With Significant Lead Patents (Class 361/533)
  • Patent number: 11282653
    Abstract: A solid electrolytic capacitor is provided that includes a capacitor element having a valve action metal base with a porous portion on a first main surface of a core portion, a dielectric layer disposed on a surface of the porous portion, a solid electrolyte layer disposed on the dielectric layer, and a conductor layer disposed on the solid electrolyte layer. Moreover, the capacitor includes a sealing layer that seals a first main surface of the capacitor element, a cathode outer electrode electrically connected to the conductor layer, and an anode outer electrode electrically connected to the valve action metal base. The sealing layer and the cathode outer electrode are disposed on the conductor layer and a cathode through-electrode extends through the sealing layer on the conductor layer. The conductor layer and the cathode outer electrode are connected to each other with the cathode through-electrode interposed therebetween.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: March 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takeshi Furukawa
  • Patent number: 8953303
    Abstract: The present invention relates to a lithium ion capacitor having excellent capacitance characteristics and high energy density. More particularly, the present invention relates to a cathode active material for a lithium ion capacitor, which utilizes a lithium composite metal oxide having a large initial irreversible capacitance as a specific cathode additive in addition to a carbon-based material applied as a cathode active material, and a production method thereof, and a lithium ion capacitor including the same. According to the present invention, lithium can be electrochemically doped on an anode without using metal lithium, and the capacitance characteristics of a lithium ion capacitor and the safety of a lithium-doping process can be significantly improved.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: February 10, 2015
    Assignee: Korea Electronics Technology Institute
    Inventors: Young Jun Kim, Jeom-Soo Kim, Min Sik Park
  • Patent number: 8896986
    Abstract: A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on the dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: November 25, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, John E. McConnell, Philip M. Lessner, Randolph S. Hahn, John Bultitude
  • Patent number: 8837115
    Abstract: An electrolytic capacitor includes an electrolytic capacitor element, anode terminals as a pair, and a conductive member. The capacitor element has an anode body formed by placing an anode foil and a cathode foil one above the other and by winding the anode and cathode foils, anode leads as a pair electrically connected to the anode foil, and a cathode lead electrically connected to the cathode foil. A dielectric layer is formed on a surface of the anode foil. A electrolyte layer is placed between the dielectric layer and the cathode foil. The anode terminals as a pair are each electrically connected to corresponding one of anode leads as a pair of the capacitor element. The conductive member electrically connects the anode terminals to each other outside the capacitor element.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: September 16, 2014
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Hideki Ishida
  • Patent number: 8741214
    Abstract: A method of making a sintered article in which a solid object is embedded includes forming a green body of compressed particles with the solid body is partially embedded. The green body includes an opening across which the solid body extends. The green body is sintered to form a sintered body and the opening permits deformation of the solid body in response to stress applied during the sintering process. A sintered article in which a solid body is at least partially embedded includes an opening. The solid body extends across the opening so that the solid body can deform within the opening. The opening in the solid body prevents distortion of the sintered body from a planar configuration during sintering, even when the green body is relatively thin.
    Type: Grant
    Filed: October 17, 2011
    Date of Patent: June 3, 2014
    Assignee: Evans Capacitor Company
    Inventor: David A. Evans
  • Publication number: 20130314845
    Abstract: A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.
