With Conductive Support Mounting Patents (Class 363/144)
  • Patent number: 10439061
    Abstract: A front surface electrode common to a plurality of unit cells is provided substantially all over an active region of a semiconductor element. A plurality of electrode pads on the front surface electrode are closer to the outer peripheral portion side than the central portion of the active region. Different wires are joined to substantially the center of each electrode pad. The active region is divided into two or more segments so that the segments are aligned along the path of current flowing through the front surface electrode, and unit cells different in conduction ability are disposed respectively in each segment. Unit cells lowest in conduction ability are in the first segment farthest from junctions of the wires and electrode pads, and the unit cells are disposed so that the farther apart from the junctions of the wires and electrode pads, the lower in conduction ability the unit cells are.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: October 8, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Takeyoshi Nishimura
  • Patent number: 9960591
    Abstract: In a multilayer printed circuit board (circuit board 20) having an inverter (switching elements 22) mounted thereto, only a second wiring pattern P2 arranged downstream of a semiconductor relays 24 and able to shut off an electric power supply and a third wiring pattern P3 arranged upstream of a shunt resistor 27 and able to detect an overcurrent are placed in adjacent layers in a manner to face each other, and thus, even if the mutually facing portions (laminated portion) of the these two wiring patterns P2 and P3 are subjected to short circuit, an overcurrent caused by the short circuit can be detected by the shunt resistor 27 and the electric power supply to the switching elements 22 can be shut off by the switching elements 22, so that overheating at the second and third wiring patterns P2 and P3 can be avoided.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: May 1, 2018
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hiroyuki Saito, Haruhiko Fujita
  • Patent number: 9936615
    Abstract: A power pole inverter is provided. The power pole inverter includes a housing assembly, a capacitor assembly, a number of arm assemblies, a number of heat sinks, and a support assembly. The housing assembly includes a number of sidewalls. The housing assembly sidewalls defining an enclosed space. The capacitor assembly is coupled to the housing assembly. Each arm assembly includes a plurality of electrical components and a number of electrical buses. Each the electrical bus includes a body with terminals, each the terminal structured to be coupled to, and in electrical communication with, the capacitor assembly, each arm assembly including a neutral terminal. Each arm assembly is coupled to, and in electrical communication with, the capacitor assembly. The support assembly includes a non-conductive frame assembly. The support assembly is structured to support each the heat sink in isolation.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: April 3, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Jonathan Charles Crouch, Irving Albert Gibbs, Wesley Byron Johnson, Paul Thomas Murray, Ron Carl Schueneman
  • Patent number: 9812876
    Abstract: A wall socket includes a socket housing, an output terminal, a power converter circuit and a load detection circuit. The output terminal is arranged at a side of the socket housing and configured to output a DC output voltage. The power converter circuit is arranged in the socket housing and configured to convert an input voltage to the DC output voltage according to a control signal. The load detection circuit is configured to receive an identification signal outputted by an electronic device when the electronic device is connected to the output terminal, and output the control signal according to the identification signal to adjust a voltage level of the DC output voltage.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: November 7, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Kun-Chi Lin, Chung-Chieh Cheng, Chun-Chih Chen
  • Patent number: 9362205
    Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: June 7, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Takashi Shibasaki, Hidefumi Saito, Takahisa Makino, Masanori Shimizu, Daisuke Sasaki
  • Patent number: 9363894
    Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: June 7, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Takashi Shibasaki, Hidefumi Saito, Takahisa Makino, Masanori Shimizu, Daisuke Sasaki
  • Patent number: 9270102
    Abstract: An example multilayered bus bar includes, among other things, a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is sandwiched between the first and third conductive layers. A polarity of the second conductive layer is different than a polarity of the first and third conductive layers.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: February 23, 2016
    Assignee: Ford Global Technologies, Inc.
