Abstract: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire inserted and connected to a lower portion of the capacitor element; a cathode extraction layer formed on the capacitor element; an anode lead frame provided on one side of the lower surface of the capacitor element so as to be electrically insulated from the cathode extraction layer, the anode lead frame having an insertion portion into which a projecting lower portion of the anode wire is inserted; a cathode lead frame provided on the other side of the lower surface of the capacitor element so as to be electrically connected to the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the lower end surface of the anode wire, the lower surface of the anode lead frame, and the lower surface of the cathode lead frame; an anode lead terminal provided on the molding portion so as to be electrically connected to the lower end surface of the anode wire and the

Abstract: An apparatus comprising a capacitor stack, including one or more substantially planar anode layers, and one or more substantially planar cathode layers. Additionally, the capacitor has a case having a first opening and a second opening, the first opening sized for passage of the capacitor stack, and a cover substantially conforming to the first opening and sealingly connected to the first opening. Also, the capacitor includes a plate substantially conforming to the second opening and sealingly connected to the second opening, the plate defining an aperture. Additionally, the capacitor includes a plug substantially conforming to the aperture in the plate, the plug sealingly connected to the plate. The capacitor stack is disposed in the case, and the terminal is in electrical connection with the case and at least one capacitor electrode.

Abstract: One embodiment of the present subject matter includes an apparatus which includes a capacitor stack, including at least one substantially planar capacitor electrode, a case having a first opening and a second opening, the first opening sized for passage of the capacitor stack, the second opening defined by walls having a first thickness, a cover substantially conforming to the first opening and sealingly connected to the first opening and a plate substantially conforming to the second opening, the plate sealingly connected to the second opening, the plate having a second thickness which is approximately greater than the first thickness of the walls defining the second opening, wherein the capacitor stack is disposed in the case.

Abstract: In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in a first direction to a position near an anode terminal forming portion. The anode terminal forming portion is connected to the frame body and used for forming the anode terminal. The cathode terminal forming portion is connected to the frame body and used for forming the cathode terminal. The anode terminal forming and the cathode terminal forming portions are spaced to each other in the first direction on a principal surface of the frame body.

Abstract: A solid electrolytic capacitor includes a porous sintered body made of valve metal, and an external anode terminal used for surface-mounting. The anode terminal is offset from the center of the sintered body, as viewed in the thickness direction or first direction of the sintered body. Further, the anode terminal is spaced away from the sintered body in a second direction which is perpendicular to the first direction. Between the sintered body and the anode terminal is formed a conductive path, which is inclined with respect to both the first and the second directions. The path comes closer to the anode terminal in the first direction as it goes farther away from the sintered body in the second direction.

Abstract: The present invention relates to a chip solid electrolyte capacitor obtained by connecting a part of the anode part and a part of the cathode part of a capacitor element to an anode terminal and a cathode terminal, respectively, and jacket-molding the capacitor element excluding a part or the whole of respective bottom faces or bottom and side faces of the anode and cathode terminals, wherein the connection face of the cathode terminal to the capacitor element is larger than the entire face of the capacitor element in the side connected to the cathode terminal, having large capacitance and low equivalent series resistance (ESR); a production method of the capacitor and an electronic device using the capacitor.

Abstract: A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat from the electrical components to the heat dissipation device and ambient air. The inner surface defines a cavity within the heat dissipation device that also enables housing of the electrical components.

Abstract: A portion of an anode lead frame 3 of a solid electrolytic capacitor 1 is bent to form a protruding portion 4 that protrudes toward an anode lead 20. The protruding portion 4 includes a first horizontal portion 41 positioned higher than and substantially parallel to the anode lead 20, a second horizontal portion 40 contacting the anode lead 20, a sloping portion 42 linking the inner end of the first horizontal portion 41 with the outer end of the second horizontal portion 40, and an auxiliary bent portion 43 bent upward from the inner end of the second horizontal portion 40 and substantially symmetrical with the sloping portion 42. A contact surface 46 of the second horizontal portion 40 with the anode lead 20 is formed flat, and a surface 47 of the second horizontal portion 40 on the opposite side to the contact surface 46 is formed with a rounded curvature.

