Heat Sink Patents (Class 372/36)
  • Patent number: 11914139
    Abstract: A scanning optical apparatus includes a first light source unit, a second light source unit, a rotary polygon mirror and a casing provided with a bottom surface on which said deflection unit is disposed. The second light source unit is disposed at a position away from the bottom surface more than the first light source unit with respect to a rotational axis direction of the rotary polygon mirror. The casing is provided with first and second supporting surfaces for supporting the first and second light source. Both the first and second supporting surfaces are faced in a direction away from the bottom surface.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: February 27, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventor: Wataru Sato
  • Patent number: 11888286
    Abstract: A laser chip for flip-chip bonding on a silicon photonics chip with passive alignment features. The laser chip includes a chip body made of a p-region and a n-region in vertical direction and extended from a front facet to a rear facet in longitudinal direction, a pair of first vertical stoppers formed respectively beyond two sides of the chip body based on a wider width of the n-region, an active region buried in the chip body between the p-region and the n-region in the vertical direction and extended from the front facet to the rear facet in the longitudinal direction, an alignment mark formed on a top surface of the p-region near the front facet with a lateral distance defined in sub-micron precision relative to the active region; and a thin metal film on the surface of the p-region having a cleaved edge shared with the front facet.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: January 30, 2024
    Assignee: MARVELL ASIA PTE LTD
    Inventors: Xiaoguang He, Radhakrishnan L. Nagarajan
  • Patent number: 11859950
    Abstract: A non-lethal dazzling device includes a laser operable in the visible spectrum. The laser can be a relatively low-powered laser, such as a laser having a maximum output power of 2.5 mW, or it can be a higher-powered laser with a drive circuit that lowers the maximum output power to a safe level based on the range of the hostile target from the laser. In certain embodiments, the disclosed non-lethal dazzling device can be coupled to the bridge of a binocular device.
    Type: Grant
    Filed: September 4, 2022
    Date of Patent: January 2, 2024
    Inventor: Daniel Poplawski
  • Patent number: 11843220
    Abstract: A light emitting device includes: a first semiconductor laser element; a base portion including: a bottom portion including a first upper surface on which the first semiconductor laser element is disposed, and a frame portion surrounding the first semiconductor laser element, the frame portion including a second upper surface positioned above the first upper surface and a support portion positioned between the first upper surface and the second upper surface, the a support portion having a support area; a light reflecting member having a flat plate-shaped and contacting the support area, the light reflecting member being configured to reflect light from the first semiconductor laser element; and a lid portion bonded to the second upper surface.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: December 12, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Masatoshi Nakagaki, Kazuma Kozuru
  • Patent number: 11824323
    Abstract: The disclosed diode laser packages include a carrier having an optics-mounting surface to which first and second sets of collimating and turning optics are mounted. The carrier includes a heatsink receptacle medially located between the first and second sets. A cooling plenum has a diode-mounting surface and includes heatsink material disposed in the heatsink receptacle. The cooling plenum further has an inlet, an outlet, and a coolant passageway defined between the inlet and the outlet. The coolant passageway is sized to receive the heatsink material disposed in heatsink receptacle. Multiple semiconductor laser diode devices are each mounted atop the diode-mounting surface and positioned for bidirectional emission toward the first and second sets of collimating and turning optics. The multiple semiconductor laser diode devices are thermally coupled to the heatsink material through which coolant is deliverable by the coolant passageway.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: November 21, 2023
    Assignee: nLIGHT, Inc.
    Inventor: Manoj Kanskar
  • Patent number: 11824324
    Abstract: A diode laser arrangement has a diode laser device and at least one cooling device. The at least one cooling device is arranged on the diode laser device. The at least one cooling device is configured to cool the diode laser device. The at least one cooling device has a contact body and at least one heat conducting insert. The contact body contains a first material or consisting of a first material, and the at least one heat conducting insert has a second material, which is different from the first material, or consisting of a second material, which is different from the first material, and the contact body is arranged on the diode laser device. The at least one heat conducting insert is embedded in the contact body.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: November 21, 2023
    Assignee: TRUMPF Photonics, Inc.