    Type: Application
    Filed: August 6, 2013
    Publication date: November 28, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, John E. McConnell, Robert Ramsbottom, Philip M. Lessner, Randolph S. Hahn, John Bultitude
  • Patent number: 8582278
    Abstract: A capacitor containing a solid electrolytic capacitor element that includes an anode, dielectric, and a cathode that includes a solid electrolyte is provided. An anode lead extends from the anode and is electrically connected to an anode termination. Likewise, a cathode termination is electrically connected to the cathode. The cathode termination contains an upstanding portion that is oriented generally perpendicular to the lower surface of the capacitor element, and first and second planar portions that are oriented generally parallel to the lower surface of the capacitor. The first and second planar portions are interconnected by a folded region so that the first portion is positioned vertically above the second portion. Thus, after encapsulating the capacitor element with a molding material, the second planar portion remains exposed for subsequent connection to an electrical component.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: November 12, 2013
    Assignee: AVX Corporation
    Inventor: Stanislav Zednicek
  • Patent number: 8390990
    Abstract: A solid electrolytic capacitor includes a capacitor element having an anode portion, a dielectric film and a cathode portion, an anode lead frame, a cathode lead frame, and a molded resin for covering at least a part of the anode and cathode lead frames and the capacitor element. In a cathode lead frame opposed portion opposed to the capacitor element with a conductive adhesive material being interposed is provided with a through hole having a narrowed portion smaller in diameter than other portions between a capacitor-element-side opening portion and a molded-resin-side opening portion, and the conductive adhesive material is formed in the through hole.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: March 5, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Atsushi Furuzawa, Hiroaki Izu
  • Patent number: 8310817
    Abstract: In a solid electrolytic capacitor, a path of an electric current flowing from a lower layer to an upper layer of a laminate in cathode portions of respective capacitor elements connected through an electroconductive adhesive layer is opposite to paths of electric currents flowing from a canopy through joints to cathode terminals, thereby achieving reduction in ESL by mutual inductance effect in a simple structure. Since the solid electrolytic capacitor has the structure in which the laminate is surrounded by the canopy and joints, sufficient pressure resistance is ensured for the capacitor elements during resin injection. For this reason, a resin mold to cover the laminate can be formed by transfer molding, which ensures excellent heat resistance and moisture resistance.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: November 13, 2012
    Assignee: TDK Corporation
    Inventors: Masaaki Kobayashi, Hironori Sato
  • Patent number: 8289678
    Abstract: The present invention relates to a solid electrolytic capacitor and a method for preparing the same. There is provided a solid electrolytic capacitor in accordance with the invention including a capacitor element with anode polarity therein and a cathode layer formed on an outer surface thereof; an anode wire with an end portion protruding on one surface of the capacitor element; a cathode lead layer formed on the other surface the capacitor element; a molding part surrounding the capacitor element to expose the protruding end portion of the anode wire and an end portion of the cathode lead layer; and an anode terminal and a cathode terminal formed by a plating layer at both sides of the molding part. It is possible to save preparation cost by simplifying a structure and a preparation process of the solid electrolytic capacitor.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: October 16, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Chong Hoon Pak
  • Patent number: 8179665
    Abstract: A solid electrolytic capacitor includes a capacitor element surrounded with a cathode layer, an anode wire inserted into the capacitor element, a cathode terminal electrically connected to the capacitor element by being positioned at one side below the capacitor element, an anode terminal defining a space between the capacitor element and a top surface thereof and is electrically connected to the anode wire by being positioned at the other side below the capacitor element, a conductive paste coated being thicker toward an inside of the capacitor element, thereby electrically connecting the capacitor element to the cathode terminal and broadening the space, and a fixing film closely coupled to a bottom surface of the conductive paste. A molding unit wraps the capacitor element and the fixing film in a state of closely adhering the conductive paste and the cathode terminal to top and bottom surfaces of the fixing film, respectively.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: May 15, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Chong Hoon Pak
  • Patent number: 8179666
    Abstract: A multilayer electrolytic capacitor has a laminated body in which anode foils and cathode foils are alternately laminated with separators in between, and a lead member connected to corresponding electrode foils among the anode foils and cathode foils. Each of the anode foils and each of the cathode foils have their respective main electrode portions opposed to each other through the separator and their respective lead portions led from the associated main electrode portions. Each lead portion includes an end face intersecting with a direction in which the lead portions are led, and a side face intersecting with the end face and extending in a lamination direction in the laminated body. The lead member has a first portion extending in the direction in which the lead portions are led, and a second portion intersecting with the first portion and extending in the lamination direction. The second portion of the lead member is connected to the side faces of the lead portions.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: May 15, 2012
    Assignee: TDK Corporation
    Inventor: Hiroaki Hasegawa
  • Patent number: 8134083
    Abstract: A circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the dielectric layer having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: March 13, 2012
    Assignee: AB Mikroelektronik Gesselschaft mit beschrankter Haftung
    Inventor: Bernd Haegele
  • Patent number: 8102668
    Abstract: An integral impedence is formed on or within a lead frame pin of a semiconductor package and receives a connection from an electrode of a semiconductor die within the package to eliminate the need for adjustment and protective impedences external of the package. The impedence comprises passives such as resistors, capacitors, diodes or inductors which modify the performance of the package for new semiconductor device characteristics. The impedences may have positive or negative temperature coefficients and are in close thermal communication with the semiconductor die.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: January 24, 2012
    Assignee: International Rectifier Corporation
    Inventors: Henning M. Hauenstein, Alana Nakata
  • Publication number: 20110261505
    Abstract: A solid electrolytic capacitor is provided that includes a capacitor element having a dielectric coating, a solid electrolyte, and a cathode lead portion formed in order on a surface of an anode portion having an anode lead portion. The cathode lead portion is electrically connected to a cathode terminal by a connecting portion, and the connecting portion is formed of a sintered body of a metal.
