Abstract: A first reception unit receives “ambient temperature” which is a temperature of surroundings where the computer is installed. A second reception unit receives “first device temperature” which is a temperature of a first device provided in the computer. A third reception unit receives “second device temperature” which is a temperature of a second device provided in the computer. A fan rotation speed indicating unit determines the rotation speed of the fan based on a comparison between the ambient temperature, first device temperature, and second device temperature which are received by the first to third reception units and a fan rotation speed description table describing a relationship between the respective temperature and fan rotation speed and instructs the fan to rotate at the determined rotation speed.

Abstract: A LCD device includes color LEDs, a light-mixing optical guide plate and a main optical guide plate for guiding lights from the color LEDs, a LCD panel for receiving lights from the main optical guide plate, a housing for supporting the LCD panel, light-mixing optical guide plate and main optical guide plate in block, and a heat sink for dissipating the heat transferred from the LEDs. On the rear surface side of the light-mixing optical guide plate, a heat receiving member is provided having a higher heat receiving capability than the rest of the housing.

Abstract: A printed circuit board is provided with at least one via hole, in which a heat dissipating element is arranged, wherein at least one radiant source is arranged on the heat dissipating element. The lighting device is provided with at least one such printed circuit board.

Abstract: A circuit board assembly includes a motherboard defining a number of plug slots, and a fixing mechanism for securing a heat sink. The fixing mechanism is positioned between two adjacent plug slots, and includes a support member mounted on the motherboard, two fixing brackets mounted on opposite ends of the support member, two bars rotatably connected to the fixing brackets, and a connection member detachably connected to the support member by the bars. The opposite borders of the support member extend in the same direction substantially parallel to the plug slots, and the support member forms four connecting portions for securing the heat sink on opposite sides thereof, and the connecting portions are located between the opposite borders.

Abstract: A heat dissipation device for dissipating heat from an electronic component. The heat dissipation device includes a shroud having a bottom wall and a sidewall partially surrounding the bottom wall, a base mounted on a bottom of the bottom wall, a bracket fixed on a top of the bottom wall, an impeller rotatably mounted on the bracket, a fin assembly arranged on the bottom wall, a plurality of heat pipes connecting the fin assembly with the base, and a cover secured on the sidewall. An end of the bottom wall extends beyond the sidewall to support the fin assembly thereon. An opening and a window are respectively defined in the bottom wall and the cover. A plate is formed within the opening of the bottom wall and connects the bracket with the base.

Abstract: An exemplary electronic device includes an enclosure, two electronic components received in the enclosure, a heat sink, and a thermal insulation member. The enclosure defines a receiving space for receiving the electronic components and the thermal insulation member. Two ventilating holes are defined in the enclosure. The thermal insulating member defines a heat dissipating passage therein, communicating with the exterior via the ventilating holes of the enclosure. The heat sink is received in the heat dissipating passage and thermally coupled to the electronic components for dissipating heat from the electronic components. The heat dissipating passage is substantially thermally insulated from the part of the receiving space of the enclosure having the electronic components by the thermal insulation member.

Abstract: A heat sink type module includes a mounting seat and a heat sink. The mounting seat includes a supporting plate, and two substantially parallel first side plates extending up from opposite first sides of the supporting plate. A latch protrudes from an inner surface of each first side plate. A heat sink includes a base plate and fins extending up from a top surface of the base plate. The base plate includes two substantially parallel first sides. The latches of the first side plates latch the first sides of the base plate to fix the heat sink.

Abstract: The subject invention relates to a semiconductor package and method of manufacturing the same. The semiconductor package of the subject invention comprises a substrate with a through hole penetrating therethrough; a semiconductor chip positioned on the substrate covering the through hole; and a thermal conductive device filling the through hole and contacting the semiconductor chip. According to the subject invention, the thermal resistance in the structure of the semiconductor package is substantially reduced and thus desirable performance of heat spreading or dissipation is achieved. In addition, the production cost and size of the semiconductor package are also reduced.

Abstract: A system and method are provided for directly coupling a chassis and a heat sink. A circuit board is provided with at least one processor mounted thereon. Additionally, a heat sink is provided, the heat sink being mechanically coupled to at least one of the circuit board and the processor for providing thermal communication between the heat sink and the circuit board. Furthermore, a mount is provided, the mount being coupled to the heat sink for providing a direct mechanical coupling with a chassis.

Abstract: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Abstract: An automatic transmission control unit cooling apparatus includes a control unit having an electronic component, installed on a substrate, for controlling the automatic transmission; a holder accommodating the substrate and within a case of the automatic transmission disposed at a position that is higher than the oil surface in the automatic transmission when the transmission is installed in a vehicle and on a side face of a valve body in the transmission case. The apparatus further includes a radiator that contacts the electronic component or the substrate in order to conduct heat generated by the electronic component. At least a part of the radiator is immersed in the oil when the transmission is installed in the vehicle.

