Abstract: An airflow velocity measuring apparatus that includes a fixed-temperature heat generating device. The fixed-temperature heat generating device includes a power supply, a positive-temperature-coefficient thermistor element, a switching element, a comparator element, a first negative-temperature-coefficient thermistor element, a second negative-temperature-coefficient thermistor element, and plural resistor elements. The positive-temperature-coefficient thermistor element is disposed at a measuring point at which the velocity of airflow is measured. The switching element is repeatedly turned ON and OFF so as to cause the positive-temperature-coefficient thermistor element to generate heat at a preset temperature, thereby applying a pulse voltage from the power supply to the positive-temperature-coefficient thermistor element. The airflow velocity measuring apparatus measures the velocity of airflow at the measuring point based on the waveform of this pulse voltage.

Abstract: A semiconductor device includes a burst signal generation unit arranged to generate a burst signal so as to supply the burst signal to a transmission unit that drives a piezoelectric element, a signal processing unit arranged to process a received signal received by the piezoelectric element or another piezoelectric element, and a resetting unit arranged to forcibly reset a filter in the signal processing unit.

Abstract: An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.

Abstract: A plasma processing apparatus and a temperature measuring method that may measure a temperature of an object in a processing chamber by a low-coherence interferometer without forming a hole in a holding stage or an upper electrode of the plasma processing apparatus, thereby performing a plasma process of a substrate with high precision and uniformity. The plasma processing apparatus is implemented by disposing a light source collimator outside of a light source window, disposing a light-receiving collimator outside of a light-receiving window, allowing a measurement light emitted from the light source collimator to pass through the light source window to be obliquely emitted to a surface of the object to be measured, and allowing the reflected measurement light to pass through the light-receiving window to be incident on the light-receiving collimator. The temperature of the object in the processing chamber may be measured by the low-coherence interferometer.

Abstract: Fiber optic sensing systems and methods. In a described embodiment, a fiber optic sensing system includes an optical fiber transmitting energy to a chemical vapor deposited diamond material proximate a substance in a well. The diamond material is deposited as a coating on a substrate. The substrate and coating are heated when the energy is transmitted by the optical fiber. This heats the substance in the well, which is detected to determine a property of the substance. In another embodiment, light energy is transmitted through the diamond material.

Abstract: The thermal detector includes a substrate, a thermal detector element including a light absorbing film, a support member supporting the thermal detector element and supported on the substrate so that a cavity is present between the member and the substrate, and at least one auxiliary support post of convex shape protruding from either the substrate or the support member towards the other. The height of the at least one auxiliary support post is shorter than the maximum height from the substrate to the support member.

Abstract: An infrared sensor according to the present invention includes a semiconductor substrate, a thin-film pyroelectric element made of lead titanate zirconate and disposed on the semiconductor substrate, a coating film coating the pyroelectric element and having a topmost surface that forms a light receiving surface for infrared rays, and a cavity formed to a shape dug in from a top surface of the semiconductor substrate at a portion opposite to the pyroelectric element and thermally isolates the pyroelectric element from the semiconductor substrate.

Abstract: An apparatus and methods for characterizing the response of a particle to a parameter that characterizes an environment of the particle. A change is induced in the parameter characterizing the environment of the particle, where the change is rapid on a timescale characterizing kinetic response of the particle. The response of the particle is then imaged at a plurality of instants over the course of a period of time shorter than the timescale characterizing the kinetic response of the particle. The response may be detected by measuring a temperature jump or by measuring correlation and anticorrelation between probe parameters across pixels. More particularly, the particle may be a molecule, such as a biomolecule, and the environment, more particularly, may be a biological cell. The parameter characterizing the environment of the particle may be a temperature, and change may be induced in the temperature by heating a volume that includes the particle, either conductively or radiatively.

Abstract: An active sensor apparatus includes an array of sensor elements arranged in a plurality of columns and rows of sensor elements. The sensor apparatus includes a plurality of column and row thin film transistor switches for selectively activating the sensor elements, and a plurality of column and row thin film diodes for selectively accessing the sensor elements to obtain information from the sensor elements. The thin film transistor switches and thin film diodes are formed on a common substrate.

