Casing Patents (Class 361/535)
  • Patent number: 7206193
    Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: April 17, 2007
    Assignees: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.
    Inventors: Toshihisa Nagasawa, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai
  • Patent number: 7193840
    Abstract: A solid electrolytic capacitor having a plurality of capacitor elements is provided that is small in size and has good electrical characteristics. The solid electrolytic capacitor includes a plurality of capacitor elements each having a dielectric film, a cathode layer, and a cathode lead-out layer formed in succession on a surface of an anode body having an anode lead part, each anode lead part of the capacitor elements connected to an anode terminal, each cathode lead-out layer of the capacitor elements connected to a cathode terminal, and the plurality of capacitor elements covered by a housing made of resin. The capacitor elements 1 are mounted on the cathode terminal 2 at an interval, the cathode terminal 2 is provided with a cathode resin-filling opening 2a, and the resin is filled between the capacitor elements 1 and in the cathode resin-filling opening 2a.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: March 20, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Yasuko Ohtsu
  • Patent number: 7141332
    Abstract: The present invention pertains to lightweight, hard and leakproof prismatic packaging structures for electrochemical devices and economical method of assembly and hermetic sealing of said structures by plastic layers attached to their metal walls. Metal welding is avoided and superior protection of lithium polymer cells and other cells is thus provided at lesser cost.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: November 28, 2006
    Inventors: Joseph B. Kejha, David Chua, Hsiu-Ping Lin
  • Patent number: 7135754
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: November 14, 2006
    Assignees: Nec Tokin Corporation, Nec Tokin Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
  • Patent number: 7125429
    Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
    Type: Grant
    Filed: January 19, 2004
    Date of Patent: October 24, 2006
    Assignee: Kemet Electronics Corporation
    Inventors: Brian John Melody, John Tony Kinard, Daniel F. Persico, Chris Stolarski, Phillip Michael Lessner, Qingping Chen, Kim Pritchard, Albert Kennedy Harrington, David Alexander Wheeler
  • Patent number: 7119663
    Abstract: A remote control key that may easily be disassembled while preventing theft of its transponder. The remote control key includes a transmitter for transmitting a signal to remotely control locking and unlocking of a door. The transponder transmits a predetermined ID code. A housing retains the transmitter and the transponder. A pad is formed on the housing to operate the transmitter. A seal seals the transponder that is retained in the housing. The seal and the pad are formed from the same material.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: October 10, 2006
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventors: Toshiharu Katagiri, Yoshihiro Kawai
  • Patent number: 7113391
    Abstract: An anode terminal or a cathode terminal is provided with an exposure portion that extends substantially perpendicularly to an arrangement direction of the two terminals and that have an end face exposed on a side face of a housing. At least the end face on the exposure portion is plated for improving the solder wettability. Furthermore, a front end portion of the exposure portion is bent upwards along a peripheral face of the housing.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: September 26, 2006
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Hideki Ishida, Eizo Fujii, Takeshi Takamatsu
  • Patent number: 7107099
    Abstract: A flat capacitor includes a case having a feedthrough hole, a capacitor stack located within the case, a coupling member having a base surface directly attached to the capacitor stack and having a portion extending through the feedthrough hole, the coupling member having a mounting hole, a feedthrough conductor having a portion mounted within the mounting hole, and a sealing member adjacent the feedthrough hole and the feedthrough conductor for sealing the feedthrough hole. Other aspects of the invention include various implantable medical devices, such as pacemakers, defibrillators, and cardioverters, incorporating one or more features of the exemplary feedthrough assembly.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: September 12, 2006
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Michael J. O'Phelan, Richard J. Kavanagh, James M. Poplett, A. Gordon Barr, Brian D. Schenk, Brian L. Schmidt
  • Patent number: 7085126
    Abstract: A polymeric cradle molded about the periphery of an anode pellet in an electrolytic capacitor is described. The polymeric cradle contacts between a welding strap surrounding the butt seam between mating “clam shell” casing portions and the anode pellet sidewall. This prevents the anode pellet from moving along both an x- and y-axes. Having the cathode active material contacting the opposed major casing sidewalls being in a closely spaced relationship with the anode pellet through an intermediate separator prevents movement along the z-axis. The resulting capacitor is particularly well suited for use in high shock and vibration conditions.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: August 1, 2006
    Assignee: Wilson Greatbatch Technologies, Inc.
