Abstract: A memory macro includes a first memory cell array, a first tracking circuit, a first and a second transistor. The first memory cell array includes rows of memory cells and columns of memory cells. The first tracking circuit includes a first set of memory cells configured as a first set of loading cells responsive to a first control signal, a second set of memory cells configured as a first set of pull-down cells responsive to a second control signal, and a first tracking bit line coupled to the first and second set of memory cells. The first set of pull-down cells or loading cells is configured to track a memory cell of the first memory cell array. The first and second transistor are coupled to the first tracking bit line, and configured to charge the first tracking bit line to a pre-charge voltage level responsive to a tracking enable signal.

Abstract: Methods, devices, and systems for determining read voltages for memory systems are provided. In one aspect, a memory device includes an array of memory cells, an accumulating circuit, and a controller. Each of the memory cells is coupled to a corresponding word line of multiple word lines and a corresponding bit line of multiple bit lines. The accumulating circuit is configured to: when data stored in a page is read out by applying each of a plurality of read voltages on a word line corresponding to the page, accumulate read-out signals from multiple memory cells in the page to generate a respective output value that corresponds to the accumulated read-out signals for the read voltage. The controller is configured to determine a calibrated read voltage for the page based on the respective output values and the plurality of read voltages.

Abstract: Apparatuses and methods are provided for processing in memory. An example apparatus comprises a host and a processing in memory (PIM) capable device coupled to the host via an interface comprising a sideband channel. The PIM capable device comprises an array of memory cells coupled to sensing circuitry and is configured to perform bit vector operations on data stored in the array, and the host comprises a PIM control component to perform virtual address resolution for PIM operations prior to providing a number of corresponding bit vector operations to the PIM capable device via the sideband channel.

Abstract: Digital compute-in-memory (DCIM) bit cell circuit layouts and DCIM array circuits for multiple operations per column are disclosed. A DCIM bit cell array circuit including DCIM bit cell circuits comprising exemplary DCIM bit cell circuit layouts disposed in columns is configured to evaluate the results of multiple multiply operations per clock cycle. The DCIM bit cell circuits in the DCIM bit cell circuit layouts each couples to one of a plurality of column output lines in a column. In this regard, in each cycle of a system clock, each of the plurality of column output lines receives a result of a multiply operation of a DCIM bit cell circuit coupled to the column output line. The DCIM bit cell array circuit includes digital sense amplifiers coupled to each of the plurality of column output lines to reliably evaluate a result of a plurality of multiply operations per cycle.

Abstract: An apparatus includes control circuits configured to connect to a plurality of non-volatile memory cells. Each non-volatile memory cell is configured to store a plurality of bits of a plurality of logical pages including at least a first bit of a first logical page, a second bit of a second logical page and a third bit of a third logical page. The control circuits are configured to select a subset of the plurality of logical pages for reading, perform pre-read steps, and read a first and at least a second selected logical page of the subset without performing pre-read steps between reading the first and second selected logical pages.

Abstract: The present disclosure relates to apparatuses and methods to control memory operations on buffers. An example apparatus includes a memory device and a host. The memory device includes a buffer and an array of memory cells, and the buffer includes a plurality of caches. The host includes a system controller, and the system controller is configured to control performance of a memory operation on data in the buffer. The memory operation is associated with data movement among the plurality of caches.

Abstract: A memory mat architecture is presented where a column decoder is disposed within the memory array. The location of the column decoder reduces a distance between the column decoder and a target memory cell and thus reduces a distance that a column select signal travels from the column decoder to the target memory cell. A single predecoder is disposed in a bank controller for the memory array. The column decoder may be disposed in the middle of the memory array or offset from the middle near the far edge of the memory array opposite the bank controller. The location of the column decoder enables a reduced array access time to obtain data from the target memory cell.

