Heat Sink Patents (Class 372/36)
  • Patent number: 10916914
    Abstract: Included are a metal block, a first sub-mount fixed to the metal block, and a second sub-mount having an upper surface and a lower surface which is fixed to the first sub-mount via a metal layer. Also included are an optical element mounted on the upper surface of the second sub-mount and a high frequency line path which is formed on the upper surface of the second sub-mount and electrically connected to the optical element so as to cause a signal such as a high-frequency signal to be input to or output from the optical element. In addition, the metal layer is electrically connected to the metal block.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: February 9, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventor: Takuro Shinada
  • Patent number: 10914905
    Abstract: A photoelectric adapter includes a power sourcing equipment (PSE) device, an optical connector connection part and an electrical connector. The electrical connector is connectable to an electrical connector connection part of an electrical device. The PSE device includes a semiconductor laser that oscillates with electric power, thereby outputting feed light. The PSE device is driven by receiving the electric power supplied from the electrical device through the electrical connector, and outputs the feed light from the optical connector connection part. Another photoelectric adapter includes a powered device, an optical connector connection part and an electrical connector. The powered device includes a photoelectric conversion element that converts feed light into electric power. The powered device receives the feed light supplied through the optical connector connection part, converts the feed light into the electric power, and outputs the electric power from the electrical connector.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: February 9, 2021
    Assignee: KYOCERA CORPORATION
    Inventor: Tomonori Sugime
  • Patent number: 10903622
    Abstract: Disclosed herein are various embodiments for stronger and more powerful high speed laser arrays. For example, an apparatus is disclosed that comprises an epitaxial material comprising a mesa structure in combination with an electrical waveguide, wherein the mesa structure comprises a plurality of laser regions within the mesa structure itself, each laser region of the mesa structure being electrically isolated within the mesa structure itself relative to the other laser regions of the mesa structure.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: January 26, 2021
    Assignee: OPTIPULSE INC.
    Inventor: John Richard Joseph
  • Patent number: 10903618
    Abstract: A fixture assembly having a base, an upper cover and a latch mechanism for testing an edge-emitting laser diode and a testing apparatus having the same are provided. The base includes a pocket, and a transmission cavity in communication with and orthogonal to the pocket. The upper cover includes a body, an abutting block and a pressing member. The abutting block having an electrical contact interface is engageable with the body for slidable movement with respect to the body. The latch mechanism is disposed on the upper cover, and may selectively connect or disconnect the upper cover to or from the base. When the latch mechanism is operated to connect the upper cover to the base, the pressing member applies a force through the abutting block on the edge-emitting laser diode received in the pocket, and the edge-emitting laser diode emits the laser for inspection through the transmission cavity.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: January 26, 2021
    Assignee: CHROMA ATE INC.
