Abstract: A semiconductor laser system includes a diode laser tile. The diode laser tile includes a mounting fixture having a first side and a second side opposing the first side and an array of semiconductor laser pumps coupled to the first side of the mounting fixture. The semiconductor laser system also includes an electrical pulse generator thermally coupled to the diode bar and a cooling member thermally coupled to the diode bar and the electrical pulse generator.

Abstract: The present invention relates to a semiconductor laser apparatus having a structure for preventing the corrosion of a refrigerant flow path in a heat sink and for cooling a semiconductor laser array stably over a long period of time. The semiconductor laser apparatus comprises a semiconductor laser stack in which a plurality of semiconductor laser units are stacked, a refrigerant supplier, a piping for connecting these components, and a refrigerant flowing through these components. The refrigerant supplier supplies the refrigerant to the semiconductor laser stack. The refrigerant is comprised of fluorocarbon. Each of the semiconductor laser units is constituted by a pair of a semiconductor laser array and a heat sink. The heat sink has a refrigerant flow path.

Abstract: A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.

Abstract: A laser module (1) with at least two laser units (3) are adjusted such that the emitted beams of the laser units (3) converge. The laser units (3) exhibit cooling channels (5) that are provided with a cooling medium. At least one of the laser units has a curved adjustment surface (10) which his mounted to a facing mounting surface (9) of a mounting unit (2) such that a cooling channel opening in the adjustment surface (9) is located opposite an additional cooling channel opening in the mounting surface (10).

Abstract: Methods and systems are disclosed for cooling a laser, such as a high average power (HAP) solid state laser (SSL). A coolant that has been heated from previous use can be conditioned by transferring heat from the coolant to a phase change medium. The conditioned coolant can then be re-used to cool the laser. In this manner, a low cost, lightweight, compact cooling system that generates comparatively quiescent flow at comparatively high flow rates can be provided.

Abstract: A laser oscillator is obtained in which the flatness of an optical element that makes contact with a cooling flange is maintained in a highly precise state, by suppressing a flange presser and a base from profile-deforming the cooling flange.

Abstract: A laser radiation source which is scalable with respect to output is designed in such a way that laser diode elements can be arranged on a carrier so as to be stacked equidistantly and with low stress at a low manufacturing cost. The laser radiation source comprises a vertical stack of laser diode elements contacted on both sides via electrically conductive substrate layers, and at least one multi-layer carrier comprising a first and a second metallic layer which are separated by at least one electrically insulating layer of nonmetallic material. At least one of the metallic layers is divided into metallic layer regions which are arranged adjacent to one another and at a distance from one another. Oppositely polarized substrate layers of adjacent laser diode elements are arranged on common layer regions of a metallic layer. Collimating lenses serve to collimate the radiation emitted by the laser diode elements.

Abstract: An optical module includes a laser device, a thermal conduction member, a Peltier device disposed between the laser device and the thermal conduction member, a heat radiation part, and a variable thermal-resistance device disposed between the thermal conduction member and the heat radiation part, the variable thermal-resistance device changing a thermal resistance between the thermal conduction member and the heat radiation part according to an ambient temperature.

Abstract: A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion.

Abstract: The invention relates to a solid-state laser, comprising a resonator (1) with a monolithic structure consisting of a laser medium, on which a passive Q-switch (12) and at least one resonator mirror are directly formed, and comprising several laser diodes (22) which, as a pump medium, radiate into the resonator (1) from the side. A simple and robust configuration with simultaneous high efficiency is achieved in such a way that the monolithic resonator (1) is held at one end in a first holding plate (31) and is held at its other end in a second holding plate (32), and between the first and second holding plate (31, 32) at least one carrier ring (21) is mounted which carries several laser diodes (22) which are passively wavelength stabilized.

Abstract: A system and method are provided for cooling a crystal rod of a side-pumped laser. A transparent housing receives the crystal rod therethrough so that an annular gap is defined between the housing and the radial surface of the crystal rod. A fluid coolant is injected into the annular gap such the annular gap is partially filled with the fluid coolant while the radial surface of the crystal rod is wetted as a thin film all along the axial length thereof.