    Inventor: Jun Kikuchi
  • Patent number: 9130095
    Abstract: Provided are a substrate for a power module having a uniform parallel switching characteristic and a power module including the same. The substrate for the power module includes a plurality of areas on which input terminals are mounted, an area on which an output terminal is mounted, a plurality of areas on which devices are mounted, and an area on which a plurality of control pins are mounted. The plurality of areas on which the devices are mounted are bilaterally symmetric about the area on which the plurality of control pins are mounted. The plurality of areas on which the input terminals are mounted, respectively, are provided into three areas spaced apart from each other and bilaterally symmetric to each other. The plurality of areas on which the device are mounted are bilaterally symmetric about the area on which the control pins are mounted.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: September 8, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Che-Heung Kim, Young-hun Byun, Seong-woon Booh
  • Patent number: 9117688
    Abstract: Provided is a semiconductor device including: a first MOS-FET (21) joined to a first base plate (11) via solder (61); a second MOS-FET (22) joined to a second base plate (12) via solder (64); a first lead (31) joining the first base plate (11) and the second MOS-FET (22); and a second lead (32) joining the second MOS-FET (22) and a current path member (13) that gives and receives current flowing through the MOS-FETs (21, 22) to and from the outside. The second base plate (12) is more rigid than both the leads (31, 32), a boundary line (D-D) intersects the second base plate (12) without intersecting both the leads (31, 32), the boundary line including a gap portion (52) along which both the MOS-FETs (21, 22) are opposed to each other, extending in the direction in which both the MOS-FETs (21, 22) are not opposed to each other.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: August 25, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Oga, Masaki Kato, Tsuyoshi Sugihara
  • Patent number: 9093923
    Abstract: A three-level converter includes at least one phase bridge arm, each including an upper-half and a lower-half bridge arm circuit modules. The upper-half bridge arm circuit module includes a first and a second switch units that are in series connection, and a first diode unit. The lower-half bridge arm circuit module includes a third and a fourth switch units that are in series connection, and a second diode unit. The first and second diode units are connected to the neutral point of the capacitor unit; the second and third switch units are connected to the alternating-current terminal; The first and the fourth switch unit is respectively connected to the positive terminal and negative terminal of the direct-current bus; the capacitor unit is connected to the direct-current bus between the positive and negative terminals. The two modules are disposed side by side and facing each other.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: July 28, 2015
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Jian-Ping Ying, Shao-Cai Ma, Hong-Jian Gan, Sen-Lin Wen
  • Patent number: 9078372
    Abstract: A power converting device includes a first substrate, a driving module, and a converting module. The first substrate is inserted into a main plate. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction, the second axial direction is perpendicular to the main plate. The driving module is located at one side of the first substrate and electrically connected to the first substrate. The converting module is located at the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to a length of the first substrate in the first axial direction, and a width of the converting module is smaller than the length of the first substrate in the first axial direction.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: July 7, 2015
    Assignee: CHICONY POWER TECHNOLOGY CO., LTD
    Inventors: Chih-Hsiung Huang, Yung-Hung Hsiao, Hao-Te Hsu, Chi-Chang Ho
  • Patent number: 9065322
    Abstract: An inverter device including a plurality of switching elements that convert electric power between DC power and AC power, a base plate that includes a surface on which the switching elements are placed, AC terminals through which AC power is input and output to and from an external device and which are electrically connected to the switching elements, and a capacitor that smoothes DC power. The AC terminals are disposed to protrude from the base plate perpendicular to the surface in a first reference direction. The capacitor is disposed in a rectangular area so that long sides of the rectangle are parallel to the first reference direction in plan view, and is set adjacent to a base disposition area, in which the base plate and the AC terminals are disposed in a second reference direction that is a direction perpendicular to the first reference direction.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: June 23, 2015
    Assignee: AISIN AW CO., LTD.
    Inventors: Kohei Ito, Tatsuya Kondo, Tomoyuki Suzuki
  • Patent number: 9042147
    Abstract: A power inverter includes a power semiconductor module that includes a power semiconductor device, a control circuit board that outputs a control signal used for controlling the power semiconductor device, a driver circuit board that outputs a driving signal used for driving the power semiconductor device, a conductive metal base plate arranged in a space between the driver circuit board and the control circuit board in which a fine and long opening portion is formed, wiring that connects the driver circuit board and the control circuit board through the opening portion and delivers the control signal to the driver circuit board, and an AC busbar that is arranged on a side opposite to the metal base plate through the driver circuit board and delivers an AC current output from the power semiconductor module to a drive motor. At least a portion of the AC busbar that faces the opening portion extends in a direction directly running in a longitudinal direction of the fine and long opening portion.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: May 26, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Akira Ishii, Keisuke Fukumasu
  • Publication number: 20150131354
    Abstract: According to one embodiment, an AC-DC converter includes a first printed wiring board, a planar transformer, a plurality of primary members, and a plurality of secondary members. The planar transformer has a primary coil, a secondary coil, a second printed wiring board and a core. The primary members are mounted on the first printed wiring board, and are electrically connected to the primary coil. The secondary members are mounted on the second printed wiring board, and are electrically connected to the secondary coil.
