Abstract: A semiconductor storage device according to an embodiment includes a housing, a board, a semiconductor memory component, a controller, and a heat-dissipation structure. The heat-dissipation structure includes a plurality of first heat-dissipation fins, a plurality of second heat-dissipation fins, and a first cover portion. The plurality of the first heat-dissipation fins are on a first region of the housing. The plurality of the second heat-dissipation fins are on a second region of the housing. The first cover portion is between the plurality of the first heat-dissipation fins and the plurality of the second heat-dissipation fins, or the first cover portion is at a gap between the second heat-dissipation fins. The first cover portion covers at least a part of the gap between the second heat-dissipation fins.

Abstract: An immersion cooling system is configured for uniform fluid distribution across computing devices and includes a tank defining an open interior volume, a distribution pipe having a plurality of ports, a distribution plate having a pattern of holes is positioned over the distribution pipe. A siphon wall divides the open interior volume into a first chamber and a second chamber, and the distribution plate and the distribution pipe are in the first chamber. The dielectric cooling fluid enters the first chamber of the tank through the plurality of ports in the distribution pipe, and flows through the pattern of holes in the distribution plate to contact the at least one computing device. The heat dissipates from the at least one computing device into the dielectric cooling fluid, which flows through the siphon wall into the second chamber via a transfer port that is located below a dielectric cooling fluid surface.

Abstract: A liquid-cooling plate for a CPU, includes a circulating liquid-cooling main body, a peripheral frame, a base and a liquid accumulation reservoir. The base has a central portion and a peripheral portion surrounding the central portion. A step is formed between the central portion and the peripheral portion so that the central portion is raised over the peripheral portion. The central portion defines an interior space and has a cover and two faucets. The interior space is adapted to accommodate the circulating liquid-cooling main body, and the cover closes the interior space. The two faucets are located above the cover and communicate with the circulating liquid-cooling main body. The liquid accumulation reservoir is located external to the central portion and is adapted to contain a liquid leaked from the faucets. By integrating the liquid accumulation reservoir in the liquid-cooling plate, an effective saving in an interior space of a server is resulted.

Abstract: In one embodiment, an electronic device cooling package includes an enclosure to house an electronics package, the enclosure including at least one panel with an integrated conducting plate exposed to both an inner surface of the at least one panel and an outer surface of the at least one panel. The electronic device cooling package further includes a mounting mechanism attached to the enclosure to detachably couple a cooling device to the outer surface of the at least one panel of the enclosure. Different electronics packaged within the cooling package includes different co-design of the cooling package and cooling devices.

Abstract: A modular datacenter facility and a method thereof is provided in accordance with some embodiments. The module datacenter facility can be constructed with an initial set of building modules of different types of functionality. A first building module can be a data-floor building module. A first set of sidewall-connected heating, ventilation, and air conditioning (“HVAC”) units can connect to a sidewall of the modular datacenter facility and use electrical power provided by a first electrical power distribution building module to supply conditioned air into an air-supply plenum of the sidewall to cool computing systems housed in the data-floor building module. The first set of the sidewall-connected HVAC units allow for fewer penetrations in a roof of the data-floor building module, thereby minimizing an amount of leaks potentially occurring in the roof of the ceiling, and thereby minimizing risk of any damage to the computing systems.

Abstract: A liquid-cooling block, a liquid-cooling block assembly, and a liquid-cooling heat dissipation device are disclosed. The liquid-cooling block includes a reservoir and a thermally conductive sheet. The reservoir has a liquid inlet, a first liquid outlet, a second liquid outlet, and a flow-dividing channel located inside the reservoir. A liquid inlet end of the flow-dividing channel is in communication with the liquid inlet. A liquid outlet end of the flow-dividing channel has a first flow-dividing opening and a second flow-dividing opening. The thermally conductive sheet is hermetically fixed to the reservoir to form a closed accommodating chamber therebetween. The thermally conductive sheet is integrally formed with a plurality of fins located in the accommodating chamber.

Abstract: Various aspects include devices, systems, and methods for cooling electronic equipment immersed in an immersion coolant tank with a fluid delivery wand. The fluid delivery wand may include a coolant conduit and an aperture cover. The coolant conduit may extend from a support base of the immersion coolant tank. The coolant conduit may include a lumen configured to receive dielectric fluid, wherein the coolant conduit includes at least one conduit aperture extending through a sidewall of the coolant conduit. The aperture cover may be in sliding engagement with an outer surface of the sidewall of the coolant conduit. The aperture cover may be configured to selectively restrict flow of dielectric fluid through the at least one conduit aperture by sliding along the outer surface of the outer of the sidewall.

