Abstract: Examples of the disclosure include a UPS comprising an output to be coupled to a load, a first converter leg to provide a first voltage to the output and including at least one of a first relay or fuse, a second converter leg in parallel with the first converter leg including at least one of a second relay or fuse and configured to provide a second voltage to the output out of phase with the first converter leg providing the first voltage signal, current sensors coupled to the first and second converter legs, respectively, and configured to provide a first signal indicative of a current in the first converter leg and a second signal indicative of a current in the second converter leg, respectively, and at least one controller to receive the signals, determine a current difference between the converter legs based on the signals, and decrease the current difference.

Abstract: A capacitor has at least two capacitor units, wherein a first capacitor unit and a second capacitor unit of the at least two capacitor units have opposite polarities.

Abstract: An apparatus comprises a first induction section comprising a first core and a first coil on the first core. A second induction section comprises a second core and a second coil on the second core. The first core comprises rail extensions, where at least two of the rail extensions extend from opposite ends of the first core. The second core comprises shoe portions located at respective ones of the rail extensions, where a gap is provided between each of the rail extensions and respective ones of the shoe portion. The second induction section is configured to move relative to the first induction section in a path along the extensions. The first induction section is configured to induce current in the second induction section, including when the second core moves relative to the first core along the extensions, to provide a contactless induction coupling between the first induction section and the second induction section.

Abstract: In order to cause an output to be continued while protecting a DC-DC converter including a temperature detector from overheating, without stopping an operation or excessively reducing an output, even when an abnormality has occurred in a cooler or the temperature detector has failed, a controller sets current values at which a control using droop characteristics is started in a multiple of stages in accordance with temperature values, and carries out the control using droop characteristics by switching the current value in accordance with a temperature detected by the temperature detector.

Abstract: A semiconductor module includes: an insulating heat dissipation sheet; a semiconductor device provided on the heat dissipation sheet; a lead frame including a lead terminal and a die pad which are formed integrally; a wire connecting the lead frame to the semiconductor device and constituting a main current path; and a mold resin scaling the heat dissipation sheet, the semiconductor device, the lead frame and the wire, wherein the lead terminal is led out from the mold resin, the heat dissipation sheet is in direct contact with an undersurface of the die pad, and the wire is bonded to the die pad directly above a contact part provided between the die pad and the heat dissipation sheet.

Abstract: An advantageous effect of a low-pass filter that reduces high-frequency noise can be obtained by including an input terminal that extends from a front surface to a rear surface of a multilayer circuit board including a double-sided circuit board; a first wiring conductor having an end connected to the input terminal on the rear surface of the multilayer circuit board; a first via that extends from an other end of the first wiring conductor to the front surface of the multilayer circuit board; a second wiring conductor having an end connected to the first via on the front surface of the multilayer circuit board; and a first input capacitor disposed on the second wiring conductor; by being conductive due to the input terminal and the first via being configured in series; and including the first input capacitor.

Abstract: A linear transmission device with capability of wireless power supply includes a transmission mechanism and a wireless power supply module. The transmission mechanism includes a long shaft part and a moving part. The long shaft part defines an axis. The moving part is disposed on the long shaft part in a manner that the moving part is movable along the axis. The wireless power supply module includes a magnet-providing part disposed on the long shaft part for providing a magnetic field and an induction coil disposed on the moving part. A direction of the magnetic field is parallel to the axis. A normal vector of the induction coil is parallel to the direction of the magnetic field. When the moving part is moved along the axis, a current is induced in the induction coil through variation of the magnetic field.

Abstract: A wireless powering device comprising a first coil assembly including a first coil and a second coil assembly including a second coil. The second coil is adapted to be electromagnetically coupled with the first coil. One of the first coil and the second coil is used as a transmitting coil and another of the first coil and the second coil is used as a receiving coil. The second coil is movable with respect to the first coil in a direction perpendicular to a direction of magnetic lines generated by the transmitting coil.

Abstract: A modular power distribution apparatus and method includes a frame defined by a first set of parallel supports and a second set of parallel supports, the second set of parallel supports connecting the first set of parallel supports, the frame defining a generally planar assembly defining a first side and a second side opposite the first side, as well as a set of components extending from a side of the frame and operably coupled to the frame. The set of components includes a set of power modules.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q1, Q2, and Q3 are arranged in a direction along which the first side B1 extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B1 of the substrate B, and wherein the fourth to the sixth control signal terminals Q4, Q5, and Q6 are arranged in a direction along which the second side B2 extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B2 of the substrate B.