    Type: Application
    Filed: July 28, 2014
    Publication date: May 14, 2015
    Inventors: Yuji Nakajima, Shigeyasu Iwata
  • Publication number: 20150117077
    Abstract: An AC/DC power bank distribution management system is provided, which includes a power supply unit, a power distribution board and a power distribution unit. The power source includes the alternating current (AC) or direct current (DC) that is converted into a low-voltage DC by a high efficiency power supply unit. Then, the power distribution board adjusts the transmission mode for providing a direct current with safe, stable and low-voltage. Thus, for the AC/DC power bank distribution management system, the power consumption value refers to a real power consumption usage value in the server system operator which can provide a fair electricity data for the telecommunications system operators and the server system to save the electricity expenses for the server system.
    Type: Application
    Filed: June 26, 2014
    Publication date: April 30, 2015
    Inventors: Tang-Hsien Huang, Hsien-Tang Weng, Che-Yu Lin
  • Patent number: 8988861
    Abstract: The power converter includes a power conversion section which configures a circuit for power conversion, a power bus bar extending from the power conversion section, a terminal block, and a current sensor measuring current flowing in the power bus bar. The terminal block includes a mounting surface to which a terminal portion of the power bus bar is mounted. The mounting surface faces a direction substantially perpendicular to an arrangement direction in which the power conversion section and the terminal block are arranged. The current sensor is located at a side of a bottom surface on the opposite side of the mounting surface in the terminal block. The power bus bar includes: a sensor-surrounded portion surrounded by the current sensor; and an outer surface faced portion located between the sensor-surrounded portion and the terminal portion along an outer surface on the opposite side of the power conversion section.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: March 24, 2015
    Assignee: Denso Corporation
    Inventor: Akio Yokota
  • Patent number: 8947899
    Abstract: An apparatus and method for mounting additional components, such as capacitors, to a DC bus of a motor drive. In one aspect, a motor drive includes an enclosure defining an interior, an input for receiving input electrical power from a power source, an output for providing output electrical power to a load, an intermediate DC circuit including a DC bus located in the interior of the enclosure, and a modular capacitor bus electrically coupled with the intermediate DC circuit, the modular capacitor bus including at least one capacitor mounted thereto. The modular capacitor bus is mountable as a unit to the DC bus.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: February 3, 2015
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Robert Allen Savatski, Michael Loth, Lee Gettelfinger
  • Patent number: 8942020
    Abstract: A phase leg for a three-level power converter includes a heat sink device that includes a first surface and a second surface opposite the first surface. The phase leg also includes a first portion including at least one semiconductor switching device coupled to the first surface. The phase leg further includes a second portion including at least one semiconductor switching device coupled to the second surface.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: January 27, 2015
    Assignee: General Electric Company
    Inventor: Mark Eugene Shepard
  • Patent number: 8934277
    Abstract: In some aspects of the invention, multiple insulating substrates each mounting thereon at least one each of at least four semiconductor devices that form at least one of three-level electric power inverter circuits and a base plate on the one surface of which a plurality of the insulating plates are arranged are provided. On the one surface of the base plate, at least four regions are established and multiple insulating substrates are arranged to be distributed so that at least one each of the at least four semiconductor devices is arranged in each of the four regions established on the base plate. This can make the semiconductor devices arranged to be distributed so that heat generating sections determined according to the operation mode of the semiconductor system comes to be partial to disperse generated heat, by which a semiconductor system is provided which can enhance heat dispersion efficiency.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: January 13, 2015
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Shuangching Chen, Hiroaki Ichikawa
  • Patent number: 8902623
    Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: December 2, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Fusanori Nishikimi, Kinya Nakatsu
  • Publication number: 20140321184
    Abstract: The invention relates to a synchronous rectifier (16) for integration into a power source (10) in order to provide a direct current, in particular in a cube or ashlar-shaped unit of a heavy-current transformer (12), comprising circuit elements (24), an actuation circuit (17) for actuating the circuit elements (24) and a supply circuit (48), wherein a printed circuit board (35) with conductor tracks and connection surfaces is provided for receiving electronic components.
