With Cooling Means Patents (Class 361/676)
  • Patent number: 10310912
    Abstract: Data processing workloads are selectively assigned within a data center and/or among data centers based on non-data processing overhead within the data center and/or among the data centers. Power consumption of a rack including servers is predicted based on data processing demands that are placed on the servers for a given data processing workload, and power consumed by the rack is measured when the servers are performing the given data processing workload. A metric of power consumed by the rack for non-data processing overhead is derived based on a difference between results of the predicting and the measuring. A future data processing workload is selectively assigned to the rack based on the metric of power of power consumed by the rack for the non-data processing overhead. Assignment may also take place at an aisle and/or data center level based on these metrics.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: June 4, 2019
    Assignee: CA, INC.
    Inventors: Serguei Mankovskii, Douglas M. Neuse, Ramanjaneyulu Malisetti, Rajasekhar Gogula, Subhasis Khatua
  • Patent number: 10084218
    Abstract: A battery pack having a battery pack housing defining an interior region is provided. The housing further includes an inlet aperture and an outlet aperture communicating with the interior region. The battery pack further includes a battery module that is disposed in the interior region of the battery pack housing proximate to the inlet aperture. The battery module has a first battery cell, a heat exchanger, and first and second end plates. The first battery cell and the heat exchanger are disposed against one another, and are further disposed between the first and second end plates. The heat exchanger defines a first flow path portion therethrough. The first end plate has a first end portion that extends longitudinally past the first end of the first battery cell, and a second end portion that extends longitudinally past the second end of the first battery cell.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: September 25, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Robert Merriman, Heekook Yang
  • Patent number: 10008837
    Abstract: An improved bus bar apparatus is usable in high temperature electrical terminations and is configured to provide sufficient heat dissipation such that when connected at one end with a 90° C. wire, the bus bar apparatus is at most only at 75° C. at another end thereof, which end can be connected with a lower temperature electrical component such as a circuit interrupter. The bus bars apparatus may include bus bars that extend directly between the high temperature wires and the low temperature electrical component, or the bus bar apparatus may additionally include wires that are electrically interposed between the low temperature region of the bus bars and the electrical component. Additional cooling could be provided by employing oversized wires. The bus bars may additionally include fins, fans, or supplementary heat sinks to enhance thermal convection of the bus bar. The bus bar apparatus additionally can be provided with its own enclosure to be usable in a retrofit situation.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: June 26, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Robert Yanniello, David Glenn Loucks
  • Patent number: 9966641
    Abstract: A battery pack has a battery pack housing that defines an interior region, and a battery module that is disposed in the interior region. The battery module has a first battery cell, and a first heat exchanger defining a first flow path portion therethrough. The battery pack further includes a first electric fan and a thermally conductive housing that are disposed in the interior region. The thermally conductive housing has a first housing portion, and at least first and second cooling fins defining a second flow path portion therebetween. At least a portion of the second flow path portion is substantially in-line with the first flow path portion. The first electric fan urges air to flow through an inlet aperture, the first flow path portion, the second flow path portion, and through the first electric fan to a first outlet aperture to cool the battery module.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: May 8, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Joseph Blumka, Paul Laurain, Alexander Jeffrey Smith
  • Patent number: 9787109
    Abstract: A battery pack includes a battery pack housing defining an interior region with first and second interior spaces and an intermediate space. The battery pack housing includes inlet and outlet apertures communicating with the first and second interior spaces, respectively. The battery pack has a battery module disposed in the first interior space having a first battery cell and a heat exchanger. The heat exchanger defines a first flow path portion therethrough. The battery pack has a fan assembly disposed in the intermediate space having a first electric fan, and a thermally conductive housing disposed in the second interior space that defines a second flow path portion. The first electric fan urges air to flow through the inlet aperture, the first flow path portion, a portion of the first electric fan, the second flow path portion, and the outlet aperture.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: October 10, 2017
    Assignee: LG Chem, Ltd.
