Abstract: A head gimbal assembly may comprise a slider, a micro-actuator attached to the slider, a flexure to mount the slider and the micro-actuator, and a suspension comprising a support region, a main portion, and a moving portion, wherein the flexure comprises a plurality of trace sets to electrically couple the micro-actuator and the slider, and wherein the plurality of trace sets are laminated generally parallel to each other.

Abstract: A suspension board with circuit includes a conductive region in which a conductive layer is formed and a mounting region for mounting a slider on which a magnetic head that is electrically connected to the conductive layer is mounted. The mounting region mounts the slider so that the slider is capable of relatively moving with respect to the conductive region, and the conductive region includes an opposing region that is opposed to the slider in the thickness direction at the time of the relative movement of the slider with respect to the conductive region and a damage preventing portion for preventing damage to the opposing region by the slider.

Abstract: A system according to one embodiment includes a thin film stack having a magnetic transducer and a contact pad; and a heater in the thin film stack for inducing thermal protrusion of a media-facing side of the thin film stack, wherein the thin film stack is characterized by the contact pad protruding farther than the magnetic transducer upon the thin film stack being heated by the heater. A method for calibrating a protrusion of a magnetic head includes increasing a thermal protrusion of a magnetic head to induce head-medium contact; determining that the head has contacted the medium, wherein a portion of the head that contacts the medium is a contact pad or overcoat of the contact pad; determining parameters for inducing a desired amount of protrusion based in part on the determination that the head has contacted the medium; and storing the parameters.

Abstract: Embodiments of the present invention help to reduce the resistance variation of the heater provided in order to adjust the flying height of the slider. According to one embodiment, a magnetic head slider has a magnetic read/write device and a heater formed on the trailing end surface of the slider. The heater comprises a heating portion, terminal portions and lead portions. Where a terminal portion overlaps with a lead portion, a diffusion stop film is disposed between them. In addition, a diffusion stop film is disposed between a lead portion and a lower shield seed film (NiFe) under the associated stud. The diffusion stop films and are Ta films with a thickness of 5 nm or preferably at least 10 nm.

Abstract: An assembly includes a slider and a suspension assembly. The slider includes an air bearing surface and a slider mounting surface opposite the air bearing surface. There are a plurality of slider pads on the slider mounting surface. The suspension assembly includes a plurality of suspension pads on a suspension mounting surface. Each of the suspension pads is connected to one of the slider pads with a solder joint so that the slider mounting surface has at least one of a pitch, roll, or yaw angle with respect to the suspension mounting.

Abstract: Embodiments of the present invention provide a magnetic slider of which terminals have a sufficiently large process margin for the laser condition in the SBB process. According to one embodiment, a magnetic slider comprises: a read element and a write element; plural wiring lines which are connected to the read element and the write element; a protective film which covers the read element, the write element and the plural-wiring lines; plural slider pads formed on the protective film; and plural studs which respectively connect the slider pads and the wiring lines and are covered by the protective film, wherein each of the slider pads comprises a chromium film, a nickel iron film and a gold film, the nickel iron film is formed between the chromium film and the gold film, and the chromium film is formed between the nickel iron film and one of the studs and is in contact with the protective film.

Abstract: Approaches for a hard-disk drive suspension interconnect having a wide bandwidth. A suspension interconnect includes a substrate layer, a dielectric layer disposed on the substrate layer, and a plurality of transmission-line (TL) conductors disposed within the dielectric layer. Air gaps may be disposed around the TL conductors to minimize the tendency of the dielectric material to act as an electrical shunt, which impedes high bandwidth signal transmission. An air gap may exist in the dielectric layer between adjacent TL conductors. Additionally, the area adjacent to the plurality of TL conductors, along the direction of signal travel, may alternate between dielectric material and air gaps. Indeed, there need not be any solid material enclosing the TL conductors save for a plurality of dielectric cross ties that provide structural support thereto. The substrate layer may also comprise one or more air gaps underneath a portion of the plurality of TL conductors.

