Abstract: A semi-flex component carrier includes a stack having at least one electrically insulating layer structure, at least one electrically conductive layer structure and a stress propagation inhibiting barrier. The stack defines at least one rigid portion and at least one semi-flexible portion. The stress propagation inhibiting barrier includes a plurality of stacked vias filled at least partially with electrically conductive material in an interface region between the at least one rigid portion and the at least one semi-flexible portion and configured to inhibit stress propagation between the at least one rigid portion and the at least one semi-flexible portion during bending.

Abstract: A flexible printed circuit and a display device are provided. The flexible printed circuit includes: a plurality of sub-circuit boards arranged in a stack, wherein the plurality of sub-circuit boards include at least a first sub-circuit board and a second sub-circuit board; and a pressure sensor arranged on the first sub-circuit board, wherein the first sub-circuit board includes: a substrate film; a conductive film arranged on a side of the substrate film away from the second sub-circuit board; an adhesive layer arranged on a side of the conductive film away from the substrate film; a cover layer arranged on a side of the adhesive layer away from the substrate film; and an electromagnetic shielding layer arranged on a side of the cover layer away from the substrate film, wherein at least a part of the conductive film is formed as an electrode of the pressure sensor.

Abstract: Electronic devices including a display layer and a cover layer including a foldable region are disclosed herein. The display layer and the cover layer are configured to be moved between a folded configuration and an unfolded configuration by bending the cover layer along the foldable region. Methods of making a cover layer for an electronic device are also disclosed.

Abstract: A semi-flex component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. The at least one electrically insulating layer structure forms at least part of the semi-flexible portion and includes a material having an elongation of larger than 3% and a Young modulus of less than 5 GPa.

Abstract: According to an exemplary embodiment of the present invention, by providing an apparatus for fabricating a stretchable electronic element including a chamber, a plurality of sample portions loaded into the chamber and spaced apart from each other, while the chamber is maintained at atmospheric pressure, and a movable member moving the plurality of sample portions and compressing each of the plurality of sample portions together while the chamber is kept under vacuum, it is possible to fabricate variable stretchable electronic elements.

Abstract: Embodiments of this disclosure pertain to glass articles that comprise a maximum CS magnitude (CSmax) of about 900 MPa or greater, a CS magnitude of 750 MPa or greater at a depth of about 5 micrometers, and a maximum CT magnitude (CTmax) disposed at a depth from the first major surface in a range from about 0.25 t to about 0.75 t. Embodiments of a curved glass article are also disclosed. In one or more embodiments, such curved glass articles include the first major concave surface comprising a maximum radius of curvature of about 100 mm or greater and a first maximum CS value (CSmax1) of greater than about 800 MPa, a second major convex surface comprising a second maximum CS value (CSmax2), wherein the CSmax2 is less than CSmax1. Embodiments of an automotive interior system including such curved glass articles and methods of making glass articles are also disclosed.

Abstract: A mount (10) and an optoelectronic component (100) with the mount (10) are provided, wherein the mount (10) comprises a moulding (5), at least one through-contact (41, 42) and a plurality of reinforcing fibres (52), wherein the moulding (5) is formed from an electrically insulating moulding material (53), the through-contact (41, 42) is formed from an electrically conductive material, and the reinforcing fibres (52) produce a mechanical connection between the moulding (5) and the through-contact (41, 42) by the reinforcing fibres (52) being arranged in certain regions of the moulding (5) and arranged in certain regions of the through-contact (41, 42). A method for producing a mount or a component with such a mount is also provided.

Abstract: A flexible display device, which has a bending area and a non-bending area, includes a display panel, and a window member disposed on the display panel and including a first glass substrate, a second glass substrate disposed opposite to the second glass substrate, and a bonding layer disposed between the first glass substrate and the second glass substrate. The bonding layer includes a first bonding part overlapping the bending area and a second bonding part overlapping the non-bending area and having a modulus greater than a modulus of the first bonding part.