Abstract: This disclosure describes a memory cell array with enhanced read sensing margin. The memory cell array includes a write port and a read port being connected through first and second data storage lines. The memory cell array further includes multiple word lines and bit lines arranged in rows and columns such that the read port is coupled to a read word line, a read bit line, and a virtual ground. The read port includes a first transistor coupled to at least the read bit line and the virtual ground, a second transistor coupled to at least the first data storage line and the first transistor, a third transistor coupled to at least the second data storage line and the read word line, and a fourth transistor coupled at least the first data storage line and the read word line.

Abstract: A pseudo-analog memory computing circuit includes at least one input circuit, at least one output circuit and at least one pseudo-analog memory computing unit. Each pseudo-analog memory computing unit is coupled between one of the at least one input circuit and one of the at least one output circuit and has at least one weight mode. Each pseudo-analog memory computing unit generates at least first computing result for a coupled output circuit according to a weight of a selected weight mode and at least one input signals of a coupled input circuit.

Abstract: A data storage system includes a storage medium coupled to a storage controller via an electrical interface connected to a plurality of input/output (IO) pads of the storage medium. The storage medium receives a read or write instruction from the storage controller via the IO pads, associates the read or write instruction with memory cells of a first block of a first plane of a plurality of planes of the storage medium, and adjusts a word line voltage level or a source line voltage level for the first block of the first plane based on (i) a position of the first plane with respect to the IO pads of the storage medium and (ii) a position of the first block within the first plane.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines and arranged in strings and configured to retain a threshold voltage. A control circuit is coupled to the word lines and strings and is configured to compute a target word line voltage including a kicking voltage to be applied to selected ones of word lines for a kick time during a read operation. The control circuit extends the kick time by a compensation time to a compensated kick time in response to determining the target word line voltage is not greater than a predetermined voltage design limit. The control circuit applies the kicking voltage to the selected ones of word lines for the compensated kick time thereby enabling a word line voltage to reach one of a plurality of reference voltages quickly without exceeding the predetermined voltage design limit.

Abstract: Systems, methods, and apparatus related to spike current suppression in a memory array. In one approach, a memory device includes a memory array having a cross-point memory architecture. The memory array has access lines (e.g., word lines and/or bit lines) configured to access memory cells of the memory array. Each access line is split into left and right portions. Each portion is electrically connected to a single via, which a driver uses to generate a voltage on the access line. To reduce electrical discharge associated with current spikes, a first resistor is located between the left portion and the via, and a second resistor is located between the right portion and the via.

Abstract: A memory unit with a multiply-accumulate assist scheme for a plurality of multi-bit convolutional neural network based computing-in-memory applications is controlled by a reference voltage, a word line and a multi-bit input voltage. The memory unit includes a non-volatile memory cell, a voltage divider and a voltage keeper. The non-volatile memory cell is controlled by the word line and stores a weight. The voltage divider includes a data line and generates a charge current on the data line according to the reference voltage, and a voltage level of the data line is generated by the non-volatile memory cell and the charge current. The voltage keeper generates an output current on an output node according to the multi-bit input voltage and the voltage level of the data line, and the output current is corresponding to the multi-bit input voltage multiplied by the weight.

Abstract: A non-volatile memory apparatus and corresponding method of operation are provided. The apparatus includes non-volatile memory cells in an integrated circuit device along with a microcontroller in communication with the non-volatile memory cells. The microcontroller is configured to receive a memory operation command and in response, determine a condition value of one of a plurality of conditions associated with the memory operation command and whether the one of the plurality of conditions is dynamic. In parallel, the microcontroller determines and outputs an output value using the condition value. The microcontroller then determines whether the one the plurality of conditions has changed. If the one of the plurality of conditions is dynamic and has changed, the microcontroller determines an updated condition value and in parallel, compares the condition value and the updated condition value and determines and outputs an updated output value using the updated condition value and the comparison.

