Capacitive Patents (Class 367/181)
  • Patent number: 10750291
    Abstract: The application describes MEMS transducers having a patterned membrane electrode which incorporates a plurality of openings or voids. A conductive element is provided on the surface of the underlying membrane within the opening.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: August 18, 2020
    Assignee: Cirrus Logic, Inc.
    Inventors: Marek Sebastian Piechocinski, Richard Ian Laming, Tsjerk Hans Hoekstra, Colin Robert Jenkins, Axel Thomsen
  • Patent number: 10681472
    Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, the back plate having a plurality of acoustic holes, a diaphragm interposed between the substrate and the back plate, and being spaced apart from the substrate and the back plate, the diaphragm covering the cavity, forming an air gap between the back plate, and sensing an acoustic pressure to generate a displacement, and a plurality of anchors extending from an end portion of the diaphragm and along a circumference of the diaphragm, each of the anchors having a serpentine shape in a plan view and including a bottom portion making contact with an upper surface of the substrate to support the diaphragm from the substrate. Thus, the MEMS microphone may have adjustable area of the slit.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: June 9, 2020
    Assignee: DB HITEK CO., LTD.
    Inventor: Jong Won Sun
  • Patent number: 10674999
    Abstract: An ultrasound system (1) is disclosed that comprises a probe (10) including an array (110) of CMUT (capacitive micromachined ultrasound transducer) cells (100), each cell comprising a substrate (112) carrying a first electrode (122), the substrate being spatially separated from a flexible membrane (114) including a second electrode (120) by a gap (118); and a bias voltage source (45) coupled to said probe and adapted to provide the respective first electrodes and second electrodes of at least some of the CMUT cells with a monotonically varying bias voltage including a monotonically varying frequency modulation in a transmission mode of said probe such that the CMUT cells are operated in a collapsed state and transmit at least one chirped pulse during said transmission mode. Such a system for instance may be an ultrasound imaging system or an ultrasound therapeutic system. An ultrasonic pulse generation method using such as system is also disclosed.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: June 9, 2020
    Assignee: Koninklijke Philips N.V.
    Inventors: Martin Pekar, Martinus Bernardus Van Der Mark
  • Patent number: 10656255
    Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. An interior support structure is disposed within the cavity and connected to the substrate and the membrane.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: May 19, 2020
    Assignee: InvenSense, Inc.
    Inventors: Eldwin Ng, Julius Ming-Lin Tsai, Nikhil Apte
  • Patent number: 10638237
    Abstract: The present disclosure provides a microphone and a manufacturing method thereof. The microphone includes: a fixed membrane disposed on a substrate; a diaphragm spaced apart from the fixed membrane, wherein an air layer is positioned between the fixed membrane and the diaphragm; a supporting layer configured to support the diaphragm on the fixed membrane; and a damping hole configured to flow air in the air layer to a non-sensing area of the supporting layer.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: April 28, 2020
    Assignees: Hyundai Motor Company, KIA Motors Corporation
    Inventor: Ilseon Yoo
  • Patent number: 10638235
    Abstract: A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: April 28, 2020
    Assignee: Merry Electronics (Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang
  • Patent number: 10623852
    Abstract: The application relates to MEMS transducers comprising at least one support structure for connecting a backplate structure of the transducer with an underlying substrate. A strengthening portion is provided in the region of the support structure.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: April 14, 2020
    Assignee: Cirrus Logic, Inc.
