For Computer Memory Unit Patents (Class 361/679.31)
  • Patent number: 10950561
    Abstract: An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package including a semiconductor chip, having an inactive surface and an active surface, on which a connection pad is disposed, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure to each other.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung Mi Jung, Kyoung Ok Jung, Guk Hee Jung
  • Patent number: 10949362
    Abstract: Technologies for facilitating remote memory requests in accelerator devices are disclosed. The accelerator device includes circuitry to receive, from a kernel of the present accelerator device, a request through an application programming interface exposed to a high level software language in which the kernel of the present accelerator device is implemented, to establish a logical communication path between the kernel of the present accelerator device and a target accelerator device kernel, based on one or more physical communication paths. The communication protocol supported by the accelerator device may allow kernels operating on the accelerator device to send memory requests for memory locations at remote devices, with the communication protocol performing all of the operations necessary to carry out the memory request.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 16, 2021
    Assignee: Intel Corporation
    Inventors: Susanne M. Balle, Evan Custodio, Paul H. Dormitzer, Narayan Ranganathan
  • Patent number: 10928700
    Abstract: Nano antenna structures and methods of manufacturing the same are provided. A nano antenna structure includes a reflective layer, a transparent conductive layer disposed on the reflective layer, an insulating layer disposed on the transparent conductive layer, a nano antenna material layer disposed on the insulating layer, and an adhesion layer disposed between the insulating layer and the nano antenna material layer.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: February 23, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Changbum Lee, Sunil Kim, Duhyun Lee, Byounglyong Choi
  • Patent number: 10929729
    Abstract: A solid state drive apparatus may include a main body including a semiconductor device, a label attached to a first portion of an exterior surface of the main body such that a second portion of the exterior surface of the main body is free of the label, and an information marking on the label and on the second portion of the exterior surface of the main body.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: February 23, 2021
    Inventors: Ji-hye Cha, Beom-jun Kim, Nam-ho Song, Sung-woo Joo
  • Patent number: 10897837
    Abstract: A cooling arrangement for a server mountable in a server rack comprises a phase change device and a fluid cooling unit. The phase change device includes an evaporator mountable on a heat-generating unit of the server, a condenser disposed outside of the server, and conduits extending laterally from the server, between the evaporator and the condenser. The conduits carry a working fluid heated in the evaporator to the condenser. The working fluid is cooled in the condenser before returning to the evaporator. The fluid cooling unit is positioned along the server rack and receives a cooling fluid from an external cooling facility. A heat transfer module of the fluid cooling unit has an open channel for slidably receiving the condenser. The cooling fluid flows in a water jacket surrounding the open channel. Heat is transferred from the condenser to the cooling fluid flowing in the water jacket.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: January 19, 2021
    Assignee: OVH
    Inventors: Ali Chehade, Hadrien Bauduin
  • Patent number: 10847188
    Abstract: An accommodating structure of data storage unit includes a carrier case formed by integrated injection molding. The carrier case is a plastic piece comprising a housing, a pair of elastic arms connected with the housing and a push block connected with the elastic arms. The housing has a receiving space, and the push block has a tab at a side away from the receiving space. Moreover, the present invention further provides an accommodating assembly of data storage unit. The components of the accommodating assembly are less and the structures are simple to enhance the convenience of assembly.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: November 24, 2020
    Assignee: SUPER MICRO COMPUTER INC.
    Inventors: Yueh-Ming Liu, Hung-Chieh Chang, Tan-Hsin Chang, Hsiao-Chung Chen, Yu-Chuan Chang
  • Patent number: 10840177
    Abstract: To address the issue of shrinking volume that can be allocated for electrical components, a system can use an interposer with a flexible portion. A first portion of the interposer can electrically connect to a top side of a motherboard. A flexible portion of the interposer, adjacent to the first portion, can wrap around an edge of the motherboard. A peripheral portion of the interposer, adjacent to the flexible portion, can electrically connect to a bottom side of the motherboard. The peripheral portion can be flexible or rigid. The interposer can define a cavity that extends through the first portion of the interposer. A chip package can electrically connect to the first portion of the interposer. The chip package can be coupled to at least one electrical component that extends into the cavity when the chip package is connected to the interposer.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: November 17, 2020
    Assignee: Intel Corporation
    Inventors: Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim, Tin Poay Chuah
  • Patent number: 10840225
    Abstract: A package-on-package and a package connection system including the same are provided. The package-on-package includes a first semiconductor package including a first semiconductor chip, and a second semiconductor package disposed on the first semiconductor package and including a second semiconductor chip electrically connected to the first semiconductor chip. The first semiconductor chip includes an application processor (AP) including a first image signal processor (ISP), and the second semiconductor chip includes a second image signal processor (ISP).