Abstract: A memory circuit includes a NAND logic gate, a first N-type transistor, a second N-type transistor, a first inverter and a first latch. The NAND logic gate is configured to receive a first bit line signal and a second bit line signal, and to generate a first signal. The first N-type transistor is coupled to the NAND logic gate, and configured to receive a first pre-charge signal. The second N-type transistor is coupled to the first N-type transistor and a reference voltage supply, and configured to receive a first clock signal. The first inverter is coupled to the NAND logic gate, and configured to output a data signal inverted from the first signal. The first latch is coupled to the NAND logic gate, and configured to latch the first signal in response to at least the first clock signal or the first pre-charge signal.

Abstract: A switching unit of a touch panel device switches between a first connection state in which, among a plurality of drive wiring lines, a first drive wiring line and a second drive wiring line adjacent to each other are connected, and a second connection state in which, among the plurality of drive wiring lines, the first drive wiring lines adjacent to each other are connected to each other and the second drive wiring lines adjacent to each other are connected to each other.

Abstract: A memory device includes: memory cells; an operation mode determiner for determining any one of a normal operation mode and a memory communication operation mode of communicating data with another memory device; a pad control signal generator for generating a pad control signal for determining a pad to receive a signal corresponding to a data movement command of the memory controller according to the determined operation mode; a pad controller for receiving the signal through the determined pad according to the pad control signal; an internal command generator for generating an internal operation command corresponding to the data movement command according to the determined operation mode; and an operation controller for performing one of a read operation of reading first target data from the memory cells and a program operation of storing second target data in the memory cells, based on the internal operation command.

Abstract: The present disclosure includes apparatuses and methods for simultaneous in data path compute operations. An apparatus can include a memory device having an array of memory cells and sensing circuitry selectably coupled to the array. A plurality of shared I/O lines can be configured to move data from the array of memory cells to a first portion of logic stripes and a second portion of logic stripes for in data path compute operations associated with the array. The first portion of logic stripes can perform a first number of operations on a first portion of data moved from the array of memory cells to the first portion of logic stripes while the second portion of logic stripes perform a second number of operations on a second portion of data moved from the array of memory cells to the second portion of logic stripes during a first time period.

Abstract: Various embodiments of the present disclosure are directed towards a method for memory repair using a lookup table (LUT)-free dynamic memory allocation process. An array of memory cells having a plurality of rows and a plurality of columns is provided. Further, each memory cell of the array has multiple data states and a permanent state. One or more abnormal memory cells is/are identified in a row of the array and, in response to identifying an abnormal memory cell, the abnormal memory cell is set to the permanent state. The abnormal memory cells include failed memory cells and, in some embodiments, tail memory cells having marginal performance. During a read or write operation on the row, the one or more abnormal memory cells is/are identified by the permanent state and data is read from or written to a remainder of the memory cells while excluding the abnormal memory cell(s).

Abstract: Several embodiments of memory devices and systems with offset memory component automatic calibration error recovery are disclosed herein. In one embodiment, a system includes at least one memory region and calibration circuitry. The memory region has memory cells that read out data states in response to application of a current read level signal. The calibration circuitry is operably coupled to the at least one memory region and is configured to determine a read level offset value corresponding to one or more of a plurality of offset read level test signals, including a base offset read level test signal. The base offset read level test signal is offset from the current read level signal by a predetermined value. The calibration circuitry is further configured to output the determined read level offset value.

Abstract: An apparatus may include a delay line that receives a command signal and provides a delayed command signal. The apparatus may include an edge starter that provides a clock enable signal responsive, at least in part, to a change in level of the command signal. A gate circuit of the apparatus may provide a shift clock signal responsive, at least in part, to the clock enable signal. The apparatus may also include a shifter that captures and shifts the delay command signal responsive, at least in part, to the shift clock signal.