    Inventors: Barry Muffoletto, Laurie O'Connor
  • Patent number: 7075777
    Abstract: One embodiment of the present subject matter includes a capacitor, comprising a first cupped shell having a first opening, and a second cupped shell having a second opening, wherein the first opening and the second opening are adapted to sealably mate to form a closed shell defining a volume therein. In the embodiment, the closed shell is adapted for retaining electrolyte. A plurality of capacitor layers in a substantially flat arrangement are disposed within the volume, along with electrolyte, in the present embodiment. The present closed shell includes one or more ports for electrical connections.
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: July 11, 2006
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Brian Doffing, James A. Taller, Gregory J. Sherwood, Jason A. Shiroff
  • Patent number: 7019960
    Abstract: The invention provides an electric double-layer capacitor sealed up by a flexible casing material that ensures a release of pressure upon an increasing internal pressure. A pressure release valve (1) is attached to the flexible casing material. The pressure release valve (1) comprises a collar airtightly joined to the flexible casing material and a cylindrical portion (3) connected to the collar, extending out of a capacitor enclosure. The cylindrical portion (3) comprises an end part (5) having a self-closing passage (6) that is opening to the outside only upon a pressure release and is closed up in a normal state, and a channel (4) in communication with the interior of the capacitor enclosure.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: March 28, 2006
    Assignees: Power Systems Co., Ltd., Japan Gore-Tex Inc., Kokoku Intech Co., Ltd.
    Inventors: Michio Okamura, Hitoshi Nakamura, Kotaro Kobayashi
  • Patent number: 7016178
    Abstract: A housing for an electrochemical cell having at least a first electrode and a second electrode. The housing includes a lid having a first indentation to contact the first electrode, and a bottom having a second indentation to contact the second electrode. The first indentation has a first cross-section and the second indentation has a second cross-section. The first cross-section and the second cross-section get narrower as the first indentation and the second indentation progress into an interior of the housing.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: March 21, 2006
    Assignee: EPCOS AG
    Inventors: Werner Erhardt, Hubertus Goesmann, Gerhard Niederberger, Stefan Nowak, Klaus Schoch
  • Patent number: 7012799
    Abstract: An enclosure for an electrical energy storage device such as a wet tantalum electrolytic capacitor or an electrochemical cell such as a lithium/silver vanadium oxide cell is described. The enclosure comprises two metallic casing components or portions. The first is a drawn member having a planar face wall supporting a surrounding sidewall and is shaped to nest the anode, cathode and intermediate separator components. The surrounding sidewall has an annular flange at its outer periphery. A mating cover is a stamped planar piece of similar material whose periphery fits inside the annular flange or rim as a complementary piece.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: March 14, 2006
    Assignee: Wilson Greatbatch Technologies, Inc.
    Inventors: Barry Muffoletto, Edward J. Gloss, Douglas Eberhard, Joseph Spaulding, Yanming Liu, Neal Nesselbeck, Louis Marinaccio, Eric Stemen, Rodney Stringham
  • Patent number: 6961232
    Abstract: An electrolytic capacitor with a polymeric housing in the form of a pocket defining a chamber, with an opening along a selected edge. The opening has opposed sides that are sealed together to provide a seam. A number of conductive layers are positioned within the chamber, and a feed-through conductor element has a first end electrically connected to the layers. An intermediate portion of the feed through passes through the seam, and an external portion extends from the housing. The housing may be vacuum formed high density polyethylene, with the feed-through contained in an elastomeric sleeve having a flattened cross section to be readily received in the seam, and to accommodate thermal expansion differences between the housing and the feedthrough. The device may be manufactured by inserting a stack of layers in the pocket, and thermally welding across the opening of the pocket on a single weld line.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: November 1, 2005
    Assignee: Pacesetter, Inc.
