With Specific Dielectric Material Or Layer Patents (Class 361/750)
  • Patent number: 10032857
    Abstract: Capacitor structures for integrated circuit devices are provided. Capacitors include proximate dense or highly dense etchstop layers. The dense or highly dense etchstop layer is, for example, a high-k material. Capacitors are, for example, metal-insulator-metal (MIM) capacitors and are useful in DRAM (dynamic random access memory) and eDRAM (embedded dynamic random access memory) structures.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: July 24, 2018
    Assignee: Intel Corporation
    Inventor: Ruth A. Brain
  • Patent number: 9967972
    Abstract: A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: May 8, 2018
    Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Andreas Zluc, Gerald Weidinger, Mario Schober, Hannes Stahr, Timo Schwarz, Benjamin Gruber
  • Patent number: 9864343
    Abstract: A three dimensional support element for a timepiece sensor, made in 3D-MID and including integrated electrical connection paths, a flexible connection interface formed of bent wire springs or flexible finger-pieces, and a rigid connection interface.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: January 9, 2018
    Assignee: ETA SA Manufacture Horlogere Suisse
    Inventors: Raphael Balmer, Francois Klopfenstein
  • Patent number: 9831467
    Abstract: The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: November 28, 2017
    Assignee: OLEDWORKS GMBH
    Inventors: Jens Meyer, Rainald Manfred Gierth, Stefan Peter Grabowski, Herbert Lifka, Peter Van De Weijer, Petrus Cornelis-Paulus Bouten, Volker Lambert Van Elsbergen, Manfred Stephan Ruske, Soren Hartmann
  • Patent number: 9655242
    Abstract: A printed wiring board includes a first insulating layer having concave portions on first surface of the first insulating layer, a first conductor layer including first circuits formed in the concave portions, a second conductor layer including second circuits on second surface of the first insulating layer, a first via conductor connecting the first and second conductor layers, and a second insulating layer formed on the second surface of the first insulating layer and covering the second conductor layer. Each first circuit has upper, lower and side surfaces such that the upper surface is exposed from the first insulating layer and the side and lower surfaces are not roughened surfaces, each second circuit has top, back and side surfaces such that the side and back surfaces are roughened surfaces, and a thinnest first circuit has a line width L1 smaller than a line width L2 of a thinnest second circuit.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: May 16, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Yasushi Inagaki, Toshiki Furutani
  • Patent number: 9505902
    Abstract: The present disclosure relates to ceramic fillers and methods for preparing said ceramic fillers. The present disclosure further relates to dielectric resonator, fluoropolymer-ceramic filler compositions and their corresponding laminates along with their respective methods for preparing the same from the ceramic fillers. The present disclosure further provides a dielectric resonator and fluoropolymer-ceramic filler laminates having enhanced dielectric properties. The present disclosure also relates to various microwave applications of such fillers, resonators and laminates including microwave devices and circuits.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: November 29, 2016
    Assignees: SECRETARY, DEPARTMENT OF ELECTRONICS AND INFORMATION TECHNOLOGY, GOVT OF INDIA, EXECUTIVE DIRECTOR, CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY (C-MET), SECRETARY, DEPARTMENT OF ATOMIC ENERGY
    Inventors: Ratheesh Ravendran, Stanley Jacob Kollannoor, Kodakattumana Purushothaman Murali, Akhilesh Jain, Pundlik Rama Hannurkar
  • Patent number: 9455064
    Abstract: Circuits characterized by plural conductive paths supported on a non-conductive substrate are provided. Ceramic filler compositions and methods for preparing the ceramic filler compositions are also provided. Further, fluoropolymer-ceramic filler compositions and their laminates along with their respective methods for their preparation are provided. The fluoropolymer-ceramic filler compositions provide for excellent properties for dielectric constant, loss tangent and temperature coefficient of dielectric constant. In addition, electrical substrate materials having a conductive outer layer supported on a thin sheet of insulating material are also provided.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: September 27, 2016
    Assignees: Centre for Materials for Electronics Technology (C-MET), The Secretary, Dept. of Electronics and IT, Govt. of India
    Inventors: Rajesh Surendran, Murali Kodakkattumana Purushothaman, Ratheesh Ravendran
  • Patent number: 9450364
    Abstract: The present invention is directed to a tape light electrical connector that is configured to electrically and physically connect a tape light, such as a light emitting diode (LED) tape light and a lead wire together in order to provide electrical continuity between the tape light and the lead wire, and to prevent physical separation of the tape light from the lead wire, once the tape light and the lead wire have been coupled to the tape light electrical connector. The electrical connector may further be configured to allow for removal of the lead wire and the tape light from the electrical connector, and accordingly the electrical connector may be reusable for installation of other lead wires and tape lights to be connected thereto.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: September 20, 2016
    Assignee: QTRAN, INC.