    Type: Application
    Filed: October 31, 2012
    Publication date: October 30, 2014
    Applicant: FRONIUS INTERNATIONAL GMBH
    Inventors: Bernhard Artelsmair, Christoph Schultschik, Johannes Neuboeck, Stefan Wolfsgruber
  • Patent number: 8863869
    Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: October 21, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
  • Patent number: 8839509
    Abstract: Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: September 23, 2014
    Assignee: DENSO CORPORATION
    Inventors: Noriyuki Kakimoto, Masao Yamada
  • Patent number: 8830693
    Abstract: A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: September 9, 2014
    Assignee: Medtronic, Inc.
    Inventor: Mark R. Boone
  • Patent number: 8824161
    Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: September 2, 2014
    Assignee: Medtronic, Inc.
    Inventors: Mohsen Askarinya, Mark R. Boone, Andreas A. Fenner, Lejun Wang, Kenneth Heames
  • Patent number: 8811050
    Abstract: A relay-connecting member (16) has relay terminals (32), each of which is fit-connected to an output electrode (28) and a male tab (30) of an output terminal (14). With this structure, by simply inserting the output electrode (28) and the male tab (30) of the output terminal (14) into the relay-connecting member (16), it is possible to easily electrically connect the output electrode (28) and the male tab (30) of the output terminal (14) through the relay terminal (32).
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: August 19, 2014
    Assignees: Toyota Jidosha Kabushiki Kaisha, Sumitomo Electric Industries, Ltd., Kohshin Electric Corp., Autonetworks Technologies, Ltd., Sumitomo Wiring Sytems, Ltd
    Inventors: Yutaka Hotta, Shiro Nishida, Yuki Higashimori
  • Patent number: 8737074
    Abstract: A modular direct-current power conversion system is applied to receive a DC input voltage and output a DC output voltage. The modular direct-current power conversion system includes a main board and a plurality of DC power conversion modules. The main board includes a primary surface, a voltage input terminal, a voltage output terminal, a plurality of insertion regions, and a plurality of pin holders. When the DC power conversion module is inserted on the main board, the DC input voltage is inputted via the voltage input terminal to the DC power conversion module. The DC power conversion module converts the DC input voltage into a DC output voltage, and the DC output voltage is outputted via the voltage output terminal.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: May 27, 2014
    Assignee: Delta Electronics, Inc.
    Inventors: Ping-Long Yang, Chia-Hsiang Li
  • Patent number: 8705258
    Abstract: A communication device for use with a power distribution module. The communication device allows multiple different DMX universes to be handled over the same cable that also handles power distribution. A front of house module is provided for powering consoles and receiving DMX inputs from the consoles. Two different consoles can be powered and provide their inputs, and either console can be used to control any or all of the universes.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: April 22, 2014
    Assignee: Production Resource Group, LLC
    Inventors: Charles Reese, Rusty Brutsche, James Bornhorst
  • Patent number: 8675379
    Abstract: A power-converting apparatus, such as a power module, may include a base plate (16), a first direct current (DC) bus and a second DC bus (22, 24). A power semiconductor component (18, 20) may be electrically coupled to one of the buses, and may be disposed on a substrate (12, 14) physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor (50) may be coupled across the first and second DC buses, and at least second and third capacitors (52) may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path.