    Inventor: Dean F. Carson
  • Patent number: 6952046
    Abstract: A package including a substrate, a plurality of components on the substrate, and a lid assembly including a plurality of integrated covers for at least select components on the substrate. A method of manufacturing such a lid assembly is also disclosed as is a packaging method.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: October 4, 2005
    Assignee: Foster-Miller, Inc.
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor
  • Patent number: 6898066
    Abstract: The present invention relates to a structure of chip type electrolytic capacitor, which comprises a casing cover and a partition to separate space of casing cover into a dielectric chamber and a buffer chamber, a dielectric which includes lead pins, holes on the partition for the lead pins pass through. The dielectric is installed in the dielectric chamber, and lead pins pass through the holes on partition and extend to the buffer chamber. The buffer chamber is sealed with a bottom cover which also includes holes for lead pins. A stuff of epoxide is filled into the buffer chamber to fix the dielectric and its lead pins. A top cover is to seal the dielectric chamber for filling electrolyte. The casing cover is made with high strength engineering plastic by plastic injection machine. A supersonic welding and the epoxide adhesive solidification package technologies replace rubber packing.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: May 24, 2005
    Inventor: Chieh-Fu Lin
  • Patent number: 6882521
    Abstract: A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: April 19, 2005
    Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.
    Inventors: Makoto Tsutsui, Toshihisa Nagasawa
  • Patent number: 6855885
    Abstract: A housing for an electrical component includes an electrically conductive cup which includes a wall, a floor, and a cover having electrical terminals. The housing also includes an electrically insulating coating applied to an outside of the floor and adjoining regions of the wall, and an electrically insulating covering which covers the wall at least partially and which overlaps the electrically insulating coating. The electrically insulating covering is on the electrically insulating coating and does not coat the floor. A mounting plate is also included on which the floor is positioned.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: February 15, 2005
    Assignee: Epcos AG
    Inventor: Wilhelm Schweikert
  • Patent number: 6850405
    Abstract: New designs that provide two anodes and their associated feedthroughs incorporated into one capacitor are described. The feedthrough wires can be in their own glass-to-metal seal or, they can be combined into one glass-to-metal seal as long as they are electrically insulated from each other. One embodiment has the anode feedthroughs left unconnected, while in other embodiments; they are joined externally of the capacitor casing. Several interconnect designs are described.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: February 1, 2005
    Assignee: Wilson Greatbatch Technologies, Inc.
    Inventors: Richard Mileham, Eric Stemen, Laurie O'Connor, William Elliott, Joseph E. Spaulding, Barry C. Muffoletto, Douglas Eberhard
  • Patent number: 6845004
    Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: January 18, 2005
    Assignee: Kemet Electronics Corporation
    Inventors: Brian John Melody, John Tony Kinard, Daniel F. Persico, Chris Stolarski, Phillip Michael Lessner, Qingping Chen, Kim Pritchard, Albert Kennedy Harrington, David Alexander Wheeler
  • Patent number: 6831827
    Abstract: A family of spacers of various sizes for securing a standardized terminating electrical protection device (such as one of the “snap-cap” type) to an electrical energy power source (i.e., a lithium electrochemical cell) is described. The terminating protection device is mounted on a header for an electrochemical cell and contains a circuit board provided with electrical components, such as diodes and fuses. The function of the circuit board is generally to protect the cell from being overcharged or too rapidly discharged, and the like. The spacers are sized to take up the space between the edge of the cell and the edge of the terminating protection device. That way, only variously sized spacers need to be stocked. The spacers are relatively simple to manufacture and inexpensive to stock.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: December 14, 2004
    Assignee: Wilson Greatbatch Technologies, Inc.
