Abstract: CMUT devices are used in many applications e.g. for ultrasound imaging and pressure measurement. These devices operate by sensing a change in capacitance caused by deflection of a membrane (32) comprising one of a pair of electrodes in the device by ultrasound exposure of or pressure applied on, the membrane. The CMUT device may be susceptible to the effects of changing temperature.

Abstract: A capacitance type vibration sensor has a substrate including a hollow portion, a vibration electrode plate, which is arranged facing the hollow portion at an upper surface side of the substrate and which vibrates by sound pressure, and a fixed electrode plate which is arranged facing the vibration electrode plate and which is opened with a plurality of acoustic perforations passing therethrough in a thickness direction. The capacitance type vibration sensor has an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion. The capacitance type vibration sensor also has an air escape portion, which is a perforation or a groove formed in the substrate.

Abstract: Provided is a capacitive transducer having a wide frequency band width and an improved transmitting and receiving sensitivity, the capacitive transducer including an element including a plurality of cells: each of the plurality of cells including: a first electrode; a vibrating film including a second electrode, the second electrode being opposed to the first electrode with a gap; and a supporting portion that supports the vibrating film, in which the element includes a first cell and a second cell as the cell, the first cell including the vibrating film having a first spring constant, the second cell including the vibrating film having a second spring constant smaller than the first spring constant; and a distance between the first electrode and the second electrode of the first cell is smaller than a distance between the first electrode and the second electrode of the second cell.

Abstract: Implementations of a cMUT have dual operation modes. The cMUT has two different switchable operating conditions depending on whether a spring member in the cMUT contacts an opposing surface at a contact point in the cMUT. The two different operating conditions have different frequency responses due to the contact. The cMUT can be configured to operate in transmission mode when the cMUT in the first operating condition and to operate in reception mode when the cMUT is in the second operating condition. The implementations of the dual operation mode cMUT are particularly suitable for ultrasonic harmonic imaging in which the reception mode receives higher harmonic frequencies.

Abstract: A vibrating element manufacturing method by which adhesion is stabilized and yield is improved, a vibrating element, a vibrating actuator, a lens barrel and a camera system. A vibrating element manufacturing method is provided with a first step of arranging an elastic body on a holding member, a second step of forming an electromechanical transducing element by injection molding on the surface of the elastic body, and a third step of sintering the electromechanical transducing element by heating and bonding the elastic body with the electromechanical transducer element.

Abstract: A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.

Abstract: A Capacitive Micromachined Ultrasonic Transducer (CMUT) having a membrane operatively connected to a top electrode and having a bottom electrode having a concave void. When a DC bias voltage is applied, the membrane is deflected towards the bottom electrode such that a peripheral edge region of the membrane is brought into close proximity with the bottom electrode and an electrostatic force proximal to the peripheral edge region of the membrane is increased.

Abstract: Implementations of a capacitive micromachined ultra-sonic transducer (CMUT) include a feedback component connected in series with the CMUT. The feedback component applies a feedback on a voltage applied on the CMUT for affecting the voltage applied on the CMUT as a capacitance of the CMUT changes during actuation of the CMUT.

Abstract: A capacitive micromachined ultrasonic transducer (CMUT) includes a structured membrane which possesses improved frequency response characteristics. Some embodiments provide CMUTs which include a substrate, a first electrode, a second movable electrode, and a structured membrane. The movable second electrode is spaced apart from the first electrode and is coupled to the structured membrane. The structured membrane is shaped to possess a selected resonant frequency or an optimized frequency response. The structured membrane can include a plate and a beam coupled to the plate such that the resonant frequency of the structured membrane is greater than the resonant frequency of the plate. Furthermore, the ratio of the resonant frequency of the structured membrane over the mass of the structured membrane can be greater than the ratio of the resonant frequency of the plate over the mass of the plate. In some embodiments, the CMUT is an embedded spring ESCMUT.