    Inventors: John M. Tremaine, Adrian R. Teschemaker
  • Patent number: 9338883
    Abstract: A printed wiring board includes multiple insulating layers laminated on each other and each including resin and core, the insulating layers having first-surface sides and second-surface sides on the opposite side, respectively, and including multiple first insulating and second insulating layers, multiple first-surface-side conductive layers formed on the first-surface sides of the first insulating layers, respectively, multiple second-surface-side conductive layers formed on the second-surface sides of the second insulating layers, respectively.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: May 10, 2016
    Assignee: IBIDEN CO., Ltd.
    Inventor: Satoshi Watanabe
  • Patent number: 9144152
    Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: September 22, 2015
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Minoru Kubota, Masashi Higuchi
  • Publication number: 20150146388
    Abstract: A flexible display apparatus includes a flexible display unit, a flexible film and a molding compound. The flexible display unit has a first region and a second region surrounding the first region, and the flexible film is disposed on the flexible display unit and at least located within the first region. The flexible film has a circumferential surface and at least one accommodating groove, the accommodating groove is sunken from the circumferential surface, and the flexible film exposes the second region of the flexible display unit. The molding compound is disposed on the flexible display unit, covers the circumferential surface and the second region exposed by the flexible film and fills the accommodating groove. A thickness of the molding compound filling the accommodating groove is the same as the thickness of the flexible film.
    Type: Application
    Filed: October 15, 2014
    Publication date: May 28, 2015
    Inventors: Ta-Nien Luan, Yen-Fong Liao, Kuan-Lin Huang, Chen-Yuan Sung, Chiang-Ling Tseng
  • Patent number: 9036357
    Abstract: A method of manufacturing a display device includes preparing a display panel that has a display region where an image is displayed and a non-display region adjacent to the display region, and disposing a power supply flexible printed circuit board (FPCB) in a lower surface of the display panel and in the non-display region of an upper surface of the display panel. The method includes disposing a tape on the display panel to cover an upper side of the power supply FPCB disposed on the upper surface of the display panel, and attaching the tape to the display panel by performing a thermal hardening process on the tape to fix the power supply FPCB to the display panel.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: May 19, 2015
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Min-Cheol Kim
  • Patent number: 9036366
    Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: May 19, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shunjiro Takemori, Shigeru Narakino
  • Publication number: 20150131238
    Abstract: A flexible display device includes: a flexible display panel configured to display an image; a dielectric elastomer film disposed on a portion of the flexible display panel; a first electrode layer disposed on an upper portion of the dielectric elastomer film; and a second electrode layer disposed on a lower portion of the dielectric elastomer film, the first electrode layer includes a plurality of first electrodes, each of the plurality of first electrodes disposed apart from each other, the second electrode layer includes a plurality of second electrodes, each of the plurality of second electrodes disposed apart from each other.
