Abstract: Some embodiments include first memory cells and a first line used to access the first memory cells, second memory cells and at least one second line used to access the second memory cells. The first and second memory cells have a number of threshold voltage values corresponding to a number of states. The states represent values of information stored in the memory cells. During a read operation to read the first memory cells, a first voltage may be applied to the first line and a second voltage may be applied to the second line. At least one of the first and second voltages may include a value based on a change of at least one of the threshold voltage values changing from a first value to a second value. The first and second values may correspond to a unique state selected from all of the states. Other embodiments including additional apparatus, systems, and methods are disclosed.

Abstract: In a semiconductor memory including word lines and bit lines arranged in a matrix and a plurality of memory cells provided at intersections of the word lines and the bit lines, a bit line precharge circuit is provided for controlling the potential of a low-data holding power supply coupled to memory cells provided on a corresponding one of the bit lines. In a write operation, the bit line precharge circuit controls the potential of a low-data holding power supply of a memory cell corresponding to a selected bit line to be higher than the potential of a low-data holding power supply of a memory cell corresponding to an unselected bit line.

Abstract: In a read circuit, a write circuit writes a data to be stored and/or a test data to the memory cell. A control circuit controls the write circuit to write the test data to the memory cell in a first phase, and to write the test data which is same as the first phase to the memory cell in a second phase. An integrator integrates voltages at one terminal of the memory cell during the first phase to obtain a first integrated voltage, and integrates voltages at one terminal of the memory cell during the second phase to obtain a second integrated voltage. A buffer stores the first integrated voltage. A comparator compares the first integrated voltage from the buffer with the second integrated voltage from the integrator to obtain the data.

Abstract: A multi-port memory, comprising: m (m?2) input/output ports independent of one another; n (n?2) memory banks independent of one another; and a route switching circuit capable of optionally setting signal routes of a command, an address, and input/output data between the m input/output ports and the n memory banks, wherein the route switching circuit allocates p (1?p?m) input/output ports optionally selected from the m input/output ports to a memory bank optionally selected from the n memory banks.

Abstract: A memory system includes Q memory blocks that each include M memory sub-blocks. The memory system also includes Q word line decoders that each are associated with a different one of the Q memory blocks. The memory system also includes a bit line decoder and Q×M switch modules. Each Q×M switch module selectively controls access to up to J of the M memory sub-blocks of the Q memory blocks. The Q word line decoders and the bit line decoder access less than M memory sub-blocks in at least two of the Q memory blocks during one of a read and write operation. M and Q are integers greater than 1, and J is an integer greater than or equal to 1.

Abstract: Digital memory devices and systems, as well as methods of operating digital memory devices, that include access circuitry to access a first subset of a plurality of memory cells associated with a current access address during a current access cycle and precharge circuitry, disposed in parallel relative to the access circuitry, to precharge in full or in part a second subset of the plurality of memory cells associated with a next precharge address during the current access cycle.

Abstract: An array of non-volatile memory cells arranged in logical columns and logical rows, and associated circuitry to enable reading or writing one or more memory cells on a row in parallel. In some embodiments, the array of memory cells may include a phase change material. In some embodiments, the circuitry may include a write driver, a read driver, a sense amplifier, and circuitry to isolate the memory cells from the sense amplifier with extended refresh.

Abstract: A static random access memory device capable of preventing stability issues during a write operation is provided, in which a memory cell is coupled to a read word line, a write word line, a read bit line, a write bit line and a complementary write bit line, and a multiplexing unit is coupled to the read bit line, the write bit line and the complementary write bit line. The multiplexing unit applies first and second logic voltages representing a logic state stored in the memory cell to the write bit line and the complementary write bit line, respectively, when the memory cell is not selected to be written by an input signal from a data driver and the read word line is activated, in which the first and second logic voltages are opposite to each other.

Abstract: A sensing enable signal control circuit determines a driving timing of an I/O sense amplifier based on a read-out result of data, which is stored in a dummy cell of a semiconductor memory apparatus. The sensing enable signal control circuit in a semiconductor memory apparatus includes a detection code generating unit configured to output a detection code according to a voltage level of dummy cell data, which are read out from a dummy cell through at least one read operation, in response to a column select enable signal, and a multiplexer configured to receive the detection code and a default code and output a delay code to delay a sensing enable signal.

Abstract: A semiconductor device includes: first and second input/output terminals; a first input/output line connected to the first input/output terminal; a second input/output line connected to the second input/output terminal; and a first by-path route that connects the first input/output line and the second input/output line. When in normal operation mode, the first by-path route is set in a non-conductive state. When in a test mode, the first by-path route is set into a conductive state so that a first data inputted to the first input/output terminal is outputted as a first data to the second input/output line, in correspondence with a transition of a clock signal in the first direction, and so that a second data inputted to said first input/output terminal is outputted as a second input data for said first input/output line, in correspondence with a transition of said clock signal in the second direction.

