Abstract: The subject technology is related to autonomous vehicles (AV) and, in particular, to an autonomous driver system controller (ADSC) that is fixed to the AV. The AV comprises an electronic drivetrain configured to move the AV; and an autonomous driver system controller (ADSC) fixed to an interior surface of the AV and configured to control the electronic drivetrain with a processor connected to a plurality of memory integrated circuits (IC) that are fixed to a printed circuit board (PCB). The plurality of memory ICs are mounted on each side of the PCB using a ball grid array (BGA) with a column of pins in the BGA of a top-surface memory IC is longitudinally aligned with a corresponding column of pins in the BGA of a bottom-surface memory IC.

Abstract: A first substrate has recesses respectively provided at corner portions of a bottom surface. Outer electrodes each have an electrode body portion provided around an associated one of the recesses on the bottom surface. The electrode body portions each are made up of a plurality of laminated metal layers. A first metal layer located at an innermost side of the plurality of metal layers is formed on the bottom surface at a position spaced apart from a short-side ridge portion between the bottom surface and a side surface.

Abstract: This invention provides a box for accommodating capacitor including bottom plate, two first side plates, two second side plates, fixed engagement structure and movable engagement structure. First side plates are disposed opposite to each other. Second side plates are disposed opposite to each other. Side plates are respectively connected to a plurality of side edges of bottom plate so that bottom plate and side plates together form accommodation space. Fixed engagement structure and the movable engagement structure are respectively connected to first side plates. Fixed engagement structure and movable engagement structure are located at a side of accommodation space that is located farthest from bottom plate. Movable engagement structure includes cantilever part and engagement part. Cantilever part is connected to one of first side plates. Engagement part protrudes from movable end part of cantilever part.

Abstract: The present invention provides a temperature protective device for a filter capacitor bank. The capacitor bank comprises two or more capacitors which are arranged in an array manner. The temperature protective device comprises a temperature measurement device which comprises: a cover body covering the capacitor bank; a single temperature sensor fixed at a center area of the cover body, which is used for measuring a temperature value of the capacitor bank; and a heat conduction pad located between the cover body and the capacitor bank, wherein the heat conduction pad and the cover body have fitted shapes. The temperature protective device of the present invention saves cost and can accurately realize temperature protection of the capacitor bank.

Abstract: A coil component includes an element body having a rectangular main surface; a coil provided within the element body, wherein the coil having a lower coil portion and an upper coil portion; terminal electrodes provided at positions corresponding to corners of the main surface; extracting conductors connected within the element body to both end portions of the coil, wherein the extracting conductors extending from the end portions of the coil to terminal electrodes provided on the main surface; and a dummy electrode provided on the main surface at a position different from those of the terminal electrodes, wherein the dummy electrode is conducted to neither of the extracting conductors.

Abstract: A method of forming a resonator includes forming top and bottom dielectric structures over a substrate. A piezoelectric layer is formed between the top and bottom dielectric structures. A bottom electrode is formed between the piezoelectric layer and the bottom dielectric structure, and a top electrode is formed between the piezoelectric layer and the top dielectric structure. A metal layer is formed over the top dielectric structure and is patterned, thereby forming a first contact pad making electrical contact to the top electrode, a second contact pad making electrical contact with the bottom electrode, and a mass bias located over the top dielectric structure.

Abstract: A capacitor bank assembly has a conductive mount tray and capacitors. The capacitors are vertically mounted and held by the conductive mount tray. All positive terminals of the capacitors are connected to a first conductive plate. All negative terminals of the capacitors are connected to a second conductive plate. An insulating material separates the first conductive plate and the second conductive plate.

Abstract: An inductor device and a method of fabricating the same. The inductor device according to the invention includes a conductive coil, a pillar and a cladding body. The pillar is molded from a plurality of first composite material powders by a pressing process. Each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin. The cladding body is molded from a plurality of second composite powders. Each second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin. The first weight ratio of the first thermosetting resin to the first composite material powders is less than the second weight ratio of the second thermosetting resin to the second composite material powders. The cladding body and the conductive coil and the pillar cladded by the cladding body are heated to a curing temperature.

Abstract: A method for reducing influence of a remote reference power noise on signal quality is provided. A remote reference power plane connected to a power module is identified according to a schematic diagram of signal design, and a noised power plane is determined. A position of the noised power plane is found in a PCB, and whether the noised power plane is remote referenced by a high-speed signal is judged. Placement positions and number of connection capacitors are determined according to a layout and routing position of the high-speed signal and a width of the noised power plane. Two capacitors with fixed capacitance values are placed at the placement positions of the connection capacitors. Connection capacitors are added to a position of a noised remote reference power plane of a signal line for connecting the power plane and the ground.