Abstract: A HGA comprises a slider and a suspension with a flexure having a tongue region for supporting the slider. A read/write transducer and a piezoelectric element are formed oppositely. The connecting points of the curve beams and the inner tongue of the tongue region are in mirror positions to a center point of the inner tongue, and the connecting points of each curve beam are located at opposite sides of a center axis of the flexure. The slider has multiple electrical pads electrically connecting with the read/write transducer. The inner tongue has multiple electrical pads. The flexure has multiple inner leads electrically connected with the electrical pads of the inner tongue formed on the curve beams. The structure of the HGA prevents the read/write transducer from damaged and cause the manufacture of the HGA simpler. The present invention also discloses a suspension and a disk drive unit.

Abstract: A write circuit and a head for a hard disk drive. The head includes a substrate that has an electrical ground and a write element that has a center tap. The head also has a resistor that is connected to the center tap and the electrical ground. The resistor provides a return path for AC and DC components of any common mode signal in a write circuit. The resistor can also generate heat that thermally expands the head and varies a head flying height. The write element is connected to an write driver circuit that provides in phase currents to a write element during the write operation and out of phase currents during a read operation. The out of phase currents allow for thermal expansion and flying height control even during a read operation.

Abstract: A suspension for a head gimbal assembly comprises a flexure having a suspension tongue with a trailing portion. The trailing portion has a plurality of trailing pads formed thereon adapted for bonding to a trailing edge of a slider. The trailing portion is isolated from other portions of the flexure by a first slot surrounding the trailing portion. The isolated trailing portion is not affected due to the temperature change, the thermal crown change of the slider is reduced and, in turn, the variation of flying height of the slider is reduce so as to improve read/write performance of the slider. The invention also discloses a head gimbal assembly and a disk drive unit with the same.

Abstract: A method for manufacturing a disk drive head suspension having a plated load point dimple. A photoresist mask having an opening with load point-defining side walls and a load point diameter is formed over a planar portion of a spring metal member. Metal is plated onto the spring metal member in the opening to form a load point having the load point diameter on the planar portion of the spring metal member.

Abstract: Embodiments of the present invention relate to approaches to effectively let noise on a head slider bonded to a silicon substrate of a microactuator, escape to the ground. A head gimbal assembly (HGA) according to an embodiment of the present invention comprises a microactuator bonded to a gimbal tongue. The microactuator comprises a piezoelectric element and a movable part for moving in response to expansion or contraction of the piezoelectric element. The motion of the movable part causes a head slider to slightly move. The microactuator further comprises a conductive path including an impurity-containing silicon layer formed on the silicon substrate. The conductive path transmits electric charge of the head slider to a suspension. The conductivity of the impurity-containing silicon layer is lower than the one of the silicon substrate so that the noise charge of the head slider may escape to the suspension.

Abstract: An assembly includes a slider and a suspension assembly. The slider includes an air bearing surface and a slider mounting surface opposite the air bearing surface. There are a plurality of slider pads on the slider mounting surface. The suspension assembly includes a plurality of suspension pads on a suspension mounting surface. Each of the suspension pads is connected to one of the slider pads with a solder joint so that the slider mounting surface has at least one of a pitch, roll, or yaw angle with respect to the suspension mounting.

Abstract: Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.

Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.

Abstract: Embodiments of the present invention provide a highly reliable hard disk drive (HDD). In an HDD according to an embodiment of the present invention, solder at a solder joint for joining a pad of a head slider and a pad of a transmission wiring comprises the main component of Sn and atomic percent to atomic percent of indium. The solder exhibits the ? phase within the range of ?150° C. to 120° C. Accordingly, even if the HDD is left at a low temperature for a long time, the solder joint is not broken.