Abstract: Receiving a request for canceling setting, a control circuit erases data stored in a corresponding block, changes a value of a protection flag, and cancels protection setting. When an overall protection is set for any block, the control circuit prohibits access to all blocks, except when it is an operation mode for activating a memory program contained in the microcomputer. Further, control circuit permits an access to a block M only when partial protection is set, CPU is in the mode for activating a memory program contained in the microcomputer and the access is for reading an instruction code in accordance with an instruction fetch.

Abstract: A memory includes memory cells, wherein during a first write operation in which first logical data is written in all memory cells connected to a first word line, a source line driver and a word line driver, the source line driver shifts a voltage of a selected source line corresponding to the first word line in a direction away from the voltage of the first word line and the word line driver shifts a voltage of a second word line in a same direction as a transition direction of voltage of a selected source line, and during a second write operation in which second logical data is written in a selected cell connected to the first word line, the source line driver and the word line driver shift voltages of the selected source line and the second word line in a direction approaching the voltage of the first word line.

Abstract: A non-volatile memory storage system including a transmission interface, a memory module, and a controller is provided. The memory module includes first and second non-volatile memory chips. The first and the second non-volatile memory chips can be simultaneously enabled by receiving a chip enable signal from the controller via a chip enable pin. When the controller performs a multichannel access, the controller provides an access instruction to the first and second non-volatile memory chip, after enabling the first non-volatile memory chip and the second non-volatile memory chip with the chip enable signal. When the controller performs a single channel access, the controller provides the access signal to one of the first and second non-volatile memory chips, and provides a non-access instruction to the other one, after enabling the first non-volatile memory chip and the second non-volatile memory chip with the chip enable signal.

Abstract: To include a comparison circuit that generates comparison results by comparing plural pieces of data simultaneously read via data lines with expected values, an AND gate that activates a first determination signal in response to a fact that at least one of the comparison results indicates a mismatch, and an OR gate that activates a second determination signal in response to a fact that all the comparison results indicate a mismatch. With this arrangement, when a detection test of a defective address is performed in a wafer state, a defect of a column selection line can be detected.

Abstract: A method and apparatus for protecting non-volatile memory is described. A write command is processed only when an operating voltage is between specified operating limits and when a data pattern stored in the non-volatile memory is repeatedly read successfully.

Abstract: The present invention is related to a composite flash memory device comprises a plural sector flash memory array which is divided to plural sector that is a minimum erasing unit of the flash memory device, a flash memory array storing control commands which control a total system of the composite flash memory device and/or the only composite flash memory device in and sharing I/O line of the plural sector flash memory array, the read operation of the flash memory array is enable when the plural sector flash memory array is gained access.

Abstract: Memories, precharge control circuits, methods of controlling, and methods of utilizing are disclosed, including precharge control circuits for a memory having at least one bank of memory. One such control circuit includes at least one precharge preprocessor circuit. The precharge preprocessor circuit is coupled to a respective bank of memory and is configured to prevent precharge of the respective bank of memory until after execution of buffered write commands issued to the respective bank of memory is completed.

Abstract: A memory module includes a plurality of data ports configured to receive/transmit associated data and a plurality of memory devices. The plurality of memory devices include a first set of the memory devices in at least one rank, each memory device of the first set being coupled to each of the associated data ports, and a second set of the memory devices in at least one other rank, each memory device of the second set being configured to receive/transmit the associated data for the memory device through at least each associated memory device of the first set.

Abstract: A device includes a memory configured so that, in the event that one pass-gate transistor associated with a bit cell is determined to be excessively weak such that reading the bit cell could be undesirably difficult, a second pass-gate transistor can be configured to support a read operation. For example, during a manufacturing test procedure, the access speed of each bit cell at a memory device is determined. If a bit cell fails to achieve a desired access speed, the column of the memory that includes the defective bit cell can be configured to access information stored at the bit cell using the second bit line associated with the second pass-gate transistor.

Abstract: A one read/two write SRAM circuit of which memory cell size is small, and high-speed operation is possible. The SRAM circuit includes first and second flip-flop circuits which are connected in parallel to a common write word line; a first write control circuit which is connected to said first flip-flop circuit, is conducted by a write control signal supplied to said write word line, and supplies a first write signal to said first flip-flop circuit; and a second write control circuit which is connected to said second flip-flop circuit, is conducted by a write control signal supplied to said write word line, and supplies a second write signal to said second flip-flop circuit.

