Abstract: A polishing pad for a chemical mechanical polishing apparatus includes a polishing layer having a polishing surface and a backing layer formed of a fluid-permeable material. The backing layer includes a lower surface configured to be secured to a platen and an upper surface secured to the polishing layer, wherein the lower surface and upper surface are sealed. A first seal circumferentially seals an edge of the backing layer, and a second seal seals and separates the backing layer into a first region and a second region surrounded by the first region.

Abstract: A device, system, and method are provided for providing vibration data for rotating machinery. A sensor device is provided as a one-piece unit that is mechanically mounted to a pump. The sensor includes a vibration sensor, a processor, a wireless communications interface for exchanging data with a user device, and an internal battery. The processor is configured to receive a measurement request from the user device via the wireless communications interface. In response, the processor is further configured to configure the vibration sensor, receive data samples for multiple axes from the vibration sensor, and calculate a component velocity root mean square (vRMS) value, from the data samples, for each of the multiple axes. The processor may combine the component vRMS values into a sample vRMS value, and send a final vRMS value, based on the sample vRMS value, to the user device via the wireless communication interface.

Abstract: An optical inspection device includes: a barrel; a first light source unit at a first side of the barrel and configured to irradiate light of a first wavelength range through a first light path; a second light source unit at a second side of the barrel, the second side being different from the first side, and configured to irradiate light of a second wavelength range that is different from the first wavelength range through a second light path; and a camera. At least a portion of the first light path is different from the second light path.

Abstract: A surface inspection system for capturing surface defects of a surface to be checked, includes a camera system, an illumination system including one or more light sources, and an evaluation system. The evaluation system evaluates a brightness and/or color distribution of the surface to be checked in at least one image captured by the camera system and captures surface defects of the surface to be checked as local deviations in the brightness and/or color. The evaluation system is configured to assess a local deviation in the brightness and/or color as a surface defect when the local deviation appears brighter in at least one first subregion and darker in at least one second subregion than a surface region surrounding the local deviation, and/or different colors are dominant in different subregions.

Abstract: A method for assessing the profile of a tool using a non-contact tool setting apparatus that includes a transmitter for emitting a light beam and a receiver for receiving the beam. The receiver generates a beam intensity signal describing the intensity of received light. The setting apparatus is mounted to a coordinate positioning apparatus that allows the tool to be moved relative to the setting apparatus. The method includes using the coordinate positioning apparatus to move the tool relative to the setting apparatus along a tool inspection path, the tool inspection path being selected so that the light beam is traced substantially along a periphery of the tool to be inspected. Beam intensity data is collected describing the beam intensity signal that is generated by the receiver as the tool inspection path is traversed and analysis of the collected beam intensity data is used to assess the tool profile.

Abstract: A smart tool system may include at least one assembly of a tool holder and a tool, and a tooling machine configured to rotate the at least one assembly to cut a workpiece. The tooling machine may have a spindle to which the tool holder may be selectively attachable, and a controller configured to rotate the spindle at a spindle speed. The smart tool system may also include at least one database configured to store vibrational data relating to at least one of the at least one assembly and the tooling machine. The smart tool system may further be configured to determine an optimum operating value and/or range of optimum operating values of at least one parameter for the tooling machine based on the vibrational data. The optimum operating value(s) provide for minimized or no chatter when cutting the workpiece.

Abstract: An automated evaluation system for obtaining images for collectible items and using artificial intelligence (AI) to analyze different parameters of the images, such as an edge parameter, a corner parameter, and a centering parameter. The system can move the collectible items, which can be collectible cards, using a robotic arm or through manual manipulation to a working area to then obtain images of the collectible items using a camera or a scanner. The images can be saved to a database and accessible by a control computer to analyze the images with the AI model. The system can provide a first-pass grade as to the authenticity and condition of the card. The grade can be manually verified by a human grader.

Abstract: A system and method of obtaining a quantitative evaluation of paper. By looking at the topographic data and comparing it to machine parameters, an operator can optimize the paper forming machine settings to create consistently high quality paper with minimal surface defects.

Abstract: The present application relates to devices and components including apparatus, systems, and methods to provide uplink spatial relation switch delay for an uplink spatial relation switch based at least in part on a pathloss reference signal associated with uplink spatial relation switch.

