Abstract: The present invention provides a thermal sensor integrated IC having a resistor and a converting circuit. The resistor is implemented by at least one metal line, wherein a resistance of the resistor is varied with a temperature of the resistor, the resistor has a first terminal and a second terminal, and one of the first terminal and the second terminal is arranged to provide a voltage signal corresponding to the resistance. The converting circuit is coupled to the resistor, and is configured to convert the voltage signal to an output signal for determining the temperature. In one embodiment, the at least one metal line is made by copper.

Abstract: A converter device for an electrical machine, including a switch with a plurality of switching elements to generate a multiphase alternating current for the electrical machine and a plurality of phase conductors for conducting an alternating current generated in each case by the switch to the electrical machine, wherein a number of first phase conductors that is one less in number than the total number of phase conductors are coordinated with a current measuring means, and a control device is provided, which is designed to determine a calculated value describing a current along the second phase conductor from first measured values of the current measuring means, wherein the control device is designed to check the plausibility of the calculated value on the basis at least one second measured value of a short circuit detecting device coordinated with a switching element.

Abstract: A method and a circuit take a measurement of a sensor having first, second and third lead wires by: (a) providing first, second and third terminals for voltage measurements; (b) connecting a current sensing device (e.g., a reference resistor) to provide a signal at the third terminal that is indicative of the current in the third lead wire of the sensor; (c) connecting a first protective device between the first lead wire of the sensor and the first terminal; (d) connecting a second protective device between the second lead wire of the sensor and the second terminal; (e) connecting a first current source to the first lead wire of the sensor; (f) connecting a second current source to the second lead wire of the sensor; and (g) measuring a first voltage across the first and second terminals and a second voltage across the third terminal and the voltage reference.

Abstract: The present invention provides a semiconductor device having a sensor capable of improving precision while suppressing increase in occupation area. A semiconductor device has: a first counter; and a second counter (time measuring circuit) measuring time until a count value, which is obtained by counting a first signal having a frequency corresponding to a first voltage, reaches a largest count value which can be counted by the first counter. The first counter obtains a piece of digital information corresponding to the first voltage on the basis of a count value obtained by counting a second signal having a frequency corresponding to a second voltage, which is different from the first voltage, on the basis of the time measured by the time measuring circuit.

Abstract: A temperature measurement device is provided to measure an environment temperature and includes a thermistor, a resistor, a determination circuit, and a measurement circuit. The thermistor is coupled to a first node. The thermistor has a specific impedance value at a specific environment temperature point. The resistor has a first terminal coupled to the first node. The determination circuit determines a real impedance value of the resistor. The measurement circuit is coupled to the first node for receiving a measurement value signal generated at the first node and obtains a value of the specific environment temperature point according to the measurement value signal and the real impedance value of the resistor.

Abstract: To provide a highly accurate temperature sensor circuit. The temperature sensor circuit includes a first constant current circuit; a first diode in which a first voltage reflecting the temperature of an object to be detected is generated between an anode and a cathode in accordance with a first current supplied from the first constant current circuit; a second constant current circuit; a second diode which includes an oxide semiconductor and in which a second voltage is generated between an anode and a cathode in accordance with a second current supplied from the second constant current circuit; and an amplifier circuit which amplifies a difference between the first voltage and the second voltage.

Abstract: The present invention provides a steel plate quality assurance system and facilities thereof, wherein the steel plate quality assurance system measures, with a steel plate manufacturing line including a finishing mill of a steel plate manufacturing line, and accelerated cooling equipment disposed on the downstream side of the finishing mill in the advancing direction of the steel plate manufacturing line, temperature of at least the whole area of the upper surface of a steel plate, or the whole area of the lower surface of a steel plate to perform quality assurance, and includes temperature measurement means; temperature analysis means; and mechanical property determining means.

Abstract: A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.

