Abstract: According to one embodiment, in a nonvolatile semiconductor memory device, a data latch circuit which is connected to a sense amplifier circuit controls a data writing operation and a data reading operation to and from a nonvolatile memory cell array through a data bus, and outputs the stored data to the data bus when the sense amplifier circuit performs the data writing operation. The data latch circuit is provided with two nodes respectively storing and outputting normal data and reverse data which are connected to the data bus.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: Disclosed is a semiconductor integrated circuit in which the number of bus lines is reduced and current consumption during operation can be lessened. The semiconductor integrated circuit includes a circuit unit (e.g., a memory cell array plate) which is divided into a plurality of banks (bank 1, bank 2) and processes multiple bits of data; a plurality of input/output circuits which perform input and output of multiple bits of data; and a plurality of bus lines which provide electrical coupling between the respective data input/output circuits and the circuit unit. Among the bus lines, two or more bus lines laid to extend laterally along the horizontal sides of the banks and coupled to different banks include a common bus line adapted as a shared bus line into which the middle parts of the bus lines are merged.

Abstract: In one or more of the disclosed embodiments, the number of times toggle operations of a data bus are performed at the time of a data transmission in a semiconductor storage apparatus is reduced, thereby reducing the power consumption. For example, a semiconductor storage apparatus according to one embodiment of the present invention comprises a DRF bus, a DR11F bus, a GDRF bus and a GDR11F bus. The DRF bus and DR11F bus, and the GDRF bus and GDR11F bus, are placed in parallel for the purpose of reducing the number of times toggle operations of a data bus are performed at the time of a data transmission. The DR11F bus is added to make the DRF11F bus perform a toggle operation only when the DRF buses on both sides are made to perform a toggle operation if the data transmission were performed in a conventional system.

Abstract: Provided is a data transfer apparatus and method that enables fast data transfer, and has a simple circuit configuration and a small area; and a semiconductor circuit.

Abstract: Dual I/O data read is performed in an integrated circuit which includes a serial peripheral interface memory device. In one example, a second page read address is transmitted to the memory device using a first input pin and a second input pin concurrently, while transferring data from the memory device associated with a first page read address using a first output pin and a second output pin concurrently. The first page read address is associated with a first location in the memory device and the second page read address is associated with a second location in the memory device.

Abstract: A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed In an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has the maximum variation width of a threshold voltage for memorizing information set larger than that of the second nonvolatile memory area. When the maximum variation width of the threshold voltage for memorizing information is larger, since stress to a memory cell owing to a rewrite operation of memory information becomes larger, it is inferior In a point of guaranteeing the number of times of rewrite operation; however, since a read current becomes larger, a read speed of memory information can be expedited.

Abstract: A system is provided for multi-rank, partial-width memory modules. A memory controller is provided. Additionally, a memory bus is provided. Further, a memory module with a plurality of ranks of memory circuits is provided, the memory module including a first number of data pins that is less than a second number of data pins of the memory bus.

Abstract: Circuits and methods for reducing noise in the power supply of circuits coupled to a bidirectional bus are presented. The circuits and methods are responsive to an idle condition on the bidirectional bus. The control signal is applied to and changes an electrical characteristic within the receiver to generate a voltage offset. The voltage offset prevents unintended voltage transitions in the power supply of circuits coupled to the bidirectional bus from generating a signal transition on an output signal connection of the receiver.

Abstract: A DRAM and memory controller are coupled during driver training to reduce mismatches. The impedances of the system are controlled through a termination at the controller to yield improvements in timing margins. The coupling of the components on a shared electrical bus through adjustment of the termination values during training removes known offset issues.

Abstract: A memory structure is described. In one embodiment, the memory structure comprises a memory controller configured to receive a clock signal and to be coupled to a plurality of memory modules via a single address/control bus. The memory controller couples to each of the plurality of memory modules via a separate chip select signal for each memory module. The memory controller issues commands across the address/control bus to the memory modules in an interleaved fashion in accordance with the timing supplied by the clock. During a waiting period after issuance of a command to one memory module, the memory controller can issue commands to a different memory module.