Abstract: An apparatus (100) for optically characterizing a textile sample (106) comprises a presentation subsystem (102) comprising a viewing window (108). A radiation subsystem (114) comprises a radiation source (120) for directing a first, ultraviolet radiation (122) and a second, visible radiation (123) toward the sample (106), and causing the sample (106) to produce a fluorescent radiation (124) and a reflected radiation (125). A sensing subsystem (126) comprises an imager (130) for capturing the fluorescent radiation (124) and the reflected radiation (125) in an array of pixels (408). A control subsystem (132) comprises a processor (136) for controlling the presentation subsystem (102), the radiation subsystem (114), and the sensing subsystem (126), and for creating a fluorescent and reflected radiation image (400) containing both spectral information and spatial information in regard to the fluorescent radiation (124) and the reflected radiation (125).

Abstract: There are provided a laser irradiation apparatus, a laser irradiation method, and a semiconductor device manufacturing method that reduce irradiation unevenness of a laser beam. A laser irradiation apparatus includes a waveform shaping device (20). The waveform shaping device (20) includes a laser beam source (11), a first waveform shaping unit (30) that shapes the pulse waveform of a pulse laser beam by applying a delay according to an optical path length difference between two light beams (L11 and L12) branched by a first beam splitter (31), a wave plate that changes the polarization state of the pulse laser beam from the first waveform shaping unit (30), and a second waveform shaping unit (40) that shapes the pulse waveform of the pulse laser beam by applying a delay according to an optical path length difference between two light beams (L15 and L16) branched by a second beam splitter (41).

Abstract: A measurement device and method for a semiconductor structure are provided. The measurement device for the semiconductor structure includes a bearing platform, a clamping mechanism, and an image acquisition system. The clamping mechanism is installed on the bearing platform and includes a clamp disposed along a vertical direction. The clamp is configured to clamp the semiconductor structure such that the semiconductor structure is clamped with a to-be-measured surface facing a side. The image acquisition system is disposed by a side of the clamping mechanism, and is configured to acquire a three-dimensional morphology of the semiconductor structure from the side.

Abstract: Provided is a polarization measuring device including a stage on which a measurement target is provided, a light source assembly configured to emit incident light, a first polarimeter configured to polarize the incident light, a second polarimeter configured to polarize reflected light reflected from the measurement target that is irradiated by the incident light, a filter assembly configured to remove noise from the reflected light, and a detector configured to receive the reflected light and measure an intensity of the reflected light and a phase of the reflected light.

Abstract: An information processing device, to be used in an image capturing device that illuminates an object by an illumination means and captures reflected light from the object as a reflection image by a capturing means, includes a determination means for determining an irradiation angle range for irradiating the object by the illumination means, on the basis of two types of inclination statistic values that are values corresponding to the inclination distribution of the unevenness existing on a surface of the object.

Abstract: In an example, a surface inspection apparatus includes a light source to illuminate a portion of a surface in a print apparatus, a light detection apparatus and processing circuitry. The light detection apparatus may receive diffusely reflected light and specularly reflected light from the portion of the surface, and may comprise a detection element for detecting the specularly reflected light. The processing circuitry may comprise a comparison module to determine a relationship between an intensity of the detected diffusely reflected light and the detected specularly reflected light and a quality module to evaluate if the surface meets a quality criterion based on the relationship.

Abstract: A formation detection system comprising: (a) one or more sensors and (b) one or more lights that illuminate a location of interest so that the one or more sensors can monitor the location of interest; wherein one of the one or more sensors are located substantially planar with a wire of a paper machine and proximate to a slice opening so that the one of the one or more sensors is adjacent to a cut through so that the one of the one or more sensors is capable of measuring stock above the wire and removed water below the wire, and wherein the one of the one or more sensors is capable of measuring a distance between an impingement location of a stock jet and the wire from a forming board.

Abstract: In various examples, information may be received for a 3D model, such as 3D geometry information, lighting information, and material information. A machine learning model may be trained to disentangle the 3D geometry information, the lighting information, and/or material information from input data to provide the information, which may be used to project geometry of the 3D model onto an image plane to generate a mapping between pixels and portions of the 3D model. Rasterization may then use the mapping to determine which pixels are covered and in what manner, by the geometry. The mapping may also be used to compute radiance for points corresponding to the one or more 3D models using light transport simulation. Disclosed approaches may be used in various applications, such as image editing, 3D model editing, synthetic data generation, and/or data set augmentation.