    Type: Application
    Filed: May 21, 2014
    Publication date: May 14, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventor: Ja Eun LEE
  • Publication number: 20150131239
    Abstract: Disclosed herein are a three-dimensional stretchable electronic device and a manufacturing method comprising the same, wherein the three-dimensional stretchable electronic device is configured such that a connection line is positioned therein and thus can be protected from the outside, and the connection line is made of a liquid metal so there is no change in volume of the connection line upon stretching. Additionally, elements can be transferred to both sides of the substrate, thus increasing the degree of integration.
    Type: Application
    Filed: January 13, 2015
    Publication date: May 14, 2015
    Inventors: Jeong Sook Ha, Jangyeol Yoon, Yein Lim, Sooyeong Hong
  • Patent number: 9019715
    Abstract: A touch panel includes a substrate, a transparent sensor electrode pattern, a patterned compensation electrode, a passivation layer, a transparent shielding electrode and at least one connection structure. The substrate has a surface and includes a sensor region and a peripheral region. The transparent sensor electrode pattern is disposed on the surface of the substrate and in the sensor region. The patterned compensation electrode is disposed on the surface of the substrate and in the peripheral region, and the patterned compensation electrode and the transparent sensor electrode pattern are electrically isolated. The passivation layer is disposed on the surface of the substrate, covers the transparent sensor electrode pattern, and at least partially exposes the patterned compensation electrode. The transparent shielding electrode is disposed on the passivation layer.
    Type: Grant
    Filed: February 24, 2013
    Date of Patent: April 28, 2015
    Assignee: AU Optronics Corp.
    Inventors: Chia-Chun Yeh, Po-Yuan Liu, Wen-Chi Chuang, Pei-Jung Wu, Cheng-Ta Ho
  • Publication number: 20150077951
    Abstract: A circuit board assembly is described. The circuit board assembly (1) comprises a module (2) which comprises a first flexible substrate (7) and a device mounted on the first flexible substrate and a circuit board (3) which comprises a second flexible substrate (4), wherein the module is mounted on the circuit board.
    Type: Application
    Filed: March 1, 2013
    Publication date: March 19, 2015
    Inventor: Kate Stone
  • Publication number: 20150062842
    Abstract: An element substrate comprises a flexible substrate, an element layer, a buffer layer and an interface layer. The element layer is disposed on the flexible substrate. The buffer layer is disposed on the flexible substrate. The buffer layer and the element layer are disposed on the opposite sides of the flexible substrate. The interface layer is disposed between the flexible substrate and the buffer layer and includes partial material of both of the flexible substrate and the buffer layer. A display apparatus including the element substrate and a manufacturing method of the element substrate are disclosed.
    Type: Application
    Filed: August 11, 2014
    Publication date: March 5, 2015
    Inventors: Chi-Che TSAI, Hui-Chen HSU, Wei-Yen WU, Wei-Yun CHANG
  • Publication number: 20150060842
    Abstract: An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.
    Type: Application
    Filed: November 11, 2014
    Publication date: March 5, 2015
    Inventor: Tsung-Ying KE
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Publication number: 20140376197
    Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
    Type: Application
    Filed: September 11, 2014
    Publication date: December 25, 2014
    Inventors: MICHAEL RAYMOND WEATHERSPOON, DAVID B. NICOL, LOUIS JOSEPH RENDEK, JR.
  • Patent number: 8912450
    Abstract: A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 16, 2014
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz
  • Patent number: 8905772
    Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: December 9, 2014
    Assignees: The Board of Trustees of the University of Illinois, Northwestern University
    Inventors: John A Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim
  • Publication number: 20140334113
    Abstract: According to the present invention, an electronic textile (1) is provided. The electronic textile comprises an electronic structure (3) including conductive wires (4) being at least partly spaced apart from each other and one or more electronic components (5) connected to the conductive wires. One or more gaps (14) are formed in the electronic structure between the at least partly spaced apart conductive wires. The electronic textile further comprises a fabric structure (2) including two fabric portions (10), wherein the electronic structure is sandwiched between the two fabric portions. Further, the two fabric portions are joined together according to a bonding pattern including bonding segments (8), the bonding segments being arranged in one or more of the gaps of the electronic structure such that the electronic structure is held in place in the fabric structure by the bonding pattern.
