Abstract: A power converter of the present invention is connected between a direct current power source and controls power to a load by switching equipment. The converter is equipped with a first conductor for connecting a negative pole of the power converter and the switching equipment, and a second conductor for connecting a housing of the power converter and the negative pole of the power converter to the first conductor through a resistor.

Abstract: A bus bar system with an assembly unit having a base plate with side limbs and fixing items which are connected to the assembly unit. The assembly unit forms a receiving element for a bus bar holder and bus bars which are covered with cover elements and/or adapters for peripheral devices. The covers and/or adapters are mechanically connected to the bus bars by plug-in receiving elements and/or locking receiving elements and the adapters are also electrically connected to the bus bars. An assembly unit, which can be produced and mounted at low cost without impeding functional requirements, is provided and the assembly unit forms locking receiving elements together with retaining flanges, which protrude at a distance on the outer sides of the side limbs, and fixing flanges, wherein bar-shaped fixing items can be inserted into and/or locked inside the receiving elements.

Abstract: Systems and apparatus are provided for an inverter module for use in a vehicle. The inverter module comprises a first electrical base and a second electrical base each having an electrically conductive mounting surface, wherein the electrical bases are physically distinct and electrically coupled. A first semiconductor switch has a surface terminal that is coupled to the electrically conductive mounting surface of the first electrical base. A second semiconductor switch has a surface terminal that is coupled to the electrically conductive mounting surface of the first electrical base. A first semiconductor diode and a second semiconductor diode each have a surface terminal, the surface terminals are coupled to the electrically conductive mounting surface of the second electrical base. The first semiconductor switch and first semiconductor diode are antiparallel, and the second semiconductor switch and second semiconductor diode are antiparallel.

Abstract: A power converter apparatus includes a substrate 22 on which switching elements Q, Q1 to Q6 are mounted, positive and negative terminal interconnection members 27, 28 mounted on the substrate, and a capacitor 17 having a positive terminal 17a connected to the main body of the positive terminal interconnection member 27 and a negative terminal 17b connected to the main body of the negative terminal interconnection member 28. The interconnection members each have a plate-like main body 27a, 28a that is located above and parallel to the substrate 22. The main bodies of the interconnection members are stacked to be close to each other while being electrically insulated from each other. Each of the positive terminal interconnection member and the negative terminal interconnection member further includes a plate-like extension 27b, 28b that extends from the corresponding main body toward the substrate, and a terminal portion 27c, 28c that extends from the extension and is joined to the substrate.

Abstract: The object of the present invention is to reduce parasitic inductance of a main circuit in a power supply circuit. The present invention provides a non-insulated DC-DC converter having a circuit in which a power MOS*FET for a high-side switch and a power MOS*FET for a low-side switch are connected in series. In the non-insulated DC-DC converter, the power MOS*FET for the high-side switch is formed by a p channel vertical MOS*FET, and the power MOS*FET for the low-side switch is formed by an n channel vertical MOS*FET. Thus, a semiconductor chip formed with the power MOS*FET for the high-side switch and a semiconductor chip formed with the power MOS*FET for the low-side switch are mounted over the same die pad and electrically connected to each other through the die pad.

Abstract: The object of the present invention is to reduce parasitic inductance of a main circuit in a power supply circuit. The present invention provides a non-insulated DC-DC converter having a circuit in which a power MOS•FET for a high-side switch and a power MOS•FET for a low-side switch are connected in series. In the non-insulated DC-DC converter, the power MOS•FET for the high-side switch is formed by a p channel vertical MOS•FET, and the power MOS•FET for the low-side switch is formed by an n channel vertical MOS•FET. Thus, a semiconductor chip formed with the power MOS•FET for the high-side switch and a semiconductor chip formed with the power MOS•FET for the low-side switch are mounted over the same die pad and electrically connected to each other through the die pad.

