Abstract: A method includes determining a target etching depth for etching a plurality of dielectric regions in a wafer. The wafer includes a plurality of protruding semiconductor fins and the plurality of dielectric regions between the plurality of protruding semiconductor fins. The method further includes etching the plurality of dielectric regions, projecting a light beam on the wafer, and generating a spectrum from a reflected light reflected from the wafer, determining an end point for etching based on the spectrum. The end point is an expected time point. The plurality of dielectric regions are etched to the target etching depth. The etching of the plurality of dielectric regions is stopped at the end point.

Abstract: A method for evaluating a weld in a formed object includes performing a contact mechanics test of a first region that includes the weld and storing one or more corresponding weld surface mechanical property measurements, performing a contact mechanics test of a second region that excludes the weld and storing one or more corresponding base material surface mechanical property measurements, determining a relative difference in the weld surface mechanical property measurements and the base material surface mechanical property measurements, determining one or more weld width measurements on the exterior surface of the formed object, and evaluating the weld based on the determined relative difference in the weld surface mechanical property measurements and the base material surface mechanical property measurements in relation to the determined weld width measurements in order to provide an index of weld quality that is traditionally measured through a destructive test or examination.

Abstract: Described herein are systems and methods that may efficiently detect multi-return light signals. A light detection and ranging system, such as a LiDAR system, may fire a laser beam that may hit multiple objects with a different distance in one line, causing multi-return light signals to be received by the system. Multi-return detectors may be able to analyze the peak magnitude of a plurality of peaks in the return signals and determine a multitude of peaks, such as the first peak, the last peak and the maximum peak. One embodiment to detect the multi-return light signals may be a multi-return recursive matched filter detector. This detector comprises a matched filter, peak detector, centroid calculation and a zeroing out function. Other embodiments may be based on a maximum finder that algorithmically selects the highest magnitude peaks from samples of the return signal and buffers for regions of interests peaks.

Abstract: A hardness tester includes an image acquirer acquiring an image of a surface of a sample captured by an image capturer, a test area definer defining a test area where the hardness test is performed with respect to the image of the surface of the sample displayed by a display which displays the acquired image of the surface, a test setting acquirer acquiring estimated hardness of the sample and test force when the hardness test is performed, an estimator estimating a size of the indentation to be formed on the surface of the sample based on the acquired test force and the estimated hardness, and a display controller displaying an image picture of the indentation to be formed, based on the estimated size of the indentation superimposed on the image of the surface of the sample displayed by the display.

Abstract: A plenoptic otoscope enables three-dimensional and/or spectral imaging of the inside of the ear to assist in improved diagnosis of inflammations and infections. The plenoptic otoscope includes a primary imaging system and a plenoptic sensor. The primary imaging system includes an otoscope objective and relay optics, which cooperate to form an image of an inside of an ear at an intermediate image plane. The plenoptic sensor includes a microimaging array positioned at the intermediate image plane and a sensor array positioned at a conjugate of the pupil plane. An optional filter module may be positioned at the pupil plane or one of its conjugates to facilitate three-dimensional and/or spectral imaging.

Abstract: A rigidity measurement apparatus is a rigidity measurement apparatus that measures rigidity of an object to be measured and includes a load estimator, a displacement calculator, and a rigidity calculator. The load estimator estimates a load applied to a measurement point set on the object to be measured by using a captured image of the object to be measured. The displacement calculator calculates a displacement of the measurement point by using the captured image. The rigidity calculator calculates the rigidity of the object to be measured by using the load and the displacement.

Abstract: There is provided a method for measuring a laminated iron core. The method includes preparing a laminated iron core in which two or more kinds of metal plates with different shapes are laminated and a deformed part is formed inside a hole continuing in a lamination direction of the laminated iron core, acquiring a surface profile data indicating a surface shape of the deformed part through an inlet of the hole by a non-contact sensor located in an outside of the hole, and calculating a size of the deformed part by a calculator based on the surface profile data.

Abstract: An optical metrology device determines physical characteristics of at least one via in a sample, such as a through-silicon vias (TSV), using signal strength data for modeling of the bottom critical dimension (BCD) and/or for refinement of the data used to determine a physical characteristic of the via, such as BCD and/or depth. The metrology device obtains interferometric data and generates height and signal strength data, from which statistical properties may be obtained. The height and signal strength data for the via is refined by removing noise using the statistical property, and the BCD for the via may be determined using the refined height and signal strength data. In one implementation, a signal strength via map for a via is generated using signal strength data and is fit to a model to determine the BCD for the via.

