Electrical Attachment Of Slider/head Patents (Class 360/234.5)
  • Patent number: 10187991
    Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer, a conductive pattern including a wire, and a cover insulating layer. The conductive pattern includes a terminal for being connected to a piezoelectric element, connected to the wire, and disposed next to the base insulating layer in a direction perpendicular to the thickness direction. The terminal is exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, and extends along the direction perpendicular to the thickness direction so as to go away from the base insulating layer next thereto. At least a portion of a peripheral end surface of the terminal is covered with the cover insulating layer.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: January 22, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takatoshi Sakakura, Tomoaki Okuno
  • Patent number: 10109307
    Abstract: A positioning method positions a flexure whose front end side is joined to an outside frame with respect to a load beam, keeps the positioned state of the flexure and load beam, plastically deforms the outside frame to bend the front end side of the flexure so that the position of a tongue of the flexure is adjusted to the position of a dimple of the load beam, and joins the flexure and load beam to each other to keep the position adjusted state of the tongue.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: October 23, 2018
    Assignee: NHK Spring Co., Ltd.
    Inventors: Tadashi Tokiwa, Naoki Moriya
  • Patent number: 10043541
    Abstract: In a disk drive having a flexible circuit tail that is routed within a recess in the actuator arm, a dielectric spacer is added to the top of the tail in order to space the circuit traces within the tail further away from the electrically conductive actuator arm, and to make more repeatable that spacing. The added spacing reduces electrical coupling and thus increases the bandwidth of the circuit. The spacer can be in the form of a section of the same viscoelastic material that is used elsewhere as a vibration dampener on the suspension, the viscoelastic material being adhered to the tail before the tail is inserted within the recess. Alternatively, the spacer can be a thickened region of the flexible circuit covercoat in the area where the tail will reside within the recess.
    Type: Grant
    Filed: November 12, 2016
    Date of Patent: August 7, 2018
    Assignee: Magnecomp Corporation
    Inventors: Christopher G. Dunn, Benjapa Tanampee
  • Patent number: 10034388
    Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting layer, a conductive pattern including a wire disposed at one side in the thickness direction of the base insulating layer and a terminal exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, a piezoelectric element disposed at the other side in the thickness direction with respect to the terminal and including an element terminal electrically connected to the terminal, and a solder layer disposed between the terminal and the element terminal. The solder layer has a solder composition containing Sn, Ag, and Cu, and the solder layer has a thickness in the thickness direction of 50 ?m or less.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: July 24, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takatoshi Sakakura, Tomoaki Okuno, Takahiro Takano
  • Patent number: 10028378
    Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: July 17, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiroyuki Tanabe, Naohiro Terada, Yuu Sugimoto, Daisuke Yamauchi
  • Patent number: 9858954
    Abstract: A test fixture for testing a slider configured for heat assisted magnetic recording. The test fixture has a three dimensional structure with contact pads configured to make contact with electrically conductive contact pads at the trailing edge of the slider. The test fixture also has a structure with a contact pad configured to make electrical contact with a contact pad formed at a backside surface of the slider.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: January 2, 2018
    Assignee: Western Digital Technologies, Inc.