Abstract: A system for operating a gas turbine includes a compressor, a combustor, and a turbine. The combustor and turbine define a hot gas path. A sensor disposed outside the hot gas path measures internal thermal emissions from the combustor or turbine and generates a first signal reflective of the internal thermal emissions. The internal thermal emissions are infrared or ultraviolet emissions. A controller connected to the sensor receives the first signal and adjusts the compressor, combustor, or turbine in response to the first signal from the sensor. A method for operating a gas turbine includes measuring internal thermal emissions from inside a combustor or turbine using a sensor disposed outside the hot gas path. The method further includes generating a first signal reflective of the internal thermal emissions and adjusting the operation of the compressor, combustor, or turbine in response to the first signal from the sensor.

Abstract: This disclosure describes systems, methods, and apparatuses for making a non-contact measurement of a substrate in a plasma processing chamber that accounts for stray blackbody radiation. In particular, a photocurrent is calculated that can be attributed to the stray blackbody radiation based upon a temperature of the stray blackbody radiation, a reflectance of a target substrate, and a temperature of the substrate. Knowing the photocurrent attributable to the stray blackbody radiation, a non-contact temperature measurement can be made, and the photocurrent attributable to the stray blackbody radiation can be subtracted out to arrive at a more accurate non-contact substrate temperature measurement.

Abstract: A method and apparatus for estimating the temperature sensed upon contact with a surface. The method includes contactless heating of the surface, contactless measurement of a time change in temperature of the surface, and estimation of the temperature sensed upon contact with the surface on the basis of this time change in temperature.

Abstract: The abnormality detection apparatus includes a first function of measuring a first temperature of a first portion of the abnormality detection apparatus, the first temperature having a correlation with a second temperature of a second portion of a vehicle alternator, a second function of integrating a stress depending on a temperature variation of the first portion on the basis of the first temperature measured by the first function, a third function of predicting occurrence of abnormality in the second portion depending on the stress integrated by the second function, and a fourth function of issuing an alarm when the third function predicts occurrence of abnormality.

Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.

Abstract: A method is present for monitoring a structure. A plurality of modes is identified for a first response for the structure at a first temperature. Each mode in the plurality of modes is adjusted from the first temperature to the second temperature to form a plurality of temperature adjusted modes. A temperature adjusted response is formed from the plurality of temperature adjusted modes in which the temperature adjusted response is adjusted to a second temperature from the first temperature. The temperature adjusted response is compared to a second response to evaluate the changes in the structure between the two sets of measurements.

Abstract: A patch having an infrared (IR) target is placed proximate to the surface of a mammal. The patch may include an insulator for protecting the target from exterior, ambient IR and may include bar codes or other indicia uniquely associated with either the patch or the mammal. The patch may also include a bio-reactive agent for indicating characteristics such as the pH of the mammal's skin. The patch may also include a thermometer for sensing the level of IR radiation from the IR target and may include a display of the temperature associated with such a level. The patch may also include a transmitter for wirelessly communicating information about such level to a remote location. A method of using the patch is also disclosed.

Abstract: A thermal analysis apparatus possesses a temperature sensor measuring a temperature of a heating furnace inside, a temperature program setter which can set a temperature program and outputs a temperature program signal, a temperature control section adjusting a supply electric power to a heater in compliance with a difference between the temperature program signal and a detection signal of the temperature sensor, a processor section calculating an air flow rate corresponding to a program temperature, and a mass flow controller which adjusts an air flow rate supplied to the heating furnace inside in compliance with a signal of the air flow rate calculated by the processor section. In the processor section, operation expressions calculating the air flow rate are set so as to differ respectively in a higher temperature side and a lower temperature side than a predetermined boundary temperature.

Abstract: A method for calibrating a thermometer is provided. The method includes deriving values of at least two different reference calibration coefficients of a reference calibration equation. The reference calibration equation relates temperature of a reference temperature sensor to at least two different calibration coefficients and a measured characteristic of the reference temperature sensor. A primary temperature sensor of the thermometer is calibrated using the derived values of the at least two different reference calibration coefficients. In another method for calibrating a thermometer, value of at least one reference calibration coefficient is derived from a reference calibration equation. The reference calibration equation is a non-linear equation relating the temperature of the reference temperature sensor to the at least one calibration coefficient and a measured characteristic of the reference temperature sensor.