Abstract: A coil electronic component includes a plurality of coil layers including coil patterns and connection patterns. The coil patterns are disposed between the connection patterns. The connection patterns are at least partially exposed from the coil electronic component. The coil electronic component further includes connection electrodes connecting the connection patterns formed in different coil layers of the plurality of coil layers with each other, and external electrodes connected to the connection electrodes and at least partially enclosing the connection electrodes.

Abstract: A thin film type coil component that includes a body having a coil embedded therein and including a composite of magnetic powder particles and a polymer, and external electrodes disposed on at least portions of external surfaces of the body. The body includes an upper body portion disposed on an upper surface of the coil, a lower body portion disposed on a lower surface of the coil, and a central body portion disposed between the upper body portion and the lower body portion and including a central portion of the coil. The upper body portion and the lower body portion include a stacked structure of a plurality of magnetic sheets, each magnetic sheet including the composite of the magnetic powder particles and the polymer.

Abstract: A capacitor unit is integrally provided with: a capacitor main body; a pair of bus bars that are connected to a pair of corresponding electrodes of the capacitor main body; and a casing that internally contains the capacitor main body and the bus bars and is made of resin. The bus bars are each provided with an input terminal on a first end side to which a connection terminal of a high-voltage cable for DC power is connected, while being each provided with an output terminal on a second end side to which an inverter substrate is connected.

Abstract: An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.

Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.

Abstract: A connector includes a holder (20) and an electronic component (60) with a cylindrical main body (61). Lead wires (62) project axially from one axial end (61A) of the main body (61). An electronic component holding portion (35) is in the holder (20) and includes an insertion opening (39) into which the electronic component (60) is inserted. Projecting portions (64) are formed on the lead wires (62) and project radially out beyond an outer peripheral surface of the main body (61). The electronic component holding portion (35) includes a main body accommodating portion (36) for accommodating the main body (61) and guides (37) that communicate with the main body accommodating portion (36). The guides (37) are located radially outward of the main body (61) and guide the projecting portions (64) toward back sides in an inserting direction while suppressing circumferential movements of the projecting portions (64).

Abstract: A semiconductor substrate includes a semiconductor chip and an interconnect substrate. The interconnect substrate has an interconnect region between a first main surface formed with plural orderly arranged first and second signal electrodes connected to the semiconductor chip, and a second main surface. The interconnect region has a core substrate, interconnect layers formed on both surfaces thereof, plural first through holes and plural first vias that pass through the interconnect layer on the side of the first main surface for forming impedance matching capacitances. Each first through hole is connected to a first signal interconnect at a position spaced part from the first signal electrode by a first interconnect length and each first via is connected to the second signal interconnect at a position spaced apart from the second signal electrode by a second interconnect length that is substantially equal with the first interconnect length.

Abstract: A reusable electronic circuit assembling system facilitates assembly and testing of electronic circuits. The system has at least one baseboard and one or more assembling blocks magnetically or mechanically attached to the baseboard. Each assembling block has at least two electrically connected conductive clips located separately in the opening holes of the assembly block. Discrete electronic components are connected by selectively inserting the electrodes of the to-be-connected electronic components into the clips of the assembling blocks. A complete circuit is constructed by attaching the above block-component assemblies on the baseboard and connecting them in accordance with the desired circuit diagram.

Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.

Abstract: There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.

Abstract: A capacitor assembly comprises a plurality of capacitor elements, a clamping assembly, and a conductive path. The clamping assembly retains the plurality of capacitor elements longitudinally perpendicular to an adjacent mounting surface. The conductive path electrically connects the plurality of capacitor elements to one or more circuit elements disposed proximate the adjacent mounting surface. The clamping assembly includes a base with a central strut and a plurality of peripheral struts projecting perpendicularly therefrom, and the clamping assembly also includes a central conductive path.

Abstract: A power converter includes a PCB and a semiconductor die coupled to the PCB. The semiconductor die includes first through fourth switching devices. The power converter further includes a first energy storage element electrically connected to the first and second switching devices and a second energy storage element electrically connected to the third and fourth switching devices. The first energy storage element is mounted over the first and second switching devices and the second energy storage element is mounted over the third and fourth switching devices.

Abstract: A power conversion apparatus includes a switching circuit including semiconductor switches, and a main circuit capacitor connected between a DC power source and the switching circuit. The main circuit capacitor includes a capacitor element, first wiring members that connect the DC power source to the switching circuit, and second wiring members that connect the capacitor element to the switching circuit. The capacitor element, the first wiring members, and the second wiring members are received in a case.

Abstract: A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.