Abstract: A hardness tester includes a memory associating and storing a parts program having defined measurement conditions with respect to a sample, including a test position, and an image file acquired by capturing an image of the shape of the sample; an image acquirer acquiring image data of the sample to be measured; a pattern matcher performing a pattern matching process on the image data of the sample using the image file associated with the parts program; a determiner determining whether an image file exists which has a shape related to the image data of the sample; a retriever retrieving the parts program associated with the image file having a related shape; and a measurer measuring hardness of the sample based on the retrieved parts program.

Abstract: A cutting apparatus includes a width measuring unit for measuring the width of a grooving groove formed in a wafer by laser grooving and the width of a cut groove formed by a cutting blade. The width measuring unit includes an imaging camera for imaging the grooving groove and the cut groove, and an illuminating unit for illuminating an area to be imaged by the imaging camera with light supplied in a predetermined light quantity. Therefore, when first light is radiated from the illuminating unit, a first image in which the grooving groove is sharply imaged can be imaged by the imaging camera, whereas when second light is radiated from the illuminating unit, a second image in which the cut groove is clearly imaged can be imaged by the imaging camera. Consequently, the grooving groove and the cut groove can be easily distinguished from each other.

Abstract: A light interference measuring device comprises: a light source 20 that outputs light; a beam splitter 222 that causes the light output from the light source to diverge into a reference optical path and a measurement optical path and that outputs a combined wave in which reflection light that has passed through the reference optical path and reflection light that has passed through a measuring object arranged in the measurement optical path are combined; a reference mirror 231 that is arranged in the reference optical path and that reflects light which is diverged into the reference optical path by the beam splitter 222; a stage 12 that is arranged in the measurement optical path and that has the work W placed thereon; an imaging part 25 that images an image in which the combined wave is formed; a reference mirror adjustment mechanism (234, 238, 239) that adjusts a posture of the reference mirror 231; and a control part that controls the reference mirror adjustment mechanism such that a reflecting surface of

Abstract: A method of inspecting a semiconductor device includes providing a substrate, on which a mold layer with a plurality of mold openings is provided, milling the mold layer in a direction inclined at a predetermined angle with respect to a direction normal to a top surface of the substrate, such that an inclined cutting surface exposing milled mold openings is formed, the milled mold openings including first milling openings along a first column extending in a first direction and having different heights, obtaining image data of the cutting surface, the image data including first contour images of the first milling openings, and obtaining a first process parameter, which represents an extent of bending of the mold openings according to a distance from a top surface of the substrate, using positions of center points of the first contour images.

Abstract: A hardness tester enabling a user to form an indentation in a desired test position, capable of performing an accurate hardness test even when center positions of an indenter and a field lens are offset. The hardness tester includes an XY stage displacing a sample stage in a horizontal direction; a CCD camera capturing images of a sample surface via a field lens; a monitor displaying the images; a turret capable of selectively positioning the indenter or the field lens in a predetermined position opposite the sample; a memory storing an amount of horizontal direction offset between the center positions of the indenter and the field lens when positioned in the predetermined position; and a CPU displaying, based on the amount of offset stored in the memory, a mark indicating the center position of the indenter on the monitor when the field lens is positioned in the predetermined position.

Abstract: This invention relates to a new portable device with no solid frame, which makes it possible to carry out instrumented indentation of a material to deduct its mechanical properties. Continuous or instrumented indentation consists in measuring the force and displacement when an indenter is pushed into the tested material. The device is made up of a sleeve with a reduced volume and its lower base, which may be of variable shapes adapted to that of the material to test, a piston sliding in the sleeve, the displacement of which is controlled by the hand of a user, a manipulating arm, a mechanical column or a robot, an elastic ring or a spring limiting the displacement of the piston, three displacement sensors arranged in an equilateral triangle around a single-piece indenter having any shape, and a force sensor that makes it possible to measure the change in the force depending on the depression made by the indenter in the tested material.

Abstract: A measuring device is configured to measure a height of a mold. The measuring device includes a laser generator, a raster, a camera module, and a controller. The raster is positioned between the laser generator and the mold. A laser beam emitted by the laser generator is refracted by the raster to divide the laser into two laser beams. The two laser beams cooperatively define a predetermined angle ?. The camera module is configured to capture an image of the two laser beams irradiated onto the top surface. The controller is electrically connected to the camera module, and configured to receive the image and to calculate an actual distance D between the two laser beams, according to the image. The controller is capable of calculating a height H of the mold, according to D and the predetermined angle ?.

