Abstract: A display device includes a substrate including a display region, a hole, and a hole edge region surrounding the hole, first data lines disposed on the substrate, extending in a first direction, arranged in a second direction intersecting the first direction in the display region, and bypassing the hole along the hole edge region, and second data lines disposed on the substrate, extending in the first direction, alternately arranged with the first data lines in the second direction in the display region, and bypassing the hole along the hole edge region. At least one of the first data lines intersects at least one of the second data lines such that the first data lines are disposed adjacent to each other and the second data lines are disposed adjacent to each other in the hole edge region.

Abstract: According to one implementation of the present disclosure, a power grid comprising: one or more cells; a metal layer; first and second buried power rails; and one or more local interconnects, wherein one or more local interconnect stitches are configured to electrically couple the one or more cells to either of the first or second buried power rails through the metal layer and the one or more local interconnects.

Abstract: A plug-in holder includes a frame, a first engaging structure and at least one second engaging structure. The frame has a first side and a second side, wherein the first side is opposite to the second side. The first engaging structure is located at the first side. The at least one second engaging structure is located at the second side.

Abstract: According to an embodiment of the disclosure, an electronic device may include: a printed circuit board (PCB); a plurality of lines disposed on the PCB; a plurality of conductive pads disposed at an upper surface of the PCB on which the plurality of lines are disposed; a first antenna pattern disposed at the upper surface of the PCB and electrically connected to a first conductive pad of the plurality of conductive pads; and a first switch electrically connected to the first antenna pattern.

Abstract: According to various embodiments of the disclosure, an electronic device may comprise a housing at least partially including an electrically conductive material, a first circuit board disposed in the housing, a connection member disposed on the first circuit board and partially extending past an edge of the first circuit board, a second circuit board disposed in the housing and connected to the connection member from a side of the first circuit board in which the connection member extends, and a shielding member disposed to surround the connection member and the second circuit board inside the housing. The shielding member may be electrically connected to at least one of the housing and the first circuit board. Other various embodiments are possible.

Abstract: A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 ?m to 5 ?m.

Abstract: A display device comprising: first and second pixels; a first data line connected to the first pixel and configured to have data voltages applied thereto; and a second data line connected to the second pixel, the second data line being adjacent to the first data line, and configured to have the data voltages applied thereto, wherein the first data line includes a 1A-th data line which is in a first data layer, and the second data line includes a 2B-th data line which is in a second data layer different from the first data layer.

Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.

Abstract: An AP device includes a lower housing, a PCB assembly, and an upper cover. The PCB assembly is located in a cavity between the upper cover and the lower housing. The PCB assembly includes a PCB, an antenna, a first device, and a second device. The antenna is fastened to an upper surface of the PCB. The first device is located on the upper surface, and a height of the first device is less than a first height threshold or a conductor structure proportion is less than a proportion threshold. The second device is located on a lower surface of the PCB, and a height of the second device is greater than the first height threshold and a conductor structure proportion is greater than the proportion threshold.

Abstract: A radio-frequency module includes a mounting board having first and second major surfaces opposite to each other and a duplexer including a transmit filter coupled to a node and a receive filter coupled to the node. The transmit filter is mounted on the first major surface, and the receive filter is mounted on the second major surface. When the mounting board is viewed in a plan view, a footprint of the transmit filter at least partially overlaps a footprint of the receive filter.

Abstract: An electrical connector with electromagnetic shielding function includes a circuit board, a plurality of cables and a shielding component. The circuit board includes a plurality of conductive pads and a ground component. Each of cables includes a wire core and a shielding layer for covering the wire core. One end of the wire core is exposed from the shielding layer, and the wire cores of the cables are electrically connected to the conductive pads respectively. The shielding component is configured on the circuit board and electrically connected to the ground component. The shielding component forms a plurality of shielding grooves for covering the conductive pads and the cables. Each of the shielding grooves includes a contact portion configured to contact the shielding layer and a shielding portion configured to cover the exposed wire core of the cables to provide electromagnetic shielding to the cables.

