Abstract: A power converter includes a positive busbar electrically connected to a positive terminal and the first capacitor electrode, and includes a negative busbar electrically connected to a negative terminal and the second capacitor electrode. The power converter includes output busbars each electrically connected to a given output terminal among multiple output terminals, a given high-side switching element among a plurality of high-side switching elements, and a given low-side switching element among a plurality of low-side switching elements. The power converter includes a cooler that cools the high-side switching elements and the low-side switching elements. The power converter includes a housing that accommodates a supply tube and a discharge tube. The positive terminal, the negative terminal, the output terminals, the inlet port, and the outlet port are exposed on the housing. The inlet port, the outlet port, the supply tube, and the discharge tube are separate members from the housing.

Abstract: An apparatus includes a processor configured to control an automatic test equipment (ATE) to measure one or more parameters of a current test instance for testing a device under test (DUT), during execution of the current test instance on the DUT, and determine, based on the measured one or more parameters, one or more controls for controlling a temperature of a thermal head connected to the DUT so that a junction temperature of the DUT corresponds to a predetermined test temperature. The processor is further configured to control the temperature of the thermal head, based on the determined one or more controls.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: A hierarchical heat exchanger manifold includes: first and second fluid passages respectively open to an inlet and an outlet in a first level of the heat exchanger manifold; a plurality of first and second fluid passages in a second level of the heat exchanger manifold; and a plurality of first and second fluid passages in a third level of the heat exchanger manifold. A number of the first fluid passages in the third level is greater than a number of the first fluid passages in the second level. Each of the first fluid passages in the second level is in fluid communication with the inlet and at least one of the first fluid passages in the third level, and each of the second fluid passages in the second level is in fluid communication with the outlet and at least one of the second fluid passages in the third level.

Abstract: A substation containing a switch-gear or control-gear system, in particular a switch-gear or control-gear system includes at least one low voltage switch-gear or control-gear, with unmanned operation and maintenance. The inner room, where the switch-gear or control-gear are located in, is hermetically enclosed by an outer housing, the switch-gear or control-gear system is provided for unmanned operation and maintenance with a robotic system or manipulator, and/or the robotic system or manipulator is provided with a camera system, and/or an image recognition system and/or the inner room is locked against the outer housing by an inner, automatically operated door, and/or the robot system is implemented in such, that the robot systems acting area is extended from the inner room, partly in the area outside the inner room, but inside the outer housing, where spare parts are stored in a spare parts hand over area.

Abstract: A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.

Abstract: Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

Abstract: A method for filling a cooling circuit of a motor vehicle with a coolant may include filling the cooling circuit with ion-free water in a water filling operation, leaving the ion-free water in the cooling circuit for a water duration of action in a water operation of action, displacing the ion-free water out of the cooling circuit via filling the cooling circuit with a passivating agent in a passivating operation, rinsing the cooling circuit with ion-free water such that the ion-free water at least dilutes the passivating agent in the cooling circuit and a liquid including at least one of the ion-free water and the passivating agent remains in the cooling circuit in a rinsing operation, displacing the liquid out of the cooling circuit via filling the cooling circuit with the coolant in a coolant filling operation, and/or fluidically sealing the cooling circuit towards an outside in a sealing operation.

Abstract: The invention relates to a power module (4) for a medium or high voltage converter (1), preferably a modular multilevel converter, comprising at least one power semiconductor module (7), preferably an IGBT assembly, at least one energy storage module (9), preferably a capacitor module, at least one cooling device (14), wherein the cooling device (14) is formed as a cooling plate (17) that can be run through by a coolant, in particular flown through by a cooling liquid, and the at least one power semiconductor module (7) and/or the at least one energy storage module (9) are arranged on an upper side (18) and/or bottom side (19) of the cooling plate (17), and wherein the at least the power semiconductor module (7) is connected with the cooling plate (17) in a thermally conductive manner, and wherein the cooling plate (17) is provided for load-bearing support on a rack (2) of an assigned receiving space (3) of the medium or high voltage converter (1) and comprises support surfaces (16) projecting laterally in th

Abstract: An inverter control device to drive a motor includes a power module that supplies a driving current to the motor. The inverter control device further includes a power module board that outputs a driving signal to the power module, a control board that outputs a control signal to the power module board, and a smoothing capacitor. The power module, the power module board, the capacitor, and the control board are sequentially stacked and accommodated in a single casing made of a metal material, the power module being a bottommost layer. An input terminal of a power supply current is located on one side surface of the casing and an output terminal of a driving current of the motor is located on another side surface of the casing orthogonal to the one side surface, and the output terminal and a bus bar connected to the power module are directly connected to each other in a same plane.