    Inventors: Stephan Strohmaier, Arne-Heike Meissner-Schenk, Gerald Urban, Gerd Hansen, Christian Carstens
  • Patent number: 11811193
    Abstract: A pyrolytic graphite (PG) substrate and laser diode package includes a substrate body having a PG crystalline structure with a basal plane oriented at a pre-determined orientation angle as measured from a longitudinal axis of a heat generating material, such as a laser diode, mounted on a surface of the PG substrate, so that a coefficient of thermal expansion (CTE) of the PG substrate is substantially matched with a CTE of the material.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: November 7, 2023
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Susant Patra, Robert J. Deri, John W. Elmer
  • Patent number: 11789221
    Abstract: An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: October 17, 2023
    Assignee: Aeva, Inc.
    Inventors: Zhizhong Tang, Wenjing Liang, Kevin Kinichi Masuda, Pradeep Srinivasan
  • Patent number: 11791605
    Abstract: A diode laser arrangement for the cooling of and supply of electrical current to diode laser devices, having at least two stacks, each having a diode laser device which is configured to emit a laser beam, an upper cooling device, and a lower cooling device. The diode laser device is arranged on the upper cooling device and on the lower cooling device such that the diode laser device is arranged between the upper cooling device and the lower cooling device. The upper and lower cooling devices are in each case electrically connected to the diode laser device arranged therebetween. The upper cooling device and/or the lower cooling device of a stack are in each case formed as a microchannel cooler. The upper cooling device and/or the lower cooling device of a stack in each case have substantially no electrical insulation with respect to the diode laser device arranged therebetween.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: October 17, 2023
    Assignee: TRUMPF Photonics, Inc
    Inventors: Christoph Tillkorn, Stephan Strohmaier, Steffen Ried
  • Patent number: 11769862
    Abstract: A light emitting device includes: a first substrate including: a first lead, and a second lead positioned apart from the first lead; a second substrate disposed on an upper face of the second lead, the second substrate including: a base, and a first conducting part disposed on an upper face of the base; a light emitting element disposed on the second substrate and electrically connected to the first conducting part; a first wire electrically connecting the first lead and the first conducting part; and a wall part straddling and covering an upper face of the first lead and an upper face of the second lead. A height of the wall part is less than a height of the second substrate.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: September 26, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Dai Wakamatsu, Kimihiro Miyamoto, Kensuke Yamaoka, Yoshiyuki Ide
  • Patent number: 11769843
    Abstract: A photonic module and a method of making same, the module having one or more optoelectronic chips, such as a laser diode typically having six sides, with each optoelectronic chip having two opposing sides (a first side and a second side) abutting and electrically connected to metal regions (preferably electro-formed), the two metal regions are physically distinct and electrically separate from each other, the two electro-formed metal regions serving, in use, as heat spreaders for conducting heat away from the optoelectronic chip.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: September 26, 2023
    Assignee: HRL LABORATORIES, LLC
    Inventors: Daniel Yap, Florian G. Herrault, Christopher S. Roper, Partia Naghibi
  • Patent number: 11740419
    Abstract: Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 29, 2023
    Assignee: CIG PHOTONICS JAPAN LIMITED
    Inventors: Daisuke Noguchi, Hiroshi Yamamoto
  • Patent number: 11736197
    Abstract: An optical module includes: an optical semiconductor device in which a semiconductor laser and an optical modulator are integrated; a bypass capacitor including a lower electrode and an upper electrode, the bypass capacitor being connected in parallel to the semiconductor laser; a dielectric substrate having an upper surface and a lower surface, the optical semiconductor device and the bypass capacitor being surface-mounted on the upper surface, the dielectric substrate having a conductor pattern on the upper surface, the cathode electrode and the lower electrode being bonded to the conductor pattern; and a conductor block supporting the lower surface of the dielectric substrate. The lower electrode of the bypass capacitor having an overlap area overlapping with the upper surface of the dielectric substrate, the lower electrode of the bypass capacitor having an overhang area overhanging from the upper surface of the dielectric substrate.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: August 22, 2023
    Assignee: CIG PHOTONICS JAPAN LIMITED
    Inventors: Daisuke Noguchi, Hiroshi Yamamoto
  • Patent number: 11735703
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: August 22, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Naoki Takojima, Kairi Makita, Fumio Ueno
  • Patent number: 11710943
    Abstract: A light emitting device includes a base, a lid portion, a plurality of semiconductor laser elements, and a collimate lens. The lid portion is fixed to the base to define a hermetically sealed space by the lid portion and the base. The semiconductor laser elements are provided in the hermetically sealed space. The collimate lens has a non-lens portion fixed to the lid portion, and a plurality of lens portions connected and aligned along one direction and surrounded by the non-lens portion when viewed from a light extracting surface side of the collimate lens.
