optical sensors, optical coherence tomography (OCT) set-ups, optical sensing methods and OCT methods are disclosed which can provide: (i) multiple en-face images at several depths with dynamic dispersion compensation, (ii) fast acquisition of cross sections, (iii) fast acquisition of 3D volumes of a scattering object while maintaining dynamic focus; (iv) fast acquisition of long axial measurement profiles, non mechanical, with dynamic focus, range scalable, with applications in tracking and OTDR.Type: GrantFiled: February 24, 2009Date of Patent: August 20, 2013Assignee: University of KentInventor: Adrian Podoleanu
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Patent number: 8502982Abstract: A flow cell for use in an arrayed imaging reflectometry detection system is described herein. The flow cell includes: first and second members that are secured together to define a substantially fluid-tight chamber having an inlet and an outlet, at least the second member being light transmissive; and a chip having a substrate, one or more coating layers on the substrate, and one or more probe molecules tethered to the outermost coating layer, the chip being positioned with the outermost coating layer and the one or more probe molecules thereon exposed to fluid in the chamber and facing the second member, whereby light passing through the second member is reflected by the chip.Type: GrantFiled: October 30, 2008Date of Patent: August 6, 2013Assignee: University of RochesterInventors: Charles R. Mace, Benjamin L. Miller, Lewis J. Rothberg
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Patent number: 8451519Abstract: A multicolor marking platform may include a marking engine with a storage device storing color standard data, a non-black color separation station, marking process stations to selectively mark a color test pattern on a target substrate, and a color control logic with color control applications to selectively control color characteristics of the marking engine by controlling the non-black color separation station or a marking process station; and a spectral sensor to detect each color test pattern on the target substrate and provide corresponding color measurement data to the color control logic. The color control logic may selectively control the non-black color separation station or a marking process station in response to the color measurement data and the corresponding color standard data in relation to the selected color control application. Various embodiments of the multicolor marking platform and a method for controlling color in same are also provided.Type: GrantFiled: July 15, 2009Date of Patent: May 28, 2013Assignee: Xerox CorporationInventors: Mark A. Adiletta, Paul S. Bonino, Chad E. LaBarge