Abstract: A power conversion device includes a first cooler configured to cool a power module, a second cooler configured to cool at least one electronic component, and a housing configured to house the first cooler and the second cooler. The power conversion device also includes a connecting coolant passage formed in an inner wall of the housing such that the connecting coolant passage connects the first cooler to the second cooler. The power conversion device can have the connecting coolant passage formed in the housing, without enlarging a size of the housing. The strength of a side wall of the housing is enhanced because the connecting coolant passage is formed in the inner wall of the housing.

Abstract: An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows . The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part . The first flow path part is formed at a position facing the side wall that forms the housing space.

Abstract: A power inverter includes a power semiconductor module that includes a power semiconductor device, a control circuit board that outputs a control signal used for controlling the power semiconductor device, a driver circuit board that outputs a driving signal used for driving the power semiconductor device, a conductive metal base plate arranged in a space between the driver circuit board and the control circuit board in which a fine and long opening portion is formed, wiring that connects the driver circuit board and the control circuit board through the opening portion and delivers the control signal to the driver circuit board, and an AC busbar that is arranged on a side opposite to the metal base plate through the driver circuit board and delivers an AC current output from the power semiconductor module to a drive motor. At least a portion of the AC busbar that faces the opening portion extends in a direction directly running in a longitudinal direction of the fine and long opening portion.

Abstract: A switchboard copper busbar heat dissipating device for dissipating heat from a copper busbar inside a switchboard includes a thermally-conductive electrically-insulating plate having a first surface connected to the copper busbar and a second surface; at least one heat pipe having a first end connecting to the second surface of the thermally-conductive electrically-insulating plate and a second end protruding out of the switchboard; and a plurality of cooling fins connected to the second end of the heat pipe and disposed outside the switchboard. Hence, the switchboard copper busbar heat dissipating device is conducive to miniaturization of a switchboard, enhancement of efficiency of heat dissipation of the switchboard, compliance with the Ingress Protection (IP) Ratings of the switchboard (regarding waterproofing and dust-proofing thereof), and avoiding a waste of energy.

Abstract: A power converter arrangement has two static switching element bridges that are alternatively operable and comprise static switching elements. The power converter arrangement has one housing that houses the two static switching element bridges; the housing has one cooling system for the static switching element bridges housed therein.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.

Abstract: A fully-passive, dynamically configurable directed cooling system for a microelectronic device is disclosed. In general, movable pins are suspended within a cooling plenum between an active layer and a second layer of the microelectronic device. In one embodiment, the second layer is another active layer of the microelectronic device. The movable pins are formed of a material that has a surface tension that decreases as temperature increases such that, in response to a temperature gradient on the surface of the active layer, the movable pins move by capillary flow in the directions of decreasing temperature. By moving in the direction of decreasing temperature, the movable pins move away from hot spots on the surface of the active layer, thereby opening a pathway for preferential flow of a coolant through the cooling plenum at a higher flow rate towards the hot spots.

Abstract: A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.

Abstract: When testing or powering up a magnet in a magnetic resonance imaging device, a switch is provided that switches a winding between resistive and superconductive modes. The switch includes a housing that contains a winding wound about a bobbin, and an internal coolant cavity that contains coolant that cools the winding, A baffle separates the internal coolant cavity from an external coolant reservoir. The baffle has small apertures that permit influx of liquid coolant into the internal cavity to cool the winding, At high temperatures, the coolant in the internal cavity vaporizes causing the winding to further increase its temperature and resistance, Upon reduction of heat to the winding, the winding cools sufficiently to permit influx of liquid coolant, thereby restoring a superconductive mode of operation to the winding.