Abstract: A storage device including, a plurality of non-volatile memories configured to include a memory cell region including at least one first metal pad; and a peripheral circuit region including at least one second metal pad and vertically connected to the memory cell region by the at least one first metal pad and the at least one second metal pad, and a controller connected to the plurality of non-volatile memories through a plurality of channels and configured to control the plurality of non-volatile memories, wherein the controller selects one of a first read operation mode and a second read operation mode and transfers a read command corresponding to the selected read operation mode to the plurality of non-volatile memories, wherein one sensing operation is performed to identify one program state among program sates in the first read operation mode, and wherein at least two sensing operations are performed to identify the one program state among the program states in the second read operation mode.

Abstract: A nonvolatile semiconductor storage device includes a first channel layer including a first drain-side select transistor, a first source-side select transistor, and a first memory cell transistor, a second channel layer including a second drain-side select transistor, a second source-side select transistor, and a second memory cell transistor, a word line that functions as a gate electrode of the first and second memory cell transistors, and a controller. When a read operation is executed on the first memory cell transistor, the controller turns on the second drain-side select transistor and the second source-side select transistor, supplies a first voltage to the word line in a state where the first drain-side select transistor and the first source-side select transistor are turned off, and then, supplies a second voltage to the word line in a state where the first drain-side select transistor and the first source-side select transistor are turned on.

Abstract: A two-channel semiconductor component has a doped semiconductor body formed from a group IV semiconductor material, a top-side top-gate electrode, and a bottom-side bottom-gate electrode. A source region has a greater extent in a depth direction in the silicon body than a drain region. A source isolation region is arranged between a source region and the top-gate electrode, and a drain isolation region is arranged between a drain region and the top-gate electrode, which isolation region extends in a depth direction as far as to the lower edge of a gate isolation layer of the top-gate electrode. In a first operating state a first conductive channel separated laterally from the source region by the source isolation region can be formed, as can a second conductive channel, which is decoupled from the first conductive channel by a barrier region of the semiconductor body extending in a depth direction between the conductive channels.

Abstract: An error detection code generation circuit of a semiconductor device includes a first cyclic redundancy check (CRC) engine, a second CRC engine and an output selection engine. The first CRC engine generates first error detection code bits using a first generation matrix, based on a plurality of first unit data and first DBI bits in response to a mode signal. The second CRC engine generates second error detection code bits using a second generation matrix, based on a plurality second unit data and second DBI bits, in response to the mode signal. The output selection engine generates final error detection code bits by merging the first error detection code bits and the second error detection code bits in response to the mode signal. The first generation matrix is the same as the second generation matrix.

Abstract: An active region includes a body region in which first and second transistors are formed, a connection portion to which a potential of the body region is connected, and a lead portion that connects the body region and the connection portion. Source regions or drain regions of the first and second transistors formed in the body region are provided in a common region. Each of the lead portions extends from a corresponding channel region such that the lead portions are isolated from each other, and a gate electrode extends thereon. A width of the lead portion is narrower than a distance between corresponding ones of contact portions of the source regions and the drain regions of the first and second transistors. A width of the connection portion is equal to or narrower than a gate width of the gate electrode extending on the lead portion.

Abstract: High-efficiency control technology for non-volatile memory is shown. A controller allocates spare blocks of a non-volatile memory to provide a first active block and writes data issued by a host to the first active block. When the number of spare blocks is less than a threshold number and valid data of a first source block is less than a critical data amount, the controller uses the first active block as a data transfer destination for the valid data from the first source block.

Abstract: A semiconductor structure includes SRAM cells, bit-line edge cells, and word-line edge cells, wherein the SRAM cells are arranged in an array, bordered by the bit-line edge cells and the word-line edge cells, each of the SRAM cells including two inverters cross-coupled together and a pass gate coupled to the two inverters, and the pass gate includes a FET; a first bit-line of a first metal material, disposed in a first metal layer, and electrically connected to a drain feature of the FET; a first word-line of a second metal material, and electrically connected to a gate electrode of the FET, and disposed in a second metal layer; and a second bit-line of a third metal material, electrically connected to the first bit-line, and disposed in a third metal layer. The first metal material and the third metal material are different from each other in composition.

