Abstract: The system and method for cooling a laser using a split liquid cooled heat exchanger. The temperature of coolant entering the system is applied to a portion of the system most in need of lower temperatures and a second heat exchanger uses the outflow from the first heat exchanger to cool a remaining portion of the system that has a tolerance for higher temperatures. The laser cooling system is compact, e.g., less than 45 cubic inches and can handle thermal loads of about 800 W.

Abstract: An apparatus includes at least one laser source and a print bed. A light valve array having at least three optically addressable light valves is positioned to direct differing images at the print bed. Optics to direct multiple beams derived from the at least one laser source can be positioned to direct light toward and from the optically addressable light valves.

Abstract: A fluid-cooled laser amplifier module (100) is disclosed which comprises: a casing; a plurality of slabs (110) of optical gain medium oriented in parallel in the casing for cooling by a fluid stream (154, 156); a polarisation rotator (120) disposed between a first group of one or more slabs (111) of the optical gain medium and a second group of one or more slabs (112) of the optical gain medium; optical windows (150, 152) for receiving an input beam or pulse (130) for amplifying by the slabs and for outputting the amplified beam or pulse (140); and fluid stream ports (155, 157) for receiving and discharging the fluid stream for cooling the slabs.

Abstract: An electronic device is mountable on a substrate. The substrate includes a first layer and a second layer located on a lower surface of the first layer. The first layer includes a plurality of first through-cavities. The second layer includes at least one second through-cavity overlapping the plurality of first through-cavities in a plan view. The plurality of first through-cavities are continuous with the at least one second through-cavity.

Abstract: In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.

Abstract: A laser apparatus comprising a laser diode module/cooling plate assembly in which a plurality of LD modules to which a driving current is supplied in series is disposed on the surface of a cooling plate, comprising: a laser power source; switch valves for switching a flow direction of a cooling liquid flowing through a cooling liquid flow path; a timing determination apparatus for determining the timing for switching the flow direction of the cooling liquid, by referencing temperature time series data of at least any one temperature variation part in the laser diode module/cooling plate assembly having temperature variations due to heat generated in a heat-generating part of the laser diode module; and a control circuit for outputting a driving current output command to the laser power source and outputting a valve switch command to the switch valves by referencing the determination result of the timing determination apparatus.

Abstract: In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

Abstract: An optical system including first and second optical elements for guiding light therein. For each optical element, the propagating light enters or exits the optical element through a coupling surface of the optical element. The coupling surfaces of the optical elements face, and align with, each other so that light propagating in one of the optical elements exits the optical element through the coupling surface of the optical element and enters the other optical element through the coupling surface of the other optical element. The coupling surfaces are separated from each other and define a region therebetween. The region is filled with a coolant, the coolant substantially surrounding at least one of the first and second optical elements.

Abstract: In an active gas generating apparatus, a power feeder is provided above metal electrodes in an integrated high-voltage electrode unit. When seen in plan view, the power feeder has a shape that entirely covers the metal electrodes in the integrated high-voltage electrode unit. Each of power feeding units is provided below the metal electrodes in an integrated ground electrode unit. When seen in plan view, each of the power feeding units has a shape that entirely covers the metal electrodes of the integrated ground electrode unit.

Abstract: Disclosed herein is a cooler of a semiconductor laser. The cooler includes a heat sink comprising a first surface and a second surface opposite the first surface; a first conductive layer and a second conductive layer, disposed on the first surface and not short-circuited to each other; and a conductive connector comprising a first end part, a second end part, and a first connection part connecting the first end part and the second end part. The first end part is on the first conductive layer. The second end part is on the second surface of the heat sink and insulated from the heat sink. The first connection part is disposed at a first non-opposite end of the first conductive layer on the heat sink.

Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.

Abstract: A system and an apparatus having an optic and a cooling system for cooling the optic. In one example an optically addressed light valve forms the optic. The cooling system includes first and second windows on opposing surfaces of the optically addressed light valve which constrain a cooling fluid to flow over the opposing surfaces. The fluid pressure outside the optically addressed light valve is low enough that it does not compress a liquid crystal gap of the optically addressed light valve. The cooling fluid is also transparent to a high powered light beam which is projected through the first and second windows, and also through the optically addressed light valve, during an additive manufacturing operation.