Abstract: A capacitor mounting construction includes housing, a bracket and an urging member. The housing has a capacitor accommodating space configured to accommodate a capacitor and a wire accommodating space configured to accommodate a wire extended from the capacitor. The bracket is engaged with the housing, is configured to fix and electrically connect the wire to a conductive member in the wire accommodating space, and covers the capacitor accommodating space to define a capacitor accommodating chamber. The urging member is provided on an inner wall of the capacitor accommodating chamber, and is configured to urge the capacitor to contact another inner wall of the capacitor accommodating chamber.

Abstract: A power filter output architecture of a power supply includes a power conversion circuit board, a filter inductor, and a power output port. The power conversion circuit board includes a conversion circuit which converts an input power into at least one converted power, a power output circuit arranged at an edge of the power conversion circuit board, and a ground circuit arranged between the conversion circuit and the power output circuit. The filter inductor includes a first pin which obtains the converted power, an inductor body which receives the converted power and induces it to produce a filtered power, and a second pin which crosses the ground circuit to connect to the power output circuit. The power output port includes a plurality of power output terminals disposed on the power output circuit to obtain the filtered power, and a plurality of ground terminals connected to the ground circuit.

Abstract: The device includes a first inductor, a first insulating layer, a second inductor, and a third inductor. The first inductor includes a helical conductive pattern. The second inductor is located in a region overlapping the first inductor through the first insulating layer. The second inductor includes a helical conductive pattern. The third inductor is connected in series to the second inductor, and includes a helical conductive pattern.

Abstract: Provided is an electronic device that is provided with a filter circuit that suppresses the effects of electromagnetic noise propagated through space from a circuit board and reduces parasitic inductance, and can output a voltage with adequately reduced noise. To solve the above problem, in an electronic device provided with a cabinet (101), a circuit board (132) provided in the cabinet, an output terminal (122) that passes through a through hole provided in the cabinet and outputs the output of the circuit board to the outside, the present invention constructs a loop composed of a filter means (142) having a filter capacitor (142a), an output terminal, a cabinet, and wires (142b, 142c) for connecting these parts. The wire (142c) connected to the cabinet is connected to a position close to the output terminal, and reduces the size of the loop. In addition, a shield (102) is provided between the filter means and the circuit board.

Abstract: An electrical connector assembly is provided with an electrical busbar for conducting power. The busbar has a width, a length, and a thickness. The busbar has a first portion with a first length, and a second portion with a second length. The second portion is oriented at a non-zero angle relative to the first portion. A connector is mounted to the busbar. One of the width and the thickness is reduced for receipt of a sensor about the busbar. A power converter assembly is provided with a direct current bus capacitor and a power module oriented in a housing. A plurality of the electrical connector assemblies are each connected to at least one of the direct current bus capacitor and the power module.

Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

Abstract: A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.

Abstract: A circuit board includes a first circuit area, a first processing unit and a conductive pattern. The first circuit area includes a plurality of first electrically contacts. The first processing unit, which includes a ball grid array (BGA) substrate, is disposed on the first circuit area and is electrically connected to the first electrically contacts. The BGA substrate has a plurality of solder balls and a bypass circuit. The conductive pattern is electrically connected to the first electrically contacts.

Abstract: An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.

Abstract: Provided is a circuit board including a resin base, and a resistance element formed above the resin base. The resistance element includes a resistance pattern including an electrode portion and an extending portion, and an electrode formed on the electrode portion of the resistance pattern and including a foot portion reduced in thickness toward the extending portion.

Abstract: A miniaturized wideband surface mount bias tee comprises a printed circuit board with a functioning first capacitor and a dummy second capacitor, and an inductor bonded atop the two capacitors. The capacitors, adhesive and solder are depositable by standard surface mount pick and place machinery. The inductor wires are bonded to one of the first capacitor bonding pads and to an inductor bonding pad. The circuit element bonding pads include portions bordering the pc board edges and are conductively connected to bonding pads on the bottom face of the pc board. Conductive thru-vias for the first capacitor bonding pads reduce parasitic inductance and extend the operating frequency range. A flat-topped insulating cap encloses the bias tee sides and top. The cap forms an air gap between the inductor and circuit elements and provides a surface for manipulating the bias tee with present-day assembly equipment.

Abstract: A converter power unit comprises: a heat sink; n power switch modules on the heat sink; a first group of laminated bus bars comprising a first and a second bus bar; a capacitor group comprising m capacitor; a second group of laminated bus bars comprising a third and a fourth bus bar, the first bus bar is connected with the third bus bar, the second bus bar is connected with the fourth bus bar; providing that vertical projection areas projected by an area occupied by the n power switch modules and projected by the capacitor group on a first plane perpendicular to an axial direction of the capacitor group are defined as a first and a second projection areas respectively, the first and the second projection area have an overlapped area. The present application can reduce the stray inductances in the commutating loop of the converter.