Abstract: Surface mount electrolytic capacitors are provided with anode and cathode terminations having respective first termination portions provided on the bottom surface of a molded package in a generally coplanar configuration. A second cathode termination portion is bent in a generally perpendicular fashion to the first cathode termination portion and may then be adhered to the external cathode layer of a capacitor body. A second anode termination portion is bent in a generally perpendicular fashion to the first anode termination portion and may then be welded to an anode wire connected to and extending from the capacitor body. An insulation pad may be provided between the first anode termination portion and the capacitor body to prevent device shorting. A planar termination frame may be provided to form the electrolytic capacitors of the present subject matter.

Abstract: A solid electrolytic capacitor (1) comprises an element (2) protruding an anode lead (20), an anode lead frame (3) to which the anode lead (20) is to be attached, and a housing (5) for covering the element (2). The anode lead frame (3) has a step portion (4). The step portion (4) comprises a first horizontal portion (40) provided inside a side portion of the housing (5), a second horizontal portion (41) provided higher or lower and further inside the housing (5) than the first horizontal portion (40) and receiving an outer surface of the anode lead (20), and a linking portion (42) linking the first horizontal portion (40) and the second horizontal portion (41). The linking portion (42) is provided with an open hole (43), an edge of the open hole (43) overlapping the second horizontal portion (41), and a tip portion of the anode lead (20) being fitted into the open hole (43).

Abstract: A capacitor including a capacitor stack. The capacitor includes one or more substantially planar anode layers, and one or more substantially planar cathode layers. The capacitor includes a case with a first opening and a second opening, the first opening sized for passage of the capacitor stack and the second opening defined by walls having a first thickness. Additionally, the capacitor has a cover substantially conforming to the first opening and sealingly connected to the first opening, and a plate substantially conforming to the second opening, the plate adapted for attachment of a terminal, and sealingly connected to the second opening. The plate has a second thickness which is approximately greater than the first thickness of the walls defining the second opening. The capacitor stack is disposed in the case, and the terminal is in electrical connection with the case and at least one capacitor electrode.

Abstract: The invention provides a process for fabricating a solid electrolytic capacitor of the chip type which process includes the steps of plating a fabrication frame comprising an anode terminal member and a cathode terminal member projecting from a pair of side frame members respectively so as to be opposed to each other, the anode terminal member being stepped so as to provide a lower portion toward the cathode terminal member, a hole extending vertically and being formed in each of the anode terminal member and a higher portion of the cathode terminal member, joining an anode lead of a capacitor element to an upper surface of the cathode terminal member and a bottom surface of the capacitor element to an upper surface of the lower portion of the cathode terminal member, forming a packaging resin portion around the capacitor element without permitting resin to ingress into the holes, and cutting the anode and cathode terminal members along vertical planes extending through the respective holes.

Abstract: A face-down terminal solid electrolytic capacitor with the increased strength between electrode terminals and a casing resin is provided. The face-down terminal solid electrolytic capacitor has a structure where a mold structure in which a lead frame and capacitor elements fixed to the lead frame are overmolded with a casing resin is cut along cutting planes respectively passing through an anode terminal forming portion and a cathode terminal forming portion of the lead frame so that end surfaces of an anode terminal and a cathode terminal are exposed. In the lead frame, the anode terminal forming portion 21 and the cathode terminal forming portion 22 are provided so as to face each other. The anode terminal forming portion has a concave portion 21j on the board mount side and a convex portion 21t on the opposite side, which are formed by deforming part of the anode terminal forming portion in a direction perpendicular to a board mount surface. The concave portion is applied with plating.

Abstract: A solid electrolytic capacitor including a capacitor element having an anode body partly provided with a cathode layer, an anode-side and a cathode-side lead frame attached to a lower surface of the capacitor element, and a housing covering the lead frames and the capacitor element except lower surfaces of the lead frames. Both of the lead frames are exposed on the bottom face of the housing. The anode-side lead frame extending longitudinally of the capacitor is provided in an outer end portion thereof with at least two strips which separate each other. Outer end portions of the strips are exposed on the outer end face of the housing. A concave space is formed between the strips and is filled with resin forming the housing.

Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

Abstract: A solid electrolytic capacitor which includes a capacitor element in which a dielectric coating layer and a cathode layer are sequentially formed on a surface of an anode element having an anode lead member planted on one end surface thereof, an anode terminal connected with the anode lead member, a platy cathode terminal mounting the capacitor element thereon and connected with the cathode layer, and an enclosure resin coating the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed on a same plane from the enclosure resin. The cathode terminal is provided with a cathode exposed portion exposed from the enclosure resin in at least two locations on the same plane.

Abstract: The present invention provides a solid electrolytic capacitor comprising a capacitor element in which a dielectric coating layer and a cathode layer are sequentially formed on a surface of an anode element having an anode lead member planted on one end surface thereof, an anode terminal connected with the anode lead member, a platy cathode terminal mounting the capacitor element thereon and connected with the cathode layer, and an enclosure resin coating the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed on a same plane from the enclosure resin. The cathode terminal is provided with a cathode exposed portion exposed from the enclosure resin in at least two locations on the same plane.

Abstract: A chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane has the cathode portion mounted thereon, is connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

Abstract: A capacitor is constituted by a capacitor device including an anode part and a cathode part; and a substrate for mounting the capacitor device. The front face of a main part of the substrate is formed with first and second electrodes connected to the cathode and anode parts, respectively. The rear face of main part is provided with first and second outer electrodes electrically connected to the first and second electrodes by way of first and second conduction paths penetrating through the main part, respectively. The first and second electrodes are arranged in a row in a longitudinal direction of the substrate. The first and second outer electrodes include first and second connection areas for connecting with external wiring. The first and second connection areas extend in the longitudinal direction of the substrate, and are arranged in a row in a direction intersecting the longitudinal direction.

Abstract: A solid electrolytic capacitor includes a package for a capacitor element including an anode lead portion and a cathode portion. The package includes an insulating resin member which is arranged to cover the capacitor element and which includes hole portions formed therethrough. An anode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the anode lead portion through the hole portion. A cathode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the cathode conducting portion through the hole portion.

Abstract: A solid electrolytic capacitor includes a capacitor element provided with an anode body from which an anode lead projects, an anode-side lead frame positioned below the anode lead, and a bolster member which is provided between the anode lead and the anode-side lead frame and electrically connects the anode lead and the anode-side lead frame. At least one portion of the anode lead cuts into the bolster member.

Abstract: A feedthrough terminal assembly for an active implantable medical device utilizes to establish a reliable electrical connection between capacitor electrode plates, via inner surface metallization of a capacitor aperture, and an associated terminal pin 10, which passes at least partially therethrough. The inserts are preferably resiliently flexible, such as a spring, to establish this connection. The insert also serves to establish a mechanical connection between the capacitor and the terminal pin.

Abstract: A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

Abstract: An electrolytic capacitor with a further lowered impedance is provided. In the electrolytic capacitor in accordance with the present invention, respective currents directed opposite from each other flow through anode and cathode vias extending along the thickness of a substrate. The anode vias are lopsidedly located in a marginal area of an anode electrode pattern, and thus are disposed significantly close to the cathode vias formed in a cathode electrode pattern disposed close to the anode electrode pattern. The cathode vias are lopsidedly located in a marginal area of the cathode electrode pattern, and thus are disposed significantly close to the anode vias. Since the anode and cathode vias are formed close to each other as such, this electrolytic capacitor achieves a lower ESL, thereby attaining an impedance lower than that of a conventional electrolytic capacitor.

Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.

Abstract: Disclosed is an aluminum electrolytic capacitor, wherein each of anode and cathode foils is joined to a corresponding portion of a leader line through at least two caulked joint sections formed at each of the opposite ends of the flat portion, and a plurality of pressure-welded joint sections formed between the respective caulked joint sections at the opposite ends. The chaulked joint sections formed at each of the opposite ends of the portion provide a high joint strength. Further, the pressure-welded joint sections formed between the respective caulked-join sections at the opposite ends of the portion allow an electrical connection between the foil and the leader line to be stably obtained at a low resistance. This joint structure can, therefore, be applied to small-size capacitors which have not been able to be obtained by using only caulked joint, to achieve an aluminum electrolytic capacitor having a sufficient joint strength and a highly reliable electrical connection.