    Type: Application
    Filed: April 20, 2011
    Publication date: October 27, 2011
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventor: Keiko Matsuoka
  • Patent number: 8040662
    Abstract: A solid electrolytic capacitor includes a cathode terminal structured such that the cathode terminal's flat portion connected to a cathode portion has a divided structure made up of a first flat portion and a second flat portion spaced from each other by a predetermined distance to form a slit. Therefore, even if the cathode terminal is caused to be peeled off from the cathode portion, the peeling can be restricted to only one of the first and second flat portions, so that the peeled-off area can be prevented from increasing. Accordingly, the reliability of the state of fixture of the cathode terminal to the cathode portion is improved, so that the solid electrolytic capacitor can be provided having the structure with which the reliability of the solid electrolytic capacitor can be improved.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: October 18, 2011
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Akinari Kurokawa, Yoshikazu Hirata
  • Publication number: 20110228448
    Abstract: A solid electrolytic capacitor including a capacitor element having an anode member and a cathode member, an anode terminal electrically connected with the anode member, a cathode terminal electrically connected with the cathode member, and a mold resin portion covering the capacitor element; wherein the cathode terminal has an upper step portion, a lower step portion, and a side portion, the upper step portion is connected with the cathode member, the lower step portion is exposed out of the mold resin portion, the side portion is extended along with a side surface of the cathode member from the upper step portion and is connected with the side surface, and the side portion is longer than the upper step portion, in a direction in which the cathode terminal and the anode terminal are aligned.
    Type: Application
    Filed: May 26, 2011
    Publication date: September 22, 2011
    Applicant: SANYO ELECTRIC CO., LTD
    Inventors: Keiko Matsuoka, Shoji Umeda
  • Patent number: 8023251
    Abstract: A hybrid energy storage device includes at least one cell comprising at least one positive electrode, at least one negative electrode, a separator placed between said at least one positive and said at least one negative electrode, and an electrolyte. The at least one positive electrode comprises an active material comprising lead and a tab extending from a side of the at least one positive electrode. The at least one negative electrode comprises an activated carbon material, a tab extending from a side of the at least one negative electrode, and a lead lug encapsulating said tab. A first cast-on lead strap is on the tab extending from said at least one positive electrode. A second cast-on lead strap is on the lead lug of the at least one negative electrode.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: September 20, 2011
    Assignee: Axion Power International, Inc.