    Inventor: Robert Zayatz
  • Patent number: 6826034
    Abstract: An electrochemical cell includes an electrode stack and a housing that is substantially cylindrical in shape and that holds the electrode stack. The housing has an indentation that forms a substantially flat contact area with the electrode stack. A method for producing the electrochemical cell includes inserting the electrode stack into the housing, bringing a die into contact with the housing, the die having a head with at least three contact points that come into contact with the housing, and stamping the die onto the housing to form the indentation.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: November 30, 2004
    Assignee: EPCOS AG
    Inventors: Rainer Hebel, Rudolf Wittman, Norbert Will
  • Patent number: 6819545
    Abstract: A capacitor including an expandable part fabricated on a capacitor housing is enclosed. The expandable part is expandable by a fault that occurs within the capacitor housing, thereby extending the capacitor housing to contact with an external interrupter. The external interrupter includes an external electrode and an external sensing circuit. The external sensing circuit detects a contact between the capacitor housing and the external electrode and sends a signal to disconnect the capacitor from an apparatus circuit.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: November 16, 2004
    Assignee: Parallax Power Components, LLC
    Inventors: Edward M. Lobo, Francis Mello
  • Patent number: 6819546
    Abstract: A solid electrolytic capacitor is provided which includes a capacitor element having an anode and a cathode, a sheet member for mounting the capacitor element, and a protection package formed on the sheet member to enclose the capacitor element. The sheet member is provided with an anode terminal and a cathode terminal which are connected to the anode and the cathode, respectively.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: November 16, 2004
    Assignee: Rohm Co., Ltd.
    Inventor: Chojiro Kuriyama
  • Patent number: 6813140
    Abstract: The present invention seeks to provide improved solid state capacitors and improved methods of manufacturing such capacitors. According to one aspect of the present invention solid state capacitors are manufactured by providing an electrically conducting substrate and forming a plurality of porous bodies comprising valve action materials on a substrate surface where each body has an upper surface distal to the substrate. An electrically insulating layer is formed over the bodies with a conducting cathode layer being formed over the insulating layer. The substrate is divided into a plurality of capacitor portions where each capacitor portion comprises a body portion and a substrate portion. The end region of each body portion distal from the substrate is provided with a platform that is a cathode terminal site in the final capacitor.
    Type: Grant
    Filed: October 2, 2002
    Date of Patent: November 2, 2004
    Assignee: AVX Limited
    Inventor: David Huntington
  • Patent number: 6813139
    Abstract: A method of making a double layer capacitor, in accordance with one embodiment, includes coupling a top collector disk to a proximal end of a double layer capacitor electrode assembly; electrically coupling a bottom collector disk to a distal end; heating a can; inserting the double layer capacitor electrode assembly into the can; cooling the can, wherein a peripheral edge of the bottom collector disk is coupled to the can as the diameter of the can is decreased; forming a bead around an exterior of the can; heating a lid; placing a concave structure of the lid in juxtaposition with a convex structure on the top collector disk; cooling the lid, wherein the concave structure is coupled to the convex structure as the diameter of the can is decreased; creating a seal between the lid and the can; and placing an electrolyte solution into the electrode assembly.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: November 2, 2004
    Assignee: Maxwell Technologies, Inc.
    Inventors: Priya Bendale, Manuel R. Malay, John M. Dispennette, Chenniah Nanjundiah, Frederic Spiess
  • Patent number: 6801424
    Abstract: A capacitor structure comprises a shallow drawn case having a first major side and a peripheral wall extending therefrom, the first major side having a first interior surface and the wall having a peripheral interior surface. A lid is sealingly coupled to the case along adjacent edges of the lid and the wall, the lid and said case forming an encasement of the capacitor structure, the lid comprising a second interior surface. A cathode material is disposed proximate the first and second interior surfaces, and an anode is positioned intermediate the cathode material and has a peripheral portion positioned proximate the adjacent edges. A protective layer on the peripheral portion protects the anode during the sealing process. A first insulative separator is positioned between the anode and the cathode material.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: October 5, 2004
    Assignee: Medtronic, Inc.