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: July 25, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Soichiro Miura, Kazuma Kozuru
  • Patent number: 11699890
    Abstract: A semiconductor laser machine includes a semiconductor laser element including a first end face that emits a laser beam and a second end face that is opposite the first end face; a heat sink; and a sub-mount securing the semiconductor laser element to the heat sink. The sub-mount includes a substrate that serves as a thermal stress reliever, a solder layer joined to the semiconductor laser element, and a junction layer formed between the substrate and the solder layer. Compared with the semiconductor laser element, the substrate is extended in a rearward direction that is from the first end face toward the second end face. As for the solder layer and the junction layer, a portion of at least the solder layer is removed behind the second end face.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: July 11, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tomohiro Kyoto, Daisuke Morita, Kimio Shigihara, Keisuke Furuta
  • Patent number: 11688710
    Abstract: An electronic device is provided. The electronic device includes: a substrate, a first light-emitting element, and a second light-emitting element. The first light-emitting element is disposed on the substrate and configured to emit a first color light under a first current density when the substrate provides a first current to the first light-emitting element. The second light-emitting element is disposed on the substrate and configured to emit a second color light under a second current density when the substrate provides a second current to the second light-emitting element. The first current is equal to the second current, and the first current density is different from the second current density.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: June 27, 2023
    Assignee: INNOLUX CORPORATION
    Inventors: Tzu-Min Yan, Tsau-Hua Hsieh
  • Patent number: 11686559
    Abstract: A laser weapon system is described. Particularly, embodiments describe subsystems of a laser weapon system including those necessary for laser generation, operational control, optical emission, and heat dissipation configured to provide a lightweight unit of reduced dimensions.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: June 27, 2023
    Assignee: Applied Research Associates, Inc.