    Inventors: Scott Lyall Cargill, Timothy John Brosnihan
  • Patent number: 10602280
    Abstract: A condenser microphone, including at least one diaphragm, at least one electrode assigned to the diaphragm, comprising at least one ring-shaped insulator holding the electrode, comprising at least one diaphragm ring holding the diaphragm, and a holding ring holding the components mentioned. The mechanical and electrical properties of the condenser microphone are improved where the holding ring includes ceramic material. Preferably, the diaphragm ring and/or the ring-shaped insulator also consist(s) of ceramic material. With further preference, the ceramic material is zirconium oxide.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: March 24, 2020
    Assignee: Austrian Audio GmbH
    Inventors: Dieter Rapitsch, Christoph Frank, Mathias Balac
  • Patent number: 10555087
    Abstract: An acoustic sensor has a semiconductor substrate having an opening, a back plate that is disposed facing the opening of the semiconductor substrate, that is configured to function as a fixed electrode, and that has sound holes that allow passage of air, a vibration electrode film disposed facing the back plate through a void, and a casing configured to house the substrate, the back plate, and the vibration electrode film, and having a pressure hole that allows inflow of air. The acoustic sensor converts transformation of the vibration electrode film into a change in capacitance between the vibration electrode film and the back plate to detect sound pressure.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: February 4, 2020
    Assignee: Omron Corporation
    Inventor: Yuki Uchida
  • Patent number: 10551264
    Abstract: Embodiments relate generally to an ultrasonic detector, and methods of making the ultrasonic detector. The ultrasonic detector may comprise a piezoelectric element operable to convert the pressure of sound waves from mechanical energy into electric signal; a protective cover; a hot melt adhesive; one or more layers of solder; one or more perforated metal electrodes comprising openings filled with the solder; and one or more support elements. The ultrasonic detector may also comprise one or more casing elements operable to enclose and house the other elements of the ultrasonic detector; a printed circuit board (PCB) operable to receive ultrasonic data from the piezoelectric element and electrodes, wherein the electrodes connect to, or contact, the PCB; and an insulator located in proximity to the electrodes, and operable to prevent shorting between the metal electrodes and the metal casing elements.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: February 4, 2020
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Michael Ethan Grant, Jeffrey Cutler
  • Patent number: 10425724
    Abstract: Disclosed herein, among other things, are systems and methods for improved circuit design for hearing assistance devices. One aspect of the present subject matter includes a hearing assistance device configured to compensate for hearing losses of a user. The hearing assistance device includes a substrate and an interposer embedded into the substrate to form a system in package module. According to various embodiments, the interposer includes one or more integrated circuits (ICs) on the interposer, the one or more ICs configured to provide electronics for the hearing assistance device.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: September 24, 2019
    Assignee: Starkey Laboratories, Inc.
    Inventors: Douglas F. Link, Ay Vang, Yike Wang
  • Patent number: 10425744
    Abstract: The present disclosure provides a microphone including: a substrate having an acoustic hole; a vibrating electrode disposed on the substrate; and a fixing layer disposed on the vibrating electrode, wherein a central portion of the fixing layer corresponding to the acoustic hole of the substrate is formed upwardly convex.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: September 24, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Ilseon Yoo
  • Patent number: 10413938
    Abstract: In some examples, a CMUT array may include a plurality of elements, and each element may include a plurality of sub-elements. For instance, a first sub-element and a second sub-element may be disposed on opposite sides of a third sub-element. In some cases, the third sub-element may be configured to transmit ultrasonic energy at a higher center frequency than at least one of the first sub-element or the second sub-element. Further, in some instances, the sub-elements may have a plurality of regions in which different regions are configured to transmit ultrasonic energy at different resonant frequencies. For instance, the resonant frequencies of a plurality of CMUT cells in each sub-element may decrease in an elevation direction from a center of each element toward the edges of the CMUT array.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: September 17, 2019
    Assignee: Kolo Medical, Ltd.
    Inventors: Danhua Zhao, Xuefeng Zhuang, Yongli Huang
  • Patent number: 10399121
    Abstract: In some examples, a capacitive micromachined ultrasonic transducer (CMUT) includes a first electrode and a second electrode. The CMUT may be connectable to a bias voltage supply for supplying a bias voltage, and a transmit and/or receive (TX/RX) circuit. In some cases, a first capacitor having a first electrode may be electrically connected to the first electrode of the CMUT, the first capacitor having a second electrode that may be electrically connected to the TX/RX circuit. Furthermore, a first resistor may include a first electrode electrically connected to the first electrode of the first capacitor and the first electrode of the CMUT. A second electrode of the first resistor may be electrically connected to at least one of: a ground or common return path, or the second electrode of the first capacitor.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: September 3, 2019
    Assignee: Kolo Medical, Ltd.