Abstract: Apparatus and method for checking the depth of a crease line in a material comprising a stamping device (4) having stamping portions (8) arranged at a plurality of levels with respect to a surface of said material, the arrangement being such that those portions (8) which contact the material mark the material with an indicator indicative of the depth of the crease line.

Abstract: Obtaining at least one of a cross-section profile, depth, width, slope, undercut and other parameters of via-holes by a non-destructive technique using an optical system having an illumination system for producing at least one light beam and directing it on a sample in a region of the structure containing at least one via-hole, a detection system configured and operable to collect a pattern of light reflected from the illuminated region, the light pattern being indicative of one or more parameters of said via-hole, and, a control system connected to the detection system, the control system comprising a memory utility for storing a predetermined theoretical model comprising data representative of a set of parameters describing via-holes reflected pattern, and a data processing and analyzing utility configured and operable to receive and analyze image data indicative of the detected light pattern and determine one or more parameters of said via-hole.

Abstract: A multi-purpose device that can be used, as, among other things, an otoscope and a three dimensional scanning system is disclosed.

Abstract: Optical scanning with an optical probe composed of an elongated cylinder of transparent material mounted upon an optical scanner body; one or more sources of scan illumination mounted in the probe distally or proximally with respect to the scanner body and projecting scan illumination longitudinally through the probe; a radially-reflecting optical element mounted in the probe having a conical mirror on a surface of the radially-reflecting optical element, the mirror oriented so as to project scan illumination radially away from a longitudinal axis of the probe with at least some of the scan illumination projected onto a scanned object; a lens mounted in the probe between the radially-reflecting optical element and the scanner body and disposed so as to conduct to an optical sensor scan illumination reflected from the scanned object.

Abstract: A method of determining a structural parameter related to process-induced asymmetry, the method including: illuminating a structure, having an asymmetry property and a sub-structure susceptible to process-induced asymmetry, with radiation with a plurality of illumination conditions, at a first location of a substrate, determining a difference between measured asymmetry properties of the structure obtained with each of the plurality of illumination conditions, calculating a differential dependence of a difference between modeled asymmetry properties simulated for illumination by each of the plurality of illumination conditions on a structural parameter representing process-induced asymmetry of the sub-structure, and determining a value of the structural parameter using the determined difference and the calculated differential dependence.

Abstract: Method and system for measuring an opening at least partially defined by a surface. A plurality of target bodies are positioned about a circumference of a target body holder that is sized to fit within the opening. The target bodies are forced radially outward to cause at least one of the target bodies to be positioned against the surface. A geometric property of the opening is determined based at least partially on a location of at least one of the target bodies positioned against the surface.

Abstract: An apparatus is provided for inspecting holes in components. The apparatus includes a telecentric lens system positionable at a near end of a hole with an optical axis of the lens system aligned with the axis of the hole to image the interior of the hole. The apparatus further includes an illumination system for illuminating the interior of the hole. The apparatus further includes a camera arranged to receive an image of the illuminated interior of the hole from the telecentric lens system. The illumination system includes a light source for producing a beam of parallel light, and optics for directing the produced beam through the telecentric lens system along the optical axis thereof, and through the hole. The beam reaches the far end of the hole, and is reflected from a surface located at or adjacent the far end of the hole to illuminate the interior of the hole.

Abstract: A micro-cavity measuring method and equipment based on micro focal-length collimation are provided. The equipment can be used to measure irregular micro-cavities and “sub-macro” micro-cavities. Wherein a cylindrical or spherical lens with micro focal-length is combined with a fiber probe(11,12) to form a collimating and imaging optical system of a point light source(8), and the collimating and imaging optical system transforms the two or three dimensional movement of the fiber probe(11,12) into a change in image ultra-highly sensitively. A lot of advantages are obtained, i.e., micro measuring force, high aspect ratio, easy miniaturization, high resolution, simple construction and high speed.