Abstract: Embodiments disclosed herein provide a non-intrusive thermal (NIT) monitor for sensing temperatures useful for semiconductor manufacturing applications. In some embodiments, a NIT monitor comprises a thermopile, a fluid housing with a fluid window, and an elongated member positioned between the thermopile and the fluid window for transmitting or reflecting infrared signals corresponding to a temperature of a fluid in the fluid housing. The fluid housing may have a cross-sectional profile to enable the manipulation of the fluid flow under the fluid window, enhancing the speed and accuracy of the temperature sampling. The elongated member, which may be hollow and coated with gold, may an extended piece of the fluid housing or a part of an optics housing. In some embodiments, the NIT monitor is connected to a main conditioning circuit board via a cable for processing the temperature measurements at a remote location.

Abstract: A conventional radiation thermometer encompasses an infrared radiation sensor and a heatable and/or coolable radiation incidence window. The method and radiation thermometer according to the invention use the established dependence of the sensor signal U of the infrared radiation sensor on the temperature Tw of the radiation incidence window W (or any other heatable or coolable optical element in the beam path) for verifying its proper functional operation. Applying the method according to the invention, the radiation incidence window (or perhaps another optical element in the beam path) is heated up or cooled by activating an associated electric heating or cooling device. The resulting change ?Uw in the sensor signal U is detected, preferably in continuous fashion, as a function of the window temperature Tw and analyzed or verified for any deviation from an acceptable value or permissible range.

Abstract: Provided is a man-clothing-environment (MCE) simulator quantitatively measuring properties of clothes to transfer heat and moisture between human skin and an external environment. The MCE simulator includes a hot chamber providing a high-temperature environment, a cold chamber providing a low-temperature environment, a skin model selectively coupled to the hot chamber or the cold chamber while being vertically erect, a water supplier supplying water to a hot plate included in the skin model, and a controller controlling the hot chamber, the cold chamber and the skin model, and processing data on temperature and humidity measured by sensors. The skin model includes the hot plate receiving heat and water while being vertically erect and simulating human skin, a ring-shaped frame coupled to a side of the hot plate and supporting a fabric to be separated from the side of the hot plate, and the sensors measuring temperature and humidity inside and outside the fabric.

Abstract: The present invention relates to an analytical device (X1) including a mounting portion (10) for mounting an analytical tool (2) capable of outputting information for computation, a computation unit for conducting computation for analyzing a sample based on the information for computation, and a temperature detection unit (12) for outputting the temperature information. The temperature detection unit (12) is disposed in the mounting portion (10). The analytical device (X1) preferably further includes a temperature correction unit for correcting the computation results obtained in the computation unit, based on the temperature information. The temperature detection unit (12) includes, for example, a contact type temperature sensor (12A). In this case, the contact type temperature detection unit (12) may include a thermally conductive portion (12B) having a contact surface (12b) to be brought into contact with the temperature sensor (12A) and the analytical tool (2).

Abstract: A fixing apparatus according to one aspect of the present invention includes a non-contact temperature detecting element 81 allocated in non-contact with a heat roller, the sensing element detecting a temperature of the heat roller. The non-contact temperature sensing section 81 includes a thermopile P which detects a target temperature Pt of a heat roller 2, a temperature element CPU 100 which estimates an ambient temperature at the periphery of the thermopile P and computes an estimated ambient temperature SQt, and a thermister Q which detects an ambient temperature Qt at the periphery of the thermopile and outputs the ambient temperature Qt at an output voltage of a predetermined rate with respect to a total output voltage value corresponding to the estimated ambient temperature SQt.

Abstract: A method and apparatus for measuring a temperature during a process are provided. In one embodiment, an apparatus for measuring a substrate temperature during an etching process is provided that includes a chamber body, a chamber lid enclosing the chamber body and a substrate support assembly. A plurality of windows formed in a substrate supporting surface of the substrate support assembly. A signal generator is optically coupled through the substrate support assembly to the windows. A sensor is positioned above the substrate support and aligned to receive energy transmitted from the signal generator through at least one of the windows, wherein the sensor is configured to detect a metric indicative of transmittance.