    Inventors: Xuefeng Zhuang, Danhua Zhao, Yongli Huang
  • Patent number: 10291973
    Abstract: A microphone includes a base and a microelectromechanical system (MEMS) die and an integrated circuit (IC) disposed on the base. The microphone also includes a cover mounted on the base and covering the MEMS die and the IC. The cover includes an indented region or an inwardly drawn region that define a top port through which acoustic energy can enter the microphone and be incident on the MEMS die. The microphone also includes a filtering material disposed on the top port on an outside surface of the cover and within the indented region or the inwardly drawn region. The filtering material provides resistance to ingression of solid particles or liquids into the microphone.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 14, 2019
    Assignee: Knowles Electronics, LLC
    Inventors: Tony K. Lim, Norman Dennis Talag
  • Patent number: 10277968
    Abstract: The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: April 30, 2019
    Assignee: Goertek.Inc
    Inventors: Guanxun Qiu, Qinglin Song
  • Patent number: 10250963
    Abstract: A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: April 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Li-Wen Hung, John U. Knickerbocker
  • Patent number: 10225662
    Abstract: An audio sensing device having a resonator array and a method of acquiring frequency information using the audio sensing device are provided. The audio sensing device includes a substrate having a cavity formed therein, a membrane provided on the substrate and covering the cavity, and a plurality of resonators provided on the membrane and respectively sensing sound frequencies of different frequency bands.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: March 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Cheheung Kim
  • Patent number: 10212501
    Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: February 19, 2019
    Assignee: GOERTEK.INC
    Inventors: Zhe Wang, Quanbo Zou, Jifang Tao
  • Patent number: 10192805
    Abstract: A semiconductor structure includes a semiconductor wafer having at least one semiconductor device integrated in a first device layer, a thermally conductive but electrically isolating layer on a back side of the semiconductor wafer, a front side glass on a front side of the semiconductor wafer, where the thermally conductive but electrically isolating layer is configured to dissipate heat from the at least one semiconductor device integrated in the semiconductor wafer. The thermally conductive but electrically isolating layer is selected from the group consisting of aluminum nitride, beryllium oxide, and aluminum oxide. The at least one semiconductor device is selected from the group consisting of a complementary-metal-oxide-semiconductor (CMOS) switch and a bipolar complementary-metal-oxide-semiconductor (BiCMOS) switch. The semiconductor structure also includes at least one pad opening extending from the back side of the semiconductor wafer to a contact pad.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: January 29, 2019
    Assignee: Newport Fab, LLC
    Inventor: David J. Howard
  • Patent number: 10129665
    Abstract: A device, including a vibratory apparatus having an actuator configured to generate vibrations upon actuation of the actuator, including plurality of lever arms, wherein the vibratory apparatus is configured such that at least a respective portion of respective lever arms of the plurality of lever arms move about at least one of a single or a respective hinge when the vibratory apparatus is generating vibrations.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: November 13, 2018
    Assignee: Cochlear Limited
    Inventor: Scott Allen Miller
  • Patent number: 10125012
    Abstract: A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of contact pads for contacting the MEMS device and a second set of contact pads for contacting the first chip are arranged. The first chip is mechanically attached and electrically connected to the second set of contact pads via the mounting surface facing the main surface. The mounting surface of the first chip is at least 25% smaller than the main surface of the MEMS chip.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: November 13, 2018
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Horst Theuss
  • Patent number: 10117028
    Abstract: A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: October 30, 2018
    Assignee: Cirrus Logic, Inc.
    Inventors: David Talmage Patten, Tsjerk Hans Hoekstra
  • Patent number: 10030500
    Abstract: A wellbore surveillance system obtains fluid reservoir information data, such as the position and amount of gas, oil and/or water, while draining hydrocarbons from an oil or gas field via a casing in a wellbore in a formation. The casing has a vertical part near a top of the casing and an inner face, the system comprising a first sensor for measuring a content of gas, oil and/or water in the formation, and a second sensor for measuring a content of gas, oil and/or water in the formation.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: July 24, 2018
    Assignee: WELLTEC A/S
    Inventor: Jorgen Hallundbæk
  • Patent number: 10006824
    Abstract: Microelectromechanical systems (MEMS) pressure sensors having a leakage path are described. Provided implementations can comprise a MEMS pressure sensor system associated with a back cavity and a membrane that separates the back cavity and an ambient atmosphere. A pressure of the ambient atmosphere is determined based on a parameter associated with movement of the membrane.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: June 26, 2018
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Aleksey S. Khenkin, Baris Cagdaser, James Christian Salvia, Fariborz Assaderaghi
  • Patent number: 10000374