Abstract: An optical device includes a light modulation device disposed on an optical axis of incident light, and a holding section configured to hold the light modulation device. The holding section includes an inflow part to which a liquid supplied from an outside of the holding section inflows, a flow channel forming part disposed along a circumferential edge of the light modulation device so as to have an annular shape, and having a flow channel through which the liquid flowed from the inflow part circulates, and an outflow part from which the liquid having flowed through the flow channel outflows to the outside of the holding section. At least one of an inside of the inflow part and an inside of the flow channel is provided with at least one projection.

Abstract: This disclosure provides planar waveguides with enhanced support and/or cooling. One or more endcaps could be disposed between coating/cladding layers at one or more ends of a core region, where the core region is doped with at least one active ion species and each endcap is not doped with any active ion species that creates substantial absorption at pump and signal wavelengths. A core region could include at least one crystal or crystalline material, and at least one cladding layer could include at least one glass. Different types of coolers could be disposed on or adjacent to different coating/cladding layers. Side claddings could be disposed on opposite sides of a planar waveguide, where the opposite sides represent longer sides of the waveguide. Endcaps and one or more coolers could be sealed to a housing, and coolant can flow through a substantially linear passageway along a length of the waveguide. One side of a planar waveguide could be uncooled.

Abstract: A semiconductor apparatus with improved heat removal and improved heat flow to a heat sink is provided. The semiconductor apparatus includes a p-type semiconductor. An n-p tunnel junction is positioned within an epitaxial structure of the p-type semiconductor. A metal contact layer is connected to the n-p tunnel junction through an alloyed n-type contact interface. The n-p tunnel junction improves heat flow from the semiconductor through an alloyed contact interface formed between the tunnel junction and the metal contact layer which has lower thermal and electrical resistance in comparison to a conventional metallurgically abrupt interface of a p-type contact.

Abstract: A plate-like laser medium has a through-hole for providing a flow of a cooling medium. The laser medium unit includes the plurality of laser media. A laser beam amplification device includes a laser medium unit 10, an excitation light source 21 that causes excitation light to enter the laser medium unit 10, a through-hole 16a of a window member as a unit for supplying the cooling medium in a through-hole 14a of the laser medium 14, and a cooling medium flow path F1 arranged around the laser medium unit 10.

Abstract: A method of thermographic inspection includes absorbing, at an applique applied to a test area of an article, light from a testing light source. The method further includes emitting, by the applique, thermal radiation directed to a capture device, the thermal radiation corresponding to at least a portion of the light absorbed by the applique.

Abstract: The present invention discloses a laser beam combination apparatus, comprising: a water cooling plate, a beam combiner and two laser arrays; each of the laser arrays comprises N lasers, wherein N is a positive integer more than 1; the two laser arrays are fixed on an upper surface and a lower surface of the water cooling plate, respectively; and the beam combiner performs a spatial beam combination, a polarization beam combination or a wavelength beam combination of laser beams output from the two laser arrays.

Abstract: A laser medium unit 10 in a laser beam amplification device includes a plurality of laser media 14. A cooling medium flow path F1 is provided around the laser medium unit 10 to cool the laser medium unit 10 from outside. A sealed space between the laser media 14 is filled with gas or liquid, and a laser beam for passing through the sealed space is not interfered by a cooling medium flowing outside. Therefore, a fluctuation of an amplified laser beam is prevented, and a quality such as stability and focusing characteristics of the laser beam is improved.

Abstract: An apparatus and method are provided for producing an ultrashort pulsed output beam. A 694 nm pump beam from a first GaN semiconductor laser diode pumped, Q-switched ruby laser is directed into at least one amplifier that includes a broadband gain element doped with trivalent chromium ions (Cr3+). A spectrally linearly chirped low-intensity seed pulse from a master oscillator is directed into the at least one optically pumped amplifier to produce an amplified linear chirped pulsed output beam. A 694 nm second pump beam from a second GaN semiconductor laser diode pumped, Q-switched ruby laser is directed into a power amplifier that also includes a broadband gain element doped with trivalent chromium ions (Cr3+). The amplified linear chirped pulsed output beam is directed into the optically pumped power amplifier to produce a high energy linear chirped pulsed output beam which is then directed into a pulse compressor to produce the ultrashort pulsed output beam.

Abstract: A gas laser excitation system with an integrated impedance matching circuit, comprises a gas laser electrode, a high-frequency connection line connectable to the gas laser electrode and configured for transmission of high-frequency power to the gas laser electrode, and a shield configured to shield the high-frequency power to be transmitted. The shield is arranged between the high-frequency connection line and the gas laser electrode. The high-frequency connection line interacts with the gas laser electrode and/or the shield in such a way that the resulting impedance changes at least across a section of the high-frequency connection line.