    Type: Application
    Filed: November 27, 2012
    Publication date: November 13, 2014
    Inventors: Jacobus Petrus Johannes Van Os, Steven Broeils Luitjens, Liesbeth Van Pieterson, Guofu Zhou, Frank Anton Van Abeelen
  • Publication number: 20140328033
    Abstract: Disclosed is a flexible display device capable of forming a display device on a glass substrate and simultaneously ensuring flexibility, and a fabrication method thereof, the method including preparing a glass substrate having a display region and a non-display region defined on a front surface thereof, forming a display device on the display region defined on the front surface of the glass substrate, preparing a metal foil substrate, bonding the metal foil substrate to the glass substrate such that a front surface of the metal foil substrate faces the front surface of the glass substrate so as to seal the display device, attaching a first passivation film on a region of a rear surface of the glass substrate, the region corresponding to a part or all of the non-display region defined on the front surface of the glass substrate, and attaching a second passivation film on an entire rear surface of the metal foil substrate, performing a first etching with respect to the display region of the rear surface of the
    Type: Application
    Filed: July 15, 2014
    Publication date: November 6, 2014
    Inventors: Jae-Young Lee, Jung-Hwan Lee
  • Patent number: 8879276
    Abstract: An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: November 4, 2014
    Assignee: Power Gold LLC
    Inventor: James Jen-Ho Wang
  • Publication number: 20140321075
    Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 30, 2014
    Applicant: Apple Inc.
    Inventors: Kuo-Hua SUNG, Silvio GRESPAN
  • Publication number: 20140323968
    Abstract: The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level embodiments of transient electronics are provided.
    Type: Application
    Filed: April 11, 2014
    Publication date: October 30, 2014
    Applicant: The Board of Trustees of the University of Illinois
    Inventors: John A. ROGERS, Chi Hwan LEE, Lan YIN, Xian HUANG, Cecilia Maria das Neves Barbosa LEAL, Daniel Vincent HARBURG
  • Publication number: 20140321076
    Abstract: A resin multilayer substrate includes a resin structure formed by laminating a plurality of resin layers and disposed components. Built-in components are embedded within the resin structure and a mounted component mounted on a surface of the resin structure. The resin structure includes a flexible part in which a first lamination number of the resin layers are laminated and a rigid part in which a second lamination number of the resin layers is laminated. The second lamination number is larger than the first lamination number. When viewed in a plan view, the flexible part has a shape which is not a rectangle, and a disposed component which is closest to a boundary line between the flexible part and the rigid part is disposed such that a side thereof which is closest to the boundary line is parallel to the boundary line.
    Type: Application
    Filed: July 14, 2014
    Publication date: October 30, 2014
    Inventors: Norio Sakai, Yoshihito Otsubo
  • Patent number: 8872040
    Abstract: A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing layer.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: October 28, 2014
    Assignee: Fujitsu Limited
    Inventors: Tsuyoshi Kanki, Shoichi Suda, Yoshihiro Nakata
  • Patent number: 8867218
    Abstract: An electronic apparatus includes a metal holding member. The holding member includes a first region, a second region formed by hemming the first region, and a third region formed by bending perpendicularly relative to the second region at a bending part. The first region has an opening part. A part of the opening part is blocked by the bending part.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: October 21, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventor: Jiro Yamamoto
  • Patent number: 8867231
    Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: October 21, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Lee Jacobo Jose Roitberg, Terry R. Billger
  • Patent number: 8867219
    Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: October 21, 2014
    Assignee: Harris Corporation
    Inventors: Michael Weatherspoon, David Nicol, Louis Joseph Rendek, Jr.