    Inventors: Edward Buiel, Victor Eshkenazi, Leonid Rabinovich, Wei Sun, Vladimir Vichnyakov, Adam Swiecki, Joseph Cole
  • Patent number: 8018713
    Abstract: Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: September 13, 2011
    Assignee: NEC Tokin Corporation
    Inventors: Yuji Yoshida, Katsuhiro Yoshida, Takeo Kasuga, Masanori Takahashi, Takeshi Saito, Koji Sakata
  • Patent number: 8014129
    Abstract: A stacked solid electrolytic capacitor includes a plurality of stacked solid electrolytic capacitor elements. Each solid electrolytic capacitor element includes an anode formed of a valve action metal, an anode section formed on an end of the anode, a dielectric formed on the surface of the valve action metal and including an oxide of the valve action metal, and a cathode layer formed on the dielectric. The cathode layers and the anode sections of the solid electrolytic capacitor elements are, respectively, connected to each other across the plurality of stacked solid electrolytic capacitor elements. A conductive layer extending in the stacking direction is formed on at least part of a side face of an area where the cathode layers of the solid electrolytic capacitor elements are formed.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: September 6, 2011
    Assignee: NEC Tokin Corporation
    Inventors: Takeshi Saito, Takeo Kasuga, Koji Sakata
  • Patent number: 7969710
    Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: June 28, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
  • Patent number: 7969711
    Abstract: A Zener diode—capacitor combination wherein a Zener diode is mounted in the capacitor body and connected in parallel with the capacitor after the capacitor has been voltage tested. A welded strap or jumper wire completing the diode circuit or a connection of separate terminations during soldering may be used to complete the circuit.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: June 28, 2011
    Assignee: Kemet Electronics Corporation
    Inventors: John D. Prymak, Eric Jayson Young
  • Publication number: 20110019341
    Abstract: An object of the present invention is to provide a solid electrolytic capacitor having reduced leakage current and a manufacturing method thereof.
    Type: Application
    Filed: March 25, 2009
    Publication date: January 27, 2011
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Takashi Umemoto, Masaaki Nemoto, Hiroshi Nonoue
  • Publication number: 20100142125
    Abstract: The present invention relates to a solid electrolytic capacitor with increased capacitance. The solid electrolytic capacitor of the present invention includes a capacitor element which includes positive polarity inside and inserts an anode wire into one end while surrounding an external surface with a cathode layer; a cathode terminal electrically connected to the capacitor element by being positioned at one side of a lower part of the capacitor element; an anode terminal which includes a molding injection space on a top surface and is electrically connected to the anode wire by being positioned at the other side of the lower part of the capacitor element; and a molding unit which wraps an exterior of the capacitor element and is formed to expose bottom surfaces of the anode terminal and the cathode terminal.
    Type: Application
    Filed: February 13, 2009
    Publication date: June 10, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang KIM, Kwan Hyeong Kim, Chong Hoon Pak
  • Patent number: 7688571
    Abstract: A solid electrolytic capacitor includes a base substrate, a capacitor element, a metal cap, an extractor terminal and an insulating member. The base substrate has electrical conductivity. The capacitor element is provided on the base substrate. The metal cap is coupled to the base substrate and covers the capacitor element. The extractor terminal passes through the base substrate, is coupled to an anode of the capacitor element, and includes a first conductive member acting as a core member and a second conductive member covering the first conductive member. The insulating member is provided between the base substrate and the extractor terminal. Electrical conductivity of the first conductive member is higher than that of the second conductive member. Thermal expansion coefficient of the second conductive member is less than that of the insulating member.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: March 30, 2010
    Assignee: Nichicon Corporation
    Inventors: Hidetoshi Ishizuka, Toshiyuki Mizutani, Minoru Funahashi, Tadayuki Echigo
  • Patent number: 7619875
    Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire inserted and connected to a lower portion of the capacitor element; a cathode extraction layer formed on the capacitor element; an anode lead frame provided on one side of the lower surface of the capacitor element so as to be electrically insulated from the cathode extraction layer, the anode lead frame having an insertion portion into which a projecting lower portion of the anode wire is inserted; a cathode lead frame provided on the other side of the lower surface of the capacitor element so as to be electrically connected to the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the lower end surface of the anode wire, the lower surface of the anode lead frame, and the lower surface of the cathode lead frame; an anode lead terminal provided on the molding portion so as to be electrically connected to the lower end surface of the anode wire and the
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: November 17, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
  • Patent number: 7573699
    Abstract: A solid electrolytic capacitor, including a stack of solid electrolytic capacitor elements each having an anode part and a cathode part. The stacked structure is such that cathode parts of solid electrolytic capacitor elements are stacked one on another to have some misalignment between the stacked elements. The capacitor preferably has a structure in which one end part of the cathode part of at least one of the solid electrolytic capacitor elements stacked on another element is more prominent or retracted than that of the element below.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: August 11, 2009
    Assignee: Showa Denko K.K.