Abstract: A non-volatile memory device including: a page buffer configured to latch a plurality of page data constituting one bit page of a plurality of bit pages, and a control logic configured to compare results of a plurality of read operations performed in response to a high-priority read signal set to select one of a plurality of read signals included in the high-priority read signal set as a high-priority read signal, and determine a low-priority read signal corresponding to the high-priority read signal, wherein the high-priority read signal set is for reading high-priority page data, and the low-priority read signal is for reading low-priority page data.

Abstract: According to one embodiment, a memory system includes a memory controller configured to send a first command set including arithmetic operation target data and an address that designates a memory cell to store weight data; and a nonvolatile semiconductor memory configured to receive the first command set from the memory controller, read the weight data from the memory cell designated by the address, perform an arithmetic operation based on the arithmetic operation target data and the weight data, and send arithmetic operation result data to the memory controller.

Abstract: A method for compensating for a read error is disclosed, wherein each of n states are read from memory cells of a memory, the states being determined in a time domain. If the n states do not form a code word of a k-from-n code, a plurality of states from the n states, which were determined within a reading window, are provided with a first valid assignment and fed to an error processing stage. If the error processing does not indicate an error, the n states are further processed with the first valid assignment, and if the error processing indicates an error, the plurality of states that were determined within the reading window are provided with a second valid assignment and the n states are further processed with the second valid assignment. Accordingly, a device, a system and a computer program product are also disclosed.

Abstract: A data storage device is provided. The data storage device includes: a first function block of a device controller configured to receive user data and perform a first data processing; a first buffer memory connected to the first function block and configured to store user data subjected to the first data processing as first process data; a second function block of the device controller configured to receive a data write command determined based on the first process data; and a non-volatile memory connected to the second function block, and configured to receive and store data stored in the first buffer memory. The user data is provided to the first function block before the data write command is provided to the second function block.

Abstract: A non-volatile memory device includes a memory cell region including a first metal pad and a memory cell array including a plurality of memory cells, and a peripheral circuit region including a second metal pad and an output driver to output a data signal, and vertically connected to the memory cell region by the first metal pad and the second metal pad. The output driver includes a pull-up driver and a pull-down driver. The pull-up driver includes a first pull-up driver having a plurality of P-type transistors and a second pull-up driver having a plurality of N-type transistors. The pull-down driver includes a plurality of N-type transistors. One or more power supply voltages having different voltage levels are selectively applied to the pull-up driver. A first power supply voltage is applied to the first pull-up driver, and a second power supply voltage is applied to the second pull-up driver.

Abstract: A semiconductor system includes a first semiconductor device and a second semiconductor device. The first semiconductor device outputs a chip selection signal, a command/address signal and a clock signal. The first semiconductor device outputs first external data and a strobe signal during a write operation in a test mode and receives second external data to adjust an output moment of the strobe signal during a read operation in the test mode. The second semiconductor device is synchronized with the strobe signal to latch input data generated from the first external data during the write operation according to the chip selection signal and the command/address signal. The second semiconductor device generates output data from the input data and outputs the output data as the second external data during the read operation according to the chip selection signal and the command/address signal.

Abstract: Systems and methods for dynamically assigning memory array die to CMOS die of a plurality of stacked die during memory operations are described. The plurality of stacked die may be vertically stacked and connected together via one or more vertical through-silicon via (TSV) connections. The memory array die may only comprise memory cell structures (e.g., vertical NAND strings) without column decoders, row decoders, charge pumps, sense amplifiers, control circuitry, page registers, or state machines. The CMOS die may contain support circuitry necessary for performing the memory operations, such as read and write memory operations. The one or more vertical TSV connections may allow each memory array die of the plurality of stacked die to communicate with or be electrically connected to one or more CMOS die of the plurality of stacked die.

