Abstract: A film capacitor device includes a film stack with metal strips including adjacent metal strips in 180° opposite orientations in a direction in which the metal strips continuously extend, metal-sprayed electrodes on a pair of end faces of the film stack, and conductors extending continuously in a stacking direction on a pair of end faces (cut surfaces) different from the pair of end faces on which the metal-sprayed electrodes are located.

Abstract: A composite electronic component includes a capacitor structure including a dielectric layer, and a first internal electrode and a second internal electrode alternately arranged in a first direction, with the dielectric layer interposed therebetween; a fuse structure including a fuse and a fuse body; a common electrode disposed between one surface of the capacitor structure in a second direction, crossing the first direction, and one surface of the fuse structure in the second direction, and connected to the first internal electrode and the fuse; a first external electrode disposed on the other surface of the fuse structure in the second direction, and connected to the fuse; and a second external electrode disposed on the other surface of the capacitor structure in the second direction, and connected to the second internal electrode.

Abstract: A semiconductor device has a semiconductor substrate, a first insulating film formed on a surface of the semiconductor substrate, a first recess formed in the first insulating film, a first barrier film formed on an inner surface of the first insulating film except a top peripheral region of the first trench, a first conductive film formed in the first trench, and a covering film formed on an upper surface and a top peripheral region of the first conductive film and an upper surface of the first barrier film. The first conductive film includes copper.

Abstract: An electronic device that includes an intermediate connection layer interposed between a wiring substrate with a pair of land electrodes and an electronic component. The intermediate connection layer has first and second connection electrodes formed on the surface of a base. A fuse part is formed inside the second connection electrode between a main conductor part thereof opposed to a first external electrode of the electronic component and a main conductor part of the first connection electrode opposed to a second external electrode of the electronic component.

Abstract: A ceramic electronic component includes a stack including ceramic layers and internal electrodes stacked alternately, and external electrodes provided on a surface of the stack and electrically connected to the internal electrodes. The internal electrodes include a melting trigger portion that melts earlier than any other portion. The ceramic layer adjacent to the internal electrode including the melting trigger portion includes a cavity. The cavity is provided at a position at which the cavity overlaps the melting trigger portion at least partially in a stacking direction of the internal electrodes. The cavity is open on a melting trigger portion side. A surface of at least one of the stack and the external electrodes is provided with an identifier that serves as a marker indicating use of the ceramic electronic component with the cavity vertically below the melting trigger portion.

Abstract: The present disclosure provides the printed circuit board assembly suitable for operating downhole at high temperatures. The printed circuit board assembly has a ceramic circuit board with a plurality of chips installed on it. At least one of the chips has an aluminum nitride or a silicon nitride substrate. In some of the chips, aluminum nitride is used as the oxide layer in a Si-on-Insulator configuration. In other chips, integrated circuits are fabricated on a substrate made from aluminum nitride, silicon nitride, silicon carbide, or sapphire.

Abstract: Prismatic polymer monolithic capacitor structure including multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation into the structure (which can lead to higher dissipation factor and electrode corrosion). The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

Abstract: A laminate body includes a plurality of ceramic layers and capacitor conductors embedded in the laminate body so as to be opposed to each other via one of the ceramic layers. The capacitor conductors are made of an Al-based material, and the capacitor conductors include narrow portions, respectively, which function as fuse elements. The narrow portions have an average width smaller than an average width of portions of the capacitor conductors other than the narrow portions. As a result, the electronic component has an improved capability to protect its function as a capacitor when a short circuit occurs between capacitor conductors.

Abstract: A multilayer ceramic capacitor may include: a ceramic body; first and second external electrodes disposed on a mounting surface of the ceramic body; third and fourth external electrodes disposed on a surface of the ceramic body opposing the mounting surface; a first active layer including first and second internal electrodes alternately exposed through the mounting surface of the ceramic body and the surface of the ceramic body opposing the mounting surface and connected to the first and third external electrodes, respectively; a second active layer including third and fourth internal electrodes alternately exposed through the mounting surface of the ceramic body and the surface of the ceramic body opposing the mounting surface and connected to the second and fourth external electrodes, respectively; and an intermittent part disposed on the surface of the ceramic body opposing the mounting surface and connecting the third and fourth external electrodes to each other.

Abstract: A main body of an electronic part is supported by terminals at a position above and separated from a board surface of a printed board. Each of the terminals is composed of a supporting member made of electrically insulating material and a wiring member. Each of the wiring member has an electrode-connected portion electrically connected to an electrode formed on the main body and a land-connected portion electrically connected to a land formed in the printed board. One of the wiring members is composed of a fuse wiring member having a cut-off portion, which is melted down when excess current flows. The wiring member is outwardly expanded in a direction opposite to the main body.

Abstract: A film capacitor includes a capacitor element and first and second external electrodes. The capacitor element includes a dielectric film, a first and a second electrode films facing each other across the dielectric film. The first electrode film includes electrode segments arranged in a matrix form, first fuses connecting the electrode segments adjacent to each other in a first direction, and second fuses connecting the electrode segments adjacent to each other in a second direction perpendicular to the first direction. The second fuses are arranged dispersedly in columns constituted by the electrode segments disposed in the second direction.

