Abstract: One or more semiconductor processing tools may deposit one or more tantalum nitride layers on an upper surface of a copper interconnect and within a via. The one or more semiconductor processing tools may deposit an adhesion layer on an upper surface of the one or more tantalum nitride layers and within the via. The one or more semiconductor processing tools may deposit tungsten on an upper surface of the adhesion layer and within the via for via interconnection of the magnetic tunnel junction to the copper interconnect.

Abstract: A flash drive includes a main housing, a USB adapter unit mounted in the main housing and extending out of the main housing, an inner housing movably connected to the main housing, and a flash memory unit including a flash memory that is mounted in the inner housing, and a USB-A plug that is connected to the flash memory. The inner housing is operable to move, with respect to the main housing, between a USB-C position, where the USB-A plug is electrically connected to the USB adapter unit to allow for data transfer therebetween, and a USB-A position, where the USB-A plug is detached from the USB adapter unit to prevent data transfer therebetween, such that data is transferable to and from the flash memory via the USB-A plug.

Abstract: A system for configuring a server including a portable housing having a front panel, a back panel, and a cutout disposed on the front panel, a control board disposed within the portable housing, the control board having a socket configured to operably receive and couple to a network interface card that is insertable into and removable from the housing only through the cutout, and a rib disposed within the portable housing between the front panel and the back panel, the rib having a support configured and dimensioned to engage the network interface card when the network interface card is inserted within the housing in an aligned configuration with the socket, a cooling system coupled to and powered via the control board, the cooling system including one or more fans disposed at least partially disposed within the portable housing, and a power supply system coupled to the control board.

Abstract: An electronic device includes a casing and an expansion card. The casing includes a chassis and an installation frame. The installation frame is pivotably disposed on the chassis. The expansion card is fixed to the installation frame. The expansion card is movable along with the installation frame so as to be located in the chassis or at least partially located outside the chassis.

Abstract: The disclosed technology includes a storage system with a docking station configured to serve as an interface between a host computer and a portable data pack including multiple storage drives. The docking station includes a drive-side connection interface that provides a physical and electrical coupling to each of the multiple storage drives in the portable data pack, a RAID controller, and mode selection logic for directing communications in route between the host computer and a select drive of the multiple storage drives along one of two selectable paths within the docking station, the first path permitting the host computer to interact with the select drive through the RAID controller and the second path permitting the host computer to interact with the select drive along a data channel that bypasses the RAID controller.

Abstract: According to some example embodiments according to the present disclosure, a device includes a printed circuit board (PCB); a solid state drive (SSD) connected at a first side of the PCB via at least one SSD connector; at least one field programmable gate array (FPGA) attached to the PCB at a second side of the PCB; and at least one front end connector attached to the PCB at a third side of the PCB, wherein the device is configured to process data stored in the SSD based on a command received via the at least one front end connector.

Abstract: Solid-state supercapacitors and microsupercapacitors comprising printed graphene electrodes and related methods of preparation.

Abstract: A case for use with a portable computing device is provided. The case comprises a housing for protecting the portable computing device. The housing is configured to attach to the portable computing device. The case further comprises a multiport hub and/or a data storage device contained within the housing. The multiport hub is configured to be electrically connected to the portable computing device.

Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature.

Abstract: An adaptor for incorporating a function of an Open Compute Project (OCP) mezzanine card into a storage device includes a framework, a baseboard mounted to the framework and arranged to have the Open Compute Project (OCP) mezzanine card mounted thereon, an adapting part on the baseboard, the adapting part including an insertion slot for receiving a first interface of the OCP mezzanine card, and a connector on the baseboard, the connector configured to connect with the storage device, the baseboard including interconnections between the connector and the adapting part to provide for data exchange between the OCP mezzanine card and the storage device.

Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

Abstract: A configurable PCI card for connecting to a PCI interface is disclosed. The configurable PCI card comprises a bus interface disposed on a base card for communicatively connecting to a bus of a computing device. The configurable PCI card further comprises a bracket for physically securing the base card to the computing device. The configurable PCI card also comprises a wire layout disposed on the base card for replicating a plurality of different power and heat generation profiles that correspond to a plurality of different chipsets.