    Inventor: Tomoya Utashiro
  • Patent number: 7570480
    Abstract: A tantalum capacitor including: a capacitor body containing a tantalum powder and having a mounting surface; a cathode lead frame having the capacitor body mounted thereon; a tantalum wire having an insertion portion located inside the capacitor body and a non-insertion portion located outside the capacitor body; an anode lead frame connected to the non-insertion portion of the tantalum wire; and a resin mold surrounding the capacitor body and the tantalum wire, wherein the insertion portion of the tantalum wire has at least one bending.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: August 4, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim
  • Publication number: 20090185331
    Abstract: A solid electrolytic capacitor includes a cathode terminal structured such that the cathode terminal's flat portion connected to a cathode portion has a divided structure made up of a first flat portion and a second flat portion spaced from each other by a predetermined distance to form a slit. Therefore, even if the cathode terminal is caused to be peeled off from the cathode portion, the peeling can be restricted to only one of the first and second flat portions, so that the peeled-off area can be prevented from increasing. Accordingly, the reliability of the state of fixture of the cathode terminal to the cathode portion is improved, so that the solid electrolytic capacitor can be provided having the structure with which the reliability of the solid electrolytic capacitor can be improved.
    Type: Application
    Filed: December 29, 2008
    Publication date: July 23, 2009
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Akinari KUROKAWA, Yoshikazu HIRATA
  • Publication number: 20090154068
    Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the
    Type: Application
    Filed: January 8, 2008
    Publication date: June 18, 2009
    Inventors: Hee Sung Choi, Seoung Jae Lee, Yeoung Jin Lee, Sung Han Won, Ha Yong Jung, Hyun Ho Shin, Jung Tae Park, Jae Youn Jeong
  • Publication number: 20080247122
    Abstract: A surface mount capacitor is provided. The surface mount capacitor includes a capacitive element including an anode and a cathode, the anode having an exposed portion, an encapsulation material partially surrounding the capacitive element, a non-conductive substrate in contact with the encapsulation material, an anode termination connected to the non-conductive substrate, a cathode termination connected to the non-conductive substrate, and a first conductive path between the exposed portion of the anode and the anode termination comprising a first external conductive connection on a first external surface of the capacitor. The capacitor may also include a second conductive path between the cathode and the cathode termination. The second conductive path includes a second external conductive connection on a second external surface of the capacitor. The second conductive path may further include a conductive adhesive between the cathode and the second external conductive connection.
    Type: Application
    Filed: May 11, 2007
    Publication date: October 9, 2008
    Applicant: VISHAY SPRAGUE, INC.
    Inventors: PAVEL VAISMAN, ALEX EIDELMAN, EVGENY PETUHOV
  • Patent number: 7352562
    Abstract: A solid electrolytic capacitor includes a capacitor element 2, an anode lead terminal 3 electrically connected to an anode of the capacitor element, a cathode lead terminal 4 electrically connected to a cathode of the capacitor element, and a package 5 which is made of synthetic resin and hermetically seals the capacitor element. The lead terminals are embedded in the bottom 5a of the package with the lower surfaces of the lead terminals exposed at the bottom surface of the package. The anode lead terminal and the cathode lead terminal are respectively formed with standing pieces 8 and 9 at portions corresponding to side surfaces 5b, 5c of the package, and the standing pieces have respective outer surfaces exposed at the side surfaces of the package. This structure enhances the soldering strength and facilitates the visual inspection of the quality of the soldering.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: April 1, 2008
    Assignee: Rohm Co., Ltd.