Abstract: A sensor device formed on a semiconductor substrate. The device comprises a thermal radiation sensor including a sensing cell and a referencing cell which are co-operable for providing a first output signal indicative of the temperature fluctuation resulting from incident radiation. A gradient sensor including a pair of cells spatially located on the semiconductor substrate is provided which are co-operable to provide a second output signal indicative of the temperature gradient across the semiconductor substrate for facilitating calibrating the first output signal. At least one of the cells of the gradient sensor is not common to the cells of the thermal radiation sensor.

Abstract: The invention is related to methods for determining thermophysical properties of solid bodies, particularly, to methods for determining thermal conductivity and volumetric heat capacity. In accordance with the method, a reference sample and sequentially located samples of solid bodies are heated by a thermal energy source moving at a constant speed relative to the reference sample and the samples being studied. Excessive temperatures of the surfaces of the reference sample and the studied samples at points on a line of heating are measured and the thermophysical properties of the reference sample and the samples being studied are determined. Arbitrary shape samples are used and thermal conductivity and volumetric heat capacity of the samples are determined by solving an inverse coefficient problem of thermal conductivity.

Abstract: The invention concerns a device for determining the temperature inside an item to be cooked (12). The invention comprises at least one temperature sensor (20) for detecting at least one surface temperature of the item to be cooked (12) and/or an ambient temperature around the item to be cooked, particularly at a measuring location inside the cooking chamber surrounding the item to be cooked, preferably with an ambient temperature sensor which is arranged at said measuring location. Furthermore, the device comprises at least one distance sensor (22) for detecting one or multiple distances between the distance sensor (22) and one or multiple distance measuring points (36) on the surface of the item to be cooked (12).

Abstract: A system and method for automatic analysis of temperature transition data over an area of a sample surface. The system relies on the use of a microfabricated probe, which can be rapidly heated and cooled and has a sharp tip to provide high spatial resolution. The system also has fast x-y-z positioners, data collection, and algorithms that allow automatic analysis of and visualization of temperature transition data.

Abstract: A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.

Abstract: A thermal detecting device for sensing temperature at multiple locations proximate to the detecting device is provided. The detecting device has a pair of infrared detectors each configured to measure temperature of two locations by receiving infrared energy of the two locations. A housing encloses the pair of infrared detectors. The housing is configured with an aperture to allow the infrared energy of the two locations to be received by the pair of infrared detectors. A reflective mirror or two mirrors focus the infrared energy of the two locations towards the pair of infrared detectors. The detecting device may be configured to determine if there is a temperature differential at a location as the housing moves with respect to the location.

Abstract: A thermoacoustic tomographic method for imaging an object, wherein the object is thermally excited by a source and the acoustic waves from the object, which are caused by the thermal excitation, from different directions of the object are detected using at least one detector and an image of the object is reconstructed from the detected acoustic waves and the positional information, wherein the acoustic waves detected by the detector are integrated at least in one direction over a length of at least ?{square root over (8)}·d, where d denotes the maximum distance from a point of the object to be imaged to the detector.

Abstract: Provided is an apparatus for substrate processing. The apparatus may include a radiation source emitting a photonic beam, an optical system to form a beam image, a scanning stage, a temperature monitoring means, an output signal generator that compares the monitored temperature with a preset temperature, and a controller coupled to the radiation source and the stage. The stage may be adapted to scan the substrate so the beam image heats a region of the substrate surface, and the temperature monitoring means may collect and analyzes p-polarized radiation of at least three different spectral regions emitted from one or more places on the heated substrate region. The controller in response to a temperature error signal may be programmed to alter the beam intensity and/or to provide changes in the scanning velocity between the stage and the beam. Other apparatuses and temperature monitoring systems are provided as well.

Abstract: A thermal processing system includes a source of laser radiation emitting at a laser wavelength, beam projection optics disposed between the reflective surface and a substrate support capable of holding a substrate to be processed, a pyrometer responsive to a pyrometer wavelength, and a wavelength responsive optical element having a first optical path for light in a first wavelength range including the laser wavelength, the first optical path being between the source of laser radiation and the beam projection optics, and a second optical path for light in a second wavelength range including the pyrometer wavelength, the second optical path being between the beam projection optics and the pyrometer. The system can further include a pyrometer wavelength blocking filter between the source of laser radiation and the wavelength responsive optical element.