Abstract: The laser tube housing of a CO2 slab laser is provided with a cooling system in which coolant fluid tubes are inserted into hollowed out portions formed in the longitudinal sidewalls of the laser tube housing; mounting the coolant fluid tubes in this way provides for enhanced cooling and increased stiffness of the laser tube housing. Also, a cooling system is provided for the laser's electrode assembly that relies on a manifold system that is mounted on a longitudinal sidewall of the laser tube housing to route coolant fluid through the sidewall to the electrode assembly; sidewall flow of the coolant fluid enables the end flanges of the laser tube housing to be remove without disturbing either the electrodes or the optical resonator of the laser.

Abstract: In order to operate a laser amplifier system comprising a solid-state body thermally coupled to a cooling member and having a laser active volume area, in which at least one laser-active amplifier structure consisting of semiconductor material is arranged in at least one surface and extends at least over partial areas of the surface, a pumping radiation source generating a pumping radiation field for the optical pumping of the laser-active volume area and an optical means of the amplifier defining a laser amplifier radiation field passing through the laser active volume area, as efficiently as possible it is suggested that the absorption of pumping radiation from the pumping radiation field in the laser-active amplifier structure be equal to or greater than the absorption of pumping radiation by a surrounding structure adjacent to the amplifier structure and that the pumping radiation field proceed such that it passes several times through the amplifier structure.

Abstract: A laser module (1) with at least two laser units (3) are adjusted such that the emitted beams of the laser units (3) converge. The laser units (3) exhibit cooling channels (5) that are provided with a cooling medium. At least one of the laser units has a curved adjustment surface (10) which his mounted to a facing mounting surface (9) of a mounting unit (2) such that a cooling channel opening in the adjustment surface (9) is located opposite an additional cooling channel opening in the mounting surface (10).

Abstract: A projector comprises a case, an illuminant heat source, a thermal module, and an equalizing temperature module. The equalizing temperature module is disposed between the illuminant heat source and the thermal module. When the fluid flows from the illuminant heat source to the equalizing temperature module, the fluid flows through a relative high temperature region more than that of flowing through a relative low temperature region. The equalizing temperature module at least comprises a heat pipe and a plurality of heat sinks. The heat pipe has a first end located in the relative low temperature region and a second end located in the relative high temperature region. The heat pipe transfers heat from the relative high temperature region to the relative low temperature region by a cold fluid in the heat pipe. The plurality of heat sinks are disposed on the heat pipe to increase the area of heat conduction.

Abstract: A carbon-dioxide (CO2) gas-discharge slab laser includes elongated discharge-electrodes in a sealed enclosure. Radio Frequency (RF) power is supplied to the electrodes via an impedance matching network and a co-axial electrical low inductance transmission line feed-through sealed to the enclosure. The feed-trough includes two spring contacts which are configured to be spring compression push-fit in grooves in edges of the discharge-electrodes. A central conductor of the feed-through is fluid cooled. A capacitor of the impedance matching network is assembled on the central conductor as an integral part of the feed-trough.

Abstract: Object: To provide a solar light pumped laser and a cooling method of a solar light pumped laser. Means for Solving the Problems: A solar light pumped laser performing laser oscillation by pumping a laser medium with solar light, the solar light pumped laser including, a laser medium 12, a container device 14 that supports the laser medium 12 therein, the container device 14 being provided with a focusing optical element 22 for irradiating solar light focused along the laser medium 12, while retaining cooling liquid in a space between the laser medium 12 and the container device 14, and additionally, a pair of optical reflection elements (16, 18) arranged adjacent to the opposing ends of the laser medium. An end of the container device 14 has Brewster's angle. Further, the cooling liquid according to the present invention contains water functioning as an optical medium to form a water lens simultaneously with cleaning the focusing optical element 22.

Abstract: A laser diode array having a plurality of diode bars bonded by a hard solder to expansion matched spacers and mounted on a gas or liquid cooled heatsink. The spacers are formed of a material such as copper/diamond composite material having a thermal expansion that closely matches that of the laser bars.

Abstract: The systems and methods herein provide for tuning an optical characteristic of a gain medium for a laser system. For example, a system may include a thermal tuner that dynamically controls the temperature of the gain medium to compensate for thermal mechanical distortions of the gain medium caused by laser energy in the gain medium. In doing so, the tuner may dynamically adjust a coolant temperature and/or a coolant flow rate proximate to the gain medium. Accordingly, heat is dynamically removed from the gain medium so as to adjust for optical distortions in the gain medium. Such a dynamic heat removal may provide a laser system designer with the ability to generate laser energy with controllable predetermined optical wavefronts (e.g., a flat optical wavefront).