    Inventors: Alexander Jeffrey Smith, Anthony Arena, Juil Yum, Adam Henry Jin Wah Yee Ing
  • Patent number: 9756767
    Abstract: A power conversion apparatus includes: a cooling air passage defined with cooling fins of upper and lower converters and cooling fins of an inverter opposed to each other; upper and lower blowing fans provided upstream of the cooling air passage; and upper and lower sucking fans provided downstream of the cooling air passage and at positions offset from the converters. The blowing fans are provided for supplying cooling air from upstream of the cooling air passage, and the sucking fans are provided for discharging air from within a casing of the apparatus to the outside.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: September 5, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Masanori Shin, Takayuki Komatsu, Katsuhiro Nakagawa, Yasunori Yamamoto
  • Patent number: 9722286
    Abstract: A battery pack is provided. The battery pack includes first and second temperature sensors that are disposed in first and second interior spaces, respectively. The first temperature sensor generates a first signal indicative of a first temperature level of the battery cell. The second temperature sensor generates a second signal indicative of a second temperature level of the DC-DC voltage converter. The battery pack further includes a microprocessor that determines a first fan speed percentage value of the electric fan based on the first temperature level, and a second fan speed percentage value of the electric fan based on the second temperature level. The microprocessor selects the first fan speed percentage value if the first fan speed percentage value is greater than the second fan speed percentage value.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: August 1, 2017
    Assignee: LG Chem, Ltd.
    Inventors: Alexander Jeffrey Smith, Richard McCormick, Satish Ketkar, Robert Merriman, Heekook Yang
  • Patent number: 9673126
    Abstract: A multi-functional semiconductor refrigerating and warming dual-purpose box includes a box body, a refrigerating and heating unit, a composite condenser unit, and a liquid delivering pump. The box body includes two independent rooms, a bottom machine room, an upper working room, and a lower working room. The refrigerating and heating unit includes an upper room semiconductor refrigerating and heating unit and a lower room semiconductor refrigerating and heating unit, the upper room semiconductor refrigerating and heating unit comprising an external heat exchanger of the upper room, a first semiconductor chilling plate, and an internal heat exchanger of the upper room. The composite condenser unit and the liquid delivering pump are connected to the external heat exchanger of the upper room and the external heat exchanger of the lower room through pipes. A manufacturing method of a multi-functional semiconductor refrigerating and warming dual-purpose box is also provided.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: June 6, 2017
    Assignee: Chongqing Semiconductor Klc Holdings Ltd.
    Inventor: Wanhui Liu
  • Patent number: 9668376
    Abstract: An electric converter system, including a housing configured to receive a dielectric fluid, at least two electric modules, each including a first space and a second space, the first space including a connecting portion and a cooling system configured to circulate the dielectric fluid to cool the electric modules. The converter system further includes an inter module bus bar portion including a complementary connecting portion, whereby the connecting portion is configured to be connected to the complementary connecting portion of the inter module bus bar portion, whereby the inter module bus bar portion is configured to interconnect one of the at least two electric modules with the other of the at least two electric modules, said one electric module being proximate to said other electric module, and whereby the connecting portion, the first space and the second space of each electric module are arranged in series.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: May 30, 2017
    Assignee: ABB Schweiz AG
    Inventors: Gernot Riedel, Slavo Kicin, Thomas Gradinger
  • Patent number: 9502331
    Abstract: An electric power converter includes a semiconductor module, a cooling pipe, a pressing member and a supporting member. A pair of supporting wall portions is disposed so as to sandwich the semiconductor module, the cooling pipe, and the pressing member in an overlapping direction. A semiconductor element includes a small-sized semiconductor element, and a large-sized semiconductor element of which an outer shape is larger than that of the small-sized semiconductor element when projected onto a plane parallel to the overlapping direction. Within the semiconductor module, the large-sized semiconductor element is disposed closer to a connecting end portion side where a connecting portion of the pair of supporting wall portions are disposed than the small-sized semiconductor elements is.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: November 22, 2016
    Assignee: DENSO CORPORATION
    Inventors: Tomohisa Sano, Yuu Yamahira
  • Patent number: 9461451
    Abstract: A power converter is equipped with a semiconductor module stack, a positive bus bar stack, and a negative bus bar stack. The positive bus bar stack has a first positive bus bar and a second positive bus bar stacked. The negative bus bar stack also has a first negative bus bar and a second negative bus bar stacked in a stacking direction Z of the positive bus bar stack. The first semiconductor modules of the semiconductor module stack are connected to the first positive bus bar and the first negative bus bar, while the second semiconductor modules of the semiconductor module stack are connected to the second positive bus bar and the second negative bus bar. This results in a decreased variation in mutual inductance among the semiconductor modules, which leads to a decrease in overall inductance of the power converter.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: October 4, 2016
    Assignee: DENSO CORPORATION
    Inventors: Hiroyoshi Sawada, Makoto Okamura
  • Patent number: 9374900
    Abstract: A connector system includes a first substrate, a second substrate, and a standoff arranged between the first substrate and the second substrate. The standoff includes a first part with an external threading and a second part with an internal threading configured to engage with the external threading of the first part. The first part is configured to engage with the first substrate, the second part is configured to engage with the second substrate, and the external threading of the first part and the internal threading of the second part are configured such that the first part and the second part are configured to be unscrewed from each other to cause the distance between the first and second substrates to increase.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: June 21, 2016
    Assignee: Samtec, Inc.