Abstract: A power line adapter and its controlling method to be operated in a power-saving mode are disclosed. The power line adapter includes a power-transmitting module for generating a DC supply voltage and a data-transmitting module for transmitting data. Furthermore, the data-transmitting module at least includes a power line communication circuit and an Ethernet physical layer transceiver. The controlling method comprises steps of: monitoring a link signal generated by the Ethernet physical layer transceiver when the power line adapter is operated in an active mode; and, disconnecting the DC supply voltage to the power line communication circuit and entering the power-saving mode if the link signal indicates a disconnection over a first time period.

Abstract: Disclosed is a monitoring and/or control device (1) having an assembly of system modules (Si) in the form of field bus coupler modules, supply modules and/or input/output modules, which are arranged adjacent to one another and have terminal contacts in order to connect a system bus (4) and/or a voltage supply terminal of a system module (Si) to the subsequent system module (Si+1). At the end of the assembly of system modules (Si), a bridge module (B) is provided opposite a field bus coupler (S1) for coupling the system bus (4) to a field bus (7) and/or opposite a voltage supply module (S2) for feeding a supply voltage for the connected system modules (Si) for the redundant voltage supply of the system modules (Si) adjoining the bridge module (B) and/or for providing the system bus (4) for the system modules (Si) adjoining the bridge module (B) if a system module (Si) is removed from the sequence of system modules (Si).

Abstract: A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

Abstract: Power supply equipment includes a power converter and connector adapters for coupling between the converter and various appliances. The connector adapters bear respective adapter indicators. A particular connector adapter, bearing a corresponding adapter indicator, is chosen for mating with a particular appliance. The power converter generates selectable output voltages which are identified by respective converter indicators. The power converter output voltage is selected so that the converter indicator matches the indicator on the adapter chosen for the particular appliance.

Abstract: One aspect of the present invention concerns an inverter for converting a direct current into an alternating current. In one aspect, in order to provide an inverter which can be repaired more quickly and more reliably at the location of use, an inverter is of an at least partially modular structure, with releasably installed modules and connecting lines releasably mounted to the modules.

Abstract: By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor said first conductor and second conductor are connected connected to said wide conductor; and a cooler to which through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Abstract: A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.

Abstract: A circuit assembly and package incorporates a front cover with power contacting blades extending from a front surface thereof for electrical engagement in a receptacle having a standard peripheral dimension. A housing is attached to the front cover and extends perpendicularly therefrom. The housing contains an electrical circuit connected to the power contacting blades which is contained on a plurality of circuit boards mounted substantially perpendicular to the front cover. The housing and front cover create a footprint less than the peripheral dimension of the receptacle. A connecting cable extends from the housing and is connected to the electrical circuit.

Abstract: A programmable power supply for providing a regulated DC output power is disclosed. The power supply provides the output power to any one of a plurality of electronic devices adapted for receiving the output power at an operational voltage or an operational current. The power supply receives a programming signal to maintain the output power at the operational voltage or operational current associated with a particular selected electronic device. Accordingly, by varying the programming signal, the power supply can be programmed to provide output power to any one of several electronic devices having differing input power requirements.

Abstract: A power cable having a commonly configured interface at either end of the cable is provided. The power cable is used to connect a power source to a power inverter or to provide power from the power inverter to a device. The power cable has two ends each provided with a commonly configured interface. The commonly configured interface may be a plug or a plug receptacle. A plurality of different adapters for various power sources or devices may be coupled to the commonly configured interface. The adapters may be provided with a corresponding interface that plugs into or is received by the commonly configured interface at an end of the cable.

Abstract: A power converter of the present invention is connected between a direct current power source and controls power to a load by switching equipment. The converter is equipped with a first conductor for connecting a negative pole of the power converter and the switching equipment, and a second conductor for connecting a housing of the power converter and the negative pole of the power converter to the first conductor through a resistor.

