Heat Sink Patents (Class 372/36)
  • Patent number: 11367992
    Abstract: A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: June 21, 2022
    Assignee: SCHOTT AG
    Inventors: Robert Hettler, Michelle Fang
  • Patent number: 11340290
    Abstract: A testing device may include a stage associated with holding an emitter wafer during testing of an emitter. The stage may be arranged such that light emitted by the emitter passes through the stage. The testing device may include a heat sink arranged such that the light emitted by the emitter during the testing is emitted in a direction away from the heat sink, and such that a first surface of the heat sink is near a surface of the emitter wafer during the testing but does not contact the surface of the emitter wafer. The testing device may include a probe card, associated with performing the testing of the emitter, that is arranged over a second surface of the heat sink such that, during the testing of the emitter, a probe of the probe card contacts a probe pad for the emitter through an opening in the heat sink.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: May 24, 2022
    Assignee: Lumentum Operations LLC
    Inventor: Eric R. Hegblom
  • Patent number: 11309466
    Abstract: A light emitting unit includes a reflective structure, a light transmitting body and a light emitting chip. The reflective structure has a recess formed by inner side surfaces thereof, and the reflective structure includes a side opening and a bottom opening corresponding to the recess. The side opening and the bottom opening are adjacent to each other, and the inner side surfaces are defined as a top surface and a surrounding side surface. The light transmitting body is disposed within the recess and doped with fluorescent powder. The light transmitting body includes a light emitting surface and an electrode exposing surface. The light emitting surface is corresponding to the side opening; and the electrode exposing surface is corresponding to the bottom opening. The light emitting chip is partially disposed within the light transmitting body and has a bottom, a top light emitting and side light emitting surfaces.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: April 19, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yu-Yu Chang, Chih-Yuan Chen, Yung-Chang Jen
  • Patent number: 11309683
    Abstract: A laser module includes: a laser device that emits a laser beam including a major polarization component and a minor polarization component; a beam splitter that splits the laser beam into the major polarization component and the minor polarization component and that directs the major polarization component and the minor polarization component in different directions; an optical fiber that is optically coupled to the major polarization component split by the beam splitter and externally outputs the major polarization component; a package housing that houses the laser device and that has an inner surface including a minor polarization component irradiation portion that is irradiated by the minor polarization component split by the beam splitter; and a temperature measurement element that is attached to the package housing and that detects a temperature change of the minor polarization component irradiation portion.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: April 19, 2022
    Assignee: Fujikura Ltd.
    Inventor: Yohei Kasai
  • Patent number: 11289536
    Abstract: A display apparatus including a thin film transistor (TFT) substrate, a first LED sub-unit disposed on the TFT substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed between the TFT substrate and the first LED sub-unit, and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit are configured to be independently driven, light generated from the first LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the second LED sub-unit and the third LED sub-unit, and light generated from the second LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the third LED sub-unit.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: March 29, 2022
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jong Hyeon Chae, Seong Gyu Jang, Ho Joon Lee, Chang Yeon Kim, Chung Hoon Lee
  • Patent number: 11258234
    Abstract: A miniature illuminator is described which is suitable for assembly into mobile electronics devices such as cell phones and computer tablets. Features of the invention overcome the complexity of current miniature illuminators by using single molded structure which includes all the electrical feedthrough connections and has the features necessary for accurate mounting of optical components. The molded structure includes laser safety connections which provide an electrical interrupt signal when the illuminator is damaged in a way that could result in propagation of non-eye safe illuminator beams. In an alternate operation the illuminator provides a signal when a subject gets too close to the illuminator and would receive unsafe VCSEL illuminator beam. The laser safety feature is integrated into the molded Illuminator package so that separate electrically connected structures to achieve this function are eliminated.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: February 22, 2022
    Assignee: Princeton Optronics, Inc.