Abstract: A cooling system for a subterranean power line may include a cooling tube configured to house a fluid. Heat generated by the subterranean power line may be radiated and/or conducted to the cooling tube and absorbed by the fluid within the cooling tube. As the fluid heats up, it may change phase from a liquid to a gas. The hot gas may rise to a heat-exchanging condenser configured to dissipate the heat and condense the fluid back into a liquid. The cool, condensed liquid my return from the heat-exchanging condenser to the cooling tube. Risers, gas transport tubes, pressure regulation systems, fluid storage tanks, and other components described herein may increase the efficiency of the cooling system and/or otherwise improve the viability of the cooling system for subterranean power lines.

Abstract: An assembly may include at least one duct and at least one distribution box, wherein the distribution box is mounted on the duct in fluid-tight engagement therewith for enclosing a distribution chamber therewith. Also, a method of mounting a distribution box to a duct, at a distribution point that is spaced-apart from duct ends, may include positioning a distribution point duct section in the distribution box, and hermetically sealing a distribution chamber, defined within the distribution box, from an environment of the distribution box.

Abstract: The invention relates to a switch cabinet arrangement of a device for generating electrical energy, wherein the switch cabinet arrangement comprises at least two separate power switch cabinets. The technical object of achieving an optimum scalability of devices for generating electrical energy with at the same time a simple installation and maintenance of the power switch cabinets despite a small available installation space, is achieved according to the invention in that the power switch cabinets respectively comprise a machine connection, a power module, a mains connection and a decentralised control unit, wherein the power module comprises a machine converter, a mains converter, a direct voltage intermediate circuit and a chopper, and wherein the power switch cabinets are electrically connected in parallel to one another via the machine connection and the mains connection.

Abstract: An integration method and module aims at simplifying the electrical connections between equipment and an electrical power center to be supplied electricity, while enabling a good accessibility of each piece of equipment for easier maintenance. To do so, a particular integration of this equipment is carried out so as to be able to connect the equipment in a direct extension of the electrical power center. According to one embodiment, an integration module includes a frame and a cover, the frame having a substantially parallelepipedic shape adapted to be able to extend longitudinally along a main axis in parallel with a longitudinal main side of the electrical power center. Cells, which define a constant cross section and an adjustable width enabled by movable intermediary walls, extend perpendicularly to the main longitudinal axis. Such cells are adapted to receive formatted electrical equipment.

Abstract: A power converter equipped with a semiconductor stack made up of semiconductor modules, bus bars coupled to power terminals of the semiconductor modules, a capacitor, and an input terminal table. The capacitor is disposed in alignment with a first direction in which the semiconductor modules are stacked. The capacitor has a first end and a second end opposed to the first end in a second direction in which the power terminals extend from the semiconductor modules. The first end faces in the second direction. The input terminal table is located near the second end of the capacitor. This structure permits the power converter to be reduced in size and produced at a decreased cost.

Abstract: A heat transfer system includes an electrical distribution cabinet extending about at least one current-carrying conductor. The heat transfer system also includes at least one electrically-insulating and thermally-conducting device coupled to the at least one current-carrying conductor. The heat transfer system further includes at least one heat pipe coupled to the at least one electrically-insulating and thermally-conducting device. The heat pipe is also thermally coupled to at least a portion of the electrical distribution cabinet.

Abstract: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.

Abstract: In order to obtain a switchgear which can improve heat dissipation efficiency, in the switchgear which dissipates heat outside an apparatus vessel, the heat being generated from an electrical apparatus placed in the apparatus vessel, the switchgear includes a first heat conductor in which one side is connected to a heat generation portion of the apparatus vessel and the other side is extended toward the apparatus vessel side, a second heat conductor in which one side is disposed near the other side of the first heat conductor and the other side is extended outside the apparatus vessel, and an insulating member between conductors disposed between the other side of the first heat conductor and one side of the second heat conductor.

Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.

Abstract: The method of the invention makes it possible to cool electrical switchgear operating at medium voltage and high current, such as a circuit breaker. The method consists in inserting serially two heat pipes (11) inside said switchgear, putting a first end (11A) of the first heat pipe (11) in the hot portion of the hot portions (10A, 10C) of the circuit breaker (10) and a second end (11B) of the first heat pipe (11) in a portion that is cooler (10A) of the hot portions (10A, 10C). The other heat pipe (11) is put between the cooler of the hot portions (10A) and a cooler part of the circuit breaker (10). A particular application is provided for medium-voltage, high-current circuit breakers.