    Inventors: James Robert Huffman, Cody Logan Graf, David Lynn Decker, William Chieng Ouyang
  • Patent number: 9178337
    Abstract: An outdoor unit of an HVAC system comprises a frame, at least one refrigerant coil mounted to the frame, a fan motor, a compressor, a controller, and a premises power source accessory panel. The fan motor is coupled to a fan which drives air through the refrigerant coil. The compressor is coupled to the refrigerant coil to drive refrigerant therethrough. The controller is coupled to the fan motor and compressor. The premises power source accessory panel is removably coupled to the frame and includes a bracket and circuit protection element. The bracket has at least one electrical conduit aperture. The circuit protection element is mounted to the bracket and coupleable to a premises power source. The premises power source is a renewable-energy power source located on a premises of the HVAC system. The bracket is removably coupleable to the outdoor unit in lieu of a conventional electrical conduit panel.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: November 3, 2015
    Assignee: Lennox Industries Inc.
    Inventors: Robert B. Uselton, Timothy J. Brizendine
  • Patent number: 9144161
    Abstract: A bus is placed at the center of a housing. Breakers and cables forming branch circuits branching from the bus are placed at the upper and lower stages in the housing, being displaced in the right-left direction. Spaces formed between the side wall of the housing and the side walls of an upper-stage breaker compartment and an upper-stage cable compartment containing the upper-stage apparatuses are used as paths leading to the housing ceiling for a bus compartment, and a lower-stage breaker compartment and a lower-stage cable compartment containing the lower-stage apparatuses. The bus compartment and all the apparatus compartments each directly lead to a ceiling portion of the housing and have an opening portion. Pressure discharge plates are provided on the opening portions.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: September 22, 2015
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Susumu Kozuru, Katsuhiko Horinouchi
  • Patent number: 9042112
    Abstract: A converter power unit comprises: a heat sink; n power switch modules on the heat sink; a first group of laminated bus bars comprising a first and a second bus bar; a capacitor group comprising m capacitor; a second group of laminated bus bars comprising a third and a fourth bus bar, the first bus bar is connected with the third bus bar, the second bus bar is connected with the fourth bus bar; providing that vertical projection areas projected by an area occupied by the n power switch modules and projected by the capacitor group on a first plane perpendicular to an axial direction of the capacitor group are defined as a first and a second projection areas respectively, the first and the second projection area have an overlapped area. The present application can reduce the stray inductances in the commutating loop of the converter.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: May 26, 2015
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei Guan, Jian Jiang, Bagao Li, Kaitian Yan, Hongyang Wu
  • Patent number: 9007746
    Abstract: A cabinet structure for a switchgear assembly. The cabinet structure includes a cabinet having upper and lower vents and a breaker cradle for holding a circuit breaker having primary disconnects for connecting the circuit breaker to bus bars. The cabinet further includes an air passageway located between the upper and lower vents, wherein the air passageway extends vertically through the primary disconnects and the cabinet. Further, the cabinet includes a fan module having at least one fan for drawing outside air through the lower vent, the air passageway and the primary disconnects for cooling the primary disconnects.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: April 14, 2015
    Assignee: Siemens Industry, Inc.