  • Patent number: 8866022
    Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: October 21, 2014
    Assignee: Panasonic Corporation
    Inventors: Yoshito Kitagawa, Naoyuki Tani, Toshiyuki Asahi
  • Patent number: 8854826
    Abstract: A suspension board with circuit includes a conductive region in which a conductive layer is formed and a mounting region for mounting a slider on which a magnetic head that is electrically connected to the conductive layer is mounted. The mounting region mounts the slider so that the slider is capable of relatively moving with respect to the conductive region, and the conductive region includes an opposing region that is opposed to the slider in the thickness direction at the time of the relative movement of the slider with respect to the conductive region and a damage preventing portion for preventing damage to the opposing region by the slider.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: October 7, 2014
    Assignee: Nitto Denko Corporation
    Inventor: Tetsuya Ohsawa
  • Patent number: 8847079
    Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: September 30, 2014
    Assignee: International Business Machines Corporation
    Inventors: Laurent A. Dellmann, Michel Despont, Ute Drechsler, Roland M. Guerre
  • Publication number: 20140268596
    Abstract: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Eugene M. Chow, Dirk DeBruyker
  • Patent number: 8832929
    Abstract: A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: September 16, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung Ho Lee, Se Min Oh, Chang Hwan Choi, Choon Keun Lee, Jeong Yeol Moon, Jong Rip Kim
  • Patent number: 8830685
    Abstract: A flexible sheet of organic polymer material, may include a monolithically fabricated array of one or more types of cells juxtaposed among them to form a multi-cell sheet. Each cell may include a self consistent, organic base integrated circuit, replicated in each cell of same type of the array, and shares, in common with other cells of same type, at least a conductor layer of either an electrical supply rail of the integrated circuit or of an input/output of the integrated circuit. A piece of the multi-cell, sheet including any number of self consistent integrated circuit cells, may be severed from the multi-cell sheet by cutting the sheet along intercell boundaries or straight lines, with a reduced affect on the operability of any cell spared by the cutting.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: September 9, 2014
    Assignee: STMicroelectronics S.R.L.
    Inventor: Manuela La Rosa
  • Patent number: 8824150
    Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: September 2, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: JungYoul Kang, SeongHun Kim
  • Patent number: 8804350
    Abstract: Disclosed is a control device for use in woven article, which includes a conductive fabric that includes conductive warps, conductive wefts, and insulation warps, which are arranged so as to form a plurality of conduction sites; a first woven flat cable, which includes a plurality of conductor lines, the first woven flat cable being set to overlap the conductive fabric, two of the conductor lines being electrically and respectively connected to the conductive warp and the conductive weft of one of the conduction sites; and a processor unit, to which the conductor lines of the first woven flat cable is electrically connected.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: August 12, 2014
    Assignee: King's Metal Fiber Technologies Co., Ltd.
    Inventors: Hong-Hsu Huang, I-Chen Su, Shun-Tung Yang
  • Publication number: 20140204543
    Abstract: A data transaction apparatus includes a housing, a system circuit board comprising a tamper detection circuit disposed in the housing, and a tamper protection device configured to seal the system circuit board within the housing in a detachable manner. The tamper protection device includes a tamper resistant board and a resin layer covering the tamper resistant board, wherein the tamper resistant board includes a flexible substrate and a plurality of fence-like lead wires disposed on the flexible substrate. In one embodiment of the present disclosure, the tamper detection circuit is triggered to generate a secure response when a tamper event is detected.
    Type: Application
    Filed: January 18, 2013
    Publication date: July 24, 2014
    Applicant: XAC AUTOMATION CORP.
