With Passive Components Patents (Class 361/811)
  • Patent number: 10643785
    Abstract: A thin film type coil component that includes a body having a coil embedded therein and including a composite of magnetic powder particles and a polymer, and external electrodes disposed on at least portions of external surfaces of the body. The body includes an upper body portion disposed on an upper surface of the coil, a lower body portion disposed on a lower surface of the coil, and a central body portion disposed between the upper body portion and the lower body portion and including a central portion of the coil. The upper body portion and the lower body portion include a stacked structure of a plurality of magnetic sheets, each magnetic sheet including the composite of the magnetic powder particles and the polymer.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Young Seuck Yoo, Seok Il Hong
  • Patent number: 10236121
    Abstract: A capacitor unit is integrally provided with: a capacitor main body; a pair of bus bars that are connected to a pair of corresponding electrodes of the capacitor main body; and a casing that internally contains the capacitor main body and the bus bars and is made of resin. The bus bars are each provided with an input terminal on a first end side to which a connection terminal of a high-voltage cable for DC power is connected, while being each provided with an output terminal on a second end side to which an inverter substrate is connected.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: March 19, 2019
    Assignee: Mitsubishi Heavy Industries Thermal Systems, Ltd.
    Inventors: Makoto Hattori, Hiroyuki Kamitani, Hiroto Higuchi, Takayuki Takashige
  • Patent number: 9867285
    Abstract: An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: January 9, 2018
    Assignee: Apple Inc.
    Inventors: Paul A. Martinez, Tyler S. Bushnell, Jason C. Sauers
  • Patent number: 9786428
    Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: October 10, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Hyuck Yang, Young Seuck Yoo, Sung Kwon Wi, Hye Won Bang, Geon Se Chang, Young Do Kweon, Ju Hwan Yang
  • Patent number: 9331435
    Abstract: A connector includes a holder (20) and an electronic component (60) with a cylindrical main body (61). Lead wires (62) project axially from one axial end (61A) of the main body (61). An electronic component holding portion (35) is in the holder (20) and includes an insertion opening (39) into which the electronic component (60) is inserted. Projecting portions (64) are formed on the lead wires (62) and project radially out beyond an outer peripheral surface of the main body (61). The electronic component holding portion (35) includes a main body accommodating portion (36) for accommodating the main body (61) and guides (37) that communicate with the main body accommodating portion (36). The guides (37) are located radially outward of the main body (61) and guide the projecting portions (64) toward back sides in an inserting direction while suppressing circumferential movements of the projecting portions (64).
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: May 3, 2016
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Tomoyuki Kondo
  • Patent number: 9035450
    Abstract: A semiconductor substrate includes a semiconductor chip and an interconnect substrate. The interconnect substrate has an interconnect region between a first main surface formed with plural orderly arranged first and second signal electrodes connected to the semiconductor chip, and a second main surface. The interconnect region has a core substrate, interconnect layers formed on both surfaces thereof, plural first through holes and plural first vias that pass through the interconnect layer on the side of the first main surface for forming impedance matching capacitances. Each first through hole is connected to a first signal interconnect at a position spaced part from the first signal electrode by a first interconnect length and each first via is connected to the second signal interconnect at a position spaced apart from the second signal electrode by a second interconnect length that is substantially equal with the first interconnect length.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: May 19, 2015
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shuuichi Kariyazaki, Ryuichi Oikawa
  • Patent number: 8991040
    Abstract: A reusable electronic circuit assembling system facilitates assembly and testing of electronic circuits. The system has at least one baseboard and one or more assembling blocks magnetically or mechanically attached to the baseboard. Each assembling block has at least two electrically connected conductive clips located separately in the opening holes of the assembly block. Discrete electronic components are connected by selectively inserting the electrodes of the to-be-connected electronic components into the clips of the assembling blocks. A complete circuit is constructed by attaching the above block-component assemblies on the baseboard and connecting them in accordance with the desired circuit diagram.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: March 31, 2015
    Assignee: 5eTek, LLC
    Inventor: Erli Chen
  • Patent number: 8964407
    Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: February 24, 2015
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Tatsuro Sawatari, Yuichi Sugiyama
  • Patent number: 8952271
    Abstract: There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: February 10, 2015
    Assignee: Fujitsu Limited
    Inventors: Masaharu Furuyama, Daisuke Mizutani, Seiki Sakuyama, Toshiya Akamatsu
  • Publication number: 20150003031
    Abstract: A capacitor assembly comprises a plurality of capacitor elements, a clamping assembly, and a conductive path. The clamping assembly retains the plurality of capacitor elements longitudinally perpendicular to an adjacent mounting surface. The conductive path electrically connects the plurality of capacitor elements to one or more circuit elements disposed proximate the adjacent mounting surface. The clamping assembly includes a base with a central strut and a plurality of peripheral struts projecting perpendicularly therefrom, and the clamping assembly also includes a central conductive path.