Abstract: A flexible mounting slider with anti-static structure includes a slider body, an anti-static structure and a lead layer. The slider body includes an ABS, a slider back surface opposite to the ABS and a trailing edge connected with the ABS and the slider back surface. The trailing edge forms a plurality of slider pads thereon. The anti-static structure is provided on the slider back surface, which includes an insulation plate formed on the slider back surface, an anti-static plate formed on the insulation plate and a grounding element. In the invention, the anti-static plate comprises an insulation layer and an anti-static layer. The grounding element is electrically contacting with the anti-static layer of the anti-static plate and the slider back surface simultaneously. The lead layer is sandwiched between the insulation plate and the insulation layer of the anti-static plate and electrically connected with the slider pads of the slider body.

Abstract: A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive layer formed on the insulating layer, and a pedestal for supporting a slider. The pedestal includes a lower pedestal made of the insulating layer, and formed in a continuous frame shape so as to surround a bonding surface of the metal supporting board to the slider, and an upper pedestal made of the conductive layer, and formed in a discontinuous frame shape on the lower pedestal.

Abstract: A disk drive flexure has a pattern of voids in the ground plane in the area directly underneath the read and write bond pads, in order to adjust the respective impedances of the read and write bond pad pairs to match the impedances of the read and write transducers and the signal trace pairs to and from the transducers. The resulting impedance matched bond pads increase the effective signal bandwidth of the flexure and its electrical connections, decreasing the probability of error at high signal speeds and increasing the maximum data rate through the suspension.

Abstract: Gimbal designs are provided that minimize adverse dynamic performance of a HDD suspension, particularly subsequent to head-disk-interface (HDI) interactions. The improvement of operational performance can be seen in graphical representations of the vibrational modes of a gimbal mounted slider subsequent to such HDI interactions. Each gimbal design includes a ramp limiter formed as two separated arms connected by one or two transverse bars and a routing of conducting traces that relieves stress and minimally contacts these bars.

Abstract: A micro-actuator to which no head slider is adhesively bonded is mounted on a suspension. The head slider is adhesively bonded to the micro-actuator mounted on the suspension. Before the head slider adheres to the micro-actuator, an electrical connecting work of the slider is completed, and a characteristic test is carried out. If the head slider is judged as being normal as a result of the characteristic test, the head slider concerned is bonded to the micro-actuator by the adhesive.

Abstract: For a Tunneling Magnetoresistive (TMR) element, an electrode is used as a magnetic shield or vice versa. This can pose a problem in that noise from a heater source or electromagnetic induction has a direct influence on the TMR element, namely, on a read signal. According to one embodiment of the present invention, however, a thin film head portion has an insulating film, a heater, an electromagnetic shield, a read element, and a write element laminated in this order from the side of a slider. Insulating films isolate the constituent elements above from each other, and a protection film covers the group mentioned above. The heater is a thin film resistive element made of NiCr or the like, and is disposed above the insulating film. The electromagnetic shield is a magnetic film made of permalloy or the like, and covers the heater. The read element comprises a lower shield and electrode, a TMR element, and an upper shield and electrode.

Abstract: The present invention relates to a thin-film device whose bump has an improved surface property. A thin-film element of the thin-film device includes at least one of an electromagnetic conversion element, a passive element and an active element. A lead conductor film containing Cu as a main component is connected to the thin-film element. The lead conductor is provided with a bump. The bump includes a first conductor film and a second conductor film. The first conductor film is adhered onto the lead conductor film and is a Ta film or made of a material having a comparably fine crystal structure. The second conductor film is a plated film which is directly or indirectly formed on the first conductor film and contains Au as a main component.

Abstract: A slider structure that allows a grounded heater element to be employed, while also allowing a decision of whether the slider is to be an “up” slider or a “down” slider to be made in a late stage in the formation of the slider. The slider includes electrical contact pads for making electrical connection with the heater element. The slider also includes a dedicated ground path formed on the slider body at a location that is removed from either of the first and second contact pads, ground path providing electrical connectivity to the slider body. At a late stage in the manufacture of the read and write head, a determination can be made as to which contact pad is to be a ground pad, and that pad can be electrically connected with the ground path.