    Inventor: James E. Hopkins
  • Patent number: 10884330
    Abstract: A light source apparatus according to an aspect of the present disclosure includes a substrate having a first surface, a frame, a lid with which the frame is provided, a light emitter that is accommodated in an accommodation space, a wavelength converter that is provided at the substrate, is accommodated in the accommodation space, converts first light emitted from the light emitter into second light having a wavelength different from the wavelength of the first light, and outputs the second light, and a first optical film that is provided in the light path between the light emitter and the wavelength converter, transmits one of the first light and the second light, and reflects the other one of the first light and the second light, and the light emitter emits the first light in such a way that the chief ray of the first light travels along the first surface.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: January 5, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tetsuo Shimizu, Wataru Yasumatsu
  • Patent number: 10884256
    Abstract: A collimator lens to be held by a holder member, includes a lens portion including an area through which light passes, and a protruding portion protruding from the lens portion. The lens portion is formed on an outer peripheral surface of the collimator lens and includes a bonded portion to be bonded and fixed onto a bonding portion, which is formed on the holder member, through an adhesive. The protruding portion includes a plane formed on an outer peripheral surface of the protruding portion. The plane is formed at a position where a normal line to the plane intersects with the bonded portion.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: January 5, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kunihiro Niwa, Junya Azami
  • Patent number: 10862264
    Abstract: A light-emitting element housing member includes a substrate that is made of a ceramic and internally includes a deep-bottom-type space portion having an opening in at least one position thereof, wherein an inner wall of the space portion serves as a mounting part for a light-emitting element. A light-emitting element housing member includes a mounting part meant for mounting a light-emitting element and includes a substrate that includes a bottom base material having a rectangular shape in a planar view and a wall member provided on the bottom base material to enclose the mounting part in a U-shaped manner and have an opening in at least one portion thereof, wherein the substrate is integrally formed of a ceramic.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: December 8, 2020
    Assignee: KYOCERA Corporation
    Inventors: Youji Furukubo, Sentaro Yamamoto, Masanori Okamoto, Katsuaki Masaki, Takehiro Nishimura, Kazuya Shibata
  • Patent number: 10804675
    Abstract: Disclosed herein is a semiconductor laser device that has a higher heat dissipation property, comprising: a base; a block protruding from a first surface of the base; a laser chip being joined onto a side face rising upward from the first surface, and allowing heat generated to be transferred to the block; a cap covering the block and be fixed on the first surface; a window provided in the cap and allowing the light emitted from the laser chip to pass through; at least one lead pin penetrating the base, one end of the lead pin protruding inside the cap, and any of the lead pin being positioned at an opposite side of the block with respect to the laser chip; and a pinless region extending in a range of the base corresponding to a rear side of the block and provided with none of pins including the lead pin.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: October 13, 2020
    Assignee: USHIO DENKI KABUSHIKI KAISHA
    Inventors: Yasushi Takizawa, Masato Hagimoto, Shintaro Miyamoto
  • Patent number: 10763638
    Abstract: A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 1, 2020
    Assignee: SCHOTT AG
    Inventors: Rudolf Jungwirth, Amy Soon Li Ping, Artit Aowudomsuk, Ong Wai Li, Kenneth Tan, Karsten Droegemueller
  • Patent number: 10763640
    Abstract: Apparatus include a conductive block including a base surface and a plurality of parallel stepped surfaces opposite the base surface and defining respective mounting surfaces situated to receive respective laser diodes having respective thermal paths defining a common thermal path distance from the mounting surfaces to the base surface, and a two-phase cooling unit including a coupling surface attached to the base surface of the conductive block and wherein the two-phase cooling unit is situated to conduct heat generated through the emission of laser beams from the laser diodes along the thermal paths.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 1, 2020
    Assignee: nLIGHT, Inc.
    Inventors: Manoj Kanskar, Mark DeFranza
  • Patent number: 10734124
    Abstract: A heat pipe assembly of a nuclear apparatus includes a number of elongated heat pipes and a detection system having one or more fiber optic cable assemblies that are elongated and are wrapped in a helical fashion along an exterior surface of one or more of the heat pipes. The detection system further includes an optical signal generator that supplies to each, fiber optic assembly an optical signal and additionally includes a sensor that detects a number of reflections of the optical signal and generates an output. The output is usable by an instrumentation and control system to determine a number of temperatures along one or more of the heat tubes by detecting a temperature at each of a plurality of locations along each fiber optic cable assembly.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: August 4, 2020