    Type: Application
    Filed: September 15, 2014
    Publication date: January 1, 2015
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventor: Dale W. Massolle, JR.
  • Publication number: 20140369018
    Abstract: A power converter includes a PCB and a semiconductor die coupled to the PCB. The semiconductor die includes first through fourth switching devices. The power converter further includes a first energy storage element electrically connected to the first and second switching devices and a second energy storage element electrically connected to the third and fourth switching devices. The first energy storage element is mounted over the first and second switching devices and the second energy storage element is mounted over the third and fourth switching devices.
    Type: Application
    Filed: May 24, 2012
    Publication date: December 18, 2014
    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventor: David Michael Giuliano
  • Patent number: 8902612
    Abstract: A power conversion apparatus includes a switching circuit including semiconductor switches, and a main circuit capacitor connected between a DC power source and the switching circuit. The main circuit capacitor includes a capacitor element, first wiring members that connect the DC power source to the switching circuit, and second wiring members that connect the capacitor element to the switching circuit. The capacitor element, the first wiring members, and the second wiring members are received in a case.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: December 2, 2014
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Aiko Inuduka, Toshio Nagao, Hidenori Hara
  • Patent number: 8885356
    Abstract: A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: November 11, 2014
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Wael Zohni, Richard Dewitt Crisp
  • Patent number: 8861225
    Abstract: A capacitor mounting construction includes housing, a bracket and an urging member. The housing has a capacitor accommodating space configured to accommodate a capacitor and a wire accommodating space configured to accommodate a wire extended from the capacitor. The bracket is engaged with the housing, is configured to fix and electrically connect the wire to a conductive member in the wire accommodating space, and covers the capacitor accommodating space to define a capacitor accommodating chamber. The urging member is provided on an inner wall of the capacitor accommodating chamber, and is configured to urge the capacitor to contact another inner wall of the capacitor accommodating chamber.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: October 14, 2014
    Assignee: Yazaki Corporation
    Inventor: Shinji Kodama
  • Patent number: 8861226
    Abstract: A power filter output architecture of a power supply includes a power conversion circuit board, a filter inductor, and a power output port. The power conversion circuit board includes a conversion circuit which converts an input power into at least one converted power, a power output circuit arranged at an edge of the power conversion circuit board, and a ground circuit arranged between the conversion circuit and the power output circuit. The filter inductor includes a first pin which obtains the converted power, an inductor body which receives the converted power and induces it to produce a filtered power, and a second pin which crosses the ground circuit to connect to the power output circuit. The power output port includes a plurality of power output terminals disposed on the power output circuit to obtain the filtered power, and a plurality of ground terminals connected to the ground circuit.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: October 14, 2014
    Assignee: Sea Sonic Electronics Co., Ltd.
    Inventor: Hsiu-Cheng Chang
  • Patent number: 8830694
    Abstract: The device includes a first inductor, a first insulating layer, a second inductor, and a third inductor. The first inductor includes a helical conductive pattern. The second inductor is located in a region overlapping the first inductor through the first insulating layer. The second inductor includes a helical conductive pattern. The third inductor is connected in series to the second inductor, and includes a helical conductive pattern.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: September 9, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Masaya Kawano, Yasutaka Nakashiba
  • Publication number: 20140240946
    Abstract: Provided is an electronic device that is provided with a filter circuit that suppresses the effects of electromagnetic noise propagated through space from a circuit board and reduces parasitic inductance, and can output a voltage with adequately reduced noise. To solve the above problem, in an electronic device provided with a cabinet (101), a circuit board (132) provided in the cabinet, an output terminal (122) that passes through a through hole provided in the cabinet and outputs the output of the circuit board to the outside, the present invention constructs a loop composed of a filter means (142) having a filter capacitor (142a), an output terminal, a cabinet, and wires (142b, 142c) for connecting these parts. The wire (142c) connected to the cabinet is connected to a position close to the output terminal, and reduces the size of the loop. In addition, a shield (102) is provided between the filter means and the circuit board.