Abstract: A current distributor includes a common, uninterrupted first main busbar as a main current supply and a number of current distributor modules which are each associated with a respective circuit breaker and can be disposed in a row along the main busbar. The current distributor module or each current distributor module has a first connection line for supplying current to a load circuit. The current distributor module or each current distributor module has a housing, a slot formed on a front side of the housing for plugging on an associated circuit breaker, and a first channel which passes through the housing in a transverse direction for accommodating the first main busbar. A first contact opening of the slot corresponds to the first channel and a second contact opening of the slot corresponds to a housing receptacle for a connection socket of the first connection line.

Abstract: Inverter bus structures, assemblies and associated methods are disclosed herein. One embodiment of the disclosure, for example, is directed to a power inverter including an inverter module for converting DC power to AC power, a printed circuit board carrying a capacitor array, a DC power source, and a bus structure. The bus structure is physically coupled each of the inverter module and the printed circuit board, and the bus structure electrically couples each of the inverter module, the printed circuit board to the DC power source.

Abstract: A high-voltage device having a measuring resistor, also called a bleeder, is plunged into an electrical field whose voltage varies in the same way as the voltage along the bleeder. To achieve this, the capacitive elements are distributed in two rows, each row defining a plane. Along each row, the potentials are growing. The space between the two rows is sufficient for the bleeder to be placed therein. The bleeder is formed either by series-connected resistors or by a screen-printed resistor.

Abstract: A power unit device which can be made small, with which special measures of plant and labor at the time of assembly are unnecessary, and of which assembly is easy and universality in its manufacturing aspect is excellent. The power unit device has a heat sink having a first heat-receiving part and formed on the opposite side from this a second heat-receiving part; a power module, in firm contact with the first heat-receiving part, containing a power semiconductor element for performing DC-AC conversion and/or AC-DC conversion for one phase; a smoothing condenser, in firm contact with the second heat-receiving part, for suppressing ripple current of the power semiconductor element; and fixing means passing through the power module, the heat sink and the smoothing condenser.

Abstract: A mobile power adapter having an electric socket for power input, multiple adapter ports for power output, a power supply unit for converting input power supply into desired output power supply for output through the adapter ports, and a monitoring unit for monitoring the temperature inside the mobile power adapter and the operation status of the power supply unit on electric voltage, electric current, power consumption status and total wattage for enabling the monitoring data to be displayed on a display screen on the outside wall of a housing of the mobile power adapter.

Abstract: A power converter of the present invention is connected between a direct current power source and controls power to a load by switching equipment. The converter is equipped with a first conductor for connecting a negative pole of the power converter and the switching equipment, and a second conductor for connecting a housing of the power converter and the negative pole of the power converter to the first conductor through a resistor.

Abstract: The invention is directed to an apparatus (1) for accommodating a plurality of individual inverters (2), comprising a rack, the individual inverters (2) being removably mountable to the side elements of said rack, said rack having at least one terminal block (10) for receiving cables for current supply and evacuation.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: The object of the present invention is to reduce parasitic inductance of a main circuit in a power supply circuit. The present invention provides a non-insulated DC-DC converter having a circuit in which a power MOS• FET for a high-side switch and a power MOS•FET for a low-side switch are connected in series. In the non-insulated DC-DC converter, the power MOS•FET for the high-side switch is formed by a p channel vertical MOS•FET, and the power MOS•FET for the low-side switch is formed by an n channel vertical MOS•FET. Thus, a semiconductor chip formed with the power MOS•FET for the high-side switch and a semiconductor chip formed with the power MOS•FET for the low-side switch are mounted over the same die pad and electrically connected to each other through the die pad.

Abstract: A semiconductor device for an automotive power control center. The device can include first, second and third legs, a semiconductor and an insulating material. The semiconductor is coupled to the legs and configured to transmit relatively high current power between the first and second legs in response to a control signal transmitted via the third leg. The insulating material can encapsulate the semiconductor and portions of the first and second legs. The insulating material can pass through one or more apertures formed in each of the first and second legs to aid in structurally interlocking the first and second legs to one another. A method for forming a semiconductor device is also provided.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: An electric connection and an electric component, the electric component comprising connectors for connecting the electric component. The connectors are formed of a first and a second electrically conductive laminar conductor, which are placed opposite each other and isolated from one another with an insulator, whereby the electric component is arranged to be connected through the plane surfaces of the laminar conductors, and the insulator is arranged between the laminar conductors such that the insulator comprises at least one free plane surface.

