Abstract: A combination run capacitor/positive temperature coefficient resistor/overload (CAP/PTCR/OL) module is described. The cover of the combination housing includes a capacitor compartment and terminal openings for receiving blade terminals of a run capacitor. The terminal openings in the cover align with blade receiving receptacles coupled to the PTCR start circuit. The blade terminals of a run capacitor are inserted into the receptacle openings and into electrical engagement with the blade receiving receptacles. The capacitor is supported and protected by a potting mixture filling the capacitor compartment.

Abstract: A filtering induction device is provided to improve the filter effect via the increase of an insertion loss resulting from stray capacitance. The induction device includes at least one core structure, and first and second flat coils that interlacing with each other. The first flat coil is used as an inductor, and the second flat coil is used as an electrode belonging to a capacitor formed between the circles of the first flat coil.

Abstract: Radio frequency identification tag devices with bridge circuit assemblies and methods for high-volume, low-cost production are disclosed. The bridge circuit assemblies and methods of the present invention can reduce the complexity of the RFID tag devices by providing a one-sided circuit design. The resonant frequency of the circuits formed on the devices may be tuned by severing selected connections to one or more tuning capacitor plates that form a part of the capacitor structure. Severing connections to the tuning capacitor plates changes the capacitance of the circuit that, in turn, changes the resonant frequency of the circuit. Further, the devices and methods of the present invention allow for the option of placing a die either on the antenna substrate or on the bridge circuit assembly.

Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.

Abstract: A capacitive vacuum measuring cell includes first and second ceramic housing bodies (1, 4) joined by an edge seal (3). A thin ceramic membrane (2) is supported between first and second housing bodies (1, 4) by the edge seal (3) at a small distance from the first housing body (1) creating a reference vacuum chamber (25) therebetween. An electrically conductive material (7) coats opposing surfaces of the first housing body (1) and the membrane (2) to form a capacitor. A measurement vacuum chamber (26) is provided between the membrane (2) and the second housing body (4). A port (5) communicates with the second housing body (4) to connect the measurement vacuum chamber (26) of the measuring cell to the medium to be measured. The membrane (2) is made from an Al2O3 slurry that is sintered in a first heating step, cooled, and then reheated to smooth the membrane.

Abstract: An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.

Abstract: The invention relates to a capacitor module for a converter. The capacitor module contains a capacitor which can be fastened to a base frame or to a cooling body by means of lateral, mechanical holding devices. In addition, the capacitor comprises at least one additional mechanical holding device for fastening at least one electronic terminal of the converter and of at least one measuring sensor, especially of a current transformer and/or of a voltage transformer. The inventive capacitor module makes it possible to realize a construction of a converter which is compact and has a reduced weight.

Abstract: A header assembly for use in an optical transmitter. The header assembly includes a header, a laser mounted on the header, and at least one passive electronic component mounted on the header, wherein the passive electronic component is one from the group of: an inductor, a capacitor, and a resistor.

Abstract: A method for producing an on-chip signal transforming device. The method includes providing a substrate, and laying a first conductive layer above the substrate, wherein the first conductive layer has a plurality of interleaved inductors. The method then includes laying a second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.

Abstract: A laminated chip component including: alternately laminated conductive patterns (13,43,63) and insulating sheets (11,41,61); through-holes (12,42,62) which are provided in the insulating sheets and connect top layer conductive patterns to bottom layer conductive patterns; auxiliary conductive patterns (15,45,65) which are provided on the top faces of the conductive patterns at positions facing the through-holes provided in adjacent insulating sheets; and conductors (14,64) which are provided in the through-holes. The auxiliary conductive patterns can be substituted by conductor sections (16,66) which are provided in the insulating sheets at the positions facing the through-holes provided in adjacent insulating sheets. And, a method for manufacturing a laminated chip component is also disclosed.