Abstract: A multiple-port semiconductor memory device capable of achieving a smaller circuit area is provided. A power supply line supplying an operation voltage of a memory cell is formed in an identical metal interconnection layer where word lines are formed and it is provided adjacent to and between corresponding first word line and second word line. Then, for example, when the same memory cell row is accessed, a voltage level of the power supply line is raised by a coupling capacitance of the word lines. Thus, even in identical-row-access, static noise margin in identical-row-access can be maintained to be as great as that in different-row-access. Therefore, for example, even when a size or the like of a driver transistor is not made larger, deterioration of static noise margin can be suppressed and a circuit area can be made smaller.

Abstract: A nonvolatile semiconductor memory device comprises a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time.

Abstract: A process is performed periodically or in response to an error in order to dynamically and adaptively optimize read compare levels based on memory cell threshold voltage distribution. One embodiment of the process includes determining threshold voltage distribution data for a population of non-volatile storage elements, smoothing the threshold voltage distribution data using a weighting function to create an interim set of data, determining a derivative of the interim set of data, and identifying and storing negative to positive zero crossings of the derivative as read compare points.

Abstract: A method of operating a flash memory device includes a first operating mode and a second operating mode having different operating speeds. Each one of the first and second operating modes includes a bit line set-up interval and at least one additional interval. The flash memory is divided into first and second mats connected to respective first and second R/W circuits. During the bit line set-up interval of the second operating mode, the flash memory controls operation of both the first and second R/W circuits in a time division approach to stagger respective peak current intervals for the first and second mats.

Abstract: An integrated circuit includes a memory array including a plurality of memory cells, the memory cells include a core storage element having at least a first storage node (S) and a complementary second storage node (S-bar), and a first pass gate coupled to the first storage node (S). A single bitline (BL) is coupled to a node in a source drain path of the first pass gate. The BL is for Reading data from and Writing data to the first storage node (S). A buffer circuit includes a second pass gate and a driver transistor, wherein the second pass gate is coupled between the driver transistor and the source drain path of the first pass gate. A gate of the driver transistor is coupled to the second storage node (S-bar). At least one wordline (WL) is coupled to the first pass gate and the second pass gate.

Abstract: Methods and devices are disclosed, some such methods comprising applying a verify pass-through voltage to unselected select lines of the floating-gate memory array that is greater than a read pass-through voltage applied to the unselected select lines. Other methods involve utilizing a cell current for reading a value from one or more memory cells in program-verify operations that is lower than a cell current for reading the value from the one or more memory cells in read operations.

Abstract: A method for driving a ferroelectric memory device having a plurality of memory cells that store data and a memory cell for flag is provided. The method includes, upon writing to the plurality of memory cells, the steps of: reading data from the plurality of memory cells and the memory cell for flag; judging as to whether the data readout from the memory cell for flag is specified data; overwriting write data to the plurality of memory cells, and writing reverse data of the specified data to the memory cell for flag, when the data readout from the memory cell for flag is the specified data; and rewriting the data readout from the plurality of memory cells to the plurality of memory cells, and writing the reverse data to the memory cell for flag, when the data readout from the memory cell for flag is the reverse data.

Abstract: Methods and apparatus for use in a memory system having a non-volatile memory and a controller for limiting the number of non-volatile memory arrays from a plurality of available arrays accessed at one time are useful in the control of concurrent access of memory arrays. One method includes implementing a pipelining sequence for transferring data to and from the non-volatile memory arrays and limiting the number of active arrays operating at one time. The controller is configured to wait for the at least one of the arrays to complete before initiating a transfer to and from a further array.

Abstract: Various embodiments of the present invention are generally directed to a method and apparatus for carrying out a partial block update operation upon a resistive sense memory (RSM) array, such as formed from STRAM or RRAM cells. The RSM array is arranged into multi-cell blocks (sectors), each block having a physical block address (PBA). A first set of user data is written to a selected block at a first PBA. A partial block update operation is performed by writing a second set of user data to a second block at a second PBA, the second set of user data updating a portion of the first set of user data in the first PBA. The first and second blocks are thereafter read to retrieve the second set of user data and a remaining portion of the first set of user data.

Abstract: A page of non-volatile multi-level memory cells on a word line is sensed in parallel by sense amps via bit lines. A predetermined input sensing voltage as an increasing function of time applied to the word line allows scanning of the entire range of thresholds of the memory cell in one sweep. Sensing of the thresholds of individual cells is then reduced to a time-domain sensing by noting the times the individual cells become conducting. Each conducting time, adjusted for delays in the word line and the bit line, can be used to derive the sensing voltage level that developed at the word line local to the cell when the cell became conducting. The locally developed sensing voltage level yields the threshold of the cell. This time-domain sensing is relative insensitive to the number of levels of a multi-level memory and therefore resolve many levels rapidly in one sweep.

