Abstract: A device for detecting household conditions and events includes a power supply portion and a plurality of portions able to detect different conditions, or changes in different conditions. Each detecting portion includes an input port and an output port, the output port of one detecting portion is detachably electronically connected to the power supply portion, and the input port of one detecting portion is detachably electronically connected to the output port in a modular fashion of another detecting portion, the remote selection of a specific required detection is also provided.

Abstract: A function key module of a game controller and a game controller are provided. The function key module includes a key housing, a lens component, a hollow packaging board, a circuit board, a flat cable, and a bottom casing. The flat cable is fixedly connected to the bottom casing. The circuit board is electrically connected to the flat cable, and the hollow packaging board is arranged above the circuit board. The lens component is arranged above the hollow packaging board. The key housing is fixedly connected to the bottom casing. The circuit board is provided with an OFN module, an infrared LED light source module, and a photosensitive array module. The OFN module, the infrared LED light source module, and the photosensitive array module are electrically connected to each other.

Abstract: The present invention relates to a carrier substrate (30) comprising signal vias (41) for electrically interconnecting components (10, 31) arranged on opposing sides of the carrier substrate (30). The carrier substrate (30) further comprises: at least one cavity (20) embedded in the carrier substrate (30) having at least one chamber wick part (24) and a working fluid, and wherein the at least one cavity (20) at least partially encompass the signal vias (41). The present invention also relates to an electronic assembly and an apparatus for wireless communication comprising the carrier substrate (30).

Abstract: An immersion liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The tank includes a base and a plurality of side walls. The base and the plurality of sidewalls are connected. The condenser includes a plurality of condenser tubes. The manifold system is coupled to the condenser to assist in distributing liquid flow to and from the plurality of condenser tubes. The at least one top cover is located generally opposite to the base.

Abstract: A data centre, a method of cooling electrical equipment in a data centre, and a services module for a data centre, are disclosed. The data centre is for accommodating a plurality of racks of IT equipment and comprises: a) a plurality of hot aisles interleaved with a plurality of cold aisles separated by IT equipment rack storage areas; b) an air handling unit configured to supply cooling air to the cold aisles; c) a services area for accommodating at least one UPS switchboard for directing electrical power to a plurality of IT equipment racks, the services area comprising hot and cold zones, a hot zone being separated from a cold zone by at least one of (i) a UPS switchboard storage area and (ii) a partition; wherein, in use, cooling air is supplied to the UPS switchboard storage area from the air handling unit via the cold zone of the services area.

Abstract: A battery unit including a battery, a circuit board, a switching device which achieves charge or discharge of the battery, and a casing made up of a bottom and a peripheral wall. The battery is disposed on the bottom. The circuit board is arranged farther away from the bottom than from the battery. The switching device is located closer to the bottom than the circuit board is. The switching device has a visible area visually or optically perceived, as inwardly facing inside the casing from outside the circuit board, and includes a data-retaining area on which data on characteristics of the switching device is provided, for example, in the form of a code. This structure facilitates the ease with which the data on the characteristics of the switching device is visually or optically read out of the data-retaining area without having to have an increased size of the battery unit.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: An electronic device includes a main body, a case, and an airbag. The main body includes an accommodation space and an opening, and a fan is disposed in the accommodation space. The case is disposed on the opening and one side of the case is connected to one side wall of the main body surrounding the opening. The airbag is disposed in the accommodation space below the orthographic projection of the case and communicates with the fan. When the airbag is not yet inflated, the case horizontally covers the opening. When the fan rotates at a speed greater than a critical speed, the airbag is inflated by the fan to lift another side of the case, so that the case is tilted on the main body to expose the opening.

Abstract: Systems and methods are involved with but are not limited to an apparatus including a traylike structure including one or more apertures being positioned along one or more of a first wall portion, a second wall portion, a third wall portion, and a fourth wall portion; and a flangelike structure including one or more protrusions being positioned to extend from one or more of a first lower interior surface of a first elongated member, a second lower interior surface of a second elongated member, and a third lower interior surface of the third elongated member to engage with the one or more apertures of the traylike structure thereby coupling the flangelike structure with the traylike structure. In addition, other aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Abstract: Systems and methods for detecting a keyboard's position with respect to a display of a multi-form factor Information Handling System (IHS) are described. In some embodiments, an IHS may include: a processor; and a memory coupled to the processor, the memory having program instructions stored thereon that, upon execution by the processor, cause the IHS to: identify, using an infrared (IR) transceiver, a position of a keyboard disposed on a surface of a display; and render a graphical feature on the display based upon the position.