Abstract: An interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device comprises: conductive lines of the first electronic circuit arranged in a plane; connectors configured to define an overlap in the plane between each end of the conductive lines with a corresponding end of stretchable conductive lines providing an electrical connection between the conductive lines and the stretchable conductive lines over the entire overlap; and at least one anchoring structure for providing an anchoring of the first electronic circuit with the second, external stretchable electronic circuit device, wherein the at least one anchoring structure provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.

Abstract: The present invention relates the quality of a display device by implementing a function capable of increasing the response time of the liquid crystal in the low temperature environment by preventing deterioration in visibility on a panel surface and applying a structure capable of generating heat.

Abstract: A wiring board includes an insulating base having a first principal surface, and a second principal surface opposite to the first principal surface, a first through hole formed in the base, a first conductive layer provided inside the first through hole, a first insulating layer covering the first principal surface, a second insulating layer covering the second principal surface, a second through hole formed in the first insulating layer, the base, and the second insulating layer, a magnetic material provided inside the second through hole, a third through hole famed in the magnetic material, and a second conductive layer provided inside the third through hole.

Abstract: A wirelessly locatable tag may be configured to transmit a wireless signal to an electronic device to facilitate localization of the wirelessly locatable tag by the electronic device. The wirelessly locatable tag may include an antenna assembly comprising an antenna frame defining a top surface and a peripheral side surface and an antenna positioned along the peripheral side surface and configured to transmit the wireless signal. The wirelessly locatable tag may further include a frame member coupled to the antenna assembly and defining a battery cavity configured to receive a button cell battery and an enclosure enclosing the antenna assembly and the frame member. The enclosure may include a first housing member formed from a unitary polymer structure and defining a top wall defining an entirety of a top exterior surface of the wirelessly locatable tag.

Abstract: A method of making an electrical device is described. The method comprises the steps: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) positioning at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; and (iii) providing a layer of adhesive material, preferably as a liquid, to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and/or at least a portion of the first circuit board such that following step (iii) the first electrically operable component is fixed on the layer of interlayer material by at least a portion of the layer of adhesive material.

Abstract: Apparatuses and associated methods for mounting PCBs and other electronics boards in portable medical equipment and/or other portable and non-portable electronic devices are disclosed herein. In some embodiments, the technology disclosed herein can provide PCB mounting systems that isolate the PCB from detrimental shock, vibration, and/or strain, while also providing electrical ground paths that greatly reduce EMI and other electrical disturbances. Some embodiments of the mounting systems described herein include both elastomeric (e.g., rubber) components and resilient metallic grounding members that, when assembled together, provide favorable shock mounting as well as robust electrical grounding without the inconvenience of using separate shock mounts, grounding straps, etc.

Abstract: An electronic device according to various embodiments of the disclosure may include a printed circuit board constructed with a layered structure of a plurality of boards, and may include, among the plurality of boards, a circuit board constructed around a first region to which an acoustic component is disposed, and having at least one slit constructed to block a low-frequency band noise.

Abstract: A display device includes a substrate including an opening area and a display area at least partially surrounding the opening area; and a metal layer including a first region and a second region adjacent to a non-display area between the opening area and the display area, the first region and the second region are spaced apart from each other, and one of the first region and the second region includes a protrusion extending toward the other of the first region and the second region, and the other of the first region and the second region has a shape to receive the protrusion.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: a plurality of transistors patterned on a semiconductor substrate during a front-end-of-line (FEOL) process, metal interconnects formed on top of the plurality of transistors during a back-end-of-line (BEOL) process and configured to interconnect the plurality of transistors, and a plurality of passive components formed under the semiconductor substrate in a backside layer during a backside a back-end-of-line (B-BEOL) process, wherein the plurality of passive components are connected to the plurality of transistors through a plurality of vias.