Abstract: An integrated circuit device includes a serial peripheral interface adapted for receiving a first command supporting an address of a first configuration, wherein the serial peripheral interface supports an address of a second configuration upon receipt of a second command, the second configuration being different from the first configuration. In a specific embodiment, the first and the second configurations are different in address length. In another embodiment, a second address cooperated with the second command has a first part and a second part, the second part comprising a plurality of byte addresses, each of the byte addresses being associated with a corresponding byte of data. In another embodiment, integrated circuit device also includes a mode logic circuit for controlling operations of the first command and the second command. Various other embodiments are also described.

Abstract: A semiconductor memory device includes a memory cell array divided into a plurality of areas, a common data bus connected to an input/output circuit, a plurality of individual data buses connected to different areas of the memory cell array through different paths respectively, and a bidirectional buffer connected to the common data bus and the individual data buses. In the semiconductor memory device, the bidirectional buffers transmit data bidirectionally between the common data bus and a selected one of the individual data buses.

Abstract: A design structure, structure and method of using and/or manufacturing structures having asymmetric junction engineered SRAM pass gates is provided. The structure includes an SRAM cell having asymmetric junction-engineered SRAM pass gates with a high leakage junction and a low leakage junction. The asymmetric junction-engineered SRAM pass gates are connected between an internal node and a bit-line node. The high leakage junction is from a body to the internal node and the low leakage junction is from the body to the bit-line node.

Abstract: A semiconductor storage device includes: a plurality of memory cell arrays; a plurality of bidirectional data buses provided in correspondence with respective ones of the plurality of memory cell arrays; a plurality of bidirectional buffer circuits, which are provided in correspondence with respective ones of the memory cell arrays, capable of connecting adjacent bidirectional data buses serially so as to relay data in the bidirectional data buses; and a control circuit for controlling activation of the bidirectional buffer circuits. The bidirectional buffer circuit is arranged so as to invert logic and the bidirectional buffer circuit is arranged so as not to invert logic.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed in an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has the maximum variation width of a threshold voltage for memorizing information set larger than that of the second nonvolatile memory area. When the maximum variation width of the threshold voltage for memorizing information is larger, since stress to a memory cell owing to a rewrite operation of memory information becomes larger, it is inferior in a point of guaranteeing the number of times of rewrite operation; however, since a read current becomes larger, a read speed of memory information can be expedited.

Abstract: A semiconductor device includes: first and second input/output terminals; a first input/output line connected to the first input/output terminal; a second input/output line connected to the second input/output terminal; and a first by-path route that connects the first input/output line and the second input/output line. When in normal operation mode, the first by-path route is set in a non-conductive state. When in a test mode, the first by-path route is set into a conductive state so that a first data inputted to the first input/output terminal is outputted as a first data to the second input/output line, in correspondence with a transition of a clock signal in the first direction, and so that a second data inputted to said first input/output terminal is outputted as a second input data for said first input/output line, in correspondence with a transition of said clock signal in the second direction.

Abstract: A non-volatile storage device includes a substrate, a monolithic three-dimensional memory array of non-volatile storage elements arranged above a portion of the substrate, a plurality of sense amplifiers in communication with the non-volatile storage elements, a plurality of temporary storage devices in communication with the sense amplifiers, a page register in communication with the temporary storage devices, and one or more control circuits. The one or more control circuits are in communication with the page register, the temporary storage devices and the sense amplifiers. The sense amplifiers are arranged on the substrate underneath the monolithic three-dimensional memory array. The temporary storage devices are arranged on the substrate underneath the monolithic three-dimensional memory array. The page register is arranged on the substrate in an area that is not underneath the monolithic three-dimensional memory array.