    Assignee: Westinghouse Electric Company LLC
    Inventors: Jorge V. Carvajal, Thomas W. Tweedle, Raghu K. Avali, Yasir Arafat, Matthew R. Heisel, Jurie Van Wyk
  • Patent number: 10707651
    Abstract: A semiconductor laser element that includes a stripe-shaped light-emitting region and that is formed by adhering a surface of the semiconductor laser element on a side opposite to a semiconductor substrate and a submount to each other by a solder layer includes a terrace section on a surface of the semiconductor laser element that is adhered by the solder layer, the terrace section being separated from a ridge portion, which is a current-carrying portion, by a grooved portion. A top surface of a region including the grooved portion is covered by a metal. The terrace section is divided into a plurality of portions that are disposed in a scattered manner.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: July 7, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yasuo Kan, Ryuhichi Sogabe
  • Patent number: 10698303
    Abstract: A projection apparatus for producing a pixel-based illumination pattern has a laser light source for producing coherent laser light and a micromirror array with a multiplicity of mirrors. The mirrors are implemented so as to be controllable in terms of their position, for setting a brightness and/or color of a respective pixel of the pixel-based illumination pattern. The laser light source emits the laser light towards the micromirror array. A beam-shaping element splits the laser light from the laser light source into a multiplicity of partial beams and each of the partial beams is oriented toward one of the mirrors of the micromirror array.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: June 30, 2020
    Assignee: Continental Automotive GmbH
    Inventor: Stefan Holzinger
  • Patent number: 10690319
    Abstract: A light emitting device includes: a first semiconductor laser element; a second semiconductor laser element; and a light exit surface which emits light from the first semiconductor laser element and the second semiconductor laser element. The first semiconductor laser element is disposed at a position farther than the second semiconductor laser element as seen from a flat surface including a point on a surface of the light exit surface and perpendicular to a light extraction direction.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: June 23, 2020
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Kento Hayashi, Yuhki Kawamura, Masao Kamiya, Satoshi Wada, Masaaki Osawa
  • Patent number: 10686295
    Abstract: A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: June 16, 2020
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Jens Mueller, Markus Horn
  • Patent number: 10680411
    Abstract: The invention describes a laser sensor module comprising at least one Vertical Cavity Surface Emitting Laser (100) and at least one driving circuit (120). The driving circuit (120) is adapted to provide electrical energy to the Vertical Cavity Surface Emitting Laser (100) such that the Vertical Cavity Surface Emitting Laser (100) emits laser pulses (345) with a pulse length (356) of less than 100 ns and a duty cycle of less than 5% in comparison to a continuous laser emission. The driving circuit (120) is further adapted to provide additional energy to the Vertical Cavity Surface Emitting Laser (100) at least 100 ns prior to at least a part of the laser pulses (345) such that the part of the laser pulses (345) are emitted under defined optical conditions. The invention further describes a distance detection device comprising the laser sensor module and a method of driving the laser sensor module.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 9, 2020
    Assignee: TRUMPF PHOTONIC COMPONENTS GMBH
    Inventors: Holger Moench, Alexander Marc Van Der Lee, Stephan Gronenborn
  • Patent number: 10644481
    Abstract: An optical component packaging structure includes a base, a sealing cover, and a cooler. The base includes a mounting surface and a back surface that faces a direction opposite to that faced by the mounting surface. The cooler includes a cooling plate, a heat dissipation plate disposed opposite to the cooling plate, and a conductive connection body connecting the cooling plate and the heat dissipation plate. The cooling plate includes a cooling surface. The cooler is partially built in the base. The cooling plate faces a direction the same as the mounting surface. The sealing cover covers the mounting surface, and the sealing cover and the mounting surface form a sealing cavity. The cooling surface is located inside the sealing cavity. The heat dissipation plate protrudes from the back surface and is sealedly connected to the base.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: May 5, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yue Wen, Zhiguang Xu, Sulin Yang
  • Patent number: 10634926