    Inventors: Joseph Nolan Paranto, Christopher Scott Church
  • Patent number: 11679943
    Abstract: An apparatus for stacking and coating of very short cavity laser diode arrays. The apparatus includes an array holder fixture to securely hold the very short cavity laser diode arrays and spacer arrays, and a stacking plate. The array holder fixture including a top-side presser to secure a stack of very short cavity laser arrays and spacer arrays from a first end of the stack, a bottom-side presser to secure the stack of very short cavity laser arrays and spacer arrays from a second end of the stack, and a pair of side clamps. The array holder fixture is operatively coupled to the stacking plate during the stacking of the very short cavity laser diode arrays and spacer arrays.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: June 20, 2023
    Assignee: Modulight Corporation
    Inventors: Lasse Orsila, Antti Saarela
  • Patent number: 11602902
    Abstract: A method and system for a three dimensional printing system are described herein. In one example, the three dimensional printing system has a moveable carriage, an array of laser modules and a print controller. In this example, the moveable carriage has a print head arranged to selectively deposit a printing agent on to a layer of build material as the moveable carriage is moved relative to the layer of build material. The printing agent controls localized fusing of the build material on application of energy. The print controller is communicatively coupled to the array of laser modules and controls activation of individual laser modules of the array of laser modules so as to apply, selectively, energy to addressable sub-regions of the layer of build material on which printing agent has been deposited to control fusing together with the deposited printing agent.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 14, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Xavier Soler Pedemonte, Esteve Comas Cespedes, Juan Ramos Campos
  • Patent number: 11588299
    Abstract: Methods for fabricating vertical cavity surface emitting lasers (VCSELs) on a large wafer are provided. An un-patterned epi layer form is bonded onto a first reflector form. The first reflector form includes a first reflector layer and a wafer of a first substrate type. The un-patterned epi layer form includes a plurality of un-patterned layers on a wafer of a second substrate type. The first and second substrate types have different thermal expansion coefficients. A resulting bonded blank is substantially non-varying in a plane that is normal to an intended emission direction of the VCSEL. A first regrowth is performed to form first regrowth layers, some of which are patterned to form a tunnel junction pattern. A second regrowth is performed to form second regrowth layers. A second reflector form is bonded onto the second regrowth layers, wherein the second reflector form includes a second reflector layer.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: February 21, 2023
    Assignee: Mellanox Technologies, Ltd.
    Inventors: Vladimir Iakovlev, Yuri Berk, Elad Mentovich, Tamir Sharkaz
  • Patent number: 11557879
    Abstract: Disclosed herein are various embodiments for stronger and more powerful high speed laser arrays. For example, an apparatus is disclosed that comprises an active mesa structure in combination with an electrical waveguide, wherein the active mesa structure comprises a plurality of laser regions within the active mesa structure itself, each laser region of the active mesa structure being electrically isolated within the active mesa structure itself relative to the other laser regions of the active mesa structure.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: January 17, 2023
    Assignee: OptiPulse Inc.
    Inventor: John Richard Joseph
  • Patent number: 11552446
    Abstract: A cooling device (1) for cooling an electrical component (4), in particular a laser diode, including a base body (2) with at least one outer face (20) and at least one integrated cooling channel (5), in particular a micro-cooling channel, a connecting surface (21) on the outer face (20) of the base body (2) for connecting the electrical component (4) to the base body (2) and a first stabilising layer (11), wherein the first stabilising layer (11) and the connecting surface (21) are arranged at least partially one above the other along a primary direction (P), and wherein the first stabilising layer (11) is offset relative to the outer face (20) towards the interior of the base body (2) by a distance (A) along a direction parallel to the primary direction (P).
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: January 10, 2023
    Assignee: ROGERS GERMANY GMBH
    Inventors: Nico Kuhn, Manfred Götz, Andreas Meyer, Vitalij Gil, Johannes Wiesend
  • Patent number: 11543495
    Abstract: Systems and methods described herein relate to LIDAR systems and their operation. An example method includes partitioning a plurality of light-emitter devices into a plurality of groups. Each light-emitter device is associated with a given group of the plurality of groups. The method also includes selecting a group from the plurality of groups according to a predetermined group order and selecting one or more light-emitter devices from the plurality of light-emitter devices of the selected group according to a firing order. The method yet further includes, at a predetermined shot dither time, causing the selected light-emitter device to emit at least one light pulse. The predetermined shot dither time is based on a shot dither schedule. The method may additionally include repeating the method to provide a complete scan in which each light-emitter device of the plurality of light-emitter devices has emitted at least one light pulse.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: January 3, 2023
    Assignee: Waymo LLC
    Inventor: Mark Alexander Shand
  • Patent number: 11515689
    Abstract: A semiconductor laser module includes: an optical fiber that outputs a first laser beam to an exterior of the semiconductor laser module; semiconductor laser devices each including an emission portion that emits a second laser beam, an electrically conductive portion that supplies electric power to the emission portion, and a mount on which the emission portion and the electrically conductive portion are disposed; a mount base including mount surfaces that form steps; and an optical system that optically couples the second laser beams from the emission portions to an incident end face of the optical fiber. The mounts of the semiconductor laser devices are disposed on the mount surfaces. The semiconductor laser devices include an upper semiconductor laser device and a lower semiconductor laser device adjacent to each other in a step direction of the mount base.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: November 29, 2022
    Assignee: Fujikura Ltd.