Abstract: It is a device designed to distinguish plants from agricultural soil (soil background); of the type that a photographic camera uses to proceed with the capture of images and process them in order to perform the detection of weeds, and from it, with the information obtained, to drive an actuator that controls the operation of corresponding media valves that command the work of the sprinklers arranged in the carrier boom of the sprayer, through which it is possible to apply herbicidal products, or exercise a control over them that may be mechanical or chemical.

Abstract: The electronic wind instrument (1) includes an instrument body (10) in which a through-hole leading into an internal space (11) opens on an outer surface (12), an operation piece (20) attached to the instrument body (10) at a position of a through-hole (14) and pushed down toward the internal space (11), and an electronic component disposed in the internal space (11). The electronic component includes a push-down sensor (6) that detects that the operation piece (20) is being pushed down, and the outer surface (12) of the instrument body (10) comprises an outer wall (16a) that is provided around the through-hole (14) and that faces toward the through-hole (14), an inner wall (16b) that is provided nearer to the through-hole (14) than the outer wall (16a) and that faces toward the outer wall (16a), and a groove bottom (16c) connecting the outer wall (16a) and the inner wall (16b) together.

Abstract: The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.

Abstract: A display device includes a substrate including an opening area and a display area at least partially surrounding the opening area; and a metal layer including a first region and a second region adjacent to a non-display area between the opening area and the display area, the first region and the second region are spaced apart from each other, and one of the first region and the second region includes a protrusion extending toward the other of the first region and the second region, and the other of the first region and the second region has a shape to receive the protrusion.

Abstract: Certain aspects of the present disclosure generally relate to an integrated circuit assembly. One example integrated circuit assembly generally includes a first reconstituted assembly, a second reconstituted assembly, and a third reconstituted assembly. The first reconstituted assembly comprises at least one passive component and a first bonding layer. The second reconstituted assembly is disposed above the first reconstituted assembly and comprises one or more first semiconductor dies, a second bonding layer bonded to the first bonding layer of the first reconstituted assembly, and a third bonding layer. The third reconstituted assembly is disposed above the second reconstituted assembly and comprises one or more second semiconductor dies and a fourth bonding layer bonded to the third bonding layer of the second reconstituted assembly.

Abstract: Various embodiments described herein provide for printed circuit boards with one or more spaces for embedding components, which can be used to implement a memory sub-system.

Abstract: A switching power supply module includes a power inductor which includes a magnetic core and L-shaped metal end electrodes and a switching power supply chip which includes a packaging body, a bare chip and a bottom bonding pad of the bare chip; the L-shaped metal end electrode includes a first electrode part which is welded at 90° to the magnetic core and a second electrode part which extends in parallel from the first electrode part to the middle of the magnetic core and is perpendicular to the first electrode part; the bare chip and the packaging body are embedded between the first, the second electrode part and the magnetic core; the bottom bonding pad abuts between the two second electrode parts and is insulated from the second electrode part, and the weld face of the bottom bonding pad is flush with that of the second electrode part.

Abstract: Embodiments of the disclosure provide systems and methods for incorporating an optical sensing system in a MEMS package for real-time sensing of angular position of a MEMS mirror. The system may include an optical source configured to emit an optical signal to a backside of the MEMS mirror. The system may also include an optical detector configured to receive a returning optical signal reflected by the backside of the MEMS mirror. The system may further include at least one controller. The at least one controller may be configured to determine a scanning angle of the MEMS mirror based on a position on the optical detector where the returning optical signal is received.

Abstract: An electronic device includes a system board, a power module and a conductive part. The system board includes a first surface and a second surface opposite to each other. The power module is disposed on the second surface and provides power to the semiconductor device through the system board. The conductive part is disposed on a first side of the power module adjacent to the second surface, wherein the conductive part is electrically connected with the and the system board, wherein the power is transmitted between the and the semiconductor device through the conductive part. The power module includes at least one switch circuit and a magnetic core assembly. The at least one switch circuit disposed on a second side of the power module away from the conductive part. The magnetic core assembly is arranged between the switch circuit and the conductive part.

Abstract: One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.