Abstract: An immersion dual-cycle multi-mode liquid cooling regulation system and method for a data center comprises data center cabinets, a microchannel condensation heat exchanger, a plate heat exchanger, waste heat recovery devices, a cooling water storage tank, a fluorinated liquid storage tank, a liquid pump, a fluorinated liquid, pipelines, and pipeline valves. The system switches between single-phase and two-phase circulation loops according to the working power consumption of a server and the thermophysical property of a cooling working medium, and realizes flexible adjustment and control according to the cooling demand of the cabinet, the load magnitude and the working environment, thus avoiding the waste of resources caused by different loads in the data center; and cooling water flows through the waste heat recovery devices to recover heat, to reduce the electricity consumption of the system and greatly improve the utilization efficiency of cooling capacity.

Abstract: Disclosed are designs to facilitate blind-mating of fluid connectors on servers and on racks that house the servers. The design includes two plates. A first plate has a connector channel to guide the connectors of the server through the first plate and spring structures to apply a force to push the connectors of the server toward the center of the connector channel. A second plate has positioning holes around its perimeter for mounting the connectors of the server using the force of the spring structures. The first plate is rotatable around a rotation axis to align the connectors of the server with the connectors of the rack. The second plate may have an elastic layer that is compressed to change a width of the second plate by inserting the second plate to the rack to automatically align the connectors of the server and of the rack in the horizontal direction.

Abstract: An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment situated within the immersion tank. The IT equipment is configured to provide IT services and is at least partially submerged within a phase change liquid, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the phase change liquid thereby causing at least some of the phase change liquid to turn into vapor phase. The immersion cooling system includes a primary condenser unit positioned above the immersion tank and a secondary condenser unit, where, either a single, or both the primary and secondary condenser units are configured to receive cooling liquid from an external cooling unit to condense the phase change liquid in vapor phase back into liquid phase.

Abstract: Disclosed is an immersion cooling unit including an immersion cell, defining an internal cavity. An electrical component is positioned in the internal cavity. A dielectric working fluid partially fills the internal cavity and at least partially immerses the electrical component. A condensing coil is positioned above the dielectric working fluid. The dielectric working fluid comprises at least one of 1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene, (HFO-153-10mczz), or 1,1,1,4,5,5,5-heptafluoro-4-trifluoromethyl-2-pentene, (HFO-153-10mzzy). Also disclosed is a method of cooling an electrical component, comprising partially immersing an electrical component in a working fluid; and transferring heat from the electrical component using the working fluid.

Abstract: A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.

Abstract: A liquid immersion cooling system includes a tank defining a tank interior configured to receive electronic components (e.g., servers) and a thermally conductive dielectric liquid to cool the electronic components. The liquid immersion cooling system also includes a power shelf external to the tank interior, where the power shelf includes a converter configured to receive an alternating current (AC) power supply and convert the AC power supply to a direct current (DC) power supply. The liquid immersion cooling system also includes a DC bus configured to route the DC power supply from the power shelf, into the tank interior, and to the electronic components.

Abstract: A blind mating connection structure for servers is disclosed. On the server side, a connector module has fluid connectors to be blind mated to fluid connectors on rack manifolds in a server rack. The connector module is coupled to a sliding channel on the server. The connector module slides horizontally and vertically in response to movement of a positioning slider on the connector module. On the rack manifold side, a guiding module has an opening that receives the positioning slider when the server is installed in the server rack. The guiding module tapers down to a centering point midway between each rack manifold. As the server is slid into the server rack, the positioning slider follows the guiding module to the center point, moving the connector module into alignment with the fluid connectors on the rack manifold for blind mating.

Abstract: An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, hybrid cooling unit is disclosed wherein an evaporative cooler is to provide a source of cooled air and a liquid heat exchanger is to provide a source of cooled liquid for cooling one or more electronic components, the hybrid cooling unit further including an air inlet to direct a flow of external air to remove heat from the evaporative cooler and the liquid heat exchanger.

Abstract: Systems and methods are disclosed for a liquid cooling module for an information handling system that may include a mounting card configured to mount the liquid cooling module to a card slot proximate to a graphics card; a radiator inlet configured to receive a heated liquid from a pump of the graphics card; a radiator inlet tube configured to transfer the heated liquid from the graphics card to the liquid cooling module; a radiator configured to receive the heated liquid via a radiator inlet; a blower configured to direct a surrounding air flow across the radiator to cool the heated liquid; a radiator outlet configured to receive the cooled liquid from the radiator; and a radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the graphics card.

