Abstract: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.

Abstract: An optical device includes: a stem; a mount portion connected with the stem and having an upper face, a first face and a second face opposite to the first face, the first face and the second face constituting a side face with respect to the upper face; an optical element mounted on the upper face of the mount portion; an electronic components mounted on the first face and the second face of the mount portion respectively; a first lead that penetrates the stem and is extended to a side of the first face of the mount portion; and a second lead that penetrates the stem and is extended to a side of the second face of the mount portion.

Abstract: In an organic light-emitting display device which is thin and has excellent mechanical strength and a method of manufacturing the organic light-emitting display device, the organic light-emitting display device comprises: a panel including a first substrate and a second substrate coupled to each other by a sealing resin interposed between an internal surface of the first substrate and an internal surface of the second substrate, wherein a first concave portion is formed in an outer surface of the first substrate, and a second concave portion is formed in an outer surface of the second substrate; and a buffer cushion disposed in the first concave portion, wherein the density of an edge portion of the buffer cushion is greater than the density of a center portion of the buffer cushion.

Abstract: A computer enclosure includes a front panel, a switch module, and a light guide module. The switch module is attached to the front panel and includes a mounting bracket, a switch member attached to the mounting bracket, and a light emitting diode (LED) attached to the mounting bracket. The light guide module is attached to the front panel and has a light guide slot and a first transparent board covering the light guide slot. The LED is configured to generate light that enters in the light guide slot and propagates out from the first transparent board.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.

Abstract: Provided is a semiconductor photodetector element which is reduced in manufacturing cost and improved in precision. The semiconductor photodetector element includes: a first photodiode formed in a P-type silicon substrate; a second photodiode formed in the P-type silicon substrate and has the same structure as that of the first photodiode; a color filter layer formed above the first photodiode from a green filter; a color filter layer formed of a black filter above the second photodiode; and an arithmetic circuit portion which subtracts a detection signal of the second photodiode from a detection signal of the first photodiode.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC_LED system in single chip with four metal contacts is also disclosed to be driven by four-phase voltage sources.

Abstract: A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on the chip to the contact connecting pads. Signals are passed via these contact pads such that signals at high frequencies are passed via one or more contact pads and signals at low frequencies are passed via one or more contact pads. The chip is shifted on the substrate from a central position with respect to the totality of the contact connecting pads, so that the bonding wires for those contact pads via which signals at a high frequency are passed are shorter than bonding wires for those contact pads via which signals at low frequencies are passed.

Abstract: A system for purifying a fluid uses ultra violet (UV) light to inactivate micro-organisms present in the fluid. The system has an arrangement of UV light emitters on perforated plates. The fluid, while passing through perforations in the perforated plates, is exposed to the UV light emitted by the UV light emitters. Micro-organisms present in the fluid pass very close to the UV light emitters. The UV light absorbed by the micro-organisms causes genetic damage and inactivation. The system has feedback units providing feedback about the physical properties of the fluid to a power unit supplying power to the UV light emitters. The power unit varies the amount of power supplied to the UV light emitters, based on the feedback.

Abstract: A mounting apparatus for a light emitting diode having a shoulder extending therefrom includes a panel, a base, and a bracket. The panel defines a through hole therein for the light emitting diode emitting light therethrough. The base extends from the panel round the through hole of the panel. The base includes a hollow cylinder. The cylinder defines a pair of mounting slots therein. The bracket includes a hollow retaining body for holding the light emitting diode therein. A pair of hooks and a pair of location portions extends from the retaining body. A height of the hooks is greater than that of the location portions. The shoulder of the light emitting diode is located between the hooks and location portions. A pair of shafts extends from the retaining body for being engaged in said mounting slots of the base.

Abstract: There is disclosed a nightlight that can be held or worn by a child and that can display projected images in 3-D mode upon a flat surface to comfort and provide assurance for a child when left in the dark.

Abstract: A circuit arrangement for a power semiconductor module provides low parasitic inductances and low loss. An electrically insulating substrate supports metallic ribbon connectors which in turn power attached semiconductor components. DC port conducts are positioned in close proximity to each other and are arranged in at least one partial sector parallel and in close proximity to the surface of the substrate and/or the ribbon connectors and electrically insulated from the same, and at least one AC port conductor is similarly attached. The port conductors include surface elements enabling simplified low-inductance wire bond connection from the port conductors to either the power semiconductor components or ribbon connectors or both.