Abstract: A thermal imaging apparatus comprises a housing defining an entrance pupil for ingress of imaging radiation. At least one light sensor is positioned forward of the entrance pupil. An electronic imaging device such as a focal plane array is located in the housing rearward of the entrance pupil for converting imaging radiation to electrical signals for further processing. The apparatus further includes a shutter having an open position and a closed position. In the closed position, the shutter is located between the entrance pupil and the electronic imaging device so as to inhibit exposure of the electronic imaging device to incident radiation. Circuitry is provided for selectively operating the shutter to be in the closed position based on signals produced at the light sensor.

Abstract: Method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: A first thermistor 8 and a second thermistor 9 are arranged forwardly and rearwardly of a thermopile sensor 5. A thermopile chip 55 is arranged and interposed between the first thermistor 8 and an integrated thermistor 57. A sensor cover is mounted in contact with front and side portions of a can portion 59 of a thermopile casing 56. A temperature or a radiant quantity of infrared rays on the front portion of the can portion is estimated from a temperature change of the integrated thermistor per second.

Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.

Abstract: A pressure thermistor has a retention part, a film retained on the lower surface of the retention part in such a way that both surfaces of the film are exposed, and a thermosensitive device attached to the film. One surface of the film is rough and faces a pressure roller. The one surface of the film is increased in surface area due to rough surface. Thus, reflection of heat from the pressure roller is suppressed on the one surface of the film. Also, it becomes possible to improve the absorptivity of heat on the one surface of the film.

Abstract: A method and apparatus for measuring the core temperature of an animal or human. Emissions from the eyeball are detected, at one or more wavelengths selected on the basis of various factors, including the ability of that wavelength to reach the interior of the eyeball. An illumination marker shines a spot of light on the eyeball, such that the spot corresponds to the area from which emissions are being detected.

Abstract: An improved roadway temperature monitoring system is designed to be powered by solar energy for measuring and transmitting sensed roadway surface temperatures over a wireless link to remote workstations comprises a module housing fabricated from a light-transmissive, thermally conductive tough plastic for containing a solar cell array, a microprocessor, a spread spectrum RF transmitter, a plurality of temperature sensing elements and a battery supply therefor whose charge is maintained by the solar cell array.

Abstract: A vehicle air conditioner has an IR sensor that detects a temperature of air inside a vehicle compartment. The IR sensor is disposed on an instrument panel so that the sensor is disposed above switches and a face blowout port on the instrument panel. Accordingly, a detecting range of the IR sensor is prevented from interfering by hands of a driver or an occupant even when the switches are operated by the driver. Thus, the air conditioner is capable of stable air conditioning.

Abstract: A method for providing an electronic monitoring device with the ability to detect the status of a controlled condition of a monitored environment, and, based on this status, to automatically self-adjust monitoring parameters in accordance with pre-defined parameter settings so as to properly monitor the controlled condition of the monitored environment. The monitoring device includes a microcontroller, a sensor to detect the status of the controlled condition of the monitored environment, switches to allow for user interaction and audible and visual annunciation devices as well as remote annunciation devices such as relays, all of these devices combined in a system to alert personnel when controlled conditions are abnormal.

Abstract: A method for reducing temperature measurement error in a tympanic thermometer. The present disclosure provides a tympanic thermometer including a heat sensing probe defining a longitudinal axis and an outer surface extending from a distal end of the tympanic thermometer. The heat sensing probe includes a thermally insulating sensor housing extending to a distal end thereof. Can-packaged temperature sensing electronics are mounted at the distal portion of the sensor housing. A thermally conductive nozzle is configured to direct heat flux to the temperature sensing electronics in the distal end of the heat sensing probe. The sensor can preferably include a lip extending radially therefrom and contacting the nozzle at at least one contact point to provide heat flux to the sensor can.

Abstract: Disclosed herein are methods and systems for sensing and controlling the temperature of a resistive element configured for use in a read/write head of a magnetic data storage device. In one embodiment, a method includes detecting a voltage across the resistive element, where the voltage varies as a function of a temperature of the resistive element. The method also includes comparing the voltage to a predetermined value to determine a variation of the voltage from the predetermined value, and then altering a power applied to the resistive element based on the variation. In this exemplary embodiment, the temperature of the resistive element is then controlled as a function of the altered applied power.