Abstract: A capacitor is provided so as to include: a capacitor element including a dielectric layer, and an anode and a cathode that are arranged to support the dielectric layer therebetween; a planar anode terminal; and a planar cathode terminal. The anode terminal and the cathode terminal are led out from the capacitor element in a same direction so as to be in parallel with each other, and at least a part of the anode terminal and at least a part of the cathode terminal overlap each other without contact in a direction perpendicular to a terminal plane of at least one terminal selected from the anode terminal and the cathode terminal. A capacitor built-in board using the capacitor also is provided.

Abstract: A solid electrolytic capacitor is provided which includes a capacitor element having an anode and a cathode, a sheet member for mounting the capacitor element, and a protection package formed on the sheet member to enclose the capacitor element. The sheet member is provided with an anode terminal and a cathode terminal which are connected to the anode and the cathode, respectively.

Abstract: A chip-type solid electrolytic capacitor having two capacitor elements using a valve metal and laminated in a direction perpendicular to a mounting surface to be mounted on a substrate. A pair of anode lead wires are extracted on one side from anode members of the capacitor elements in parallel to the mounting surface. The anode lead wires are connected to two branches of an anode terminal portion, respectively. A cathode terminal is connected to cathode layers on dielectric oxide films of the anode members. The solid electrolytic capacitor is encapsulated in an encapsulating resin with the anode terminal and the cathode terminal partially exposed. The branches of the anode terminal portion are configured so that they overlap each other by rotation of 180° around a center line.

Abstract: A solid electrolytic capacitor having a solid electrolytic capacitor element having an anode part assigned to one end part of an anode substrate composed of a valve-acting metal having on the surface thereof a dielectric film layer, and a cathode part including of a solid electrolyte layer formed on the dielectric film layer in the remaining portion of the anode substrate and having an electrically conducting layer formed thereon. The anode part is connected to a lead frame via a weld metal provided on the anode part of the solid electrolytic capacitor element by irradiating the anode part with a laser ray. Also disclosed is a method of producing the solid electrolytic capacitor.

Abstract: A capacitor structure comprises a shallow drawn encasement having first and second major sides and a peripheral wall coupled to the first and second sides. A cathode is disposed within the encasement proximate the first and second major sides, the cathode having a cathode lead. A central anode a having an anode lead is disposed within the encasement, and a bipolar, insulative feedthrough extends through the encasement through which electrical coupling may be made to the anode lead and the cathode lead.

Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.

Abstract: An aluminum electrolytic chip capacitor having excellent resistance against vibrations is disclosed. The capacitor is free from breakage of soldered portions or lead wires due to the vibrations upon being mounted on a board. The capacitor includes a metal case accommodating a capacitor element and having its open end sealed with a sealing member, and an insulated terminal plate mounted on the case. The case is provided with an annular shrink portion at the sealing of the open end. The terminal plate includes wall portions disposed at positions other than on a line of the lead wire bending direction of the periphery of the terminal plate. The wall portions cover at least the shrink portion. Inner surfaces of the wall portions abut the periphery of the case, thereby holding the case.

Abstract: In a fixing portion against which an end surface of a capacitor element abuts is provided on a portion of a cathode lead frame covered with a casing resin, the distance through which external oxygen moves to reach the capacitor element is increased by the distance of the fixing portion, whereby probability of oxidation is remarkably reduced, thus oxidation hardly occurs in the capacitor element. Further, since the capacitor element can be reliably positioned by bringing its end into abutment against the fixing portion, assembly accuracy is largely improved and the capacitor can be made compact with ease.

Abstract: A solid electrolytic capacitor is obtained by mounting a plurality of single plate capacitor elements within a chip by employing a stacking structure such as parallel stacking, opposing stacking, each layer-opposing stacking or closest stacking. As a result, a compact and high-capacitance element can be easily manufactured. The single plate capacitor element is preferably an element having an unfolded fan-like shape.