Abstract: A compact expansion card riser assembly for connection of two expansion cards to horizontally oriented circuit board is disclosed. The riser assembly includes a support bracket, a first horizontal riser board, and a second horizontal riser board. The first horizontal riser board has an expansion card connector. The first horizontal riser is attached to the support bracket. The support bracket and first horizontal riser board support a horizontally oriented expansion card. The second horizontal riser board has an expansion card connector. The second horizontal riser is attached to the support bracket. The support bracket and second horizontal riser board support a horizontally oriented expansion card.

Abstract: A cooled electronic circuit board (10) comprising: a support circuit board (11) equipped with sockets (12a, 12b, 12c) mutually alongside each other for DIMM storage modules (13); DIMM storage modules (13) each equipped with a plug (14) which can be coupled with one of the sockets (12a, 12b, 12c); two supports (15, 16) for storage modules (13), having respective channels (17) for the passage of a cooling liquid; thermal conduits (18) connected to the channels (17), each located between two adjacent sockets (12a, 12b, 12c) of the support circuit board (11); heat diffusers (19) each equipped with two walls (20, 21) each covering a side of one of the storage modules (13). The heat diffusers (19) are designed in such a way that, in use, two of the adjacent heat diffusers are in mutual thermal contact and in thermal contact with the thermal conduits (18) and with the supports (15, 16).

Abstract: An information processing system includes a processor, a memory device, and riser card. The riser card includes a riser card cage, a circuit card, and a baffle. The circuit card is installed into the riser card cage and includes a card edge and a connector affixed to the circuit card. The card edge is configured to be installed into another connector on an information handling system in a first orientation. The connector is configured to receive a card edge of an add-in card in a second orientation perpendicular to the first orientation. The baffle is integrated with the riser card cage. The baffle is configured to divert a first air flow from the processor away from the riser card cage, and to channel a second air flow from the memory device into the riser card cage.

Abstract: Carriers may be adapted, or configured, to allow devices received thereby to move towards and away from an interface end region. When devices are positioned proximate the interface end region of the carriers, interfaces of the devices may be presented by the carriers for operable coupling to an enclosure. When devices are positioned away from the interface end region of the carriers, interface adapters may be coupled to the interfaces of the devices, which may present a different interface for operable coupling to an enclosure.

Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.

Abstract: A baseboard management controller (BMC) carrier module that contains a BMC carrier bracket and a thumb screw is disclosed. The BMC carrier bracket has a back plate, a top plate, a side plate, and a corner plate. The corner plate includes a first section and a second section. The second section of the corner plate extends perpendicularly from the first section of the corner plate. The BMC carrier bracket is configured to receive a BMC board between the first section of the corner plate and the side plate. The BMC board includes an aperture to receive a screw to secure the BMC board to the BMC carrier bracket, at a distance from the back plate. The thumb screw is coupled to the second section of the corner plate of the BMC carrier bracket, and is configured to bias a memory carrier module against the side plate.

Abstract: A controller device may connect to one or more expansion modules for capability expansion. The controller device may be configured to automatically detect and identify connected expansions modules. The controller device may be configured to further automatically detect an order in which the expansion modules are connected. A graphical user interface may be provided including a visualization of the system configuration including the order of the expansion modules.

Abstract: Semiconductor packages having a die electrically connected to an antenna by a coaxial interconnect are described. In an example, a semiconductor package includes a molded layer between a first antenna patch and a second antenna patch of the antenna. The first patch may be electrically connected to the coaxial interconnect, and the second patch may be mounted on the molded layer. The molded layer may be formed from a molding compound, and may have a stiffness to resist warpage during fabrication and use of the semiconductor package.

Abstract: A server system can include a plurality of servers interconnected by a network. Each server can include a server processor, a socket configured to receive a module, and at least one removable computation module configured for insertion into the socket. Each computation module can include first processing circuits mounted on the computation module and configured to at least decrypt data packets received by the server independent of the server processor and second processing circuits mounted on the computation module and configured to form a virtual switch for switching the data packets.

Abstract: Technologies for providing workload-based sled position adjustment include a sled manipulator. The sled manipulator includes a compute engine configured to determine, as a function of a heat production of one or more resources located on a sled in the execution of a workload assigned to the sled, sled placement parameters indicative of a target position of the sled relative to a set of fans. The sled manipulator also includes a position adjustment subsystem configured to adjust, as a function of the sled placement parameters, a present position of the sled.

