Abstract: A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The interposer does not have through-interposer vias formed therein. First passive devices are formed on the first side of the interposer and electrically coupled to the RF device. Second passive devices are formed on the second side of the interposer. The first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices.

Abstract: A holder for mounting multiple capacitors onto a circuit board includes a main structure and a plurality of latching member. The main structure has a top plate and a plurality of side plates. The top plate includes a plurality of holding slots, with the latching members off the side plates. Each latching member has an extension portion and an engaging member. The engaging member is located at the end of the extension under the bottom edge of the side plate. The capacitor includes a main body and a pair of electric leads at one end of the main body. At the opposite end of the electric leads, the main body is bounded on top by the top plate of the main structure, where the main body of each capacitor emerges partially above the upper surface of the top plate.

Abstract: An improved overload relay includes a number of current transformers that draw power from a circuit it protects in order to evaluate the circuit and also to power itself. The overload relay advantageously includes a visual indicator that includes an LED that is able to provide a visual indication of a status of the overload relay.

Abstract: The circuit device includes a first transmitting inductor, a first insulating layer, a first receiving inductor, and a second receiving inductor. The first transmitting inductor is constituted of a helical conductive pattern and receives a transmitted signal. The first receiving inductor is located in a region overlapping the first transmitting inductor through the first insulating layer. The first receiving inductor is constituted of a helical conductive pattern, and generates a received signal corresponding to the transmitted signal input to the first transmitting inductor. The second receiving inductor is connected in series to the first receiving inductor, and constituted of a helical conductive pattern. The second receiving inductor generates a voltage in an opposite direction to that generated by the first receiving inductor, in response to a magnetic field of the same direction.

Abstract: A portable electronic device and a transferring method of a circuit element thereof are provided. The portable electronic device comprises a main body and a circuit element. The main body has a shell and a control element by a print way. The circuit element is integrated with the shell by transferring and is electrically connected with the control element.

Abstract: A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.

Abstract: A circuit protection element and a circuit board with the circuit protection element are disclosed. The circuit protection element includes a metal base, and at least one opening slot located at the metal base. The metal base forms a positioning portion. One end of the metal base is fastened onto a circuit board. The bottom of the free end of the metal base contacts a conducting point located on the circuit board to make the circuit be in a conducting status. When the current is overloaded or the circuit is over-heated, the bottom of the free end of the metal base is heated so that the bottom of the free end of the metal base separates from the conducting point and the positioning portion is wedged with the circuit board. Thereby, the circuit becomes a broken circuit. The circuit protection element can prevent the electronic components from being burnt down.

Abstract: A semiconductor device and manufacturing method to effectively suppress the problem of mutual interaction occurring between an inductor element and wires positioned above the inductor element formed over the same chip. A semiconductor device includes a semiconductor substrate and a multi-wiring layer formed overlying that semiconductor substrate, and in which the multi-wiring layer includes: the inductor element and three successive wires and a fourth wire formed above the inductor element; and two shielded conductors at a fixed voltage potential and covering the inductor element as seen from a flat view, and formed between the inductor element and three successive wires and a fourth wire formed above the inductor element.

Abstract: A power conversion apparatus includes a switching circuit including semiconductor switches, and a main circuit capacitor connected between a DC power source and the switching circuit. The main circuit capacitor includes a capacitor element, first wiring members that connect the DC power source to the switching circuit, and second wiring members that connect the capacitor element to the switching circuit. The capacitor element, the first wiring members, and the second wiring members are received in a case.

Abstract: An embodiment of a power-supply module includes a molded package, power-supply components disposed within the package, and an inductor disposed within the package and over the power-supply components. For example, for a given output-power rating, such a power-supply module may be smaller, more efficient, and more reliable than, and may run cooler than, a power-supply module having the inductor mounted outside of the package or side-by-side with other components. And for a given size, such a module may have a higher output-power rating than a module having the inductor mounted outside of the package or side-by-side with other components.

Abstract: The present invention relates to an integrated power inserter, comprises: a housing; a voltage lowering and rectifying member; and a coupling member having a power input end, a radio frequency signal coupling circuit, a radio frequency signal input end and a radio frequency signal output end, wherein the radio frequency signal input end is input with a radio frequency signal and outputs a power signal, the radio frequency signal output end outputs a radio frequency signal being coupled to a television; with the mentioned structure of the integrated power inserter, a power inserter can be integrated in a power adaptor for simplifying wire layout and lowering production cost.

Abstract: A holder holds an electrical component having wire ends that act as electrical connections. The holder includes a body having a center part. The center part has a recess for holding the component. Side walls of the recess have slots for guiding wire ends of the component. The recess and the slots are open at a same side of the body.