Abstract: A multilayer LC composite component is constructed for allowing for free and easy setting of an attenuation pole formed at a frequency higher than the central frequency to adjust the frequency characteristics of the LC composite component. In the multilayer LC composite component, inductor via-holes are connected in the direction in which insulation layers are stacked to constitute first to third pillar inductors. In the axial directions of the first and third inductors, input and output lead patterns are electrically connected to midpoints of the first and third inductors. A distance between a ground pattern and each of positions at which the input and output lead patterns are electrically connected to the first and third inductors is shorter than the length of each of the first and third inductors.

Abstract: A method for forming terminations on the opposite ends of a chip component includes placing a chip component in a cavity with one end of the chip component exposed. Termination conductive material is then deposited on the exposed end of the chip component and the component is removed from the cavity and reversed. Termination material is then deposited on the other exposed end. One modification of the invention includes extending the chip components completely through holes in a plate so that the opposite ends of the chip component are exposed. The termination material is then placed on the opposite ends of the chip component.

Abstract: A microwave-frequency microcircuit assembly includes an integrated circuit structure having a circuit ground. A support structure includes a grounded metallic carrier, and a dielectric substrate having a top surface, a bottom surface contacting the carrier, and a capacitor via extending through the dielectric substrate. A metallization on the top surface of the substrate includes an input metallization trace to the integrated circuit structure, an output metallization trace from the integrated circuit structure, and a substrate ground plane upon which the integrated circuit structure is affixed. A thin-film capacitor resides in the capacitor via and is electrically connected between the substrate ground plane and the carrier. An electrical resistor is connected between the circuit ground of the integrated circuit structure and the carrier to self-bias the integrated circuit structure.

Abstract: A shielding and/or grounding strip includes a strip of material defining a first longitudinal side, a second longitudinal side, a top surface, and a mounting surface, with the first longitudinal side forming a hook member. At least one barb element extends from the mounting surface of the strip of material and at least one contact flap is formed on the mounting surface of the strip of material.

Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking. A reinforcement beam is located laterally across the bottom of the package to provide mechanical strength for the case.

Abstract: A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.

Abstract: An electronic power device including at least one sub-system supporting power modules, a capacitor battery connectable to an electrical power supply and being connected to the power modules. The capacitor battery includes one or more capacitors which when a plurality are provided are disposed in parallel between first and second connection plates. Each sub-system has a first face supporting at least one first power module and a second face for supporting at least one second power module and wherein the first plate is connected to each first power module and the second plate is connected to each second power module.

Abstract: A multilayer high frequency electronic component having a greatly reduced resistance component of a signal line which functions as an inductor is constructed such that the signal line includes at least two conductor patterns provided on the surface of insulation sheets. The at least two conductor patterns have substantially the same shape and different pattern widths. The at least two conductor patterns are arranged to extend continuously across an insulation layer.

Abstract: A laser trimmable electronic device (1) has a housing (2) and a partially enclosed component (3) at least partially enclosed inside the housing (2) and electrically coupled to external connector terminals (4,5). The device (1) has a laser trimmable component (6) electrically coupled the external connector terminals (4,5), wherein at least part of the trimmable component (6) is mounted to an outer surface (7) of the housing (2).

Abstract: A surface mountable electronic device comprising a body incorporating an electronic device and having a substantially planar mounting surface and another surface extending from the mounting surface, at least one electrical lead extending from the device, and a terminal of conductive material having a first portion fixedly received in the body and extending through the other surface, a second portion extending from the first portion and electrically connected to the lead and a third portion extending along the mounting surface for providing electrical connection to a circuit. A recess preferably is provided in the other surface of the body for receiving the first portion of the terminal.

Abstract: A discharge lamp assembly has a discharge lamp, and an ignition device for the discharge lamp, the ignition device including at least one inductive component and at least one capacitive component, at least a part of one of the components being surrounded by at least a part of the other of the components, the ignition device further having a housing in which the components are arranged and which is connectable with the discharge lamp.

Abstract: The present invention relates to a chip coil for use in the electronic appliance or such other equipment, and intended to present a chip coil of an excellent mounting capability. Recesses (6) are provided only in the top and bottom surfaces of main body (1) having a square pillar shape, and in the bottom surface of main body (1) an insulation resin (4) is provided in the recess (6) to cover coil (2) within the space of recess (6).