Abstract: A multi-port memory device having a storage node, a precharge node, a first, second, third, and fourth transistor, and a control module. The first transistor includes a current electrode connected to the storage node, another current electrode connected to a first bit line, and a gate connected to a first wordline. The second transistor includes a current electrode connected to the storage node, another current electrode connected to a second bit line, and a gate connected to a second wordline. The third transistor includes a current electrode connected to the reference node, another current electrode connected to the first bit line, and a gate. The fourth transistor includes a current electrode connected to the precharge node, another current electrode connected to the second bit line, and a gate. The control module deactivates the fourth transistor in response to a dummy access of the first storage module at the second transistor.

Abstract: There are provided are a plurality of memory mats, a sub-word driver that accesses a normal memory cell irrespective of whether a row address to which access is requested is a defective address, a sub-word driver that accesses a redundant memory cell belonging to a memory mat different from the normal memory cell indicated by the row address, when the row address is a defective address. According to the present invention, the normal memory cell and a redundant memory cell belong to memory mats different to each other, and thus the normal memory cell can be accessed concurrently with determining operation of the repair determining circuit.

Abstract: The present disclosure relates to memory arrays with read reference voltage cells. In particular the present disclosure relates to variable resistive memory cell apparatus and arrays that include a high resistance state reference memory cell and a low resistance state reference memory cell that provides a reliable average reference voltage on chip to compare to a read voltage of a selected memory cell and determine if the selected memory cell is in the high resistance state or low resistance state. These memory arrays are particularly suitable for use with spin-transfer torque memory cells and resolves many systematic issues related to generation of a reliable reference voltage.

Abstract: An asynchronous logic family of circuits which communicate on delay-insensitive flow-controlled channels with 4-phase handshakes and 1 of N encoding, compute output data directly from input data using domino logic, and use the state-holding ability of the domino logic to implement pipelining without additional latches.

Abstract: A semiconductor memory device includes at least one write global bit line connected to a plurality of local bit lines and at least one read global bit line connected to the local bit lines. The phase-change memory device having the write global bit line and the read global bit line suppress coupling noise generated during a read-while-write operation.

Abstract: Techniques for simultaneously driving a plurality of source lines are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for simultaneously driving a plurality of source lines. The apparatus may include a plurality of source lines coupled to a single source line driver. The apparatus may also include a plurality of dynamic random access memory cells arranged in an array of rows and columns, each dynamic random access memory cell including one or more memory transistors. Each of the one or more memory transistors may include a first region coupled to a first source line of the plurality of source lines, a second region coupled to a bit line, a body region disposed between the first region and the second region, wherein the body region may be electrically floating, and a gate coupled to a word line and spaced apart from, and capacitively coupled to, the body region.

Abstract: A content addressable memory (CAM) device includes an array of memory cells arranged in rows and columns; compare circuitry configured to indicate match results of search data presented to each row of the array; and compare circuitry configured to indicate match results of search data presented to each column of the array, thereby resulting in a two-dimensional search capability of the array.

Abstract: A NAND interface having a reduced pin count configuration, in which all command and address functions and operations of the NAND are provided serially on a single serial command and address pin adapted to receive all commands and addresses, and data communication is performed on a number of data communication pins.

Abstract: Systems and methods for reducing delays between successive write and read accesses in multi-bank memory devices are provided. Computer circuits modify the relative timing between addresses and data of write accesses, reducing delays between successive write and read accesses. Memory devices that interface with these computer circuits use posted write accesses to effectively return the modified relative timing to its original timing before processing the write access.

Abstract: A memory architecture that employs one or more semiconductor PIN diodes is provided. The memory employs a substrate that includes a buried bit/word line and a PIN diode. The PIN diode includes a non-intrinsic semiconductor region, a portion of the bit/word line, and an intrinsic semiconductor region positioned between the non-intrinsic region and the portion of the bit/word line.

Abstract: Provided are a plurality of memory cell arrays 136 and 146 each having a plurality of nonvolatile memory elements having a characteristic whose resistance value changes according to electric pulses applied, and control units (102, 104, 108, 110, 114, 128, 130, 152) configured to write data to a memory cell array and to read data from another memory cell array such that writing of the data and reading of the data occur concurrently in writing of the data to the plurality of memory cell arrays.