    Inventors: Rahul Rajvanshi, Harry W. Josten, James Keith Flowers
  • Patent number: 9001499
    Abstract: An electrical switching apparatus includes a plurality of poles, each of the poles including a terminal. The terminal of a first one of the poles is proximate the terminal of a second one of the poles. A jumper is electrically connected between the terminal of the first one of the poles and the terminal of the second one of the poles. The jumper includes a plurality of heat transfer members, each of the heat transfer members being separated from others of the heat transfer members.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: April 7, 2015
    Assignee: Eaton Corporation
    Inventors: Kenneth D. Kolberg, Thomas M. Whalen, John J. Shea, Percy J. Lipsey
  • Patent number: 8995122
    Abstract: An electronic-device housing stores an electronic circuit and a cooling fan. The electronic-device housing includes a first surface having at least one opening to release heat outside. At least one projected portion projects toward an outside of the electronic-device housing, and when the electronic-device housing is installed on an installation surface so that the first surface is opposed to the installation surface and the projected portion comes into contact with the installation surface, a rotation moment acting on a gravity center of the electronic-device housing acts in a direction where the rotation moment causes the first surface to move away from the installation surface.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: March 31, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Tetsuhiro Sano
  • Patent number: 8995133
    Abstract: An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: March 31, 2015
    Assignee: Deere & Company
    Inventors: Andrew D. Wieland, Kevin B. Larsen, John N. Oenick, Gregory K. Harmelink, Neal D. Clements
  • Patent number: 8982540
    Abstract: The present invention is directed to an enclosure for electrical equipment. The enclosure includes a power plate assembly and a vented cover installed over the power plate assembly. Electrical components operating at 50 volts or more are mounted to a rail in the power plate assembly. The vented cover separates the electrical components mounted to the rail from the electrical components mounted in the enclosure.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: March 17, 2015
    Assignee: Panduit Corp.
    Inventors: Rey Bravo, John C. Senese
  • Patent number: 8974125
    Abstract: In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: March 10, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Laurence R. McColloch, David J. K. Meadowcroft, Paul Yu
  • Publication number: 20150049421
    Abstract: In one embodiment, an electronic device package structure includes an electronic die having conductive pads on one surface. The one surface is further attached to at least one lead. A conductive layer covers at least one conductive pad and at least portion of the lead thereby electrically connecting the lead to the conductive pad.
    Type: Application
    Filed: December 4, 2013
    Publication date: February 19, 2015
    Applicant: Amkor Technology, Inc.
    Inventors: Jong Sik Paek, Doo Hyun Park, Yoon Joo Kim, Seong Min Seo, Young Suk Chung
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8941977
    Abstract: The present invention is directed to an enclosure for electrical equipment. The enclosure includes a power plate assembly and a vented cover installed over the power plate assembly. Electrical components operating at 50 volts or more are mounted to a rail in the power plate assembly. The vented cover separates the electrical components mounted to the rail from the electrical components mounted in the enclosure.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: January 27, 2015
    Assignee: Panduit Corp.
    Inventors: Rey Bravo, John C. Senese
  • Patent number: 8929071
    Abstract: A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: January 6, 2015
    Assignee: General Electric Company
    Inventors: Richard Alfred Beaupre, Ljubisa Dragoljub Stevanovic, Daniel Jason Erno, Charles Gerard Woychik
  • Patent number: 8907212
    Abstract: A junction box includes a cable connecting box and a cover covering the cable connecting box. The cable connecting box includes an insulative block, a plurality of contacting foils retained in the insulative block and a plurality of diodes. Each diode connects with two neighborly contacting foils. The contacting foils are insert-molded with the insulative block. Based on thermal radiation properties of the plastic material is superior to that of the metal material, as the contacting foils transfer the heat to the insulative block, the insulative block would deliver the heat to the cable connecting box, then the heat would be delivered to the cover. Such that, the heat dissipates outside quickly from the junction box.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Xue-Yuan Xiao, Hong-Qiang Han, Zi-Qiang Zhu
  • Publication number: 20140334074
    Abstract: An electrical contactor assembly is provided including an electrical contactor, an electrical bus bar, and a panel formed from an electrically insulating material. At least one post protrudes through the panel and is in contact with the electrical bus bar. The at least one post is constructed from an electrically and thermally conductive material. A first end of the at least one post is configured to electrically and thermally connect to the electrical contactor. A heat sink is removably coupled to a second end of the at least one post. The heat sink includes a body having a plurality of fins extending radially outward. A first portion of the plurality of fins extends around a circumference of the body. A second portion of the plurality of fins extends around only a portion of the circumference of the body.
