With Cooling Means Patents (Class 361/679.46)
  • Patent number: 10768999
    Abstract: Embodiments in include a system, a method, and a computer program product for performing intelligent load shedding for multi-channel processing system. The embodiments include a multi-channel processing system, wherein each channel of the multi-channel processing system includes a plurality of processors, and a plurality of links coupling each channel with each other channel in the multi-channel processing system, wherein the links are used to transmit status information of the plurality of processors. The embodiments also include a plurality of cooling elements coupled to each channel having the plurality of processors, wherein the plurality of cooling elements are configured to remove heat from the multi-channel processing system.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: September 8, 2020
    Assignee: HAMILTON SUNSTRAND CORPORATION
    Inventors: Christopher Brian Noll, Steven A. Avritch
  • Patent number: 10747272
    Abstract: Systems and methods for detecting a keyboard's position with respect to a display of a multi-form factor Information Handling System (IHS) are described. In some embodiments, an IHS may include: a processor; and a memory coupled to the processor, the memory having program instructions stored thereon that, upon execution by the processor, cause the IHS to: identify, using an infrared (IR) transceiver, a position of a keyboard disposed on a surface of a display; and render a graphical feature on the display based upon the position.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: August 18, 2020
    Assignee: Dell Products, L.P.
    Inventors: John T. Morrison, Jace W. Files, Michiel Sebastiaan Emanuel Petrus Knoppert, Mark R. Ligameri
  • Patent number: 10703490
    Abstract: A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: July 7, 2020
    Assignee: GE Aviation Systems LLC
    Inventors: Michel Engelhardt, Christopher Mouris Astefanous
  • Patent number: 10620671
    Abstract: An electronic device includes a first component, a second component, a dual axis module, and a third component. The second component is flipably disposed at the first component. The dual axis module has a first shaft and a second shaft. The second component is pivoted to the second shaft. The third component is pivoted to the first shaft. The electronic device is switched between a first state, a second state, a third state, and a fourth state. During the switching of the first state to the second state, the first shaft is rotatable relative to the first component and the second shaft is non-rotatable. During the switching of the second state to the third state, the first shaft is non-rotatable and the second shaft is rotatable relative to the first component. During the switching of the third state to the fourth state, the first shaft is rotatable relative to the first component and the second shaft is non-rotatable.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: April 14, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tzu-Chien Lai, Yen-Hsiao Yeh
  • Patent number: 10595444
    Abstract: A computing device for cooling an electronic component is provided. The computing device includes a chassis with a first end and a second end; fan modules located at the first end of the chassis; and a Peripheral Component Interconnect Express (PCIe) baseboard located at a front side of the chassis. The PCIe baseboard is configured to support placement thereof in the chassis in a first position and a second position. The second position of the PCIe baseboard is a 180-degree rotation from the first position. The PCIe baseboard includes GPU slots for installing a plurality of graphic processing units (GPUs), the GPUs including fan modules.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: March 17, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chiao-Lun Tsai, Hsin-Chieh Lin, Che-Wei Hsu
  • Patent number: 10506739
    Abstract: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: December 10, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shang-Che Lee, I-Lung Chen, Yi-Hsuan Wu, Wang-Hung Yeh, Chang-Yuan Wu, Jie-Ting Hsieh, Yu-Fan Chuang
  • Patent number: 10499543
    Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: December 3, 2019
    Assignee: INTERNATIONAL BUSTNESS MACHINES CORPORATION
    Inventors: Timothy Joseph Chainer, Pritish Ranjan Parida, Mark Delorman Schultz
  • Patent number: 10372178
    Abstract: A system of modular fans for a network device is disclosed. The network device includes a rack assembly having side walls forming an enclosure with a plurality of sled slots accessible from a rear end. A plurality of operation sleds are mountable on one of the plurality of sled slots. A plurality of removable fan modules is provided. Each of the removable fan modules are installed in one of the operation sleds. The removable fan modules are individually removable from the operation sleds and therefore may be swapped out while the rest of the components in the network device remain operational.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: August 6, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Hou-Hsien Chang, Chao-Jung Chen, Yaw-Tzorng Tsorng
  • Patent number: 10356957
    Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: July 16, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P Franz, Tahir Cader
  • Patent number: 10338639
    Abstract: A mobile device processor unit enables a remotely-located user to interact with a user interface associated with a complete mobile device on a computer supporting the user, where the interface is presented based on execution of functionality of the complete mobile device on a limited selection of components of the complete mobile device. The limited selection of components is included in a mobile device processor unit. The processor unit can be installed in a slot space of a support chassis to structurally support the limited selection of components and to couple the processor unit with a connector to communicatively couple the components with the remote user via a communication network.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: July 2, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Aaron Benjamin Lockey, Timothy Joseph Thompson
  • Patent number: 10338647
    Abstract: A housing assembly for a computer system includes at least one first shielding casing with a first plurality of ventilation openings in an area of a first housing wall of the first shielding casing; and at least one second shielding casing with a second plurality of ventilation openings in an area of a second housing wall of the second shielding casing, wherein a first contact area of the first housing wall of the first shielding casing borders directly on a corresponding second contact area of the second housing wall of the second shielding casing, and at least one of the first housing wall of the first shielding casing and the second housing wall of the second shielding casing includes a recess so that the first plurality of ventilation openings of the first shielding casing is spaced apart from the second plurality of ventilation openings of the second shielding casing.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 2, 2019
    Assignee: Fujitsu Client Computing Limited
    Inventor: Wilhelm Neukam
  • Patent number: 10302363
    Abstract: In one embodiment, a cooling system includes a thermosyphon cooler that cools a cooling fluid through dry cooling and a cooling tower that cools a cooling fluid through evaporative cooling. The thermosyphon cooler uses natural convection to circulate a refrigerant between a shell and tube evaporator and an air cooled condenser. The thermosyphon cooler is located in the cooling system upstream of, and in series with, the cooling tower, and is operated when the thermosyphon cooler is more economically and/or resource efficient to operate than the cooling tower. According to certain embodiments, factors, such as the ambient temperature, the cost of electricity, and the cost of water, among others, are used to determine whether to operate the thermosyphon cooler, the cooling tower, or both.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: May 28, 2019
    Assignee: Johnson Controls Technology Company
    Inventors: James W. Furlong, Joseph W. Pillis, Delmar E. Lehman
  • Patent number: 10293476
    Abstract: A stack arrangement having at least two stack elements, which can be stacked on each other in a stacking direction, of which at least one is formed from a transport container which has a container body having a storage receptacle which has a machine receptacle for an electrical or pneumatic hand tool machine. The stacking elements have bus interfaces for transferring data and/or energy between the stacking elements of the stack arrangement, wherein the bus interfaces form a bus connection between the stack elements when the stack elements are stacked on each other.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: May 21, 2019
    Assignee: FESTOOL GMBH
    Inventor: Bernd Fleischmann
  • Patent number: 10291877
    Abstract: A display includes a display panel, a board mounting portion, and a circuit board arranged at one surface of the board mounting portion. The display panel also includes a cover portion positioned only at a portion of the one surface of the board mounting portion. The portion includes a region in which the circuit board is arranged. The cover portion includes a bottom surface portion and a first side surface portion that extends from the bottom surface portion toward the one surface of the board mounting portion. The first side surface portion includes a first opening portion.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: May 14, 2019
    Assignee: Funai Electric Co., Ltd.
    Inventors: Yuki Kita, Akihiro Fujikawa
  • Patent number: 10278311
    Abstract: An electronic display assembly for an electronic display includes a front panel having a perimeter and a housing. An ingestion gap ingests, and an exhaustion gap exhausts, open loop fluid. The ingestion and exhaustion gaps are each located along a vertical and horizontal portion of the perimeter. A channel is positioned behind the electronic display. A fan causes the open loop fluid to flow from the ingestion gap through a first gas pathway to the channel and from the channel to a second gas pathway and out the exhaustion gap.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: April 30, 2019
    Assignee: MANUFACTURING RESOURCES INTERNATIONAL, INC.
