Abstract: A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

Abstract: A solid electrolytic capacitor having excellent electrical characteristics due to an insulating protective layer. A water-shedding silicone rubber that cures by moisture or heat energy is coated to form the insulating protective layer on a protruding portion of a valve metal foil, at a protruding portion on the end surface of a porous valve metal body and on the surface of a dielectric layer covering the protruding portion of the valve metal foil.

Abstract: A chip type capacitor which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability, and a method for preparing the chip type capacitor and an anode terminal. The chip type capacitor has a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body. An anode terminal is electrically connected to the portion of the anode lead wire extending from the anode body. This extending portion of the anode lead wire has about 75% or more of its periphery, in the direction substantially perpendicular to the extending direction of the anode lead wire, covered with solidified matter resulting from solidification of a melt, thereby bonding the anode terminal and the anode lead wire to each other.

Abstract: An electrolytic capacitor with a further lowered impedance is provided. In the electrolytic capacitor in accordance with the present invention, respective currents directed opposite from each other flow through anode and cathode vias extending along the thickness of a substrate. The anode vias are lopsidedly located in a marginal area of an anode electrode pattern, and thus are disposed significantly close to the cathode vias formed in a cathode electrode pattern disposed close to the anode electrode pattern. The cathode vias are lopsidedly located in a marginal area of the cathode electrode pattern, and thus are disposed significantly close to the anode vias. Since the anode and cathode vias are formed close to each other as such, this electrolytic capacitor achieves a lower ESL, thereby attaining an impedance lower than that of a conventional electrolytic capacitor.

Abstract: A solid electrolytic capacitor having a solid electrolytic capacitor element having an anode part assigned to one end part of an anode substrate composed of a valve-acting metal having on the surface thereof a dielectric film layer, and a cathode part including of a solid electrolyte layer formed on the dielectric film layer in the remaining portion of the anode substrate and having an electrically conducting layer formed thereon. The anode part is connected to a lead frame via a weld metal provided on the anode part of the solid electrolytic capacitor element by irradiating the anode part with a laser ray. Also disclosed is a method of producing the solid electrolytic capacitor.

Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.

Abstract: A capacitor element includes an anode chip body formed by sintering valve metal powder, an anode wire projecting from an end surface of the anode chip body, and a ring member made of a water-repellent thermoplastic synthetic resin and fitted around a root portion of the anode wire connected to the anode chip body. The ring member is fitted and attached to the anode wire. The ring member adheres closely to both of the anode chip body and the anode wire without a gap by thermally melting the ring member in its fitted state around the anode wire.

Abstract: The present invention provides a capacitor having a plurality of layers of aluminum foil connected to a first electrical terminal of the capacitor and another plurality of layers of aluminum foil connected to a second electrical terminal of the capacitor. The layers of aluminum foil are separated by a polymer such as a conductive organic polymer, so that each layer of polymer physically separates a layer of aluminum foil connected to the first terminal from a layer of aluminum foil connected to the second terminal. In some such embodiments the aluminum foil may be etched to provide greater surface area and capacitance, and also may be oxidized to form a dielectric layer.

Abstract: In a fixing portion against which an end surface of a capacitor element abuts is provided on a portion of a cathode lead frame covered with a casing resin, the distance through which external oxygen moves to reach the capacitor element is increased by the distance of the fixing portion, whereby probability of oxidation is remarkably reduced, thus oxidation hardly occurs in the capacitor element. Further, since the capacitor element can be reliably positioned by bringing its end into abutment against the fixing portion, assembly accuracy is largely improved and the capacitor can be made compact with ease.

Abstract: A solid electrolytic capacitor comprising a capacitor element comprising a valve-acting metal substrate having on the surface thereof a dielectric film and a solid electrolytic layer provided on the dielectric film, the capacitor element provided with lead wires (lead frames), in which the bonding structure between the capacitor element and the lead frames is improved. The solid electrolytic capacitor has high strength at the bonded portion between the capacitor element and the lead frames and has excellent heat resistance and is highly reliable. Also, a method for manufacturing such a solid electrolytic capacitor is disclosed.

Abstract: In a fixing portion against which an end surface of a capacitor element abuts is provided on a portion of a cathode lead frame covered with a casing resin, the distance through which external oxygen moves to reach the capacitor element is increased by the distance of the fixing portion, whereby probability of oxidation is remarkably reduced, thus oxidation hardly occurs in the capacitor element. Further, since the capacitor element can be reliably positioned by bringing its end into abutment against the fixing portion, assembly accuracy is largely improved and the capacitor can be made compact with ease.

Abstract: This invention relates to solid electrolyte capacitors and is intended to decrease the contact resistance between the body of the capacitor and lead frames and the internal resistance of these components. The, invention provides a process for producing a solid electrolyte capacitor by forming a dielectric oxide film on an anode body of valve metal, forming a cathode layer of solid conductive substance on the oxide film to prepare a capacitor element, coating the cathode layer of the capacitor element with a carbon layer, coating the carbon layer with a silver paste layer to prepare a capacitor body, and bonding a lead frame to the silver paste layer of the. capacitor body with a silver adhesive. While the capacitor element coated with the carbon layer and a silver paste are being vibrated relative to each other, the capacitor element is dipped in the silver paste and withdrawn therefrom in the direction of the vibration, whereby the carbon layer is coated with the silver paste layer.