Abstract: Disclosed is a method of communication between a plurality of liquid cooling modules of a cooling system for one or more one computer servers, in which: the cooling modules communicate with each other in a manner that operates in N+1 redundancy where N is greater than or equal to 2, so as to enable a standard replacement of any one of these cooling modules without stopping the cooling and without stopping the operation of the server or servers, this communication being ensured by a collaborative protocol without master/slave, before switching from an active mode where it is cooling to a backup mode where it is no longer cooling, the redundant cooling module verifying beforehand that a data set is consistent across all these cooling modules and that this consistency is maintained for a predetermined duration.

Abstract: The present invention relates to the field of servers, and disclosed thereby is a peripheral component interconnect express (PCIE) structure capable of tool-free disassembly/assembly, including: a node base and a PCIE support, a board card being mounted on the node base, and the board card being provided thereon with a PCIE insertion slot; a Riser card is mounted on the PCIE support, and a PCIE card is mounted within the PCIE slot by means of the Riser card; the PCIE support is detachably mounted on the node base, and the node base on which the PCIE support is mounted may be steadily placed into a machine case. The PCIE structure provided by the present invention may simultaneously lock two adjacent PCIE supports within a node, and no tools are required for the entire assembly and disassembly process.

Abstract: Systems and methods are involved with but are not limited to an apparatus including a traylike structure including one or more apertures being positioned along one or more of a first wall portion, a second wall portion, a third wall portion, and a fourth wall portion; and a flangelike structure including one or more protrusions being positioned to extend from one or more of a first lower interior surface of a first elongated member, a second lower interior surface of a second elongated member, and a third lower interior surface of the third elongated member to engage with the one or more apertures of the traylike structure thereby coupling the flangelike structure with the traylike structure. In addition, other aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Abstract: A display apparatus and a manufacturing method thereof are provided. The display apparatus includes a printed circuit board on which a plurality of light emitting diodes (LEDs) is mounted; a frame configured to support the printed circuit board, and including a frame hole passing through the frame; a chassis coupled to the frame, and including a chassis hole configured to correspond to the frame hole; and a bonding member positioned between the printed circuit board and the frame, through the frame hole and the chassis hole, the bonding member configured to bond the frame to the printed circuit board.

Abstract: A case for a laptop computer, the case comprising upper and lower shells which are entirely separate from one another. Each shell comprises an outer layer of a first injection moulded polymer and an inner liner of a second injection moulded polymer softer than the first. Each shell defines a cavity having a back surface and upstanding side walls, the cavity being arranged to receive, in use, one half of the laptop computer. The second polymer comprises a plurality of inwardly extending clips which protrude across the cavity from an edge of the side wall furthest from the back surface to, in use, retain the shell on the laptop half.

Abstract: A terminal apparatus includes a body and a display that is rotatably joined to the body by a swivel shaft. Hinge mechanisms that open and close the display with respect to the body are provided on both sides of the swivel shaft. The hinge mechanisms are connected to the ground of the display and parts of the hinge mechanisms protrude from the lower edge of the display. Metal components that are connected to the ground of the body and support and make conductive contact with the protrusions of the hinge mechanisms are provided on the body. Since the grounds of the display and the body are connected by both the swivel shaft and the hinge mechanisms, a potential difference between the grounds of the body and the display is reduced compared to when the grounds are connected only via the swivel shaft.

Abstract: Systems and methods are involved with but are not limited to an apparatus including a traylike structure including one or more apertures being positioned along one or more of a first wall portion, a second wall portion, a third wall portion, and a fourth wall portion; and a flangelike structure including one or more protrusions being positioned to extend from one or more of a first lower interior surface of a first elongated member, a second lower interior surface of a second elongated member, and a third lower interior surface of the third elongated member to engage with the one or more apertures of the traylike structure thereby coupling the flangelike structure with the traylike structure. In addition, other aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

Abstract: Embodiments in include a system, a method, and a computer program product for performing intelligent load shedding for multi-channel processing system. The embodiments include a multi-channel processing system, wherein each channel of the multi-channel processing system includes a plurality of processors, and a plurality of links coupling each channel with each other channel in the multi-channel processing system, wherein the links are used to transmit status information of the plurality of processors. The embodiments also include a plurality of cooling elements coupled to each channel having the plurality of processors, wherein the plurality of cooling elements are configured to remove heat from the multi-channel processing system.