    Inventor: Eisaku Tanaka
  • Patent number: 7327557
    Abstract: A structure and method for connecting capacitor electrodes is provided. One aspect of this disclosure relates to an apparatus for connecting cathodes. The apparatus includes a cathode layer containing an aperture, and a connection member. The connection member includes a protrusion mateable to the aperture having a length at least equal to a thickness of the cathode layer, a first flat section perpendicular to the protrusion, the first flat section having a first side attached to the protrusion and a second side including a contact surface, and a second flat section perpendicular to the first flat section, the second flat section at an offset distance from the protrusion and having a height equal to or greater than the protrusion, and where the connection member is mated to the cathode layer. Other aspects and embodiments are provided herein.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: February 5, 2008
    Assignee: Cardiac Pacemakers, Inc.
    Inventor: James M. Poplett
  • Patent number: 7321486
    Abstract: The present invention provides an electric double layer capacitor that has less chance for internal resistance increase. For this objective, in this electric double layer capacitor, an electric double layer capacitor element sandwiches a separator between a cathode and an anode, arranged inside a container comprising a lid and a concave shaped containing portion. On the inner bottom face in the containing portion, an insulating layer having a first conductive layer connected to a connecting terminal, and an opening portion penetrates to the first conductive layer are formed, wherein a second conductive layer fills inside the opening portion. Onto the insulating layer and the second conductive layer, a third conductive layer which laminates a first layer comprised of aluminum and a second layer comprised of carbon, is formed and connected to the cathode. The fourth conductive layer is connected to the anode, and also connected to the connecting terminal.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: January 22, 2008
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Masaaki Nemoto, Koji Endo, Kikuko Kato, Yasuo Nakahara, Hiroshi Nonoue
  • Patent number: 7262955
    Abstract: An anode terminal or a cathode terminal is provided with an exposure portion that extends substantially perpendicularly to an arrangement direction of the two terminals and that have an end face exposed on a side face of a housing. At least the end face on the exposure portion is plated for improving the solder wettability. Furthermore, a front end portion of the exposure portion is bent upwards along a peripheral face of the housing.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: August 28, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Hideki Ishida, Eizo Fujii, Takeshi Takamatsu
  • Patent number: 7233485
    Abstract: A solid electrolytic capacitor includes: a capacitor element including an anode made of a valve metal having an oxide film formed on a surface thereof, a cathode provided with a valve metal, and a separator provided between the anode and the cathode, the anode and the cathode and the separator being wound around together; a solid electrolyte interposed between the anode and the cathode; an anode lead tab having an oxide film formed on a surface thereof and being fixed to the anode; and a cathode lead tab fixed to the cathode. The oxide film of the anode lead tab has a portion the thickness of which is equal to or greater than 75% but less than 100% of the thickness of the oxide film of the anode.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: June 19, 2007
    Assignees: Sanyo Electric Co., Ltd., Saga Sanyo Industries Co., Ltd.
    Inventors: Kazumasa Fujimoto, Sachiko Yoshino
  • Patent number: 7221556
    Abstract: In one aspect, a method of interconnecting two or more foils of a capacitor, the method comprising connecting together one or more anode connection members of one or more anode foils and one or more cathode connection members of one or more cathode foils and electrically isolating the one or more anode foils from the one or more cathode foils.