    Inventors: Christian S. Nielsen, Mark Edward Viste, Anthony W. Rorvick, David P. Haas, Joachim Hossick-Schott, John D. Norton, Timothy T. Bomstad, Kurt J. Casby
  • Publication number: 20040142190
    Abstract: The present invention provides a casing material for an electronic component which has a good adhesion with an aluminum foil and a resin layer, impermeability of steam, heat seal property, and corrosion resistance for an electrolyte. The present invention also provides a casing for an electronic component using the casing material. The present invention also provides an electronic component including the casing. The casing material comprises a heat resistant resin drawn film layer as an outer layer, a thermoplastic resin not-drawn film as an inner layer, and an aluminum foil layer provided between the layers. In particular, an acrylic polymer layer is provided between the aluminum foil layer and the not-drawn film layer.
    Type: Application
    Filed: October 7, 2003
    Publication date: July 22, 2004
    Inventors: Hideo Kawai, Katsumi Tanaka, Takahiro Aoyama, Mitsuo Nakazaki
  • Patent number: 6744620
    Abstract: A capacitor comprises an anode body that is surrounded by a housing, an anode contact projecting out of the inside of the anode body, and a cathode contact proceeding along the upper side of the anode body, this cathode contact having its housing side coated with an adhesion layer. As a result of the adhesion layer, the risk of the formation of bubbles and, thus, the risk of a tearing of the housing is alleviated.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: June 1, 2004
    Assignee: EPCOS AG
    Inventors: Thomas Hipp, Peter Berendt
  • Patent number: 6719813
    Abstract: A solid electrolytic capacitor having (A) a capacitor element including an oxide layer 1 formed on a part of an outer surface of a valve metal anode body, a solid electrolyte layer 2 formed on the oxide layer layer, and a cathode conductor layer 3 formed on the solid electrolyte layer, and an anode lead out area on a remaining part of the anode body, (B) lead terminals connected to the cathode and the anode lead out area of the capacitor element, and (C) a packaging resin encapsulating the capacitor element with parts of the lead terminals exposed outside. The solid electrolytic capacitor has a first separation strip 6 and a second separation strip 7 formed on a part of the roughened surface layer and also has insulating material 8 on the respective surfaces of the first and the second separation strips.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: April 13, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshikuni Kojima, Kenji Kuranuki, Kazuo Tadanobu, Takuhisa Sugimoto, Yasuhiro Kobatake
  • Publication number: 20040018425
    Abstract: The present invention pertains to lightweight, hard and leakproof prismatic packaging structures for electrochemical devices and economical method of assembly and hermetic sealing of said structures by plastic layers attached to their metal walls. Metal welding is avoided and superior protection of lithium polymer cells and other cells is thus provided at lesser cost.
    Type: Application
    Filed: July 23, 2002
    Publication date: January 29, 2004
    Inventors: Joseph B. Kejha, David Chua, Hsiu-Ping Lin
  • Patent number: 6620366
    Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Cool Options, Inc.