Abstract: Embodiments are disclosed of a cooling apparatus with one or more cold plates, each adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment. A fluid control module is mounted to the substrate and fluidly coupled to the cold plates. The fluid control module includes a fluid inlet with an inlet mechanism adapted to enable and disable the fluid inlet; the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized. The fluid control module also includes a fluid outlet with an outlet mechanism adapted to enable and disable the fluid outlet; the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized. A dedicated power supply is electrically coupled to the inlet mechanism and the outlet mechanism, and when the inlet mechanism is de-energized, the outlet mechanism is also de-energized after a delay.

Abstract: The disclosed computer cooling system includes a liquid immersion cooling tank configured as a server chassis with an integrated power bus, control bus and data bus. The server chassis tank receives and services a plurality of modular blades including disaggregated single server components dedicated to similar functions and resembling a beekeeper's box of vertical and spaced operation, insertion and extraction. The modular blades include at least one management blade, interfaces and peripherals blade, storage blade, CPU blade and one or more GPU blades and other processors. Each blade configures hottest operating components lowest in a heat flow via transverse mounted brackets and vented ends. A blade extraction mechanism includes movable winches for manipulating the plurality of modular blades from a top side of the heat flow and a hydraulic lift for pushing each modular blade from a bottom of the heat flow out of the liquid immersion cooling tank.

Abstract: Embodiments are disclosed of an apparatus including a room manifold comprising at least one fluid loop. A plurality of rack manifolds is fluidly coupled to, and projects from, the room manifold. Each rack manifold includes one or more connectors to couple the rack manifold to one or more components within an electronics rack. A plurality of valves is fluidly coupled in the room manifold, and each rack manifold is fluidly coupled to the room manifold between a pair of valves. The pair of valves can be used to terminate flow between the room manifold and each rack manifold.

Abstract: A filling method for an accommodating system is provided. The filling method includes filling a liquid into an accommodating device at a first temperature, and withdrawing a predetermined amount of the liquid from the accommodating device using a pump. The predetermined amount is related to a temperature change.

Abstract: An immersion tank includes a tank main body that includes a storage unit that stores a cooling liquid in which an electronic device is immersed, an upper part of the storage unit having an opening, a lid body that includes a top wall portion and a side wall portion, and is paired with the tank main body, and a gas-phase heat exchanger that cools a space between the storage unit and the top wall portion.

Abstract: The present disclosure provides a heat dissipation system, including: a coolant and a convection accelerator. The coolant is configured to contact at least a portion of the heat generating device; the convection accelerator is disposed in a predetermined region surrounding the heat generating device, configured to accelerate a flow of the coolant surrounding the heat generating device.

Abstract: A method for implementing power capping in a velocity cooled (VC) mobile data center (MDC). A management information handling system (IHS) applies a power cap for all power consuming components of the VC MDC based, in part, on the detected velocity of the VC MDC. The detected velocity is compared to an outside air cooling threshold velocity. In response to the detected velocity being below the outside air cooling threshold velocity, a first power cap is selected, based on the detected velocity being below the outside air cooling threshold velocity. In response to the detected velocity being at or above the outside air cooling threshold velocity, a second, higher, power cap is selected, based in part on the detected velocity being at or above the outside air cooling threshold velocity. Power capping is implemented to conserve available onboard power for IT equipment processing, based on availability of ram air cooling.

Abstract: A method for cooling IT equipment of a velocity cooled (VC) mobile data center (MDC) includes: determining if a velocity of the VC MDC is above a minimum threshold velocity that enables ram air cooling of IT equipment within the VC MDC; and in response to the velocity not being above the minimum threshold velocity, activating a secondary cooling source to provide a flow of cooling air across the IT equipment within the VC MDC, the flow of cooling air supplementing the ram air cooling.

Abstract: A heat dissipation apparatus for a plurality of heat-generating electrical devices dissipates heat of the heat-generating electrical devices by using heat-absorbing liquid. The apparatus includes a container. The container contains coolant liquid and the plurality of heat-generating electrical devices, the container includes a bottom plate, two first side plates, and two second side plates; the first side plate is fixedly connected to the bottom plate by plastic welding, the second side plate is fixedly connected to the bottom plate by plastic welding, and the first side plate is fixedly connected to the second side plate by plastic welding.

Abstract: In one implementation, a system for valve failure prediction includes a temperature engine to determine a temperature of a liquid exiting a cooling device, a flowrate engine to compare an actual flow rate of the liquid exiting the cooling device to a flow rate threshold, a prediction engine to determine when a valve of the cooling device is malfunctioning based on the comparison of the actual flow rate and the flow rate threshold, and a notification engine to notify a user when the valve of the cooling device is malfunctioning.

Abstract: There is provided an electronic apparatus that includes a housing. A control circuit is provided inside the housing, a battery is provided inside the housing, a heat storage material is provided between the control circuit and the battery inside the housing, and a gap is provided between the control circuit and the battery.