    Inventors: Tong Chen, Qing Wang
  • Patent number: 11244982
    Abstract: A display apparatus including a thin film transistor (TFT) substrate, a first LED sub-unit disposed on the TFT substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed between the TFT substrate and the first LED sub-unit, and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit are configured to be independently driven, light generated from the first LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the second LED sub-unit and the third LED sub-unit, and light generated from the second LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the third LED sub-unit.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: February 8, 2022
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jong Hyeon Chae, Seong Gyu Jang, Ho Joon Lee, Chang Yeon Kim, Chung Hoon Lee
  • Patent number: 11239386
    Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: February 1, 2022
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Karl Weidner, Ralph Wirth, Axel Kaltenbacher, Walter Wegleiter, Bernd Barchmann, Oliver Wutz, Jan Marfeld
  • Patent number: 11233370
    Abstract: A device for generating laser radiation includes a resonator, an optical assembly, and an adjustment device is provided. The optical assembly includes a movably arranged support element on which optical components are arranged, wherein an optical component is a device for deflecting laser radiation. The device for deflecting laser radiation of the optical assembly is arranged in the beam path of laser radiation generated by the resonator. The adjustment device changes the position of the optical assembly from a first position to another position relative to the resonator, wherein the position of the beam path of laser radiation emanating from the optical assembly in the first position remains unchanged by the adjustment of the optical assembly to the other position relative to the resonator. A corresponding method is also provided.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: January 25, 2022
    Assignee: COMPACT LASER SOLUTIONS GMBH
    Inventor: Andreas Kuntze
  • Patent number: 11217966
    Abstract: Gallium and nitrogen containing optical devices operable as laser diodes and methods of forming the same are disclosed. The devices include a gallium and nitrogen containing substrate member, which may be semipolar or non-polar. The devices include a chip formed from the gallium and nitrogen substrate member. The chip has a width and a length, a dimension of less than 150 microns characterizing the width of the chip. The devices have a cavity oriented substantially parallel to the length of the chip.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: January 4, 2022
    Assignee: KYOCERA SLD Laser, Inc.
    Inventors: James W. Raring, Hua Huang
  • Patent number: 11215528
    Abstract: In some examples, multiple front-end device based high speed OTDR acquisition may include measuring, in parallel, light transmission with respect to specified optical fibers of a plurality of optical fibers by utilizing a plurality of analog and optic front-end devices. A front-end interface may be operatively connected to the plurality of analog and optic front-end devices. The front-end interface may convert analog signals received from the specified analog and optic front-end devices to digital signals. A measurement controller may be operatively connected to the front-end interface to control operation of the plurality of analog and optic front-end devices, and analyze, based on the digital signals, a property of the specified optical fibers.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: January 4, 2022
    Assignee: VIAVI SOLUTIONS FRANCE SAS
    Inventor: Andre Champavere
  • Patent number: 11152550
    Abstract: An object of the present invention is to suppress the occurrence of a short circuit in a light-emitting device. A light-emitting device 1 includes a conductive member 11, a holding member 20 holding the conductive member 11, at least a part of the conductive member 11 being inserted in the holding member 20, a light-emitting element 30 connected to the conductive member 11, and a cover member 40 covering the holding member 20. The conductive member 11 has exposed portions 16 exposed to the outside from the holding member 20. The cover member 40 covers all the exposed portions 16 and has a lens portion 41 disposed at a position facing the light-emitting element 30.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: October 19, 2021
    Assignee: TS TECH CO., LTD.
    Inventors: Takayoshi Ito, Kazumasa Narita
  • Patent number: 11133644
    Abstract: Semiconductor laser device (1) includes lower electrode block (10) that has a first terminal hole and first and second connection holes, upper electrode block (60) that has third connection holes communicating with the respective first connection holes and a second terminal hole, heat sink (110) that has fourth connection holes communicating with the respective second connection holes, and optical component (100) attached to upper electrode block (60). The first and the second connection holes are formed on both side of a recess that is formed to house a submount on which a semiconductor laser element is disposed. Lower electrode block (10) is disposed on heat sink (110). Lower electrode block (10) and upper electrode block (60) are fastened together with first fasteners (90, 90), whereas lower electrode block (10) and heat sink (110) are fastened together with second fasteners (91, 91).