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: November 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kwan Lee, Young Sik Hur, Won Wook So
  • Patent number: 10833046
    Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: November 10, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tea Geon Kim, Jung Lae Jung, Bub Ryong Lee
  • Patent number: 10825483
    Abstract: Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: November 3, 2020
    Assignee: Dell Products, L.P.
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Patent number: 10813248
    Abstract: In one embodiment, an apparatus includes a fan for cooling electronics within a chassis, the fan comprising a rotor with a plurality of fan blades connected thereto for generating an axial airflow during operation of the fan, a sensor for detecting failure of the fan, and an airflow blocking device positioned at an exhaust side of the fan and configured to prevent airflow through the fan upon detection of the fan failure, wherein the airflow blocking device is stowed in a position removed from a path of the axial airflow generated by the fan during operation of the fan. A method for preventing airflow recirculation at a failed fan is also disclosed herein.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 20, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: Rohit Dev Gupta, Robert Gregory Twiss
  • Patent number: 10802559
    Abstract: An example system includes a first data port and a second data port. The system includes a controller electrically coupled to the first and second data ports. The controller is to cause the first data port to receive power. The controller is to cause the second data port to output at least a portion of the received power. The controller is to detect an impending loss of power to the first data port. The controller is to cause the second data port to transmit an urgent power request.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: October 13, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Roger D Benson
  • Patent number: 10785888
    Abstract: An air guide cover fixed on a motherboard having slot connectors and main coolers. The air guide cover includes an air guide body and a clip assembly. The air guide body covers the slot connectors correspondingly. The clip assembly has a first U-clip and a second U-clip, both of which connected to the air guide body. The first U-clip and the second U-clip are individually snapped and fixed to the clips of the slot connectors and the fixtures of the main coolers, respectively. In this way, the air guide cover can be fixed on the motherboard without using fasteners, like screws, such that savings in time and effort are achieved.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: September 22, 2020
    Assignee: SUPER MICRO COMPUTER INC.
    Inventor: William Shen
  • Patent number: 10742323
    Abstract: An optical transceiver includes a housing, a fastening component, and a bail. The fastening component is movably disposed on the housing and configured to be detachably fastened with the cage. The bail is pivoted on the fastening component and includes a holding portion. The holding portion is configured to abut the housing to maintain a pivot angle between the bail and the fastening component.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: August 11, 2020
    Assignee: Prime World International Holdings Ltd.
    Inventors: Yu Chen, Hsuan-Chen Shiu, Che-Shou Yeh
  • Patent number: 10709418
    Abstract: The present disclosure includes an ultrasound diagnostic apparatus with easy assembly and disassembly. The apparatus comprises an outer casing including a motherboard module having motherboard guiding plugs and motherboard ports installed thereon and a first outer-casing sliding device; and a main case structure being housed by the outer casing, including a transducer panel module coupled to an I/O module, a carrier board module coupled to the transducer panel module via the I/O module and having a PC module installed thereon process ultrasound data, carrier-board guiding holes to receive the motherboard guiding plugs, carrier-board ports to inter-plug in the motherboard ports, and a first main-case sliding device to slide in the first outer-casing sliding device and facilitate the main case structure to move relative to the outer casing; wherein the motherboard module and the I/O module are perpendicular to the transducer panel module and the carrier board module.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: July 14, 2020
    Assignee: CHISON MEDICAL TECHNOLOGIES CO., LTD.