Abstract: An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the electronic device has a first line structure containing height-structured interconnects on the underside of the plastic housing and a second line structure containing bonding connections which are disposed within the plastic housing.

Abstract: A lighting assembly includes a printed circuit board and a cover. The printed circuit board carries a plurality of groups of LEDs. The cover is unitarily formed and receives the printed circuit board. The cover defines a corresponding plurality of windows. Each of the windows is configured to direct a high intensity light generated by a corresponding one of the groups of LEDs in a distinct direction.

Abstract: A first apparatus includes a semiconductor device and a heatsink thermally coupled to the semiconductor device. The heatsink is located and formed to screen the device from external electromagnetic radiation or to contain radiation produced by the device. A second apparatus includes a semiconductor device, a heatsink thermally coupled to the semiconductor device, and a grounding structure having a capacitive coupling to the heatsink.

Abstract: A modular LED circuit board consisting of a circuit board being frangible along a first and second set of intersecting fragmentation lines, the fragmentation lines dividing the circuit board into a plurality of sections. A plurality of LEDs are mounted to the circuit board, at least one LED being mounted to each section, each section having a sub-circuit operatively coupled to the LED, each sub-circuit having a positive and negative lead. The sub-circuits of adjacent sections are operatively coupled together by frangible leads.

Abstract: An LED package having a generally tubular electrically conductive body, a circuit board which is mounted across the body at or adjacent one end thereof and which has an outer face on which an LED is mounted, an end contact exposed at the end of the body remote from the circuit board and located relative to the body by means of an insulating cap mounted across the body. An electrical conductor extends from the end contact through the cap, through the interior of the body and through the circuit board to connect the end contact to one of the anode and the cathode of the LED. An electrically conductive path is formed on the circuit board to connect the other of the anode and the cathode of the LED to the body such that the body serves as a second contact enabling current to be supplied to the LED.

Abstract: A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by overlaying lead frames having leads and then depositing molding material on the leads. The packaging units are manufactured in an assembly line process which includes a feeder to feed the lead frames and a molder to deposit the molding material.

Abstract: An optical transceiver module includes a body and an optical transceiver unit. The body includes a seat, a mini head cover coaxially arranged within the seat, and a tubular sleeve coaxially engaged to the seat. The optical transceiver unit includes a retaining seat, a light receiving or emitting module coaxially arranged within the retaining seat. The focus of the optical transceiver module is calibrated by proprietarily tools and then is welded with the body by laser welding. The components of the optical transceiver module are very simple. The cost can be reduced. The error is smaller and precision is high. The volume is small and thus the optical transceiver module can be used in different module.

Abstract: Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface of a heat sink (3) fixed to a support plate (2). A DC capacitor (16) is fixed to a bottom face of the heat sink (3) by adhesion. A control substrate (11) having a control IC (13) mounted thereon is fixed to the support plate (2). Moreover, a plurality of electrodes (10), a DC side electrode and refrigerant inlet-outlet (9) and a control connector (15) are provided on the support plate (2). A case (1) is fixed to a peripheral portion of the support plate (2), and surrounds the insulating substrate (5), the control substrate (11), the heat sink (3) and the DC capacitor 16 together with the support plate (2). Both the case (1) and the support plate (2) have conducting property.

Abstract: A light emitting device mounting bracket includes a body and mounting hooks for fixing the bracket to a computer enclosure. The body defines a hole for mounting a light emitting device, a turret with a snap being formed at one side of the hole and a battlement being formed around an opposite side of the hole. The light emitting device is inserted into the hole by pressing on a bottom thereof, a flange of the light emitting device abutting a stopping surface of the battlement when fully inserted, and the snap of the turret engaging the bottom of the light emitting device. The mounting hooks engage with corresponding holes in a front panel of the computer enclosure, thereby mounting the light emitting device bracket to the panel of the computer system.