    Inventors: Noriyuki Saiki, Kazue Kudo, Takaharu Niimi, Yasunobu Yanagisawa
  • Patent number: 9837106
    Abstract: A two-dimensional magnetic recording (TDMR) disk drive has a gas-bearing slider that includes first and second sensors with a first cross-track spacing electrically coupled to a first magnetic shield, and third and fourth sensors with a different cross-track spacing electrically coupled to a second magnetic shield. The different spacings results in the first and third sensors and the second and fourth sensors having a cross-track spacing to accommodate for the effect of head skew. Each sensor is connected to an associated amplifier by a suspension trace and a common trace connected to its associated shield. Switching circuitry selects either the first and third amplifiers or the second and fourth amplifiers as the active pair depending on the radial location where the data is to be read. Thus the appropriate pair of sensors are aligned with the data tracks despite the presence of high head skew.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: December 5, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: John Thomas Contreras, Howard Gordon Zolla
  • Patent number: 9792933
    Abstract: According to one embodiment, a magnetic head includes an air bearing surface, a first surface on which contact pads connected to elements are provided, a pair of second surfaces provided respectively with a connection terminal connected to the contact pad, a main pole with a distal end portion extending to the air bearing surface, a write shield opposing the distal end portion of the main pole with a write gap therebetween, and a high-frequency oscillator provided between the main pole and the write shield within the write gap and electrically connected to the main pole and the write shield. The high-frequency oscillator includes a spin injection layer and an oscillation layer, and at least the oscillation layer is recessed in a direction away from the air bearing surface.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: October 17, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Gaku Koizumi, Tomoko Taguchi, Katsuhiko Koui
  • Patent number: 9728211
    Abstract: Devices including a suspension pad shape and layout that avoids shorts caused by solder bridging during coupling of leads thereto. One embodiment includes a plurality of slider pads and a plurality of suspension pads being generally aligned with the slider pads. A conductive material electrically couples each of the suspension pads to the slider pad aligned therewith. At least one of the suspension pads is characterized as follows. The suspension pad has a proximal edge positioned closest to the associated slider pad, a distal edge positioned opposite the proximal edge, and side edges extending between the proximal and distal edges. At least a portion of the suspension pad tapers toward the proximal edge.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: August 8, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kenichi Murata, Yuhsuke Matsumoto, Masafumi Umeda, Hiroyasu Tsuchida
  • Patent number: 9704520
    Abstract: Described herein is a connector assembly that comprises a head-gimbal assembly (HGA) tail connector, a flex connector, and an adhesive. The HGA tail connector comprises a pad support, an HGA pad coupled to the pad support, and an HGA trace coupled to the pad support and electrically coupled to the HGA pad. The flex connector comprises a substrate, comprising a first side and a second side, where the first side is opposite the second side. The flex connector also comprises a flex pad coupled to the first side of the substrate, a flex trace coupled to the second side of the substrate, and a via extending through the substrate from the first side to the second side. The via electrically couples the flex pad and the flex trace. Also, the adhesive adheres the HGA pad of the HGA connector in electrical contact with the flex pad of the flex connector.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: July 11, 2017
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Shigeo Nakamura, Nobumasa Nishiyama, Takuma Muraki, Teruhiro Nakamiya
  • Patent number: 9607641
    Abstract: A slider of a magnetic recording head comprises a plurality of electrical bond pads coupled to bias sources. A first writer on the slider is coupled between first and second bond pads. A second writer on the slider is coupled between third and fourth bond pads. At least one heater is coupled between two of the first, second, third, and fourth bond pads. The first writer can have a center-tap coupled to first and second bond pads. The second writer can have a center-tap coupled to third and fourth bond pads. A first writer heater can be coupled between the center-tap of the second writer and the ground pad. A second writer heater can be coupled between the center-tap of the first writer and the ground pad.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: March 28, 2017
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Narayanan Ramakrishnan, Declan Macken
  • Patent number: 9508361
    Abstract: Transmission signals may generated based on three differential signals and transmitted along a channel. Each of the plurality of transmission signals may include a signal representative of each of the three differential signals. After receiving the transmission signals, the original three differential signals may be generated based on the transmission signals.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: November 29, 2016
    Assignee: Seagate Technology LLC
    Inventors: Bruce Buch, Stefan A. Ionescu
  • Patent number: 9502058
    Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: November 22, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yoshito Fujimura, Hiroyuki Tanabe, Saori Kanezaki, Naohiro Terada, Yuu Sugimoto
  • Patent number: 9431032
    Abstract: A method and system provide a magnetic transducer including first and second read sensors, a shield and a conductive via. The shield is between the first and second read sensors. The magnetic transducer also includes first and second read shields. The shield has a top surface and a bottom surface opposite to the top surface. The bottom surface faces the first read sensor. The conductive via is isolated from the first read shield and the second read shield. The conductive via provides electrical contact to the shield and is electrically connected to the bottom surface of the shield.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: August 30, 2016
    Assignee: WESTERN DIGITAL (FREMONT), LLC
    Inventors: Shaoping Li, Steven C. Rudy, Ge Yi, Gerardo A. Bertero, Qunwen Leng, Ming Mao
  • Patent number: 9406324
    Abstract: According to one embodiment, a magnetic head slider includes: a leading edge, and a trailing edge; a media facing side (MFS) extending between the leading edge and the trailing edge; a first region located near the trailing edge, and a second region located between the first region and the leading edge; a center rail comprising: a forward segment protruding from the first region of the slider, and a posterior segment protruding from the second region of the slider; a rear rail protruding from the second region of the slider; and a secondary protective film deposited on one or more portions of the first region.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: August 2, 2016
    Assignee: HGST Netherlands B.V.