    Inventors: Dongdong Sun, Chunlin Peng, Jian Lu
  • Patent number: 10685926
    Abstract: An antenna module includes an antenna substrate including a core layer, insulating layers disposed on opposite surfaces of the core layer, and wiring layers including antenna patterns. The antenna substrate has first and second recess portions. The antenna module further includes a passive component disposed in the first recess portion, a semiconductor chip disposed in the second recess portion and having an active surface, an encapsulant encapsulating at least portions of the semiconductor chip and the passive component, and a connection portion disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the semiconductor chip. The passive component has a thickness greater than that of the semiconductor chip, and the first recess portion has a depth greater than that of the second recess portion.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: June 16, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hyun Lim, Han Kim, Chul Kyu Kim, Sang Jong Lee, Jung Ho Shim
  • Patent number: 10678311
    Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: June 9, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jiyong Kim, Suin Kim, Teck Su Oh, Sung-Ki Lee
  • Patent number: 10674637
    Abstract: A cooling device includes, a liquid immersion tank having an opening in a top thereof, in which an electronic circuitry including a heat generating circuit is immersed in a second coolant, a lid fitted into the opening, and a cooler, into which a cooled first coolant is input through a first pipe, and from which the first coolant is output through a second pipe, the cooler being located between a liquid level of the second coolant and a lower surface of the lid that faces the liquid level.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: June 2, 2020
    Assignee: FUJITSU LIMITED
    Inventor: Minoru Ishinabe
  • Patent number: 10629263
    Abstract: A semiconductor memory device includes a substrate, a controller, a semiconductor memory component, first and second capacitors, and a jumper element. The substrate has a conductor pattern. The conductor pattern includes a first conductor portion and a second conductor portion. The first conductor portion overlaps at least a part of the first capacitor in a thickness direction of the substrate and is electrically connected to the first capacitor. The second conductor portion overlaps at least a part of the second capacitor in the thickness direction of the substrate and is electrically connected to the second capacitor. The first conductor portion and the second conductor portion are separated from each other, and are electrically connected to each other by the jumper element.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: April 21, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takashi Yamasaki, Shinichi Kikuchi
  • Patent number: 10622701
    Abstract: An antenna apparatus comprises a semiconductor die in a molding compound layer, a first through via is between a sidewall of the semiconductor die and a sidewall of the molding compound layer and an antenna structure over the molding compound layer, wherein a first portion of the antenna structure is directly over a top surface of the semiconductor die and a second portion of the antenna structure is directly over a top surface of the first through via.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: April 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lai Wei Chih, Monsen Liu, En-Hsiang Yeh, Chuei-Tang Wang, Chen-Hua Yu
  • Patent number: 10607656
    Abstract: An apparatus for mounting a hard disk drive unit and an optical disk drive unit to an electronic device includes a supporting bracket defining an accommodating space for the hard disk drive unit and the optical disk drives unit and a clip. The supporting bracket includes a connecting plate and a resilient latching member attached to the connecting plate and located within the connecting plate. The clip corresponds to the resilient latching member and is configured to be attached to the optical disk drive unit. The resilient latching member is switchable between a clip-locking position and a clip-unlocking position.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: March 31, 2020
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ching-Jou Chen, Wen-Hsiang Hung, Chun-Bao Gu
  • Patent number: 10596597
    Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: March 24, 2020
    Assignee: Fujifilm Sonosite, Inc.
    Inventors: N. Christopher Chaggares, Eric Rieder
  • Patent number: 10578825
    Abstract: Novel tools and techniques are provided for implementing FTTx, which might include Fiber-to-the-Home (“FTTH”), Fiber-to-the-Premises (“FTTP”), and/or the like. A method might include routing an F1 line(s) from a central office or DSLAM to a fiber distribution hub (“FDH”) located within a block or neighborhood of customer premises, via at least an apical conduit source slot. From the FDH, an F2 line(s) might be routed, via any combination of various apical conduit components, to a network access point (“NAP”) servicing one or more customer premises. An F3 line(s) might be distributed, at the NAP and from the F2 line(s), to a network interface device (“NID”) or optical network terminal (“ONT”) at each customer premises, via any combination of the apical conduit components, which include channels in at least portions of roadways. In some embodiments, at least one wireless access point is disposed in each of one or more channels.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: March 3, 2020
    Assignee: CenturyLink Intellectual Property LLC
    Inventors: Thomas Schwengler, Michael L. Elford, Michael P. Winterrowd, Thomas C. Barnett, Jr.