Abstract: An interface is provided, the interface having at least two form factors—one for interfacing to a connector on a fiber channel drive and one or more other form factors for interfacing to one or more other styles of connectors. The first form factor is on a first part of the printed circuit board and the others are on a second part of the printed circuit board. Further, the first part of the printed circuit board is on one side of the printed circuit board and the other part of the printed circuit board is on an opposite side. Further, one or more non-SCA connectors are mounted on a front side of a substrate for receiving one or more non-SCA style connectors and an SCA2 receptacle is mounted on the back side of the substrate for interfacing the non-SCA connector an SCA connector on a fiber channel cable. Further, the non-SCA2 connector can include a DB9 receptacle, a high speed serial data connector (HSSDC), or RJ-45. Further, the fiber channel drive can receive a media interface adapter (MIA).

Abstract: A method of controlling a refrigerator including a power supply unit, an inverter applying three-phase power to a compressor is disclosed. The compressor is driven initially for a predetermined period of time. If the RPM of the compressor is not within the range between a maximum and a minimum RPM, a controller determines a malfunction of the compressor or a disconnection between the inverter and compressor during the predetermined period of time. The controller increases the number of the malfunction by one whenever the malfunction is determined. If the increased number is greater than a given number, the controller stops the compressor and alerts user to the malfunction.

Abstract: An electronic assembly (10) includes a chip capacitor (11) having two major surfaces (12, 15) and a pair of electrodes (13, 14). A plurality of electrically conductive traces (20-23, 25-28) are formed on one (12) of the major surfaces. Some of the plurality of electrically conductive traces are electrically coupled to a first electrode (14) and some of the plurality of electrically conductive traces are coupled to a second electrode (14) of the pair of electrodes. Electronic circuit elements (16, 17, 18) are coupled to the plurality of electrically conductive traces (20-23, 25-28), thereby forming the electronic assembly (10).

Abstract: An inverter device includes plural modules, each module being formed by a series circuit having a parallel circuit of a switching device and a first diode, and a parallel circuit of a second switching device and a second diode, allowing a reduced size, high reliability, high frequency switching and low noise. Each of the semiconductor modules includes a plurality of switching device chips and at least one diode chip formed on a metal substrate. Electrode plates are provided in locations of the module adjacent to the switching device chips and the diode chips to facilitate connection of the electrodes of the respective chips to one another and to the outside of the module.

Abstract: Disclosed is an optical package which is economical to manufacture. An optical component, such as a PIN photodiode, is bonded to a substrate such as silicon with no metallization on its side surfaces. The resulting assembly is solder bonded to the bottom surface of the package so that a side surface of the substrate is adjacent to the bottom surface with essentially no solder therebetween.

Abstract: An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.

Abstract: The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customized pattern of bonding pads is then formed over the one or both surfaces of the substrate which correspond to the terminal footprints of specific surface mounted packages intended to be mounted on the substrate. A generalized pattern of bonding pads may also be formed on the surfaces of the substrate for electrically connecting terminals of bare dice thereto by means of thin wire. All bonding pads are electrically connected to one or more vias by direct electrical contact or by a conductive trace extending from the bonding pad to a nearby via.

Abstract: An adapter (1, FIG. 1) is provided for the connection of an optoelectronic component such as an LED (light emitting diode) (2) to a circuit board (8) that lies in a case (34), wherein the adaptor positions the LED close to a window (32) in the top wall (30) of the case. The adapter has a pair of passages (4, 5) for holding conductors (11, 12) that connect terminals of the LED to SMD (surface mount device) contacts (6) that connect to the circuit board. The adapter holds the LED high enough above the circuit board, for the upper face (36) of the LED to lie in or close to the level of the window, so light from the LED can be readily seen from outside the case.

Abstract: Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable socket adapter in one embodiment. The socket adapter can be used for interconnecting an electronic component having terminals in a first configuration to electrical contacts in printed circuit board.

Abstract: An improved light emitting diode (LED) package structure for an LED lighting device comprises a reflector having a bowl-shaped reflecting surface formed by a pressing technique. A stand member extends from the center of the reflecting surface to the focus point of the reflector to support an LED die thereon. This arrangement allows the reflecting surface to extend toward the center thereof in order to increase the reflecting surface area and thus increasing the luminance of the LED display.

Abstract: An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.

Abstract: An electrolytic capacitor comprising a capacitor element and an electrolyte impregnated to the element, wherein the electrolyte comprises a reaction product of citraconic acid with trialkylamine dissolved in a solvent selected from the group consisting of lactones, glycols and mixtures thereof.