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: September 28, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kouji Oomori, Teruaki Kasai
  • Patent number: 11133642
    Abstract: A packaged electronic device structure includes a substrate having a major surface. A semiconductor device is connected to the major surface of the substrate, the semiconductor device having a first major surface, a second major surface opposite to the first major surface, and a side surface extending between the first major surface and the second major surface. A package body encapsulates a portion of the semiconductor device, wherein the side surface of the semiconductor device is exposed through a side surface of the package body. In some examples, the side surface of the semiconductor device is an active surface. In some examples, the package body comprises a molded structure that contacts and overlaps the first major surface of the semiconductor device.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: September 28, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ramakanth Alapati, Darrell Paul Baker, Anthony B. Taguinod
  • Patent number: 11128101
    Abstract: A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: September 21, 2021
    Assignee: SCHOTT AG
    Inventors: Robert Hettler, Artit Aowudomsuk, Kenneth Tan, Karsten Droegemueller
  • Patent number: 11128105
    Abstract: In a semiconductor laser device, a semiconductor layer includes a first groove formed on both sides of a ridge, a pair of second recesses facing each other and between which the ridge is interposed on a side of a light emitting surface, and a pair of third grooves in parallel to the first groove from the light emitting surface and interposing the ridge therebetween.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: September 21, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Teruyoshi Takakura, Yoshimi Tanimoto, Yoshihiko Tani, Yuhzoh Tsuda
  • Patent number: 11095085
    Abstract: The present disclosure relates to a laser system. The laser system may have at least non-flat gain media disc. At least one pump source may be configured to generate a beam that pumps the non-flat gain media disc. A laser cavity may be formed by the pump source and the non-flat gain media disc. An output coupler may be included for receiving and directing the output beam toward an external component.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: August 17, 2021
    Assignees: Lawrence Livermore National Security, LLC, The Government of the United States as represented by the Secretary of the Navy
    Inventors: Jay W. Dawson, Ronald Lacomb
  • Patent number: 11070025
    Abstract: A semiconductor radiation source includes at least one semiconductor chip that generates radiation; a controller with one or more switching elements configured for pulsed operation of the semiconductor chip; and at least one capacitor body, wherein the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the controller electrically connects to a side of the semiconductor chip opposite the capacitor body, and the controller, the capacitor body and the semiconductor chip are stacked on top of each other so that the capacitor body is located between the control unit and the semiconductor chip.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: July 20, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Andreas Wojcik, Hubert Halbritter, Josip Maric
  • Patent number: 11052435
    Abstract: A way of using narrowband irradiation to de-ice or release ice from a surface is provided. The methodology can be applied to a range of different types of de-icing from windshield de-icing to aircraft wing de-icing to releasing ice from the ice tray of an ice making machine. While there are many different specific applications, the concept and methodologies taught remain similar across all of them.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: July 6, 2021
    Assignee: PRESSCO IP LLC
    Inventors: Don W. Cochran, Jonathan M. Katz, Benjamin D. Johnson, Denwood F. Ross, III
  • Patent number: 11056354
    Abstract: Described is a semiconductor substrate stack, including: a plurality of semiconductor substrates arranged in a stack in which the semiconductor substrates include opposing facing surfaces, wherein the facing surfaces of adjacent semiconductor substrates are separated by a gap, each semiconductor substrate having an edge surface at an exposed edge of the stack. A spacer is attached to one of the facing surfaces of each of the at least one of the semiconductor substrates and extends between adjacent semiconductor substrates to define the gap and mask a central portion of each respective semiconductor substrate.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: July 6, 2021
    Assignee: Lumentum Technology UK Limited
    Inventors: Ian David Juland, Douglas Ritchie, Graeme Harris
  • Patent number: 11050220
    Abstract: The present invention is directed to an ultra-compact dual quantum cascade laser assembly that nearly doubles the strength of a traditional laser in a in a single hermetically sealed micropackage. The device may comprise two quantum cascade lasers that meet at a combiner to create a single laser with a higher strength than traditional lasers. The current invention provides a path to an ultra-compact coherent beam combing arrangement that uses both dichroic beam combining and polarization beam combining techniques.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: June 29, 2021
    Assignee: PRANALYTICA, INC.