Abstract: An automotive power control center that includes a housing, a first conductor coupled to the housing, a second conductor, a control circuit, which is coupled to the housing, and a semiconductor. The second conductor is coupled to the housing and insulated from the first conductor. The solid-state device includes a first terminal, which is electrically coupled to the first conductor, a second terminal, which is electrically coupled to the second conductor, and a third terminal, which is electrically coupled to the control circuit. The solid-state device is configured to selectively control transmission of electricity between the first and second terminals in response to a signal transmitted from the control circuit through the third terminal. In some embodiments the solid-state device may be removably coupled to the housing. In other embodiments, the solid-state device may be fixedly coupled to the various conductors and terminals.

Abstract: An automotive power control center that includes a housing, a first conductor coupled to the housing, a second conductor, a control circuit, which is coupled to the housing, and a semiconductor. The second conductor is coupled to the housing and insulated from the first conductor. The solid-state device includes a first terminal, which is electrically coupled to the first conductor, a second terminal, which is electrically coupled to the second conductor, and a third terminal, which is electrically coupled to the control circuit. The solid-state device is configured to selectively control transmission of electricity between the first and second terminals in response to a signal transmitted from the control circuit through the third terminal. In some embodiments the solid-state device may be removably coupled to the housing. In other embodiments, the solid-state device may be fixedly coupled to the various conductors and terminals.

Abstract: By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Abstract: A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A power output device of the present invention comprises a power supply having an input end for conducting electric current and an output device for supplying power to a computer. The output device has the following elements. A main cable and a sub-cable are connected to a bus on a circuit board of the power supply. An external module is formed by a substrate, a plurality of receptacles and at least one conductive wire. The substrate is connected to the power output bus of the circuit board through a bank of wires. The receptacles are positioned on the substrate and pass out of a back plate of the power supply; each receptacle being electrically connected to the printed circuits of the substrate. One end of the conductive wire has a joint for being received by the receptacle; another end of the conductive wire having a plug as a power supply end.

Abstract: A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

Abstract: A powerline networking adapter attaches to a power brick and includes a network data connection and two AC power connections. In another embodiment, a hybrid power brick includes both AC-DC power conversion elements and powerline networking adapter circuits in the brick.

Abstract: A rotor and a method of constructing a rotor are disclosed. The rotor includes a hub that is capable of being supported by a shaft that extends along an axis, a plurality of laminations, and a plurality of wire windings supported by the plurality of laminations. The hub includes an inner structure configured to support the hub relative to the shaft, an outer structure that supports the laminations, and an intermediate structure that is coupled to the inner and outer structures and supports the inner and outer structures relative to one another.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Hermetically sealed high-voltage assemblies are made up of series-connected diodes. Exposed tabs bonding adjacent diodes allow for greater thermal dissipation than previous products. This allows higher current-carrying capacity especially if used in oil.

Abstract: A DC-to-AC inverter includes an inverter housing, a power conversion module, and an interference insulating arrangement which includes a DC inlet and an insulating member. The inverter housing has a receiving compartment defining an interference zone within which electromagnetic interference occurs, and a free zone free of electromagnetic interference. The power conversion module includes a main PCB which has a DC-AC inversion circuitry implemented thereon to convert an input DC signal into an output AC signal. The DC inlet is electrically connected to the main PCB for connecting with a DC power source to draw of a DC current as the input DC signal to the main PCB, wherein the CD inlet is located at the free zone of the receiving compartment to insulate the DC inlet from being electromagnetically interfered during a DC to AC conversion at the power conversion module.