Abstract: The high-power-optical-amplifier of the present invention uses a number of spaced, thin slabs (e.g., disc-shaped doped-slabs that are stacked, with a space between discs), aligned to give an amplifier both with a high active cross-section and a very high surface area to volume ratio. More specifically, the present invention provides several methods that include the steps of aligning at least two or four slabs having a thickness dimension of less than one centimeter, substantially parallel to, and spaced from adjacent slabs, wherein the slab surfaces are rendered essentially non-reflective, optically pumping the slabs and passing an input beam through the surfaces wherein the beam is optically amplified in the slabs, and wherein the input beam is of an eye-safe wavelength.

Abstract: A laser diode array having a plurality of diode bars bonded by a hard solder to expansion matched spacers and mounted on a gas or liquid cooled heatsink. The spacers are formed of a material such as copper/diamond composite material having a thermal expansion that closely matches that of the laser bars.

Abstract: A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

Abstract: A system includes a liquid cooling medium, a cooling plate having opposite first and second sides and at least one internal passage in which the liquid cooling medium flows, first and second lasers located adjacent to one another and positioned relative to the first side of the cooling plate, and a first Peltier device operably connected between the first side of the cooling plate and the first and second lasers for transferring thermal energy to the liquid cooling medium in the cooling plate.

Abstract: A laser device includes an optical resonator, a microwave driven discharge device, and a source for a second gas. The microwave driven discharge device is disposed relative to the optical resonator. The microwave driven discharge device operates at a discharge power and gas flow rate to produce a selected amount of energetic singlet oxygen metastables flowing in the direction of the optical resonator. The second source for the second gas is disposed between the optical resonator and the microwave driven discharge device. The second gas reacts with the selected amount of energetic singlet oxygen metastables to form an excited species in an amount sufficient to support lasing of the excited species in the optical resonator.

Abstract: An apparatus and method for transferring thermal energy from a heat load is disclosed. In particular, use of a phase change material and specific flow designs enables cooling with temperature regulation well above the fusion temperature of the phase change material for medium and high heat loads from devices operated intermittently (in burst mode). Exemplary heat loads include burst mode lasers and laser diodes, flight avionics, and high power space instruments. Thermal energy is transferred from the heat load to liquid phase change material from a phase change material reservoir. The liquid phase change material is split into two flows. Thermal energy is transferred from the first flow via a phase change material heat sink. The second flow bypasses the phase change material heat sink and joins with liquid phase change material exiting from the phase change material heat sink. The combined liquid phase change material is returned to the liquid phase change material reservoir.

Abstract: A hand-held laser device includes a casing formed with a substantially hollow interior space and having a laser emitter thereinside. The laser emitter is formed with an exciting lamp and a laser rod. A source generating a stream of gaseous coolant is provided within the interior space. A fluid cooling arrangement at least partially surrounding the laser rod is disposed within the stream of gaseous coolant for heat removal therefrom.

Abstract: A laser apparatus (100) has a semiconductor laser device (12a to 12c), coolant jetting means (24), and a heatsink (18a to 18c). The semiconductor laser device has a light output surface (50) for emitting laser light. The coolant jetting means has a coolant chamber (53) for accommodating a coolant, an inflow port (54) communicating with the coolant chamber, and a jet port (25) opposing the light output surface of the laser device. The heatsink has a laser mount surface (36) for mounting the semiconductor laser device, and a flow path (68a to 68c) where the coolant (56) jetted from the jet port flows in. When the coolant chamber is fed with the coolant, the jet port jets the coolant onto the light output surface of the semiconductor laser device. Since the light output surface is directly cooled by a jet flow of the coolant, cooling efficiency is excellent.