Abstract: A termination assembly for a capacitor provides controlled ESR and ESL. First and second termination elements are attached to first and second foils to provide terminal connections. The first and second foils are wound into a cylinder such that the first and second termination elements form a shape within the cylinder and are spaced apart by a first distance. First and second leads are extending from the termination elements, respectively, such that the first and second leads are spaced apart by a second distance different from the first distance.

Abstract: A solid electrolytic capacitor comprising a capacitor element comprising a valve-acting metal substrate having on the surface thereof a dielectric film and a solid electrolytic layer provided on the dielectric film, the capacitor element provided with lead wires (lead frames), in which the bonding structure between the capacitor element and the lead frames is improved. The solid electrolytic capacitor has high strength at the bonded portion between the capacitor element and the lead frames and has excellent heat resistance and is highly reliable. Also, a method for manufacturing such a solid electrolytic capacitor is disclosed.

Abstract: A solid electrolytic capacitor includes a capacitor element having an element body and an anode wire extending therefrom, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the element body, and a resin package integrally sealing these parts. Each of the anode lead and the cathode lead is a conductive plate. The element body is connected to the upper surface of the cathode lead. The anode wire is connected to the upper surface of the anode lead via a conductive bolster.

Abstract: A capacitor, particularly, an electrolyte capacitor, with low inductance includes a housing part, at least one capacitor reel including two capacitor electrodes insulated from each other by a dielectric and positioned in the housing part, and a housing bottom having at least one feed-through for contacting the capacitor electrodes and on which are arranged outer terminals for capacitor electrodes, the outer terminals being positioned so that one of the two outer terminals encircles the other terminal at least partially, and the two outer terminals are electrically insulated from each other.

Abstract: In the present invention, a capacitor element including a valve action metal, an oxide film layer formed on the surface of the valve action metal, and a solid electrolytic layer formed on the oxide film layer is provided with an organic compound having a boiling point of not lower than 150° C. and a melting point of not higher than 150° C., and the capacitor element including the organic compound is arranged inside a package. The oxide film is repaired with the organic compound as a solvent by an application of a dc voltage.

Abstract: An anode lead (11) is embedded at one end thereof in a sintered body in a capacitor element (1), and is welded at the other end thereof to a first outside lead (2). A cathode (12) is electrically connected to a second outside lead (3). The capacitor element is covered with a resin, thereby forming a resin package (5). The tip end of the first outside lead, to which the other end of the anode lead 11 is welded, is configured in such a manner as to have a capacity greater than those of other portions of the first outside lead: namely, the tip end of the first outside lead is widened or thickened in such a manner as to increase the volume of the first outside lead per unit length. Thus, it is possible to provide a solid electrolytic capacitor having the structure in which inclination of the welded portion of the anode lead can be eliminated or the welding reliability of the anode lead can be enhanced without reducing the size of the sintered body in the capacitor element or increasing the size of the package.

Abstract: A high frequency electronic package (500) having a metal housing (504) and a high frequency electronic component, such as a laser diode, contained within the metal housing (504). One or more leads (508, 510, 512, 514) pass into the metal housing through a header (506) and are coupled to the high frequency electronic component. The leads, metal housing and components within the housing cause stray inductances and capacitances, which cause problems in matching and driving the high frequency electronic component. Therefore a high value capacitor (502) is coupled between the metal housing and an anode lead, as close to the anode as possible, to short the stray capacitances at high frequencies. The capacitor can be a ring capacitor positioned over the anode lead externally of the housing, or can be a plate capacitor mounted internally or externally of the housing.

Abstract: Flat electrolytic capacitors particularly for use in implantable medical devices having stacked cathode and anode layers particular electrical connections of the capacitor anode and cathode layers with a capacitor connector assembly. Anode terminal means extend through the capacitor case side wall for electrically connecting a plurality of the anode tabs to one another and providing an anode connection terminal at the exterior of the case that is electrically insulated from the case. A cathode terminal extends through or to an encapsulation area of the capacitor case side wall via a cathode terminal passageway for electrically connecting a plurality of the cathode tabs to one another and providing a cathode connection terminal at the exterior of the case. The connector assembly is electrically attached to the anode connection terminal for making electrical connection with the anode tabs and to the cathode connection terminal for making electrical connection with the cathode tabs.