Abstract: A housing assembly for a solid state drive (SSD) includes a carrier cage configured to be fixed to a riser board, the carrier cage including a peripheral wall having at least one carrier slot. A carrier tray configured to house the SSD includes an interior compartment at least partially defined by the walls of the carrier tray. A first fixture is disposed at a first end of the carrier tray to engage the SSD. A second fixture is disposed at the second end of the carrier tray, opposite the first end, to engage the SSD, wherein the carrier tray is removably disposed within the carrier slot of the carrier cage.

Abstract: A case module that is capable of installing a first electronic module and a second electronic module, includes a cage and a restraining component. The first electronic module can move relative to the cage to a first installation position along a first direction. The second electronic module can move relative to the cage to a second installation position along a second direction perpendicular to the first direction. When the first electronic module moves relative to the cage toward the first installation position along the first direction, the restraining component is driven to move relative to the cage toward a restraining position along the first direction. The second electronic module can be stopped by the restraining component when the restraining component is located at the restraining position.

Abstract: In an example, a device may comprise a panel, a slider to retain the panel to the device, an actuator engaged with the slider, and a release member engaged with the actuator. The actuator may move the slider to unlock the panel and release the panel so that the panel is removable from the device. The release member may cause the actuator to move the slider when the release member is moved to a second position from a first position.

Abstract: A configurable modular computer enclosure includes a plurality of outer enclosures (1, 2, 3), the outer enclosures being connected together in a depth stacked formation producing a single composite outer enclosure with a single internal volume and a depth equalling the combined depths of the outer enclosures. The composite outer enclosure houses multiple sets of configurable inner enclosures (4, 5, 6, 7, 8), each inner enclosure set being formed into a composite inner enclosure by connecting together the inner enclosures in the set, allowing unlimited configurations of composite inner enclosures. Each composite inner enclosure is inserted into the composite outer enclosure and aligned via guides or runners (9) integrated into the outer enclosures.

Abstract: The disclosure provides a cage assembly including a cage body and a baffle. The cage body includes a rear portion, a first plate portion, a second plate portion, and a third plate portion. The first plate portion, the second plate portion and the third plate portion are respectively connected to different sides of the rear portion. The third plate portion is located between and connected to the first plate portion and the second plate portion. The rear portion, the first plate portion, the second plate portion and the third plate portion together form an accommodation space therebetween for accommodating a riser card and an expansion card. The first plate portion includes a vent hole connected to the accommodation space. The baffle is configured to be pivoted with respect to the cage body so as to adjust an area of orthogonal projection of the baffle projected on the vent hole.

Abstract: The present disclosure provides a clamping mechanism having a base. A first holding mechanism extends from one side of the base and movable to form an unfolded position and a folded position relative to the base. A second holding mechanism extends from another side of the base and movable to form the unfolded position and the folded position. The first holding mechanism restricts movement of an electronic device clamped on the clamping mechanism in a first direction in the unfolded position, the second holding mechanism restricts movement of the electronic device in a second direction in the unfolded position, and the second direction is different from the first direction. The present disclosure further provides a pan-tilt-zoom assembly with a clamping mechanism. The PTZ assembly with the clamping mechanism is suited for one-hand user operations and is not top-heavy.

Abstract: The application relates to a circuit board for a server system. The circuit board is adapted to be installed either in a server of a first type or in a server of a second type different from the first type. The circuit board includes connections for receiving assembly groups and a controller to provide a counting order to the connection depending on the server in which the circuit board is connected being a first type or a second type.

Abstract: A fixing mechanism is used to fix a first electronic component to a second electronic component of an electronic apparatus. The fixing mechanism includes a detachable frame, a constraining component, a combining component and an actuating component. The first electronic component is assembled with the detachable frame via a first plate portion of the detachable frame. The constraining component is movably disposed on the detachable frame. The constraining component abuts against the first plate portion. The combining component is disposed on the detachable frame and corresponds to a connecting component of the second electronic component. The actuating component is movably disposed on the detachable frame. The combining component and the connecting component are matched in a loose manner via the actuating component in a first position, and matched in a tight manner via the actuating component in a second position.

Abstract: Disclosed is a modular server that allows for the simple replacement of the system board, memory and key network components in a single system tray to form a system module. The system module is connected to a storage plane with hard drives through a mid-plane with power and data channels. The system module can be easily replaced or upgraded independently of the mid-plane and storage plane. This extends the life cycle of the server chassis and associated components such as hard drives and power module when upgrading, resulting in overall savings for the owner of this system.

Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board (PCB). The apparatus also includes a first dual stacked octal small format pluggable (OSFP) module coupled to the PCB on a top surface of the PCB. The first dual stacked OSFP module comprises two OSFP modules that are vertically stacked. The apparatus further includes a second dual stacked OSFP module coupled to the PCB on a bottom surface of the PCB. The second dual stacked OSFP module comprises two OSFP modules that are vertically stacked. A first bottom of the first dual stacked OSFP module is flush against the top surface of the PCB. A second bottom of the second dual stacked OSFP is flush against the bottom surface of the PCB.

Abstract: A product for holding a tobacco product or a tobacco substitute includes an integrated electronic device with: a power source; an input means comprising a sensor to generate an input signal from an external stimulus; an output means to generate an output signal; digital processing means to process the input signal and deliver a command signal to the output means based at least in part on processing of the input signal; and circuitry connecting the power source, the input means, the output means and the digital processing means; wherein the power source, the input means, the output means, the digital processing means and the circuitry are printed on a substantially flexible substrate. Use of packaging for holding a tobacco product or tobacco substitute includes such a product with an integrated electronic device.

Abstract: An electronic device case with a transparent or translucent back panel. The case generally comprises a frame, configured to surround the outer periphery of the electronic device, coupled to a back panel, configured to cover the back of the electronic device. The frame generally includes a plurality of outer sidewalls surrounding a center cutout. The back panel is formed from a hard plastic material such as polycarbonate. In example embodiments, the back panel material is a clear, transparent material. In other embodiments, the back panel material is a tinted or translucent material. The frame is generally overmolded onto the front or interior surface of the back panel.

Abstract: A memory socket protecting cover adapted to be assembled to a memory socket which is adapted for a memory module to insert is provided. The memory module includes a fool-proof concave, and includes a fool-proof member corresponding to the fool-proof concave. The memory socket protecting cover includes two lateral walls and a wear-resistant member. The two lateral walls are adapted to be disposed at two sides of the memory socket. The wear-resistant member is connected to the two lateral walls and adapted to be disposed on the fool-proof member. A width of the wear-resistant member is greater than or equal to a width of the fool-proof member and is smaller than a width of the fool-proof concave. When the memory module is inserted in or pulled from the memory socket, a wall of the memory module besides the fool-proof concave is adapted to contact the wear-resistant member.

Abstract: An edge card mounting structure includes an edge card, an electrical connector disposed on a circuit board, and a rack that holds the edge card and is inserted into the electrical connector to electrically connect the edge card to the electrical connector. The rack includes a rack body that accommodates the edge card, two bearing plates bilaterally disposed in the rack body, and two adjustment members that are elastically pressable to move the accommodated edge card downwardly into abutment against the bearing plates where the electric contacts of the edge card are kept in contact with the respective contact endpieces of the conducting terminal set of the electrical connector for transmitting high frequency signals.

Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.

Abstract: A storage device for graphic processors and a configuration setting adjusting method are provided. The method includes: obtaining a chassis connection status by a processor according to a first chassis electrically connected to an input/output module; reading a first initial configuration setting in a switching circuit of the first chassis by the processor; obtaining a host connection status by the processor according to at least one first connection interface electrically connected to at least one first host; and determining whether the first initial configuration setting is applicable to the chassis connection status and the host connection status by the processor according to the chassis connection status, the host connection status and a preset rule; if not, adjusting, by the processor, the first initial configuration setting of the first chassis to another configuration setting which is applicable to the chassis connection status and the host connection status.

Abstract: The present disclosure provides a chassis assembly which can include a chassis body, at least one sled, and at least one rear bracket. The chassis body can have at least one pair of rail brackets along opposing sides of the chassis body. The at least one sled can hold computer components and be sized according to the computer components. The at least one rear bracket can couple with the at least one sled.

Abstract: The invention relates to a switch cabinet or rack or rack for receiving electrical energy storage units, in particular batteries, whereby the switch cabinet or the rack has a plurality of energy storage unit slots arranged above one another, so characterized in that the energy storage unit slots are formed by a plurality of grooves, whose longitudinal and slide-in direction extends in the depth direction of the switch cabinet or rack, whereby in each case a pair of grooves are set up on the opposite lying sides of the switch cabinet or rack at the same vertical height and with their open longitudinal side directed toward one another.