Abstract: This disclosure provides casings and materials for the thermal management and protection of an electrochemical cell. The casing may also comprise a composite polymeric material for electrochemical cell thermal management, the composite polymeric material comprising a crosslinked polyether polyol phase change material configured to be in physical contact with at least a portion of an electrochemical cell.

Abstract: Provided is an electronic apparatus that makes it possible to improve a heat transfer property from a heat generating element to a heat storage material. The electronic apparatus is provided with a heat generating element and a heat storage device for storing heat generated by the heat generating element. The heat storage device includes a reaction chamber containing a heat storage material for absorbing the heat generated by the heat generating element. The reaction chamber is defined by a first surface, a second surface opposed to the first surface, and a plurality of side surfaces connecting the first surface with the second surface. In the reaction chamber, a thermal conductivity of a peripheral part is smaller than a thermal conductivity of a central part of the reaction chamber.

Abstract: Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for restricting the tower's movement so that a range of the tower's motion in a width direction of the cooling tank does not exceed at least a width of the open space. The slide mechanism supports the tower movably with respect to the cooling tank in a horizontal plane located above the open space. The liquid immersion cooling system can safely lift or lower the electronic devices densely housed within the cooling tank without requiring the stage in the periphery of the installation surface of the cooling tank.

Abstract: An article may include an optical transceiver package, which may include a photonics component mounted in the optical transceiver package. The photonics component may generate heat in an operational state. The optical transceiver package may include a sealed thermal chamber that maintains the photonics component between a lower predetermined working temperature and a higher predetermined working temperature. The sealed thermal chamber may include a material that exhibits a first thermal conductivity below a lower predetermined threshold temperature and a second thermal conductivity higher than the first thermal conductivity above an upper predetermined threshold temperature. A method may include retaining the generated heat to raise the photonics component above a lower predetermined working temperature, and conducting the generated heat away from the optical transceiver package to lower the photonics component below an upper predetermined working temperature.

Abstract: A source of liquid provided an input of liquid into a liquid cooling system. The liquid from the source of liquid flows through a check valve assembly which includes an input, a first output, and a second output. The second output includes a check valve configured to open when the pressure of the liquid exceeds a threshold pressure value. A connector is attached to the first output of the check valve assembly. The connector is a quick connect fitting equipped with a self-sealing valve.

Abstract: The present invention provides a hybrid cooled blade server enclosure having a liquid-cooled insert having a chilled surface for contacting a heat exchange block on the blade server and an electric fan for removing heated air from the enclosure.

Abstract: This disclosure provides a casing for the thermal management and protection of an electrochemical cell. The casing may comprise an inner surface configured to be in physical contact with at least a portion of an outer surface of an electrochemical cell. The inner surface may be substantially solid at room temperature. The casing may also comprise a polymer matrix which itself comprises two or more temperature management materials. At least one of the two or more temperature management materials may comprise a microencapsulated phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and at least one other of the two or more temperature management materials may comprise an elastomeric material. The polymer matrix may be substantially homogeneous.

Abstract: A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.

Abstract: A system for cooling a CPU. The system has a tank for holding dielectric coolant in a liquid phase. The CPU is immersed in the coolant. A cover closes the tank. Electric pathways that convey data to/from the CPU traverse the cover. The electric pathways allow the CPU to exchange data with an external device. In this fashion, the CPU can perform data processing functions while being immersed in dielectric coolant.

Abstract: A personal cloud structure for a portable computing device such as a tablet personal computer (PC), mobile phones, portable media players, or the like. The personal cloud structure may be fitted with memory, a network connection, two-way wireless charging, external memory slots, external connections and other components to create a portable personal cloud.

Abstract: A scalable liquid cooled power system using a number of modularized, hot-plug, hot-swap, and scalable liquid-cooled power conversion modules mounted on mating mounting assemblies. A modularized, scalable liquid coolant manifolds and liquid cooling management system provides coolant circulation through the power conversion modules. The system optionally includes a highly scalable system control and administration system, and optionally provides the facility for on-board liquid-to-air heat exchanger system, or off-board cooling using an external heat exchanger system.

Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.

Abstract: A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state.

Abstract: Methods, apparatuses, and computer program products for provisioning aggregate computational workloads and air conditioning unit configurations to optimize utility of air conditioning units and processing resources within a data center are provided.

Abstract: Methods, apparatuses, and computer program products for provisioning aggregate computational workloads and air conditioning unit configurations to optimize utility of air conditioning units and processing resources within a data center are provided.

Abstract: A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.

Abstract: A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract: A cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.

Abstract: A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.