    Inventors: Jan Vincent Cullano, Estela Paguio, Mary Agnes G. Perez
  • Patent number: 9390737
    Abstract: A method for manufacturing a magnetic recording head slider is disclosed. A plurality of bond pads are formed in a linear arrangement adjacent one another on a trailing edge of a slider body. Each of the plurality of bond pads comprises a probe contact area and a soldering contact area with each area being laterally bounded in a width dimension, along the trailing edge, by respective edges of the pads wherein a width of the probe contact area is greater than a width of the soldering contact area of each respective pad whereby the probe contact area is larger than the soldering contact area.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: July 12, 2016
    Assignee: Western Digital (Fremont), LLC
    Inventors: Wachira Puttichaem, Adisak Tokaew, Tzong-Shii Pan
  • Patent number: 9236070
    Abstract: A suspension flexure is provided. The suspension flexure includes a steel layer, a polyimide layer above the steel layer, and a copper layer on the polyimide layer comprising a plurality of dual opposing cantilevered copper pads.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: January 12, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventor: Alex Enriquez Cayaban
  • Patent number: 9208811
    Abstract: Methods and apparatuses are implemented to cause a first contact event between a slider and a magnetic recording medium at a first operating temperature, the slider comprising at least a writer, a writer heater, a reader, and a reader heater. Methods and apparatuses are implemented to cause a second contact event between the slider and the medium at a second operating temperature different from the first operating temperature, determine a flying height displacement of the slider for the contact events, and optionally store the flying height displacement.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: December 8, 2015
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Tae won Kim, Tae Young Kim
  • Patent number: 9202498
    Abstract: A head transducer comprises a reader coupled to reader bond pads and configured to interact with a magnetic storage medium. A first thermal sensor is configured to produce a first sensor signal. The first sensor is biased relative to a common mode voltage at the reader bond pads. A second thermal sensor is configured to produce a second sensor signal. One of the first and second sensors is situated at or near a close point of the head transducer in relation to the magnetic storage medium, and the other of the first and second sensors spaced away from the close point. Circuitry is configured to combine the first and second sensor signals and produce a combined sensor signal indicative of one or both of a change in head-medium spacing and head-medium contact.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 1, 2015
    Assignee: Seagate Technology LLC
    Inventor: Declan Macken
  • Patent number: 9171561
    Abstract: Assemblies and methods that include a flex circuit having a slider facing surface and an opposing back surface; a slider having a back surface and an opposing air bearing surface (ABS), the slider including an electrical connection region; and a through circuit electrical connection, that is in electrical connection with the electrical connection region of the slider, the back surface of the slider interfacing with the slider facing surface of the flex circuit.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: October 27, 2015
    Assignee: Seagate Technology LLC
    Inventors: Jason B. Gadbois, Bradley Ver Meer, Joseph Stephan, Scott Matzke, Ravishankar Ajjanagadde Shivarama, Christopher Unger
  • Patent number: 9135935
    Abstract: System and methods are illustrated for customizing the HGA bonding skew angle of a TDMR slider including a plurality of readers to adjust reader alignment relative to a track location on disk media. Overlay error caused by manufacturing variations is compensated for by adjusting the skew angle of the slider when it is bonded to the suspension to form the HGA. Process operations for manufacturing a TMDR HDD include manufacturing a multiple reader, multiple layer TDMR slider, determining an overlay error in the slider, determining a slider bonding skew angle based on the determined overlay error and other parameters, and bonding the slider to a HDD suspension at the determined bonding skew angle.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: September 15, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Michael L. Mallary, Gerardo A. Bertero, Shaoping Li
  • Patent number: 9072207
    Abstract: A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: June 30, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yasunari Ooyabu, Tetsuya Ohsawa, Emiko Tani
  • Patent number: 9058829