    Inventors: Ken Katagiri, Yohei Kasai
  • Patent number: 11482835
    Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: October 25, 2022
    Assignee: Lumentum Operations LLC
    Inventors: Richard F. Carson, Nein-Yi Li, Mial E. Warren, Thomas Fanning, Gianluca Bacchin
  • Patent number: 11476640
    Abstract: An adapter element (10) for connecting a component (4), such as a laser diode, to a heat sink (7), comprising: a first metal layer (11), which in a mounted state faces the component (4), and a second metal layer (12), which in the mounted state faces the heat sink (7), and an intermediate layer (13) comprising ceramic arranged between the first metal layer (11) and the second metal layer (12), wherein the first metal layer (11) and/or the second metal layer (12) is thicker than 40 ?m, preferably thicker than 70 ?m and more preferably thicker than 100 ?m.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: October 18, 2022
    Assignee: ROGERS GERMANY GMBH
    Inventors: Johannes Wiesend, Heiko Schweiger
  • Patent number: 11466965
    Abstract: A non-lethal dazzling device includes a laser operable in the visible spectrum. The laser can be a relatively low-powered laser, such as a laser having a maximum output power of 2.5 mW, or it can be a higher-powered laser with a drive circuit that lowers the maximum output power to a safe level based on the range of the hostile target from the laser. In certain embodiments, the disclosed non-lethal dazzling device can be coupled to the bridge of a binocular device.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: October 11, 2022
    Inventor: Daniel Poplawski
  • Patent number: 11460647
    Abstract: A chip packaging structure that includes an optoelectronic (OE) chip mounted on a first surface of a substrate and whose optically active area is directed laterally; and a lens array for the optoelectronic (OE) chip that is mounted on the first surface of the substrate and faces to the optoelectronic (OE) chip, wherein the lens array has inside a reflector reflecting light from a first direction to a second direction, in which the first direction is substantially perpendicular to the second direction.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: October 4, 2022
    Assignee: International Business Machines Corporation
    Inventors: Jean Benoit Heroux, Masao Tokunari
  • Patent number: 11462887
    Abstract: A laser element includes a light emitting portion that has at least two or more light emitting points, and a terminal member on which the light emitting portion is mounted. The terminal member includes a base portion that has a mounting surface on which the light emitting portion is mounted, a base that has a front surface where the base portion is provided substantially at a center, and four pins that extend from a rear surface of the base. The light emitting portion is positioned in a range surrounded by the four pins as viewed from the front surface of the base.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: October 4, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Masaya Ishida, Takuya Nishida
  • Patent number: 11411374
    Abstract: A Vertical Cavity Surface Emitting Laser (VCSEL) has a mesa having an active region, which has m active layer structures (with m?2). The active layer structures are electrically connected to each other by a tunnel junction therebetween. The mesa has an optical resonator, which has first and second DBRs. The active region is between the first and second DBRs. The VCSEL has first and second electrical contacts, which provide electrical current to the active region, and an electrical control contact, which controls gain-switched laser emission of the VCSEL by at least 1 up to m?1 active layer structures by a current between the electrical control contact and the first or second electrical contact. A current aperture is between the active region and the first or second electrode. A distance between the current aperture and a furthest active layer structure is at least three times the laser light's wavelength.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: August 9, 2022
    Assignee: TRUMPF PHOTONIC COMPONENTS GMBH
    Inventor: Ulrich Weichmann
  • Patent number: 11387391
    Abstract: A conversion element, an optoelectronic component, an arrangement and a method for producing a conversion element are disclosed. In an embodiment an arrangement includes a conversion element having a wavelength converting conversion material, a matrix material in which the conversion material is embedded and a substrate on which the matrix material with the embedded conversion material is directly arranged, wherein at least one condensed sol-gel material, and a laser source configured to emit primary radiation during operation, wherein the conversion element is arranged in a beam path of the laser source, wherein the conversion element is mechanically immovably mounted with respect to the laser source, and wherein the primary radiation of the laser source is dynamically arranged to the conversion element.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: July 12, 2022