    Type: Application
    Filed: May 8, 2013
    Publication date: November 13, 2014
    Applicant: Hamilton Sundstrand Corporation
    Inventors: Debabrata Pal, Aida Virginia Bennett, John Shutts
  • Patent number: 8872022
    Abstract: A cooling system for a subterranean power line may include a cooling tube configured to house a fluid. Heat generated by the subterranean power line may be radiated and/or conducted to the cooling tube and absorbed by the fluid within the cooling tube. As the fluid heats up, it may change phase from a liquid to a gas. The hot gas may rise to a heat-exchanging condenser configured to dissipate the heat and condense the fluid back into a liquid. The cool, condensed liquid my return from the heat-exchanging condenser to the cooling tube. Risers, gas transport tubes, pressure regulation systems, fluid storage tanks, and other components described herein may increase the efficiency of the cooling system and/or otherwise improve the viability of the cooling system for subterranean power lines.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: October 28, 2014
    Assignee: Elwha LLC
    Inventors: Roderick A. Hyde, Jordin T. Kare, Nathan P. Myhrvold, David B. Tuckerman, Lowell L. Wood, Jr.
  • Patent number: 8868250
    Abstract: In one implementation, an environmental controller operates a cooling system in an electronic device. The environmental controller includes a closed loop control system for operating a cooling fan at a target speed. The environmental controller may select the target speed based on one or more temperature sensors. The environmental controller may select the target speed based on the speeds of additional fans or the fans may be controlled in unison. The closed loop control system includes a proportional weight. When a measured cooling fan speed deviates from the target speed by more than a threshold error value, the proportional weight is constant. As the measured cooling fan speed approaches the target speed, and the threshold error value is crossed, the proportional weight is variable. The variance may be a function of time such as a periodic stair step function.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: October 21, 2014
    Assignee: Cisco Technology, Inc.
    Inventors: Niels-Peder Mosegaard Jensen, Joseph Dean Jaoudi
  • Patent number: 8861202
    Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: October 14, 2014
    Assignee: GM Global Technology Operations LLC
    Inventor: Mathew L. Nassoiy
  • Patent number: 8848374
    Abstract: A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor disposed above the semiconductor substrate, and a thermal protection structure disposed above the resistor. The thermal protection structure has a plurality of heat dissipating elements, the heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate. The thermal protection structure receives the heat generated from the resistor and the heat dissipating elements dissipates the heat to the semiconductor substrate.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: September 30, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jian-Hong Lin, Chin Chuan Peng, Tzu-Li Lee, Bi-Ling Lin, Bor-Jou Wei, Chien Shih Tsai
  • Patent number: 8848362
    Abstract: A device may include multiple power supplies that are cooled by a system fan. The power supplies may be cross-connected to supply power to one another and the device may monitor temperatures of the power supplies. Based on the temperatures of the power supplies, the device may determine whether any of the power supplies are likely to be on fire. The device may shut off the fan when a power supply is determined to be likely to be on fire.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: September 30, 2014
    Assignee: Juniper Networks, Inc.
    Inventors: Thuan Che, Jaspal Gill, Frank Krippendorf
  • Patent number: 8842421
    Abstract: An arc-resistant switchgear enclosure has a vent opening and a vent flap. Normally the vent flap is open to allow air to circulate through the enclosure. However, in the event of an arc fault explosion in the enclosure, the vent flap is forced to close by the explosion. As the vent flap closes, a flexible latch member moves along a keeper and prevents the vent flap from reopening. In some embodiments, the latch member contacts the keeper and props the vent flap open for normal operation.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: September 23, 2014
    Assignee: Central Electric Manufacturing Company
    Inventor: Paul W. Gingrich
  • Publication number: 20140254070
    Abstract: A sealed electrical enclosure for housing an electrical component is provided. In one exemplary embodiment, the sealed electrical enclosure includes a housing, a first and second electrical connector, an actuator, and a terminal. The housing has a sealed interior when a top portion is coupled to a bottom portion. The first electrical connector extends from the sealed interior through the bottom of the housing and is electrically coupled to the electrical component. The actuator extends from the sealed interior through the housing and is configured to manipulate the electrical component. The terminal is electrically coupled to the second electrical connector. The second electrical connector is configured to mate with the first electrical connector. The first and second electrical connectors are configured to be connected and disconnected to attach and remove the housing to and from the terminal.