    Abstract: A mobile terminal having a lighting device including a light emitting element, a diffractive optical element (DOE) to diffract a part of light output from the light emitting element, and a driving unit to move the diffractive optical element so as to vary a distance between the light emitting element and the diffractive optical element.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: April 28, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Changhwan Lee, Yunsup Shin, Ayoung Cho
  • Patent number: 10630038
    Abstract: This disclosure relates to laser disk mounting systems and methods. The laser disk mounting systems comprise a disk module with a round disk-shaped heat sink having a front side, a rear side, and an edge surface connecting the front side and the rear side, and a laser disk arranged on the front side of the heat sink, and a radial mounting device with an opening for receiving the disk module, wherein the disk module is mounted in the radial mounting device such that a force action is applied in radial direction on the edge surface.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: April 21, 2020
    Assignee: TRUMPF LASER GMBH
    Inventors: Sven-Silvius Schad, Alexander Killi, Vincent Kuhn, Markus Graf
  • Patent number: 10587091
    Abstract: A light emitting device includes a base; a plurality of semiconductor laser elements that are disposed on the base and that are configured to emit light laterally from the plurality of semiconductor laser elements; a reflecting member that is disposed on the base and configured to reflect light from the plurality of semiconductor laser elements; a surrounding part that is disposed on the base and that surrounds the plurality of semiconductor laser elements and the reflecting member; a wiring part that is disposed on the base so as to extend to a location outside of the surrounding part, the wiring part being electrically connected to the plurality of semiconductor laser elements; a radiating body disposed on the surrounding part, the radiating body comprising at least one of a metal and a ceramic, and the radiating body having an opening; and a wavelength converting member that is located in the opening of the radiating body, the wavelength converting member being configured to convert a wavelength of light t
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: March 10, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Kazuma Kozuru, Shinichi Nagahama
  • Patent number: 10587097
    Abstract: Method and devices for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, are provided. The laser devices include multiple laser emitters integrated onto a substrate (in a module), which emit green or blue laser radiation.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: March 10, 2020
    Assignee: Soraa Laser Diode, Inc.
    Inventors: James W. Raring, Paul Rudy, Chendong Bai
  • Patent number: 10529885
    Abstract: PROBLEM TO BE SOLVED: To reduce an influence on an optical device caused by stress variation on a resin sealing body due to an environmental change and similar change. SOLUTION: An optical device includes a substrate 11, a semiconductor lamination portion formed on the substrate 11 and configured to receive or emit a light, a protective layer 3 that has a shape to cover an entire surface of the semiconductor lamination portion, a mold resin 6 configured to seal the protective layer 3 and the substrate 11 excluding a surface of the substrate 11 on an opposite side of a surface on which the semiconductor lamination portion is formed. The light is entered or emitted from a side of the substrate 11, and the mold resin 6 includes a through hole 61 configured to pass through from a top surface of the mold resin 6 to the protective layer 3. A deformation of the mold resin 6 is reduced by the protective layer 3 and the through hole 61.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: January 7, 2020
    Assignee: Asahi Kasei Microdevices Corporation
    Inventors: Edson Gomes Camargo, Toshiaki Fukunaka
  • Patent number: 10515581
    Abstract: The LED pixel includes a driver IC (20) and an LED chip (40); the LED chip (40) is stacked and mounted on a surface of the driver IC (20), and a wire (31) going from the cathode of the LED chip (40) is connected to the driver IC (20). The driver IC (20) is an unpackaged die. An insulation layer is disposed on the surface of the die, and a pad (30) disposed on the insulation layer is connected to a positive electrode. The LED chip (40) is mounted on the pad (30), and the anode of the LED chip (40) is electrically connected with the pad (40). This improves the light transmittance of the LED display product.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: December 24, 2019
    Inventor: Shuling Li
  • Patent number: 10498106
    Abstract: Disclosed herein are various embodiments for stronger and more powerful high speed laser arrays. For example, an apparatus is disclosed that comprises an epitaxial material comprising a mesa structure in combination with an electrical waveguide, wherein the mesa structure comprises a plurality of laser regions within the mesa structure itself, each laser region of the mesa structure being electrically isolated within the mesa structure itself relative to the other laser regions of the mesa structure.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: December 3, 2019
    Assignee: OPTIPULSE INC.