    Assignee: OSRAM GMBH
    Inventors: Angela Eberhardt, Florian Peskoller, Jörg Frischeisen, Thomas Huckenbeck, Michael Schmidberger, Jürgen Bauer, Dennis Sprenger, Jürgen Hager, Maximilian Vogl, Oliver Woisetschläger, Vera Stöppelkamp
  • Patent number: 11385422
    Abstract: An optical semiconductor device comprises: a first wiring pattern provided on a carrier mounting surface of a dielectric substrate; a first reference potential pattern surrounding the first wiring pattern; a carrier block provided on the carrier mounting surface and having a main surface, a side surface, and a second wiring pattern and a second reference potential pattern constituting coplanar lines; and an optical semiconductor element provided on the main surface. One end portion of the second wiring pattern extends to at least an end edge on the side surface side in the main surface and is conductively joined to the first wiring pattern with a conductive joining material therebetween. One end portion of the second reference potential pattern extends to at least the end edge on the side surface side in the main surface and is conductively joined to the first reference potential pattern with a conductive joining material therebetween.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: July 12, 2022
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tomoya Saeki, Yasushi Fujimura, Taichi Misawa
  • Patent number: 11367992
    Abstract: A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: June 21, 2022
    Assignee: SCHOTT AG
    Inventors: Robert Hettler, Michelle Fang
  • Patent number: 11340290
    Abstract: A testing device may include a stage associated with holding an emitter wafer during testing of an emitter. The stage may be arranged such that light emitted by the emitter passes through the stage. The testing device may include a heat sink arranged such that the light emitted by the emitter during the testing is emitted in a direction away from the heat sink, and such that a first surface of the heat sink is near a surface of the emitter wafer during the testing but does not contact the surface of the emitter wafer. The testing device may include a probe card, associated with performing the testing of the emitter, that is arranged over a second surface of the heat sink such that, during the testing of the emitter, a probe of the probe card contacts a probe pad for the emitter through an opening in the heat sink.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: May 24, 2022
    Assignee: Lumentum Operations LLC
    Inventor: Eric R. Hegblom
  • Patent number: 11309466
    Abstract: A light emitting unit includes a reflective structure, a light transmitting body and a light emitting chip. The reflective structure has a recess formed by inner side surfaces thereof, and the reflective structure includes a side opening and a bottom opening corresponding to the recess. The side opening and the bottom opening are adjacent to each other, and the inner side surfaces are defined as a top surface and a surrounding side surface. The light transmitting body is disposed within the recess and doped with fluorescent powder. The light transmitting body includes a light emitting surface and an electrode exposing surface. The light emitting surface is corresponding to the side opening; and the electrode exposing surface is corresponding to the bottom opening. The light emitting chip is partially disposed within the light transmitting body and has a bottom, a top light emitting and side light emitting surfaces.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: April 19, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yu-Yu Chang, Chih-Yuan Chen, Yung-Chang Jen
  • Patent number: 11309683
    Abstract: A laser module includes: a laser device that emits a laser beam including a major polarization component and a minor polarization component; a beam splitter that splits the laser beam into the major polarization component and the minor polarization component and that directs the major polarization component and the minor polarization component in different directions; an optical fiber that is optically coupled to the major polarization component split by the beam splitter and externally outputs the major polarization component; a package housing that houses the laser device and that has an inner surface including a minor polarization component irradiation portion that is irradiated by the minor polarization component split by the beam splitter; and a temperature measurement element that is attached to the package housing and that detects a temperature change of the minor polarization component irradiation portion.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: April 19, 2022
    Assignee: Fujikura Ltd.