  • Patent number: 10566299
    Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: February 18, 2020
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Ching-Wen Chiang, Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu
  • Patent number: 10534250
    Abstract: An illumination device includes a light source device, a first collimate optical system on which a light beam emitted from the light source device is made incident, a condensing optical system provided at a post-stage of the first collimate optical system, a rod provided at a post-stage of the condensing optical system, a second collimate optical system provided at a post-stage of the rod, a lens integrator provided at a post-stage of the second collimate optical system, and a superimposing lens provided at a post-stage of the lens integrator. The lens integrator includes a first lens array and a second lens array provided at a post-stage of the first lens array. A light-emitting end face of the rod and a lens surface of the second lens array are substantially conjugate with each other.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: January 14, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Koichi Akiyama
  • Patent number: 10528090
    Abstract: Examples disclosed herein provide a hinge assembly for a computing device. One example hinge assembly includes a first bracket attached to a first member of the computing device and a second bracket attached to a second member of the computing device. The hinge assembly includes a hinge pivotally connecting the first bracket to the second bracket along a first axis, and a first gear rotatably connected to the first bracket along the first axis. The hinge assembly further includes a set of gears, each gear from the set of gears rotatably connected to different axes parallel to the first axis. As an example, the set of gears is to provide friction against the first gear to provide a level of resistance to a torque provided when the first bracket is to be moved along the first axis.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: January 7, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roger Chen, Kt Wu, Charlie Ku
  • Patent number: 10515236
    Abstract: The present disclosure relates to a data retention device designed for security of digital classified information. In the data retention device, a power source component is first activated by a fingerprint switch. When a data plug of a dedicated storage module and a data socket of an encryption module are connected with each other, a locking element in the encryption module is fixed at a locking hole in the dedicated storage module and the encryption module is electrically connected to the dedicated storage module through the data socket. Then, with an external component of the encryption module electrically connected to an external device, classified information is accessed, encrypted in the encryption module and saved in the storage element.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: December 24, 2019
    Assignee: WALTON ADVANCED ENGINEERING INC.
    Inventors: Hong Chi Yu, Mao Ting Chang
  • Patent number: 10499539
    Abstract: A heat dissipation apparatus, adaptable to at least one first circuit device and at least one second circuit device, includes a chassis; and at least one separation mechanism disposed in the chassis, the first circuit device and the second circuit device being respectively disposed at two sides of the separation mechanism, the first circuit device being not aligned with the second circuit device, and the separation mechanism including a separation board.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: December 3, 2019
    Assignee: Wiwynn Corporation
    Inventors: Ming-Hsien Lu, Chien-An Chen, Pin-Jen Chen
  • Patent number: 10492315
    Abstract: A storage device carrier system includes a carrier assembly configured to releasably engage a storage device and configured to be releasably received within a storage device bay within an IT component. An electrical coupler assembly is configured to electrically couple the storage device to the IT component. A thermal sealing assembly is configured to reduce the leakage of cooling air from around the storage device carrier system.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: November 26, 2019
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Yujie Zhou, Xiaoping Wu, Wei Dong
  • Patent number: 10483673
    Abstract: An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: November 19, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Byron A Alcorn, Shane Ward, Peter Andrew Seiler
  • Patent number: 10477705
    Abstract: A storage device includes a first housing, a second housing, a circuit board, a first electric connector, a first storage unit, a second electric connector and a second storage unit. The second housing is matched with the first housing and connected with the first housing. The circuit board is disposed between the first housing and the second housing. The first electric connector is disposed on the circuit board. The first storage unit is disposed on the circuit board and electrically connected with the first electric connector. The second electric connector is disposed on the circuit board. The second storage unit is disposed on the circuit board and electrically connected with the second electric connector. The first storage unit and the second storage unit are independent from each other. Therefore, the advantages of utilizing two independent storage units on single one product are achieved.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: November 12, 2019
    Assignee: APACER TECHNOLOGY INC.