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: May 22, 2007
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Brian L. Schmidt, Michael J. O'Phelan, Michael Krautkramer, Gregory J. Sherwood, A. Gordon Barr
  • Patent number: 7184257
    Abstract: A solid electrolytic capacitor includes a capacitor element and a board mounting the capacitor element thereon. The capacitor element includes a support made of a valve metal, and an anode and a cathode provided on the support. Anode and cathode lead conductors connected to the anode and the cathode are provided on a first principal surface of the support, and anode and cathode lands are formed on a second principal surface. A conductive portion passing through the board electrically connects either the anode lead conductor to the anode land or the cathode lead conductor to the cathode land.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: February 27, 2007
    Assignee: TDK Corporation
    Inventors: Masaaki Kobayashi, Masaaki Togashi
  • Patent number: 7177141
    Abstract: The present invention provides a solid electrolytic capacitor with low leakage current. In the solid electrolytic capacitor, an anode has an anode lead made of tantalum, a surface layer made of niobium formed on the anode lead, and a rectangular block shaped base body having a porous sintered body made from niobium particles, and the anode lead is partially embedded in the base body. Onto the anode, an oxide layer made of niobium oxide, an electrically conductive polymer layer, and a cathode laminated with a first electrically conductive layer and a second electrically conductive layer are sequentially laminated. Onto the top surface of an area surrounding the cathode, a cathode terminal is formed through an electrically conductive adhesive layer. Also, an anode terminal is connected onto an edge of the anode lead.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: February 13, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Takahisa Iida, Mutsumi Yano, Mamoru Kimoto
  • Patent number: 7161797
    Abstract: A surface mount capacitor (10) and method for making the same. A solid slug or pellet anode body (1) is encapsulated in a case (6) of insulating material. An anode and cathode termination pair (2, 3) are formed with surface mount mounting portions on one side of the case (6). An electrical connection (4) is made from the cathode termination (2) to a cathode on pellet (1) through the case (6). An electrical connection (7) is made between an anode associated with the pellet (1) and the anode termination (3) externally of the case (6). The external connection (7) allows improved volumetric efficiency by freeing up space in the case (6) for a bigger pellet (1).
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: January 9, 2007
    Assignee: Vishay Sprague, Inc.
    Inventors: Pavel Vaisman, Alex Eidelman, Yuri Stangrit, Leonid Vasserman
  • Patent number: 7139163
    Abstract: A mold member 5 packaging a capacitor element 2 is in the form of a generally rectangular parallelepiped whose length L is greater than the width W and the height H. The mold member 5 includes an opposite pair of side surfaces extending in the direction of the length L, and an anode lead terminal 3 is arranged at an anode-side one 5a of the longitudinally-extending side surfaces, whereas a cathode terminal 4 is arranged at a cathode-side one 5b of the longitudinally-extending side surfaces. The chip body 6 is in the form of a generally rectangular parallelepiped elongated in the direction of the length L of the mold member 5. The lead terminals 3 and 4 are elongated in the direction of the length L of the mold member 5. Of an opposite pair of longitudinally-extending side surfaces of the chip body 6, an anode side one 6a is provided with a plurality of anode bars 7 juxtaposed and projecting therefrom.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: November 21, 2006
    Assignee: Rohm Co., Ltd.
    Inventor: Takeshi Sawano
  • Patent number: 7139164
    Abstract: A solid electrolytic capacitor including a capacitor element having an anode body partly provided with a cathode layer, an anode-side and a cathode-side lead frame attached to a lower surface of the capacitor element, and a housing covering the lead frames and the capacitor element except lower surfaces of the lead frames. Both of the lead frames are exposed on the bottom face of the housing. The anode-side lead frame extending longitudinally of the capacitor is provided in an outer end portion thereof with at least two strips which separate each other. Outer end portions of the strips are exposed on the outer end face of the housing. A concave space is formed between the strips and is filled with resin forming the housing.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: November 21, 2006
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Kazutoyo Horio, Takayuki Matsumoto, Tetsuyuki Sakuda, Manabu Yamaguchi, Kazuhiro Aihara, Shinji Arimori
  • Patent number: 7113391
    Abstract: An anode terminal or a cathode terminal is provided with an exposure portion that extends substantially perpendicularly to an arrangement direction of the two terminals and that have an end face exposed on a side face of a housing. At least the end face on the exposure portion is plated for improving the solder wettability. Furthermore, a front end portion of the exposure portion is bent upwards along a peripheral face of the housing.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: September 26, 2006