Abstract: A system for providing on-die termination (ODT) of a control signal bus. The system includes a memory device that includes a plurality of data bus connectors, one or both of a load signal connector and a reset signal connector, a control bus connector, an ODT, and a mechanism. The ODT is in communication with the control bus connector, and the ODT provides a level of termination resistance to a control bus connected to the control bus connector. The mechanism latches data received via the data bus connectors in response to a signal received via one or both of the load signal connector and the reset signal connector. The data is utilized to set the level of termination resistance provided by the ODT.

Abstract: A memory has a serial interface. The serial interface is programmable to either use separate dedicated input and output pads, or to use one bidirectional pad. When one bidirectional pad is used, the interface signal count is reduced by one.

Abstract: A semiconductor memory device includes a data input driver and a data output driver for receiving an external power supply voltage, and for inputting and outputting data, respectively; and a voltage detector for detecting the external power supply voltage to generate a detection signal, wherein a drive current of each of the data input driver and the data output driver is controlled by the detection signal.

Abstract: A repeater of a global input/output line includes a data transmitter including first and second drivers for outputting data signals of the global input/output line through different transmission routes in response to a transmission direction control signal, and a third driver for driving the global input/output line in response to an output signal of the data transmitter.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: A memory device has multiple bi-directional data paths. One of the multiple bi-directional data paths is configured to transfer data at one speed. Another one of the multiple bi-directional data paths is configured to transfer data at another speed.

Abstract: An integrated circuit and a method for transferring data is provided. One embodiment provides a method for transferring data in an integrated circuit. The method includes driving a first line in accordance with data to be transferred. The data is transmitted from the first line to a second line based on a capacitive coupling.

Abstract: A memory with improved write current is provided, including a bit line, a write switch and a control circuit. The write switch is coupled between a voltage source and the bit line, and has a control terminal. Based on a bit line select signal, the control circuit controls the electric conductance of the write switch and discharges/charges the parasitic capacitors of the write switch. The voltage source is turned on after the control terminal of the write switch reaches a pre-determined voltage level.

Abstract: The semiconductor device includes a first pair of data lines, a second pair of data lines, a third pair of data lines, a first amplifier (SA) connected to the first pair of data lines, a first switch that controls connection between the first pair of data lines and the second pair of data lines, a second switch that controls connection between the second pair of data lines and the third pair of data lines, a second amplifier that amplifies data on the second pair of data lines, for output to the third pair of data lines, a third amplifier connected to the third pair of data lines, and a control circuit that controls the second switch forming a pair of switches. When two data lines constituting the third pair of data lines both assume a first state, the control circuit controls the second switch to be turned off, thereby controlling the second pair of data lines and the third pair of data lines to be disconnected.

Abstract: A memory interface subsystem including a write logic and a read logic. The write logic may be configured to communicate data from a memory controller to a memory. The read logic may be configured to communicate data from the memory to the memory controller. The read logic may comprise a plurality of physical read datapaths. Each of the physical read datapaths may be configured to receive (i) a respective portion of read data signals from the memory, (ii) a respective read data strobe signal associated with the respective portion of the received read data signals, (iii) a gating signal, (iv) a base delay signal and (v) an offset delay signal.

Abstract: An initial verify read operation is performed after each programming pulse. The verify voltage starts at an initial verify voltage for the first word line and increases for each word line that is verified up to a maximum verify voltage. A second verify read operation is then performed after the program/verify operation. The second verify read operation uses a verify voltage that is substantially close to the maximum verify voltage used during the program/verify step.

Abstract: A semiconductor integrated circuit includes a memory, a master interface circuit that performs one of receiving a data transfer request from the memory and outputting a data transfer request to the memory, a slave interface circuit that performs one of receiving data from the memory and outputting data to the memory in response to the data transfer requests, and a delay circuit that delays a data transfer end signal that indicates one of an end of a data transfer from the memory and an end of a data transfer to the memory.