Abstract: A fingerprint sensing structure includes a flexible substrate divided into a fingerprint-sensing region and a non-fingerprint-sensing region. In the non-fingerprint-sensing region, the fingerprint sensing structure includes a plurality of organic insulating layers, a wiring layer having conductive wires and at least one inorganic insulating layer, where the wiring layer is sandwiched between two organic insulating layers to render the portion of the fingerprint sensing structure corresponding to non-fingerprint-sensing region to have bending with curvature radius not larger than 2 mm. In the finger sensing region, the fingerprint sensing structure includes a thin film transistor layer and a sensing electrode layer. The thin film transistor layer includes a plurality of thin film transistors, a plurality of conductive wires respectively along a first direction and a second direction. The sensing electrode layer has a plurality of sensing electrodes to sense surface features of living organism.

Abstract: A method for manufacturing a flexible substrate includes: providing a carrier substrate; forming a photosensitive adhesive layer on the carrier substrate; providing a flexible substrate including an active area and a non-active area on the photosensitive adhesive layer; the photosensitive adhesive layer including a first area and a second area, curing photosensitive adhesive in the first area with light irritation, and leaving photosensitive adhesive in the second area uncured; forming an element on the flexible substrate, such that an orthographic projection of the non-active area on the carrier substrate covers an orthographic projection of the first area on the carrier substrate, and an orthogonal projection of the second area on the carrier substrate covers an orthogonal projection of the active area on the carrier substrate; cutting the carrier substrate along a boundary between the non-active area and the active area of the element.

Abstract: Capacitor structures for integrated circuit devices are provided. Capacitors include proximate dense or highly dense etchstop layers. The dense or highly dense etchstop layer is, for example, a high-k material. Capacitors are, for example, metal-insulator-metal (MIM) capacitors and are useful in DRAM (dynamic random access memory) and eDRAM (embedded dynamic random access memory) structures.

Abstract: A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described.

Abstract: A three dimensional support element for a timepiece sensor, made in 3D-MID and including integrated electrical connection paths, a flexible connection interface formed of bent wire springs or flexible finger-pieces, and a rigid connection interface.

Abstract: The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.

Abstract: A printed wiring board includes a first insulating layer having concave portions on first surface of the first insulating layer, a first conductor layer including first circuits formed in the concave portions, a second conductor layer including second circuits on second surface of the first insulating layer, a first via conductor connecting the first and second conductor layers, and a second insulating layer formed on the second surface of the first insulating layer and covering the second conductor layer. Each first circuit has upper, lower and side surfaces such that the upper surface is exposed from the first insulating layer and the side and lower surfaces are not roughened surfaces, each second circuit has top, back and side surfaces such that the side and back surfaces are roughened surfaces, and a thinnest first circuit has a line width L1 smaller than a line width L2 of a thinnest second circuit.

Abstract: The present disclosure relates to ceramic fillers and methods for preparing said ceramic fillers. The present disclosure further relates to dielectric resonator, fluoropolymer-ceramic filler compositions and their corresponding laminates along with their respective methods for preparing the same from the ceramic fillers. The present disclosure further provides a dielectric resonator and fluoropolymer-ceramic filler laminates having enhanced dielectric properties. The present disclosure also relates to various microwave applications of such fillers, resonators and laminates including microwave devices and circuits.

Abstract: Circuits characterized by plural conductive paths supported on a non-conductive substrate are provided. Ceramic filler compositions and methods for preparing the ceramic filler compositions are also provided. Further, fluoropolymer-ceramic filler compositions and their laminates along with their respective methods for their preparation are provided. The fluoropolymer-ceramic filler compositions provide for excellent properties for dielectric constant, loss tangent and temperature coefficient of dielectric constant. In addition, electrical substrate materials having a conductive outer layer supported on a thin sheet of insulating material are also provided.