    Inventor: Ryan DeMars
  • Patent number: 10244655
    Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: March 26, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy Joseph Chainer, Pritish Ranjan Parida, Mark Delorman Schultz
  • Patent number: 10234072
    Abstract: Embodiments of the invention relate to a system and method to enable and support vertical installation of a rack server midplane. The system is comprised of two primary components, including a guide and a bracket. The guide is secured to a server chassis, and is sized to receive the bracket. Upon receipt of the bracket, the bracket is held in position by the guide. The bracket is configured to frictionally hold the midplane in position. Installation of the bracket with the midplane within the chassis includes a direct installation of the bracket to the guide and an indirect installation of the midplane to the guide.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: March 19, 2019
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: David J. Jensen, Brian Kerrigan, Brian A. Trumbo
  • Patent number: 10211425
    Abstract: A display device and a method of manufacturing the same, the display device including a substrate; a display panel on the substrate; a first film on the display panel; and a first pattern arranged along edges of the first film, the first pattern including a material having a coefficient of thermal expansion (CTE) that is different from the CTE of a material of the first film.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: February 19, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Soyoung Lee
  • Patent number: 10188017
    Abstract: In an example, a cooling device is provided. The cooling device includes a connection block including a surface, an inlet passage, and an outlet passage. The cooling device includes a first membrane defining a first volume with a first opening at a first end thereof. The first membrane sealingly engages with the surface around the inlet passage. The cooling device includes a second membrane defining a second volume with a second opening at a second end thereof. The second membrane also defines a plurality of apertures and sealingly engages with the surface inside of the first membrane and around the outlet passage. The cooling device also includes a substrate arranged in the second membrane, is connected to the surface, and includes a heat-generating device. Coolant fluid flows into the first volume via the inlet passage, through the plurality of apertures into the second volume, and exits via the outlet passage.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: January 22, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: David Thomas Gauthier, Michael Rees Helsel, Nicholas Andrew Keehn
  • Patent number: 10149402
    Abstract: An IO subsystem, for use with an IT computing device, includes a cage assembly configured to releasably engage a chassis of the IT computing device and to receive a plurality of IO adapter cards. A midplane adapter assembly, positioned within the cage assembly, includes a first electrical connector system configured to engage a generic connector system included within the IT computing device and a second electrical connector system configured to engage the plurality of IO adapter cards. A coupling system is configured to releasably couple the cage assembly to the chassis of the IT computing device.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: December 4, 2018
    Assignee: EMC IP Holding Company LLC
    Inventors: Daniel Dufresne, James L. Pringle, Jr.
  • Patent number: 10149406
    Abstract: An electronic apparatus includes a casing provided with a ventilating opening disposed in a front surface of the casing; a plurality of fan devices disposed in a rear portion of the casing; a board that includes a heat generating device disposed on an upper surface of the board and includes a heat radiating device disposed on a lower surface of the board, and is housed in the casing, and is configured to divide the flow of the air into two in an upward-downward direction of the casing; a heat transport member configured to couple the heat generating device to the heat radiating device; and a seal member configured to form a duct structure extending in the front-rear direction of the casing between the board and a bottom wall portion of the casing by sealing a gap penetrating in a thickness direction of the board between the board and the casing.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: December 4, 2018
    Assignee: FUJITSU LIMITED
    Inventor: Takashi Shirakami
  • Patent number: 10061364
    Abstract: The present invention aims at improving a cooling efficiency and a maintenance workability related to heat generating components in a storage subsystem. Therefore, the present invention provides multiple cooling fans configured to cool multiple components for operating the storage subsystem, a first wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a first component, a second wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a second component having a smaller heating value than the first heat generating component and having a low temperature, and a chassis configured to store the multiple components, the cooling fans and the first and second wind direction panels, wherein the second wind direction panel is configured to be integrated with a side wall of the chassis and detachable from the chassis.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: August 28, 2018
    Assignee: Hitachi, Ltd.