Abstract: A capacitive micro-machined ultrasonic transducer (CMUT) array includes an improved elementary aperture for imaging operations. The transducer can be of a linear, curved linear, annular, matrix or even single surface configuration. The elementary apertures thereof are formed by a specific arrangement of capacitive micromachined membranes (CMM) so as to exhibit ideal acoustical and electrical behavior when operated with imaging systems. The CMM arrangements can be either conventional where the element transducers of the array are uniformly shaped by predefined CMMs in a manner such as to exhibit acoustic behavior similar to a piezoelectric transducer, or can be more sophisticated, wherein each element transducer is formed by a specific combination of different CMMs (i.e., of a different size and/or shape) so as to provide the transducer with built-in acoustic apodization that can be implemented in the azimuth and/or elevation dimension of the device.

Abstract: There is provided a method for manufacturing a capacitive micromachined ultrasonic transducer. In this method, a first insulating layer and a vibrating membrane are bonded by heat treatment and a second insulating layer is formed by thermal oxidation in a single heating step, with a cavity provided in the transducer communicating with the outside of the transducer through a communication portion.

Abstract: A compression post capacitive micromachined ultrasonic transducer (CMUT) is provided. The compression post CMUT includes a first electrode, a top conductive layer having a pattern of post holes, a moveable mass that includes the first electrode. The compression post CMUT further includes an operating gap disposed between the top surface of the top conductive layer and a bottom surface of the moveable mass, a pattern of compression posts, where a proximal end the compression post is connected perpendicularly to a bottom surface of the moveable mass, where the pattern of compression posts span through the pattern of post holes. The top conductive layer includes the second electrode that is electronically insulated from the first electrode, where the pattern of compression posts compress to provide a restoring force in a direction that is normal to the bottom surface of the moveable mass.

Abstract: An ultrasonic sensor unit includes a transmission base plate and a reception base plate. The transmission base plate includes an ultrasonic transmission sensor configured and arranged to transmit ultrasonic waves. The reception base plate includes an ultrasonic reception sensor configured and arranged to receive the ultrasonic waves. One of the transmission base plate and the reception base plate define a through-hole at a position corresponding to one of the ultrasonic transmission sensor and the ultrasonic reception sensor provided in the other of the transmission base plate and the reception base plate so that the one of the ultrasonic transmission sensor and the ultrasonic reception sensor is exposed through the through-hole.

Abstract: Harmonic capacitive micromachined ultrasonic transducer (“cMUT”) devices and fabrication methods are provided. In a preferred embodiment, a harmonic cMUT device generally comprises a membrane having a non-uniform mass distribution. A mass load positioned along the membrane can be utilized to alter the mass distribution of the membrane. The mass load can be a part of the membrane and formed of the same material or a different material as the membrane. The mass load can be positioned to correspond with a vibration mode of the membrane, and also to adjust or shift a vibration mode of the membrane. The mass load can also be positioned at predetermined locations along the membrane to control the harmonic vibrations of the membrane. A cMUT can also comprise a cavity defined by the membrane, a first electrode proximate the membrane, and a second electrode proximate a substrate. Other embodiments are also claimed and described.

Abstract: Asymmetric membrane capacitive micromachined ultrasonic transducer (“cMUT”) devices and fabrication methods are provided. In a preferred embodiment, a cMUT device according to the present invention generally comprises a membrane having asymmetric properties. The membrane can have a varied width across its length so that its ends have different widths. The asymmetric membrane can have varied flex characteristics due to its varied width dimensions. In another preferred embodiment, a cMUT device according to the present invention generally comprises an electrode element having asymmetric properties. The electrode element can have a varied width across its length so that its ends have different widths. The asymmetric electrode element can have different reception and transmission characteristics due to its varied width dimensions. In another preferred embodiment, a mass load positioned along the membrane can alter the mass distribution of the membrane. Other embodiments are also claimed and described.