Abstract: Systems and methods for detecting a keyboard's position with respect to a display of a multi-form factor Information Handling System (IHS) are described. In some embodiments, an IHS may include: a processor; and a memory coupled to the processor, the memory having program instructions stored thereon that, upon execution by the processor, cause the IHS to: identify, using an infrared (IR) transceiver, a position of a keyboard disposed on a surface of a display; and render a graphical feature on the display based upon the position.

Abstract: A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.

Abstract: An electronic device includes a first component, a second component, a dual axis module, and a third component. The second component is flipably disposed at the first component. The dual axis module has a first shaft and a second shaft. The second component is pivoted to the second shaft. The third component is pivoted to the first shaft. The electronic device is switched between a first state, a second state, a third state, and a fourth state. During the switching of the first state to the second state, the first shaft is rotatable relative to the first component and the second shaft is non-rotatable. During the switching of the second state to the third state, the first shaft is non-rotatable and the second shaft is rotatable relative to the first component. During the switching of the third state to the fourth state, the first shaft is rotatable relative to the first component and the second shaft is non-rotatable.

Abstract: A computing device for cooling an electronic component is provided. The computing device includes a chassis with a first end and a second end; fan modules located at the first end of the chassis; and a Peripheral Component Interconnect Express (PCIe) baseboard located at a front side of the chassis. The PCIe baseboard is configured to support placement thereof in the chassis in a first position and a second position. The second position of the PCIe baseboard is a 180-degree rotation from the first position. The PCIe baseboard includes GPU slots for installing a plurality of graphic processing units (GPUs), the GPUs including fan modules.

Abstract: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.

Abstract: A system of modular fans for a network device is disclosed. The network device includes a rack assembly having side walls forming an enclosure with a plurality of sled slots accessible from a rear end. A plurality of operation sleds are mountable on one of the plurality of sled slots. A plurality of removable fan modules is provided. Each of the removable fan modules are installed in one of the operation sleds. The removable fan modules are individually removable from the operation sleds and therefore may be swapped out while the rest of the components in the network device remain operational.

Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.

Abstract: A housing assembly for a computer system includes at least one first shielding casing with a first plurality of ventilation openings in an area of a first housing wall of the first shielding casing; and at least one second shielding casing with a second plurality of ventilation openings in an area of a second housing wall of the second shielding casing, wherein a first contact area of the first housing wall of the first shielding casing borders directly on a corresponding second contact area of the second housing wall of the second shielding casing, and at least one of the first housing wall of the first shielding casing and the second housing wall of the second shielding casing includes a recess so that the first plurality of ventilation openings of the first shielding casing is spaced apart from the second plurality of ventilation openings of the second shielding casing.

Abstract: A mobile device processor unit enables a remotely-located user to interact with a user interface associated with a complete mobile device on a computer supporting the user, where the interface is presented based on execution of functionality of the complete mobile device on a limited selection of components of the complete mobile device. The limited selection of components is included in a mobile device processor unit. The processor unit can be installed in a slot space of a support chassis to structurally support the limited selection of components and to couple the processor unit with a connector to communicatively couple the components with the remote user via a communication network.

Abstract: In one embodiment, a cooling system includes a thermosyphon cooler that cools a cooling fluid through dry cooling and a cooling tower that cools a cooling fluid through evaporative cooling. The thermosyphon cooler uses natural convection to circulate a refrigerant between a shell and tube evaporator and an air cooled condenser. The thermosyphon cooler is located in the cooling system upstream of, and in series with, the cooling tower, and is operated when the thermosyphon cooler is more economically and/or resource efficient to operate than the cooling tower. According to certain embodiments, factors, such as the ambient temperature, the cost of electricity, and the cost of water, among others, are used to determine whether to operate the thermosyphon cooler, the cooling tower, or both.

Abstract: A stack arrangement having at least two stack elements, which can be stacked on each other in a stacking direction, of which at least one is formed from a transport container which has a container body having a storage receptacle which has a machine receptacle for an electrical or pneumatic hand tool machine. The stacking elements have bus interfaces for transferring data and/or energy between the stacking elements of the stack arrangement, wherein the bus interfaces form a bus connection between the stack elements when the stack elements are stacked on each other.