Abstract: Methods and systems for monitoring etch or deposition processes using image-based in-situ process monitoring techniques include illuminating a measurement area on a sample disposed in a process chamber. The measurement area is illuminated using an input beam generated remote from the process chamber and transmitted to a first viewing window of the process chamber by a first optical fiber. Portions of the first input beam reflected from the measurement area are transmitted from the first viewing window to an imaging sensor by a second optical fiber. A sequence of images is obtained at the imaging sensor, and a change in reflectance of pixels within each of the images is determined. The etch or deposition process is monitored based on the change in reflectance.

Abstract: The present invention discloses a high-precision and miniaturized on-orbit calibration device for a six-dimensional force sensor of a space station manipulator and a calibration method thereof, which include an inverted ? shape fixing bracket, three force applying devices, and a cubic stress block. Each force applying device includes a force applying head, a single axis force sensor, a force source part and a fastening part. The force source part includes an upper support plate, a second electrode plate, piezoelectric ceramic plates, a first electrode plate and a lower support plate, which are coaxially arranged sequentially from top to bottom. The single axis force sensor is mounted on the top of the upper support plate, and the hemispherical force applying head is mounted on the top of the single axis force sensor. The cubic stress block is mounted on the top of the six-dimensional force sensor.

Abstract: The present disclosure discloses a method for measuring the film thickness of a semiconductor device. The measuring method includes: providing a reference spectrogram of a main storage region of a reference semiconductor device; obtaining a first measured spectrogram of a main storage region of a semiconductor device to be measured; adjusting a thickness parameter of a target film in the main storage region of the reference semiconductor device within a preset range based on the reference spectrogram, obtaining an adjusted reference spectrogram, and comparing the first measured spectrogram with the adjusted reference spectrogram; if the similarity between the first measured spectrogram and the adjusted reference spectrogram is greater than a first preset value, using the thickness parameter corresponding to the adjusted reference spectrogram as the thickness of the target film in the main storage region of the semiconductor device to be measured.

Abstract: An overlay metrology system may scan a sample including inverted Moiré structure pairs along a scan direction, include an illumination sub-system to illuminate first and second Moiré structures of one of an inverted Moiré structure pair with common mutually coherent illumination beam distributions, and include an objective lens to capture at least +/?1 diffraction orders from sample, where a first pupil plane includes overlapping distributions of the collected light with an interference pattern associated with relative wavefront tilt. The system may also include a diffractive element in the first pupil plane, where one diffraction order associated with the first Moiré structure and one diffraction order associated with the second Moiré structure overlap at a common overlap region in a field plane, and a collection field stop located in the field plane to pass light in the common overlap region and block remaining light and remove the relative wavefront tilt.

Abstract: The present invention provides a fully integrated digital workflow for the designing and production of packaging. A designer creates a package design with a special effect ink digitally, using a computer connected to a color database and a special effect ink database. Advantageously, the present workflow minimizes the complexity of the workflow by using transparent color layers printed over plain special effect additive ink layers to develop the special effect inks to be used on press. The present workflow advantageously can also be used to assess match of polychromatic inks.

Abstract: A medical system that includes a medical device having an imaging device configured to capture images of a target site. A location of the target site is determined based on the images. The medical device includes a light source configured to direct light onto the location of the target site, and a processor and non-transitory computer readable medium storing instructions that, when executed by the processor, causes the processor to move a sensor of a medical instrument toward the location of the target site based on the sensor detecting the light at the target site.

Abstract: A system (400) includes an illumination system (402), a detector (404), and a comparator (406). The illumination system includes a radiation source (408) and a spatial light modulator (410). The radiation source generates a beam of radiation (442). The spatial light modulator directs the beam toward a surface (436) of an object (428) and adjusts a spatial intensity distribution of the beam at the surface. The detector receives radiation (444) scattered at the surface and by a structure (434) near the surface. The detector generates a detection signal based on the received radiation. The comparator receives the detection signal, generates a first image based on the detection signal, and distinguishes between a spurious signal and a signal corresponding to a presence of a foreign particle on the surface based on the first image and the adjusted spatial intensity distribution.