Abstract: A wafer level package of micro electromechanical system (MEMS) microphone includes a substrate, a number of dielectric layers stacked on the substrate, a MEMS diaphragm, a number of supporting rings and a protective layer. The MEMS diaphragm is disposed between two adjacent dielectric layers. A first chamber is between the MEMS diaphragm and the substrate. The supporting rings are disposed in some dielectric layers and stacked with each other. An inner diameter of the lower supporting ring is greater than that of the upper supporting ring. The protective layer is disposed on the upmost supporting ring and covers the MEMS diaphragm. A second chamber is between the MEMS diaphragm and the protective layer. The protective layer defines a number of first through holes for exposing the MEMS diaphragm. The wafer level package of MEMS microphone has an advantage of low cost.

Abstract: A cMUT and a cMUT operation method use an input signal that has two components with different frequency characteristics. The first component has primarily acoustic frequencies within a frequency response band of the cMUT, while the second component has primarily frequencies out of the frequency response band. The bias signal and the second component of the input signal together apply an operation voltage on the cMUT. The operation voltage is variable between operation modes, such as transmission and reception modes. The cMUT allows variable operation voltage by requiring only one AC component. This allows the bias signal to be commonly shared by multiple cMUT elements, and simplifies fabrication. The implementations of the cMUT and the operation method are particularly suitable for ultrasonic harmonic imaging in which the reception mode receives higher harmonic frequencies.

Abstract: A capacitive micromachined ultrasonic transducer (cMUT) device, comprising: a cMUT formed on a semiconductor substrate; a DC high-voltage generation unit that is provided on the semiconductor substrate and that is for generating a DC high-voltage signal to be superposed on a driving signal for the cMUT; a driving signal generation unit that is provided on the semiconductor substrate and that is for generating the driving signal; and a superposition unit that is provided on the semiconductor substrate and that is for branching the DC high-voltage signal output from the DC high-voltage generation unit and for superposing one of the branched DC high-voltage signals on the other of the branched DC high-voltage signals via the driving signal generation unit.

Abstract: Implementations include a capacitive micromachined ultrasonic transducer (CMUT) having an additional transducing device overlaid in a vertically stacked relationship. In some implementations the additional transducing device is a second CMUT configured to operate at a different frequency from the first CMUT.

Abstract: A pressure wave generator includes a silicon substrate, a hole formed in the silicon substrate, and a film covering the hole. The film includes a multilayer film of a heat generating member and a heat insulating layer.

Abstract: A signal generator generates an electrical signal that is sent to an amplifier, which increases the power of the signal using power from a power source. The amplified signal is fed to a sender transducer to generate ultrasonic waves that can be focused and sent to a receiver. The receiver transducer converts the ultrasonic waves back into electrical energy and stores it in an energy storage device, such as a battery, or uses the electrical energy to power a device. In this way, a device can be remotely charged or powered without having to be tethered to an electrical outlet.

Abstract: This invention provides a technique whereby, even if a step is produced by splitting a lower electrode into component elements, resistance increase of an upper electrode, damage to a membrane and decrease of dielectric strength between an upper electrode and the lower electrode, are reduced. In an ultrasonic transducer comprising plural lower electrodes, an insulation film covering the lower electrodes, plural hollow parts formed to overlap the lower electrodes on the insulation film, an insulation film filling the gaps among the hollow parts, an insulation film covering the hollow parts and insulation film, plural upper electrodes formed to overlap the hollow parts on the insulation film and plural interconnections joining them, the surfaces of the hollow parts and insulation film are flattened to the same height.

Abstract: An acoustic mirror of alternately arranged layers of high and low acoustic impedances is manufactured in that a basic material having a first layer of the layer sequence is initially provided, on which a second layer of the layer sequence is created on the first layer such that the second layer of the layer sequence partially covers the first layer. Subsequently, a planarization layer is applied onto the layer sequence, and the planarization layer is removed in an area which in the common layer plane projects laterally beyond the second layer so as to result in a residual planarization layer. Finally, a termination layer is applied onto the layer sequence and the residual planarization layer.