Abstract: An apparatus for continuously monitoring a photopolymerization reaction in real time by optical pyrometry includes a housing having a chamber; a sample mount that may be disposed within the chamber; a light source for supplying light to induce a photopolymerization reaction in a monomer sample disposed on the sample mount; and an optical pyrometer that may be attached to the housing for measuring temperature of the monomer sample. The temperature of the sample with respect to time is used to monitor progress of the reaction. Another apparatus for monitoring a photopolymerization reaction combines optical pyrometry and infrared spectroscopy. The apparatus includes a sample mount disposed in a beam of an infrared spectrometer a light source for supplying light to induce a photopolymerization reaction in a monomer sample disposed on the sample mount and an optical pyrometer for measuring temperature of the monomer sample.

Abstract: A control apparatus for a gas sensor, wherein a microcomputer 44, which is connected to an oxygen sensor 30 including a detection element 12 and a heater 14, detects the cooling water temperature Tw of the engine. The control apparatus determines that condensation water within the exhaust pipe is being generated when the cooling water temperature Tw is equal to or lower than 0° C. When equal to or lower than 0° C., the microcomputer 44 supplies to the heater 14 electrical power for maintaining the temperature of the detection element 12 within the range of 100° C. to a splash-water-cracking generation temperature (e.g., about 300° C.) at or above which cracking can occur in a laminated-type oxygen sensor element 10 due to splash of condensation water. Electrical power is supplied to the heater 14 such that a pulse signal Sh is output from the microcomputer 44, and the heater 14 is pulse-driven by use of a heater electrification control circuit 34.

Abstract: An infrared thermometer comprises a detecting portion provided with a waveguide (8) having a tubular conformation and capable of conveying the infrared radiation emitted from a detecting surface towards a sensor member (7) housed within the infrared-thermometer holding body; the waveguide has the conformation of a parabola the extension of which increasingly more converges in the direction of the sensor member (7).

Abstract: A first aspect of the present invention is a method for collecting temperature data in a facility wherein the facility includes a plurality of systems. The method includes coupling a plurality of sensors to at least one of the plurality of systems, connecting each of the plurality of sensors to a central system and utilizing the central system to collect temperature data from each of the plurality of sensors.

Abstract: An infrared thermometer comprises a detecting portion provided with a waveguide (8) having a tubular conformation and capable of conveying the infrared radiation emitted from a detecting surface towards a sensor member (7) housed within the infrared-thermometer holding body; the waveguide has the conformation of a parabola the extension of which increasingly more converges in the direction of the sensor member (7).

Abstract: The invention provides a temperature monitoring system for a semiconductor test handler. A preparation stage brings a test device to a predetermined temperature for testing at a test platform at said predetermined temperature. At least one radiation sensor, such as a thermopile device, is employed in the test handler for detecting a surface temperature of the test device by measuring radiation emitted from the test device.

Abstract: The invention provides a cooling system for protecting an image fiber and an imaging device from thermal influences and a temperature measurement apparatus, for a molten metal, capable of being easily controlled and stably measuring the temperature. The temperature measurement apparatus for a molten metal comprises four connectable portions of a nozzle portion a purge/cooling gas introduction portion, an image fiber fitting portion with a window glass and an image fiber to a double pipe nozzle protection tube. A distance from a nozzle distal end as an introduction portion of thermal radiation light to a light reception portion at an image fiber distal end becomes short so that a greater amount of thermal radiation light can be received.

Abstract: There is provided a semiconductor wafer heat treatment apparatus and method, which can carry out a heat treatment to suppress variations in line widths within surface on a semiconductor wafer and the like, which includes: a heating plate for heating a semiconductor wafer to a predetermined temperature; a temperature measuring unit for measuring temperatures when heating the semiconductor wafer or a semiconductor wafer equivalent placed on the heating plate, at portions divided into a plurality of regions; and a controller for controlling the temperatures of the semiconductor wafer, and based on the temperature measurement result of the temperature measuring unit, the controller controls the temperature in heating the semiconductor wafer, for each of the plurality of regions. In cooling after the heating process, based on the temperature measurement result, the controller controls the temperature in cooling the semiconductor wafer, for each of the plurality of regions.