Abstract: A rotary disk module, having a rotary disk is interposed between a pair of heat sinks each spaced from the rotary disk by a gap. A motor is installed for driving the rotary disk to rotate. The gaps are filled with cooling medium such as helium, water or liquid nitrogen to remove the heat generated in the rotary disk by conduction, convection or evaporation. The rotary disk may be fabricated from various materials depending on the intended applications of the module, and the heat sink surfaces are preferably fabricated from materials with higher thermal conductivity. The rotation of the rotary disk allows the regions on which an optical pump radiation is delivered to be separated from the regions from which an optical radiation is extracted. In addition to improved heat dissipation effect, the rotation of the optical disk allows multiple directions of pump energy or multiple sources of pump energies and/or multiple beams of optical radiation to be applied and extracted simultaneously.

Abstract: An RF-excited waveguide laser module comprises a first electrode having a first elongate surface defining in part a waveguide laser channel extending along an optical axis, the first elongate surface having a substantially linear cross-section normal to the optical axis. A second electrode has a second elongate surface defining in part the waveguide laser channel extending along the optical axis. The second elongate surface has a non-linear cross-section normal to the optical axis. A dielectric insert may be provided between the electrodes defining in part the waveguide laser channel. A lengthwise gap may extend essentially an entire length of the waveguide laser channel between one of the first and second electrodes and the dielectric insert. The gap provides fluid communication between the waveguide laser channel and a volume outside the waveguide laser channel.

Abstract: This invention relates to a semiconductor laser apparatus having a structure to prevent corrosion in a refrigerant flow path of a heat sink and cool stably a semiconductor laser array over a long period. The semiconductor laser apparatus has a semiconductor laser stack, a refrigerant supplier, an insulating piping, and a refrigerant. The refrigerant supplier supplies the refrigerant to the semiconductor laser stack. The refrigerant is comprised of fluorocarbon. The insulating piping is an insulating piping with flexibility. An grounded conductive material is arranged inside the insulating piping. The conductive material operates to remove static electricity generated where the refrigerant flows inside the insulating piping.

Abstract: A semiconductor device comprising a semiconductor component, particularly a power laser diode bar, disposed on a cooling element, wherein the cooling element contains in its interior a cooling channel for conducting a coolant. The coolant channel comprises in at least one region microstructures for effective heat transfer to the coolant. The semiconductor component substantially completely overlaps the region of the cooling channel comprising the microstructures. Disposed between the semiconductor component and the cooling element is an intermediate support so arranged and configured that it compensates for mechanical stresses between the semiconductor component and the cooling element occurring as a result of differing thermal expansions of the semiconductor component and the cooling element. The material of the cooling element particularly preferably has a high modulus of elasticity such that the compensation takes place substantially within the elastic strain regime.

Abstract: High-power laser diode system offering reduced consumption and inventory of coolant. The invention provides coolant at a very high flow rate to a heat exchanger. A portion of the coolant flow downstream of the heat exchanger is separated and pumped by a fluid-dynamic pump back into the heat exchanger. The fluid dynamic pump is operated by a fresh coolant supplied at high-pressure. Because a substantial portion of the flow leaving the heat exchanger is recirculated back to the inlet, the amount of fresh coolant consumed is substantially reduced compared to a traditional laser diode system. This enables reduced size of coolant lines and results in a more compact and lightweight system. Other uses of the invention include cooling of devices requiring heat rejection at very high heat flux including photovoltaic cells, solar panels, semiconductor laser diodes, semiconductor electronics, and laser gain medium.

Abstract: Disclosed herein is a multichip package comprising an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the optoelectronics assembly; a plate having a first surface and a second surface; the first surface being opposedly disposed to the second surface; a portion of the first surface contacting a portion of the socket to provide thermal contact between the socket and the plate; a serpentine channel being disposed between the plate and the socket to provide a passage for a communication cable that is in operative communication with the optoelectronics assembly; and a heat exchanger in thermal contact with the plate; the heat exchanger being operative to cool the multichip package.

Abstract: An optical assembly with mounting provided to effectively transfer heat away from an optic, such as a slab or waveguide amplifier or laser disk, while limiting internal stresses. The assembly includes an optic with a planar surface. A heat sink is positioned in the assembly with an upper surface next to the planar surface of the optic. The upper surface of the heat sink comprises a recessed surface defining a reservoir for containing a compliant heat transfer material. The assembly may further include a volume of the heat transfer material, such as a liquid metal or thermally conductive gel, in the reservoir of the heat sink. In one embodiment, the optic is a slab amplifier with a reflective coating or layer that directly contacts the heat transfer material in the heat sink reservoir or a foil or membrane is provided between the heat transfer material and the slab.

