Abstract: Designs for a rackmount chassis having multiple card slots are presented herein. In one example, an apparatus includes a chassis configured to mount into a server rack, including a plurality of peripheral card slots, and a plurality of status lights configured to provide indications of operational status for an associated slot. The chassis further includes switch circuitry, including at least three switch elements, configured to couple the slots, wherein a first portion of ports on each of the switch elements is coupled to corresponding slots, a second portion of the ports on each of the switch elements is coupled to external ports of the chassis, and a third portion of the ports on each of the switch elements is coupled to at least another among the switch elements. The chassis may further include a plurality of external ports on the chassis communicatively coupled to the slots through the switch circuitry.

Abstract: A display driver circuit may include a revision controller for controlling a nonvolatile memory having instructions by which control data for controlling devices controlled by the display driver circuit are changed, and a drive controller for controlling the devices based on the instructions. The revision controller determines whether to perform a read operation to the instructions based on electrical power being applied to the display driver circuit, and transfers instruction signals, which are generated based on the determination to perform the read operation, to the driving controller.

Abstract: Described is a packaging technology to improve performance of an AI processing system. An IC package is provided which comprises: a substrate; a first die on the substrate, and a second die stacked over the first die. The first die includes memory and the second die includes computational logic. The first die comprises a ferroelectric RAM (FeRAM) having bit-cells. Each bit-cell comprises an access transistor and a capacitor including ferroelectric material. The access transistor is coupled to the ferroelectric material. The FeRAM can be FeDRAM or FeSRAM. The memory of the first die may store input data and weight factors. The computational logic of the second die is coupled to the memory of the first die. The second die is an inference die that applies fixed weights for a trained model to an input data to generate an output. In one example, the second die is a training die that enables learning of the weights.

Abstract: According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

Abstract: An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

Abstract: Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

Abstract: An electronic device is provided. The electronic device includes a housing, a first riser module, a hard-disk backplane module, and a plurality of hard-disks. The first riser module is disposed in the housing. The first riser module includes a first tray structure and a first riser board. The first riser board is disposed on the first tray structure. The first tray structure is adapted to move the first riser board in a first direction. The hard-disk backplane module is disposed in the housing. The tray structure is adapted to move the first riser board in the first direction to connect the hard-disk backplane module. The hard-disks are connected to the hard-disk backplane module. The modules of the electronic device of the embodiment of the invention can be coupled together more easily.

Abstract: A hybrid cable distribution system wherein a feeder cable is received by a box. The feeder cable can be a hybrid cable including optical fibers and copper wire (coax). The box may be used only for copper signal handling (such as coaxial signal handling), and then at a later date, the box may be used for receiving fiber signals. Customers can directly connect to the feeder fan out device by connecting a tail of a drop splice module that is spliced to an individual distribution cable to the feeder fan out device. This connection creates a point-to-point connection. The number of fan out devices in the system can be increased or decreased as needed. Alternatively, a splitter input can be connected to the feeder fan out device, such as through a pigtail extending from the splitter, wherein the splitter splits the signal as desired into a plurality of outputs. The outputs of the splitters can be in the form of connectors or adapters.

Abstract: Clean chamber technology for 3D printers and bioprinters is described. An airtight chamber or enclosure is provided so that positive pressure can be created inside the chamber. Unfiltered air is sucked in from outside into the chamber through a high efficiency filter such as a HEPA filter, using an electrically powered fan or blower, filtering out at least about 99% of particles and contaminants. The filtered air is then pushed into a 3D printing area inside the chamber and out through vents within the frame of the chamber. The technology provides a clean environment for 3D bioprinting of human tissue models and organs and 3D cell culturing without requiring clean room facilities.

Abstract: Systems for controlling louver positions are described herein. Such systems may include: a louver frame; a louver coupled to the louver frame via a rotation member and adapted to rotate at a louver side around an axis of rotation at the rotation member. In one embodiment, the louver includes a spring member engagement feature. The system also includes a spring member coupled to the louver frame and adapted to engage with the spring member engagement feature of the louver and apply a force to the louver when a forward airflow is applied to the louver in a forward airflow direction.