    Inventors: Rodolfo Barron-Jimenez, C. Kumar N. Patel
  • Patent number: 11041602
    Abstract: An optical system includes a plurality of lenses and a lens holding member. Each of the plurality of lenses has a cut-off face to have a shape of a partial circle formed by cutting off part of a periphery of a first circle. Cut-off faces of adjacent lenses face each other. The adjacent lenses have an interval between centers of the lenses is smaller than a diameter of the first circle. The lens holding member has an outer surface including a plurality of lens arrangement holes in which the plurality of lenses are respectively disposed. Adjacent lens arrangement holes are linked together to form a linked hole. The linked hole has a shape that represents part of a shape formed by disposing a plurality of second circles, the second circles being partially overlapped, each of the second circles having a diameter larger than a diameter of the first circle.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 22, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Kazuhiro Minami
  • Patent number: 11011885
    Abstract: A laser device that is easily assembled and can be manufactured at low cost and a light-source device using the same are provided. The laser device includes a base plate portion, a semiconductor laser element placed on the base plate portion, a lid portion provided on the base plate portion, on which the semiconductor laser element is placed, and including a top plate, and a side wall portion covering a part or all of lateral sides of a space between the base plate portion and the top plate. The top plate is integrally formed with a part or all of the side wall portion.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: May 18, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Etsuji Katayama, Atsushi Oguri, Hajime Mori
  • Patent number: 10978852
    Abstract: A light emitting device includes a package body, a light-transmissive cover, one or more semiconductor laser elements, a wavelength converting member, a wiring, electrically conductive layers, an opaque electrically insulating member, and electrodes. The light-transmissive cover is secured to the package body. The wavelength converting member is disposed above the light-transmissive cover in an optical path of the laser light emitted from the semiconductor laser element. The wiring is disposed on a light incidence surface-side of the wavelength converting member. The electrically conductive layers are electrically connected to the wiring and disposed on an upper surface of the light-transmissive cover. The electrically insulating member at least partially covers the electrically conductive layers and the light-transmissive cover.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: April 13, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Tadayuki Kitajima
  • Patent number: 10958037
    Abstract: It is provided a laser arrangement, having an electro-absorption-modulated laser, having a laser section and an electro-absorption modulator section; a current source for supplying the laser section with current; a DC voltage source that is arranged in addition to the current source and can be used to apply DC voltage to a diode structure of the electro-absorption modulator section; a driver with which an RF signal is able to be fed to the laser; and an electrical connection via which the driver is connected to the laser. The electrical connection provides a direct current connection between the driver and the laser such, and the driver is configured such, that a photocurrent that is generated in the electrode-absorption modulator section of the laser by illumination with light of the laser section at least partially flows to the driver and at least contributes to the energy supply of the driver.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: March 23, 2021
    Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FĂ–RDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Jung Han Choi, Heinz-Gunter Bach, Lei Yan
  • Patent number: 10958039
    Abstract: There is provided an optical module comprising a semiconductor laser element; and a planar lightwave circuit (PLC) in which a waveguide is formed on a substrate. A position of a light-emitting point of the semiconductor laser element is approximately aligned with a position of a core of the waveguide. In a plan view, a first line segment representing an emission surface of the semiconductor laser element and a second line segment corresponding to the first line segment and representing an incident surface of the waveguide are arranged oblique to each other, and the light-emitting point of the semiconductor laser element is disposed closer to an intersection point of an extension line of the first line segment and the second line segment or an extension line of the second line segment than a center of the first line segment.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: March 23, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Tadaaki Miyata
  • Patent number: 10951007
    Abstract: An optically pumped tunable VCSEL swept source module has a VCSEL and a pump, which produces light to pump the VSCEL, wherein the pump is geometrically isolated from the VCSEL. In different embodiments, the pump is geometrically isolated by defocusing light from the pump in front of the VCSEL, behind the VCSEL, and/or by coupling the light from the pump at an angle with respect to the VCSEL. In the last case, angle is usually less than 88 degrees. There are further strategies for attacking pump noise problems. Pump feedback can be reduced through (1) Faraday isolation and (2) geometric isolation. Single frequency pump lasers (Distributed feedback lasers (DFB), distributed Bragg reflector lasers (DBR), Fabry-Perot (FP) lasers, discrete mode lasers, volume Bragg grating (VBG) stabilized lasers can eliminate wavelength jitter and amplitude noise that accompanies mode hopping.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 16, 2021
    Assignee: EXCELITAS TECHNOLOGIES CORP.