Abstract: A method for measuring a via bottom profile is disclosed for obtaining a profile of a bottom of a via in a front side of a substrate. In this method, an infrared (IR) light source is transmitted from the back of the substrate to the bottom of the via through an objective by using an IR-microscope, and lights scattered from the bottom of the via are acquired by an image capturing device to generate an image, where the image displays a diameter (2Ea) of the via bottom profile and a diameter (2Ec) of a maximum receivable base area of the via for the IR-microscope. Thereafter, by using an elliptic equation, a minor axis radius thereof (Eb) is obtained, and thus the via bottom profile is obtained from a radius (Ea) of the via bottom profile and the minor axis radius (Eb) of the elliptic equation.

Abstract: The present invention provides a novel system and method for obtaining at least one of a cross-section profile, depth, width, slope, undercut and other parameters of via-holes by non-destructive technique. The optical system comprises an illumination system for producing at least one light beam and directing it on a sample in a region of the structure containing at least one via-hole; a detection system configured and operable to collect a pattern of light reflected from the illuminated region, the light pattern being indicative of one or more parameters of said via-hole; and, a control system connected to the detection system, the control system comprising a memory utility for storing a predetermined theoretical model comprising data representative of a set of parameters describing via-holes reflected pattern, and a data processing and analyzing utility configured and operable to receive and analyze image data indicative of the detected light pattern and determine one or more parameters of said via-hole.

Abstract: Gaps between strips of composite tape forming a surface are measured by a gauge. The position of the edges of adjacent strips of the tape is sensed as the gauge is moved along the surface, and a gap between the adjacent strips is calculated based on the sensed position of the edges.

Abstract: The attenuation and other optical properties of a medium are exploited to measure a thickness of the medium between a sensor and a target surface. Disclosed herein are various mediums, arrangements of hardware, and processing techniques that can be used to capture these thickness measurements and obtain dynamic three-dimensional images of the target surface in a variety of imaging contexts. This includes general techniques for imaging interior/concave surfaces as well as exterior/convex surfaces, as well as specific adaptations of these techniques to imaging ear canals, human dentition, and so forth.

Abstract: The invention relates to a method for monitoring the filling of a capsule with a medicament, a corresponding filing method and the corresponding devices. According to the monitoring method, after at least part of the capsule is filled with a given filling mass of given closed shape of medicament, in a first step, at least the filling mass located in the part of the capsule after filling is recorded with a digital image, in a second step, the shape of the filling mass located in the part of the capsule is determined from the digital image and, in a third step, the shape analysed to give an analysis of the filling in comparison with given shapes.

Abstract: The attenuation and other optical properties of a medium are exploited to measure a thickness of the medium between a sensor and a target surface. Disclosed herein are various mediums, arrangements of hardware, and processing techniques that can be used to capture these thickness measurements and obtain dynamic three-dimensional images of the target surface in a variety of imaging contexts. This includes general techniques for imaging interior/concave surfaces as well as exterior/convex surfaces, as well as specific adaptations of these techniques to imaging ear canals, human dentition, and so forth.

Abstract: The present invention relates to a rotationally asymmetric chaotic optical multi-pass cavity useful in optical gas sensing spectroscopy, optical delay lines, and laser amplification systems, for example. The cavity may include a single closed mirror having a light reflective surface that is deformed in two orthogonal directions and more particularly, but not exclusively, in the shape of a quadrupole in both horizontal and vertical planes. The cavity includes a light entry port and a light exit port which may be the same or separate ports, as well as a gas inlet and a gas outlet. The optical path length, the beam divergence rate, and the spot pattern are controlled by selecting the cavity deformation coefficients and the input beam direction to achieve the desired beam path and beam quality.

Abstract: An apparatus is provided for inspecting holes in components. The apparatus includes a telecentric lens system positionable at a near end of a hole with an optical axis of the lens system aligned with the axis of the hole to image the interior of the hole. The apparatus further includes an illumination system for illuminating the interior of the hole. The apparatus further includes a camera arranged to receive an image of the illuminated interior of the hole from the telecentric lens system. The illumination system includes a light source for producing a beam of parallel light, and optics for directing the produced beam through the telecentric lens system along the optical axis thereof, and through the hole. The beam reaches the far end of the hole, and is reflected from a surface located at or adjacent the far end of the hole to illuminate the interior of the hole.

Abstract: A system for via structure measurement is disclosed. The system comprises a reflectometer, a simulation unit and a comparing unit. The reflectometer is configured to collect a measured diffraction spectrum of at least a via. The simulation unit is configured to provide simulated diffraction spectrums of the at least a via. The comparing unit is configured to determine at least a depth and at least a bottom profile of the at least a via by comparing the collected diffraction spectrum and the simulated diffraction spectrums.