    Inventors: Jiunn-Chang Lee, Jia-Wei Lin, Liang-Cheng Li
  • Patent number: 10471737
    Abstract: In an example, a transmission may include a driven gear attached to a module housing of the imaging module. Further, the transmission may include a retention nose fixed or attached to the module housing. The retention nose may engage with a retention shelf of a drive housing and may retain the module housing to the drive housing such that the driven gear is operably engaged with a drive gear attached to the drive housing.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: November 12, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Asa Weiss
  • Patent number: 10470334
    Abstract: An electronic device includes a casing and a tray. The casing includes an engaging portion. The tray is disposed in the casing. The tray includes a tray body, a handle, a sliding member, an elastic member and a lock member. The handle includes a first driving portion. The sliding member includes a first driving groove and a second driving groove. The lock member includes a second driving portion, a through hole and an engaging recess. The engaging portion engages with the engaging recess. When the handle moves along a first direction, the first driving portion presses the first driving groove, such that the sliding member moves along a second direction. When the sliding member moves along the second direction, the second driving groove presses the second driving portion, such that the lock member moves along a third direction and then the engaging portion disengages from the engaging recess.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: November 5, 2019
    Assignee: Wistron Corporation
    Inventor: Zhong-Hui Mao
  • Patent number: 10438559
    Abstract: An electronic device includes a housing, a display device exposed through a first part of the housing, a recess formed in a second part of the housing, a receptacle formed in the recess, a plurality of conductive contacts disposed inside the receptacle and including a first contact, a first circuit that supplies and/or receives a current of a first level or larger to and/or from the first contact when an external connector is inserted into the receptacle, a first switching device that electrically connects the first circuit with the first contact or to interrupt a connection between the first circuit and the first contact, a second circuit that detects existence of a foreign object contacting the first contact while the external connector is inserted into the receptacle and a control circuit that controls the first switching device based at least in part on information regarding the detected existence of the foreign object.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: October 8, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho Yeong Lim, Du Hyun Kim, Yong Seung Yi, Je Kook Kim, Tae Lee Lee, Dong Il Son
  • Patent number: 10405442
    Abstract: A cabinet with a lock includes a cabinet in which a server is accommodated, a first locking mechanism which does not allow the server to be taken out of the cabinet with a locking manipulation, and a second locking mechanism which locks a position of the cabinet or a position of the server in coordination with a locking operation by the first locking mechanism.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: September 3, 2019
    Assignee: KONICA MINOLTA, INC.
    Inventors: Morihisa Kawahara, Hayato Mori
  • Patent number: 10383261
    Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 13, 2019
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Andrew Louis Krivonak, Theodore Clark Brown, Shreenath Shekar Perlaguri, Brian Magann Rush, Rajendra Yammanuru, Naveenan Thiagarajan, Arunpandi Radhakrishnan
  • Patent number: 10330882
    Abstract: Novel tools and techniques are provided for implementing FTTx, which might include Fiber-to-the-Home (“FTTH”), Fiber-to-the-Premises (“FTTP”), and/or the like. A method might include routing an F1 line(s) from a central office or DSLAM to a fiber distribution hub (“FDH”) located within a block or neighborhood of customer premises, via at least an apical conduit source slot. From the FDH, an F2 line(s) might be routed, via any combination of various apical conduit components, to a network access point (“NAP”) servicing one or more customer premises. An F3 line(s) might be distributed, at the NAP and from the F2 line(s), to a network interface device (“NID”) or optical network terminal (“ONT”) at each customer premises, via any combination of the apical conduit components, which include channels in at least portions of roadways. In some embodiments, at least one wireless access point is disposed in each of one or more channels.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 25, 2019
    Assignee: CenturyLink Intellectual Property LLC
    Inventors: Thomas Schwengler, Michael L. Elford, Michael P. Winterrowd, Thomas C. Barnett, Jr.