    Abstract: A layer material which is particularly suitable for the realization of self-supporting structural elements having an electrode in the layer structure of a MEMS component. The self-supporting structural element is at least partially made up of a silicon carbonitride (Si1-x-yCxNy)-based layer.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: June 19, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Christoph Schelling, Benedikt Stein, Michael Stumber
  • Patent number: 9986342
    Abstract: A transducer includes at least one element including a plurality of cells. Each of the cells includes a pair of electrodes disposed with a gap therebetween and a vibrating membrane including one of the electrodes, and the vibrating membrane is vibratably supported. First and second cells of the plurality of cells in the element have the gaps that communicate with each other, and the first cell and a third cell in the element have the gaps that do not communicate with each other.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: May 29, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kazutoshi Torashima, Ayako Kato, Takahiro Akiyama
  • Patent number: 9888325
    Abstract: Systems and methods for preventing electrical leakage in a MEMS microphone. In one embodiment, the MEMS microphone includes a semiconductor substrate, an electrode, a first insulation layer, and a doped region. The first insulation layer is formed between the electrode and the semiconductor substrate. The doped region is implanted in at least a portion of the semiconductor substrate where the semiconductor substrate is in contact with the first insulation layer. The doped region is also electrically coupled to the electrode.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: February 6, 2018
    Assignee: Robert Bosch GmbH
    Inventors: Brett Mathew Diamond, John M. Muza, John W. Zinn
  • Patent number: 9872120
    Abstract: An ultrasonic transducer module may comprise: an ultrasonic transducer comprising a substrate, a thin film separated from the substrate, a support portion for supporting the thin film, and a first electrode pad on the substrate; and/or a circuit board comprising a main body, an opening in the main body for accommodating the thin film, and a second electrode pad attached to the first electrode pad. An ultrasonic transducer may comprise: a substrate; a plurality of first electrode layers on the substrate, with spaces between the first electrode layers; an insulating layer between the substrate and the first electrode layers; a support portion on the first electrode layers; a thin film supported by the support portion, with cavities between each of the first electrode layers and the thin film; and/or a second electrode layer on the thin film.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: January 16, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seogwoo Hong, Dongsik Shim, Seokwhan Chung
  • Patent number: 9853201
    Abstract: A piezoelectric MEMS microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: December 26, 2017
    Assignee: The Regents of the University of Michigan
    Inventors: Karl Grosh, Robert J. Littrell
  • Patent number: 9842241
    Abstract: An embodiment includes an ultrasonic sensor system comprising: a backend material stack including a first metal layer between a substrate and a second metal layer with each of the first and second metal layers including a dielectric material; a ultrasonic sensor including a chamber, having a negative air pressure, that is sealed by first and second electrodes coupled to each other with first and second sidewalls; an interconnect, not included in the sensor, in the second metal layer; wherein (a) a first vertical axis intersects the substrate, the chamber, and the first and second electrodes, (b) a second vertical axis intersects the interconnect and the substrate, (c) a first horizontal axis intersects the chamber, the interconnect, and the first and second sidewalls, and (d) the first and second electrodes and the first and second sidewalls each include copper and each are included in the second metal layer.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: December 12, 2017
    Assignee: Intel Corporation
    Inventors: Mondira D. Pant, Mohamed A. Abdelmoneum, Tanay Karnik
  • Patent number: 9820066
    Abstract: A micro speaker is disclosed. The micro speaker includes a diaphragm and a voice coil for driving the diaphragm, the diaphragm including a conductive dome a suspension surrounding the conductive dome; a conductive front cover located adjacent to and keeping a distance from the conductive dome; and a capacitor formed by the conductive dome and the conductive front cover for outputting electrical signals according to vibrations of the diaphragm and for detecting real-time replacement of the diaphragm.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: November 14, 2017
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventor: Yang Zhang
  • Patent number: 9820067
    Abstract: A micro speaker is disclosed. The micro speaker includes a diaphragm and a voice coil for driving the diaphragm, the diaphragm including a conductive dome and a suspension surrounding the conductive dome, the conductive dome including a plurality of units being isolated from each other; a conductive front cover located adjacent to and keeping a distance from the conductive dome, the conductive front cover including a plurality of units being isolated from each other; and a plurality of capacitors formed by the units of conductive front cover and the units of the conductive dome for outputting electrical signals according to vibrations of the diaphragm and for detecting real-time replacement of the diaphragm.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: November 14, 2017
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventor: Yang Zhang
  • Patent number: 9820068
    Abstract: A micro speaker is disclosed. The micro speaker includes a diaphragm and a voice coil for driving the diaphragm, the diaphragm including a conductive dome and a suspension surrounding the conductive dome, the conductive dome including a plurality of units being isolated from each other; a conductive front cover located adjacent to and keeping a distance from the conductive dome; and a plurality of capacitors formed by the units of conductive dome and the conductive front cover for outputting electrical signals according to vibrations of the diaphragm and for detecting real-time replacement of the diaphragm.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: November 14, 2017