    Abstract: A apparatus includes first and second read transducers arranged on a media-facing surface. The read transducers detect magnetic fields of a recording medium. First and second heaters are disposed proximate the respective first and second read transducers. The first and second heaters independently control respective first and second protrusions of the first and second read transducers from the media-facing surface.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: June 16, 2015
    Assignee: Seagate Technology LLC
    Inventors: John Wolf, Erik Hutchinson
  • Publication number: 20150098152
    Abstract: An apparatus such as a magnetic recording head with at least two separately addressable read transducers that are coplanar in a cross track direction. The apparatus includes first coplanar electrical contacts respectively disposed on and in electrical contact with first surfaces of the at least two read transducers and an electrically insulating magnetic material disposed between the electrical contacts.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 9, 2015
    Applicant: Seagate Technology LLC
    Inventors: Jason Bryce Gadbois, Steven A. Mastain, James K. Price
  • Publication number: 20150098151
    Abstract: A read head with at least two separately addressable read transducers that are coplanar in a cross track direction. The read transducers have a cross track width, wr, and a center-to-center separation distance between the two read transducers either greater than 3wr or the distance of two tracks of an associated medium in the cross track direction.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 9, 2015
    Applicant: Seagate Technology LLC
    Inventors: Jason Bryce Gadbois, Steven A. Mastain, James K. Price
  • Patent number: 8995090
    Abstract: A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: March 31, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Jin Nishiyama, Yuji Narita
  • Patent number: 8995091
    Abstract: A slider for magnetic data recording in a thermally assisted recording system. The slider has a slider body and a magnetic recording head formed on a trailing edge of the slider body. A first terminal is formed on a trailing edge surface of the recording head, and a second terminal is formed on a backside surface both the magnetic recording head and the slider body so as to extend across both the magnetic recording head and the slider body. An electrically conductive lead formed within the magnetic recording head connects the first lead with the second lead.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: March 31, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: Tomomitsu Inoue, Hideo Yamakura, Hidetoshi Anan, Hiroshi Ishizaki
  • Patent number: 8988829
    Abstract: Disk drive embodiments with common lead connections in the slider, suspension, and preamplifier are described. The arm electronics IC includes a preamplifier with single-ended input from the set of signal traces that include a common signal return lead for the plurality of read transducers (readers) in the slider. Two embodiments of the preamps are described that include a single-ended design and a pseudo-single-ended design. Each embodiment supplies the required bias to each read transducer using an operational transconductance amplifier (OTA) that drives a variable current source connected to the transducer. The positive input to the OTA is a DC voltage with the AC signal from the transducer imposed on it. The negative input is a DC reference voltage. Various embodiments of the signal trace configuration on the suspension are described including a single and double layer embodiments.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: March 24, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: John Contreras, Joey Martin Poss, Rehan Ahmed Zakai
  • Patent number: 8947830
    Abstract: A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: February 3, 2015
    Assignee: Seagate Technology LLC
    Inventors: Aaron Michael Collins, Scott Matzke, Christopher Unger, Paul Davidson, Daniel Richard Buettner
  • Publication number: 20140368954
    Abstract: In a first terminal portion, a first conductor, a terminal element as a first protection, and a first gold-plating layer are provided. The first terminal element is thicker than a base nickel layer of a slider terminal portion. The first gold-plating layer is provided with a first roughening processed portion. An electrically conductive paste contacts the roughening processed portion. In a second terminal portion, a second conductor, a terminal element as a second protection, and a second gold-plating layer are provided. The second terminal element is thicker than the base nickel layer. The second gold-plating layer is provided with a second roughening processed portion. An electrically conductive paste contacts the second roughening processed portion.