    Type: Grant
    Filed: August 8, 2011
    Date of Patent: March 18, 2014
    Assignee: General Electric Company
    Inventors: Joseph Lucian Smolenski, Michael Schutten, Eladio Clemente Delgado, Richard Alfred Beaupre
  • Patent number: 8665596
    Abstract: Power switching circuitry has a heat absorbing structure, and a heat conductive substrate having power switching components on a first surface and a second surface adjacent to the heat absorbing structure. Electrically conductive members, comprising first and second members, are on the first surface and extend along a first axis orthogonal to the heat conductive substrate. The second portion is more remote from the heat conductive substrate, and has a smaller cross-sectional area than, the first portion to define a shoulder region orthogonal to the first axis. A circuit board is located on the shoulder regions, with the second portions extending through the circuit board. An urging mechanism urges the circuit board against the shoulder regions, whereby the electrically conductive members provide a current path between the heat conductive substrate and the circuit board, and urge the heat conductive substrate into thermal contact with the heat absorbing structure.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: March 4, 2014
    Assignee: PG Drives Technology Limited
    Inventor: Richard Peter Brereton
  • Patent number: 8611113
    Abstract: A Voltage Source Converter has a series connection of switching assemblies, in which each switching assembly has an electrically conducting plate member carrying a plurality of semiconductor chips each having at least a semiconductor device of turn-off and a free-wheeling diode connected in parallel therewith. Said chips are connected in parallel with each other by each being connected by at least one individual conductor member to a said plate member of an adjacent switching assembly of said series connection. Each switching assembly has a mechanical switch configured to be open under normal operation of the switching assembly and configured to enable connection of said plate member of the switching assembly to the plate member of an adjacent switching assembly for bypassing said semiconductor chips of the switching assembly to which the mechanical switch belongs in the case of occurrence of a short circuit current through a semiconductor chip of the switching assembly.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: December 17, 2013
    Assignee: ABB Technology AG
    Inventor: Gunnar Asplund
  • Patent number: 8599554
    Abstract: A power converter is installed in a casing attached beneath the floor of an electric vehicle. The power converter includes a capacitor unit and a power semiconductor module housed in a hermetically sealed part of the casing closed by a cover for closing an access port, and a cooler installed in an exposed part, the cooler cooling heat generated from the power semiconductor module. The power converter includes a bus bar that electrically connects the power semiconductor module and the capacitor unit, and a conductive bar that electrically connects the capacitor unit and the bus bar. The conductive bar is drawn from the upper surface of the capacitor unit, and is bent into a crank.
    Type: Grant
    Filed: July 6, 2009
    Date of Patent: December 3, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Ryotaro Harada, Tetsuya Takahashi
  • Patent number: 8570782
    Abstract: A power supply circuit includes a voltage regulating circuit, a control circuit, and a switch circuit. The voltage regulating circuit receives an AC voltage signal from a live wire output terminal and converts the AC voltage signal to a control signal. The control circuit receives the control signal and turns on or turns off an electronic connection from the AC voltage signal to the switch circuit according to the control signal. The switch circuit is configured to be powered on and output the AC voltage signal when the electronic connection from the AC voltage signal to the switch circuit is turned on.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: October 29, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ling-Yu Xie, Xing-Ping Xie
  • Patent number: 8564996
    Abstract: In a semiconductor module, a high-potential side conductor includes a wide section on which the high-potential side switching element is mounted, a high-potential side terminal coupled with a high potential source, and a narrow section extending from the wide section to the high-potential side terminal in a first direction. The wide section is wider than the narrow section in a second direction perpendicular to the first direction. The wide section has a first side and a second side opposite to the first side in the second direction. A distance between the first side of the wide section and a low-potential side conductor is shorter than a distance between the second side of the wide section and the low-potential side conductor. The narrow section extends from a portion of the wide section closer to the first side than the second side.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: October 22, 2013
    Assignee: Denso Corporation
    Inventors: Takashi Masuzawa, Toshihiro Fujita, Hiroshi Taki
  • Patent number: 8537550
    Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: September 17, 2013
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Masato Higuchi, Yasuhiko Kawanami, Katsushi Terazono, Koji Higashikawa, Akira Sasaki, Takayuki Morihara, Takashi Aoki, Tetsuya Ito, Yukihisa Nakabayashi, Tasuku Isobe, Kiyonori Koguma
  • Publication number: 20130229130
    Abstract: A power converter includes a mounting substrate, a one-piece-type connector including an input connector and an output connector, the input connector and the output connector being formed in one-piece and arranged side by side; and a case made of an electrically conductive material. The one-piece-type connector includes lead terminals configured to connect the input cable and the output cable to a power converting circuit and an electrically conductive ground connection portion electrically connected to the case through an electrically conductive member. The ground connection portion includes a shield surface arranged to extend along at least a portion of a side surface of the output connector.