Abstract: An improved system for connecting a DC bus cable and a remote motor drive includes a capacitance module and an extension module that may each be mounted adjacent to the remote motor drive. The capacitance module includes a first DC bus connector and a second DC bus connector. The first DC bus connector includes a terminal block configured to receive a pair of conductors for the DC bus. The first DC bus connector further includes a pair of intermediate bus bars where each of the intermediate bus bars are connected at a first end to the terminal block and at a second end to a circuit board contained within the capacitance module. Traces on the circuit board are routed between the second ends of the intermediate bus bars and the second DC bus connector. The second DC bus connector is configured to be connected to DC bus bars.

Abstract: The invention relates to an electronic module (1), in particular an electronic power module for hybrid vehicles or electric vehicles, comprising: a printed circuit board (10) with at least one contact point (11); an electronic unit (20), in particular a power electronic unit, with at least one connection point (21), the connection point (21) of the electronic unit (20) being electrically connected to the contact point (11) of the printed circuit board (10) by means of at least one electrically conductive contact element (30); and a heat sink (40) with a top (41), the electronic unit (20) bearing indirectly and/or directly against the top (41) of the heat sink (40). According to the invention, at least one heat-conducting element (50) is arranged between the contact element (30) and the heat sink (40) in such a manner that a thermally conductive connection is produced between the contact element (30) and the heat sink (40).

Abstract: Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

Abstract: A cooling structure according to the present invention is provided with: a base material formed with a cooling water flow passageway; a pipe which includes a first layer formed on an outer surface of the base material, and a second layer formed on the outside of the first layer; and a plate having the pipe cast therein. The base material is configured from a highly thermally conductive first material. The first layer is configured from a heat-resistant second material. The second layer is configured from a third material having high affinity with the second material. The plate is configured from a highly thermally conductive fourth material. The second material and the third material respectively have high affinity with the fourth material.

Abstract: An apparatus comprises a first induction section comprising a first core and a first coil on the first core. A second induction section comprises a second core and a second coil on the second core. The first core comprises rail extensions, where at least two of the rail extensions extend from opposite ends of the first core. The second core comprises shoe portions located at respective ones of the rail extensions, where a gap is provided between each of the rail extensions and respective ones of the shoe portion. The second induction section is configured to move relative to the first induction section in a path along the extensions. The first induction section is configured to induce current in the second induction section, including when the second core moves relative to the first core along the extensions, to provide a contactless induction coupling between the first induction section and the second induction section.

Abstract: Power generation control devices (4) of respective power generators (1) transmit conduction rates of field coils (101) of the respective power generators (1) to an external control device (5), while the external control device (5) obtains an average value of the conduction rates, obtains a field duty limiting command value for limiting the conduction rate of the field coil (101) determined by the power generation control device (4) based on the average value, and transmits the field duty limiting command value to the power generation control device (4). With this operation, the power generation control device (4) limits power generation amounts of the respective power generators (1) based on the command value, to thereby equalize the power generation amounts of the respective power generators (1).

Abstract: The present invention relates to a device for the contact-free inductive transfer of electrical energy from a first, preferably stationary system of a shifting device into a second system of the shifting device, which can be moved relative to the first system, comprising a magnetic circuit of a primary core, which is assigned to the first system and onto which a primary coil is wound, and a secondary core, which is assigned to the second system and onto which a secondary coil is wound. The secondary core is arranged so as to be capable of being shifted relative to the primary core along a shifting path, which preferably runs parallel to a shifting path of the shifting device. The primary core extends at least along the entire length of the shifting path. According to the invention, provision is made for the primary core to comprise at least one primary core gap, which is embodied along the entire longitudinal extension of the primary core.

Abstract: An induction heating power supply apparatus includes a smoothing section to smooth DC power and an inverter section to convert the smoothed DC power into AC power. The inverter section has first and second modules, each having serially connected switching devices. Output bus bars are interposed between the first and second modules. The smoothing section has first bus bars connected to a DC power supply section and the first module, a capacitor connected to the first bus bars, second bus bars connected to the DC power supply section and the second module, and another capacitor connected to the second bus bars. The first and second bus bars extend parallel to the output bus bars. The first module is interposed between the first bus bars and the output bus bars. The second module is interposed between the second bus bars and the output bus bars.