    Type: Application
    Filed: May 7, 2014
    Publication date: December 18, 2014
    Applicant: NHK SPRING CO., LTD.
    Inventors: Masaru INOUE, Sei KAWAO, Rintarou NIWA
  • Patent number: 8913348
    Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer formed on the metal supporting layer, a conductive layer formed on the insulating base layer, and a slider supported on the metal supporting layer via a pedestal. The conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction. The conductive overlapping portion is provided to be spaced apart from the slider.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: December 16, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naotaka Higuchi, Hitoki Kanagawa, Tadashi Takahashi
  • Patent number: 8902547
    Abstract: A multiple layered interconnect structure to provide an electrical interface between one or more electrical elements on a head to read/write circuitry is disclosed. The interconnect structure includes first and second interconnecting layers. The first interconnecting layer is formed on a slider body of the head and includes a first or lower bond pad connectable to one or more electrical elements on the slider body through the first interconnecting layer. The second interconnecting layer includes a second or upper bond pad connectable to the one or more transducer elements through the second interconnecting layer. The second interconnecting layer is on top of the first interconnecting layer and the structure includes an insulating layer between the first and second interconnecting layers.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: December 2, 2014
    Assignee: Seagate Technology LLC
    Inventor: Lijuan Zhong
  • Publication number: 20140307349
    Abstract: A magnetic transducer has an air-bearing surface (ABS). The magnetic transducer has a main pole, at least one coil for energizing the main pole and at least one additional pole. The main pole has a yoke and a pole tip having an ABS facing surface. The at least one additional pole is adjacent to the main pole in a down track direction. The additional pole is recessed from the ABS, has a front surface facing the ABS, has at least one side surface, and has at least one flare angle between the front surface and the at least one side surface. The at least one flare angle is measured from the ABS to the at least one side surface and is at least fifty degrees and less than ninety degrees.
    Type: Application
    Filed: June 14, 2013
    Publication date: October 16, 2014
    Inventors: FENG LIU, ZHANJIE LI, ZHIGANG BAI
  • Patent number: 8861142
    Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface of the metal supporting board, a second insulating layer laminated on a back surface of the metal supporting board, a first conductive pattern laminated on the surface of the first insulating layer and including a first terminal connected to the magnetic head, and a second conductive pattern laminated on the surface of the second insulating layer and including a second terminal. In a slider mounting region, the slider is mounted on the surface and an electronic element mounting space is formed. Respective end edges of the first and second insulating layers are spaced apart from and located at positions inwardly protruded in the electronic element mounting space from an end edge of the metal supporting board, and the second terminal is disposed to face the electronic element mounting space.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: October 14, 2014
    Assignee: Nitto Denko Corporation
    Inventor: Tetsuya Ohsawa
  • Publication number: 20140240871
    Abstract: Approaches for an interface voltage control (IVC) system in a hard-disk drive (HDD), whereby the IVC operating point determination scheme utilizes non-contact spacing signals for calibration of IVC. While applying a series of input voltages to a slider, head-disk spacing signals are monitored, such as spacing signals from an embedded contact sensor or Wallace spacing loss spacing signals. Based on the relation between the spacing signal values and the series of input voltages, the IVC operating point is identified and stored within the HDD. The IVC operating point corresponds to the IVC input voltage necessary to neutralize the natural slider-disk voltage potential that would otherwise cause an electrostatic force that pulls the slider closer to the disk and can cause lubrication transfer from disk to slider.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: Sripathi Vangipuram Canchi, John Thomas Contreras, Saurabh Deoras, Samir Y. Garzon, Remmelt Pit
  • Patent number: 8817423
    Abstract: An Extended Circuit Integrated Suspension (ECIS) design and manufacture thereof, to allow for circuit elements to be disposed onto the load beam on the opposite side of the flexure circuit. An Extended Circuit Integrated Suspension (ECIS) may include a load beam; a flexure circuit comprising a plurality of traces; and a connection portion which connects the load beam laterally to the flexure circuit. The load beam, the flexure circuit, and the connecting portion may be formed as a single component from a single panel, and the connection portion is oriented so that the connection portion is folded to place the flexure circuit onto a first side of the load beam. Applications for the use of the extended circuit are many, and a semi-collocated micro-actuator (SCLMA) is illustrated for example.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: August 26, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Alex Enriquez Cayaban