Abstract: A hand-held laser device includes a casing formed with a substantially hollow interior space and having a laser emitter thereinside. The laser emitter is formed with an exciting lamp and a laser rod. A source generating a stream of gaseous coolant is provided within the interior space. A fluid cooling arrangement at least partially surrounding the laser rod is disposed within the stream of gaseous coolant for heat removal therefrom.

Abstract: A corrosion resistant fluid cooled acousto-optic (AO) device includes an AO interaction medium and a piezoelectric transducer affixed to the AO medium. A cooling arrangement is thermally coupled to the AO medium and includes a first material, and at least one cooling conduit in thermal contact within the first material formed from a second different material having an inlet and an outlet coupled thereto. The conduit provides a channel having an inner surface for flowing a coolant fluid therethrough, wherein the conduit includes a continuous corrosion resistant material layer over its entire area of the inner surface. The first material provides a specific acoustic impedance closer to a specific acoustic impedance of the AO medium as compared to the corrosion resistant material, and a bulk thermal conductivity at 25 C of at least 75 W/m·K.

Abstract: A high power laser system is provided having a master oscillator for generating a reference laser beam of desired beam quality, means for dividing the reference beam into multiple sub-beams, a multi-slab gain module positioned to receive the multiple sub-beams as input beams, and means for adjusting the sub-beams in phase to allow the output sub-beams to be coherently combined as a single composite output beam. Optionally, additional multi-slab gain modules similar to the first multi-slab gain module may be positioned to receive amplified output sub-beams from the first multi-slab gain module. The additional multi-slab gain modules generate further amplified output sub-beams of high aggregate power.

Abstract: A laser system thermal management system includes a laser gain assembly and a thermal management assembly. The laser gain assembly includes a laser gain medium and may include laser pump diodes. The thermal management system includes a high pressure gas tank connected to an open-cycle Joule-Thompson refrigerator. Cooled and partially liquefied gas is introduced into a reservoir. The reservoir may be in good direct thermal contact with the laser gain assembly or via a closed loop recirculating fluid heat exchanger. The heat generated by the laser gain assembly is removed by heat exchange with the cooled gas and condensate in the reservoir either by direct thermal contact or via the recirculating heat exchanger loop. Gas evaporating in the reservoir is vented.

Abstract: The present invention relates to a semiconductor laser apparatus having a metal body which efficiently cools a semiconductor laser element, in which joining of copper-made members coated with DLC layers and prevention of corrosion in the vicinity of joined portions are possible. The semiconductor laser apparatus has a metal body as a heat sink for cooling the semiconductor laser element. The metal body is constituted by a plurality of copper-made members, and the surfaces of each copper-made members are continuously coated with a diamond carbon layer except for regions corresponding to an exposed region in which the semiconductor laser element is mounted.

Abstract: A solid-state laser apparatus which can improve its durability is provide. In the solid-state laser apparatus 1, a main pipe 11 for circulating a coolant through a solid-state laser medium 3 is provided with a heat exchanger 14, whereby the laser medium 3 is prevented from raising its temperature. When the coolant becomes acidic or alkaline, a controller 24 controls a flow regulating valve 23, so as to increase the flow rate of the coolant flowing into a bypass pipe 21 provided with a deionizing filter 22, whereby the acidity or alkalinity of the coolant can be weakened. This can prevent the coolant from deteriorating a predetermined part of the laser apparatus 3, and thus can improve the durability of the solid-state laser apparatus 1.

Abstract: A semiconductor laser device 1 comprises: a heat sink 20, in turn comprising a main cooler unit 21, formed by joining metal members, a fluid channel 30, formed inside the main cooler unit 21, a cooling region 23 on an outer wall surface 22, and a resin layer 40, being continuously coated onto the outer wall surface 22 and an inner wall surface 33 with the exception of the cooling region 23; and a semiconductor laser element 80, positioned at the cooling region 23 with thermal contact with the outer wall surface 22 being maintained. By continuously coating the outer wall surface 22 and the inner wall surface 33 with the resin layer 40 with the exception of the cooling region 23, prevention of corrosion near portions at which the outer wall surface and the inner wall surface contact each other is realized.