    Inventor: E. Mikhail Sagal
  • Patent number: 6590761
    Abstract: A capacitor includes a capacitor element having leads accommodated along with electrolyte solution in a metallic case, and a sealing plate that seals the opening of the metallic case. In the capacitor, a center axis of a threaded portion provided in a terminal block on the sealing plate is constituted to be parallel to a planar portion of the sealing plate. Hence, the center axis of the threaded portion is vertical to a circuit board when mounting the capacitor onto the circuit board. Thereby, a series of operation from the insertion to the tightening of the mounting screw is done very easily.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: July 8, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisao Miyazawa, Tsuyoshi Yoshino
  • Patent number: 6576524
    Abstract: A method of making a flat capacitor includes forming at least one recess on an inside surface of a metal foil blank, leaving a surrounding peripheral flange. A coating performing as an electrode of the capacitor is applied to the inside surface of the metal foil blank and an ion-permeable separator is placed on that inside surface of the metal foil blank. A substantially planar anode with a protruding lead is placed in the recess with the lead extending through a hole of the metal foil blank. Thereafter, the metal foil blank is folded along a line intersecting the hole so that the anode is sandwiched between parts of the separator and the separator is in contact with the coating on the inside surface of the metal foil blank. In the folding process, parts of the peripheral flange of the metal foil blank are brought into contact with each other and these parts are sealed to each other to form a hermetically sealed metal foil case of the capacitor.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: June 10, 2003
    Assignee: Evans Capacitor Company Incorporated
    Inventors: David A. Evans, Ross Blakeney
  • Patent number: 6576026
    Abstract: The present invention provides an electrolytic capacitor and its anode body using a laminate of plurality of sheets of valve metal foil, exhibiting excellent high-frequency response and lower inner impedance as a electrolytic capacitor. The anode body for a electrolytic capacitor includes; a laminate of plurality of rectangular anode valve metal foil each which has dielectric layers of its metal oxide film anodized on roughened surfaces of each anode valve metal foil; and a fixing frame to clamp the laminate in the laminating direction to fix the laminate and connect electrically with anode layers of the laminated foil. Such an anode body may be used to be filled in the liquid electrolyte in the container to make a capacitor.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: June 10, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seigo Shiraishi, Emiko Igaki, Masakazu Tanahashi
  • Patent number: 6556425
    Abstract: A simpler, lower-cost way of installing polymer capacitor canisters on motors and other equipment. A bracket and/or fastener is attached to the canister (e.g., by ultrasonic welding a polymer fastener or bracket directly to the polymer canister), and the fastener and/or bracket are used to make the connection between the canister and the equipment. E.g., fasteners may be chosen so that they mate with holes or matching fasteners on the equipment to which the capacitor is being attached. Depending on choice of fastener, installation of the capacitor becomes a simple snap-in action. The capacitor manufacturer can now easily manufacture capacitors with a wide range of built-in fastener arrangements, relieving the equipment manufacturer of most of the work formerly associated with installing a capacitor on equipment.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: April 29, 2003
    Assignee: Parallax Power Components
    Inventors: Martin Hudis, Glenn Grenier, David Jenkins
  • Patent number: 6522520
    Abstract: An apparatus cover case structure which includes a sheet-like core layer which includes an electric element, laminate film layers which are respectively arranged on upper and lower surfaces of the core layer, and cover case layers which are respectively arranged on an upper surface of the upper laminate film layer and a lower surface of the lower laiminate film layer, thereby to form a sandwich structure. The apparatus cover case structure can make an electronic apparatus, such as portable telephone, smaller in size, lighter in weight and thinner in structure.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: February 18, 2003
    Assignee: Nokia Corporation
    Inventor: Kenichi Hashizume
  • Patent number: 6507482
    Abstract: There is provided a structure for mounting an electronic part, including (a) an electronic part in the form of a chip, (b) a resin block entirely covering the electronic part therewith, and (c) a pair of electrodes electrically connected to the electronic part and extending outwardly of the resin block, the electronic part being deviated in position in a direction relative to a center of the structure, the resin block being formed with a raised portion extending downwardly from a bottom surface of the resin block, the resin block having a tapered portion between a top surface of the raised portion and the bottom surface of the resin block in the direction.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: January 14, 2003
    Assignee: NEC Tokin Toyama, Ltd.
    Inventors: Daisuke Harada, Masahiko Tanaka
  • Publication number: 20030008531
    Abstract: In a method of manufacturing an aluminum solid electrolyte capacitor, mass-production of aluminum solid electrolyte capacitors with high reliability and excellent quality is made possible by adopting a sequence of steps whereby it is ensured that no stress is applied to the capacitor body (for example coiled element), and by providing means that make possible implementation of these steps. A capacitor body 1 is inserted into a case 3 having a first aperture 3A that is open at the bottom and a second constricted aperture 3B at the top, via the first aperture 3A, and sealing and fixing are performed by a sealant 5 consisting of an epoxy resin, then the capacitor body 1 is coated or impregnated by introducing 3,4-ethylenedioxy-thiophene through the second aperture 3B, then solid electrolyte constituted by poly(3,4-ethylenedioxy-thiophene) is generated by an oxidative polymerization reaction, after which the second aperture 3B is sealed.