    Inventors: Toru Kobayashi, Tadaharu Maeda, Syun Nakayama
  • Patent number: 10061097
    Abstract: A data center includes various sets of infrastructure modules which each provide a particular type of infrastructure support to support computing operations in the data center. Separate sets of infrastructure modules can be installed incrementally based on incrementally changing support capacity for the corresponding type of infrastructure support in the data center. Such incrementally changing support capacity can be based upon support requirements of electrical loads, including rack computer systems, which are inbound to the data center. Where support capacity for a particular type of infrastructure support drops below a threshold, a quantity of additional infrastructure modules which provide the particular type of infrastructure support can be selected and installed to increase the support capacity.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: August 28, 2018
    Assignee: Amazon Technologies, Inc.
    Inventors: Osvaldo P. Morales, Brock Robert Gardner
  • Patent number: 9973912
    Abstract: As sensor technology becomes more pervasive in our daily lives, an issue which arises is how to efficiently deal with the large volume of data created by these sensors. Typically, a sensor is capable of capturing far more information than is necessary for use in any given application. However, different types and amounts of data may be needed for different applications and different levels of accuracy at different times. Therefore, it is desirable that sensors are able to continue to collect comprehensive amounts of data and to send it to a unit which is able to optimize the data storage and transmission in order to reduce both upstream and downstream burdens caused by large sensor data volumes. Disclosed herein are several examples of communications devices. Communications devices can be modular, as shown, and/or stackable, as shown. An advantage to modular/stackable systems is that they can be easily customized to specific demands.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: May 15, 2018
    Assignee: Zen-me Labs Oy
    Inventor: Toni Matti Virhiä
  • Patent number: 9954993
    Abstract: An apparatus for communicating with a handheld device (e.g., a cellular telephone) is provided herein. A protective shroud is configured to enclose the handheld device and protect it against incidents that commonly cause damage to handheld devices. Integral to the protective shroud is at least one of an input component configured to receive user input and a wireless transceiver configured to transmit signals to and/or receive signals from the handheld device. In one example, where both the input component and the wireless transceiver are integral to the protective shroud, signals related to received user input (e.g., where the shroud serves as a keypad) may be transmitted to the handheld device even if the protective shroud is removed from the handheld device.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: April 24, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Timothy S. Paek, Eric Norman Badger, Daniel Allen Rosenfeld
  • Patent number: 9907202
    Abstract: An electronic equipment, including: a housing provided with ventilation holes, and a movable baffle; wherein where the electronic equipment is not in operation, the movable baffle is in a first state, the ventilation holes on the housing are shielded by the movable baffle; and where the electronic equipment is working, the movable baffle is moved to a second state to enable the ventilation holes on the housing to ventilate and dissipate heat.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: February 27, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE MULTIMEDIA TECHNOLOGY CO., LTD.
    Inventor: Pei Li
  • Patent number: 9907217
    Abstract: A cooling panel and an electronic component package including the same. The cooling panel includes first and second surfaces configured to face each other, and a cooling channel which is disposed on the second surface and in which cooling water is circulated, where the cooling channel includes a first channel region, into which cooling water is introduced, and a second channel region, through which the cooling water is discharged, and each of the first and second channel regions includes a plurality of guides, and density of the guides disposed at the first channel region is higher than density of the guides disposed at the second channel region.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: February 27, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Jong Hyun Park
  • Patent number: 9854712
    Abstract: A method for providing for conditioning of a computer data center includes supplying a working fluid from a common fluid plane to a plurality of power/cooling units distributed across a data center facility in proximity to electronic equipment that is distributed across the data center facility; converting the working fluid into electric power and cooling capacity at each of the plurality of power/cooling units; and supplying the electric power to a common electric power plane serving a plurality of racks of the electronic equipment in the data center facility and being served by a plurality of the power/cooling units in the data center facility, wherein the common fluid plane serves at least 10 percent of the power/cooling units in the data center facility and the common electric power plane serves at most 5 percent of the electronic equipment in the data center facility.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: December 26, 2017
    Assignee: Google Inc.