    Type: Application
    Filed: May 21, 2014
    Publication date: September 11, 2014
    Applicant: ERICSON MANUFACTURING COMPANY
    Inventor: RON HUGHES
  • Patent number: 8811050
    Abstract: A relay-connecting member (16) has relay terminals (32), each of which is fit-connected to an output electrode (28) and a male tab (30) of an output terminal (14). With this structure, by simply inserting the output electrode (28) and the male tab (30) of the output terminal (14) into the relay-connecting member (16), it is possible to easily electrically connect the output electrode (28) and the male tab (30) of the output terminal (14) through the relay terminal (32).
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: August 19, 2014
    Assignees: Toyota Jidosha Kabushiki Kaisha, Sumitomo Electric Industries, Ltd., Kohshin Electric Corp., Autonetworks Technologies, Ltd., Sumitomo Wiring Sytems, Ltd
    Inventors: Yutaka Hotta, Shiro Nishida, Yuki Higashimori
  • Patent number: 8792244
    Abstract: A power converter equipped with a semiconductor stack made up of semiconductor modules, bus bars coupled to power terminals of the semiconductor modules, a capacitor, and an input terminal table. The capacitor is disposed in alignment with a first direction in which the semiconductor modules are stacked. The capacitor has a first end and a second end opposed to the first end in a second direction in which the power terminals extend from the semiconductor modules. The first end faces in the second direction. The input terminal table is located near the second end of the capacitor. This structure permits the power converter to be reduced in size and produced at a decreased cost.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: July 29, 2014
    Assignee: Denso Corporation
    Inventor: Wataru Funatsu
  • Patent number: 8792226
    Abstract: A heat transfer system includes an electrical distribution cabinet extending about at least one current-carrying conductor. The heat transfer system also includes at least one electrically-insulating and thermally-conducting device coupled to the at least one current-carrying conductor. The heat transfer system further includes at least one heat pipe coupled to the at least one electrically-insulating and thermally-conducting device. The heat pipe is also thermally coupled to at least a portion of the electrical distribution cabinet.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: July 29, 2014
    Assignee: General Electric Company
    Inventors: Sandeep Dhar, Peter James Greenwood, Janaki Gadiyaram, Manish Prasad
  • Patent number: 8787013
    Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: July 22, 2014
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael P. Czamara, Osvaldo P. Morales
  • Patent number: 8755187
    Abstract: Certain exemplary embodiments can comprise a system, which can comprise a basepan comprising a banding stud. The banding stud can be configured to releasably attach a heat sink to the basepan. The heat sink configured to increase a current carrying capacity of a system associated with the basepan from a first predetermined level to a second predetermined level.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: June 17, 2014
    Assignee: Siemens Industry, Inc.
    Inventors: Fan Zhang, Robert E. Henry, Jr.
  • Patent number: 8755209
    Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: June 17, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Kenichiro Nakajima, Haruki Hamada, Hideyo Suzuki
  • Patent number: 8749051
    Abstract: A semiconductor device which provides a small and simple design with efficient cooling. A first electrically conducting cooling element is in contact with first electrodes of semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the first electrodes of the semiconductor elements to an external apparatus. A second electrically conducting cooling element is in contact with second electrodes of the semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the second electrodes of the semiconductor elements to an external apparatus. The semiconductor device includes an interface which is electrically connected to gates of the semiconductor elements for external control of respective states of the semiconductor elements.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: June 10, 2014
    Assignee: ABB Research Ltd
    Inventors: Slavo Kicin, Nicola Schulz, Munaf Rahimo, Raffael Schnell
  • Patent number: 8743532
    Abstract: In order to obtain a switchgear which can improve heat dissipation efficiency, in the switchgear which dissipates heat outside an apparatus vessel, the heat being generated from an electrical apparatus placed in the apparatus vessel, the switchgear includes a first heat conductor in which one side is connected to a heat generation portion of the apparatus vessel and the other side is extended toward the apparatus vessel side, a second heat conductor in which one side is disposed near the other side of the first heat conductor and the other side is extended outside the apparatus vessel, and an insulating member between conductors disposed between the other side of the first heat conductor and one side of the second heat conductor.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: June 3, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tomotaka Yano, Satoru Yoshida, Masahiro Arioka
  • Patent number: 8736788
    Abstract: A liquid crystal display device includes a liquid crystal display panel, a light guide plate disposed on a lower part of the liquid crystal display panel, an LED circuit substrate disposed along at least one side of the light guide plate to accommodate an LED on a front surface thereof, and a heat transmission member having a first part that faces a lower surface of the light guide plate and a second part that is extendedly bent from the first part and faces the LED circuit substrate.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: May 27, 2014
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sung Ki Kim, Won-nyun Kim
  • Patent number: 8699254
    Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: April 15, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Fusanori Nishikimi, Kinya Nakatsu
  • Patent number: 8699210
    Abstract: A system for cooling a multi-cell power supply, the system including a water pump, a water-to-air heat exchanger in fluid communication with the water pump, and a supply water manifold in fluid connection with the water-to-air-heat exchanger. The system further includes a plurality of power cells in fluid communication with the supply water manifold via one or more water hoses, and a multi-winding device in fluid communication with the plurality of power cells via at least one water-cooled bus, wherein the at least one water cooled bus electrically connects the power cells to secondary windings of the multi-winding device. The water-cooled buses provide both electrical current as well as cooling fluid to each winding of the multi-winding device, thereby eliminating a need for separate cooling and power connections.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: April 15, 2014
    Assignee: Siemens Industry, Inc.