Abstract: An electrical connection assembly includes a body, an electrically insulative layer supported by the body, a first bond pad defined on the electrically insulative layer, a first electrical contact pad defined on the electrically insulative layer and electrically isolated from the first bond pad, a circuit located adjacent to the electrically insulative layer defining a second bond pad and a second electrical contact pad that are electrically isolated from each other, and an electrically conductive bonding material that electrically and mechanically links the first and second bond pads. After setting, the electrically conductive bonding material biases the first and second electrical contact pads against each other in order to create an electrical connection therebetween.

Abstract: According to one embodiment, a head slider, includes: a slider body; an insulating nonmagnetic film configured to be laminated on an air outflow side end face of the slider body; a magnetoresistive effect film configured to be buried in the nonmagnetic film; first and second wiring patterns configured to be buried in the nonmagnetic film and connected to the magnetoresistive effect film; a third wiring pattern configured to be buried in the nonmagnetic film and connected to the first and second wiring pattern in parallel to the magnetoresistive effect film; and a switch element configured to be buried in the nonmagnetic film and change conductivity of the third wiring pattern between conduction and non-conduction.

Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal joining.

Abstract: A slider according to the present invention includes a slider body, a plurality of insulators, and conductive traces. The slider body has a first side and edges defined substantially perpendicular to the first side. The plurality of insulators are each adjacent to the first side of the slider body. The conductive traces are adjacent to each of the plurality of insulators and opposite the slider body.

Abstract: A head gimbal assembly (HGA) of a hard disk drive (HDD) includes a flexure, a slider attached to the flexure and including a magnetic head, a plurality of pads at a side of the slider, a plurality of traces attached to and supported by the flexure and respectively bonded to the pads to form an electrically continuous circuit therebetween, and an insulating support element covering a bonding region between the pads and the traces.

Abstract: A stepped-part 4b with a lower tip side is formed on the top face of a pattern end 4, and a lower face 4c thereof is used as a plane on which a solder ball 7 is provided. One or more protrusions 4d made of a swollen conductive layer are formed on the lower face to limit displacement of the solder ball in the tip direction and the both side directions. The solder ball is held by the protrusions to suppress deviation of the solder ball.

Abstract: A bending apparatus of a head gimbal assembly includes a suction unit configured to attract the head gimbal assembly, a movement unit configured to move a long tail connected to a terminal part, a stopper against which the moved long tail is butted, a transmission type optical sensor configured to detect that the long tail is positioned to the stopper, a tail holder configured to hold a part of the long tail on a work table, a roller configured to compress the terminal part against the tail holder and to bend the terminal part relative to the long tail at a right angle, and a controller configured to control, based on a detection result of the transmission type optical sensor, a movement of the tail holder to the work table and a movement of the roller to the tail holder.

Abstract: Embodiments in accordance with the present invention provide a magnetic head slider which includes a magnetic recording/reproducing element and a heater which are formed in an air outflow end surface of a slider. The heater includes a heating portion, terminal portions extending from both ends of the heating portion, and lead portions overlapping the respective terminal portions at an overlap ratio of approximately 50% or more.

Abstract: A fly height control apparatus for supporting a magnetic recording transducer comprises a trifurcated slider. A piezoelectric transducer is coupled to a surface of the central trifurcation of the trifurcated slider. The surface is opposite and parallel to an air bearing surface of the trifurcated slider. An electrical coupling means couples the piezoelectric transducer to a suspension.

Abstract: An assembly includes a slider having an air bearing surface and a slider mounting surface opposite the air bearing surface. The slider mounting surface includes first, second, third, and fourth slider pads. A first slider trace electrically shorts the first slider pad with the third slider pad. A second slider trace electrically shorts the second slider pad with the fourth slider pad. A transducing head is supported by the slider. The transducing head includes a positive terminal electrically connected to the first slider pad and a negative terminal electrically connected to the second slider pad. The first, second, third, and fourth slider pads can be connected to pads on a connection circuit with interleaved traces.