    Type: Application
    Filed: February 5, 2013
    Publication date: September 5, 2013
    Applicant: PANASONIC CORPORATION
    Inventor: Kenichi TAKAMATSU
  • Patent number: 8493762
    Abstract: A power semiconductor module includes semiconductor elements of a first system constituting each of arms in a circuit of the first system, semiconductor elements of a second system constituting each of arms in a circuit of the second system, a plurality of DC electrode conductors including a common DC electrode conductor joined to the semiconductor elements of the first and second systems, and a plurality of AC electrode conductors joined to the respective semiconductor elements of the first and second systems. Each of the semiconductor elements of the first and second systems is interposed between the DC electrode conductor and AC electrode conductor.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: July 23, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Gou Ninomiya, Toshiharu Obu, Kazuhiro Ueda, Yoshiyuki Shimizu, Shinichi Baba
  • Publication number: 20130182481
    Abstract: A nanoscale electron shuttle with two elastically mounted conductors positioned within a gap between conductors produces asymmetrical electron conduction between the conductors when the conductors receive an AC signal to provide for rectification, detection and/or power harvesting.
    Type: Application
    Filed: February 18, 2013
    Publication date: July 18, 2013
    Applicant: Wisconsin Alumni Research Foundation
    Inventor: Wisconsin Alumni Research Foundation
  • Patent number: 8462531
    Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: June 11, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Fusanori Nishikimi, Kinya Nakatsu
  • Patent number: 8422235
    Abstract: The present invention provides a vehicle power module and a power converter including a power semiconductor element (328), a plurality of connecting conductors (371U, 372U, 373U) for transmitting current to the power semiconductor element (328), and a metallic base (304) upon which the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted; and the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted upon the metallic base (304) so as to form a looped current path. Desirably, the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, 373U) are arranged so as to form two or more looped current paths.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: April 16, 2013
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Katsunori Azuma, Mutsuhiro Mori, Kinya Nakatsu, Seiichi Hayakawa, Fusanori Nishikimi
  • Patent number: 8406026
    Abstract: The power conversion apparatus includes a power conversion circuit including parallel-connected pairs of a high-side switching element and a low-side switching element connected in series, high-side driver circuits to drive the high-side switching elements, low-side driver circuits to drive the low-side switching elements, and a transformer to supply voltages to drive the high-side switching and low-side switching elements to the high-side and low-side driver circuits. The high-side switching elements are mounted in a row along a first direction on a wiring board, and the low-side switching elements are mounted in a row along the first direction on the wiring board side by side with the row of the high-side switching elements. The transformer is mounted on the wiring board on the side of the row of the high-side switching elements opposite to the row of the low-side switching elements.
    Type: Grant
    Filed: September 8, 2010
    Date of Patent: March 26, 2013
    Assignee: Denso Corporation
    Inventors: Junichi Fukuta, Tsuneo Maebara, Yusuke Shindo, Ryotaro Miura
  • Patent number: 8395364
    Abstract: The reliability of a semiconductor device is improved. A package of a semiconductor device internally includes a first semiconductor chip and a second semiconductor chip in which power MOS•FETs are formed and a third semiconductor chip in which a control circuit controlling the first and second semiconductor chips is formed. The first to third semiconductor chips are mounted on die pads respectively. Source electrode bonding pads of the first semiconductor chip on a high side are electrically connected with a first die pad of the die pads via a metal plate. On a top surface of the die pad 7D2, a plated layer formed in a region where the second semiconductor chip is mounted, and another plated layer formed in a region where the metal plate is joined are provided and the plated layers are separated each other with a region where no plated layer is formed in between.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: March 12, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Yukihiro Sato, Tomoaki Uno
  • Patent number: 8376069
    Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: February 19, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
  • Publication number: 20130028001
    Abstract: The power converter includes a power conversion section which configures a circuit for power conversion, a power bus bar extending from the power conversion section, a terminal block, and a current sensor measuring current flowing in the power bus bar. The terminal block includes a mounting surface to which a terminal portion of the power bus bar is mounted. The mounting surface faces a direction substantially perpendicular to an arrangement direction in which the power conversion section and the terminal block are arranged. The current sensor is located at a side of a bottom surface on the opposite side of the mounting surface in the terminal block. The power bus bar includes: a sensor-surrounded portion surrounded by the current sensor; and an outer surface faced portion located between the sensor-surrounded portion and the terminal portion along an outer surface on the opposite side of the power conversion section.