Abstract: There is provided a variable device circuit according to the present invention, including: a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface of the substrate; at least one variable capacitor device formed on the first principal surface of the substrate; at least one variable inductor device formed on the first principal surface of the substrate; and wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate; wherein electrical connections among the devices can be selected by operation of the movable switch device, whereby achieving stable, low-loss circuit characteristics with lower manufacturing cost.

Abstract: An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 ?m greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

Abstract: A board comprises a cavity for placing an electronic component on a base, a pair of pads for mounting said electronic component, each of said pads is formed on said base, a pair of through holes piercing through said board from said base, each of said through holes includes a land, and wires which electrically connect said lands and said pads, respectively.

Abstract: Provided are a high voltage multi-layer ceramic capacitor (MLCC) that may enable a surface mounting, and may form a guide electrode between inner electrodes or between sealing electrodes to thereby prevent a decrease in an inner voltage, caused by a parasitic capacitance, and a director current (DC)-link capacitor module using the MLCC.

Abstract: An electrical assembly for a motor controller is disclosed that includes an electrical lead. The electrical lead has a conductive trace within an insulating material and that extends a length between first and second ends. An electrical pad is in electrical continuity with and extends from the conductive trace through the insulating material at the first end. The pad includes an aperture providing a securing feature. An electrical component is supported by and integral with the second end, in one example. The electrical component is in electrical continuity with the conductive trace at the second end. A bus bar provides a joint having a first cross-sectional area. The electrical lead is flexible and is removably secured to the joint by the securing feature to provide electrical continuity from a capacitor to the bus bar. The flexible electrical lead has a second cross-sectional area substantially less than the first cross-sectional area.

Abstract: An electronic device includes a body and an input device. The body includes a shell and a non-conductive rear cover. The shell defines an opening. The rear cover tightly covers the opening and defines a through hole. The input device includes a resistor, a wire, a non-conductive rotating plate, and a conducting member. The resistor and the wire both are discontinuous ring-shaped, and concentrically disposed on the rear cover surrounding the through hole. The rotating plate is rotatably inserted through the through hole. The conducting member is disposed on the rotating plate and connects the resistor and the wire. The conducting member is operable to move around the resistor and the wire such that a resistance between one end of the resistor and one end of the wire is changed.

Abstract: A capacitor mounting construction includes housing, a bracket and an urging member. The housing has a capacitor accommodating space configured to accommodate a capacitor and a wire accommodating space configured to accommodate a wire extended from the capacitor. The bracket is engaged with the housing, is configured to fix and electrically connect the wire to a conductive member in the wire accommodating space, and covers the capacitor accommodating space to define a capacitor accommodating chamber. The urging member is provided on an inner wall of the capacitor accommodating chamber, and is configured to urge the capacitor to contact another inner wall of the capacitor accommodating chamber.

Abstract: An electronic component includes a multi-layer substrate having an upper side and under side, and at least one integrated impedance converter. The electronic component also includes at least one chip component having external contacts. The at least one chip component is disposed on the upper side of the multi-layer substrate, and is electrically connected to the at least one integrated impedance converter.

Abstract: A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.

Abstract: An electronic apparatus that includes: a circuit board; a switch attached to the circuit board; an electronic part mounted on the circuit board; a wiring pattern extending between the switch and the electronic part; and a protrusion protruding from a surface of the wiring pattern, the protrusion being disposed adjacent to the switch on the circuit board and overlapping the wiring pattern.

Abstract: A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

Abstract: A testing method for a silicon interposer employs a test probe and an electrically conductive glass handler. The silicon interposer includes multiple interconnects that extend between the opposed major surfaces of the interposer, namely from a test side of the interposer to a conductive glass handler side of the interposer. On the glass handler side, the interposer includes a layer of patterned insulative resist with open regions at some interconnects on the glass handler side and remaining resist regions at other interconnects on the glass handler side. The interposer may include a conductive adhesive layer that couples together interconnects at the open regions on the glass handler side. In this manner, a probe may send a test signal from a first interconnect at one location on the test side of the interposer, through the first interconnect, through the conductive adhesive, through a second interconnect to another probe on the test side of the interposer.

Abstract: A signal filter module includes an electrically insulative housing having protruding blocks respectively protruded from the bottom edge of each of two opposite vertical sidewalls thereof and a wire groove defined between each two adjacent protruding blocks, metal terminals each having a base partially embedded in one of the vertical sidewalls of the electrically insulative housing and partially exposed to the outside of the associating vertical sidewall to provide a bonding surface and a bonding tip extended from one end of the base and suspending outside the electrically insulative housing for bonding to an external circuit board, and filter elements each having coils wound thereon with lead ends of the coils respectively inserted through the wire grooves of the electrically insulative housing and bonded to the bonding surfaces of the bases of the metal terminals.

Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

Abstract: A drive device control unit that controls a drive device including a rotating electrical machine, the drive device control unit includes a control substrate that controls the drive device; a switching element module that forms an inverter that drives the rotating electrical machine; a smoothing capacitor that smoothes an input power supply of the inverter; a first base having the switching element module fixed thereto; and a second base supported by the first base and having the smoothing capacitor fixed to a first surface of the second base, wherein the control substrate is fixed to a second surface of the second base opposite to the first surface having the smoothing capacitor fixed thereto.

Abstract: A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive devices conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.

Abstract: A Zener diode—capacitor combination wherein a Zener diode is mounted in the capacitor body and connected in parallel with the capacitor after the capacitor has been voltage tested. A welded strap or jumper wire completing the diode circuit or a connection of separate terminations during soldering may be used to complete the circuit.

Abstract: An electronic element packaging is provided, the unit is formed with a colloid layer in a predetermined shape, and a chipset is adhered and mounted inside the colloid layer and comprises a predetermined chip and a conductor so that the unit is packaged without any substrate, thereby the costs of substrate use and design being decreased when the unit is fabricated. No consideration of the difference of heat expansion coefficient of the chip from that of substrate is made, thereby the reliability being increased and the service life being prolonged.

Abstract: A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.

Abstract: An electronic device which enables easily providing a mounting orientation recognition mark thereon while being provided with, on a end surface thereof, input/output terminals surrounded by a ground pattern. A substrate is provided within a case main body. A ground is formed on the surface of the substrate. An output terminal, a power terminal, a clock terminal, a GND terminal and a mounting orientation recognition mark hole have been formed on the ground through pattern removal. The main portion of the substrate is exposed through an opening in the case and the tip end portions of the output terminal and the like are slightly protruded from the end surface of the case main body. The ground pattern on the substrate, the case main body and the like are electrically connected to the GND terminal and the entire component is shielded.

Abstract: Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.

Abstract: The present invention discloses a socket with power supply, comprising a housing having a upper cover and a lower cover which are connected together to form a receiving space; a transformer connected with an alternate current source through a plug protruding out of the first opening; at least a socket capable of outputting the alternate current; a rectifying circuit capable of rectifying the alternate current to direct current; and an output power plug coupled with the rectifying circuit and protruding out of the second opening through a power cord to output the direct current to an electronic device.

Abstract: A printed circuit board has an opening, and a multi-layer ceramic capacitor is disposed inside the opening and is coupled to the printed circuit board. The multi layer ceramic capacitor is coupled to the printed circuit board in a manner that a center of gravity of the multi-layer ceramic capacitor is at substantially the same level as a center of gravity of the printed circuit board.

Abstract: A glass ceramic composition includes a SrZrO3 ceramic and a Li2O—MgO—ZnO—B2O3—SiO2-based glass, wherein the Li2O—MgO—ZnO—B2O3—SiO2-based glass accounts for about 1 to about 12 weight percent of the total and includes Li2O in an amount in the range of about 3.5 to about 15 weight percent, MgO in an amount in the range of about 20 to about 50 weight percent, BaO in an amount in the range of about 0 to about 25 weight percent, CaO in an amount in the range of about 0 to about 10 weight percent, SrO in an amount in the range of about 0 to about 25 weight percent, B2O3 in an amount in the range of about 16 to about 29 weight percent, SiO2 in an amount in the range of about 11 to about 35 weight percent, ZnO in an amount in the range of about 5 to about 20 weight percent, and Al2O3 in an amount in the range of about 0 to about 15 weight percent, and the glass ceramic composition further includes a SrTiO3 ceramic in an amount in the range of about 0 to about 6 weight percent of the total.

Abstract: A high-temperature platform chip has at least three electrodes on an electrically insulating substrate constructed as a heating plate with a heat conductor on the back side.

Abstract: A mounting device for mounting a capacitor on a connector element includes a hollow body defining a continuous through-hole that axially penetrates the body for receiving and mounting the capacitor. The body has a lower region defining a lower through-hole portion with a dimension. The body further has a middle region defining a middle through-hole portion with a dimension that is smaller than the first through-hole dimension. Therefore, the middle region and the lower region define a first inner shoulder between them. The body further has an upper region defining an upper through-hole portion with a dimension that is smaller than the second through-hole dimension. The upper region and the middle region define a second inner between them.