Abstract: A low-value, low-noise, high-Q, high-tolerance inductor is fabricated using multichip module technology, such as high density interconnect (HDI) technology. The inductor has overlapping sections of conductors which contain high magnetic fields between them to reduce the amount of radiated energy and circuit shielding required. The spacing between conductor sections of the inductor is adjustable in order to provide a predetermined amount of field cancellation and thereby achieve a specific inductance value. The inductor shape provides uniformity of current density across the conductor cross section, thus maximizing the Q value of the inductor.

Abstract: A tubular shaped device for insulating an electrical component such as, but not limited to, a dry film capacitor. Along one edge of the device is a rectangular shaped cutout for receiving radially extending leads of the electrical component. The electrical component is secured within the device by spreading the device open, placing the electrical component within the spread-open device, positioning the leads of the electrical component within the cutout and finally permitting the device to once again assume its tubular shape.

Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.

Abstract: An outside-insulated electronic element of a chip type has a body including an electronic element and a plate electrode which extends from the body of the element and is bent along a side surface and a bottom surface of the body of the element. The body of the electronic element including the plate electrode has a trapezoidal shape or a bow or arcuate shape. In this way, the gaps between the electronic elements when placed in a disk package can be reduced to a minimum.

Abstract: A small toroidal inductor is mounted by inserting a high valued resistor or a ceramic coil form into the central hole of the toroid. The fine leads of the inductor are then soldered to the much stiffer leads of the part that has been inserted. These stiffer leads may be bent in any desired way, and will hold their shape. This makes insertion easier and is strong enough to withstand the necessary amounts of shock and vibration. The toroid may be glued or otherwise affixed with an adhesive to the resistor or coil form.

Abstract: A method of and apparatus for identifying an item to or with which a radio frequency identification tag is attached or associated is provided. The tag is made of a nonconductive material to have a flat surface on which a plurality of circuits are pressed, stamped, etched or otherwise positioned. Each circuit has a capacitance and an inductance. The capacitance is formed from the capacitive value of a single capacitor. The inductance is formed from the inductive value of a single inductor coil having two conductive ends each connected to the capacitor. Each tag is associated with a binary number established from a pattern of binary ones and zeros which depend on the resonance or nonresonance of each circuit, respectively and the circuits position with respect to the binary table. The binary number may be converted to a decimal number using the binary table for conversion.

Abstract: An RFI through-let for screening signals transmitted between different components, for instance circuit boards, of which one component is arranged in a screened space, includes signal-transmission through-let capacitors which are mounted in a screen plate intended to be positioned in a rectangular opening in the side-wall of the screened space. The screen plate is comprised of a front part which includes a rectangular, generally flat plate having tongues or tabs disposed along the sides thereof and also having a central, rectangular hollow, and a holding part which is soldered firmly in the vicinity of the hollow of the front part. The holding part includes a flat plate whose long sides are bent to form guide flanges which extend perpendicularly downwards away from the front part, along a first line corresponding to the long sides of the opening, and along a second line downwardly of the first line are further bent inwardly towards one another.

Abstract: An electrical circuit has a substrate and a surface mount capacitor having a connector pad at each end. The substrate has two separate contact pads that are both soldered to the same connector pad on the capacitor. Two further contact pads on the substrate are soldered to the other connector pad on the capacitor. The contact pads on the substrate are connected to tracks that extend to plated-through holes and are electrically connected to one another at a point remote from the capacitor.

Abstract: A method of and apparatus for identifying an item to or with which a radio frequency identification tag is attached or associated is provided. The tag is made of a nonconductive material to have a flat surface on which a plurality of circuits are pressed, stamped, etched or otherwise positioned. Each circuit has a capacitance and an inductance. The capacitance is formed from the capacitive value of a single capacitor. The inductance is formed from the inductive value of a single inductor coil having two conductive ends each connected to the capacitor. Each tag is associated with a binary number established from a pattern of binary ones and zeros which depend on the resonance or nonresonance of each circuit, respectively and the circuits position with respect to the binary table. The binary number may be converted to a decimal number using the binary table for conversion.