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Hideki Ishida, Eizo Fujii, Takeshi Takamatsu
  • Patent number: 7110245
    Abstract: The present invention provides a solid electrolytic capacitor comprising a capacitor element in which a dielectric coating layer and a cathode layer are sequentially formed on a surface of an anode element having an anode lead member planted on one end surface thereof, an anode terminal connected with the anode lead member, a platy cathode terminal mounting the capacitor element thereon and connected with the cathode layer, and an enclosure resin coating the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed on a same plane from the enclosure resin. The cathode terminal is provided with a cathode exposed portion exposed from the enclosure resin in at least two locations on the same plane.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: September 19, 2006
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Hideki Ishida, Eizo Fujii, Yasuhiro Kishimoto, Hitoshi Ibuta
  • Patent number: 7038905
    Abstract: A capacitor comprises a laminate constituted by a plurality of laminated capacitor elements each including an anode terminal and a cathode terminal; and an object to be connected including a terminal having the anode terminal electrically connected thereto. The respective anode terminals of one capacitor element and another capacitor element in the laminate oppose a partial region and a region different from the partial region in the terminal of the object.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: May 2, 2006
    Assignee: TDK Corporation
    Inventors: Yumiko Yoshihara, Masaaki Kobayashi, Masaaki Togashi
  • Patent number: 7031141
    Abstract: A solid electrolytic capacitor includes a cathode including a solid electrolytic layer, an anode, and a dielectric layer provided between the cathode and the anode. The anode includes an anode body, an input anode terminal and an output anode terminal. A bypass current path for causing circuit current to detour around the anode body is formed between the input anode terminal and the output anode terminal.
    Type: Grant
    Filed: December 27, 2004
    Date of Patent: April 18, 2006
    Assignee: Rohm Co., Ltd.
    Inventor: Chojiro Kuriyama
  • Patent number: 7023690
    Abstract: A capacitor enlarging an anode electrode pattern of a substrate is provided. The capacitor comprises a capacitor device including anode and cathode parts; and a substrate including a device mounting surface formed with anode and cathode electrode patterns connected to the anode and cathode parts, respectively, and a rear face formed with anode and cathode land patterns connected to the anode and cathode electrode patterns corresponding thereto by way of anode and cathode vias extending along a thickness direction. The anode electrode pattern is integrally formed with a region including at least a part of a region corresponding to the anode land pattern and at least a part of a region corresponding to the cathode land pattern in an area of the device mounting surface of the substrate.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: April 4, 2006
    Assignee: TDK Corporation
    Inventors: Yumiko Yoshihara, Masaaki Kobayashi
  • Patent number: 6999304
    Abstract: In one aspect, a method of interconnecting two or more foils of a capacitor, the method comprising connecting together one or more anode connection members of one or more anode foils and one or more cathode connection members of one or more cathode foils and electrically isolating the one or more anode foils from the one or more cathode foils.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: February 14, 2006
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Brian L. Schmidt, Michael J. O'Phelan, Michael Krautkramer, Gregory J. Sherwood, A. Gordon Barr
  • Patent number: 6975503
    Abstract: In a chip type solid electrolytic capacitor, an anode terminal is provided with an anode terminal lower surface exposed from a package lower surface and an anode terminal end surface adjacent to the anode terminal lower surface and exposed from a first package end surface. The cathode terminal is also provided with a cathode terminal lower surface and a cathode terminal end surface. The anode terminal end surface is provided with an anode terminal dent surface upwardly extending from the boundary with the anode terminal lower surface. The anode terminal dent surface is plated. The cathode terminal end surface is also provided with a cathode terminal dent surface which is plated.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: December 13, 2005
    Assignee: NEC Tokin Corporation
    Inventors: Satoshi Abe, Masami Ishijima
  • Patent number: 6972943
    Abstract: An electronic component has a lead frame attached to an element with a conductive adhesive. The lead frame has one of a hole, cavity, cutout and groove filled with the adhesive. The lead frame may be provided with a plurality of grooves intersecting one another and divided into frame segments by the grooves.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: December 6, 2005
    Assignees: Sanyo Electric Co., Ltd., Sanyo Electronic Components Co., Ltd.
    Inventors: Kazuhiro Kato, Masaaki Kido, Yasuko Suma