    Type: Application
    Filed: October 26, 2012
    Publication date: August 28, 2014
    Inventors: Keisuke Fukumasu, Akihiro Namba, Hidenori Shinohara
  • Publication number: 20140198475
    Abstract: An electrical connector assembly is provided with an electrical busbar for conducting power. The busbar has a width, a length, and a thickness. The busbar has a first portion with a first length, and a second portion with a second length. The second portion is oriented at a non-zero angle relative to the first portion. A connector is mounted to the busbar. One of the width and the thickness is reduced for receipt of a sensor about the busbar. A power converter assembly is provided with a direct current bus capacitor and a power module oriented in a housing. A plurality of the electrical connector assemblies are each connected to at least one of the direct current bus capacitor and the power module.
    Type: Application
    Filed: January 17, 2013
    Publication date: July 17, 2014
    Applicant: LEAR CORPORATION
    Inventors: David Menzies, Yu Qin, Richard J. Hampo
  • Patent number: 8717774
    Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: May 6, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Michael S. Randall, Garry Renner, John D. Prymak, Azizuddin Tajuddin
  • Patent number: 8717773
    Abstract: A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: May 6, 2014
    Assignee: General Electric Company
    Inventor: Daniel Z. Abawi
  • Patent number: 8681510
    Abstract: A circuit board includes a first circuit area, a first processing unit and a conductive pattern. The first circuit area includes a plurality of first electrically contacts. The first processing unit, which includes a ball grid array (BGA) substrate, is disposed on the first circuit area and is electrically connected to the first electrically contacts. The BGA substrate has a plurality of solder balls and a bypass circuit. The conductive pattern is electrically connected to the first electrically contacts.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: March 25, 2014
    Assignee: Delta Electronics, Inc.
    Inventors: Chia-Chan Hu, Yuan-Ming Hsu
  • Patent number: 8659119
    Abstract: An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: February 25, 2014
    Assignee: International Business Machines Corporation
    Inventors: Vijayeshwar D. Kharma, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit, David Questad
  • Patent number: 8642894
    Abstract: Provided is a circuit board including a resin base, and a resistance element formed above the resin base. The resistance element includes a resistance pattern including an electrode portion and an extending portion, and an electrode formed on the electrode portion of the resistance pattern and including a foot portion reduced in thickness toward the extending portion.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: February 4, 2014
    Assignee: Fujitsu Limited
    Inventors: Tomoyuki Abe, Norikazu Ozaki
  • Patent number: 8644029
    Abstract: A miniaturized wideband surface mount bias tee comprises a printed circuit board with a functioning first capacitor and a dummy second capacitor, and an inductor bonded atop the two capacitors. The capacitors, adhesive and solder are depositable by standard surface mount pick and place machinery. The inductor wires are bonded to one of the first capacitor bonding pads and to an inductor bonding pad. The circuit element bonding pads include portions bordering the pc board edges and are conductively connected to bonding pads on the bottom face of the pc board. Conductive thru-vias for the first capacitor bonding pads reduce parasitic inductance and extend the operating frequency range. A flat-topped insulating cap encloses the bias tee sides and top. The cap forms an air gap between the inductor and circuit elements and provides a surface for manipulating the bias tee with present-day assembly equipment.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: February 4, 2014
    Assignee: Scientific Components Corporation
    Inventor: Daxiong Ji
  • Publication number: 20130271941
    Abstract: A converter power unit comprises: a heat sink; n power switch modules on the heat sink; a first group of laminated bus bars comprising a first and a second bus bar; a capacitor group comprising m capacitor; a second group of laminated bus bars comprising a third and a fourth bus bar, the first bus bar is connected with the third bus bar, the second bus bar is connected with the fourth bus bar; providing that vertical projection areas projected by an area occupied by the n power switch modules and projected by the capacitor group on a first plane perpendicular to an axial direction of the capacitor group are defined as a first and a second projection areas respectively, the first and the second projection area have an overlapped area. The present application can reduce the stray inductances in the commutating loop of the converter.