Abstract: A vehicle electrical power system includes a phase module assembly of a multi-phase inverter. The phase module assembly includes first and second flat laminated busbars extending in orthogonal planes. The phase module assembly also includes one or more transistors that convert direct current into one phase of a multi-phase alternating current of the multi-phase inverter, and to output the phase of the multi-phase alternating current to the load. The phase module assembly also includes one or more capacitors conductively coupled with the internal positive and negative terminal connectors and with the external positive and negative bushings configured to be conductively coupled with the power source of direct current. The assembly can be useful for vehicles because the components of the system are configured to carry large amounts of current in a more reliable and sustainable manner.

Abstract: An apparatus comprises a first induction section comprising a first core and a first coil on the first core. A second induction section comprises a second core and a second coil on the second core. The first core comprises rail extensions, where at least two of the rail extensions extend from opposite ends of the first core. The second core comprises shoe portions located at respective ones of the rail extensions, where a gap is provided between each of the rail extensions and respective ones of the shoe portion. The second induction section is configured to move relative to the first induction section in a path along the extensions. The first induction section is configured to induce current in the second induction section, including when the second core moves relative to the first core along the extensions, to provide a contactless induction coupling between the first induction section and the second induction section.

Abstract: An improved system for connecting a DC bus cable and a remote motor drive includes a capacitance module and an extension module that may each be mounted adjacent to the remote motor drive. The capacitance module includes a first DC bus connector and a second DC bus connector. The first DC bus connector includes a terminal block configured to receive a pair of conductors for the DC bus. The first DC bus connector further includes a pair of intermediate bus bars where each of the intermediate bus bars are connected at a first end to the terminal block and at a second end to a circuit board contained within the capacitance module. Traces on the circuit board are routed between the second ends of the intermediate bus bars and the second DC bus connector. The second DC bus connector is configured to be connected to DC bus bars.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

Abstract: An inverter system control (ISC) module is provided. The ISC module includes a housing having an upper cavity, a lower cavity, a fluid inlet, a fluid outlet, and a divider wall extending in a plane between the fluid inlet and the fluid outlet. The inverter system further includes a power module secured within the upper cavity to define an upper fluid chamber with the divider wall, and a capacitor assembly secured within the lower cavity to define a lower fluid chamber with the divider wall.

Abstract: A front surface electrode common to a plurality of unit cells is provided substantially all over an active region of a semiconductor element. A plurality of electrode pads on the front surface electrode are closer to the outer peripheral portion side than the central portion of the active region. Different wires are joined to substantially the center of each electrode pad. The active region is divided into two or more segments so that the segments are aligned along the path of current flowing through the front surface electrode, and unit cells different in conduction ability are disposed respectively in each segment. Unit cells lowest in conduction ability are in the first segment farthest from junctions of the wires and electrode pads, and the unit cells are disposed so that the farther apart from the junctions of the wires and electrode pads, the lower in conduction ability the unit cells are.

Abstract: In a multilayer printed circuit board (circuit board 20) having an inverter (switching elements 22) mounted thereto, only a second wiring pattern P2 arranged downstream of a semiconductor relays 24 and able to shut off an electric power supply and a third wiring pattern P3 arranged upstream of a shunt resistor 27 and able to detect an overcurrent are placed in adjacent layers in a manner to face each other, and thus, even if the mutually facing portions (laminated portion) of the these two wiring patterns P2 and P3 are subjected to short circuit, an overcurrent caused by the short circuit can be detected by the shunt resistor 27 and the electric power supply to the switching elements 22 can be shut off by the switching elements 22, so that overheating at the second and third wiring patterns P2 and P3 can be avoided.

Abstract: A power pole inverter is provided. The power pole inverter includes a housing assembly, a capacitor assembly, a number of arm assemblies, a number of heat sinks, and a support assembly. The housing assembly includes a number of sidewalls. The housing assembly sidewalls defining an enclosed space. The capacitor assembly is coupled to the housing assembly. Each arm assembly includes a plurality of electrical components and a number of electrical buses. Each the electrical bus includes a body with terminals, each the terminal structured to be coupled to, and in electrical communication with, the capacitor assembly, each arm assembly including a neutral terminal. Each arm assembly is coupled to, and in electrical communication with, the capacitor assembly. The support assembly includes a non-conductive frame assembly. The support assembly is structured to support each the heat sink in isolation.