    Inventor: John Richard Joseph
  • Patent number: 10490121
    Abstract: A display device is disclosed. In an embodiment a display device includes at least one connection carrier comprising a multiplicity of switches and a multiplicity of light-emitting diode chips, wherein each light-emitting diode chip is mechanically fixed and electrically connected to the connection carrier, wherein each switch is designed for driving at least one light-emitting diode chip, and wherein the light-emitting diode chips are imaging elements of the display device.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: November 26, 2019
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Stefan Illek, Norwin von Malm, Tilman Ruegheimer
  • Patent number: 10444451
    Abstract: A light shield may be formed in photonic integrated circuit between integrated optical devices of the photonic integrated circuit. The light shield may be built by using materials already present in the photonic integrated circuit, for example the light shield may include metal walls and doped semiconductor regions. Light-emitting or light-sensitive integrated optical devices or modules of a photonic integrated circuit may be constructed with light shields integrally built in.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: October 15, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Ruizhi Shi, Yang Liu, Ari Novack, Yangjin Ma, Kishore Padmaraju, Michael J. Hochberg
  • Patent number: 10431959
    Abstract: A light emitting device includes first and second semiconductor laser elements and a collimate lens. The first semiconductor laser element irradiates a first light having a first peak wavelength in a visible range. The second semiconductor laser element irradiates a second light having a second peak wavelength in the visible range, which is different from the first peak wavelength. The collimate lens is arranged on paths of the first and second lights. The collimate lens has a plurality of lens portions including a first lens portion through which the first light passes, and a second lens portion through which the second light passes. The second lens portion is connected to the first lens portion, and the first and second lens portions are different from each other in at least one of a shape of a light incident surface, a shape of a light extracting surface, and a height.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: October 1, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Soichiro Miura, Kazuma Kozuru
  • Patent number: 10424897
    Abstract: A semiconductor laser device includes a heat sink, a submount, a first electrode, an insulating layer, a semiconductor laser element, a connecting portion, and a second electrode. The submount is conductive and on a first region of an upper surface of the heat sink. The first electrode is conductive and on a second region, different from the first region, of the upper surface of the heat sink. The first electrode is electrically connected either to at least part of a side surface of the submount or to an upper surface of the submount.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: September 24, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Naoto Ueda, Kouji Oomori, Takayuki Yoshida
  • Patent number: 10416400
    Abstract: A semiconductor module is disclosed. The semiconductor module includes a housing that encloses on a bottom thereof a spacer and a wiring substrate that mounts a semiconductor element thereon. The housing includes a feedthrough that secures one end of a transmission substrate. The other end of the transmission substrate faces the wiring substrate and the spacer. The other end of the transmission substrate provides a lower end and an upper end that form an extension protruding toward the wiring substrate. The upper end is set so close to the wiring substrate but the lower end forms a space for receiving a surplus adhesive oozing between the spacer and the wiring substrate.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: September 17, 2019
    Assignee: Sumitomo Electric Device Innovations, Inc.