Abstract: A HGA comprises a slider and a suspension with a flexure having a tongue region for supporting the slider. A read/write transducer and a piezoelectric element are formed oppositely. The connecting points of the curve beams and the inner tongue of the tongue region are in mirror positions to a center point of the inner tongue, and the connecting points of each curve beam are located at opposite sides of a center axis of the flexure. The slider has multiple electrical pads electrically connecting with the read/write transducer. The inner tongue has multiple electrical pads. The flexure has multiple inner leads electrically connected with the electrical pads of the inner tongue formed on the curve beams. The structure of the HGA prevents the read/write transducer from damaged and cause the manufacture of the HGA simpler. The present invention also discloses a suspension and a disk drive unit.

Abstract: A magnetic head assembly in which a slider can be removed with deformation of a suspension suppressed and the posture angle of a magnetic head can be maintained stably and a magnetic disk drive mounted with the magnetic head assembly. A head gimbal assembly (HGA) according to an embodiment includes a suspension, a magnetic head slider provided with a magnetic head element section, and a gimbal retaining the slider and connected to the suspension. The gimbal includes a spacer formed around a conductive adhesive application area. A nonconductive adhesive application area having a planar dimension not larger than that of the conductive adhesive application area is formed outside the spacer. The gimbal and the slider are brought into conduction through a conductive adhesive applied to the conductive adhesive application area and are adhered to each other with a nonconductive adhesive applied to the nonconductive adhesive application area.

Abstract: A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow.

Abstract: In a flexure assembly for a hard disk drive suspension, a structure for preventing strains introduced by solder ball bonding from affecting the pitch static attitude (PSA) and other characteristics of the flexure assembly is presented. The structure includes a flexure that features two side rails that support a gimbal tongue, with the side rails also supporting a laterally extending bridge which is attached at its two ends to the side rails. The bridge is wide enough at its central portion to accommodate the flex trace circuit bonding pads, yet narrow enough at its ends to relieve strains caused by solder ball bonding and cooling and prevent those strains from significantly affecting the PSA. The gimbal tongue is thus, to an effective extent, mechanically and thermally isolated from the solder ball bonding pads, while at the same time the bridge provides strong mechanical support for the solder ball bonding pads.

Abstract: A suspension for a head gimbal assembly comprises a flexure having a plurality of electrical traces formed thereon, a plurality of first bonding pads formed on a first surface of the flexure and at least one second bonding pad formed on a second surface of the flexure opposite the first surface. The first bonding pads and the at least one second bonding pad are electrically connected with the electrical traces and adapted to electrically connect to a slider of the head gimbal assembly. The invention also discloses a head gimbal assembly and a disk drive unit with the same.

Abstract: Embodiments of the invention provide a compact thin-film magnetic head capable of being increased in the number of terminals, and a magnetic disk drive that uses the thin-film magnetic head. In one embodiment, a thin-film magnetic head is constructed that has a magnetic response element, multiple connection object terminals, multiple lead conductors electrically connected to the magnetic response element, and multiple connection sections each formed between each of the connection object terminals and one of the multiple lead conductors in order to electrically connect each of the connection object terminals and one of the lead conductor. All of the multiple lead conductors are provided in the state where they extend from the magnetic response element to the lower layers of the multiple connection object terminals. A magnetic disk drive using the thin-film magnetic head is constructed.

Abstract: A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

Abstract: A method of bonding a metal ball for a magnetic head assembly is provided. The method comprises: preparing a capillary; disposing the capillary so as to face a bonding surface of the electrode pad of the slider and that of the electrode pad of the flexible printed circuit board; carrying the metal ball to the bonding surfaces by introducing the metal ball and the inactive gas stream into the carrying route of the capillary; positioning and retaining the metal ball on the bonding surfaces by the inactive gas stream passing through the carrying route and issued radially from the cutoff portions; and melting the metal ball by directly applying laser beams via the cutoff portions of the capillary, and bonding the electrode pad of the slider and the electrode pad of the flexible printed circuit board by the melted metal.