    Type: Application
    Filed: November 20, 2012
    Publication date: October 17, 2013
    Inventors: Wei Guan, Jian Jiang, Bagao Li, Kaitian Yan, Hongyang Wu
  • Patent number: 8508236
    Abstract: An electronic device, and associated method, provided with a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least two separate partial circuits (18?, 18?) wherein the separate partial circuits are electrically connected in the assembled state by cooperation with at least one of: at least one device components and/or assembly components (181).
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: August 13, 2013
    Assignee: Sartorius Weighing Technology GmbH
    Inventors: Swen Weitemeier, Christian Oldendorf
  • Patent number: 8508235
    Abstract: An electronic device, and associated method, provided with a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least one capacitive element, wherein the capacitive element is a conductor surface (221) forming a capacitor in the assembled state with a corresponding, device-side conductor surface (222?), which is connected to the electrical circuit (18) via a contact element in the assembled state, whereby the capacitive value of the capacitive element in the assembled state differs from the capacitive value of the capacitive element in the disassembled state.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: August 13, 2013
    Assignee: Sartorius Weighing Technology GmbH
    Inventors: Swen Weitemeier, Christian Oldendorf
  • Patent number: 8482934
    Abstract: A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: July 9, 2013
    Assignee: International Business Machines Corporation
    Inventors: Don A. Gilliland, David B. Johnson, Dennis J. Wurth
  • Patent number: 8456855
    Abstract: A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: June 4, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Chieh Chen, Duen-Yi Ho, Shou-Kuo Hsu
  • Publication number: 20130107492
    Abstract: A capacitor assembly comprises a plurality of capacitor elements, a clamping assembly, and a conductive path. The clamping assembly retains the plurality of capacitor elements longitudinally perpendicular to an adjacent mounting surface. The conductive path electrically connects the plurality of capacitor elements to one or more circuit elements disposed proximate the adjacent mounting surface.
    Type: Application
    Filed: October 28, 2011
    Publication date: May 2, 2013
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventor: Dale W. Massolle
  • Publication number: 20130100603
    Abstract: An electronic device includes a processing unit, a first connection element, a first interface group which includes at least one interface, a second connection element, and a second interface group which includes a number of interfaces. The first connection element is detachably connected between the processing unit and the first interface group. The second connection element is detachably connected between the processing unit and the second interface group and the user can select between the two elements.
    Type: Application
    Filed: October 31, 2011
    Publication date: April 25, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventor: MIAO HE
  • Patent number: 8422222
    Abstract: A power conversion apparatus is provided, which accommodates electronic components configuring at least part of a power conversion circuit, and a terminal block collecting wires running from the electronic components, in a case. The terminal block includes a plurality of terminal connecting parts at which a plurality of high-voltage cables, through which electric power is received from and provided to the outside of the case, and the wires are connected to each other, and insulating parts provided between the terminal connecting parts and ensuring insulation between the high-voltage cables and between the wires. A plurality of insertion holes, into which the high-voltage cables are inserted, are formed in one side wall of the case. An opening part for performing an operation for fixing the high-voltage cables to the terminal connecting parts is formed in a wall of the case opposed to the terminal connecting parts and the insulating parts.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: April 16, 2013
    Assignee: Denso Corporation
    Inventor: Satoshi Noda
  • Patent number: 8395407
    Abstract: An electronic device, and associated method, provided with a circuit board (10) with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM), and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least one inductive element, which is formed by a conductor wire (201) wound into a coil around a break (202) in the circuit board (10), which in the assembled condition, is penetrated by a ferromagnetic bar or fixing pin (203), such that the inductance of the inductive element in the assembled state differs from the inductance thereof in the disassembled state.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: March 12, 2013
    Assignee: Sartorius Weighing Technology GmbH
    Inventors: Swen Weitemeier, Christian Oldendorf
  • Patent number: 8391022
    Abstract: A mezzanine board alignment and mounting device includes a multi-stage pin connected to a main board near a mezzanine board connector disposed on the main board. The multistage pin includes a base adapted to connect to the main board, a point distal to the base adapted to pass through an opening on a mezzanine board, and a support disposed between the base and the point. A diameter of the point widens towards the support. A diameter of the support is wider than a diameter of the opening. When the point is fully inserted through the opening in the mezzanine board, the mezzanine board is aligned properly to connect with the mezzanine board connector on the main board.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: March 5, 2013
    Assignee: Oracle America, Inc.