Abstract: A display includes a display panel, a board mounting portion, and a circuit board arranged at one surface of the board mounting portion. The display panel also includes a cover portion positioned only at a portion of the one surface of the board mounting portion. The portion includes a region in which the circuit board is arranged. The cover portion includes a bottom surface portion and a first side surface portion that extends from the bottom surface portion toward the one surface of the board mounting portion. The first side surface portion includes a first opening portion.

Abstract: An electronic display assembly for an electronic display includes a front panel having a perimeter and a housing. An ingestion gap ingests, and an exhaustion gap exhausts, open loop fluid. The ingestion and exhaustion gaps are each located along a vertical and horizontal portion of the perimeter. A channel is positioned behind the electronic display. A fan causes the open loop fluid to flow from the ingestion gap through a first gas pathway to the channel and from the channel to a second gas pathway and out the exhaustion gap.

Abstract: Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.

Abstract: Embodiments of the invention relate to a system and method to enable and support vertical installation of a rack server midplane. The system is comprised of two primary components, including a guide and a bracket. The guide is secured to a server chassis, and is sized to receive the bracket. Upon receipt of the bracket, the bracket is held in position by the guide. The bracket is configured to frictionally hold the midplane in position. Installation of the bracket with the midplane within the chassis includes a direct installation of the bracket to the guide and an indirect installation of the midplane to the guide.

Abstract: A display device and a method of manufacturing the same, the display device including a substrate; a display panel on the substrate; a first film on the display panel; and a first pattern arranged along edges of the first film, the first pattern including a material having a coefficient of thermal expansion (CTE) that is different from the CTE of a material of the first film.

Abstract: In an example, a cooling device is provided. The cooling device includes a connection block including a surface, an inlet passage, and an outlet passage. The cooling device includes a first membrane defining a first volume with a first opening at a first end thereof. The first membrane sealingly engages with the surface around the inlet passage. The cooling device includes a second membrane defining a second volume with a second opening at a second end thereof. The second membrane also defines a plurality of apertures and sealingly engages with the surface inside of the first membrane and around the outlet passage. The cooling device also includes a substrate arranged in the second membrane, is connected to the surface, and includes a heat-generating device. Coolant fluid flows into the first volume via the inlet passage, through the plurality of apertures into the second volume, and exits via the outlet passage.

Abstract: An IO subsystem, for use with an IT computing device, includes a cage assembly configured to releasably engage a chassis of the IT computing device and to receive a plurality of IO adapter cards. A midplane adapter assembly, positioned within the cage assembly, includes a first electrical connector system configured to engage a generic connector system included within the IT computing device and a second electrical connector system configured to engage the plurality of IO adapter cards. A coupling system is configured to releasably couple the cage assembly to the chassis of the IT computing device.

Abstract: An electronic apparatus includes a casing provided with a ventilating opening disposed in a front surface of the casing; a plurality of fan devices disposed in a rear portion of the casing; a board that includes a heat generating device disposed on an upper surface of the board and includes a heat radiating device disposed on a lower surface of the board, and is housed in the casing, and is configured to divide the flow of the air into two in an upward-downward direction of the casing; a heat transport member configured to couple the heat generating device to the heat radiating device; and a seal member configured to form a duct structure extending in the front-rear direction of the casing between the board and a bottom wall portion of the casing by sealing a gap penetrating in a thickness direction of the board between the board and the casing.

Abstract: A data center includes various sets of infrastructure modules which each provide a particular type of infrastructure support to support computing operations in the data center. Separate sets of infrastructure modules can be installed incrementally based on incrementally changing support capacity for the corresponding type of infrastructure support in the data center. Such incrementally changing support capacity can be based upon support requirements of electrical loads, including rack computer systems, which are inbound to the data center. Where support capacity for a particular type of infrastructure support drops below a threshold, a quantity of additional infrastructure modules which provide the particular type of infrastructure support can be selected and installed to increase the support capacity.

Abstract: The present invention aims at improving a cooling efficiency and a maintenance workability related to heat generating components in a storage subsystem. Therefore, the present invention provides multiple cooling fans configured to cool multiple components for operating the storage subsystem, a first wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a first component, a second wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a second component having a smaller heating value than the first heat generating component and having a low temperature, and a chassis configured to store the multiple components, the cooling fans and the first and second wind direction panels, wherein the second wind direction panel is configured to be integrated with a side wall of the chassis and detachable from the chassis.