Abstract: The present invention is directed to a tape light electrical connector that is configured to electrically and physically connect a tape light, such as a light emitting diode (LED) tape light and a lead wire together in order to provide electrical continuity between the tape light and the lead wire, and to prevent physical separation of the tape light from the lead wire, once the tape light and the lead wire have been coupled to the tape light electrical connector. The electrical connector may further be configured to allow for removal of the lead wire and the tape light from the electrical connector, and accordingly the electrical connector may be reusable for installation of other lead wires and tape lights to be connected thereto.

Abstract: A printed wiring board includes multiple insulating layers laminated on each other and each including resin and core, the insulating layers having first-surface sides and second-surface sides on the opposite side, respectively, and including multiple first insulating and second insulating layers, multiple first-surface-side conductive layers formed on the first-surface sides of the first insulating layers, respectively, multiple second-surface-side conductive layers formed on the second-surface sides of the second insulating layers, respectively.

Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.

Abstract: A flexible display apparatus includes a flexible display unit, a flexible film and a molding compound. The flexible display unit has a first region and a second region surrounding the first region, and the flexible film is disposed on the flexible display unit and at least located within the first region. The flexible film has a circumferential surface and at least one accommodating groove, the accommodating groove is sunken from the circumferential surface, and the flexible film exposes the second region of the flexible display unit. The molding compound is disposed on the flexible display unit, covers the circumferential surface and the second region exposed by the flexible film and fills the accommodating groove. A thickness of the molding compound filling the accommodating groove is the same as the thickness of the flexible film.

Abstract: A method of manufacturing a display device includes preparing a display panel that has a display region where an image is displayed and a non-display region adjacent to the display region, and disposing a power supply flexible printed circuit board (FPCB) in a lower surface of the display panel and in the non-display region of an upper surface of the display panel. The method includes disposing a tape on the display panel to cover an upper side of the power supply FPCB disposed on the upper surface of the display panel, and attaching the tape to the display panel by performing a thermal hardening process on the tape to fix the power supply FPCB to the display panel.

Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.

Abstract: A flexible display device includes: a flexible display panel configured to display an image; a dielectric elastomer film disposed on a portion of the flexible display panel; a first electrode layer disposed on an upper portion of the dielectric elastomer film; and a second electrode layer disposed on a lower portion of the dielectric elastomer film, the first electrode layer includes a plurality of first electrodes, each of the plurality of first electrodes disposed apart from each other, the second electrode layer includes a plurality of second electrodes, each of the plurality of second electrodes disposed apart from each other.

Abstract: Disclosed herein are a three-dimensional stretchable electronic device and a manufacturing method comprising the same, wherein the three-dimensional stretchable electronic device is configured such that a connection line is positioned therein and thus can be protected from the outside, and the connection line is made of a liquid metal so there is no change in volume of the connection line upon stretching. Additionally, elements can be transferred to both sides of the substrate, thus increasing the degree of integration.

Abstract: A touch panel includes a substrate, a transparent sensor electrode pattern, a patterned compensation electrode, a passivation layer, a transparent shielding electrode and at least one connection structure. The substrate has a surface and includes a sensor region and a peripheral region. The transparent sensor electrode pattern is disposed on the surface of the substrate and in the sensor region. The patterned compensation electrode is disposed on the surface of the substrate and in the peripheral region, and the patterned compensation electrode and the transparent sensor electrode pattern are electrically isolated. The passivation layer is disposed on the surface of the substrate, covers the transparent sensor electrode pattern, and at least partially exposes the patterned compensation electrode. The transparent shielding electrode is disposed on the passivation layer.

Abstract: A circuit board assembly is described. The circuit board assembly (1) comprises a module (2) which comprises a first flexible substrate (7) and a device mounted on the first flexible substrate and a circuit board (3) which comprises a second flexible substrate (4), wherein the module is mounted on the circuit board.