    Inventors: Anand Ramesh, Jimmy Clidaras, Christopher G. Malone
  • Patent number: 9798366
    Abstract: A heat dissipation system and an electronic device using the heat dissipation system are disclosed. The electronic device comprises a device main body including a circuit board. The heat dissipation system comprises a heat dissipation body, a control unit and a movable fan. The heat dissipation body is disposed near the circuit board. A plurality of first thermal sensors is distributed in various areas of the heat dissipation body and is used for monitoring a working temperature of each area. The control unit is electrically coupled with each thermal sensor. The movable fan is movably disposed at the heat dissipation body and is electrically coupled with the control unit to receive a signal, thereby allowing the control unit to control the movable fan to move to an area of the heat dissipation body having a higher working temperature than those of the other areas.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: October 24, 2017
    Assignee: WISTRON CORPORATION
    Inventors: Mang-Chia Ho, Chi-Hsiang Yeh, Jia-Cyuan Fan
  • Patent number: 9750159
    Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s).
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: August 29, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 9731666
    Abstract: An electrical junction box to be attached to a vehicle includes a heat dissipation member having a base plate portion that has a plate shape having a first surface and a second surface, a plurality of fins that protrude from the second surface, and a pedestal that is provided protruding from the second surface and that has a smaller protruding height from the second surface than the fins as well as a bracket having a pedestal attachment portion that is attached to the pedestal and a vehicle body attachment portion that is continuous with that attachment portion, extends in a direction away from the heat dissipation member, and is attachable to a vehicle body of the vehicle.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: August 15, 2017
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tomohiro Ooi, Shigeki Yamane, Takehito Kobayashi, Yukinori Kita, Yoshikazu Sasaki
  • Patent number: 9727100
    Abstract: A power unit includes a power distribution member and an interchangeable adapter configured to be deployed in an equipment rack of a distributed computing system. The power distribution member includes multiple power outlets to provide electrical power to a plurality of devices disposed in the equipment rack at a first current rating and phase type configuration, and a first connector having a plurality of first electrical contacts that are electrically coupled to the power outlets. The interchangeable adapter includes a second connector to be coupled to the first connector in which the second connector has multiple second contacts that are arranged to mate with certain ones of the first electrical contacts such that one of a plurality of different electrical power sources having a second current rating and phase type configuration is provided to the power outlets at the first current rating and phase type configuration.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: August 8, 2017
    Assignee: VCE IP Holding Company LLC
    Inventor: Alva B. Eaton
  • Patent number: 9723765
    Abstract: The exemplary embodiments herein provide an electronic display assembly having an electronic display surrounded by a front panel and a housing. An ingestion gap may be placed near a portion of the perimeter of the front panel while an exhaustion gap may be placed near an opposing portion of the perimeter of the front panel. A buffer zone may be defined between the ingestion gap and the exhaustion gap. A fan may be positioned to draw open loop fluid into the ingestion gap, through a channel behind the electronic display, and out of the exhaustion gap. This fan may also draw open loop fluid through an optional heat exchanger. A circulating fan may force circulating air through an optional heat exchanger.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: August 1, 2017
    Assignee: Manufacturing Resources International, Inc.
    Inventor: Ryan DeMars
  • Patent number: 9659466
    Abstract: A display device includes a chassis, an electronic module, and a waterproof breathable member. The chassis has a front frame and a rear cover installed on the front frame. The rear cover has a plurality of heat-dissipating holes and an intake port, and the chassis is configured to allow a heat-dissipating airflow to pass through the accommodating space via the heat-dissipating holes and the intake port. The electronic module arranged in the chassis has a circuit board, and the heat-dissipating holes are arranged above the circuit board. The waterproof breathable member is disposed on an inner surface of the rear cover and entirely shields the heat-dissipating holes, so the heat-dissipating airflow only passes through the waterproof breathable member when the heat-dissipating airflow flows out of the chassis via the heat-dissipating holes. The waterproof breathable member is configured to avoid any liquid flowing into the chassis via the heat-dissipating holes.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: May 23, 2017
    Assignee: PENETEK TECHNOLOGY, INC.