Abstract: A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a resilient structure therebetween. The resilient structure has multiple connectors distributed over the device element area to vertically transport the top player with distributed support. The resilient structure may be cantilevers formed using a middle spring layer covering cavities on the substrate. Connectors define a transducing space below the top plate. The resilient structure enables a vertical displacement of the connectors, which transports the top plate in a piston-like motion to change the transducing space and to effectuate energy transformation. No separate cells are necessary for each addressable transducer element. Multiple device elements can be made on the same substrate.

Abstract: An ultrasound diagnostic apparatus is connectable with an ultrasound probe having a c-MUT element or a piezoelectric ultrasound transducer, and includes a DC bias output portion, a transmission signal output portion, an operation portion, a control portion, and a display portion. The control portion controls the DC bias output portion and the transmission signal output portion so as to output an ultrasound transmission signal after applying the bias voltage when an instruction signal instructing the start of transmission is inputted from the operation portion, and so as to stop application of the bias voltage after stopping output of the ultrasound transmission signal when an instruction signal that instructs stopping of transmission is inputted from the operation portion. The control portion causes a connection state showing which one of the c-MUT element and the capacitive micro-machined ultrasonic transducer is connected to be displayed on the display portion.

Abstract: An ultrasonic sensor unit includes a transmission base plate and a reception base plate. The transmission base plate includes an ultrasonic transmission sensor configured and arranged to transmit ultrasonic waves. The reception base plate includes an ultrasonic reception sensor configured and arranged to receive the ultrasonic waves. One of the transmission base plate and the reception base plate define a through-hole at a position corresponding to one of the ultrasonic transmission sensor and the ultrasonic reception sensor provided in the other of the transmission base plate and the reception base plate so that the one of the ultrasonic transmission sensor and the ultrasonic reception sensor is exposed through the through-hole.

Abstract: An integrated circuit structure includes a capacitor, which further includes a first capacitor plate formed of polysilicon, and a second capacitor plate substantially encircling the first capacitor plate. The first capacitor plate has a portion configured to vibrate in response to an acoustic wave. The second capacitor plate is fixed and has slanted edges facing the first capacitor plate.

Abstract: A capacitive ultrasound transducer includes a first electrode, a second electrode, and a third electrode, the third electrode including a central region disposed in collapsibly spaced relation with the first electrode, and a peripheral region disposed outward of the central region and disposed in collapsibly spaced relation with the second electrode. The transducer further includes a layer of a high dielectric constant material disposed between the third electrode and the first electrode, and between the third electrode and the second electrode. The transducer may be operable in a collapsed mode wherein the peripheral region of the third electrode oscillates relative to the second electrode, and the central region of the third electrode is fully collapsed with respect to the first electrode such that the dielectric layer is sandwiched therebetween. Piezoelectric actuation, such as d31 and d33 mode piezoelectric actuation, may further be included.

Abstract: An ultrasonic sensor unit includes an ultrasonic transmission sensor array having a plurality of ultrasonic transmission sensors configured and arranged to transmit ultrasonic waves, and an ultrasonic reception sensor array having a plurality of ultrasonic reception sensors configured and arranged to receive the ultrasonic waves. The ultrasonic reception sensor array re coupled to the ultrasonic transmission sensor array so that the ultrasonic transmission sensors and the ultrasonic reception sensors do not overlap in planar view. One of the ultrasonic transmission sensor array and the ultrasonic reception sensor array include a plurality of through-holes through which one of the ultrasonic transmission sensors and the ultrasonic reception sensors provided in the other of the ultrasonic transmission sensor array and the ultrasonic reception sensor array are exposed.

Abstract: For disposing projections of insulating film protruding into a hollow part in CMUT in order to suppress injection of electrical charge into the insulating film due to contact of a lower surface of a membrane with a lower surface of the hollow part, there are provided a structure of disposed projections preferred for suppressing increase in driving voltage for CMUT and decrease in receiving sensitivity, and an ultrasonic diagnostic apparatus using the same.