    Inventors: Timothy W. Olesiewicz, David W. Hartwell, Brett C. Ong
  • Publication number: 20130003334
    Abstract: A chip component is provided with a block including a dielectric, input and output terminals, which are the first and second terminals that are provided on the surface of the block, an adjustment terminal that is a third terminal that includes an internal electrode extended into the block and that is provided on the surface of the block, and at least two inter-terminal circuits that are provided in the block and that are connected between at least two sets of two terminals of the first, second, and third terminals.
    Type: Application
    Filed: June 5, 2012
    Publication date: January 3, 2013
    Applicant: Sony Mobile Communications Japan, Inc.
    Inventor: Kotaro Fujimori
  • Patent number: 8345438
    Abstract: An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: January 1, 2013
    Assignees: Fujitsu Limited, Taiyo Yuden Co., Ltd.
    Inventors: Xiaoyu Mi, Tsuyoshi Matsuomoto, Satoshi Ueda, Takeo Takahashi
  • Patent number: 8331108
    Abstract: The present invention relates to an integrated power inserter, comprises: a housing; a voltage lowering and rectifying member; and a coupling member having a power input end, a radio frequency signal coupling circuit, a radio frequency signal input end and a radio frequency signal output end, wherein the radio frequency signal input end is input with a radio frequency signal and outputs a power signal, the radio frequency signal output end outputs a radio frequency signal being coupled to a television; with the mentioned structure of the integrated power inserter, a power inserter can be integrated in a power adaptor for simplifying wire layout and lowering production cost.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: December 11, 2012
    Assignee: Lantek Electronics Inc.
    Inventor: Shan-Jui Lu
  • Patent number: 8284565
    Abstract: An electronic apparatus is provided that can include a circuit board; a switch attached to the circuit board; an electronic part mounted on the circuit board; a wiring pattern extending between the switch and the electronic part; and a protrusion protruding from a surface of the wiring pattern. The protrusion may be disposed adjacent to the switch on the circuit board and overlapping the wiring pattern.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: October 9, 2012
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Akihiro Shibasaki, Katsumi Inukai, Tasuku Sugimoto
  • Patent number: 8254146
    Abstract: A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.
    Type: Grant
    Filed: January 11, 2010
    Date of Patent: August 28, 2012
    Assignee: ASUSTeK Computer Inc.
    Inventors: Chung-Wei Kuo, Chien-Jung Wu, Ming-Chuan Lee
  • Publication number: 20120206897
    Abstract: A universal capacitive power factor corrector usable with single phase inductive loads encases one capacitor, of 10 microfarads, one 240 volt varistor, one 22 microhenry coil, and a 330 k ohm resistor within a housing having a power cord, on off switch, 4 amp fuse, and a indicator lamp. Overall design to correct poorly designed single phase inductive current loads for home or small business.
    Type: Application
    Filed: February 14, 2011
    Publication date: August 16, 2012
    Inventors: Eric Boyer, John Bono
  • Publication number: 20120188742
    Abstract: A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.
    Type: Application
    Filed: January 21, 2011
    Publication date: July 26, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Don A. Gilliland, David B. Johnson, Dennis J. Wurth
  • Publication number: 20120189887
    Abstract: The invention relates to an electrical energy storage device comprising a plurality of flat storage cells for storing and discharging electrical energy, having opposing flat current collectors, a plurality of frame elements for maintaining the storage cells, and a clamping means for clamping the cells with the frame elements into a stack. Each storage cell carries at least one measurement or sensor element for measuring at least one physical variable, to which at least one respective cable for transmitting the measurement data is fixed. The frame elements comprise first recesses for receiving the measurement or sensor elements and second recesses connected to the first recesses, the second recesses of the frame elements together forming at least one channel extending over the length of the device for receiving the cables.