Abstract: An electronic apparatus includes a casing that includes a vent, with the vent venting dust inside the casing, a heat radiating fin that is housed in the casing and includes an edge portion, a cooling fan that is housed in the casing and cools the heat radiating fin, with the cooling fan including an edge portion that faces the edge portion of the heat radiating fin. The electronic apparatus has a clearance between the edge portion of the heat radiating fin and the edge portion of the cooling fan becomes narrower the further it is from the vent.

Abstract: A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and a plurality of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.

Abstract: An electronic component unit includes: a substrate; an electronic component mounted on the surface of the substrate; a heat dissipating member received on the electronic component; a cylinder member having one end coupled to the substrate, the cylinder member having the other end defining an opening opposed to the heat dissipating member; and a piston member having one end coupled to the heat dissipating member, the piston member having the other end inserted in the cylinder member through the opening to establish a closed decompressed space inside the cylinder member.

Abstract: A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.

Abstract: A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

Abstract: An electronic device includes a computer, a circuit board, a supporting base attached to a top surface of the circuit board, and a backboard attached to a bottom surface of the circuit board. The case includes a bottom plate. The circuit board defines a through hole. A CPU is located on the supporting base. The backboard defines a retaining hole. The supporting base defines a fixing hole. A heat sink is attached to the supporting base and contacted the CPU. A fixing member is engaged with the retaining hole, the fixing hole and the through hole, to engage the backboard and the supporting base to the circuit board.

Abstract: Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Abstract: An electronic device includes a motherboard and a heat dissipating plate. The motherboard includes a base. The base includes a number of ports and an electronic element. The heat dissipating plate includes a substrate and a number of fasteners extending out from the substrate for engaging with the number of ports of the motherboard. The substrate defines a bulging cavity for engaging with and dissipating heat from the electronic element.

Abstract: A computer system includes a chassis and a frame. The chassis includes a chassis bottom wall, a first chassis sidewall connected to the chassis bottom wall, and a second chassis sidewall connected to the chassis bottom wall. The frame includes a mounting bracket and a retaining bracket. The mounting bracket is secured to at least one of the chassis bottom wall and the first and second chassis sidewalls. The mounting bracket defines a through opening configured for to have a disk drive inserted through the opening. The retaining bracket defines a holding space configured for receiving the disk drive. The through opening is in communication with the holding space. The mounting bracket includes a mounting bracket top wall. The retaining bracket includes a retaining bracket top wall. The retaining bracket top wall extends from the mounting bracket top wall.

Abstract: According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block.

Abstract: A USB device is provided. The USB device includes a housing, a circuit board, a chip, a USB connector and a metal connector. The circuit board is disposed in the housing. The chip is disposed on the circuit board. The USB connector is connected to the circuit board. The metal connector is connected to the USB connector, wherein the metal connector includes an extended portion, and the extended portion contacts the chip to dissipate heat from the chip.

Abstract: A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.

Abstract: A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.

Abstract: A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region.

Abstract: A computer system includes a computer case and an air guiding duct. The motherboard is attached to the computer case, and a heat sink is attached to the motherboard. The air guiding duct includes a top panel. A mounting member is slidably attached to the top panel and is clipped to the heat sink. A limiting device is located on the top panel and engaged with the mounting member to prevent the mounting member from sliding relative the top panel.

Abstract: Apparatuses are provided for compressing a thermal interface material between a heat generating electronic component and a cooling electrical component. Embodiments include a rotatable latch fastened to the heat generating electrical component, the rotatable latch including a hook; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages a pin extending from the cooling electrical component such that the thermal interface material adhered to the heat generating electrical component is coupled to the cooling component; when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the cooling electrical component; a load screw; wherein when the rotatable latch is in the engaged position, threading the load screw into the rotatable latch moves the rotatable latch into a locked state; and a spring leaf that is coupled to the heat generating electrical component.

Abstract: Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.

Abstract: A motherboard system includes a PCB, a CPU socket mounted on the PCB, a heat dissipating device, and a number of fastening devices. The CPU socket is configured for receiving a CPU. The heat dissipating device is mounted on the CPU socket for dissipating heat generated by the CPU. The fastening devices extend through the heat dissipating device and the CPU socket and are engaged in the PCB, thereby fastening the heat dissipating device, and the CPU socket to the PCB.

Abstract: A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.

Abstract: A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.

Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

Abstract: A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

Abstract: A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portion of a motor vehicle transmission having electrical and electronic components such as valves, solenoids, motors and sensors. Spaced from the inside surface of the cover where it is subjected on both sides to flow of transmission fluid is a plate or heat sink. An electronic controller is disposed on the outside of the cover and attached by heat transferring mechanical fasteners such as studs or bolts to the plate inside the cover. Preferably, the housing of the controller also includes a heat sink.

Abstract: An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.

Abstract: A modular equipment testing apparatus is suitable for use in severe environments. The testing apparatus comprises a base computing unit, an interchangeable test instrument board, and an interchangeable equipment interface pod. The base computing unit and the interchangeable test instrument board are sealed within a computing case. A bottom panel of the computing case is formed of a heat conducting material and acts as a heat sink for removing heat from inside the computing case. The computing case and the equipment interface pod interface to form a hermetically sealed case, which can withstand a drop of 1 meter to a solid surface and immersion to a depth of 0.5 meters in water without damage to components located within the sealed case.