    Type: Application
    Filed: July 5, 2001
    Publication date: January 9, 2003
    Applicant: SHOEI CO., LTD.
    Inventor: Hitoshi Narusawa
  • Publication number: 20020148107
    Abstract: This invention relates to a graphite and/or carbon black-containing cathode coating dispersion which is suitable for battery production. The dispersion is water, acid and alkali resistant and also electrically conductive when coated on cathode surfaces. The dispersion is a water-based system which contains a binder which is an epoxy resin and is cured with an amine curative. The dispersion is maintained as a two-pot compound wherein the epoxy dispersion is mixed with an amine curative at the time of application. The epoxy resins are preferably a Bisphenol A or Bisphenol F Epichlorohydrin based epoxy or epoxy novalac.
    Type: Application
    Filed: January 9, 2001
    Publication date: October 17, 2002
    Inventor: Marufur Rahim
  • Patent number: 6459566
    Abstract: An implantable medical device such as a defibrillator is described. The device includes an hermetically sealed housing containing a flat electrolytic capacitor and an energy source such as a battery. The battery is connected to the capacitor and provides charge thereto. The capacitor stores the charge at a relatively high voltage. The charge stored in the capacitor is discharged through a defibrillation lead to a site on or in the heart when fibrillation of the heart is detected by the implantable medical device. Methods of making and using the implantable medical device, the capacitor, and their various components are disclosed.
    Type: Grant
    Filed: May 19, 2000
    Date of Patent: October 1, 2002
    Assignee: Medtronic, Inc.
    Inventors: Kurt J. Casby, Mark D. Breyen, William L. Johnson, Thomas M. Nutzman, Anthony W. Rorvick, Thomas P. Miltich
  • Patent number: 6442014
    Abstract: A chip type capacitor having a casing cover, a dielectric, an elastomer, and a cover plate. The casing cover is formed as the outer casing of a capacitor. An open receiving chamber is provided in the casing cover. A plurality of lines capable of being broken are formed at a bottom of the casing cover. The dielectric is received in the receiving chamber of the casing cover. The dielectric has two lead pins. The elastomer has two first through holes. The lead pins pass through the first through holes of the elastomer so that the elastomer covers the dielectric. The cover plate has two second through holes. The lead pins of the dielectric pass through the second through hole of the cover plate so that the cover plate covers the elastomer. An outer diameter of the elastomer is slightly larger than the inner diameter of an inner wall of the receiving chamber. The elastomer is compressed by a fixture and then the elastomer is placed in the receiving chamber for enhancing the sealing of the capacitor.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: August 27, 2002
    Inventor: Chieh-Fu Lin
  • Patent number: 6440179
    Abstract: A packaging method for electric power storage units of an ultracapacitor energy storage device. An electrolyte solution is filled directly during the process of stacking electrodes so as to omit the steps of partially forming and enclosing a refill port. Thus, the fabrication process can be effectively simplified and the production efficiency can be increased. First, an annular glue wall is coated along the border of the top surface of a first electrode. The electrolyte solution is filled on the top surface of the first electrode enclosed by the annular glue wall. A second electrode is then stacked over the first electrode. The annular glue wall is heated to bind the first electrode, the second electrode, and the annular glue wall, thus enclosing the electrolyte solution between the first electrode and the second electrode.
    Type: Grant
    Filed: February 23, 2001
    Date of Patent: August 27, 2002
    Assignee: National Energy Technology Co., Ltd.