Abstract: A structure of connection pins of a capacitor includes a housing, connection pins positioned at the lateral sides of the interior of the housing, and a capacitor element located between two pins, and the remaining space of the housing being filled with fixing glue, characterized in that one opening of the housing holds the capacitor element at a larger surface thereof and the two pins are located at the sides of the housing a plurality of elastic plates with a slanting angle are provided to the connection pins, and the lower section of the connection pins are bent to form a contact plate for contacting with a circuit board, the contact plate is a hook-like structure and is provided with solder at appropriate position, an insertion leg is provided on the contact plate for mounting with the circuit board, thereby the elastic plate clips the capacitor element to provide a good position and stable contact.

Abstract: A solid electrolytic capacitor is provided which includes a capacitor element having an anode and a cathode, a sheet member for mounting the capacitor element, and a protection package formed on the sheet member to enclose the capacitor element. The sheet member is provided with an anode terminal and a cathode terminal which are connected to the anode and the cathode, respectively.

Abstract: An electrolytic capacitor with a polymeric housing in the form of a pocket defining a chamber, with an opening along a selected edge. The opening has opposed sides that are sealed together to provide a seam. A number of conductive layers are positioned within the chamber, and a feed-through conductor element has a first end electrically connected to the layers. An intermediate portion of the feed through passes through the seam, and an external portion extends from the housing. The housing may be vacuum formed high density polyethylene, with the feed-through contained in an elastomeric sleeve having a flattened cross section to be readily received in the seam, and to accommodate thermal expansion differences between the housing and the feedthrough. The device may be manufactured by inserting a stack of layers in the pocket, and thermally welding across the opening of the pocket on a single weld line.

Abstract: An energy storage device in the form of a cylindrical double layer capacitor (1) includes a plurality of integrally formed first electrode members (2) which each extend between a first end (3) and a second end (4). A plurality of integrally formed second electrode members (5) each extend between a third end (6) and a fourth end (7). As shown, members (5) are interleaved with members (2) such that ends (7) are located intermediate ends (3, 4) of the adjacent members (2). An insulator in the form of carbon layer (8) are disposed between adjacent members (2, 5) to prevent electrical contact therebetween. First contact means in the form of flanges (11) extend from respective ends (3) of each member (2) and electrically connect all the first members. Flanges (11) provide a site for the metallisation of particles thereupon. Those particles form a porous connection layer (12) for an electrical terminal (13) for members (2). Flanges (11) also form a barrier against the ingress of the particles beyond ends (3).

Abstract: A capacitor module capable of forming assembly of capacitors is disclosed. The capacitor is contained into a housing and the housing has a male connector and a female connector formed on the opposite sides thereof. The housings can combine each other by the engagement of the male and female connectors so as to achieve the housing assembly. After that, link bars are used to connect the corresponding electrodes of each capacitor, and a cover and a base are mounted on the top and the bottom of the capacitor module.

Abstract: An aluminum electrolytic capacitor with an aluminum housing defining a chamber, and having a feed-through aperture providing communication with the chamber from outside of the housing. A number of aluminum anode layers are positioned within the chamber, and a feed-through member formed of a first conductive material occupies the feed-through aperture. The feed-through member has an inner end extending into the chamber, an outer end extending externally from the housing, and an insulative sleeve encompassing an intermediate portion of the feed-through member and directly contacting the housing at the feed-through aperture to prevent electrical contact between the feed-through member and the housing. A connection element formed of a second different conductive material is attached to the inner end of feed-through member and spaced apart from the housing. A compressible insulative gasket may be positioned between the housing and the connection element to provide insulation and a fluid seal.

Abstract: In this Application, a description is given of a passive component comprising two electric connections with a plug-in portion for securing and electrically connecting the component to a printed circuit board, for example an electrolytic capacitor. In accordance with the invention, this component is so constructed that both plug-in portions are provided with two pins, with the plug-in portions being so positioned that the four pins do not extend in a flat plane. By virtue of the measure in accordance with the invention, resoldering of such components can be dispensed with. The use of pins whose length and width are different enables the manual installation of the components in accordance with the invention in the correct position to be simplified.