Abstract: The non-volatile memory device includes a memory cell array including a plurality of memory cells and a voltage generator configured to supply a voltage to the memory cell array. The voltage generator includes a charge pump circuit, a switching circuit, and a stage controller. The charge pump circuit includes a plurality of pump units and is configured to output a pump voltage and a pump current in accordance with a number of pump units that have received an input voltage among the plurality of pump units. The switching circuit is configured to output the pump voltage. The stage controller is configured to receive an input signal corresponding to the pump current and perform a stage control operation of generating a stage control signal for controlling the number of pump units to be driven.

Abstract: A semiconductor memory device includes a controller for sequentially activating first and second control signals and activating a third control signal during an amplification period, in a pseudo cryogenic temperature, a first driver for driving a first power source line with a first voltage during an initial period of the amplification period, based on the first control signal, a second driver for driving the first power source line with a second voltage during a later period of the amplification period, based on the second control signal, a third driver for driving a second power source line with a third voltage during the amplification period, based on the third control signal, and a sense amplifier for primarily amplifying a voltage difference between a data line pair using the first and third voltages during the initial period, and secondarily amplifying the difference using the second and third voltages during the later period.

Abstract: A memory circuit includes: memory cells each including a storage transistor having a first configuration; and a tracking circuit including: a tracking bit line having first and second intermediary nodes; a tracking word line; a first finger circuit (coupled between the first intermediary node and a reference voltage node) including: a first set of first tracking cells, each including a first shadow transistor having the first configuration; and a second finger circuit (coupled between the second intermediary node and the reference voltage node) including: a second set of second tracking cells, each including a second shadow transistor having the first configuration; gate terminals of the first and second shadow transistors being coupled with the tracking word line; and a switch configured to selectively couple the first intermediary node with the second intermediary node and thereby selectively couple the first and second finger circuits in parallel.

Abstract: Memory devices and systems with configurable die powerup delay, and associated methods, are disclosed herein. In one embodiment, a memory system includes two or more memory dies. At least one memory die has a powerup group terminal and powerup group detect circuitry. The powerup group detect circuitry is configured to detect a powerup group assigned to the at least one memory die. The at least one memory die is configured to delay its powerup operation by a time delay corresponding to the powerup group to which it is assigned. In this manner, powerup operations of the two or more memory dies can be staggered to reduce peak current demand of the memory system.

Abstract: The present disclosure generally relates to enhanced write performance by taking into consideration user write performance preferences as well as enhanced post write read (EPWR) scheduling. The user provides the write performance preferences to the data storage device. When a write operation happens, the data storage device checks the write performance preference for the current LBA as well as the write performance preference for the previous LBA. The data storage device will also check whether the current word line is scheduled for EPWR. Based upon the write performance preferences for the LBAs and the EPWR scheduling, the data can be written out of order to meet the user's write performance preferences. If the data is written out of order, the flash translation layer (FLT) is informed of the switch.

Abstract: A non-volatile memory device including: a page buffer configured to latch a plurality of page data constituting one bit page of a plurality of bit pages, and a control logic configured to compare results of a plurality of read operations performed in response to a high-priority read signal set to select one of a plurality of read signals included in the high-priority read signal set as a high-priority read signal, and determine a low-priority read signal corresponding to the high-priority read signal, wherein the high-priority read signal set is for reading high-priority page data, and the low-priority read signal is for reading low-priority page data.

Abstract: High-efficiency control technology for non-volatile memory. A controller allocates spare blocks of a non-volatile memory to provide an active block and writes data issued by a host to the active block. The controller further uses the active block as the destination for data transferred from a first source block when there are fewer spare blocks than the threshold amount. When a second source block meets the transfer requirements, the controller uses the active block as the destination for data transferred from the second source block.