    Inventor: Yasuyuki Yamauchi
  • Patent number: 10391900
    Abstract: An occupant support adapted for use in a vehicle includes a cushion, an air-permeable cushion cover, and a ventilation unit. The cushion is adapted to support an occupant on the occupant support. The air-permeable cushion cover is arranged around at least a portion the cushion. The ventilation unit is configured to selectively cool the occupant of the occupant support with convective cooling through the air-permeable cushion cover.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: August 27, 2019
    Assignee: Faurecia Automotive Seating, LLC
    Inventors: Ying (Carolyn) Zhao, Robert C. Fitzpatrick, Cedric Ketels, John M. Perraut
  • Patent number: 10386178
    Abstract: The present invention relates to a laser device (10) for projecting a structured light pattern (9) onto a scene (15). The device is formed of several arrays (1) of semiconductor lasers (2), each array (1) comprising an irregular distribution of emission areas (2a) of the semiconductor lasers (2). One or several imaging optics (4) image said arrays (1) to an imaging space and superpose the images of said arrays (1) in the imaging space to form said light pattern (9). The proposed laser device generates a light pattern with high contrast and efficiency which may be used for 3D imaging systems, e. g. in automotive applications.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: August 20, 2019
    Assignee: PHILIPS PHOTONICS GMBH
    Inventors: Holger Moench, Stephan Gronenborn, Mark Carpaij
  • Patent number: 10371909
    Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: August 6, 2019
    Assignee: FINISAR CORPORATION
    Inventors: Troy Wy Piew Chiang, Julia Koh, Tat Ming Teo, William H. Wang
  • Patent number: 10367324
    Abstract: A laser component is provided, including a laser medium and a transparent heat transmitting member, at least one of which is oxide. Bonding surfaces of the laser medium and the transparent heat transmitting member are exposed to oxygen plasma, and thereafter the bonding surfaces are brought into contact without heating. The laser medium and the transparent heat transmitting member are bonded at atomic levels, their thermal resistance is low, and no large residual stress is generated due to the bonding taking place under normal temperature. The process of oxygen plasma exposure ensures transparency of their bonding interface. The laser medium and the transparent heat transmitting member are stably bond via an amorphous layer.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: July 30, 2019
    Assignee: INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION NATIONAL INSTITUTES OF NATURAL SCIENCES
    Inventors: Takunori Taira, Arvydas Kausas, Lihe Zheng
  • Patent number: 10361532
    Abstract: Semiconductor lasers are arranged in a plurality of columns. The columns of the respective semiconductor lasers include semiconductor laser installed columns. Reflecting mirrors in the respective semiconductor laser installed columns reflect light in substantially the same axial direction as viewed from above, and constitute beam groups. The beam groups of the respective semiconductor laser installed columns are formed on both sides in a width direction of a housing. That is, the beam groups are configured for each of the semiconductor laser installed columns, and the respective beam groups are formed on mutually different axes as viewed from above.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: July 23, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Etsuji Katayama, Toshio Kimura
  • Patent number: 10359648
    Abstract: Example embodiments disclose a smart contact lens for augmented reality and methods of manufacturing and operating the smart contact lens. The smart contact lens includes a first contact lens, a display unit in a center region of the first contact lens, a peripheral device on the first contact lens and around the display unit, the peripheral device being connected to the display unit, and a passivation layer covering the display unit and the peripheral device. The method of manufacturing the smart contact lens includes forming a display unit; mounting the display unit in a center region of a first contact lens, forming a peripheral device on the first contact lens, around the display unit and in connection with the display unit, and forming a passivation layer to cover the display unit and the peripheral device.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taeho Kim, Sungwoo Hwang, Sangwon Kim, Hoyoung Ahn, Daeyoung Chung
  • Patent number: 10333033
    Abstract: A light emitting device according to an embodiment includes a body having a recess; a light emitting chip disposed in the recess; and a first dampproof layer sealing the light emitting chip and extended from a surface of the light emitting chip to a bottom of the recess, wherein the light emitting chip includes a wavelength range of 100 nm to 280 nm, and the first dampproof layer includes a fluororesin-based material.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: June 25, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Jin Kim, Do Hwan Kim
  • Patent number: 10333270
    Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: June 25, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Kyono, Hideyuki Ijiri, Takao Nakamura, Hiromi Nakanishi, Takatoshi Ikegami, Kuniaki Ishihara, Yohei Enya, Tetsuya Kumano
  • Patent number: 10317704