Abstract: The present invention mainly provides a novel microchannel structure comprising a plurality of first fluid-guiding channels, a plurality of micro fluid-guiding channels and a plurality of second fluid-guiding channels. Particularly, the first fluid-guiding channel has an arc-shaped fluid-guiding end corner communicating with a first channel opening of the micro fluid-guiding channel, and the second fluid-guiding channel has an arc-shaped fluid-guiding start corner communicating with a second channel opening of the micro fluid-guiding channel.

Abstract: A flash lamp pumped CTH:YAG resonating laser and method for operating the laser whereby the laser is capable of lasing at the 2097 nm wavelength. The method for operating at the 2097 nm wavelength include utilizing an output coupler with a lower reflectivity and minimizing the passive losses in the laser. The resulting laser is capable of operating with a lower intra-cavity energy density and increased output energy, decreasing the probability of optical breakdown of the laser components when operated.

Abstract: A laser system includes a laser element, a pump source configured to input light to the laser element, a first cooling circuit and a second cooling circuit. The first cooling circuit includes a first pump configured to drive a first flow of cooling liquid through a first fluid pathway, a first primary heat exchanger configured to cool the first flow of cooling liquid, and a laser element heat exchanger configured to remove heat from the laser element using the first flow of cooling liquid. The second cooling circuit includes a second pump configured to drive a flow of cooling liquid through a second fluid pathway, a second primary heat exchanger configured to cool the second flow of cooling liquid, and a pump source heat exchanger configured to remove heat from the pump source using the first and second flows of cooling liquid.

Abstract: A semiconductor laser device of the present disclosure includes a cooling plate, an insulating sheet, a first cooling block, and a first semiconductor laser element. The conductive cooling plate includes a water supply passage and a drain passage. The insulating sheet is provided to the cooling plate, and includes a first through hole connected to the water supply passage and a second through hole connected to the drain passage. A first cooling block is provided to the insulating sheet, includes therein a first tube connected to the first through hole and the second through hole, and is electrically conductive. The first semiconductor laser element is provided to the first cooling block. The first semiconductor laser element includes a first electrode, and a second electrode opposite to the first electrode. The first electrode is electrically connected to the first cooling block, and the cooling plate is at a floating potential.

Abstract: Provided are a light source device capable of suppressing reflection of light which is irregularly reflected on a side face relating to a notch part, and a display apparatus. The light source device includes a light guide plate having a notch part formed at an edge part thereof, and a reflection sheet which is disposed to face the light guide plate and has a notch part formed at an edge part corresponding to the notch part, wherein the reflection sheet includes a low-reflection part which is provided around the notch part of a surface facing the light guide plate and has a reflectance lower than that of the reflection sheet.

Abstract: An apparatus includes a heat exchanger with a body having a passage through the body. The passage defines apertures on multiple sides of the body, and the passage is configured to allow optical signals to pass through the body. One or more tapered edges are at least partially around one or more of the apertures, and each tapered edge is configured to reflect optical radiation inward into the passage. One or more absorptive surfaces are within the passage, and the one or more absorptive surfaces configured to absorb the reflected optical radiation. The heat exchanger is configured to convert the absorbed optical radiation into heat, and the body further includes one or more cooling channels configured to receive coolant that absorbs the heat.

Abstract: The laser apparatus includes a laser oscillation part including a water-cooled plate, an air cooling machine including a radiator, a dehumidifier including a water-cooled plate, and a cooling water supply device including a cooling water pipe through which a cooling water is supplied. The air cooling machine and the dehumidifier are arranged in a housing. The cooling water pipe is branched so that the water-cooled plate in the laser oscillation part, the radiator, and the water-cooled plate in the dehumidifier are connected in parallel. The cooling water supply device supplies a common cooling water of the same temperature to the water-cooled plate in the laser oscillation part, the radiator, and the water-cooled plate in the dehumidifier.

Abstract: A medical laser system includes a crystal-based laser, a power supply for powering the crystal-based laser, a controller operably connected to the crystal-based laser and the power supply, and a liquid cooling system. The liquid cooling system includes a conduit circuit through which a cooling liquid can circulate. The conduit circuit is thermally coupled to the crystal-based laser such that the cooling liquid in the conduit circuit absorbs heat from the crystal-based laser. One or more heat sinks are coupled to the conduit circuit and to the power supply such that the cooling liquid in the conduit circuit absorbs heat from the power supply. A pump is provided for driving the cooling liquid through the conduit circuit. A heat exchanger cools the cooling liquid in the conduit circuit.