Abstract: A processor semiconductor chip is described. The processor semiconductor chip includes at least one processing core. The processor semiconductor chip also includes a memory controller. The processor semiconductor chip also includes an embedded non flash non-volatile random access memory having a stack of storage cells disposed above the processor semiconductor chip's semiconductor substrate. The embedded non-volatile random access memory is to store boot up program code that, when executed by the processor semiconductor chip, is to analyze a subsequent module of program code so that a maliciously modified version of the subsequent module of program code can be identified. The embedded non-volatile random access memory to also store the subsequent module of program code.

Abstract: A data writing method, a memory control circuit unit, and a memory storage device are provided. The method includes: writing a first data and a second data to a first physical erasing unit; copying the first data from the first physical erasing unit to a second physical erasing unit; and copying the second data from the first physical erasing unit to a third physical erasing unit, wherein the memory sub-module to which the second physical erasing unit belongs is different from the memory sub-module to which the third physical erasing unit belongs.

Abstract: Systems, apparatuses and methods related to subarray addressing for electronic memory and/or storage are described. Concurrent access to different rows within different subarrays may be enabled via independent subarray addressing such that each of the subarrays may serve as a “virtual bank.” Accessing the different rows as such may provide improved throughput of data values accessed from the respective rows being sent to a destination location. For instance, one such apparatus includes a plurality of subarrays within a bank of a memory device. Circuitry within the bank is coupled to the plurality of subarrays. The circuitry may be configured to activate a row at a particular ordinal position in a first subarray during a time period and a row at a different ordinal position in a second subarray of the plurality of subarrays during the same time period.

Abstract: A main word line circuit provides a first and second row factor signals. The main word line circuit includes a pull-up circuit to drive a global word line to follow a first decoded address signal when the first row factor signal is at a first value. The main word line circuit includes an intermediate voltage circuit to drive the global word line to follow a value of the second row factor signal. A processing device drives the global word line to an active state by setting the first row factor signal to the first value when the first decoded address signal is at a high state, and drives the global word line to follow a value of the second row factor signal by setting the first row factor signal to the second value while the first decoded address signal is at the high state.

Abstract: Methods and apparatuses for single level cell caching are described. According to one example, a method includes receiving, at a memory device, a first set of data to be stored in a lower page of multilevel memory cells, storing the first set of data in a page of single level memory cells, storing the first set of data in the lower page of the multilevel memory cells, receiving, at the memory device, a second set of data to be stored in an upper page of the multilevel memory cells, and storing the second set of data directly in the upper page of the multilevel memory cells.

Abstract: The present disclosure includes apparatuses and methods for simultaneous in data path compute operations. An apparatus can include a memory device having an array of memory cells and sensing circuitry selectably coupled to the array. A plurality of shared I/O lines can be configured to move data from the array of memory cells to a first portion of logic stripes and a second portion of logic stripes for in data path compute operations associated with the array. The first portion of logic stripes can perform a first number of operations on a first portion of data moved from the array of memory cells to the first portion of logic stripes while the second portion of logic stripes perform a second number of operations on a second portion of data moved from the array of memory cells to the second portion of logic stripes during a first time period.

Abstract: A memory system comprises a first memory including physical blocks, a second memory storing a first correspondence table in which a logical cluster address corresponding to an address assigned to data received from a host is correlated with a logical group number corresponding to a block group and a logical cluster number corresponding to a location within the block group, and a second correspondence table in which first physical block numbers corresponding to first physical blocks are correlated with a first logical group number and second physical block numbers corresponding to second physical blocks are correlated with a second logical group number, and a controller circuit that updates the first correspondence table when new data is written to the first physical blocks, and the second correspondence table, without changing the first corresponding table, when data is moved from the first to the second physical blocks.

Abstract: A three-dimensional integrated circuit non-volatile memory array includes a memory array of vertical channel NAND flash strings connected between a substrate source line and upper layer connection lines which each include n-type drain regions and p-type body line contact regions alternately disposed on each side of undoped or lightly doped string body regions so that each NAND flash string includes a vertical string body portion connected to a horizontal string body portion formed from the string body regions of the upper body connection lines.