Abstract: A device including a phase-change heat-transfer fluid cooling mechanism to cool a sheath in which is placed switchgear such as a circuit breaker. An evaporator is thus created which is connected to condensers that are placed on a roof of the sheath. The device can be for application to a medium-voltage high-current electrical installation. The device requires little maintenance and only consumes a reduced amount of energy, or even no energy.

Abstract: A system for cooling a multi-cell power supply, the system including a water pump, a water-to-air heat exchanger in fluid communication with the water pump, and a supply water manifold in fluid connection with the water-to-air-heat exchanger. The system further includes a plurality of power cells in fluid communication with the supply water manifold via one or more water hoses, and a multi-winding device in fluid communication with the plurality of power cells via at least one water-cooled bus, wherein the at least one water cooled bus electrically connects the power cells to secondary windings of the multi-winding device. The water-cooled buses provide both electrical current as well as cooling fluid to each winding of the multi-winding device, thereby eliminating a need for separate cooling and power connections.

Abstract: A power electronic device is disclosed. The power electronic device may include a housing, a conductive element positioned within the housing and rated for at least a medium voltage, a cooling system in fluid communication with the conductive element, a plurality of temperature sensing tags and a data collection unit having a receiver that is configured to receive signals from the antennae of the temperature sensing tags. The cooling system may have a plurality of outlet conduit elements that are positioned within the housing. Each of the tags may be attached to one of the outlet conduits and may include a power supply, a temperature sensor, and an antenna.

Abstract: A cooling system for a subterranean power line may include a cooling tube configured to house a fluid. Heat generated by the subterranean power line may be radiated and/or conducted to the cooling tube and absorbed by the fluid within the cooling tube. As the fluid heats up, it may change phase from a liquid to a gas. The hot gas may rise to a heat-exchanging condenser configured to dissipate the heat and condense the fluid back into a liquid. The cool, condensed liquid my return from the heat-exchanging condenser to the cooling tube. Risers, gas transport tubes, pressure regulation systems, fluid storage tanks, and other components described herein may increase the efficiency of the cooling system and/or otherwise improve the viability of the cooling system for subterranean power lines.

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.

Abstract: In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and includes a first wall section, and second and third wall sections extending from both sides of the first wall section. The cooler includes a coolant introduction tube and a coolant discharge tube. The coolant introduction tube and the coolant discharge tube project outward from to the frame. The first to third wall sections include a support wall section supporting at least one of the coolant introduction tube and the coolant discharge tube, and a frame wall section not supporting the coolant introduction tube and the coolant discharge tube. The thickness of the support wall section is larger than the thickness of the frame wall section.

Abstract: In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

Abstract: A cooling apparatus is provided for a switchgear having at least one primary contact to connect to a terminal of a circuit breaker, with a busbar joint connected to the primary contact. The cooling apparatus includes an evaporator associated with the primary contact. A condenser is located at a higher elevation than the evaporator. Heat pipe structure fluidly connects the evaporator with the condenser. Heat transfer structure is coupled with the busbar joint for removing heat from the busbar joint. Working fluid is in the evaporator so as to be heated to a vapor state, with the heat pipe structure transferring the vapor to the condenser and passively returning condensed working fluid back to the evaporator for cooling the at least one primary contact.

Abstract: A power electronics rack includes a switching chamber provided with one or more plate heat exchangers to receive a cooling fluid. A contactor chamber has contactors for connecting switches in the switching chamber to a magnetics chamber. The magnetics chamber receives at least one of a filter, an inductor or a transformer. The magnetics chamber receives cooling fluid which directly contacts the at least one of a filter, an inductor and a transformer for cooling. A common cooling circuit delivers cooling fluid to both the switching and magnetics chambers. The contactors may be reconfigured under certain conditions.

Abstract: A manifold is provided for supporting a power module assembly with a plurality of power modules. The manifold includes a first manifold section. The first face of the first manifold section is configured to receive the first power module, and the second face of the first manifold section defines a first cavity with a first baseplate thermally coupled to the first power module. The first face of the second manifold section is configured to receive the second power module, and the second face of the second manifold section defines a second cavity with a second baseplate thermally coupled to the second power module. The second face of the first manifold section and the second face of the second manifold section are coupled together such that the first cavity and the second cavity form a coolant channel. The first cavity is at least partially staggered with respect to second cavity.

