Abstract: A thin-film magnetic head is capable of securing an insulating property and minimizing the projection of a recording element section due to heat expansion. The thin-film magnetic head includes a pair of magnetic layers disposed with a predetermined gap therebetween on a surface facing a recording medium. The layers are connected to each other along an inner part in a height direction from the medium-facing surface. A spiral recording coil is disposed between the pair of magnetic layers and wound around a connecting portion of the pair of magnetic layers. The recording coil includes a dense coil portion formed with a pitch smaller than that of the inner part in the height direction so as to be closer to the medium-facing surface than the connecting portion. An organic insulating layer is locally formed to fill coil gaps of the dense coil portion, and coil gaps other than those of the dense coil portion are filled with an inorganic insulating layer.
Abstract: A method and apparatus for forming a high conductance, high aspect ratio structure in a single low temperature copper chemical vapor deposition step. A trench for a winding of a coil is formed by forming a first length of the trench in the insulation layer. The first length of the trench forms a first portion of the winding of the coil in a confined area proximate a yoke region. A second length of trench is formed in the insulation layer extending away from the first length of the trench and the yoke region. The second length of trench includes parallel trenches for forming a second portion of the winding in a nonconfined area. A metal is deposited into the first length of the trench and the second length of the trench to form the first and second portions of the winding of the coil.
Type:
Grant
Filed:
October 11, 2005
Date of Patent:
March 31, 2009
Assignee:
International Business Machines Corporation