Abstract: A solid electrolyte capacitor has a metal case 3 housing a capacitor element 1 and closed by a hermetic seal structure. More specifically, the case 3 has an opening closed with a seal plate 4 of nickel alloy. The capacitor element 1 has a pair of lead wires 15, 15 which are joined at their outer end faces respectively to lower end faces of a pair of lead pins 2, 2 by resistance welding. The lead pins 2, 2 are inserted through holes 41, 41 in the seal plate 4, with an insulating glass seal 5 filled in a clearance in each of the holes 41, 41 around the lead pin 2. The opening-defining edge of the case 3 and the outer peripheral edge of the seal plate 4 are joined to each other by resistance welding. Consequently, the capacitor retains high reliability over a prolonged period of time.

Abstract: A current collector for use in an electric double-layer capacitor is constructed such that it is held in intimate contact with the electrodes thereby reducing the internal resistance and providing for better charging and discharging characteristics. The current collector includes an electrically conductive metal foil having a plurality of through holes defined therein and a plurality of pointed bars projecting from edges of each of the through holes perpendicularly to the electrically conductive metal foil. The pointed bars extend through electrodes disposed on opposite surfaces of the current collector. Distal end portions of the pointed bars are bent over against the outer surfaces of the electrodes. The bent distal end portions hold the electrodes under pressure against the current collector so that the current collector and the electrodes are tightly fastened together. Preferably, the electrically conductive foil includes aluminum foil and each of the electrodes contains activated carbon.

Abstract: A circuit is provided which incorporates a solid electrolytic capacitor between a power source and a load. The capacitor comprises: a capacitor element including a chip body and an anode wire projecting from the chip body; an anode lead electrically connected to the anode wire; a cathode lead paired with the anode lead and electrically connected to the chip body; an auxiliary lead separate from the anode and cathode leads; a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and part of the auxiliary lead; and a fuse wire for electrically connecting the auxiliary lead to the anode lead within the resin package. Each of the anode, cathode and auxiliary leads has an inner end located in the resin package, and an outer end projecting from the resin package. Further, the anode lead of the capacitor is electrically connected to the power source without intervention of any other electronic element.

Abstract: A package-type solid electrolytic capacitor is provided which comprises: a capacitor chip having a first end and a second end opposite to the first end, the chip being formed with a cathode terminal coating at least covering the second end; an anode wire partially projecting from the first end of the chip; a plate-like metal anode lead having an inner end electrically connected to the anode wire; a plate-like metal cathode lead having an inner end electrically connected to the cathode terminal coating of the chip; and a resin package enclosing the capacitor chip, the anode wire and the inner ends of the anode and cathode leads. The cathode lead has a wider portion projecting out of the resin package, and the inner end of the cathode lead is narrower and held in abutment with and electrically connected to the cathode terminal coating at the second end of the chip.

Abstract: Provided is a solid electrolytic capacitor including a capacitor element, an internal anode lead extending from a substantially central portion of one lateral surface of the capacitor element, other surfaces of the capacitor element normal to the lateral surface being adapted to serve as cathode terminal walls, an external anode lead connected to the internal anode lead, an external cathode lead connected to one of the cathode terminal wall, and a resin mold encapsulating the capacitor element as well as connecting portions associated therewith, wherein the external anode lead connected to the internal anode lead is bent to have at least two steps at its end portion, a lower step of said at least two steps being fixed to another one of the cathode terminal walls through an insulating material, an upper step of said at least two steps being fixed to the internal anode lead.

Abstract: A surface mounting type polar electronic component is provided which comprises a polar element electrically connected to a positive lead and a negative lead, and a package enclosing the polar element together with part of the respective leads, the package having a mounting face. The leads have respective contact ends bent substantially in parallel to the mounting face of the package for contact with corresponding electrode pads of a circuit board. One of the leads has a projection extending beyond the contact end of said one lead for insertion into an insertion hole formed at a relevant one of the electrode pads.

Abstract: A solid electrolytic capacitor of the type having a built-in fuse is disclosed in which a connecting portion between the fuse and a capacitor element is made thin and securely formed to accommodate the capacitor element to be increased in capacitance without changing the outer size of a resin package. The solid electrolytic capacitor including a capacitor element, an internal anode lead extending from one surface of the capacitor element, other surfaces of the capacitor element serving as a cathode terminal wall, an external anode lead connected to the internal anode lead, an external cathode lead connected to the cathode terminal wall through a fuse, and a resin package encapsulating the capacitor element, the fuse and respective connecting portions of the external anode lead and the external cathode lead.

Abstract: A chip-type solid electrolytic capacitor includes a cathode conductive layer provided on a whole surface of a cathode layer formed on an outer surface of a capacitor element, which whole surface is opposite to a surface where an anode lead wire is lead out, and on a surface adjacent to the first-mentioned whole surface. With this arrangement, if the capacitor element is obliquely inserted into a mold during the formation of a resin shell, the inner walls of the mold will not come into contact with cathode layer of the capacitor element, but will instead come into contact with the cathode conductive layer to prevent the cathode layer from being exposed to the resin shell. As a result, any possible damage to the cathode layer of the capacitor element when the peripheral surface of the resin shell on a cathode side is subjected to roughening is prevented to eliminate defects in electric characteristics such as leakage of electric current and a tan.delta. value.