Abstract: A power converter may employ a planar transformer to minimize winding conduction loss, and the switching devices of the power converter may be aligned in lines parallel to an edge of the planar transformer to minimize the termination leakage inductance. The windings of the planar transformer may be thermally conductively coupled to one or more heat sinks carried by a circuit board which are with respective ones of the switching devices, to provide a cooling path for the planar transformer.

Abstract: A second wiring layer 362 of a multilayer wiring board constituting a power converter is provided with a first positive side direct current wiring 311p and a second positive side direct current wiring 312p constituting a direct current bus 300p. The first positive side direct current wiring 311p and the second positive side direct current wiring 312p as well as a negative side direct current wiring are provided with a bent structure for making a transmission path length on one side in a direct current transmitting direction shorter than a transmission path length on other side thereof. Line widths of the first positive side direct current wiring 311p and the second positive side direct current wiring 312p are set to a width equal to or larger than a width by which a damping factor of a noise current in the direct current transmitting direction becomes substantially a constant value.

Abstract: A dual power module architecture employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

Abstract: A voltage converter includes a converter circuit, a casing, and a jumper member. The converter circuit includes a voltage level setting circuit configured for generating a feedback signal, wherein an output voltage generated by the converter circuit has a voltage level that is determined according to value of the feedback signal. The voltage level setting circuit includes a plurality of first electrical components and a first common line. The casing receives the converter circuit, and is formed with a set of first jumper holes corresponding to the first electrical components, and a second jumper hole corresponding to the first common line. The jumper member connects selected ones of the first electrical components to the first common line upon insertion into the first and second jumper holes. The value of the feedback signal is dependent upon connection status of the first electrical components to the first common line.

Abstract: The low stray interconnecton power converting module is for converting a DC voltage into an AC voltage. It comprises two DC voltage terminals for receiving the DC voltage, an AC voltage terminal for delivering the AC voltage, and a half-bridge including a pair of power switching elements connected as a series totem pole between the DC voltage terminals via the AC voltage terminal. It also comprises a decoupling device for decoupling the half-bridge. The decoupling device comprises a series of at least two adjacent superimposed electrode plates separated by a dielectric material and extending proximately in overlapping relation with the half-bridge. Each of the adjacent electrode plates is connected to a different one of the DC terminals. The electrode plates form with the two power switching elements, the DC terminals and the AC terminal, a reduced cross section belt-like current closed loop by which a low stray interconnection inductance power converting module is obtained.

Abstract: In an inverter apparatus in which a three-phase inverter main circuit having a plurality of arms comprises a plurality of semiconductor chips for electric power, one arm of the three-phase inverter main circuit includes IGBTs and diodes of semiconductor chips having a size of 10 mm by 10 mm or less with the semiconductor chips connected in parallel, while the IGBTs and the diodes are bonded to a conductor having a thickness of 1.5 mm or more and 5 mm or less, and the conductor is glued to a cooler through an insulating resin sheet containing ceramics.

Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A method for power plane splitting. The method enables the traces on a power plane to be organized so that the conductor area is expanded while still ensuring that components with similar power supply requirements are coupled to the same trace. A potential field of a power plane of a printed circuit board is calculated by assigning one or more potential values to one or more components coupled to the printed circuit board and solving for a plurality of potential field values at a plurality of locations between the one or more components. One or more boundaries between the one or more components are defined by selecting contours of constant potential within the calculated potential field. One or more traces on the power plane are created using the one or more boundaries, wherein the one or more traces connect a corresponding one or more pluralities of components and each plurality of components of the one or more.

Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.

Abstract: A progammable power supply for providing a regulated DC output power is disclosed. The power supply provides the output power to any one of a plurality of electronic devices adapted for receiving the output power at an operational voltage or an operational current. The power supply receives a programming signal to maintain the output power at the operational voltage or operational current associated with a particular selected electronic device. Accordingly, by varying the programming signal, the power supply can be programmed to provide output power to any one of several electronic devices having differing input power requirements.