Abstract: Disclosed is a semiconductor memory device includes a selector for selectively loading read inversion information and write inversion information on an inversion bus, the inversion bus for transferring the inversion information loaded by the selector, a plurality of read inversion units for reflecting the inversion information from the inversion bus to output data, and a plurality of write inversion units for reflecting the inversion information from the inversion bus to input data.

Abstract: A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed in an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has the maximum variation width of a threshold voltage for memorizing information set larger than that of the second nonvolatile memory area. When the maximum variation width of the threshold voltage for memorizing information is larger, since stress to a memory cell owing to a rewrite operation of memory information becomes larger, it is inferior in a point of guaranteeing the number of times of rewrite operation; however, since a read current becomes larger, a read speed of memory information can be expedited.

Abstract: A memory die, including a memory array, a memory array data terminal and a data bus that includes a first sub bus and a second sub bus is disclosed. A first bi-directional buffer arranged between the memory array data terminal and the first sub bus and a second bi-directional buffer arranged between the memory array data terminal and the second sub bus is also disclosed. The first and second bi-directional buffers are adapted to couple the first sub bus or the second sub bus to the memory array data terminal at a time.

Abstract: A memory has a serial interface. The serial interface is programmable to either use separate dedicated input and output pads, or to use one bidirectional pad. When one bidirectional pad is used, the interface signal count is reduced by one.

Abstract: A memory cell array includes a plurality of non-volatile semiconductor memory elements, each memory element storing data in a non-volatile manner. A shift register stores data read from the semiconductor memory element and sequentially transfers the data outside, the shift register also stores data transferred from outside and stores the data in the semiconductor memory element. A syndrome generation circuit is connected to an output terminal of the shift register, the syndrome generation circuit generating syndrome of data output from the output terminal. An error-correction circuit uses the data and the syndrome to correct an error of the data.

Abstract: A semiconductor device includes plural memory cell blocks, each having a memory array of plural memory cells. Plural control circuits are provided in correspondence with each of the memory cell blocks, for writing information to the memory cell blocks and for reading information written in the memory cell blocks. Plural input/output terminals are for inputting the information to be written and for outputting the information to be read. Plural multiplexers are provided in correspondence with each of the input/output terminals, for conveying the information to be written from the input/output terminals and for conveying the information to be read to the input/.output terminals. A bidirectional transfer type buffer is connected to each connection line between the control circuits and the multiplexers, for selectively conveying information from the control circuits to each of the multiplexers and for selectively conveying information from the multiplexers to each of the control circuits.

Abstract: A semiconductor memory apparatus includes a main bank configured to combine a first sub bank and a second sub bank. A center bitline sense amplifier array is arranged in a region where the first sub bank meets the second sub bank. A first precharge section is arranged above the first sub bank and a second precharge section is arranged below the second sub bank. The first precharge section precharges local input/output lines of the first sub bank and the second sub bank and the second precharge section precharges the local input/output lines.

Abstract: An apparatus includes a control unit for generating an input control signal to select a global input/output line to which data is transmitted. A repeater receives data from the global input/output line to output the data to a global input/output line corresponding to the input control signal. A plurality of input drivers receive the data from the repeater to transmit the data to a local input/output line connected to each memory bank.

Abstract: In one embodiment, the present invention includes a processor having multiple processor cores to execute instructions, with each of the cores including dedicated digital interface circuitry. The processor further includes an analog interface coupled to the cores via the digital interface circuitry. The analog interface may be used to communicate traffic between a package including the cores and an interconnect such as a shared bus coupled thereto. Other embodiments are described and claimed.

Abstract: In a multi-port memory device, a plurality of ports simultaneously access a plurality of banks through global data buses. A data conflict detector compares valid data signals input from the plurality of ports through the global data buses to the plurality of banks, and detects data conflict caused when the valid data signals are simultaneously input to the same bank.