    Inventors: Tsung-Lung Chen, Hsin-Hung Chen, Wen-Hsien Yu
  • Patent number: 9654017
    Abstract: A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: May 16, 2017
    Assignee: Johnson Controls Technology Company
    Inventors: Konstantin Borisov, Mark A. Nielsen, Jeffrey A. Martinelli, Brian L. Stauffer, Seth K. Gladfelter, Michael S. Todd, Ivan Jadric, Jeb W. Schreiber, Tim Beckley
  • Patent number: 9582052
    Abstract: A method, an apparatus, and a computer program product are provided. The apparatus may be a UE. The UE has a processor including a plurality of cores. The plurality of cores includes a first core and remaining cores. The UE determines a temperature of the first core of the plurality of cores. The first core processes a load. The UE determines that the temperature of the first core is greater than a first threshold. The UE determines that the temperature of the first core is not greater than a second threshold. The second threshold is greater than the first threshold. The UE transfers at least a portion of the load of the first core to a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: February 28, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Rajat Mittal, Madan Krishnappa, Rajit Chandra, Mohammad Tamjidi
  • Patent number: 9483090
    Abstract: A method for providing for conditioning of a computer data center includes supplying a working fluid from a common fluid plane to a plurality of power/cooling units distributed across a data center facility in proximity to electronic equipment that is distributed across the data center facility; converting the working fluid into electric power and cooling capacity at each of the plurality of power/cooling units; and supplying the electric power to a common electric power plane serving a plurality of racks of the electronic equipment in the data center facility and being served by a plurality of the power/cooling units in the data center facility, wherein the common fluid plane serves at least 10 percent of the power/cooling units in the data center facility and the common electric power plane serves at most 5 percent of the electronic equipment in the data center facility.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: November 1, 2016
    Assignee: Google Inc.
    Inventors: Anand Ramesh, Jimmy Clidaras, Christopher G. Malone
  • Patent number: 9426924
    Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: August 23, 2016
    Assignee: International Business Machines Corporation
    Inventors: Robert R. Genest, John J. Loparco, Robert K. Mullady, John G. Torok, Wade H. White, Mitchell L. Zapotoski
  • Patent number: 9325101
    Abstract: An adapter device includes a cover that covers an inserted recording medium, a cover urging portion that urges the cover in a direction of the recording medium and causes the cover to be in press contact with the recording medium, and a connector conversion section that connects a terminal portion of the recording medium to a connector on an apparatus side having a different physical specification.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: April 26, 2016
    Assignee: Sony Corporation
    Inventors: Isao Tsutsumi, Shinji Takaki
  • Patent number: 9257359
    Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: February 9, 2016
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Arvind K. Sinha, Kevin A. Splittstoesser, Timothy J. Tofil
  • Patent number: 9236717
    Abstract: An industrial control panel is provided that comprises a zone enclosure unit and an equipment segregation unit. The zone enclosure unit has a back panel, a plurality of side panels, a top panel, a bottom panel, and a door to access the interior of the zone enclosure unit. The zone enclosure unit is adapted to contain a first set of electrical equipment. The equipment segregation unit may be mounted to the zone enclosure unit. The equipment segregation unit has a back panel, a plurality of side panels, a bottom panel, and a door to access the interior of the equipment segregation unit. The equipment segregation unit is adapted to contain a second set of electrical equipment. The first set of electrical equipment is capable of being electrically connected to the second set of electrical equipment.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: January 12, 2016
    Assignee: Panduit Corp.
    Inventors: Rey Bravo, Brian K. Arflack, Frank E. Grzelak, Jr., Eleobardo Moreno, Brian K. Rohder
  • Patent number: 9237678
    Abstract: A cooling device for electric equipment includes a cooling unit for cooling inverter elements. Cooling unit includes a heat mass which has a surface provided with the inverter elements and a back surface arranged on a back side of surface to form a heat mass inner tank arranged between the surface and the back surface and transfers heat generated at the inverter elements, a fin portion which is provided on the back surface and radiates heat transferred through the heat mass, air-conditioner coolant pipelines which are provided on the surface and form a coolant passage through which a coolant for vehicle cabin air-conditioning flows, and a water pump which supplies and discharges coolant water to and from the heat mass inner tank. With such a configuration, a cooling device for electric equipment which is excellent in cooling efficiency is provided.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: January 12, 2016
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Kunihiko Arai
  • Patent number: 9219353
    Abstract: An equipment-rack power distribution system is described which includes a PDU housing, a power input penetrating the housing, a plurality of power outlets disposed on a surface of the housing, circuitry enclosed in the housing interconnecting the power input and the power outlets, one or more air inlets associated with the housing, one or more air outlets associated with the housing, and an air flow device in fluid communication with one or more of the air inlets and the air outlets. An environmental sensor may activate the air flow device upon detection of predetermined environmental conditions, such as a temperature that is above a defined limit.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: December 22, 2015
    Assignee: Server Technology, Inc.