  • Patent number: 8810966
    Abstract: A slider for a disc drive assembly may be attached to various substrates during manufacture and installation in the disc drive assembly. In some examples, a slider attachment system includes a substrate, a first diffusion barrier layer formed over the substrate, a first solder-wettable protection layer formed over the first diffusion barrier layer, a second diffusion barrier layer formed over the first solder-wettable protection layer, and a second solder-wettable protection layer formed over the second diffusion barrier layer. The first and second solder-wettable protection layers may be formed of a material that is inert to a chemical etchant that can chemically dissolve the diffusion barrier layers. In use, solder may be applied to the second solder-wettable protection layer to wet and dissolve the layer. If the substrate needs to be detached and reattached, etchant can chemically dissolve the second diffusion barrier layer to expose the first solder-wettable layer for reattachment.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: August 19, 2014
    Assignee: Seagate Technology LLC
    Inventor: Lijuan Zhong
  • Patent number: 8810965
    Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: August 19, 2014
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Li ping Peng, Shen kuang Sidney Chou, Chi hung Yuen, Yan bin Wang, Lu Xiao
  • Patent number: 8786975
    Abstract: In one embodiment, a magnetic head slider includes a substrate, at least two elements (read element, write element, and/or heater element) positioned adjacent to the substrate, a resistance detection element positioned near the two elements, a pair of conductive terminals in an accessible position and coupled to each of the two elements, a protective film surrounding the two elements and the resistance detection element, a first and a second thin conductive wire extending from the resistance detection element and terminating at an edge of the protective film, a third thin conductive wire extending from one of the pair of conductive terminals for a first of the two elements and terminating at an edge of the protective film, and a fourth thin conductive wire extending from one of the pair of conductive terminals for a second of the two elements and terminating at an edge of the protective film.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: July 22, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Tomomitsu Inoue, Hideo Yamakura, Takateru Seki
  • Publication number: 20140198411
    Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.
    Type: Application
    Filed: February 19, 2013
    Publication date: July 17, 2014
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Li ping PENG, Shen kuang Sidney CHOU, Chi hung YUEN, Yan bin WANG, Lu Xiao
  • Patent number: 8756795
    Abstract: A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: June 24, 2014
    Assignee: Western Digital (Fremont), LLC
    Inventors: Mark D. Moravec, Subrata I Gusti Made, Santi Pumkrachang
  • Publication number: 20140154952
    Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: HGST NETHERLANDS B.V.
    Inventors: David P. DRUIST, Glenn P. GEE, Unal M. GURUZ, Edward H. LEE, David J. SEAGLE, Darrick T. SMITH
  • Publication number: 20140139953
    Abstract: A micro-milliactuator, a micro-microactuator, an actuator arm assembly, a hard disk drive and a method for operation of the hard disk are provided. In accordance with one aspect, the actuator arm assembly includes an arm, a slider for reading and writing information to disk media in response to read/write signals, and an actuator selected from the group comprising a micro-milliactuator and a micro-microactuator. The actuator has the slider mounted thereon and supports it above the disk media. The actuator includes one or more piezoelectric actuators for horizontally shifting the slider in response to actuator control signals. The actuator further includes one or more sensors physically coupled thereto for vibration sensing, compensation and suppression, the one or more sensors generating sensor signals in response to sensed vibrations during operation, wherein the actuator control signals are generated at least partially in response to the sensor signals.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 22, 2014
    Applicant: Agency for Science, Technology and Research
    Inventor: Michael Hatch
  • Patent number: 8724249
    Abstract: A magnetic recording disk drive has a fly-height sensor on the slider that supports the read/write head. The head-disk spacing signal from the fly-height sensor utilizes the existing read path between the arm electronics (AE) module and the channel electronics module. A variable gain amplifier (VGA) on the AE module receives as one input the head-disk spacing signal and as the other input an emulated read signal. The output of the VGA is thus an oscillatory signal that emulates the read signal but whose amplitude varies as the head-disk spacing varies. A multiplexer (MUX) on the AE module multiplexes the amplified read signal from the read amplifier with the VGA oscillatory output signal on the read path back to the channel electronics module.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: May 13, 2014
    Assignee: HGST Netherlands B.V.