Abstract: A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a middle spring layer therebetween. The substrate and the middle spring layer define cavities therebetween sidewalled by standing features. The middle spring layer is anchored by the standing features to create cantilevers over the cavities to enable a vertical displacement of connectors placed on the middle spring layer. The connectors define a transducing space between the middle spring layer and the top plate. The top plate is transported by the vertical displacement of the connectors in a piston-like motion to change the transducing space and to effectuate energy transformation. Various configurations of cantilevers, including single cantilevers, back-to-back double cantilevers and head-to-head double cantilevers (bridges) are possible.

Abstract: The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a substrate with at least one opening; and a membrane supported on the substrate, the membrane including at least two thin segments and a thick segment connected together, wherein the two thin segments are not at the same level, and the thick segment is formed by a plurality of layers including at least two metal layers and a via layer, such that the membrane has a curve cross section.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: A micromechanical acoustic sensor element, which has at least one diaphragm and at least one fixed counter element, the diaphragm being situated in a cavity between a substrate and the counter element and acting as movable electrode of a capacitor system, the counter element acting as first fixed counter electrode of this capacitor system, and at least one through hole being formed in the substrate for the application of sound pressure to the diaphragm. For fixation and strengthening purposes, the counter element is connected to the substrate via at least one support element. The support element is situated in the region of the cavity, and an opening is formed in the diaphragm for the support element.

Abstract: A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and perforations to facilitate air damping reduction, release of in-plane stress, and improve out-plane flexibility. Anchored at a substrate, the circular spring holds the silicon microphone suspended over a backside hole in the substrate but allows the diaphragm to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of “n” bonding pads near the outer edge of the circular spring are connected by “n/2” bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.

Abstract: A cMUT-type capacitive electroacoustic transducer including: at least one membrane configured to oscillate under effect of an electric field and/or an acoustic wave, wherein the membrane is formed from one or more layers of juxtaposed nanotubes or nanowires or nanorods, and an acoustic imaging device or UHF sonar including such transducers.

Abstract: An ultrasound transducer includes a substrate, an ultrasound transducer cell placed on one surface of the substrate and having a lower electrode, a first gap portion placed on the lower electrode and an upper electrode placed on the first gap portion, a first conductive layer placed on the other surface of the substrate and electrically connected to one of the lower electrode and the upper electrode, an electret film placed on the first conductive layer, an insulating layer placed on the electret film, and a second conductive layer placed on the insulating layer and electrically connected to the one of the lower electrode and the upper electrode not electrically connected to the first conductive layer.

Abstract: A capacitive membrane is used as a digital sensor. Membranes act as binary devices, such as being in a collapsed or non-collapsed state. By providing drum heads (membranes and associated gaps) with different response characteristics, the drum heads of an element digitally indicate the amplitude of the acoustic force by which of the drum heads are triggered or change states. The digital transducer may be used for different types of sensors, such as a CMUT, an air pressure, a temperature, a humidity, a chemical or biological stimulus or other sensor.

Abstract: This invention includes a first electrode which is fixed on a base, a vibration film which is disposed to oppose the first electrode with an air and vacuum portion between the vibration film and the first electrode, a second electrode which is supported by the vibration film and is connected to a predetermined potential, a ferroelectric which is electrically connected to the first electrode, and a driving portion that applies, to the first electrode, a driving signal which is a monopulse voltage signal and whose polarity is reversed every time the driving signal is outputted.

Abstract: A base has a plurality of projections or recesses. Each of the projections or recesses corresponds to one channel of vibration elements. Each of the vibration elements has a plurality of MUT elements. Each of the MUT elements transmits and receives ultrasonic waves. A plurality of MUT elements are arranged in each of the projections or recesses. Consequently, each of the vibration elements can transmit and receive ultrasonic waves having radiation surfaces curved along the surfaces of the projections or recesses.