Abstract: A wall socket includes a socket housing, an output terminal, a power converter circuit and a load detection circuit. The output terminal is arranged at a side of the socket housing and configured to output a DC output voltage. The power converter circuit is arranged in the socket housing and configured to convert an input voltage to the DC output voltage according to a control signal. The load detection circuit is configured to receive an identification signal outputted by an electronic device when the electronic device is connected to the output terminal, and output the control signal according to the identification signal to adjust a voltage level of the DC output voltage.

Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).

Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.

Abstract: An example multilayered bus bar includes, among other things, a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is sandwiched between the first and third conductive layers. A polarity of the second conductive layer is different than a polarity of the first and third conductive layers.

Abstract: Provided are a substrate for a power module having a uniform parallel switching characteristic and a power module including the same. The substrate for the power module includes a plurality of areas on which input terminals are mounted, an area on which an output terminal is mounted, a plurality of areas on which devices are mounted, and an area on which a plurality of control pins are mounted. The plurality of areas on which the devices are mounted are bilaterally symmetric about the area on which the plurality of control pins are mounted. The plurality of areas on which the input terminals are mounted, respectively, are provided into three areas spaced apart from each other and bilaterally symmetric to each other. The plurality of areas on which the device are mounted are bilaterally symmetric about the area on which the control pins are mounted.

Abstract: Provided is a semiconductor device including: a first MOS-FET (21) joined to a first base plate (11) via solder (61); a second MOS-FET (22) joined to a second base plate (12) via solder (64); a first lead (31) joining the first base plate (11) and the second MOS-FET (22); and a second lead (32) joining the second MOS-FET (22) and a current path member (13) that gives and receives current flowing through the MOS-FETs (21, 22) to and from the outside. The second base plate (12) is more rigid than both the leads (31, 32), a boundary line (D-D) intersects the second base plate (12) without intersecting both the leads (31, 32), the boundary line including a gap portion (52) along which both the MOS-FETs (21, 22) are opposed to each other, extending in the direction in which both the MOS-FETs (21, 22) are not opposed to each other.

Abstract: A three-level converter includes at least one phase bridge arm, each including an upper-half and a lower-half bridge arm circuit modules. The upper-half bridge arm circuit module includes a first and a second switch units that are in series connection, and a first diode unit. The lower-half bridge arm circuit module includes a third and a fourth switch units that are in series connection, and a second diode unit. The first and second diode units are connected to the neutral point of the capacitor unit; the second and third switch units are connected to the alternating-current terminal; The first and the fourth switch unit is respectively connected to the positive terminal and negative terminal of the direct-current bus; the capacitor unit is connected to the direct-current bus between the positive and negative terminals. The two modules are disposed side by side and facing each other.

Abstract: A power converting device includes a first substrate, a driving module, and a converting module. The first substrate is inserted into a main plate. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction, the second axial direction is perpendicular to the main plate. The driving module is located at one side of the first substrate and electrically connected to the first substrate. The converting module is located at the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to a length of the first substrate in the first axial direction, and a width of the converting module is smaller than the length of the first substrate in the first axial direction.

Abstract: An inverter device including a plurality of switching elements that convert electric power between DC power and AC power, a base plate that includes a surface on which the switching elements are placed, AC terminals through which AC power is input and output to and from an external device and which are electrically connected to the switching elements, and a capacitor that smoothes DC power. The AC terminals are disposed to protrude from the base plate perpendicular to the surface in a first reference direction. The capacitor is disposed in a rectangular area so that long sides of the rectangle are parallel to the first reference direction in plan view, and is set adjacent to a base disposition area, in which the base plate and the AC terminals are disposed in a second reference direction that is a direction perpendicular to the first reference direction.

Abstract: A power inverter includes a power semiconductor module that includes a power semiconductor device, a control circuit board that outputs a control signal used for controlling the power semiconductor device, a driver circuit board that outputs a driving signal used for driving the power semiconductor device, a conductive metal base plate arranged in a space between the driver circuit board and the control circuit board in which a fine and long opening portion is formed, wiring that connects the driver circuit board and the control circuit board through the opening portion and delivers the control signal to the driver circuit board, and an AC busbar that is arranged on a side opposite to the metal base plate through the driver circuit board and delivers an AC current output from the power semiconductor module to a drive motor. At least a portion of the AC busbar that faces the opening portion extends in a direction directly running in a longitudinal direction of the fine and long opening portion.