Abstract: The invention provides a lighting device (1000) configured to generate lighting device light (1001), wherein the lighting device (1000) comprises (i) a first laser light source (10) configured to generate a beam (15) of first laser light source light (11), (ii) a speckle control element (30), and (iii) a control system (50), wherein in one or more control modes of the control system (50) the speckle control element (30) is configured in an optical path (16) of the first laser light source light (11) for providing the lighting device light (1001) comprising a speckle distribution (35) of the first laser light source light (11), wherein at a predetermined distance L from the lighting device (1000) the speckle distribution (35) has a first speckle contrast value C1 selected from the range of 3%<C1<100%, wherein the predetermined distance L is selected from the range of 0.

Abstract: A deposit detection device according to an embodiment includes a calculation module, a detection module, an interpolation module, and a state management module. The calculation module calculates a region feature amount based on an edge vector of each pixel, for each unit region composed of a predetermined number of pixels included in a captured image. The detection module detects the unit region corresponding to a partial covering location and the unit region corresponding to a diffuse reflection location based on a detection condition and a second detection condition, respectively, the first detection condition and the second detection condition being based on the region feature amount. The interpolation module interpolates the area ratio of the partial covering location reduced due to the diffuse reflection location. The state management module controls state transitions of states related to interpolation of the area ratio, based on increase and decrease of the diffuse reflection location.

Abstract: An image capturing device, configured to illuminate an object by an illumination means and capture reflected light from the object as a reflection image by a capturing means, includes an irradiation angle range determination means. The irradiation angle range determination means determines, assuming that a group of pieces of unevenness existing at the same position on the surfaces of a plurality of individuals of an object is an unevenness group, an irradiation angle range for irradiating the object by the illumination means, on the basis of a statistic value of the inclination angles of the unevenness group in which variations in the inclination angles of the unevenness between individuals is larger than other unevenness groups, among the plurality of unevenness groups.

Abstract: The present invention is suitable for optical applications with excellent transparency through a haze value of 1.5% or lower and particles that are hardly visible to the naked eye, by producing a film using particles having little difference in refractive index in polyethylene terephthalate (PET), which is a commonly-used polyester film, and can provide a highly transparent optical film capable of improving a winding property by forming surface roughness of 4 nm or higher.

Abstract: A fluorometer is provided for monitoring the quality of water, featuring an array of excitation sources, an array of multiple emission detectors and a signal processor. In the array of excitation sources, each excitation source provides respective excitation source optical signaling at a respective illuminating wavelength. The array of multiple emission detectors detects multiple emission wavelengths emitted from water containing information about multiple coexisting fluorescent species present in the water that emit optical radiation at at least two different wavelengths when illuminated by the respective illuminating wavelength provided from the array of excitation sources, and provide multiple emission detector signaling containing information about the multiple coexisting fluorescent species.

Abstract: A computer-implemented method for determining optical roughness in a semiconductor pattern structure that includes receiving, using a processor, optical responses spectra collected from the semiconductor pattern structure and constructing, using the processor optical critical dimension (OCD) models by using a set of input parameters for each layer of the semiconductor pattern structure. The method further includes calculating, using the processor, theoretical optical responses from a theoretical input generated by the OCD models. In addition, the method provides for comparing, using the processor, the optical responses spectra of the semiconductor pattern structure to the theoretical optical responses to determine output parameters for the optical roughness of the semiconductor pattern structure.

Abstract: A system for calibrating a deformable sensor is provided. The system includes a deformable sensor including a housing, a deformable membrane coupled to an upper portion of the housing, and an enclosure defined by the housing and the deformable member; an imaging sensor configured to capture an image of the deformable membrane of the deformable sensor; and a controller. The enclosure is configured to be filled with a medium. The controller is configured to: receive the image of the deformable membrane of the deformable sensor; determine whether a contour of the deformable membrane in the image of the deformable membrane of the deformable sensor corresponds to a predetermined contour; and adjust a volume of the medium in the enclosure of the deformable sensor in response to the determination that the contour of the deformable membrane is different from the predetermined contour.