Abstract: Augmented reality apparatus and methods of use are provided with secure persistent digital content linked to a location coordinates. More specifically, the present invention links a physical location with digital content to enable a user interface with augmented reality that combines aspects of the physical area with location specific digital content. According to the present invention, digital content remains persistent with a location even if visual aspects of the location change.

Abstract: Various embodiments related to three dimensional printers, and reinforced filaments, and their methods of use are described. In one embodiment, a void free reinforced filament is fed into an conduit nozzle. The reinforced filament includes a core, which may be continuous or semi-continuous, and a matrix material surrounding the core. The reinforced filament is heated to a temperature greater than a melting temperature of the matrix material and less than a melting temperature of the core prior to drag the filament from the conduit nozzle.

Abstract: A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.

Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.

Abstract: A display device includes a display panel including a display area on which a plurality of display elements is disposed and a non-display area on which one or more wires for driving the plurality of display elements are disposed. A back cover is attached to one surface of the display panel and has a plurality of openings. A roller unit winds or unwinds the back cover and the display panel, and a lifting unit moves the back cover and the display panel in a vertical direction. The plurality of openings overlaps the display panel, and each of the plurality of openings is disposed to be staggered with one or more of the openings in an adjacent row. A size of the back cover is larger than a size of the display panel.

Abstract: A power converter module includes a multilayer printed circuit board, a switching device, a magnetic core element and a winding via. The multilayer printed circuit board has a first surface, a second surface and an inside layer. The multilayer printed circuit board includes a plurality of copper layers. The magnetic core element is disposed in the inside layer and includes a hole. One end of the winding via is electrically connected to the switching device, and the other end of the winding via is electrically connected to the second surface. The winding via penetrates through the hole and forms a magnetic assembly. An amount of the copper layers on a first side of the magnetic core element close to the first surface of the multilayer printed circuit board is at least two more than a second side of the magnetic core element.

Abstract: A first antenna element (1111) and a second antenna element (1121) are formed on a first dielectric substrate (131). The first antenna element (1111) is supplied with power from a first radio frequency element (191). The second antenna element (1121) is supplied with power from a second radio frequency element (192). The first dielectric substrate (131), the first radio frequency element (191) and the second radio frequency element (192), and a first heat dissipation member (120) are laminated in this order in a Z-axis direction that is a normal direction of the first dielectric substrate (131). When viewed in plan from the Z-axis direction, the first heat dissipation member (120) overlaps at least a part of the first radio frequency element (191) and at least a part of the second radio frequency element (192).

Abstract: Some of a plurality of image signal lines of a display apparatus according to one embodiment includes: a plurality of bypass wiring portions (bypass wirings) arranged in a frame region so as to have both ends being connected to a plurality of extension wiring portions (extension wirings). The plurality of bypass wiring portions of the plurality of image signal lines include: a plurality of second-layer bypass wirings arranged in a second conductive layer; and a plurality of third-layer bypass wirings arranged in a third conductive layer that is different from a first conductive layer and the second conductive layer. Each of an arrangement pitch between the plurality of second-layer bypass wirings and an arrangement pitch between the plurality of third-layer bypass wirings is smaller than an arrangement pitch between the plurality of image signal lines in a display region.

Abstract: A terminal device includes a display screen module, wherein the display screen module comprises a passive matrix organic light-emitting diode (PMOLED) display panel, and an electrode cable of the PMOLED display panel comprises a transparent cable and a camera, wherein an orthographic projection of a lighting region of the camera on a display surface of a PMOLED display panel is located in the display region in which the transparent cable is located.

Abstract: A method of 3D printing an object includes receiving design information corresponding to an object for which a printed object is to be generated by a 3D printing operation according to a first set of print instructions, generating a plurality of measurement locations, printing successive layers which form the object, measuring the object at the measurement locations to form measurement data, comparing the measurement data with expected measurements of the measurement locations based on the design information, and generating, based on the comparing, deviation information. The measurement locations represent locations of the object to be measured by a measurement device. The deviation information represents deviations between the printed object following completion of the printing, and the object represented by the design information.