Abstract: According to one embodiment, an AC-DC converter includes a first printed wiring board, a planar transformer, a plurality of primary members, and a plurality of secondary members. The planar transformer has a primary coil, a secondary coil, a second printed wiring board and a core. The primary members are mounted on the first printed wiring board, and are electrically connected to the primary coil. The secondary members are mounted on the second printed wiring board, and are electrically connected to the secondary coil.

Abstract: An AC/DC power bank distribution management system is provided, which includes a power supply unit, a power distribution board and a power distribution unit. The power source includes the alternating current (AC) or direct current (DC) that is converted into a low-voltage DC by a high efficiency power supply unit. Then, the power distribution board adjusts the transmission mode for providing a direct current with safe, stable and low-voltage. Thus, for the AC/DC power bank distribution management system, the power consumption value refers to a real power consumption usage value in the server system operator which can provide a fair electricity data for the telecommunications system operators and the server system to save the electricity expenses for the server system.

Abstract: The power converter includes a power conversion section which configures a circuit for power conversion, a power bus bar extending from the power conversion section, a terminal block, and a current sensor measuring current flowing in the power bus bar. The terminal block includes a mounting surface to which a terminal portion of the power bus bar is mounted. The mounting surface faces a direction substantially perpendicular to an arrangement direction in which the power conversion section and the terminal block are arranged. The current sensor is located at a side of a bottom surface on the opposite side of the mounting surface in the terminal block. The power bus bar includes: a sensor-surrounded portion surrounded by the current sensor; and an outer surface faced portion located between the sensor-surrounded portion and the terminal portion along an outer surface on the opposite side of the power conversion section.

Abstract: An apparatus and method for mounting additional components, such as capacitors, to a DC bus of a motor drive. In one aspect, a motor drive includes an enclosure defining an interior, an input for receiving input electrical power from a power source, an output for providing output electrical power to a load, an intermediate DC circuit including a DC bus located in the interior of the enclosure, and a modular capacitor bus electrically coupled with the intermediate DC circuit, the modular capacitor bus including at least one capacitor mounted thereto. The modular capacitor bus is mountable as a unit to the DC bus.

Abstract: A phase leg for a three-level power converter includes a heat sink device that includes a first surface and a second surface opposite the first surface. The phase leg also includes a first portion including at least one semiconductor switching device coupled to the first surface. The phase leg further includes a second portion including at least one semiconductor switching device coupled to the second surface.

Abstract: In some aspects of the invention, multiple insulating substrates each mounting thereon at least one each of at least four semiconductor devices that form at least one of three-level electric power inverter circuits and a base plate on the one surface of which a plurality of the insulating plates are arranged are provided. On the one surface of the base plate, at least four regions are established and multiple insulating substrates are arranged to be distributed so that at least one each of the at least four semiconductor devices is arranged in each of the four regions established on the base plate. This can make the semiconductor devices arranged to be distributed so that heat generating sections determined according to the operation mode of the semiconductor system comes to be partial to disperse generated heat, by which a semiconductor system is provided which can enhance heat dispersion efficiency.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: The invention relates to a synchronous rectifier (16) for integration into a power source (10) in order to provide a direct current, in particular in a cube or ashlar-shaped unit of a heavy-current transformer (12), comprising circuit elements (24), an actuation circuit (17) for actuating the circuit elements (24) and a supply circuit (48), wherein a printed circuit board (35) with conductor tracks and connection surfaces is provided for receiving electronic components.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another.

Abstract: A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.

Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

Abstract: A relay-connecting member (16) has relay terminals (32), each of which is fit-connected to an output electrode (28) and a male tab (30) of an output terminal (14). With this structure, by simply inserting the output electrode (28) and the male tab (30) of the output terminal (14) into the relay-connecting member (16), it is possible to easily electrically connect the output electrode (28) and the male tab (30) of the output terminal (14) through the relay terminal (32).

Abstract: A modular direct-current power conversion system is applied to receive a DC input voltage and output a DC output voltage. The modular direct-current power conversion system includes a main board and a plurality of DC power conversion modules. The main board includes a primary surface, a voltage input terminal, a voltage output terminal, a plurality of insertion regions, and a plurality of pin holders. When the DC power conversion module is inserted on the main board, the DC input voltage is inputted via the voltage input terminal to the DC power conversion module. The DC power conversion module converts the DC input voltage into a DC output voltage, and the DC output voltage is outputted via the voltage output terminal.