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventor: Yang Zhang
  • Patent number: 9820069
    Abstract: A micro speaker is disclosed. The micro speaker includes a diaphragm and a voice coil for driving the diaphragm, the diaphragm including a conductive dome and a suspension surrounding the conductive dome; a conductive front cover located adjacent to and keeping a distance from the conductive dome, the conductive front cover including a plurality of units being isolated from each other; and a plurality of capacitors formed by the units of conductive front cover and the conductive dome for outputting electrical signals according to vibrations of the diaphragm and for detecting real-time replacement of the diaphragm.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: November 14, 2017
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventor: Yang Zhang
  • Patent number: 9745188
    Abstract: A microelectromechanical device may include: a semiconductor carrier; a microelectromechanical element disposed in a position distant to the semiconductor carrier; wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: August 29, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Stefan Barzen, Ulrich Krumbein, Wolfgang Friza, Wolfgang Klein
  • Patent number: 9699547
    Abstract: A non-directional microphone includes a housing, a microphone unit attached to the housing, and including a diaphragm that receives a sound wave, and a connector portion to which a cable connector including a cable that transmits an audio signal from the microphone unit is connected, and a pressure equalization opening that allows a back-side space of the diaphragm in the housing and an outer space to communicate is provided in the connector portion. In the non-directional microphone, the communication between the back-side space of the diaphragm and the outer space through the pressure equalization opening is cut off when the cable connector is connected to the connector portion, and the back-side space of the diaphragm communicates into the outer space through the pressure equalization opening when the cable connector is disconnected from the connector portion.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: July 4, 2017
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 9693133
    Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: June 27, 2017
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9676617
    Abstract: A method for a capacitive micromachined ultrasound transducer (cMUT) is provided. The method grows and patterns a diffusion barrier layer over a surface of a base layer. The diffusion barrier layer have different areas that allow different levels of diffusion penetration. A diffusion process is performed over the diffusion barrier layer such that a diffusion reactivated material reaches different depths into the base layer below the different areas. A anchor is formed using the diffusion reactivated material. The anchor has a lower portion below a major surface of the base layer and an upper portion above the major surface of the base layer. A cover layer is placed over the anchor and the base layer. At least one of the cover layer and the base layer includes a flexible layer, such that the cMUT electrodes are movable relative to each other to cause a change of the gap width.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: June 13, 2017
    Assignee: KOLO TECHNOLOGIES, INC.
    Inventor: Yongli Huang
  • Patent number: 9681234
    Abstract: A MEMS microphone structure, comprising a semiconductor substrate having a cavity, a first dielectric layer having a through-hole communicating with the cavity, a lower diaphragm electrode formed above the through-hole and at least partially attached to the upper surface of the first dielectric layer, and an upper electrode structure with an insulating layer. The upper electrode structure comprises an annular supporter, a back plate having multiple holes, and an upper electrode connection. At least a part of the annular supporter extends downwardly to the lower diaphragm electrode while the rest of the annular supporter extends downwardly to the substrate. The back plate is suspended above the lower diaphragm electrode by the annular supporter, forming an air gap therebetween. An upper electrode is embedded in the insulating layer at the back plate and is lead out by the upper electrode connection.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: June 13, 2017
    Assignee: SHANGHAI IC R&D CENTER CO., LTD
    Inventors: Chao Yuan, Xiaoxu Kang, Qingyun Zuo
  • Patent number: 9668056
    Abstract: A sound transducer structure includes a membrane, a counter electrode, and a plurality of elevations. The membrane includes a first main surface, made of a membrane material, in a sound transducing region and an edge region of the membrane. The counter electrode is made of counter electrode material, and includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. The plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: May 30, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Stefan Barzen, Marc Fueldner
  • Patent number: 9660170
    Abstract: Micromachined ultrasonic transducer (MUT) arrays capable of multiple resonant modes and techniques for operating them are described, for example to achieve both high frequency and low frequency operation in a same device. In embodiments, various sizes of piezoelectric membranes are fabricated for tuning resonance frequency across the membranes. The variously sized piezoelectric membranes are gradually transitioned across a length of the substrate to mitigate destructive interference between membranes oscillating in different modes and frequencies.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 23, 2017
    Assignee: FUJIFILM DIMATIX, INC.