Abstract: An electronic device, and associated method, provided with a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least one capacitive element, wherein the capacitive element is a conductor surface (221) forming a capacitor in the assembled state with a corresponding, device-side conductor surface (222?), which is connected to the electrical circuit (18) via a contact element in the assembled state, whereby the capacitive value of the capacitive element in the assembled state differs from the capacitive value of the capacitive element in the disassembled state.

Abstract: An electronic device, and associated method, provided with a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least two separate partial circuits (18?, 18?) wherein the separate partial circuits are electrically connected in the assembled state by cooperation with at least one of: at least one device components and/or assembly components (181).

Abstract: A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.

Abstract: A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.

Abstract: A capacitor assembly comprises a plurality of capacitor elements, a clamping assembly, and a conductive path. The clamping assembly retains the plurality of capacitor elements longitudinally perpendicular to an adjacent mounting surface. The conductive path electrically connects the plurality of capacitor elements to one or more circuit elements disposed proximate the adjacent mounting surface.

Abstract: An electronic device includes a processing unit, a first connection element, a first interface group which includes at least one interface, a second connection element, and a second interface group which includes a number of interfaces. The first connection element is detachably connected between the processing unit and the first interface group. The second connection element is detachably connected between the processing unit and the second interface group and the user can select between the two elements.

Abstract: A power conversion apparatus is provided, which accommodates electronic components configuring at least part of a power conversion circuit, and a terminal block collecting wires running from the electronic components, in a case. The terminal block includes a plurality of terminal connecting parts at which a plurality of high-voltage cables, through which electric power is received from and provided to the outside of the case, and the wires are connected to each other, and insulating parts provided between the terminal connecting parts and ensuring insulation between the high-voltage cables and between the wires. A plurality of insertion holes, into which the high-voltage cables are inserted, are formed in one side wall of the case. An opening part for performing an operation for fixing the high-voltage cables to the terminal connecting parts is formed in a wall of the case opposed to the terminal connecting parts and the insulating parts.

Abstract: An electronic device, and associated method, provided with a circuit board (10) with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM), and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least one inductive element, which is formed by a conductor wire (201) wound into a coil around a break (202) in the circuit board (10), which in the assembled condition, is penetrated by a ferromagnetic bar or fixing pin (203), such that the inductance of the inductive element in the assembled state differs from the inductance thereof in the disassembled state.

Abstract: A mezzanine board alignment and mounting device includes a multi-stage pin connected to a main board near a mezzanine board connector disposed on the main board. The multistage pin includes a base adapted to connect to the main board, a point distal to the base adapted to pass through an opening on a mezzanine board, and a support disposed between the base and the point. A diameter of the point widens towards the support. A diameter of the support is wider than a diameter of the opening. When the point is fully inserted through the opening in the mezzanine board, the mezzanine board is aligned properly to connect with the mezzanine board connector on the main board.

Abstract: A chip component is provided with a block including a dielectric, input and output terminals, which are the first and second terminals that are provided on the surface of the block, an adjustment terminal that is a third terminal that includes an internal electrode extended into the block and that is provided on the surface of the block, and at least two inter-terminal circuits that are provided in the block and that are connected between at least two sets of two terminals of the first, second, and third terminals.

Abstract: An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.

Abstract: The present invention relates to an integrated power inserter, comprises: a housing; a voltage lowering and rectifying member; and a coupling member having a power input end, a radio frequency signal coupling circuit, a radio frequency signal input end and a radio frequency signal output end, wherein the radio frequency signal input end is input with a radio frequency signal and outputs a power signal, the radio frequency signal output end outputs a radio frequency signal being coupled to a television; with the mentioned structure of the integrated power inserter, a power inserter can be integrated in a power adaptor for simplifying wire layout and lowering production cost.

Abstract: An electronic apparatus is provided that can include a circuit board; a switch attached to the circuit board; an electronic part mounted on the circuit board; a wiring pattern extending between the switch and the electronic part; and a protrusion protruding from a surface of the wiring pattern. The protrusion may be disposed adjacent to the switch on the circuit board and overlapping the wiring pattern.

Abstract: A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.

Abstract: A universal capacitive power factor corrector usable with single phase inductive loads encases one capacitor, of 10 microfarads, one 240 volt varistor, one 22 microhenry coil, and a 330 k ohm resistor within a housing having a power cord, on off switch, 4 amp fuse, and a indicator lamp. Overall design to correct poorly designed single phase inductive current loads for home or small business.