    Inventors: Marc F. Aiello, Peter Willard Hammond, Edward Alan Cheesman, Wayne Sheldon Jordan, Jonathan Kunkle
  • Patent number: 8682203
    Abstract: A disclosed cooling structure includes a casing including a bottom plate arranged in a bottom portion of the casing and having a through hole formed in the bottom plate; a heat source to be cooled accommodated in the casing; a suctioning unit configured to suction outer air from an outside of the casing to an inside of the casing via the through hole in the bottom plate; an open and close member including an outer air path for carrying the suctioned outer air and being capable of opening and closing relative to the casing; and an outer air applying unit configured to cool the heat source by the carried outer air received from the open and close member.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: March 25, 2014
    Assignee: Ricoh Company, Ltd.
    Inventors: Yuuki Kikushima, Mamoru Takayama, Hiroshi Suzuki, Satoshi Aizawa
  • Patent number: 8681482
    Abstract: This disclosure describes examples of an apparatus to enclose components of a switching assembly of an automatic transfer switch. In one embodiment, the apparatus, or arc chamber cover, has a housing made of material with optical properties that permit observation of the interior of the housing. A mounting assembly couples to the housing. The mounting assembly secures the apparatus to the automatic transfer switch. In one example, the mounting assembly comprises feet comprising a material with mechanical properties that can withstand pressure and other forces inside of the interior chamber. The apparatus also includes one or more baffles to control the flow of gasses and control electric arcs within the switching assembly.
    Type: Grant
    Filed: January 19, 2012
    Date of Patent: March 25, 2014
    Assignee: General Electric Company
    Inventors: Suresh Srikantaiah, Arthur Michael Evans, Sudarshan Allada, Pravin Pralhad Kulkarni
  • Patent number: 8634220
    Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: January 21, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito
  • Patent number: 8631890
    Abstract: The object of the present invention is to provide an electric construction machine capable of efficiently cooling the battery mounted on the swing structure. To achieve the object, there is provided an electric construction machine in which a battery storage room 11 is formed in the swing structure 3 and a plurality of batteries 231 as electric power sources are arranged in the battery storage room 11, comprising: a battery storage structure 23 storing the batteries 231 and having an air flow channel through which air can flow upward from a lower part of the battery storage structure 23; a covering sheet 26 entirely covering the top and side faces of the battery storage structure 23; and a duct 27 for discharging the air, one end of which is arranged in an upper part of the covering sheet 26.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: January 21, 2014
    Assignee: Hitachi Construction Machinery Co., Ltd.
    Inventors: Akira Noguchi, Masayuki Yunoue
  • Patent number: 8631411
    Abstract: A method for controlling a data center, comprising a plurality of server systems, each associated with a cooling system and a thermal constraint, comprising: a concurrent physical condition of a first server system; predicting a future physical condition based on a set of future states of the first server system; dynamically controlling the cooling system in response to at least the input and the predicted future physical condition, to selectively cool the first server system sufficient to meet the predetermined thermal constraint; and controlling an allocation of tasks between the plurality of server systems to selectively load the first server system within the predetermined thermal constraint and selectively idle a second server system, wherein the idle second server system can be recruited to accept tasks when allocated to it, and wherein the cooling system associated with the idle second server system is selectively operated in a low power consumption state.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: January 14, 2014
    Assignee: The Research Foundation for The State University of New York
    Inventor: Kanad Ghose