Abstract: A method for dual I/O data read in an integrated circuit which includes a serial peripheral interface memory device. In an embodiment, the memory device includes a clock signal, a plurality of pins, and a configuration register. In an embodiment, the configuration register includes a wait cycle count. The method includes transmitting a read address to the memory device using a first input/output pin and a second input/output pin concurrently. In an embodiment, the read address includes at least a first address bit and a second address bit, the first address bit being transmitted using the first input/output pin, and the second address bit being transmitted using the second input/output pin. The method includes accessing the memory device for data associated with the address and waiting a predetermined number clock cycles associated with the wait cycle count. The method includes transferring the data from the memory device using the first input/output pin and the second input/output pin concurrently.

Abstract: A semiconductor memory device includes plural ports for transmitting an input data serial-interfaced with an external device into a global data bus, plural banks for parallel-interfacing with the plural ports through the global data bus, plural input signal transmission blocks, responsive to a mode register enable signal, for transmitting an input signal parallel-interfaced with the external device into the global data bus, and a mode register set for determining one of a data access mode and a test mode based on the input signal inputted through the global data bus.

Abstract: In one embodiment of the invention, a memory module is disclosed including a printed circuit board with an edge connector; an address controller coupled to the printed circuit board; and a plurality of memory slices. Each of the plurality of memory slices of the memory module includes one or more memory integrated circuits coupled to the printed circuit board, and a slave memory controller coupled to the printed circuit board and the one or more memory integrated circuits. The slave memory controller receives memory access requests for the memory module from the address controller. The slave memory controller selectively activates one or more of the one or more memory integrated circuits in the respective memory slice in response to the address received from the address controller to read data from or write data into selected memory locations in the memory integrated circuits.

Abstract: A dynamic random access memory (“DRAM”) device includes a pair of internal address buses that are selectively coupled to an external address bus by an address multiplexer, and a pair of internal data buses that are selectively coupled to an external data bus by a data multiplexer. The DRAM device also includes a bank multiplexer for each bank of memory cells that selectively couples one of the internal address buses and one of the internal data buses to the respective bank of memory cells. Select signals generated by a command decoder cause the multiplexers to select alternate internal address and data buses responsive to each memory command received by the command decoder.

Abstract: Systems and methods disclosed herein provide for variable data width memory. For example, in accordance with an embodiment of the present invention, a technique for doubling a width of a memory is disclosed, without having to increase a width of the internal data path or the number of input/output pads.

Abstract: A memory device with global lines being used for other applications when the global lines are not in use is provided. The memory device includes: a plurality of banks; a global input/output line for transferring data input/output signals of the plurality of banks in a normal operation; and a bank selection signal transferring unit for transferring a plurality of test bank selection signals to the plurality of banks in a test mode.

Abstract: A memory device includes a first sensing amplifier to amplify data received from the memory array, a first driver to generate a first tri-state signal responsive to the amplified data from an first sense amplifier and to provide the first tri-state signal to a data bus line, a second sensing amplifier to amplify data received from the memory array, and a second driver to generate a second tri-state signal responsive to the amplified data from an second sense amplifier and to provide the second tri-state signal to the data bus line, where the first sensing amplifier and the first driver are located in different regions of the device, and the second sensing amplifier and the second driver are located in a common region of the device.

Abstract: A semiconductor memory device includes a memory cell array divided into a plurality of areas, a common data bus connected to an input/output circuit, a plurality of individual data buses connected to different areas of the memory cell array through different paths respectively, and a bidirectional buffer connected to the common data bus and the individual data buses. In the semiconductor memory device, the bidirectional buffers data transmitted bidirectionally between the common data bus and a selected one of the individual data buses.

Abstract: A phase change memory includes a plurality of cells for storing data in the form of respective resistance levels, addressing circuits for addressing cells to be programmed, and the resistance levels are determined from comparison of cell currents of addressed cells with a reference current. A reference generator provides the sense amplifier with the reference current. The reference generator is provided with a reference select circuit to select the reference current from a plurality of verify currents based on program data to be stored in the cell.