Abstract: Disclosed are a detection method and a detection apparatus for a polishing pad of a chemical mechanical polishing device, particularly a detection method and a detection apparatus for detecting a surface of a polishing pad dynamically. An isolation region isolated by a gas to expose the polishing pad is formed by the detecting device, and a detection is performed on the isolation region, such that the chemical mechanical polishing device is capable of detecting the polishing pad without interrupting a manufacturing process and the detection results with more accurate can be achieved. Thereby, the polishing pad can be repaired and replaced more timely.

Abstract: A computer-implemented method for determining optical roughness in a semiconductor pattern structure that includes receiving, using a processor, optical responses spectra collected from the semiconductor pattern structure and constructing, using the processor optical critical dimension (OCD) models by using a set of input parameters for each layer of the semiconductor pattern structure. The method further includes calculating, using the processor, theoretical optical responses from a theoretical input generated by the OCD models. In addition, the method provides for comparing, using the processor, the optical responses spectra of the semiconductor pattern structure to the theoretical optical responses to determine output parameters for the optical roughness of the semiconductor pattern structure.

Abstract: The disclosed technology relates to an inspection apparatus that includes a stage configured to retain a specimen for inspection, an imaging device having a field of view encompassing at least a portion of the stage to view a specimen retained on the stage, and a plurality of lights disposed on a moveable platform. The inspection apparatus can further include a control module coupled to the imaging device, each of the lights and the moveable platform. The control module is configured to perform operations including: receiving image data from the imaging device, where the image data indicates an illumination landscape of light incident on the specimen; and automatically modifying, based on the image data, an elevation of the moveable platform or an intensity of one or more of the lights to adjust the illumination landscape. Methods and machine-readable media are also contemplated.

Abstract: The disclosed subject matter relates to methods for monitoring or controlling a manufacturing process of a material by determining when a variation in surface characteristics takes place. Such surface characteristics correlates to the processing condition of the material and can include density, roughness, porosity, or planarity on a surface of the material. The methods can include herein can include directing a solvent or energy on a surface of the material to form an at least partially modified surface, directing light at an incident angle with respect to the at least partially modified surface, measuring one or more predetermined properties of light reflected from the at least partially modified surface, determining that the material is fully processed based on the measured predetermined property of the light reflected, and optionally adjusting a processing parameter of the manufacturing process in response to the measured predetermined property.

Abstract: A method for estimating vehicle location by obtaining change events from an event camera's observations of a ground surface moving relative to the vehicle, determining a signature of the ground surface from the change events; and estimating the location using the signature. The change events may be processed to produce an 1st invariant representation of a ground surface patch for use as the signature. Alternatively, range measurements representing a patch may be used as the signature. A map is constructed having the representations of the ground surface patches including the locations of the patches. The same patch of ground surface is subsequently measured thereby obtaining a sequence of change events which are processed to produce a 2nd representation. The 2nd representation is matched to the map of 1st invariant representations. The location of the vehicle on the ground is determined based on the match.

Abstract: The invention relates to a method of providing vacuum insulating glass (VIG) units each comprising at least a first and a second glass pane and a plurality of support pillars distributed between opposing surfaces of said glass panes to provide a gap (8) between the glass panes. A plurality of pane elements are provided, and individual topographic representations (TOPREP_2a-TOPREP_2n) of each of said plurality of pane elements (2a-2n) are obtained based on input (4) from a measuring arrangement (3), and the topographic representations are stored in a data storage (DS). The stored topographic representations are processed and resulting surface distance characteristic between pairs of panes are estimated. Vacuum insulating glass (VIG) assemblies are thus provided based on estimated resulting surface distance characteristics. The invention additionally relates to a system for providing manufacturing layouts and a manufacturing facility.

Abstract: A scene camera system that includes two or more mirrors that reflect light from a respective portion of a field of view (FOV) in front of the system and two or more cameras that each capture the light reflected by a respective one of the two or more mirrors. By using the mirrors to reflect the light, the cameras' entrance pupils are imaged to a location closer to a user's eyes to thus achieve a more accurate representation of the perspective of the user.