    Inventors: Bartley C. Johnson, Walid A. Atia, Peter S. Whitney, Mark E. Kuznetsov, Edward J. Mallon
  • Patent number: 10951004
    Abstract: A light source device includes a substrate and a plurality of laser light sources. The laser light sources each include a submount mounted on the substrate, and a semiconductor laser element mounted on the submount. The laser light sources are individually and independently disposed on the substrate. The laser light sources disposed adjacent to each other and emitting light having an identical wavelength band differ from each other in thermal resistance at a region between the semiconductor laser element and the substrate.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: March 16, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Seiji Nagahara
  • Patent number: 10945337
    Abstract: A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: March 9, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takumi Ikeda, Yasuyuki Kimura, HanSu Kim, HaeRyong Ahn
  • Patent number: 10916914
    Abstract: Included are a metal block, a first sub-mount fixed to the metal block, and a second sub-mount having an upper surface and a lower surface which is fixed to the first sub-mount via a metal layer. Also included are an optical element mounted on the upper surface of the second sub-mount and a high frequency line path which is formed on the upper surface of the second sub-mount and electrically connected to the optical element so as to cause a signal such as a high-frequency signal to be input to or output from the optical element. In addition, the metal layer is electrically connected to the metal block.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: February 9, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventor: Takuro Shinada
  • Patent number: 10914905
    Abstract: A photoelectric adapter includes a power sourcing equipment (PSE) device, an optical connector connection part and an electrical connector. The electrical connector is connectable to an electrical connector connection part of an electrical device. The PSE device includes a semiconductor laser that oscillates with electric power, thereby outputting feed light. The PSE device is driven by receiving the electric power supplied from the electrical device through the electrical connector, and outputs the feed light from the optical connector connection part. Another photoelectric adapter includes a powered device, an optical connector connection part and an electrical connector. The powered device includes a photoelectric conversion element that converts feed light into electric power. The powered device receives the feed light supplied through the optical connector connection part, converts the feed light into the electric power, and outputs the electric power from the electrical connector.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: February 9, 2021
    Assignee: KYOCERA CORPORATION
    Inventor: Tomonori Sugime
  • Patent number: 10903622
    Abstract: Disclosed herein are various embodiments for stronger and more powerful high speed laser arrays. For example, an apparatus is disclosed that comprises an epitaxial material comprising a mesa structure in combination with an electrical waveguide, wherein the mesa structure comprises a plurality of laser regions within the mesa structure itself, each laser region of the mesa structure being electrically isolated within the mesa structure itself relative to the other laser regions of the mesa structure.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: January 26, 2021
    Assignee: OPTIPULSE INC.
    Inventor: John Richard Joseph
  • Patent number: 10903618
    Abstract: A fixture assembly having a base, an upper cover and a latch mechanism for testing an edge-emitting laser diode and a testing apparatus having the same are provided. The base includes a pocket, and a transmission cavity in communication with and orthogonal to the pocket. The upper cover includes a body, an abutting block and a pressing member. The abutting block having an electrical contact interface is engageable with the body for slidable movement with respect to the body. The latch mechanism is disposed on the upper cover, and may selectively connect or disconnect the upper cover to or from the base. When the latch mechanism is operated to connect the upper cover to the base, the pressing member applies a force through the abutting block on the edge-emitting laser diode received in the pocket, and the edge-emitting laser diode emits the laser for inspection through the transmission cavity.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: January 26, 2021
    Assignee: CHROMA ATE INC.
    Inventor: James E. Hopkins
  • Patent number: 10884256
    Abstract: A collimator lens to be held by a holder member, includes a lens portion including an area through which light passes, and a protruding portion protruding from the lens portion. The lens portion is formed on an outer peripheral surface of the collimator lens and includes a bonded portion to be bonded and fixed onto a bonding portion, which is formed on the holder member, through an adhesive. The protruding portion includes a plane formed on an outer peripheral surface of the protruding portion. The plane is formed at a position where a normal line to the plane intersects with the bonded portion.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: January 5, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kunihiro Niwa, Junya Azami
  • Patent number: 10884330
    Abstract: A light source apparatus according to an aspect of the present disclosure includes a substrate having a first surface, a frame, a lid with which the frame is provided, a light emitter that is accommodated in an accommodation space, a wavelength converter that is provided at the substrate, is accommodated in the accommodation space, converts first light emitted from the light emitter into second light having a wavelength different from the wavelength of the first light, and outputs the second light, and a first optical film that is provided in the light path between the light emitter and the wavelength converter, transmits one of the first light and the second light, and reflects the other one of the first light and the second light, and the light emitter emits the first light in such a way that the chief ray of the first light travels along the first surface.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: January 5, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tetsuo Shimizu, Wataru Yasumatsu