Abstract: A ceramic short circuit resistant capacitor that is bendable and/or shapeable to provide a multiple layer capacitor that is extremely compact and amenable to desirable geometries. The capacitor that exhibits a benign failure mode in which a multitude of discrete failure events result in a gradual loss of capacitance. Each event is a localized event in which localized heating causes an adjacent portion of one or both of the electrodes to vaporize, physically cleaning away electrode material from the failure site. A first metal electrode, a second metal electrode, and a ceramic dielectric layer between the electrodes are thin enough to be formed in a serpentine-arrangement with gaps between the first electrode and the second electrode that allow venting of vaporized electrode material in the event of a benign failure.

Abstract: A bundled capacitor with a plurality of individual capacitors is described herein. Each bundled capacitor provides an individual capacitance value. The bundled capacitor can include a housing, a cap connected to the housing, a central common terminal, a plurality of auxiliary terminals, an interrupter, an insulating spider, an insulated collective connection, a thermal fuse, a frangible electrical connection, an insulating layer, a resin disposed around the capacitors, and an expansion chamber formed between the resin and the interrupter, enabling the cap to deform when one of the capacitors overheats in the bundled capacitor.

Abstract: A metallization film capacitor that achieves both high heat resistance and high withstand voltage at the same time. A metal-deposited electrode is formed on a PEN film in each of a pair of metalized films. These metalized films are wound such that the metal-deposited electrodes face each other via the dielectric film in between. A metalized contact electrode is formed on both end faces of these wound metalized films to configure the metallization film capacitor. A divisional electrode is provided on the metal-deposited electrode. In addition, a fuse is coupled to this divisional electrode for providing a self-maintaining function. Pass rate a/b of a deposition pattern is set to 4.0 or smaller, where ‘a’ is the fuse width, and ‘b’ is the length of the divisional electrode in a lengthwise direction of the metalized films.

Abstract: There is provided a deposited film for a film capacitor, which comprises: a thermally sprayed metal contact part formed at one end of a dielectric in a width direction of the dielectric, and a margin part having no deposited metal formed at the other end of the dielectric in the width direction of the dielectric; a split electrode in a rectangular shape formed by forming a T-shaped window margin, from the margin part to a predetermined position within a width range of the deposit film, in the width direction of the deposited film; and a fuse part formed between the split electrodes in the width direction of the deposited film, wherein adjacent fuse parts in the length direction of the deposited film are formed in a stepped layout in the width direction of the deposited film.

Abstract: A metallization film capacitor that achieves both high heat resistance and high withstand voltage at the same time. A metal-deposited electrode is formed on a PEN film in each of a pair of metalized films. These metalized films are wound such that the metal-deposited electrodes face each other via the dielectric film in between. A metalized contact electrode is formed on both end faces of these wound metalized films to configure the metallization film capacitor. A divisional electrode is provided on the metal-deposited electrode. In addition, a fuse is coupled to this divisional electrode for providing a self-maintaining function. Pass rate a/b of a deposition pattern is set to 4.0 or smaller, where ‘a’ is the fuse width, and ‘b’ is the length of the divisional electrode in a lengthwise direction of the metalized films.

Abstract: A capacitor having a large current carrying capacity includes a hollow core formed by a non-conducting tubular section, and a capacitor winding wrapped around the tubular section. A thermal cutoff device is disposed within the hollow core. The thermal cutoff device is configured to sense a predetermined temperature level within the hollow core and disable the current carrying capacity of the capacitor. The thermal cutoff device is disposed at a geometric center of the capacitor winding, which is also the hot spot of the capacitor winding. The thermal cutoff device includes first and second conductors electrically connected to each other with a predetermined solder alloy. The first conductor includes a cross-sectional portion that is attached to the second conductor. The cross-sectional portion is subjected to a springing force in a lateral direction away from the second conductor.

Abstract: The invention includes an electromagnetic filter for a feedthrough conductor, and a method of making such a filter. At least two dielectric components are supported from a first side of a substrate, such as a housing or a printed circuit board. At least one of the dielectric components is associated with a failsafe link.

Abstract: A surface mounting type electronic component such as a solid electrolytic capacitor is provided which comprises an electronic element, a safety fuse wire having a base end electrically connected to the electronic element, and a resin package enclosing the electronic element together with the fuse wire. The fuse wire also has a tip end which is exposed at a face of the resin package, and the face of the resin package is formed with a layer-like terminal in electrical connection with the tip end of the fuse wire.

Abstract: The present invention relates to a film condenser and a metalized film for manufacturing the same. The metalized film comprises a base film formed from an insulating material, and a metal coating layer formed on the base film. A plurality of uncoated portions are formed as area partition margins in the metal coating layer so as to respectively form, in the metal coating layer, a plurality of electrode regions, a plurality of fuse connecting regions surrounded by two or more of the electrode regions, and a plurality of fuse portions. The fuse portions electrically connect each one of the fuse connecting regions with the electrode regions surrounding the one of the fuse connecting regions.

Abstract: A compact solid electrolytic capacitor includes a capacitor element having a positive electrode and a negative electrode which are respectively connected electrically to a first lead and a second lead and a casing of a resin material surrounding the capacitor element. A low melting-point metal layer serving as a fuse, which will quickly melt under an abnormal condition, is inserted between and electrically connects the capacitor element and the second lead and an arc-extinguishing material capable of absorbing the melted metal of the low melting-point metallic material fills a throughhole through the second lead where the latter contacts the low melting-point metal layer. The low melting-point metal layer may be in the form of a flat ribbon of thickness only about 50-100 &mgr;m.