Abstract: A power system for connecting high voltage components includes an enclosure having an interior space. A plurality of high voltage (HV) components are removably coupled to the enclosure and positioned in the interior space of the enclosure. The plurality of HV components are electrically coupled to each other. A motor is positioned outside the enclosure, and the motor is electrically interconnected through the enclosure to one of the HV components. A heat sink is positioned within the interior space for providing thermal heat transfer away from the components.

Abstract: A heat transfer element temperature variation system is disclosed. In one embodiment, the system includes: a heat transfer element configured to thermally couple to an insulating fluid within an electrical device; an ambient temperature sensor; and a control system coupled to the heat transfer element and the ambient temperature sensor, the control system for instructing the heat transfer element to adjust a temperature of the insulating fluid within the electrical device based upon a temperature indicator from the ambient temperature sensor.

Abstract: A power electronics rack includes a switching chamber provided with one or more plate heat exchangers to receive a cooling fluid. A contactor chamber has contactors for connecting switches in the switching chamber to a magnetics chamber. The magnetics chamber receives at least one of a filter, an inductor or a transformer. The magnetics chamber receives cooling fluid which directly contacts the at least one of a filter, an inductor and a transformer for cooling. A common cooling circuit delivers cooling fluid to both the switching and magnetics chambers. The contactors may be reconfigured under certain conditions.

Abstract: A device for connecting an electric line to a connection terminal for direct or indirect connection with a circuit breaker, which comprises at least one first electrically conducting body having a first end portion intended to be operatively connected to the terminal, and a second end portion intended to be operatively connected to a conductor element of the electric line, and at least one thermal conducting body comprising a hermetically sealed cavity containing a cooling fluid. The thermal conducting body is operatively coupled to the first electrically conducting body such that the hermetically sealed cavity has a first surface arranged in proximity to the first end portion and a second surface arranged in proximity to the second end portion.

Abstract: A high power drive stack system is provided which includes a cabinet (20) having a vaporizable dielectric fluid cooling system (110) and a plurality of receivers (22) for accepting a plurality of modules (30) containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors (210). Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.

Abstract: The method of the invention makes it possible to cool electrical switchgear operating at medium voltage and high current, such as a circuit breaker. The method consists in inserting serially two heat pipes (11) inside said switchgear, putting a first end (11A) of the first heat pipe (11) in the hot portion of the hot portions (10A, 100) of the circuit breaker (10) and a second end (11B) of the first heat pipe (11) in a portion that is cooler (10A) of the hot portions (10A, 10C). The other heat pipe (11) is put between the cooler of the hot portions (10A) and a cooler part of the circuit breaker (10). A particular application is provided for medium-voltage, high-current circuit breakers.

Abstract: A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

Abstract: A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology.

Abstract: A cooling device for a circuit breaker which comprises a case having a front wall, a rear wall, an upper wall, a lower wall, two flanks, and a first series of side-by-side terminals and a second series of side-by-side terminals that protrude outside from the case for the connection of the circuit breaker with an electrical circuit. The cooling device includes at least one first body made of a thermal conducting material and which has a central portion suitable for being positioned transversally along and facing the first series of terminals so as to absorb heat generated at the first series of terminals, and a first end portion and a second end portion that protrude from the central portion and are configured so as to receive the heat absorbed by the central portion and to diffuse it outside the cooling device itself.

Abstract: A compact transformer-power converter assembly includes: a transformer immersed in oil and a cooling fluid path through a power converter system for extracting heat from the power converter system and the oil.

Abstract: A cooling system for a high voltage system can include a high voltage supply and an electrical component coupled to the high voltage supply. The electrical component can generate heat that needs to be dissipated. The cooling system can include a cooling mechanism for dissipating the heat. The cooling mechanism can include a liquid conduit thermally coupled to the electrical component. The liquid conduit can contain a cooling solution comprising an alcohol having the formula R—OH, wherein R is a hydrocarbon having the formula CnH2n+1 and n is any positive integer between 1 and 6. The cooling system can additionally include a pump and a heat exchanger, each of which may be coupled to the liquid conduit.