Abstract: A polishing method which can prevent a contamination of a release nozzle for releasing a substrate, such as a wafer, from a polishing head, is disclosed. The polishing method includes: polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other; moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device; cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position; during cleaning of the substrate, discharging a fluid from a release nozzle located at the substrate transfer device; and after cleaning of the substrate, releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.

Abstract: A laser system includes a laser element, a pump source configured to input light to the laser element, a first heat exchanger, a pump source heat exchanger, a laser element heat exchanger, and a pump. The first heat exchanger is configured to cool a first flow of cooling liquid. The pump source heat exchanger is configured to remove heat from the pump source using the first flow of cooling liquid. The laser element heat exchanger is configured to remove heat from the laser element using a second flow of cooling liquid. The pump is configured to drive the first and second flows of cooling liquid.

Abstract: An optical pumping structure for lasers includes: an active medium in the form of a cylindrical rod with a circular cross-section, said rod being inserted at its ends into two rings made of a thermally conductive material; at least three stacks of pumping diode strips arranged in the form of a star around the rod; and a support temperature-regulated by a Peltier-effect module. The rings are in contact with the support, and a stack of diodes, called bottom stack, being situated between the rod and the support, and the structure comprises, for each other stack, a thermal conduction block forming a support for said stack, these blocks being mounted on the cooled support and not being in contact with one another or with the rings.

Abstract: A laser source (340) comprises a first frame (356), a laser (358), and a first mounting assembly (360). The laser (358) generates an output beam (354) that is directed along a beam axis (354A). The first mounting assembly (360) allows the laser (358) to expand and contract relative to the first frame (356) along a first axis and along a second axis that is orthogonal to the beam axis, while maintaining alignment of the output beam (354) so the beam axis (354A) is substantially coaxial with the first axis. The first mounting assembly (360) can include a first fastener assembly (366) that couples the laser (358) to the first frame (356), and a first alignment assembly (368) that maintains alignment of the laser (358) along a first alignment axis (370) that is substantially parallel to the first axis.

Abstract: A solar laser lamp includes: a solar panel assembly, a laser lamp assembly and a ground stud, where the solar panel assembly includes a base, a solar panel, a control circuit board and a storage battery, and the solar panel, the control circuit board and the storage battery are all installed in the base. The laser lamp assembly includes a lamp holder and a laser lamp, and the laser lamp is installed in the lamp holder and is connected to the control circuit board. The ground stud has an installation portion on an upper end, the base has a base connector, the lamp holder has a lamp holder connector, and the base connector, the lamp holder connector and the installation portion are fastened by using a first threaded member to pass therethrough, so that the solar panel assembly and the laser lamp assembly can be integrally installed on the ground stud, to facilitate use, storage and transportation.

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.

Abstract: Various improvements to three dimensional imaging systems having inflatable membranes are disclosed. These improvements include, among other things, a proximity sensor that can be used to warn a user of the device when approaching a feature in a cavity, such as an eardrum in an ear canal; or optical sensors with an optical coating matching the refractive index of the medium in which the optical sensors are deployed, to improve data acquisition.

Abstract: The invention relates to a laser diode (2) comprising a plurality of individual emitters (EE) constructed on a substrate (8), said laser diode (2) comprising a housing which consists of a first contact part (13), a second contact part (15), an optical element (19b), a backplate (12) and two side pieces (11), with a plurality of first spacers (9o) being arranged between the substrate (8) and the first contact part (13) and a plurality of second spacers (9u) being arranged between the individual emitters (EE) and the second contact part (15). Incisions (17a) through which a cooling medium can flow are formed between each of the individual emitters (EE). The invention also relates to a device comprising at least one laser diode (2) of this type.

Abstract: The present invention provides a thermally and electrically conductive apparatus that can provide both thermal conductivity and electrical conductivity for one or more electronic devices connected thereto. The apparatus comprises a thermally conductive element that is in thermal contact with one or more electronic devices and optionally in contact with a heat dissipation system. A portion of the thermally conductive element is surrounded by a multilayer coating system comprising two or more layers. The multilayer coating system includes alternating electrically insulating and electrically conductive layers in order to provide paths for the supply of electric current to the one or more electronic devices. A conductive layer of the multilayer coating system may be selectively patterned to connect to one or more electronic devices.