    Inventor: John Thomas Contreras
  • Patent number: 8717714
    Abstract: In a positioning and driving system including a rotating magnetic disk, a magnetic head slider that floats above the surface of the magnetic disk and writes data to and reads data from a track provided on the magnetic disk, an actuator that positions the magnetic head slider in a radial direction of the magnetic disk, and an amplifier that supplies electrical power to the actuator in accordance with the input signal and performs a driving operation, provided is the configuration of an electrothermal actuator driving system that obtains continuous displacement over the entire required operating range with respect to changes in an input voltage by using only one amplifier and that is incorporated into a feedback control system and is suitable for high-speed and high-precision positioning.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: May 6, 2014
    Assignee: Hitachi, Ltd.
    Inventor: Haruaki Otsuki
  • Patent number: 8717711
    Abstract: According to one embodiment, a magnetic data system includes a magnetic disk medium, a magnetic head having a writer element and/or a reader element, an exothermic resistor element for thermal fly-height control (TFC), a contact detection sensor having a resistor element and at least one contact detection electrode, and an insulating film on a medium facing side of the magnetic head to protect the contact detection sensor, the insulating film having a thickness greater than the contact detection electrode, a drive mechanism for passing the magnetic disk medium over the magnetic head, and a controller electrically coupled to the magnetic head for controlling operation of the magnetic head, wherein the controller adjusts magnetic spacing between the magnetic head and the magnetic disk medium via thermal distortion of the exothermic resistor element. The contact detection sensor may be used as a second TFC resistor element.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: May 6, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Atsushi Kato, Hideaki Tanaka, Ichiro Oodake, Takao Yonekawa
  • Patent number: 8711521
    Abstract: A suspension for a head gimbal assembly includes a flexure having a laminated structure including a substrate layer, an insulating layer formed on the substrate layer, and a conducting layer formed on the insulating layer. And first bonding pads are formed on the conducting layer at a first surface of the flexure, so as to electrically connect with a slider via solder balls, and second bonding pads are formed on the substrate layer at a second surface of the flexure opposite to the first surface, so as to electrically connect with extra components formed at the second surface via solder balls. The suspension can connect slider and other extra components at two opposite surfaces of the flexure with a simplified and compacted structure and a reduced cost.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: April 29, 2014
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Xian wen Feng, Fu quan Pang, Hai ming Zhou
  • Patent number: 8699187
    Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 15, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Tetsuya Nakamura, Takahiro Sakai, Masahiko Katoh, Yasushi Inoue, Tetsuya Nakatsuka, Satoshi Kaneko, Masashi Okubo
  • Patent number: 8675311
    Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: March 18, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
  • Publication number: 20140063658
    Abstract: To uniformly determine the positional relationship between a main magnetic pole and a spin torque oscillator while independently optimizing the main magnetic pole and the spin torque oscillator. On a trailing end surface of a main magnetic pole, a step is provided at the boundary between the main magnetic pole and a gap material disposed on both sides thereof, and a spin torque oscillator is formed on the step. The spin torque oscillator is effectively separated into two regions by utilizing the step. Further, a part of the spin torque oscillator is removed so as to disable the unwanted region, thereby realizing a self-alignment type high frequency magnetic field assisted magnetic recording head structure such that the positions of the end portions of the main magnetic pole and the spin torque oscillator are aligned.
    Type: Application
    Filed: August 16, 2013
    Publication date: March 6, 2014
    Applicant: HITACHI, LTD.
    Inventors: Junichiro SHIMIZU, Kikuo KUSUKAWA, Yo SATO, Masukazu IGARASHI