Abstract: A suspension assembly for a hard disk drive includes at least two spring extensions that couple to a proximal portion of a load beam. These spring extensions are disposed by a vertical offset and couple to the load beam on opposite sides of a longitudinal axis of the load beam. The method for operating a disk drive apparatus includes following by a suspension assembly from a reference position to a second position a vertical movement of a rotating disk. The suspension assembly is predisposed to move from the reference position to the second position by the vertical offset. A read/write head coupled to the suspension assembly is in closer alignment to a selected track during the vertical movement in the second position than if the first and second spring extensions were disposed to be co-planar.

Abstract: Embodiments of the invention provide a head which can prevent an external magnetic field form erasing a signal on the medium and whose main magnetic pole piece does not corrode during processing of the air bearing surface. In one embodiment, an anti-corrosion electrode is formed to apply a voltage to the main magnetic pole piece during processing of the air bearing surface. This retards corrosion of the main magnetic pole piece. Since a conductor (anti-corrosion wire) connected to this anti-corrosion electrode is made of a nonmagnetic material, concentration of an external magnetic field into the main magnetic pole piece can be suppressed. Consequently, since the magnetic leakage field emitted from the main magnetic pole piece is reduced, erasure of the signal on the medium can be prevented.

Abstract: When exogenous noise is applied to the ground wire of a thin film magnetic head, crosstalk noise occurs in a lead line and a ground lines located near the ground wire. Embodiments in accordance with the present invention avoid this by providing a common terminal near the central portion of a thin film head portion. Write element terminals are connected to lines extending from a coil. Read element terminals are connected to lead wires extending from electrodes of a GMR element. A heater terminal is connected to a line extending from a heater. The common terminal is connected to a ground line of upper and lower shields via a resistor, to ground lines of electrodes via other resistors and to a ground line of upper and lower magnetic pole pieces of a write element via another resistor. A ground line of a slider, a ground line of the heater, and a ground line of the common terminal are all connected to a ground terminal.

Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

Abstract: Systems and methods for a slider and suspension assembly are discussed. The slider and suspension assembly comprises a slider, a suspension, and composite fiber solder. The composite fiber solder is coupled to the suspension and coupled to the slider. The composite fiber solder comprises a fiber, wherein the fiber is configured to increase a fracture resistance of the composite fiber solder compared to a solder without the fiber.

Abstract: Crosstalk from a write signal on wiring on a suspension needs to be reduced since an ESD withstand voltage is decreased due to high sensitivity of a GMR head. In one embodiment, a terminal arrangement on an element-forming surface of a magnetic head slider consists of a ground terminal G, a read terminal R+, a read terminal R?, a write terminal W+ and a write terminal W? in order from the outside. With this terminal arrangement, the wiring order on a suspension consists of a read wire R?, a read wire R+, a ground line G, a write wire W? and a write wire W+ in an arrangement unlike the terminal arrangement. In other words, the ground line G is interposed between the write wires W and the read wires R.

Abstract: Gimbal designs are provided that minimize adverse dynamic performance of a HDD suspension, particularly subsequent to head-disk-interface (HDI) interactions. The improvement of operational performance can be seen in graphical representations of the vibrational modes of a gimbal mounted slider subsequent to such HDI interactions. Each gimbal design includes a ramp limiter formed as two separated arms connected by one or two transverse bars and a routing of conducting traces that relieves stress and minimally contacts these bars.

Abstract: A system and method are disclosed for improving suspension-to-slider attachment in a hard disk drive. A slider having a number of bond pads on its leading edge and a number of bond pads on its trailing edge is to be coupled to a suspension flexure having a number of leading bond pads and a number of trailing bond pads. The slider is to be coupled to the suspension flexure at the leading bond pads and the trailing bond pads by a method such as gold ball, solder ball, or solder bump bonding.