Abstract: A water-cooled heat-sink for a diode-laser bar includes a copper-cooling-unit having an integral mount thereon for the diode-laser bar. The copper-cooling-unit is attached to a steel base-unit. The base-unit and the cooling-unit are cooperatively configured such that at least one cooling-channel is formed in the cooling-unit by the attachment of the base-unit to the cooling-unit. The cooling-channel is positioned to cool the mount when cooling-water flows through the cooling-channel.

Abstract: A conduction cooled high power semiconductor laser and a method for fabricating the same are provided. The conduction cooled high power semiconductor laser comprises a heat sink (2) and one or more semiconductor laser units (1). The semiconductor laser unit consists of a laser chip (3), a substrate (4) bonded to the laser chip for heat dissipation and electrical connection, and an insulation plate (5) soldered to the substrate for insulation and heat dissipation. The semiconductor laser unit is soldered on the heat sink with the insulation plate therebetween. The semiconductor laser unit may be tested, aged, and screened in advance, and thereby the yield of the lasers can be improved and the manufacturing costs can be reduced. The laser has desirable heat dissipation performance, high reliability, and is applicable to high temperature and other complex and volatile environments.

Abstract: A crystal laser including a doped crystal, and a system for cooling the crystal. This cooling system includes: a support including a first and a second surfaces; a device for fastening the crystal to the first surface of the support to form a tight cavity between a first surface of the crystal and the first surface of the support; a circuit for supplying the tight cavity with a liquefied gas; and a device for cooling the second surface of the support.

Abstract: A method and apparatus transferring high radiant power from a plurality of laser diodes into a single optical fiber with high efficiency, small size, and reduced weight.

Abstract: A laser system includes a laser element, a pump source configured to input light to the laser element, a first cooling circuit and a second cooling circuit. The first cooling circuit includes a first pump configured to drive a first flow of cooling liquid through a first fluid pathway, a first primary heat exchanger configured to cool the first flow of cooling liquid, and a laser element heat exchanger configured to remove heat from the laser element using the first flow of cooling liquid. The second cooling circuit includes a second pump configured to drive a flow of cooling liquid through a second fluid pathway, a second primary heat exchanger configured to cool the second flow of cooling liquid, and a pump source heat exchanger configured to remove heat from the pump source using the first and second flows of cooling liquid.

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a base portion and a support portion. The base portion is made of silicon and includes a first primary surface. The first primary surface includes at least first and second V-notch grooves thereon. The support portion is made of silicon and includes at least first and second edges that are interlockingly received in the first and second V-notch grooves when the support portion is mounted on the base portion.

Abstract: A method, and systems to implement the method, for reducing slow axis divergence in a laser diode bar including tailoring a power deposition profile across the emitter so as to reduce thermal gradients, thereby resulting in a substantially (nearly) uniform temperature across the width of the emitter.

Abstract: A diode-laser bar package includes a water cooled metal heat-sink. An electrical-insulator-plate is bonded to the heat-sink with a soft solder. A metal sub-mount and a first electrode are bonded, spaced apart, on the electrical-insulator-plate. A solder-bridge fills the space between the first electrode and the sub-mount. A diode-laser bar is bonded to the sub-mount. A second electrode is bonded to the first electrode with an electrically insulating bond. Electrical connection between the second electrode and the diode-laser bar is made by a plurality of wire-bond electrical leads.

Abstract: A cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module are provided, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the cooling module effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively prolongs the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: A cooling arrangement for cooling laser gas for a gas laser includes a first cooling circuit having a first cooling assembly and a first heat exchanger for cooling laser gas which flows from a fan to a resonator of the gas laser, and a second cooling circuit which is independent of the first and which has a second cooling assembly and a second heat exchanger for cooling laser gas which flows from the resonator to the fan. The second cooling circuit has at least one additional heat exchanger for additionally cooling the laser gas which flows from the fan to the resonator.

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for a gain medium of a laser system are provided. In one aspect, a silicon-based thermal energy transfer apparatus includes silicon-based first and second manifolds each having internal coolant flow channels therein. When the first and second manifolds are coupled together, a first groove on the first manifold and a second groove on the second manifold form a through hole configured to receive the gain medium therein. The through hole has a polygonal cross section when viewed along a longitudinal axis of the gain medium.

Abstract: A crystal laser including a doped crystal, and a system for cooling the crystal. This cooling system includes: a support including a first and a second surfaces; a device for fastening the crystal to the first surface of the support to form a tight cavity between a first surface of the crystal and the first surface of the support; a circuit for supplying the tight cavity with a liquefied gas; and a device for cooling the second surface of the support.