Abstract: The invention provides a cooling system for protecting an image fiber and an imaging device from thermal influences and a temperature measurement apparatus, for a molten metal, capable of being easily controlled and stably measuring the temperature. The temperature measurement apparatus for a molten metal comprises four connectable portions of a nozzle portion a purge/cooling gas introduction portion, an image fiber fitting portion with a window glass and an image fiber to a double pipe nozzle protection tube. A distance from a nozzle distal end as an introduction portion of thermal radiation light to a light reception portion at an image fiber distal end becomes short so that a greater amount of thermal radiation light can be received.

Abstract: A heater controller for an oxygen sensor associated with a vehicle engine. The controller includes a start detect section, a restart determination section, and a heater delay control section. The start detect section detects whether the engine is started. The restart determination section determines whether the engine is restarted. The heater delay control section operates the heater to activate after a predetermined delay time, delayed from startup of the engine, that is set according to an engine water temperature. The operation of the heater is executed when the start detect section detects that the engine is started and the restart determination section determines that the engine is not restarted.

Abstract: Disclosed are an infrared sensor assembly and a refrigerator having the infrared sensor, in which a location where a heat source is generated is precisely detected by narrowing a receiving angle of an infrared sensor. To this end, the infrared sensor assembly comprises: an infrared sensor fixed to a supporting frame for receiving infrared rays generated at a heat source; a case having the infrared sensor mounted therein and an infrared filter mounted at an upper surface thereof, the infrared filter transmits only the infrared rays; and a receiving range limiting means prolonged from an outer circumference surface of the case with a predetermined height for limiting a range of the infrared rays received into the infrared sensor so as to precisely detect a location of the heat source.

Abstract: The invention relates to an infrared thermometer, especially an ear thermometer for measuring temperature, comprising an infrared sensor, a measuring tip which can be heated by a heating element, an actuating device which can be operated by a user, a control device and a display device. The invention also relates to a method for measuring temperature, especially by means of a radiation thermometer having a heatable measuring tip. Said control device switches off the heating element after the user has actuated an actuating device. After a certain amount of time, a plurality of temperature measurements are successively carried out, and the temperature to be displayed is determined from said measured temperatures or an error message is generated. At the latest, after a maximum measuring time has elapsed or after a maximum number of temperatures have been measured, the temperature to be displayed or an error message is displayed on the display device.

Abstract: A test wafer for use in wafer temperature prediction is prepared. The test wafer includes: first semiconductor layer formed in a crystalline state; second semiconductor layer formed in an amorphous state on the first semiconductor layer; and light absorption film formed over the second semiconductor layer. Next, the test wafer is loaded into a lamp heating system and then irradiating the test wafer with a light emitted from the lamp, thereby heating the second semiconductor layer through the light absorption film. Thereafter, a recovery rate, at which a part of the second semiconductor layer recovers from the amorphous state to the crystalline state at the interface with the first semiconductor layer, is calculated. Then, a temperature of the test wafer that has been irradiated with the light is measured according to a relationship between the recovery rate and a temperature corresponding to the recovery rate.

Abstract: The invention is directed to an infrared thermometer with a heatable probe head, in particular a clinical thermometer for taking a patient's temperature in the ear, and to a heatable protective cover. The probe head possesses a radiation inlet zone at its forward end. A heating element is also arranged there. The heating element is either connected to a protective cover adapted to be fitted over the probe head or secured to the forward end of the probe head.

Abstract: A temperature sensor utilizing optical temperature measuring techniques is constructed to make firm contact with a surface whose temperature is being measured, an example application being the monitoring of semiconductor wafers or flat panel displays while being processed. A cap is mounted near but spaced apart from an end of a lightwave guide, with a resilient element that applies force of the cap against a surface whose temperature is being measured as the cap is urged toward the optical fiber end. An optical temperature sensing element, such as luminescent material or a surface of known emissivity, is carried within the cap. A bellows with a closed end conveniently serves as both the cap and the resilient element. An alternative temperature measuring device installs an optical temperature sensing material within a test substrate behind an optical window, and then views the sensing material through the window.