  • Patent number: 10862264
    Abstract: A light-emitting element housing member includes a substrate that is made of a ceramic and internally includes a deep-bottom-type space portion having an opening in at least one position thereof, wherein an inner wall of the space portion serves as a mounting part for a light-emitting element. A light-emitting element housing member includes a mounting part meant for mounting a light-emitting element and includes a substrate that includes a bottom base material having a rectangular shape in a planar view and a wall member provided on the bottom base material to enclose the mounting part in a U-shaped manner and have an opening in at least one portion thereof, wherein the substrate is integrally formed of a ceramic.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: December 8, 2020
    Assignee: KYOCERA Corporation
    Inventors: Youji Furukubo, Sentaro Yamamoto, Masanori Okamoto, Katsuaki Masaki, Takehiro Nishimura, Kazuya Shibata
  • Patent number: 10804675
    Abstract: Disclosed herein is a semiconductor laser device that has a higher heat dissipation property, comprising: a base; a block protruding from a first surface of the base; a laser chip being joined onto a side face rising upward from the first surface, and allowing heat generated to be transferred to the block; a cap covering the block and be fixed on the first surface; a window provided in the cap and allowing the light emitted from the laser chip to pass through; at least one lead pin penetrating the base, one end of the lead pin protruding inside the cap, and any of the lead pin being positioned at an opposite side of the block with respect to the laser chip; and a pinless region extending in a range of the base corresponding to a rear side of the block and provided with none of pins including the lead pin.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: October 13, 2020
    Assignee: USHIO DENKI KABUSHIKI KAISHA
    Inventors: Yasushi Takizawa, Masato Hagimoto, Shintaro Miyamoto
  • Patent number: 10763638
    Abstract: A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 1, 2020
    Assignee: SCHOTT AG
    Inventors: Rudolf Jungwirth, Amy Soon Li Ping, Artit Aowudomsuk, Ong Wai Li, Kenneth Tan, Karsten Droegemueller
  • Patent number: 10763640
    Abstract: Apparatus include a conductive block including a base surface and a plurality of parallel stepped surfaces opposite the base surface and defining respective mounting surfaces situated to receive respective laser diodes having respective thermal paths defining a common thermal path distance from the mounting surfaces to the base surface, and a two-phase cooling unit including a coupling surface attached to the base surface of the conductive block and wherein the two-phase cooling unit is situated to conduct heat generated through the emission of laser beams from the laser diodes along the thermal paths.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 1, 2020
    Assignee: nLIGHT, Inc.
    Inventors: Manoj Kanskar, Mark DeFranza
  • Patent number: 10734124
    Abstract: A heat pipe assembly of a nuclear apparatus includes a number of elongated heat pipes and a detection system having one or more fiber optic cable assemblies that are elongated and are wrapped in a helical fashion along an exterior surface of one or more of the heat pipes. The detection system further includes an optical signal generator that supplies to each, fiber optic assembly an optical signal and additionally includes a sensor that detects a number of reflections of the optical signal and generates an output. The output is usable by an instrumentation and control system to determine a number of temperatures along one or more of the heat tubes by detecting a temperature at each of a plurality of locations along each fiber optic cable assembly.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: August 4, 2020
    Assignee: Westinghouse Electric Company LLC
    Inventors: Jorge V. Carvajal, Thomas W. Tweedle, Raghu K. Avali, Yasir Arafat, Matthew R. Heisel, Jurie Van Wyk
  • Patent number: 10707651
    Abstract: A semiconductor laser element that includes a stripe-shaped light-emitting region and that is formed by adhering a surface of the semiconductor laser element on a side opposite to a semiconductor substrate and a submount to each other by a solder layer includes a terrace section on a surface of the semiconductor laser element that is adhered by the solder layer, the terrace section being separated from a ridge portion, which is a current-carrying portion, by a grooved portion. A top surface of a region including the grooved portion is covered by a metal. The terrace section is divided into a plurality of portions that are disposed in a scattered manner.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: July 7, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yasuo Kan, Ryuhichi Sogabe
  • Patent number: 10698303
    Abstract: A projection apparatus for producing a pixel-based illumination pattern has a laser light source for producing coherent laser light and a micromirror array with a multiplicity of mirrors. The mirrors are implemented so as to be controllable in terms of their position, for setting a brightness and/or color of a respective pixel of the pixel-based illumination pattern. The laser light source emits the laser light towards the micromirror array. A beam-shaping element splits the laser light from the laser light source into a multiplicity of partial beams and each of the partial beams is oriented toward one of the mirrors of the micromirror array.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: June 30, 2020