Abstract: Techniques involve use of an adaptor for a storage device. The adaptor includes a baseboard arranged to support an Open Compute Project (OCP) mezzanine card in the storage device; a connector coupled to the baseboard and arranged to connect with the storage device; and an adapting part coupled to the baseboard and including an insertion slot for receiving a first interface of the OCP mezzanine card.

Abstract: A substrate guide member is integrally formed of resin, and includes: a support portion fixed in a casing; and at least one pair of a first protrusion and a second protrusion protruding from the support portion and extending in an insertion direction with a gap from each other, to thereby form a groove for allowing passage of a substrate. The at least one pair of the first protrusion and the second protrusion includes: a plurality of guide portions configured to guide the substrate; and separated portions, which are portions connecting the plurality of guide portions and have a gap larger than the gap of the plurality of guide portions.

Abstract: A docking device is provided. A portable information device can be removably attached to a docking device. The docking device includes first and second connectors that are connected to connection terminals provided on the portable information device. The docking device further includes: a first substrate with the first connector mounted thereon; a second substrate with the second connector other than the first connector mounted on the first substrate mounted thereon; and a substrate connecting member that connects between the first and second connectors in a floating state that allows relative displacement.

Abstract: Examples disclosed herein provide a compute server system comprising a plurality of nodes. In one example, each node generally includes a replaceable power source externally accessible to the node, and a guide for housing the replaceable power source. The guide generally includes conductive elements to make contact with conductive elements of the replaceable power source, and an elastic member to eject the replaceable power source from the node.

Abstract: A method and associated expansion card and computing device are disclosed. The method comprises inserting an expansion card into a connector of a printed circuit board (PCB) of the computing device. The expansion card comprises a handle that is adjustable between at least a retracted position and an extended position. The method further comprises installing a cover of the computing device. The handle is dimensioned such that when the handle is in the extended position, the handle is configured to limit motion of the expansion card toward the cover.

Abstract: Approaches, techniques, and mechanisms are disclosed for manufacturing and operating portable module systems. The portable module systems can provide additional computing, memory, communication, networking, and power functionality in compact package that can be connected to a host system. The portable module system can dissipate thermal energy using an embedded cooling system to allow the use of high performance components. The portable module system can improve the functionality and computing capacity of the host system by linking off the shelf component boards with the external bus using a bridge interface unit to transfer information from an internal bus to the external bus.

Abstract: Apparatuses for securing a memory card. One example apparatus can include a slot coupled to a printed circuit board (PCB), wherein the slot is configured to receive a memory card to provide electrical connection between the PCB and the memory card and a cover coupled to the PCB and configured to enclose the memory card when in a closed position and maintain electrical connection between the memory card and the PCB when in the closed position.

Abstract: A distributed system includes a plurality of storage systems and a network connecting the storage systems. Each storage system includes a host having a processor and a memory, and a storage device having a controller and a nonvolatile memory. When a first storage system receives, a second storage system, a write command, write data, and size information of the write data, the controller in the first storage system determines an address of the nonvolatile memory of the first storage system in which the write data are to be written, based on the write command and the size information, writes the write data in the nonvolatile memory associated with the address, and transmits the address to the second storage system, and the processor of the second storage system stores management data indicating correspondence between identification information of the write data and the address in the memory of the second storage system.

Abstract: Disclosed are an electrical power supply expansion card and a computer case. The electrical power supply expansion card comprises a housing and a circuit board. The circuit board is arranged on the housing, and the housing is installed in the computer case. The circuit board is provided with at least one peripheral interface, and is further provided with at least one power source interface. The at least one power source interface is detachably connected to a power source in the computer case so as to obtain electric power and output electric power via the at least one peripheral interface. The technical solution provided in the present invention can enable the expansion card to be an expanded power source of the power source in the computer case, thus supplying power to an external device, thereby improving the usability of the expansion card.

Abstract: A storage unit combining module capable of loading a plurality of storage units, and a storage unit moving suit having several storage unit combining modules and a related server apparatus are disclosed. The storage unit combining module includes a base, a circuit backboard and a signal adapter. The base has several positioning zones and an open zone. The circuit backboard includes a first section and a second section bent from each other. The circuit backboard further includes a plurality of connectors respectively disposed on the corresponding positioning zones. The signal adapter is disposed on the open zone and electrically connected to the second section. Two storage units are respectively loaded into two positioning zones on a right side of the base in a first inserting direction, and one storage unit is further loaded into a single positioning zone on a left side of the base in a second inserting direction.