    Inventor: Arman Hajati
  • Patent number: 9643212
    Abstract: Provided are capacitive micromachined ultrasonic transducer (CMUT) modules. A CMUT module includes a CMUT chip which includes a plurality of first electrode pads on a first surface thereof; a flexible printed circuit (FPC) which is disposed on the first surface of the CMUT chip, the FPC including a plurality of first holes which are configured to expose the plurality of first electrode pads; a plurality of second electrode pads formed on the FPC so as to correspond to the plurality of first electrode pads; and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: May 9, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dongsik Shim, Seogwoo Hong, Seokwhan Chung
  • Patent number: 9599648
    Abstract: Diaphragm 33 is provided on a top surface of silicon substrate 32, and plate unit 39 is fixed to the top surface of silicon substrate 32 so as to cover the movable electrode film with a gap. Plate unit 39 is made of an insulating material. Fixed electrode film 40 is formed on a bottom surface of plate unit 39, and diaphragm 33 and fixed electrode film 40 constitute a capacitor. In an area around plate unit 39, a whole outer peripheral edge of the top surface of silicon substrate 32 is exposed from plate unit 39. On the top surface of the substrate 32, insulating sheet 47 made of the insulating material is formed in a part of an area exposed from plate unit 39, and electrode pad 48 electrically connected to diaphragm 33 and electrode pad 49 electrically connected to fixed electrode film 40 are provided on a top surface of insulating sheet 47.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: March 21, 2017
    Assignee: OMRON Corporation
    Inventors: Takashi Kasai, Inoue Tadashi
  • Patent number: 9591408
    Abstract: A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: March 7, 2017
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Martin Wurzer
  • Patent number: 9462364
    Abstract: A capacitance type sensor has a substrate, a vibration electrode plate formed over the substrate, a back plate formed over the substrate so as to cover the vibration electrode plate, and a fixed electrode plate provided on the back plate so as to be opposite to the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is separated into a plurality of regions, each of the plurality of regions being formed with a sensing section including the vibration electrode plate and the fixed electrode plate. A barrier electrode is provided between respective sensing sections of at least one adjacent pair of regions of the plurality of regions to prevent signal interference between the respective sensing sections.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: October 4, 2016
    Assignee: OMRON Corporation
    Inventors: Yuki Uchida, Takashi Kasai
  • Patent number: 9375850
    Abstract: Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground plane common to a first electrode of the transducer elements to suppress capacitive coupling of signal lines connected to a second electrode of the transducer elements.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: June 28, 2016
    Assignee: FUJIFILM DIMATIX, INC.
    Inventors: Arman Hajati, Dimitre Latev, Deane Gardner, Hung-Fai Stephen Law
  • Patent number: 9369808
    Abstract: An acoustic transducer with high sensitivity includes a base plate, a back plate and a vibrating membrane. The vibrating membrane is peripherally fixed to the base plate and covers an opening of the base plate. The back plate has a positioning member connected between the back plate and the vibrating membrane, so as to define at least one vibratile portion that is arranged annularly by a plurality of elastic members. Thereby, the vibratile portion has a reduced deformable width and increased rigidity, so can effectively improve its acoustically receiving sensitivity and signal-to-noise ratio.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: June 14, 2016
    Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Chun-Chieh Wang, Yong-Shiang Chang
  • Patent number: 9344806
    Abstract: Measures are provided for improving the acoustic properties of a component (10) having a micromechanical microphone structure realized in a layer construction (20) over a substrate (1), and for simplifying the production method. The microphone structure of such a component (10) includes a diaphragm (11) deflectable by acoustic pressure, spanning a cavity (13) that acts as a rear-side volume in the rear side of the component, and includes a stationary, acoustically permeable counter-element (12) situated over the diaphragm (11). According to the invention, the layer construction (20) has, between the diaphragm (11) and the substrate (1), an enclosing layer (3) in which there is fashioned an acoustically transparent aperture (4). The diaphragm (11) is connected to the rear-side volume (13) via this aperture in the enclosing layer (3). Under the enclosing layer (3), the rear-side volume (13) extends laterally beyond this aperture (4).
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: May 17, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventor: Jochen Reinmuth
  • Patent number: 9319798
    Abstract: A capacitive transducer has a back plate including a fixed electrode, a diaphragm facing the back plate with an air gap interposed therebetween, the diaphragm acting as a movable electrode, at least a first stopper of a first protruding length, and a second stopper of a second protruding length. The first and second stoppers protrude from at least either the surface on the back plate near the air gap or the surface on the diaphragm near the air gap. The first stopper is provided at a position corresponding to a first position on the diaphragm. The second the stopper is provided at a position corresponding to a second position on the diaphragm. An amount of displacement of the diaphragm at the first position is greater than an amount of displacement of the diaphragm at the second position. The protruding length of the first stopper is shorter than the protruding length of the second stopper.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: April 19, 2016
    Assignee: OMRON Corporation
    Inventor: Akihiro Okugawa