  • Patent number: 10317969
    Abstract: A semiconductor device for a USB Type-C cable includes a first terminal to couple to a first VCONN line from a first end of the cable, a second terminal to couple to a second VCONN line from the second end of the cable, a charge pump, and a switch circuit coupled to the first terminal and the second terminal. The switch circuit includes a first drain-extended n-type field effect transistor (DENFET) coupled between the first terminal and an internal power supply of the semiconductor device; a first pump switch coupled between the charge pump and a gate of the first DENFET; a second DENFET coupled between the second terminal and the internal power supply; and a second pump switch coupled between the charge pump and a gate of the second DENFET.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: June 11, 2019
    Assignee: Cypress Semiconductor Corporation
    Inventors: Nicholas Alexander Bodnaruk, Pradeep Kumar Bajpai, Godwin Gerald Arulappan, Hamid Khodabandehlou
  • Patent number: 10289172
    Abstract: A holding device includes a frame module and an accommodation unit. The frame module includes a plate body and two lateral plates oppositely disposed on the first plate body. A placement area is collectively defined by the plate body and the lateral plates. Two protrusions are respectively provided on the lateral plates. The accommodation unit includes a tray and two elastic plates. The tray is slidably located within the placement area, and an accommodation space is defined between two opposite sides of the tray. Each elastic plate is elastically connected to one of opposite sides of the tray. When the tray is moved after a load is placed within the accommodation space, the protrusions respectively push the elastic plates towards the accommodation space so that the load is toollessly fastened between the elastic plates.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: May 14, 2019
    Assignee: CHENBRO MICOM CO., LTD.
    Inventors: Chao-Chiang Yang, Yu-Ching Weng
  • Patent number: 10289174
    Abstract: A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: May 14, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jung-hoon Kim
  • Patent number: 10284268
    Abstract: Radio apparatuses and methods for MIMO matrix phasing that may be used to toggle and/or weight the amount of MIMO processing based on the detected level of isolation between different polarizations of the system. Also described herein are apparatuses including auto-range and/or auto-scaling of a signal strength indicator to aid in precise alignment of the apparatus. Any of these apparatuses and methods may also include dynamic power boosting that adjusts the power (e.g., power amplifier) for an RF apparatus based on the data rate. These apparatuses may include a housing enclosing the radio device that includes a plurality of pin elements that may act as heat transfer pins and a ground pin for making a ground connection to the post or pole to which the devices is mounted.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: May 7, 2019
    Assignee: Ubiquiti Networks, Inc.
    Inventors: Gary D. Schulz, Paul Odlyzko, David E. Rawlings
  • Patent number: 10219393
    Abstract: According to one embodiment, an electronic device includes a housing including a wall portion, a printed circuit board including a plurality of lines and provided in the housing, and a connector formed of a part of the housing and a part of the printed circuit board. The connector includes an engagement hole formed in the wall portion and into which a connector plug is inserted. The connector further includes a shell formed of a portion located around the engagement hole in the wall portion, a tongue portion formed of a part of the printed circuit board and provided in the engagement hole, and connection terminals formed of the lines extending to and on a surface of the tongue portion.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: February 26, 2019
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA CLIENT SOLUTIONS CO., LTD.
    Inventors: Satoru Yasui, Masaya Hirashima, Takahiro Sakaguchi, Tsuyoshi Kozai
  • Patent number: 10180706
    Abstract: A mobile computer-based host includes a main body, at least one multifunctional module, and at least one lid. Each multifunctional module has the same size and shape. The main body includes a case and a host module, and the case encloses the host module and includes at least one module slot, each having the same size and shape for accommodating the multifunctional module. The lid covers the corresponding module slot to isolate and protect the multifunctional module. The module slots of the present invention are allowed to install the various multifunctional modules to provide different and specific functions without changing the original design of the size and shape. Thus, the application field of the mobile computer-based host is widely expanded to meet various demands in the future, and the lifetime is greatly prolonged without wasting any precious resource, thereby achieving the goal of environmental protection.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: January 15, 2019
    Assignee: IBASE TECHNOLOGY INC.