Abstract: A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the first side surface of the laser diode via a first solder bond, and the first heat sink has a first cooling channel. A second electrically-insulating heat sink is attached to the second side surface of the laser diode via a second solder bond, and the second electrically-insulating heat sink has a second cooling channel. A substrate has a top side and a bottom side, and the top side being in communication with a first bottom side of the first electrically-insulating heat sink and a second bottom side of the second electrically-insulating heat sink. The substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel.

Abstract: A semiconductor laser device 1 comprises: a heat sink 20, in turn comprising a main cooler unit 21, formed by joining metal members, a fluid channel 30, formed inside the main cooler unit 21, a cooling region 23 on an outer wall surface 22, and a resin layer 40, being continuously coated onto the outer wall surface 22 and an inner wall surface 33 with the exception of the cooling region 23; and a semiconductor laser element 80, positioned at the cooling region 23 with thermal contact with the outer wall surface 22 being maintained. By continuously coating the outer wall surface 22 and the inner wall surface 33 with the resin layer 40 with the exception of the cooling region 23, prevention of corrosion near portions at which the outer wall surface and the inner wall surface contact each other is realized.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: This invention relates to a semiconductor laser apparatus having a structure to prevent corrosion in a refrigerant flow path of a heat sink and cool stably a semiconductor laser array over a long period. The semiconductor laser apparatus has a semiconductor laser stack, a refrigerant supplier, an insulating piping, and a refrigerant. The refrigerant supplier supplies the refrigerant to the semiconductor laser stack. The refrigerant is comprised of fluorocarbon. The insulating piping is an insulating piping with flexibility. An grounded conductive material is arranged inside the insulating piping. The conductive material operates to remove static electricity generated where the refrigerant flows inside the insulating piping.

Abstract: A zig-zag laser has the ability to generate a high power beam while effectively removing heat without degrading the beam quality. The laser has a series of gaps interposed between the thin slabs, the gain medium, and between the thin slabs and the quartz windows to receive coolant and cool the cell assembly. The coolant flows transversely relative to the path of the laser and the flow of the coolant is in the opposite direction on each side of the thin slab to minimize the temperature gradient. The gaps in conjunction with the inner channel portions in the secondary manifold flow the coolant through the cell assembly in a laminar manner therein not degrading the laser beam quality. A transparent quartz/quartz interface between the secondary manifold and the cell assembly allow the fluorescence to move away from the cell assembly and minimizes heat in the cell assembly.

Abstract: The laser tube housing of a CO2 slab laser is provided with a cooling system in which coolant fluid tubes are inserted into hollowed out portions formed in the longitudinal sidewalls of the laser tube housing; mounting the coolant fluid tubes in this way provides for enhanced cooling and increased stiffness of the laser tube housing. Also, a cooling system is provided for the laser's electrode assembly that relies on a manifold system that is mounted on a longitudinal sidewall of the laser tube housing to route coolant fluid through the sidewall to the electrode assembly; sidewall flow of the coolant fluid enables the end flanges of the laser tube housing to be remove without disturbing either the electrodes or the optical resonator of the laser.

Abstract: An improved tube solid-state laser (SSL) is provided utilizing diode pumping, microchannel cooling, optics, and/or new coating and bonding processes. In one example, an amplifier module for the SSL includes a tube of laser gain material, a first substrate and a second substrate including microchannels adjacent an interior and exterior surface of the tube, respectively, and a plurality of diode bars arranged exterior to the second substrate. Advantageously, thermal lensing effects, birefringence, bifocussing, and alignment problems associated with typical tube SSLs are eliminated or reduced while providing high beam quality and high average power levels.

Abstract: An apparatus for optically pumping a laser-active solid body with pumping light coupled into the solid body through an end surface of the solid body is disclosed. The apparatus includes a laser-active solid body including an end surface though which pumping light is coupled into the solid body and a lateral surface through which pumping light exits the solid body, a reflector surrounding the laser-active solid body at a distance from the lateral surface of the solid body for reflecting light that exists the solid body back towards the solid body, and a surface for diffusing light that is coupled into the solid body through the end surface of the solid body and that exits the solid body through the lateral surface. The surface is selected from the group consisting of the lateral surface and a surface of the reflector.