    Type: Application
    Filed: June 7, 2010
    Publication date: July 26, 2012
    Applicant: Li-Tec Battery GmbH
    Inventors: Claus-Rupert Hohenthanner, Torsten Schmidt, Jens Meintschel, Andreas Fuchs
  • Patent number: 8213175
    Abstract: An electronic device includes a body and an input device. The body includes a shell and a non-conductive rear cover. The shell defines an opening. The rear cover tightly covers the opening and defines a through hole. The input device includes a resistor, a wire, a non-conductive rotating plate, and a conducting member. The resistor and the wire both are discontinuous ring-shaped, and concentrically disposed on the rear cover surrounding the through hole. The rotating plate is rotatably inserted through the through hole. The conducting member is disposed on the rotating plate and connects the resistor and the wire. The conducting member is operable to move around the resistor and the wire such that a resistance between one end of the resistor and one end of the wire is changed.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: July 3, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Song-Ling Yang
  • Patent number: 8203853
    Abstract: A chip filter and supplementary tool combination is disclosed. The chip filter includes a insulative holder base having two arrays of wire grooves arranged along two opposing sidewalls thereof and soldering zones defined in a finished surface on each sidewall corresponding to the wire grooves, connection terminals each having a base portion respectively embedded in the soldering zones in the sidewalls of the insulative holder base and a soldering surface respectively kept in flush with the top edge of the associating sidewall, and filter elements having lead wires thereof respectively extending out of the insulative holder base through the wire grooves and respectively rested on the soldering surfaces of the connection terminals and held down in position by the supplementary tool for soldering by an automatic soldering machine.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: June 19, 2012
    Assignee: U.D. Electronic Corp.
    Inventor: Po-Jung Chen
  • Publication number: 20120147578
    Abstract: A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The interposer does not have through-interposer vias formed therein. First passive devices are formed on the first side of the interposer and electrically coupled to the RF device. Second passive devices are formed on the second side of the interposer. The first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices.
    Type: Application
    Filed: December 10, 2010
    Publication date: June 14, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jun-De Jin, Mei-Show Chen, Tzu-Jin Yeh
  • Publication number: 20120044661
    Abstract: A holder for mounting multiple capacitors onto a circuit board includes a main structure and a plurality of latching member. The main structure has a top plate and a plurality of side plates. The top plate includes a plurality of holding slots, with the latching members off the side plates. Each latching member has an extension portion and an engaging member. The engaging member is located at the end of the extension under the bottom edge of the side plate. The capacitor includes a main body and a pair of electric leads at one end of the main body. At the opposite end of the electric leads, the main body is bounded on top by the top plate of the main structure, where the main body of each capacitor emerges partially above the upper surface of the top plate.
    Type: Application
    Filed: August 19, 2010
    Publication date: February 23, 2012
    Applicant: LIEN CHANG ELECTRONIC ENTERPRISE CO., LTD.
    Inventors: CHUN-KONG CHAN, CHI-CHING CHEN
  • Publication number: 20120002391
    Abstract: An improved overload relay includes a number of current transformers that draw power from a circuit it protects in order to evaluate the circuit and also to power itself. The overload relay advantageously includes a visual indicator that includes an LED that is able to provide a visual indication of a status of the overload relay.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 5, 2012
    Inventor: Ronald Arlin Van Weelden
  • Patent number: 8085549
    Abstract: The circuit device includes a first transmitting inductor, a first insulating layer, a first receiving inductor, and a second receiving inductor. The first transmitting inductor is constituted of a helical conductive pattern and receives a transmitted signal. The first receiving inductor is located in a region overlapping the first transmitting inductor through the first insulating layer. The first receiving inductor is constituted of a helical conductive pattern, and generates a received signal corresponding to the transmitted signal input to the first transmitting inductor. The second receiving inductor is connected in series to the first receiving inductor, and constituted of a helical conductive pattern. The second receiving inductor generates a voltage in an opposite direction to that generated by the first receiving inductor, in response to a magnetic field of the same direction.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: December 27, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Masaya Kawano, Yasutaka Nakashiba
  • Patent number: 8081425
    Abstract: A portable electronic device and a transferring method of a circuit element thereof are provided. The portable electronic device comprises a main body and a circuit element. The main body has a shell and a control element by a print way. The circuit element is integrated with the shell by transferring and is electrically connected with the control element.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: December 20, 2011
    Assignee: ASUSTek Computer Inc.
    Inventors: Hung-Hsiang Chen, Yang-Po Chiu
  • Patent number: 8071187
    Abstract: A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: December 6, 2011
    Assignee: Tokuyama Corporation
    Inventors: Yasuyuki Yamamoto, Osamu Yatabe, Masakatsu Maeda