Abstract: According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

Abstract: The present disclosure provides an installation device and a server including the installation device. The installation device includes: a bottom bracket for supporting a hard disk drive; a first positioning bracket detachably arranged on a first side of the bottom bracket; and a second positioning bracket fixedly arranged on a second side opposite to the first side of the bottom bracket; the first positioning bracket and the second positioning bracket are configured to fix the hard disk drive. Compared with the traditional design, four screws are omitted in the present disclosure to avoid manual locking operation in the production line and operation and maintenance of the hard disk drive module, which meets the requirements of easy installation and cost-saving design. And by adding an adapter bracket, it can be converted to a 2.5-inch hard drive bracket, which has strong compatibility.

Abstract: A memory package structure includes a substrate, a memory chip and a plurality of resistors. The substrate has a plurality of pins. The pins include a plurality of data pins used to transfer data signal. The memory chip is located on the substrate. A plurality of bonding pads is located on the memory chip. The bonding pads include a plurality of data pads used to receive the data signal from data pins or transfer the data signal from the memory chip. The resistors is located on the substrate. Each data pad is connected to a corresponding one of the data pins through a corresponding one of the resistors.

Abstract: A server including chassis, motherboard, mounting cage, first guide pillar and expansion card. Motherboard is stacked on chassis bottom plate. Mounting cage includes bearing base, handle and first pivot. Bearing base is located on a side of motherboard located away from the chassis bottom plate and located between two chassis side plates. One of two bearing base side plates includes first guide slot, and handle is pivotally connected to the one of two bearing base side plates via first pivot and includes engagement hole. First guide pillar is fixed to the one of two chassis side plates and slidably disposed in first guide slot of the one of two chassis side plates. First guide pillar is engaged into engagement hole of handle. Expansion card is stacked on bearing base bottom plate and electrically connected to motherboard.

Abstract: An equipment rack that includes a modular compute chassis, a modular processing unit located in the modular compute chassis and where the modular processing unit is configured to remove from the front of the modular compute chassis in a frontward direction, relative to the front side of the modular compute chassis, and an air mover unit located in the modular processing unit and where the air mover unit is configured to remove from a rear side of the modular processing unit in a rearward direction, relative to the front side of modular compute chassis.

Abstract: An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

Abstract: A protection device, disposed on a base or an accommodating rack that is disposed on the base, includes a bracket slidingly disposed on the base and being slidable between a first position and a second position, and a switch disposed in the bracket. At least a portion of the switch is in the accommodating rack when the bracket is in the first position; and the switch is out of the accommodating rack when the bracket is in the second position.

Abstract: A weighing and labeling system has an electronic scale, label printer, and at least one controller. The controller stores information about incoming food packages and drives the printer to produce labels based on the stored information and the weight of the food packages. The labels are transferred to the food packages. Some elements of the system are located in sealable cabinets, and further, some of the elements are mounted on the interior surface on doors hinged to the sealable cabinets. This is advantageous in food production environments requiring frequent cleaning of equipment with sprayed water. In some embodiments the sealable cabinets are positioned on vertical masts and rotatable on the masts.

Abstract: An adaptor assembly for an OCP 2.0 form factor card for installation in a server having a side slot to accommodate OCP 3.0 form factor cards is disclosed. The adaptor assembly has an adaptor board allowing the attachment of the OCP 2.0 form factor. The adaptor board includes a socket mateable with a connector on the OCP 2.0 form factor and an edge connector mateable with a socket on the server. The assembly includes an adaptor bracket attachable to the adaptor board. The adaptor bracket has a wall that covers the side slot of the server when the adaptor assembly is inserted through the side slot.

Abstract: An environment control apparatus includes an apparatus body, a processing device, a plurality of heating devices, and a plurality of cooling devices. The apparatus body includes a plurality of accommodating chambers each having one of the heating devices or one of the cooling devices. Each of the heating devices has a high temperature contacting structure, and each of the cooling devices has a low temperature contacting structure. When a chip testing device carrying chips is arranged in one of the accommodating chambers, the chip testing device is supplied with electricity, and the heating device or the cooling device of the one of the accommodating chambers is in operation, the chip testing device is configured to test the chips disposed thereon.