Abstract: An element substrate comprises a flexible substrate, an element layer, a buffer layer and an interface layer. The element layer is disposed on the flexible substrate. The buffer layer is disposed on the flexible substrate. The buffer layer and the element layer are disposed on the opposite sides of the flexible substrate. The interface layer is disposed between the flexible substrate and the buffer layer and includes partial material of both of the flexible substrate and the buffer layer. A display apparatus including the element substrate and a manufacturing method of the element substrate are disclosed.

Abstract: An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

Abstract: A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.

Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

Abstract: According to the present invention, an electronic textile (1) is provided. The electronic textile comprises an electronic structure (3) including conductive wires (4) being at least partly spaced apart from each other and one or more electronic components (5) connected to the conductive wires. One or more gaps (14) are formed in the electronic structure between the at least partly spaced apart conductive wires. The electronic textile further comprises a fabric structure (2) including two fabric portions (10), wherein the electronic structure is sandwiched between the two fabric portions. Further, the two fabric portions are joined together according to a bonding pattern including bonding segments (8), the bonding segments being arranged in one or more of the gaps of the electronic structure such that the electronic structure is held in place in the fabric structure by the bonding pattern.

Abstract: Disclosed is a flexible display device capable of forming a display device on a glass substrate and simultaneously ensuring flexibility, and a fabrication method thereof, the method including preparing a glass substrate having a display region and a non-display region defined on a front surface thereof, forming a display device on the display region defined on the front surface of the glass substrate, preparing a metal foil substrate, bonding the metal foil substrate to the glass substrate such that a front surface of the metal foil substrate faces the front surface of the glass substrate so as to seal the display device, attaching a first passivation film on a region of a rear surface of the glass substrate, the region corresponding to a part or all of the non-display region defined on the front surface of the glass substrate, and attaching a second passivation film on an entire rear surface of the metal foil substrate, performing a first etching with respect to the display region of the rear surface of the

Abstract: An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.

Abstract: A resin multilayer substrate includes a resin structure formed by laminating a plurality of resin layers and disposed components. Built-in components are embedded within the resin structure and a mounted component mounted on a surface of the resin structure. The resin structure includes a flexible part in which a first lamination number of the resin layers are laminated and a rigid part in which a second lamination number of the resin layers is laminated. The second lamination number is larger than the first lamination number. When viewed in a plan view, the flexible part has a shape which is not a rectangle, and a disposed component which is closest to a boundary line between the flexible part and the rigid part is disposed such that a side thereof which is closest to the boundary line is parallel to the boundary line.

Abstract: The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level embodiments of transient electronics are provided.

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.

Abstract: A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing layer.

Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.

Abstract: An electronic apparatus includes a metal holding member. The holding member includes a first region, a second region formed by hemming the first region, and a third region formed by bending perpendicularly relative to the second region at a bending part. The first region has an opening part. A part of the opening part is blocked by the bending part.

Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor.

Abstract: A suspension board with circuit includes a conductive region in which a conductive layer is formed and a mounting region for mounting a slider on which a magnetic head that is electrically connected to the conductive layer is mounted. The mounting region mounts the slider so that the slider is capable of relatively moving with respect to the conductive region, and the conductive region includes an opposing region that is opposed to the slider in the thickness direction at the time of the relative movement of the slider with respect to the conductive region and a damage preventing portion for preventing damage to the opposing region by the slider.

Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.

Abstract: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.

Abstract: A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.

Abstract: A flexible sheet of organic polymer material, may include a monolithically fabricated array of one or more types of cells juxtaposed among them to form a multi-cell sheet. Each cell may include a self consistent, organic base integrated circuit, replicated in each cell of same type of the array, and shares, in common with other cells of same type, at least a conductor layer of either an electrical supply rail of the integrated circuit or of an input/output of the integrated circuit. A piece of the multi-cell, sheet including any number of self consistent integrated circuit cells, may be severed from the multi-cell sheet by cutting the sheet along intercell boundaries or straight lines, with a reduced affect on the operability of any cell spared by the cutting.

Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.