    Inventors: YENG MING CHANG, CARL WESLEY ROBINSON, LI DE CHEN
  • Patent number: 8779296
    Abstract: A wiring board is provided which can prevent a metal electrode from corroding due to a defect in a transparent conductive electrode covering an end face of an organic insulating film. An active-matrix substrate includes: a glass substrate; a metal wire provided on the glass substrate; a gate insulating film covering the metal wire; an interlayer insulating film covering the gate insulating film; and a transparent electrode formed on the interlayer insulating film. The scanning wire provided with a terminal area where the transparent electrode is laminated directly on the scanning wire. The transparent electrode extends over the terminal area in such a way as to cover an end face of the interlayer insulating film that faces the terminal area and an end face of the gate insulating film that faces the terminal area.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: July 15, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiromitsu Katsui, Kenichi Kitoh, Wataru Nakamura
  • Patent number: 8780568
    Abstract: A flexible display device comprises a device substrate and a flexible circuit substrate, and achieves high reliability of electrical connection. The device substrate includes a flexible substrate, a display unit and a first terminal part. The flexible circuit substrate includes a second terminal part. An ACF including conductive particles connects the first and second terminal parts. Each conductive particle consists of a core part covered by a metal layer. An electrode layer and a cushioning layer are provided between the flexible substrate and the first terminal part. A quotient of a sum of a product of average particle diameter and elastic modulus for the core part, and a product of double average thickness and elastic modulus for the metal layer, divided by a sum of products of average thickness and elastic modulus for the first terminal part, the cushioning layer and the electrode layer, is no greater than 1.5.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: July 15, 2014
    Assignee: Panasonic Corporation
    Inventors: Takashi Osako, Yuji Tanaka
  • Publication number: 20140192491
    Abstract: The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.
    Type: Application
    Filed: December 31, 2013
    Publication date: July 10, 2014
    Applicant: E Ink Holdings Inc.
    Inventors: Ming-Sheng CHIANG, Chi-Ming WU, Chen-Yuan SUNG, Chen-Lung LO, Ta-Nien LUAN
  • Patent number: 8759884
    Abstract: An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer. The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: June 24, 2014
    Assignees: Nederlandse Organisatie voor toegepast—natuurwetenschappelijk onderzoek TNO, Koninklijke Philips Electronics N.V.
    Inventors: Jeroen van den Brand, Andreas Heinrich Dietzel, Edward Willem Albert Young, Herbert Lifka, Erik Dekempeneer
  • Patent number: 8742260
    Abstract: Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: June 3, 2014
    Assignee: NEC Corporation
    Inventor: Junya Sato
  • Patent number: 8737085
    Abstract: Disclosed is a wiring board with a built-in component and a method for manufacturing the same, the wiring board including: a wiring pattern; an electric/electronic component electrically and mechanically connected with a surface of said wiring pattern; and an insulating layer formed on the same surface of said wiring pattern as said electric/electronic component is connected and configured so as to embed said electric/electronic component, said insulating layer having an insulating resin and a reinforcing material included in the insulating resin, wherein the reinforcing material of said insulating layer exists in the insulating resin without reaching a region of said electric/electronic component in a lateral direction, and wherein the insulating resin of said insulating layer reaches said electric/electronic component so as to adhere to said electric/electronic component.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: May 27, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Kenji Sasaoka
  • Publication number: 20140118970
    Abstract: A flexible display panel, and particularly, to a flexible display panel which is bendable, not an existing glass substrate, a fabrication method thereof, and an image display terminal unit using a flexible display panel are provided. In the case of the flexible display panel, the fabrication method, and the image display terminal unit, the flexible display panel is implemented with a plastic substrate, rather than the conventional glass substrate, and a portion of the non-active area of the display panel is cut to form a cutout portion to insert modules of the image display terminal unit into the cutout portion to thus reduce a receiving space of the lower housing, thereby minimizing a width of the bezel region.
    Type: Application
    Filed: October 24, 2013
    Publication date: May 1, 2014
    Applicant: LG Display Co., Ltd.
    Inventors: JungChul KIM, SoonKwang HONG, SeokHee JEONG
  • Publication number: 20140098501
    Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.
    Type: Application
    Filed: October 1, 2013
    Publication date: April 10, 2014
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki KAWAGUCHI, Kazutoki TAHARA, Tsutomu SAGA, Minoru KUBOTA, Masashi HIGUCHI