Abstract: A semiconductor memory executes an access operation on one of a plurality of memory blocks in response to an externally supplied access request. At this time, in response to the access request, a memory control unit executes the access operation on one of the memory blocks and a refresh operation on at least one of the memory blocks on which the access operation is not executed. Consequently, it is possible to execute the refresh operation during the execution of the access operation without any conflict between the access operation and the refresh operation. As a result, the access cycle time can be shortened, which can improve the data transfer rate.

Abstract: In a read method for a memory device, a bit line is set with data in a first memory cell; and the data on the bit line is stored in a register. The data in the register is transferred to a data bus while setting the bit line with data in a second memory cell. In another read method for a memory device, a bit line of a first memory cell is initialized and the bit line is pre-charged with a pre-charge voltage. Data in a memory cell on the bit line is developed, and a register corresponding to the bit line is initialized. The data on the bit line is stored in the register. The data in the register is output externally while performing the initializing, pre-charging, making and initializing to set the bit line with data in a second memory cell.

Abstract: A memory system includes a master device, such as a graphics controller or processor, and an integrated circuit memory device operable in a dual column addressing mode. The integrated circuit memory device includes an interface and column decoder to access a row of storage cells or a page in a memory bank. During a first mode of operation, a first row of storage cells in a first memory bank is accessible in response to a first column address. During a second mode of operation, a first plurality of storage cells in the first row of storage cells is accessible in response to a second column address during a column cycle time interval. A second plurality of storage cells in the first row of storage cells is accessible in response to a third column address during the column cycle time interval. The first and second pluralities of storage cells are concurrently accessible from the interface.

Abstract: Various embodiments for implementing refresh mechanisms in dynamic semiconductor memories that allow simultaneous read/write and refresh operations. In one embodiment, the invention provides a synchronous multi-bank dynamic memory circuit that employs a flag to indicate a refresh mode of operation wherein refresh operation can occur in the same bank at the same time as normal access for read/write operation. In a specific embodiment, to resolve conflicts between addresses, an address comparator compares the address for normal access to the address for refresh operation. In case of a match between the two addresses, the invention cancels the refresh operation at that array and allows the normal access to proceed.

Abstract: A process of operating an integrated circuit containing a programmable data storage component including at least one data ferroelectric capacitor and at least one additional ferroelectric capacitor, in which power is removed from a state circuit after each read operation. A process of operating an integrated circuit containing a programmable data storage component including at least one data ferroelectric capacitor and at least one additional ferroelectric capacitor, in which power is removed from a state circuit after each write operation. A process of operating an integrated circuit containing a programmable data storage component including four data ferroelectric capacitors, in which power is removed from a state circuit after each read operation and after each write operation.

Abstract: A method of reading a nonvolatile memory device may include, after an nth erase operation is performed, reading dummy cells on which a program operation has been performed based on a first read voltage, where n is an integer greater than zero, counting a number of dummy cells that are read as having a threshold voltage lower than the first read voltage, when the number is a critical value or more, resetting a read voltage, and performing, based on the reset read voltage, a read operation on memory cells that belong to the same memory cell block as the dummy cells and on which a program operation has been performed on the memory cells after the nth erase operation has been performed.

Abstract: A nonvolatile memory device includes a first plane and a second plane, an address decoder configured to decode an externally input address and to output a first plane select signal and a second plane select signal for enabling any one of the first and second planes, a controller configured to output a first plane hold signal and a second plane hold signal for disabling any one of the first and second planes depending on program states of the first plane and the second plane, a first plane control unit configured to enable the first plane in response to a first plane select signal and the first plane hold signal, and a second plane control unit configured to enable the second plane in response to a second plane select signal and the second plane hold signal.

Abstract: A memory module is configured to include a first rank installed with a first memory chip and a second rank installed with a second memory chip. When the first and second memory chips are in a first data output mode, the first memory chip is configured to externally output lower order data of a plurality of data via lower data output pins. Also, when the first and second memory chips are in the first data output mode, the second memory chip is configured to externally output data that has the same order as the lower order data output by the first memory chip via upper data output pins.

Abstract: A semiconductor memory such as a dynamic RAM having memory mats each divided into a plurality of units or sub-memory mats. Each sub-memory mat comprises: a memory array having sub-word lines and sub-bit lines intersecting orthogonally and dynamic memory cells located in lattice fashion at the intersection points between the intersecting sub-word and sub-bit lines; a sub-word line driver including unit sub-word line driving circuits corresponding to the sub-word lines; a sense amplifier including unit amplifier circuits and column selection switches corresponding to the sub-bit lines; and sub-common I/O lines to which designated sub-bit lines are connected selectively via the column selection switches. The sub-memory mats are arranged in lattice fashion.