Abstract: An unmanned aerial vehicle (UAV) includes a central body and a plurality of landing gears that are extendable from and movable relative to the central body. The plurality of landing gears are configured to transform between a flight configuration and a surface configuration. In the flight configuration, the landing gears are extending laterally away from the central body and not in contact with a surface below the central body. In the surface configuration, the landing gears are extending towards the surface below the central body. When the landing gears are in the surface configuration, the landing gears are configured to support a weight of the central body on the surface and transport the UAV over the surface by moving one or more of the landing gears relative to the surface.

Abstract: A torsional probe for a metrology instrument includes a cantilever coupled to a support structure via a torsion bar. The cantilever, support structure, and arms of torsion bar have substantially the same thickness.

Abstract: Disclosed method of measuring a parameter relating to a structure formed using a lithographic process, and more specifically focus or line edge roughness. The method includes measuring a structure having a dimension, e.g., a critical dimension, which is sufficiently large to enable radiation diffracted by at least one edge of said structure to be (e.g., individually) optically resolved. The method comprises obtaining an intensity metric from an image of the at least one edge and determining a value for said parameter based on the intensity metric.

Abstract: A head provided to a shape measuring apparatus includes a translucent stylus head that displaces integrally with a light source and a photoreceiver, and is arranged between the light source and the photoreceiver. The stylus head includes an incident portion that causes the light from the light source to be incident on an interior of the stylus head, a reflection portion that totally reflects the incident light, and a light emission portion that emits the light that is totally reflected toward the photoreceiver. Evanescent light is generated at the measurement surface by the light that is totally reflected by the total reflection surface. The stylus head brings the measurement surface and a surface of a measurable object to face each other, separates the measurement surface from the surface of the measurable object, and is arranged such that the evanescent light reaches the surface of the measurable object.

Abstract: The invention relates to an apparatus and a method for determining a defocussing value (?z, ?z1, ?z2) for at least one image feature in an image, wherein at least one monochromatic image of an object is generated, wherein the defocussing value (?z, ?z1, ?z2) is determined on the basis of the image and depending on the wavelength (?) of the monochromatic image, and a method and apparatus for image-based determination of a dimensional size.

Abstract: A chemical mechanical polishing apparatus including a conditioning head having a first pressure sensor and a controller configured to adjust at least one of a position or a rotation of the conditioning pad responsive to the first pressure data. The conditioning head is adjustable between a first position and a second position, the conditioning head and a polishing pad are in contact when the conditioning head is in the second position, and the first pressure sensor generates first pressure data when the conditioning head is in the second position.

Abstract: The present invention provides a measuring apparatus having a housing in which an opening is formed, and measuring a reflection characteristic of a target region to be measured via the opening, the apparatus comprising an imaging device provided in the housing, and configured to capture an image of an imaging region via the opening, a detector configured to detect light reflected from the target region, which is a portion of the imaging region, a processor configured to obtain a reflection characteristic of the target region based on the light detected by the detecting unit, and a display unit configured to display the image of the imaging region captured by the imaging unit, wherein the image of the imaging region displayed by the display unit includes information indicating the target region.

Abstract: The present disclosure relates to a communication method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. In addition, a method of a terminal in a wireless communication system, includes: receiving system information including first uplink waveform information for an initial access; transmitting a radio resource control (RRC) connection request message based on the first uplink waveform information; receiving an RRC connection response message including second uplink waveform information for uplink data transmission; and transmitting data based on the second uplink waveform.

Abstract: A numerical control system of a machine tool includes an analysis device. The analysis device includes acquisition portions which acquire chronological speed control data when the work is machined and which acquire spatial machined surface measurement data after the machining of the work, a data-associating processing portion which associates the speed control data and the machined surface measurement data with each other, a machined surface failure detection portion which detects failures on the machined surface of the work, an identification portion which identifies the speed control data of failure locations corresponding to the machined surface measurement data of the failure locations, a failure interval detection portion which detects the interval of the failures and a calculation portion which calculates the frequency of vibrations based on a machining speed based on the speed control data of the failure locations and the interval of the failures.

Abstract: The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.

Abstract: The present invention provides an inspection device that is capable of detecting foreign matter with high accuracy, the inspection device including: a light source; an electro-optic element on which light from the light source is incident and which changes a phase of the light into at least two states; and a controller. The controller corrects a phase fluctuation of the electro-optic element itself, using intensity modulation characteristics of the eletro-optic element which are obtained by changing an applied voltage that is input to the electro-optic element.

Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.