    Abstract: Example embodiments disclose a smart contact lens for augmented reality and methods of manufacturing and operating the smart contact lens. The smart contact lens includes a first contact lens, a display unit in a center region of the first contact lens, a peripheral device on the first contact lens and around the display unit, the peripheral device being connected to the display unit, and a passivation layer covering the display unit and the peripheral device. The method of manufacturing the smart contact lens includes forming a display unit; mounting the display unit in a center region of a first contact lens, forming a peripheral device on the first contact lens, around the display unit and in connection with the display unit, and forming a passivation layer to cover the display unit and the peripheral device.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: June 11, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taeho Kim, Sungwoo Hwang, Sangwon Kim, Hoyoung Ahn, Daeyoung Chung
  • Patent number: 10305254
    Abstract: A VCSEL can include: an elliptical oxide aperture in an oxidized region that is located between an active region and an emission surface, the elliptical aperture having a short radius and a long radius with a radius ratio (short radius)/(long radius) being between 0.6 and 0.8, the VCSEL having a relative intensity noise (RIN) of less than ?140 dB/Hz. The VCSEL can include an elliptical emission aperture having the same dimensions of the elliptical oxide aperture. The VCSEL can include an elliptical contact having an elliptical contact aperture therein, the elliptical contact being around the elliptical emission aperture. The elliptical contact can be C-shaped. The VCSEL can include one or more trenches lateral of the oxidized region, the one or more trenches forming an elliptical shape, wherein the oxidized region has an elliptical shape. The one or more trenches can be trapezoidal shaped trenches.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: May 28, 2019
    Assignee: Finisar Corporation
    Inventors: Deepa Gazula, Nicolae Chitica, Marek Chacinski, Gary Landry, Jim Tatum
  • Patent number: 10305252
    Abstract: A power control method for a laser system comprising laser diodes arranged in diode banks is provided. Each diode bank comprises at least one of the laser diodes and has a maximum power. The method comprises operating a first diode bank of the diode banks to output a first power; and concurrently operating other of the diode banks to output other powers, at least one of the other powers being different than the first power.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: May 28, 2019
    Assignees: Lumentum Operations LLC, AMADA HOLDINGS COMPANY LTD.
    Inventors: Martin H. Muendel, Justin L. Franke, Joseph J. Alonis, Kaori Usuda, Minoru Ogata
  • Patent number: 10283929
    Abstract: Various embodiments may relate to a semiconductor laser device, including at least one laser diode, and at least one reflection surface which reflects diffusely and which is irradiated by the laser diode during operation, and an additional light-nontransmissive housing body having a cutout. The laser diode is the sole light source of the semiconductor laser device. The laser diode is mounted immovably relative to the at least one reflection surface. Light emitted by the semiconductor laser device during operation has the same spectral components as, or fewer spectral components than, light emitted by the laser diode. An interspace between the laser diode and the at least one reflection surface is free of an optical assembly. A light-emitting area of the semiconductor laser device is greater than a light-emitting area of the laser diode by at least a factor of 100.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: May 7, 2019
    Assignee: OSRAM OPTO Semiconductors GmbH
    Inventors: Hubert Halbritter, Mario Wiengarten
  • Patent number: 10256166
    Abstract: A semiconductor device includes a resin case which houses a semiconductor element, a plurality of lead frames disposed in the principal plane of a base of the resin case with spaces therebetween, and a block portion disposed over a space between adjacent lead frames along the adjacent lead frames. With the semiconductor device, the disposition of the block portion makes creepage distance long, compared with a case where the block portion is not disposed and therefore a space between the adjacent lead frames is flat. Accordingly, even if metal atoms contained in the lead frames or the like migrate on an insulator or at an interface because of migration, a conduction path is hardly formed between the adjacent lead frames. That is to say, a short circuit hardly occurs between the adjacent lead frames with the block portion therebetween. This semiconductor device provides improved reliability.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: April 9, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Masanori Tanaka, Tadanori Yamada
  • Patent number: 10256384
    Abstract: A light emitting diode (LED) support frame (10), LED device adopting the same, and LED display module. The LED support frame (10) comprises a base board (101) and a reflection cup (102). A light converging component (103) is arranged on the reflection cup (102). A concave light converging surface (1030) is provided at a side of the light converging component (103) and adjacent to a reflection cup mouth (1021). A part of a light beam emitted from an LED chip is directed to the light converging surface (1030), reflected by the light converging surface (1030), and finally converged with other light beams emitted from the LED chip to focus at a visual field observed by an observer. Therefore, the embodiment effectively reduces optical loss of lights from different directions in the light converging component (103).