    Inventors: Chang-Chen Yang, Wei-Te Pong, Yung-Shang Huang, Keh-Chi Tsai, James M. Lawson
  • Patent number: 6430024
    Abstract: The disclosure is for a capacitor cooled by a heat pipe. The capacitor casing is constructed with an open tube inserted through the casing wall and into which is inserted a simple cylindrical heat pipe. The heat pipe may terminate at the casing wall which then acts as a heat transfer surface, or a portion of the heat pipe which extends beyond the end of the capacitor can be attached to an external heat transfer device, such as a heat conductive mounting plate or a cooling fin assembly.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: August 6, 2002
    Assignee: Thermal Corp.
    Inventor: Nelson J. Gernert
  • Patent number: 6423104
    Abstract: A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.
    Type: Grant
    Filed: November 15, 2000
    Date of Patent: July 23, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Minoru Omori, Yoshitsugu Uenishi, Osamu Tomita, Nario Kawakita, Masakuni Ogino, Yoji Masuda, Tsuyoshi Yoshino
  • Patent number: 6411499
    Abstract: A capacitor includes a pellet molded within a protective material and having a cathode termination surface at one end and an anode wire extending from the other end. The cathode termination surface is centered with respect to the longitudinal axis of the capacitor. The method includes centering the pellet body and a tear drop shaped conductive cathode element within a mold and molding a protective coating around them. After the molding is complete a portion of the tear drop shaped member is removed to create a cathode termination.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: June 25, 2002
    Assignee: Vishay Sprague, Inc.
    Inventors: Tibor Kormendy, Michel J. Richard, John Y. Cadwallader, Kyle E. Clark
  • Patent number: 6400555
    Abstract: An arrangement for fastening a capacitor to an electrotechnical device and for protecting the capacitor from stresses caused by the environment. The arrangement includes a disk-like frame, one or more openings pierced in the frame, a capacitor to be fastened to each opening and one or more substantially hollow domed fastening and protection means, inside of which one of the capacitors is arranged, wherein each of the fastening and protection means is arranged into one of the openings in the frame.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: June 4, 2002
    Assignee: Vacon Oyj
    Inventors: Osmo Miettinen, Jukka Jaskari
  • Patent number: 6368364
    Abstract: A capacitor includes a pellet molded within a protective material and having a cathode termination surface at one end and an anode wire extending from the other end. The cathode termination surface is centered with respect to the longitudinal axis of the capacitor. The method includes centering the pellet body and a tear drop shaped conductive cathode element within a mold and molding a protective coating around them. After the molding is complete a portion of the tear drop shaped member is removed to create a cathode termination.
    Type: Grant
    Filed: May 23, 2000
    Date of Patent: April 9, 2002
    Assignee: Vishay Sprague, Inc.
    Inventors: Tibor Kormendy, Michel J. Richard, John Y. Cadwallader, Kyle E. Clark
  • Patent number: 6366446
    Abstract: An aluminum electrolytic capacitor assembly for use on a mounting plate includes an aluminum electrolytic capacitor fitted in a metallic housing which in places has insulation composed of shrink sleeving. The aluminum electrolytic capacitor assembly is intended for use on a mounting plate. The shrink sleeving extends into the vicinity of the cup base, and a plastic cap is arranged on the cup base for insulation.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: April 2, 2002
    Assignee: Epcos AG
    Inventors: Wilhelm Schweikert, Rainer Hebel
  • Patent number: 6356431
    Abstract: A structure of connection pins of a capacitor includes a housing, connection pins positioned at the lateral sides of the interior of the housing, and a capacitor element located between two pins, and the remaining space of the housing being filled with fixing glue, characterized in that one opening of the housing holds the capacitor element at a larger surface thereof and the two pins are located at the sides of the housing a plurality of elastic plates with a slanting angle are provided to the connection pins, and the lower section of the connection pins are bent to form a contact plate for contacting with a circuit board, the contact plate is a hook-like structure and is provided with solder at appropriate position, an insertion leg is provided on the contact plate for mounting with the circuit board, thereby the elastic plate clips the capacitor element to provide a good position and stable contact.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: March 12, 2002
    Inventors: Ming Chang Lin, Su-Chin Lai