Abstract: In a printed wiring board 10, an upper electrode connecting portion 52 penetrates through a capacitor portion 40 in top to bottom direction so that an upper electrode connecting portion first part 52a is not in contact with the capacitor portion 40, passes through an upper electrode connecting portion third part 52c provided at the upper portion of the capacitor portion 40, and then connects from the upper electrode connecting portion second part 52b to an upper electrode 42. Furthermore, a lower electrode connecting portion 51 penetrates through the capacitor portion 40 in top to bottom direction so that it is not in contact with the upper electrode 42 of the capacitor portion 40, but is in contact with a lower electrode 41.

Abstract: A method for discharging an electronic device on a substrate is provided. A metal pin mounted on a wire bonder is used to touch with a specific finger disposed on the substrate which is in electrical connection with the electronic device. As a result, the electric charge previously stored in the electronic device will be conducted to the wire bonder through the specific finger and metal pin thereby discharging the stored charge. Another method for discharging an electronic device on a substrate is also provided. A metal wire protruding out from the capillary of a wire bonder is heated to form a metal ball at the capillary. The capillary is moved to bring the metal ball into contact with the specific finger. As a result, the electric charge previously stored in the electronic device will thus can be discharged to the wire bonder. The present invention further provides a semiconductor package.

Abstract: The mounting board has a capacitor-forming sheet made from a valve metal, first and second board-forming structures, first and second electrodes, an extractor electrode, and a conductive polymer. The capacitor-forming sheet has an inner layer and a rough oxide film on at least one face of the inner layer. The first board-forming structure is provided on a face of the capacitor-forming sheet, and the second board-forming structure is provided on another face thereof on a side opposite to the first one. The first and second electrodes are isolated to each other and provided on a surface of at least one of the first and second board-forming structures. The extractor electrode and conductive polymer are provided inside at least one of the first and second board-forming structures. The extractor electrode electrically-connects the first electrode with the inner layer. The conductive polymer electrically-connects the second electrode with the rough oxide film.

Abstract: An energy storage device for storing energy for starting an internal combustion engine of a motor vehicle includes a DC-DC converter, a plurality of capacitors connected electrically to the DC-DC converter, and a housing for containing the DC-DC converter and the capacitors. The DC-DC converter converts a voltage provided by the motor vehicle's battery to a second voltage stored by the capacitors. During an engine start cycle, energy discharges from the capacitors to the starter motor of the engine, wherein the stored voltage of the capacitors provides energy to start the engine. The capacitors are recharged by the vehicle's battery. A thermally insulated barrier separates the DC-DC converter and the capacitors. The housing may be sized and shaped substantially as that of a standard motor vehicle battery, enabling the energy storage device to be installed within the motor vehicle as a substitute for one or more of the vehicle's batteries.

Abstract: A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.

Abstract: A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.

Abstract: A passive surface mount part such as a capacitor or a resistor is employed to attach a first substrate to a second substrate, or a semiconductor device to a substrate, for an electrical circuit assembly. Applicable forms of substrates include a printed circuit board such as a motherboard and a daughterboard, and applicable forms of semiconductor devices include an integrated circuit. In an aspect, a low profile attachment is provided forming a planar structure. Space is conserved, signal transmission is provided, and electrical performance is increased. In another aspect, a standoff is defined between the substrates setting the substrates apart a desired distance, compensating for any surface irregularities, increasing thermal separation, and increasing interconnect flexibility. As an application, the standoff defined between the substrates can be utilized for a structure such as optical glass structure to be situated between the substrates for use with an optical circuit assembly.

Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: In some embodiments, an array capacitor for decoupling multiple voltages is presented. In this regard, an array capacitor is introduced having two electrically isolated capacitor regions. Other embodiments are also disclosed and claimed.

Abstract: One embodiment includes an apparatus that includes an implantable device housing, a capacitor disposed in the implantable device housing, the capacitor including a dielectric comprising CaCu3Ti4O12 and BaTiO3, the dielectric insulating an anode from a cathode and pulse control electronics disposed in the implantable device housing and connected to the capacitor.

Abstract: An electronic component and an electronic-component production method in which the magnitude of a stray capacitance produced between adjacent outer electrodes is controllable. The electronic component includes a chip body and first to fourth outer electrodes. In the chip body, first and second coil block are sandwiched between magnetic substrates. Dielectric layers are interposed between the outer electrodes and the chip body such as to be away from exposed portions of coil patterns in the coil blocks. The dielectric layers have a width larger than a width of the outer electrodes, and a dielectric constant of the dielectric layers is set to be lower than the dielectric constant of the magnetic substrates.