Abstract: Techniques arrange a disk, a storage device, and a disk array. Such techniques involve: a bracket configured to be detachably coupled to a rack; and a button arranged in the bracket and configured to be movable under the action of an external force to decouple the bracket from the rack, wherein a first end of the button is configured to be operated by a user, and the end surface of the first end includes a first surface and a second surface, the second surface extending from the first surface towards a second end, opposite to the first end, of the button. Accordingly, such techniques not only can avoid accidental touch, improve heat dissipation efficiency, and provide a mark area, but also can help prevent loss of user data in a storage device and a disk array.

Abstract: A fan connector comprises a connector body, a plurality of chip terminals, a plurality of wiring terminals, and a chip circuit board. The connector body comprises an electrical connection slot, a chip slot, and a wiring slot. The plurality of chip terminals and the plurality of wiring terminals are disposed on a sidewall of the electrical connection slot. The plurality of chip terminals corresponds to the plurality of wiring terminals, respectively. The chip circuit board comprises a chip, a circuit board, and a plurality of conductive pads. The chip circuit board is inserted into the chip slot. The plurality of conductive pads is in contact with the corresponding chip terminals. One end of the connector body is connected to a fan, in which a wire passes through the wiring slot and connects to the plurality of wiring terminals. An external plug is possible to insert into the electrical connection slot.

Abstract: A tool-free hard disk mounting and dismounting device is provided according to the present application. The tool-free hard disk mounting and dismounting device includes a fixing support, a spring strip and a handle, wherein the fixing support includes a base plate, a first vertical plate and a second vertical plate, the first vertical plate and the second vertical plate are fixed to two sides of the base plate respectively, and fixing convex portions are provided at two sides of the first vertical plate respectively. The spring strip is fixed to the second vertical plate and located at an outer side of the second vertical plate, a bent portion is provided at each of two ends of the spring strip, a fixing column is provided at each of the bent portions, and a spring strip oblique boss is provided at each of two sides of the spring strip.

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

Abstract: A rotary extending frame includes a frame, a handle, a plurality of friction pieces, and a plurality of positioning discs. The frame has a plurality of accommodation spaces and fastening portions. The handle is rotatably disposed on the frame and has a holding portion and a plurality of rotating portions connected to two ends of the holding portion and facing two side surfaces of the frame respectively. The friction pieces are disposed on the corresponding rotating portions respectively and are firmly attached on the two side surfaces. The positioning discs are disposed on the corresponding rotating portions respectively and are pivotally connected to the friction pieces. The friction pieces and the frame clamp the corresponding rotating portions, so that the rotating portions and the positioning discs are adapted to rotate relative to the friction pieces and the frame and rub against the corresponding friction pieces simultaneously.

Abstract: An electronic device is provided. The electronic device includes a housing, a battery included within the housing, a connector electrically connected to an external power supply device including an integrated circuit (IC) and exposed to a part of the housing, and a power management unit included within the housing and electrically connected to the connector, wherein the power management unit is configured to communicate with the IC of the external power supply device, and wherein the connector is configured to receive a first current of a first current value during at least a part of the communication and to receive a second current of a second current value greater than the first current value during at least a part in which the communication is not performed.

Abstract: An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package including a semiconductor chip, having an inactive surface and an active surface, on which a connection pad is disposed, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure to each other.

Abstract: Technologies for facilitating remote memory requests in accelerator devices are disclosed. The accelerator device includes circuitry to receive, from a kernel of the present accelerator device, a request through an application programming interface exposed to a high level software language in which the kernel of the present accelerator device is implemented, to establish a logical communication path between the kernel of the present accelerator device and a target accelerator device kernel, based on one or more physical communication paths. The communication protocol supported by the accelerator device may allow kernels operating on the accelerator device to send memory requests for memory locations at remote devices, with the communication protocol performing all of the operations necessary to carry out the memory request.