Abstract: An accelerometer or a seismometer using an in-plane suspension geometry having a suspension plate and at least one fixed capacitive plate. The suspension plate is formed from a single piece and includes an external frame, a pair of flexural elements, and an integrated proof mass between the flexures. The flexural elements allow the proof mass to move in the sensitive direction in the plane of suspension while restricting movement in all off-axis directions. Off-axis motion of the proof mass is minimized by the use of intermediate frames disbursed within and between the flexural elements. Intermediate frames can include motion stops to prevent further relative motion during overload conditions. The device can also include a dampening structure, such as a spring or gas structure that includes a trapezoidal piston and corresponding cylinder, to provide damping during non-powered states. The capacitive plate is made of insulating material.

Abstract: The production of a hearing aid device can be simplified by the use of a microphone module with a plurality of microphones. To attach and electrically contact the microphones, the invention provides a microphone carrier with three-dimensionally directed conductor traces in MID technology. In a complicated microphone arrangement with a plurality of microphones, a single microphone module can thereby be used on which all microphones of the hearing aid device are attached and electrically connected.

Abstract: An ultrasonic speaker or acoustic system includes an electrostatic type ultrasonic transducer of a push-pull system is constructed such that a through hole is arranged in the central portion of a fixing electrode of a circular shape. A sound wave reflecting plate is arranged on the rear face of the ultrasonic transducer and an ultrasonic wave radiated from the rear face of the ultrasonic transducer is reflected by the sound wave reflecting plate and is radiated to the front face of the ultrasonic transducer through the through hole.

Abstract: The present invention provides an ultrasonic transducer device to send and receive ultrasonic waves, comprising a semiconductor substrate, a lower electrode disposed on the semiconductor substrate, a gap disposed on the lower electrode, a third insulation film disposed on the gap, an upper electrode disposed on the third insulation film, a fourth insulation film disposed on the upper electrode, a wiring layer disposed on the fourth insulation film, and a fifth insulation film disposed on the wiring layer. The upper electrode is electrically connected to the wiring layer with penetrating wires.

Abstract: An ultrasonic transducer cell according to the present invention includes: a substrate; a charge holding portion provided on the substrate; a lower electrode provided on the charge holding portion and used to input and output a signal; and a vibration membrane provided above the lower electrode to be separated from the lower electrode with a cavity, and configured to include at least an insulating film and an upper electrode provided on the insulating film.

Abstract: The present invention provides a stable and excellent electro-acoustic transducer having simple constitution with which a vibration pole does not contact with stator poles by a repulsive force acting between the vibration pole and the stator poles and the vibration pole can be stably positioned in place between the two stator poles. A vibration pole is disposed between two stator poles, and surfaces of the vibration pole and the two stator poles facing to each other have electrostatically same polarity to generate an electrostatic repulsive force as a restorative force acting between the vibration pole and the stator poles, so that the vibration pole is positioned in place and electro-acoustic conversion is performed by the vibration displacement of the vibration pole with respect to the stator poles. Whereby, the vibration pole does not contact substantially with the stator poles and the vibration pole is stably positioned in place.

Abstract: Provided is a faceplate for an In-The-Ear (ITE) hearing aid and a method of manufacturing a faceplate for an In-The-Ear (ITE) hearing aid in which the faceplate can be manufactured in a compact size, using a foldable flexible printed circuit board (PCB), while maintaining the quality, enabling mass-production, and reducing the manufacturing cost.

Abstract: In a capacitive membrane ultrasound transducer, one or more electrodes include multiple layers of conductive or semiconductive material. The layers may be positioned adjacent an insulator or cavity in an arrangement to reduce electrical degradation. For example, a conductive layer with less work function and less resistivity is spaced from an insulator by a conductive layer with more work function and more resistivity. The different layers of electrode material may provide for less electrical degradation due to the type of material used and relative location.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.