Abstract: The attenuation and other optical properties of a medium are exploited to measure a thickness of the medium between a sensor and a target surface. Disclosed herein are various mediums, arrangements of hardware, and processing techniques that can be used to capture these thickness measurements and obtain three-dimensional images of the target surface in a variety of imaging contexts. This includes general techniques for imaging interior/concave surfaces as well as exterior/convex surfaces, as well as specific adaptations of these techniques to imaging ear canals, human dentition, and so forth.

Abstract: A micro-cavity measuring method and equipment based on micro focal-length collimation are provided. The equipment can be used to measure irregular micro-cavities and “sub-macro” micro-cavities. Wherein a cylindrical or spherical lens with micro focal-length is combined with a fiber probe(11,12) to form a collimating and imaging optical system of a point light source(8), and the collimating and imaging optical system transforms the two or three dimensional movement of the fiber probe(11,12) into a change in image ultra-highly sensitively. A lot of advantages are obtained, i.e., micro measuring force, high aspect ratio, easy miniaturization, high resolution, simple construction and high speed.

Abstract: A measuring device includes a light-sending part sending light in a first direction which is a depth direction of a hollow shape, a conversion part converting a direction of the light into a circumference direction approximately orthogonal to the first direction, a detection part detecting light reflected inside a measuring object, the direction of which is converted by the conversion part, and a shape measurement part measuring an inside shape of the measuring object by obtaining a shift from a reference position according to a detection result of the detection part. Thereby, it is possible to obtain the hollow shape of an object at one time without a need of rotating the object or a light source, and to carry out a highly accurate measurement using a simple device.

Abstract: The present invention provides a method and system for on-machine 3-D depth measurement. The same image retrieving apparatus measures the first distance for the width of the similar gray-level region of cutting-surface from the first angle, and measures the second distance for the width of the similar gray-level region of cutting-surface from the first angle superimposing the second angle. The width of the similar gray-level region of cutting-surface comprises the cutting-surface and the shadow of the bottom portion of the cutting-surface. And then the cutting-surface depth is calculated according to the first angle, the second angle, the first distance, and the second distance.

Abstract: A method of measuring a porosity of a film, by measuring a refractive index of the film in a first environment having a first relative humidity to produce a first refractive index measurement. The refractive index of the film is measured in a second environment having a second relative humidity, where the first relative humidity is different from the second relative humidity, to produce a second refractive index measurement. Multiple gases can be used to create the first and second environments. The first refractive index measurement and the second refractive index measurement are input into a model that correlates refractive index to film porosity, to output the porosity of the film.

Abstract: An apparatus for measuring an internal dimension of a well-bore comprising a tool adapted to be positioned inside the well bore. The tool comprises an optical caliper comprising an optical sensor providing a response correlated to the internal dimension of the well bore, the optical sensor being coupled to an optical fiber.

Abstract: A system (10) for directly measuring the depth of a high aspect ratio etched feature on a wafer (80) that includes an etched surface (82) and a non-etched surface (84). The system (10) utilizes an infrared reflectometer (12) that in a preferred embodiment includes a swept laser (14), a fiber circulator (16), a photodetector (22) and a combination collimator (18) and an objective lens (20). From the objective lens (20) a focused incident light (23) is produced that is applied to the non-etched surface (84) of the wafer (80). From the wafer (80) is produced a reflected light (25) that is processed through the reflectometer (12) and applied to an ADC (24) where a corresponding digital data signal (29) is produced. The digital data signal (29) is applied to a computer (30) that, in combination with software (32), measures the depth of the etched feature that is then viewed on a display (34).

Abstract: The present invention provides a novel system and method for obtaining at least one of a cross-section profile, depth, width, slope, undercut and other parameters of via-holes by non-destructive technique. The optical system comprises an illumination system for producing at least one light beam and directing it on a sample in a region of the structure containing at least one via-hole; a detection system configured and operable to collect a pattern of light reflected from the illuminated region, the light pattern being indicative of one or more parameters of said via-hole; and, a control system connected to the detection system, the control system comprising a memory utility for storing a predetermined theoretical model comprising data representative of a set of parameters describing via-holes reflected pattern, and a data processing and analyzing utility configured and operable to receive and analyze image data indicative of the detected light pattern and determine one or more parameters of said via-hole.