    Inventors: Carrel W. Ewing, Brandon Ewing, Edi Murway
  • Patent number: 9176549
    Abstract: Example embodiments disclosed herein relate to a case having a base unit and a display unit. The base unit includes an emitting surface. The display unit includes a dissipating member. A hinge connects the base unit and the display unit, the hinge connected below at least part of the heat emitting surface or first vent and the heat dissipating member or second vent. The emitting surface and the dissipating member are to overlap or align when the display unit is in a closed position.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: November 3, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin L. Massaro, Mark David Senatori, Ilchan Lee
  • Patent number: 9173327
    Abstract: A data center includes a wind collecting structure that directs prevailing winds external to the data center into an interior of the wind collecting structure. The wind collecting structure includes vents around its perimeter configured to selectively open on a side of the wind collecting structure receiving prevailing wind, pressurizing the intake air. The pressurized air flows from the wind collecting structure through a compartment of the data center including computing assets. The air is directed across the computing assets to extract heat from the computing assets during operation.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: October 27, 2015
    Assignee: Facebook, Inc.
    Inventor: Scott Wiley
  • Patent number: 9131624
    Abstract: An IT chassis, configured to house IT componentry, includes a forward portion having a forward portion width and a rearward portion having a rearward portion width that is narrower than the forward portion width. A first side of the rearward portion is configured to engage a first slide assembly having a first slide width. A second side of the rearward portion is configured to engage a second slide assembly having a second slide width. The sum of the rearward portion width, the first slide width and the second slide width is substantially equal to the forward portion width.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: September 8, 2015
    Assignee: EMC Corporation
    Inventors: Keith C. Johnson, Ralph C. Frangioso, Robert P. Wierzbicki, W. Brian Cunningham, Michael Gregoire, Justin P. Bandholz, Jiabing Li
  • Patent number: 9122463
    Abstract: A server includes a chassis, processing units and an airflow generating device. The processing units are disposed inside the chassis for heat dissipation of the processing units. Each processing unit includes a motherboard, an electric heat source, a heat dissipation fin set and a stopping air bag. The electric heat source is disposed on the motherboard, the heat dissipation fin set is attached to the electric heat source and the stopping air bag including an air inlet opening is located at space between the heat dissipation fin set and one of the processing units which is adjacent to the stopping air bag. When the airflow generating devices are operated, air is blown into the stopping air bag through the air inlet opening so that the stopping air bag is inflated to occupy the space to stop an airflow from flowing through the space.
    Type: Grant
    Filed: October 3, 2013
    Date of Patent: September 1, 2015
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Ling-Jun Lai
  • Publication number: 20150146367
    Abstract: A heat dissipation system includes a number of condensers, an air distribution apparatus, a number of guiding pipes, and a controller. The air distribution apparatus includes a distribution box and a number of adjusting members. The distribution box defines an air inlet and a number of air outlets arranged along a lengthwise direction of the distribution box. The adjusting members are rotatably installed in the air outlets of the distribution box. The guiding pipe is connected between the condensers and the air inlet of the air distribution apparatus. The controller controls the adjusting members to rotate to change opening sizes of the air outlets.
    Type: Application
    Filed: December 10, 2013
    Publication date: May 28, 2015
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: SHIH-CHIEH CHEN
  • Patent number: 9042096
    Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: May 26, 2015
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Mark A. Thomas, Dennis Gammel, Shankar V. Achanta
  • Patent number: 9036344
    Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: May 19, 2015
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Jing Chen, Chien-Lung Chen