    Assignee: Continental Automotive GmbH
    Inventor: Stefan Holzinger
  • Patent number: 10690319
    Abstract: A light emitting device includes: a first semiconductor laser element; a second semiconductor laser element; and a light exit surface which emits light from the first semiconductor laser element and the second semiconductor laser element. The first semiconductor laser element is disposed at a position farther than the second semiconductor laser element as seen from a flat surface including a point on a surface of the light exit surface and perpendicular to a light extraction direction.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: June 23, 2020
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Kento Hayashi, Yuhki Kawamura, Masao Kamiya, Satoshi Wada, Masaaki Osawa
  • Patent number: 10686295
    Abstract: A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: June 16, 2020
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Jens Mueller, Markus Horn
  • Patent number: 10680411
    Abstract: The invention describes a laser sensor module comprising at least one Vertical Cavity Surface Emitting Laser (100) and at least one driving circuit (120). The driving circuit (120) is adapted to provide electrical energy to the Vertical Cavity Surface Emitting Laser (100) such that the Vertical Cavity Surface Emitting Laser (100) emits laser pulses (345) with a pulse length (356) of less than 100 ns and a duty cycle of less than 5% in comparison to a continuous laser emission. The driving circuit (120) is further adapted to provide additional energy to the Vertical Cavity Surface Emitting Laser (100) at least 100 ns prior to at least a part of the laser pulses (345) such that the part of the laser pulses (345) are emitted under defined optical conditions. The invention further describes a distance detection device comprising the laser sensor module and a method of driving the laser sensor module.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 9, 2020
    Assignee: TRUMPF PHOTONIC COMPONENTS GMBH
    Inventors: Holger Moench, Alexander Marc Van Der Lee, Stephan Gronenborn
  • Patent number: 10644481
    Abstract: An optical component packaging structure includes a base, a sealing cover, and a cooler. The base includes a mounting surface and a back surface that faces a direction opposite to that faced by the mounting surface. The cooler includes a cooling plate, a heat dissipation plate disposed opposite to the cooling plate, and a conductive connection body connecting the cooling plate and the heat dissipation plate. The cooling plate includes a cooling surface. The cooler is partially built in the base. The cooling plate faces a direction the same as the mounting surface. The sealing cover covers the mounting surface, and the sealing cover and the mounting surface form a sealing cavity. The cooling surface is located inside the sealing cavity. The heat dissipation plate protrudes from the back surface and is sealedly connected to the base.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: May 5, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yue Wen, Zhiguang Xu, Sulin Yang
  • Patent number: 10634926
    Abstract: A mobile terminal having a lighting device including a light emitting element, a diffractive optical element (DOE) to diffract a part of light output from the light emitting element, and a driving unit to move the diffractive optical element so as to vary a distance between the light emitting element and the diffractive optical element.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: April 28, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Changhwan Lee, Yunsup Shin, Ayoung Cho
  • Patent number: 10630038
    Abstract: This disclosure relates to laser disk mounting systems and methods. The laser disk mounting systems comprise a disk module with a round disk-shaped heat sink having a front side, a rear side, and an edge surface connecting the front side and the rear side, and a laser disk arranged on the front side of the heat sink, and a radial mounting device with an opening for receiving the disk module, wherein the disk module is mounted in the radial mounting device such that a force action is applied in radial direction on the edge surface.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: April 21, 2020
    Assignee: TRUMPF LASER GMBH
    Inventors: Sven-Silvius Schad, Alexander Killi, Vincent Kuhn, Markus Graf
  • Patent number: 10587091
    Abstract: A light emitting device includes a base; a plurality of semiconductor laser elements that are disposed on the base and that are configured to emit light laterally from the plurality of semiconductor laser elements; a reflecting member that is disposed on the base and configured to reflect light from the plurality of semiconductor laser elements; a surrounding part that is disposed on the base and that surrounds the plurality of semiconductor laser elements and the reflecting member; a wiring part that is disposed on the base so as to extend to a location outside of the surrounding part, the wiring part being electrically connected to the plurality of semiconductor laser elements; a radiating body disposed on the surrounding part, the radiating body comprising at least one of a metal and a ceramic, and the radiating body having an opening; and a wavelength converting member that is located in the opening of the radiating body, the wavelength converting member being configured to convert a wavelength of light t
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: March 10, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Kazuma Kozuru, Shinichi Nagahama
  • Patent number: 10587097
    Abstract: Method and devices for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, are provided. The laser devices include multiple laser emitters integrated onto a substrate (in a module), which emit green or blue laser radiation.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: March 10, 2020
    Assignee: Soraa Laser Diode, Inc.
    Inventors: James W. Raring, Paul Rudy, Chendong Bai