Abstract: As sensor technology becomes more pervasive in our daily lives, an issue which arises is how to efficiently deal with the large volume of data created by these sensors. Typically, a sensor is capable of capturing far more information than is necessary for use in any given application. However, different types and amounts of data may be needed for different applications and different levels of accuracy at different times. Therefore, it is desirable that sensors are able to continue to collect comprehensive amounts of data and to send it to a unit which is able to optimize the data storage and transmission in order to reduce both upstream and downstream burdens caused by large sensor data volumes. Disclosed herein are several examples of communications devices. Communications devices can be modular, as shown, and/or stackable, as shown. An advantage to modular/stackable systems is that they can be easily customized to specific demands.

Abstract: An apparatus for communicating with a handheld device (e.g., a cellular telephone) is provided herein. A protective shroud is configured to enclose the handheld device and protect it against incidents that commonly cause damage to handheld devices. Integral to the protective shroud is at least one of an input component configured to receive user input and a wireless transceiver configured to transmit signals to and/or receive signals from the handheld device. In one example, where both the input component and the wireless transceiver are integral to the protective shroud, signals related to received user input (e.g., where the shroud serves as a keypad) may be transmitted to the handheld device even if the protective shroud is removed from the handheld device.

Abstract: A cooling panel and an electronic component package including the same. The cooling panel includes first and second surfaces configured to face each other, and a cooling channel which is disposed on the second surface and in which cooling water is circulated, where the cooling channel includes a first channel region, into which cooling water is introduced, and a second channel region, through which the cooling water is discharged, and each of the first and second channel regions includes a plurality of guides, and density of the guides disposed at the first channel region is higher than density of the guides disposed at the second channel region.

Abstract: An electronic equipment, including: a housing provided with ventilation holes, and a movable baffle; wherein where the electronic equipment is not in operation, the movable baffle is in a first state, the ventilation holes on the housing are shielded by the movable baffle; and where the electronic equipment is working, the movable baffle is moved to a second state to enable the ventilation holes on the housing to ventilate and dissipate heat.

Abstract: A method for providing for conditioning of a computer data center includes supplying a working fluid from a common fluid plane to a plurality of power/cooling units distributed across a data center facility in proximity to electronic equipment that is distributed across the data center facility; converting the working fluid into electric power and cooling capacity at each of the plurality of power/cooling units; and supplying the electric power to a common electric power plane serving a plurality of racks of the electronic equipment in the data center facility and being served by a plurality of the power/cooling units in the data center facility, wherein the common fluid plane serves at least 10 percent of the power/cooling units in the data center facility and the common electric power plane serves at most 5 percent of the electronic equipment in the data center facility.

Abstract: A heat dissipation system and an electronic device using the heat dissipation system are disclosed. The electronic device comprises a device main body including a circuit board. The heat dissipation system comprises a heat dissipation body, a control unit and a movable fan. The heat dissipation body is disposed near the circuit board. A plurality of first thermal sensors is distributed in various areas of the heat dissipation body and is used for monitoring a working temperature of each area. The control unit is electrically coupled with each thermal sensor. The movable fan is movably disposed at the heat dissipation body and is electrically coupled with the control unit to receive a signal, thereby allowing the control unit to control the movable fan to move to an area of the heat dissipation body having a higher working temperature than those of the other areas.

Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s).

Abstract: An electrical junction box to be attached to a vehicle includes a heat dissipation member having a base plate portion that has a plate shape having a first surface and a second surface, a plurality of fins that protrude from the second surface, and a pedestal that is provided protruding from the second surface and that has a smaller protruding height from the second surface than the fins as well as a bracket having a pedestal attachment portion that is attached to the pedestal and a vehicle body attachment portion that is continuous with that attachment portion, extends in a direction away from the heat dissipation member, and is attachable to a vehicle body of the vehicle.

Abstract: A power unit includes a power distribution member and an interchangeable adapter configured to be deployed in an equipment rack of a distributed computing system. The power distribution member includes multiple power outlets to provide electrical power to a plurality of devices disposed in the equipment rack at a first current rating and phase type configuration, and a first connector having a plurality of first electrical contacts that are electrically coupled to the power outlets. The interchangeable adapter includes a second connector to be coupled to the first connector in which the second connector has multiple second contacts that are arranged to mate with certain ones of the first electrical contacts such that one of a plurality of different electrical power sources having a second current rating and phase type configuration is provided to the power outlets at the first current rating and phase type configuration.