Abstract: A semiconductor device includes a ferroelectric field-effect transistor (FeFET), wherein the FeFET includes a substrate; a source region in the substrate; a drain region in the substrate; and a gate structure over the substrate and between the source region and the drain region. The gate structure includes a gate dielectric layer over the substrate; a ferroelectric film over the gate dielectric layer; and a gate electrode over the ferroelectric film.

Abstract: Aspects of the present disclosure describe systems, methods, and structures that provide eye-tracking by 1) steering a beam of light through the effect of a microelectromechanical system (MEMS) operating at a resonant frequency onto a corneal surface; and 2) detecting the light reflected from the corneal surface.

Abstract: On a flexible substrate is printed LEDs and a driver circuit containing transistors. The LEDs and transistors are printed microscopic devices contained in an ink. The LEDs are printed in groups and connected in parallel, and the transistors are printed in groups and connected in parallel. Other components, such as resistors and an on/off switch, are also printed to form the driver. A battery and other circuit components may also be printed on the substrate. An overlay is provided over the LEDs to create a desired light pattern. The LEDs and driver may be generic, and the overlay customizes the light pattern for a particular application. The transistors in the driver may be interconnected with a trace pattern to drive the LEDs in a customized manner, such as for an insert in a product package for marketing to a consumer.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: A display device according to an embodiment of the present invention includes: a substrate, a plurality of pixels on the substrate, a first inorganic insulating layer that covers the plurality of pixels, a conductive layer on the first inorganic insulating layer, and a second inorganic insulating layer that on the conductive layer, the conductive layer being between the first inorganic insulating layer and the second inorganic insulating layer, wherein the first inorganic insulating layer includes an area that is in direct contact with the second inorganic insulating layer, and all of the conductive layer is covered with the first inorganic insulating layer and the second inorganic insulating layer.

Abstract: According to one embodiment, a relay substrate provided between a liquid crystal panel and a controller includes first connectors. The controller includes a microcomputer and second connectors. The relay substrate and the controller include a line pattern to form a test circuit which feeds a test signal back to an input pin of the microcomputer from an output pin of the microcomputer, and which transfers the test signal between the controller and the relay substrate in each pair of the first connectors and the second connectors. The microcomputer outputs the test signal from the output pin, and determines a connecting state of the cables that connect the relay substrate and the controller based on a state of feedback of the test signal to the input pin.

Abstract: A display device includes a first substrate having a light-emitting element. A second substrate is disposed over the first substrate. A sealing member is disposed between the first substrate and the second substrate. The sealing member couples the first substrate and the second substrate together. The sealing member includes a first linear portion extending in a first direction, and a second linear portion extending in a second direction different from the first direction. A maximum width of the first linear portion is greater than a maximum width of the second linear portion.

Abstract: Improved ion mirrors (10) are proposed for multi-reflecting TOF MS and electrostatic traps at various analyzer topologies. Ion mirrors (10) are constructed of printed circuit boards (11) with improved precision and flatness. To compensate for the remaining geometrical imperfections of mirror electrodes there are proposed electrode sets (17) and field structures in the ion retarding region for electronically adjusting of the ion packets time fronts, for improving the ion injection into the analyzer and for reversing the ion motion in the drift direction.

Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.

Abstract: A touch panel is provided, including a substrate, a first wire structure, and a second wire structure. The substrate includes a display area and a peripheral area surrounding the display area. The first wire structure includes a first catalyst layer, a first metal layer, and a first transparent conductive layer. The first catalyst layer is disposed above the peripheral area, the first metal layer is disposed above the first catalyst, and the first transparent conductive layer is disposed above the first metal layer. The first wire structure is divided into at least one first wire area and at least one first ground line area adjacent to the first wire area. The second wire structure is disposed under the peripheral area and includes at least one second ground line area, wherein a projection of the first wire area in a vertical direction is opposite to the second ground line area.