Abstract: Nano antenna structures and methods of manufacturing the same are provided. A nano antenna structure includes a reflective layer, a transparent conductive layer disposed on the reflective layer, an insulating layer disposed on the transparent conductive layer, a nano antenna material layer disposed on the insulating layer, and an adhesion layer disposed between the insulating layer and the nano antenna material layer.

Abstract: A solid state drive apparatus may include a main body including a semiconductor device, a label attached to a first portion of an exterior surface of the main body such that a second portion of the exterior surface of the main body is free of the label, and an information marking on the label and on the second portion of the exterior surface of the main body.

Abstract: A cooling arrangement for a server mountable in a server rack comprises a phase change device and a fluid cooling unit. The phase change device includes an evaporator mountable on a heat-generating unit of the server, a condenser disposed outside of the server, and conduits extending laterally from the server, between the evaporator and the condenser. The conduits carry a working fluid heated in the evaporator to the condenser. The working fluid is cooled in the condenser before returning to the evaporator. The fluid cooling unit is positioned along the server rack and receives a cooling fluid from an external cooling facility. A heat transfer module of the fluid cooling unit has an open channel for slidably receiving the condenser. The cooling fluid flows in a water jacket surrounding the open channel. Heat is transferred from the condenser to the cooling fluid flowing in the water jacket.

Abstract: An accommodating structure of data storage unit includes a carrier case formed by integrated injection molding. The carrier case is a plastic piece comprising a housing, a pair of elastic arms connected with the housing and a push block connected with the elastic arms. The housing has a receiving space, and the push block has a tab at a side away from the receiving space. Moreover, the present invention further provides an accommodating assembly of data storage unit. The components of the accommodating assembly are less and the structures are simple to enhance the convenience of assembly.

Abstract: To address the issue of shrinking volume that can be allocated for electrical components, a system can use an interposer with a flexible portion. A first portion of the interposer can electrically connect to a top side of a motherboard. A flexible portion of the interposer, adjacent to the first portion, can wrap around an edge of the motherboard. A peripheral portion of the interposer, adjacent to the flexible portion, can electrically connect to a bottom side of the motherboard. The peripheral portion can be flexible or rigid. The interposer can define a cavity that extends through the first portion of the interposer. A chip package can electrically connect to the first portion of the interposer. The chip package can be coupled to at least one electrical component that extends into the cavity when the chip package is connected to the interposer.

Abstract: A package-on-package and a package connection system including the same are provided. The package-on-package includes a first semiconductor package including a first semiconductor chip, and a second semiconductor package disposed on the first semiconductor package and including a second semiconductor chip electrically connected to the first semiconductor chip. The first semiconductor chip includes an application processor (AP) including a first image signal processor (ISP), and the second semiconductor chip includes a second image signal processor (ISP).

Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.

Abstract: Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.

Abstract: In one embodiment, an apparatus includes a fan for cooling electronics within a chassis, the fan comprising a rotor with a plurality of fan blades connected thereto for generating an axial airflow during operation of the fan, a sensor for detecting failure of the fan, and an airflow blocking device positioned at an exhaust side of the fan and configured to prevent airflow through the fan upon detection of the fan failure, wherein the airflow blocking device is stowed in a position removed from a path of the axial airflow generated by the fan during operation of the fan. A method for preventing airflow recirculation at a failed fan is also disclosed herein.

Abstract: An example system includes a first data port and a second data port. The system includes a controller electrically coupled to the first and second data ports. The controller is to cause the first data port to receive power. The controller is to cause the second data port to output at least a portion of the received power. The controller is to detect an impending loss of power to the first data port. The controller is to cause the second data port to transmit an urgent power request.

Abstract: An air guide cover fixed on a motherboard having slot connectors and main coolers. The air guide cover includes an air guide body and a clip assembly. The air guide body covers the slot connectors correspondingly. The clip assembly has a first U-clip and a second U-clip, both of which connected to the air guide body. The first U-clip and the second U-clip are individually snapped and fixed to the clips of the slot connectors and the fixtures of the main coolers, respectively. In this way, the air guide cover can be fixed on the motherboard without using fasteners, like screws, such that savings in time and effort are achieved.