    Inventor: You-Nan Chen
  • Patent number: 10180707
    Abstract: A computing system can include a computing system chassis that includes a front end and a back end; a drive that includes a side that includes a mounting feature; and a drive bay chassis operatively coupled to the computing system chassis where the drive bay chassis includes at least one drive bay accessible via the front end of the computing system chassis, a bracket and a latch operatively coupled to the bracket and disposed between the front end and the back end of the computing system chassis where the bracket moves responsive to contact with the side of the drive during translation of the drive into one of the at least one drive bay to engage the bracket and the mounting feature and wherein the latch is movable to disengage the bracket and the mounting feature for translation of the drive out of the at least one drive bay.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: January 15, 2019
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Timothy Samuel Farrow, Ali Kathryn Ent, Shuang Li, Albert Vincent Makley, Sean Hilliard
  • Patent number: 10168816
    Abstract: An array substrate, a display panel and a display device are provided. The array substrate includes a display area and a non-display area surrounding the display area. A first power signal line, a ground potential line and at least one pressure sensor are disposed in the non-display area. The pressure sensor includes a first power signal input terminal and a second power signal input terminal. The first power signal input terminal is electrically connected to the first power signal line. The second power signal input terminal is electrically connected to the ground potential line. The first power signal input terminal and/or the second power signal input terminal is electrically connected to an electro-static discharge unit.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: January 1, 2019
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Zhiwei Zhou, Qijun Yao, Feng Lu, Liang Liu, Yan Shen, Huafeng Bian, Zhengkui Dong
  • Patent number: 10136558
    Abstract: Thermal conditions at processing components disposed in an information handling system are estimated by applying conservation of energy and component power consumption so that discrete control of information handling system exhaust temperatures is more accurately maintained. For example, a PCI backplane communications card has its power consumption estimated based upon its width so that air flow through the information handling system is adequate to meet an exhaust temperature constraint.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: November 20, 2018
    Assignee: Dell Products L.P.
    Inventors: Hasnain Shabbir, Dominick A. Lovicott
  • Patent number: 10111365
    Abstract: A liquid-cooling mechanism, or sub-system, has a thermally conductive plate in which a cooling liquid channel is disposed, and a thermally conductive pad disposed on the thermally conductive plate. An electronic device is mounted to the thermally conductive pad, such as via a mounting component, in a manner that decreases translational movement of a contact surface of the electronic device against a contact surface of the thermally conductive pad. When mounted to the thermally conductive pad, the electronic device compresses the thermally conductive pad.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: October 23, 2018
    Assignee: Lenovo Enterprise Solutions (Singapore) PTE. LTD.
    Inventors: Andrew Thomas Junkins, Vinod Kamath
  • Patent number: 10102883
    Abstract: A hard drive disk carrier for reducing airflow-induced vibration of a hard disk drive includes a bracket assembly configured to removably secure the hard disk drive to a receiving component within an enclosure. The bracket assembly is configured for substantially exposing major surfaces of the hard drive to yield exposed surfaces and for mounting within the enclosure so that a first end of the hard disk drive faces the first end of the enclosure and a second end of the hard disk drive faces the second end of the enclosure. The bracket assembly also includes at least one end member associated with the second end of the hard disk drive. The carrier also includes an airfoil assembly with one or more louvers configured to extend from at least the second end of the hard disk drive and partially cover at least one of the exposed surfaces.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: October 16, 2018
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Ming-Sheng Chang, Chih-Hui Hsu, Yu-Ju Chang
  • Patent number: 10095290
    Abstract: A method may include, responsive to determining that the earlier-generation information handling system includes the information handling resource for which a second thermal table of the second management controller requires updated thermal control parameters for thermal control of the information handling resource: (i) reading from a first thermal table of the first management controller an entry associated with the information handling resource and a second information handling system including thermal control parameters for thermal control of the information handling resource by the second information handling system; and (ii) communicating from the first management controller to the second management controller the thermal control parameters for thermal control of the information handling resource by the second information handling system in order to update the second thermal table with the thermal control parameters.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: October 9, 2018
    Assignee: Dell Products L.P.
    Inventors: Dinesh Kunnathur Ragupathi, Sundar Dasar, Robert Daniel Whittington, Kala Sampathkumar, Sridevi Chandrasekaran
  • Patent number: 10091869
    Abstract: An electronic device includes a housing, a circuit board, and a conductive adhesive element tape. The circuit board has a first board surface facing the housing and a second board surface facing opposite the housing. The circuit board has a ground pad on the second board surface. The conductive adhesive element tape includes a first portion, a second portion, and a connection portion. The first portion is disposed between the first board surface and the housing. The first portion has a first adhesive surface and a first non-adhesive surface opposite to the first adhesive surface. The first adhesive surface adheres to the housing. The second portion has a second adhesive surface and a second non-adhesive surface opposite to the second adhesive surface. The second adhesive surface adheres to the ground pad. The connection portion connects the first portion and the second portion.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: October 2, 2018
    Assignee: AU OPTRONICS CORPORATION
    Inventor: Yuan-Yu Chien