    Type: Grant
    Filed: June 4, 2016
    Date of Patent: April 9, 2019
    Assignee: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
    Inventors: Chuanbiao Liu, Kuai Qin, Mingjun Zhu, Xiaolong Huang, Tinghong Yang
  • Patent number: 10256609
    Abstract: A surface-emitting laser according to one embodiment of the technology includes a laser element section that includes a first multi-layer film reflecting mirror, a first semiconductor layer of a first conductivity type, an active layer, a second semiconductor layer of a second conductivity type, a second multi-layer film reflecting mirror, a nitride semiconductor layer of the second conductivity type, and a light output surface in this order. The laser element section further includes an electrode that injects a current into the active layer.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: April 9, 2019
    Assignee: Sony Corporation
    Inventors: Shoichiro Izumi, Tatsushi Hamaguchi, Noriyuki Futagawa, Masaru Kuramoto
  • Patent number: 10230212
    Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: March 12, 2019
    Assignee: Cisco Technology, Inc.
    Inventors: Mudasir Ahmad, Weidong Xie, Yaoyu Pang, Chiyu Liu, Qiang Wang
  • Patent number: 10222555
    Abstract: An optoelectronic coupling system and methods of forming the same include an optoelectronic chip mounted on a substrate. The optoelectronic chip includes one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface, with a first cut-away portion to accommodate the optoelectronic chip, and an upper surface that has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has comprising one or more upper lenses positioned over respective lower lenses.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: March 5, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hidetoshi Numata, Masao Tokunari
  • Patent number: 10207244
    Abstract: A method of manufacturing a plurality of through-holes in a layer of first material by subjecting part of the layer of said first material to ion beam milling. For batch-wise production, the method comprises after a step of providing the layer of first material and before the step of ion beam milling, providing a second layer of a second material on the layer of first material, providing the second layer of the second material with a plurality of holes, the holes being provided at central locations of pits in the first layer, and subjecting the second layer of the second material to said step of ion beam milling at an angle using said second layer of the second material as a shadow mask.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: February 19, 2019
    Assignee: SMARTTIP B.V.
    Inventor: Edin Sarajlic
  • Patent number: 10199795
    Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: February 5, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Kyono, Hideyuki Ijiri, Takao Nakamura, Hiromi Nakanishi, Takatoshi Ikegami, Kuniaki Ishihara, Yohei Enya, Tetsuya Kumano
  • Patent number: 10168244
    Abstract: A gaseous fuel monitoring system can include a gaseous fuel supply enclosure, an optical line extending along the gaseous fuel supply enclosure, and a relatively highly thermally conductive material contacting both the gaseous fuel supply enclosure and the optical line. The relatively highly thermally conductive material can comprise a pyrolytic carbon material. A method of detecting leakage from a gaseous fuel supply enclosure can include securing an optical line to the gaseous fuel supply enclosure, the securing comprising contacting a pyrolytic carbon material with the optical line and the gaseous fuel supply enclosure. A gaseous fuel monitoring system can include an optical interrogator connected to the optical line, which interrogator detects changes in light transmitted by the optical line due to changes in vibrations of the enclosure.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: January 1, 2019
    Assignee: HALLIBURTON ENERGY SERVICES, INC.
    Inventors: Rory D. Daussin, Neal G. Skinner
  • Patent number: 10139714
    Abstract: A light source apparatus according to an embodiment of the present technology includes a light source section, a member, and a support section. The light source section including a contacted surface formed in a predetermined position. The member is attached to the light source section and in contact with the contacted surface. The support section is capable of supporting a component of a load that acts on the contacted surface due to the weight of the member, the component being in at least a predetermined direction and supported by the support section in both orientations of the predetermined direction.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: November 27, 2018
    Assignee: SONY CORPORATION
    Inventor: Takashi Takamatsu