Abstract: An optical transceiver includes a housing, a fastening component, and a bail. The fastening component is movably disposed on the housing and configured to be detachably fastened with the cage. The bail is pivoted on the fastening component and includes a holding portion. The holding portion is configured to abut the housing to maintain a pivot angle between the bail and the fastening component.

Abstract: The present disclosure includes an ultrasound diagnostic apparatus with easy assembly and disassembly. The apparatus comprises an outer casing including a motherboard module having motherboard guiding plugs and motherboard ports installed thereon and a first outer-casing sliding device; and a main case structure being housed by the outer casing, including a transducer panel module coupled to an I/O module, a carrier board module coupled to the transducer panel module via the I/O module and having a PC module installed thereon process ultrasound data, carrier-board guiding holes to receive the motherboard guiding plugs, carrier-board ports to inter-plug in the motherboard ports, and a first main-case sliding device to slide in the first outer-casing sliding device and facilitate the main case structure to move relative to the outer casing; wherein the motherboard module and the I/O module are perpendicular to the transducer panel module and the carrier board module.

Abstract: An antenna module includes an antenna substrate including a core layer, insulating layers disposed on opposite surfaces of the core layer, and wiring layers including antenna patterns. The antenna substrate has first and second recess portions. The antenna module further includes a passive component disposed in the first recess portion, a semiconductor chip disposed in the second recess portion and having an active surface, an encapsulant encapsulating at least portions of the semiconductor chip and the passive component, and a connection portion disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the semiconductor chip. The passive component has a thickness greater than that of the semiconductor chip, and the first recess portion has a depth greater than that of the second recess portion.

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

Abstract: A cooling device includes, a liquid immersion tank having an opening in a top thereof, in which an electronic circuitry including a heat generating circuit is immersed in a second coolant, a lid fitted into the opening, and a cooler, into which a cooled first coolant is input through a first pipe, and from which the first coolant is output through a second pipe, the cooler being located between a liquid level of the second coolant and a lower surface of the lid that faces the liquid level.

Abstract: A semiconductor memory device includes a substrate, a controller, a semiconductor memory component, first and second capacitors, and a jumper element. The substrate has a conductor pattern. The conductor pattern includes a first conductor portion and a second conductor portion. The first conductor portion overlaps at least a part of the first capacitor in a thickness direction of the substrate and is electrically connected to the first capacitor. The second conductor portion overlaps at least a part of the second capacitor in the thickness direction of the substrate and is electrically connected to the second capacitor. The first conductor portion and the second conductor portion are separated from each other, and are electrically connected to each other by the jumper element.

Abstract: An antenna apparatus comprises a semiconductor die in a molding compound layer, a first through via is between a sidewall of the semiconductor die and a sidewall of the molding compound layer and an antenna structure over the molding compound layer, wherein a first portion of the antenna structure is directly over a top surface of the semiconductor die and a second portion of the antenna structure is directly over a top surface of the first through via.

Abstract: An apparatus for mounting a hard disk drive unit and an optical disk drive unit to an electronic device includes a supporting bracket defining an accommodating space for the hard disk drive unit and the optical disk drives unit and a clip. The supporting bracket includes a connecting plate and a resilient latching member attached to the connecting plate and located within the connecting plate. The clip corresponds to the resilient latching member and is configured to be attached to the optical disk drive unit. The resilient latching member is switchable between a clip-locking position and a clip-unlocking position.

Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

Abstract: Novel tools and techniques are provided for implementing FTTx, which might include Fiber-to-the-Home (“FTTH”), Fiber-to-the-Premises (“FTTP”), and/or the like. A method might include routing an F1 line(s) from a central office or DSLAM to a fiber distribution hub (“FDH”) located within a block or neighborhood of customer premises, via at least an apical conduit source slot. From the FDH, an F2 line(s) might be routed, via any combination of various apical conduit components, to a network access point (“NAP”) servicing one or more customer premises. An F3 line(s) might be distributed, at the NAP and from the F2 line(s), to a network interface device (“NID”) or optical network terminal (“ONT”) at each customer premises, via any combination of the apical conduit components, which include channels in at least portions of roadways. In some embodiments, at least one wireless access point is disposed in each of one or more channels.

Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.