Abstract: Disclosed is an apparatus for obtaining geometrical data relating to an internal surface of a cavity. The apparatus comprises a probe having an end portion insertable into the cavity in a direction of insertion, radiation directing means for directing electromagnetic radiation from the end portion to at least one location on the internal surface to cause the radiation to be reflected from said location, detection means for detecting the reflected radiation from the at least one location, and means for determining from the detected radiation a distance between the probe and the internal surface in a direction having at least a transverse component relative to the direction of insertion. The radiation directing means is adapted to direct the radiation at an acute angle relative to the direction of insertion.

Abstract: A semiconductor device includes: a circuit board; a semiconductor chip mounted over the circuit board with a predetermined gap therebetween and electrically connected to the circuit board by a protruding electrode; a first resin material filled into the gap between the circuit board and the semiconductor chip; a second resin material that seals the semiconductor chip mounted over the circuit board; a first reflector which is formed on a surface of the circuit board on the semiconductor chip side and reflects a predetermined testing light; and a second reflector which is formed on a surface of the semiconductor chip on the circuit board side and reflects the predetermined testing light.

Abstract: In a sealing machine a pair of juxtaposed foils are sealed together at web regions having oppositely directed outer surfaces between a pair of dies, at least one of which is formed with an array of bumps that taper outwardly toward a respective one of the outer surfaces. The bumps press into the one outer surface and form therein permanent cavities of a predetermined imprint depth so as to bond together the foils at the web region. A quality of seal is determined by measuring after formation of the cavities surface features of the cavities at a level of the one outer surface of the respective foil, and calculating based on the measured surface features an imprint depth of the cavity.

Abstract: The present invention provides a method and system for on-machine 3-D depth measurement. The same image retrieving apparatus measures the first distance for the width of the similar gray-level region of cutting-surface from the first angle, and measures the second distance for the width of the similar gray-level region of cutting-surface from the first angle superimposing the second angle. The width of the similar gray-level region of cutting-surface comprises the cutting-surface and the shadow of the bottom portion of the cutting-surface. And then the cutting-surface depth is calculated according to the first angle, the second angle, the first distance, and the second distance.

Abstract: A method of measuring the three-dimensional volume or perimeter shape of an interior cavity includes the steps of collecting a first optical slice of data that represents a partial volume or perimeter shape of the interior cavity, collecting additional optical slices of data that represents a partial volume or perimeter shape of the interior cavity, and combining the first optical slice of data and the additional optical slices of data to calculate of the three-dimensional volume or perimeter shape of the interior cavity.

Abstract: A probe system includes an imager and an inspection light source. The probe system is configured to operate in an inspection mode and a measurement mode. During inspection mode, the inspection light source is enabled. During measurement mode, the inspection light source is disabled, and a structured-light pattern is projected. The probe system is further configured to capture at least one measurement mode image. In the at least one measurement mode image, the structured-light pattern is projected onto an object. The probe system is configured to utilize pixel values from the at least one measurement mode image to determine at least one geometric dimension of the object. A probe system configured to detect relative movement between a probe and the object between captures of two or more of a plurality of images is also provided.

Abstract: In a wound scanning apparatus and method, a beam or sheet of light is scanned on a wound and reflections of the scanned beam or sheet of light interacting with the wound at a plurality of points thereof is detected. The detected reflections are processed into data representative of the wound. The data or a representation thereof is reproduced in a human understandable form.

Abstract: A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the s

Abstract: The invention is a non contact laser inspection self centering device to inspect the counter sink portion of a counter sunk fastener hole on a surface. In detail, the self centering and seating device includes a combination laser transmitter and receiver for transmitting a laser bean across a surface and for receiving the return signal from the surface. A self centering device is attached to the combination laser transmitter and receiver for aligning the laser transmitter with the fastener hole such that the transmitted and received laser beam passes across the center of the counter sink portion of the fastener hole. A computer system is connected to the combination laser transmitter and receiver for analyzing the transmitted and returned laser signal from the surface and determining if the counter sink portion of the hole is within tolerance.

Abstract: An apparatus for measuring an internal dimension of a well-bore comprising a tool (1) adapted to be positioned inside the well bore. The tool comprises an optical caliper (312) comprising an optical sensor providing a response correlated to the internal dimension of the well bore, the optical sensor being coupled to an optical fiber (311A).