Abstract: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

Abstract: A wedge lock for use with a single board computer includes a first portion configured to move in a first direction and a second portion configured to move in a plurality of directions in response to the movement of the first portion and to facilitate securing the single board computer in an operating environment and to facilitate conduction cooling of the single board computer.

Abstract: A computer enclosure includes an enclosure, an air conduction member mounted in the enclosure to guide airflow, and a data storage device mounted to a top of the air conduction member.

Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A computer apparatus comprising a computer chassis, a baseboard component disposed within the computer chassis and a computer module electronically coupled to the baseboard component is disclosed. A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, wherein the heat sink assembly forms part of an integral exterior structure of the computer chassis. The chassis may comprise a compartment disposed through an exterior surface of the chassis for receiving the computer module heat sink assembly in mated fashion. The computer module heat sink assembly forms a water and air tight seal with the internal compartment of the chassis in mated fashion.

Abstract: A power supply includes a casing, a printed circuit board (PCB) and a heat dissipation module. The PCB is disposed in the casing and has a heat-generating element. The casing has a top cover. The heat dissipation module includes a heatsink and a heat dissipation plate. The heatsink is disposed at the PCB and contacts the heat-generating elements. The heatsink has a surface facing the top cover. The heat dissipation plate is disposed between the heatsink and the top cover and contacts the surface of the heatsink.

Abstract: A motherboard for an electronic device includes a main circuit board, an interface, and a sub-circuit. The main circuit board holds a plurality of heat generating element, and the sub-circuit board is electrically connected to the main circuit board through the interface. The sub-circuit board includes a connecting board and a holding board for holding heat generating elements. An end of the connecting board is electrically connected to the main circuit board through the interface, and another end of the connecting board is electrically connected to the holding board. The holding board and the main circuit board are located at opposite ends of the connecting board, and the holding board is spaced with the main circuit board in parallel.

Abstract: To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board.

Abstract: A modular thermal management system that allows one or a few heat sink and fan combinations to transfer heat away from a heat zone of a variety of graphics processing cards is provided. The thermal management system includes a mounting bracket configured to attach to the graphics processing card in thermal contact with the heat zone, the mounting bracket having a first opening that corresponds to a processor in the heat zone, a heat sink configured to attach to the mounting bracket, wherein the heat sink overlies the first opening and is in thermal contact with at least a portion of the processor through the first opening, and a fan configured to attach to the mounting bracket adjacent the heat sink.

Abstract: The present invention is a robust LED display module for use in an electronic sign which display module includes a metallic housing, a heat conductive interface panel, an LED circuit board and LEDs, and a metallic mask arranged in intimate contact and association therewith, and which components operate synergistically in concert with each other in order to evenly distribute, reduce and dissipate heat along, about and within the structure of the present invention. Display uniformity is provided by the use of major metallic structures in order to prevent warpage and to protect the geometric integrity of the LED display module.

Abstract: A cooling fan housing assembly for assembling to a heat sink includes a boosting portion and a connecting portion extended from the boosting portion. The connecting portion includes a first part and a second part for covering on and fixing to the heat sink. The second part of the connecting portion is provided with at least one hooking section for firmly hooking to the heat sink, so that a cooling fan supported on the cooling fan housing assembly can be quickly assembled to the heat sink without the risk of producing vibration during the operation of the cooling fan. Therefore, the cooling fan housing assembly not only reduces assembling labor and time and manufacturing cost, but also enables stable operation of the cooling fan.

Abstract: A heat dissipating apparatus comprises a first heat sink, a second heat sink and a fixing unit. The first heat sink comprises a connecting portion. The second heat sink comprises a connecting unit which is inserted into the connecting portion. The fixing unit includes an end portion exposed outside the connecting portion and a body accommodated in the connecting portion.

Abstract: A portable computer includes a shell, a printed circuit board in the shell, a heat generating element, a heat conducting sheet, a primary heat dissipation unit, a subsidiary heat dissipation unit, and a heat-transfer unit. The heat generating element is electronically connected on the printed circuit board. The heat conducting sheet is positioned on the heat generating element. The heat-transfer unit includes a heat-transfer member and a drive unit. The heat-transfer member connects to the heat conducting sheet. The drive unit moves the heat-transfer member to connect with the primary heat dissipation unit or the subsidiary heat dissipation unit.

Abstract: An electronic device includes a casing, an electronic component accommodated in the casing; and a composite heat conductive layer between the casing and the electronic component. The composite heat conductive layer includes a graphite layer and a thermal pad layer between the electronic component and the graphite layer. The thermal pad layer is attached to the electronic component. The graphite layer is attached to an inner surface of the casing. The graphite layer is located between the casing and the thermal pad layer. Heat conductive efficiency of the graphite layer along a horizontal spreading direction thereof exceeds that along a vertical thickness direction thereof. A surface area of the graphite layer is not less than that of the electronic component. Heat generated by the electronic component is evenly transferred and is spread to the casing via the graphite layer of the composite heat conductive layer.