    Type: Application
    Filed: July 26, 2012
    Publication date: January 31, 2013
    Applicant: DENSO CORPORATION
    Inventor: Akio YOKOTA
  • Patent number: 8354816
    Abstract: An automotive power converter is provided. The automotive power converter includes a substrate, first and second electronic devices on the substrate, at least one conductive member coupled to the substrate and having a first device portion electrically coupled to the first electronic device and a second device portion electrically coupled to the second electronic device, and first and second terminals electrically coupled to the at least one conductive member. When a power supply is coupled to the first and second terminals, current flows from the first terminal to the first device portion substantially in a first direction and from the second terminal to the second device portion substantially in a second direction. The first direction has a first component and the second direction has a second component opposing the first component.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: January 15, 2013
    Assignee: GM Global Technology Operations, LLC
    Inventors: Terence G. Ward, Edward P. Yankoski
  • Patent number: 8345458
    Abstract: In order to reduce parasitic inductance of a main circuit in a power supply circuit, a non-insulated DC-DC converter is provided having a circuit in which a power MOS•FET for a high-side switch and a power MOS•FET for a low-side switch are connected in series. In the non-insulated DC-DC converter, the power MOS•FET for the high-side switch is formed by a p channel vertical MOS•FET, and the power MOS•FET for the low-side switch is formed by an n channel vertical MOS•FET. Thus, a semiconductor chip formed with the power MOS•FET for the high-side switch and a semiconductor chip formed with the power MOS•FET for the low-side switch are mounted over the same die pad and electrically connected to each other through the die pad.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: January 1, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Masaki Shiraishi, Noboru Akiyama, Tomoaki Uno, Nobuyoshi Matsuura
  • Patent number: 8339823
    Abstract: A Voltage Source Converter having at least one phase leg connected to opposite poles of a direct voltage side of the converter and comprising a series connection of switching elements including at least one energy storing capacitor and configured to obtain two switching states, namely a first switching state and a second switching state, in which the voltage across said at least one energy storing capacitor and a zero voltage, respectively, is applied across the terminals of the switching element, has semiconductor chips of said switching elements arranged in stacks comprising each at least two semiconductor chips. The converter comprises an arrangement configured to apply a pressure to opposite ends of each stack.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: December 25, 2012
    Assignee: ABB Technology AG
    Inventors: Björn Jacobson, Gunnar Asplund
  • Patent number: 8300443
    Abstract: A series connection circuit of IGBTs and an AC switch are contained in one package. The series connection circuit is connected between the positive and negative terminals of a DC power source, and the AC switch is connected between a neutral point of the DC power source and a series connection point between the IGBTs. Straight conductor strips can be used to connect terminals on the package to the DC power source, thereby reducing inductance and thus also reducing voltage spikes.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: October 30, 2012
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Satoki Takizawa
  • Patent number: 8300439
    Abstract: Method and apparatus for monitoring, measuring and recording the operating values of each of a plurality of inter-connected AC PV modules and performing a diagnostic analysis, including comparing the those operating values to each other and to operating values recorded at an earlier time to determine laminate degradation and the performance-attenuating effect of temperature, soiling, shading, and snow cover on the modules.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: October 30, 2012
    Assignee: GreenRay Inc.
    Inventors: Ruel Davenport Little, Zachary Adam King
  • Patent number: 8289681
    Abstract: This disclosure discloses a control unit comprising a plurality of controllers, each controller having a bus bar portion having: a left and a right bus bar holder; an upper and an lower common bus bar; an upper and an lower rotating bus bar; a upper and a lower connecting body; wherein each bus bar holder has protrusions forming a gap, the upper and the lower rotating bus bar are configured to be changed between a first mode that the upper and the lower rotating bus bar engages rotatably with the left bus bar holder, and a second mode that the upper and the lower rotating bus bar are tightened and secured to the left bus bar holder, and the upper and the lower rotating bus bar of one controller in the second mode is connected in close contact with the upper and the lower common bus bar of another controller.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: October 16, 2012
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Hiroki Kanaya, Takahiro Shimozu