    Inventor: Yohei Kasai
  • Patent number: 11289536
    Abstract: A display apparatus including a thin film transistor (TFT) substrate, a first LED sub-unit disposed on the TFT substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed between the TFT substrate and the first LED sub-unit, and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit are configured to be independently driven, light generated from the first LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the second LED sub-unit and the third LED sub-unit, and light generated from the second LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the third LED sub-unit.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: March 29, 2022
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jong Hyeon Chae, Seong Gyu Jang, Ho Joon Lee, Chang Yeon Kim, Chung Hoon Lee
  • Patent number: 11258234
    Abstract: A miniature illuminator is described which is suitable for assembly into mobile electronics devices such as cell phones and computer tablets. Features of the invention overcome the complexity of current miniature illuminators by using single molded structure which includes all the electrical feedthrough connections and has the features necessary for accurate mounting of optical components. The molded structure includes laser safety connections which provide an electrical interrupt signal when the illuminator is damaged in a way that could result in propagation of non-eye safe illuminator beams. In an alternate operation the illuminator provides a signal when a subject gets too close to the illuminator and would receive unsafe VCSEL illuminator beam. The laser safety feature is integrated into the molded Illuminator package so that separate electrically connected structures to achieve this function are eliminated.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: February 22, 2022
    Assignee: Princeton Optronics, Inc.
    Inventors: Tong Chen, Qing Wang
  • Patent number: 11244982
    Abstract: A display apparatus including a thin film transistor (TFT) substrate, a first LED sub-unit disposed on the TFT substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed between the TFT substrate and the first LED sub-unit, and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit are configured to be independently driven, light generated from the first LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the second LED sub-unit and the third LED sub-unit, and light generated from the second LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the third LED sub-unit.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: February 8, 2022
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jong Hyeon Chae, Seong Gyu Jang, Ho Joon Lee, Chang Yeon Kim, Chung Hoon Lee
  • Patent number: 11239386
    Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: February 1, 2022
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Karl Weidner, Ralph Wirth, Axel Kaltenbacher, Walter Wegleiter, Bernd Barchmann, Oliver Wutz, Jan Marfeld
  • Patent number: 11233370
    Abstract: A device for generating laser radiation includes a resonator, an optical assembly, and an adjustment device is provided. The optical assembly includes a movably arranged support element on which optical components are arranged, wherein an optical component is a device for deflecting laser radiation. The device for deflecting laser radiation of the optical assembly is arranged in the beam path of laser radiation generated by the resonator. The adjustment device changes the position of the optical assembly from a first position to another position relative to the resonator, wherein the position of the beam path of laser radiation emanating from the optical assembly in the first position remains unchanged by the adjustment of the optical assembly to the other position relative to the resonator. A corresponding method is also provided.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: January 25, 2022
    Assignee: COMPACT LASER SOLUTIONS GMBH
    Inventor: Andreas Kuntze
  • Patent number: 11215528
    Abstract: In some examples, multiple front-end device based high speed OTDR acquisition may include measuring, in parallel, light transmission with respect to specified optical fibers of a plurality of optical fibers by utilizing a plurality of analog and optic front-end devices. A front-end interface may be operatively connected to the plurality of analog and optic front-end devices. The front-end interface may convert analog signals received from the specified analog and optic front-end devices to digital signals. A measurement controller may be operatively connected to the front-end interface to control operation of the plurality of analog and optic front-end devices, and analyze, based on the digital signals, a property of the specified optical fibers.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: January 4, 2022
    Assignee: VIAVI SOLUTIONS FRANCE SAS
    Inventor: Andre Champavere
  • Patent number: 11217966
    Abstract: Gallium and nitrogen containing optical devices operable as laser diodes and methods of forming the same are disclosed. The devices include a gallium and nitrogen containing substrate member, which may be semipolar or non-polar. The devices include a chip formed from the gallium and nitrogen substrate member. The chip has a width and a length, a dimension of less than 150 microns characterizing the width of the chip. The devices have a cavity oriented substantially parallel to the length of the chip.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: January 4, 2022
    Assignee: KYOCERA SLD Laser, Inc.
    Inventors: James W. Raring, Hua Huang
  • Patent number: 11152550
    Abstract: An object of the present invention is to suppress the occurrence of a short circuit in a light-emitting device. A light-emitting device 1 includes a conductive member 11, a holding member 20 holding the conductive member 11, at least a part of the conductive member 11 being inserted in the holding member 20, a light-emitting element 30 connected to the conductive member 11, and a cover member 40 covering the holding member 20. The conductive member 11 has exposed portions 16 exposed to the outside from the holding member 20. The cover member 40 covers all the exposed portions 16 and has a lens portion 41 disposed at a position facing the light-emitting element 30.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: October 19, 2021
    Assignee: TS TECH CO., LTD.
    Inventors: Takayoshi Ito, Kazumasa Narita
  • Patent number: 11133642
    Abstract: A packaged electronic device structure includes a substrate having a major surface. A semiconductor device is connected to the major surface of the substrate, the semiconductor device having a first major surface, a second major surface opposite to the first major surface, and a side surface extending between the first major surface and the second major surface. A package body encapsulates a portion of the semiconductor device, wherein the side surface of the semiconductor device is exposed through a side surface of the package body. In some examples, the side surface of the semiconductor device is an active surface. In some examples, the package body comprises a molded structure that contacts and overlaps the first major surface of the semiconductor device.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: September 28, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ramakanth Alapati, Darrell Paul Baker, Anthony B. Taguinod
  • Patent number: 11133644
    Abstract: Semiconductor laser device (1) includes lower electrode block (10) that has a first terminal hole and first and second connection holes, upper electrode block (60) that has third connection holes communicating with the respective first connection holes and a second terminal hole, heat sink (110) that has fourth connection holes communicating with the respective second connection holes, and optical component (100) attached to upper electrode block (60). The first and the second connection holes are formed on both side of a recess that is formed to house a submount on which a semiconductor laser element is disposed. Lower electrode block (10) is disposed on heat sink (110). Lower electrode block (10) and upper electrode block (60) are fastened together with first fasteners (90, 90), whereas lower electrode block (10) and heat sink (110) are fastened together with second fasteners (91, 91).
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: September 28, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kouji Oomori, Teruaki Kasai
  • Patent number: 11128101
    Abstract: A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: September 21, 2021
    Assignee: SCHOTT AG
    Inventors: Robert Hettler, Artit Aowudomsuk, Kenneth Tan, Karsten Droegemueller
  • Patent number: 11128105
    Abstract: In a semiconductor laser device, a semiconductor layer includes a first groove formed on both sides of a ridge, a pair of second recesses facing each other and between which the ridge is interposed on a side of a light emitting surface, and a pair of third grooves in parallel to the first groove from the light emitting surface and interposing the ridge therebetween.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: September 21, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Teruyoshi Takakura, Yoshimi Tanimoto, Yoshihiko Tani, Yuhzoh Tsuda
  • Patent number: 11095085
    Abstract: The present disclosure relates to a laser system. The laser system may have at least non-flat gain media disc. At least one pump source may be configured to generate a beam that pumps the non-flat gain media disc. A laser cavity may be formed by the pump source and the non-flat gain media disc. An output coupler may be included for receiving and directing the output beam toward an external component.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: August 17, 2021
    Assignees: Lawrence Livermore National Security, LLC, The Government of the United States as represented by the Secretary of the Navy
    Inventors: Jay W. Dawson, Ronald Lacomb