Abstract: Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor.

Abstract: A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.

Abstract: A method for recalibrating a bilateral thermal scanner comprising a first thermal sensor and a second thermal sensor can comprise acquiring a first set of thermal scanning data with the thermal sensors in their normal positions; optionally analyzing the first set of thermal scanning data is analyzed to determine if the data has a one-sided bias; acquiring a second set of thermal scanning data with the positions of the thermal sensors reversed; determining a calibration from the first and second sets of thermal scanning data; and optionally correcting at least one of the first and/or second set of thermal scanning data using the calibration.

Abstract: A relatively simple and inexpensive micromachined arrayed thermal probe apparatus, system for thermal scanning a sample in a contact mode and cantilevered reference probe for use therein can be used for a variety of microscopy and microcalorimetry applications ranging from the monitoring of processes in semiconductor manufacturing to the characterization of nano-scale materials, imaging of biological cells, and even data storage. Probes are designed to have very high thermal isolation and high mechanical compliance, providing advantages in both performance and ease of operation. In particular, an array of probes can be used for high throughput contact mode scanning of soft samples without mechanical feedback, and can, therefore, be used in wide arrays for high-speed measurements over large sample surfaces. The probes are preferably manufactured by a photolithographic fabrication process, which permits large numbers of probes to be made in a uniform and reproducible manner at low cost.

Abstract: A method and device includes the use of multiple remote sensors transmitting temperature information to a thermostat, while reducing or eliminating transmission interference and providing increased user control. Remote temperature sensors of the present invention sense temperature at variable time periods and only transmit temperature information on a sensed change in temperature. Transmission of temperature information is provided on variably selected frequencies within a specified range, and may be based in part on previous temperature transmissions. A learn mode is provided that allows for recognition of each sensor by a host-controlling thermostat, including determining the proper transmission power level for each sensor. Additionally, each sensor is programmable to provide a temperature offset and each sensor may be individually weighted according to specific requirements or needs.

Abstract: This invention is intended to provide a semiconductor wafer temperature measuring method for use in reflector plate-equipped infrared annealing furnaces, infrared heating epitaxy furnaces, and other semiconductor wafer processing equipment that employs lamps as the heat source, the method affording easy and accurate measurement of substrate surface temperature, thereby enabling control of the heat source on the basis of these measurements. Characterizing features are the provision of a slit or small hole to the reflector plate and measuring light from the semiconductor wafer surface in the perpendicular direction by means of a scanning CCD sensor to allow substrate temperature to be measured on the basis of the radiant light distribution peak; and the provision of slits in a plurality of locations on the reflecting plate without impairing the function thereof, so that substrate temperature distribution can be measured accurately.

Abstract: A material to be cut has a face to be cut with a cutting tool, and a cutout which temporarily brings the cutting tool into a noncontact state. Images of the cutting tool during the period when it attains an exposed state by passing over the cutout are captured with a camera mechanism at an interval of a predetermined delay time .tau.. A plurality of image information items obtained by these capturing operations include temperature change information of each location as the cutting tool gradually passes from the point of instant when it enters the cutout. Therefore, the image information items are arranged in relation to the exposure time from the point of instant, and a two-dimensional temperature distribution of the cutting tool at the point of instance is computed according to the tendency of change in image information.

Abstract: The electronic clinical thermometer of the present invention has a temperature sensing portion (3), a control signal generating circuit (2) for generating a control signal for controlling operation of each of structural elements, a converting circuit (4) for converting an output signal generated from the temperature sensing portion into a digital signal, a temperature measuring section (6) for measuring the temperature based on the digital signal, storage circuits (7) for storing and updating a maximum value of the temperature measured by the temperature measuring section in order. Data comparing circuits (8) are provided for comparing the temperature stored in the storage circuits with a present measured value. Temperature rise detecting means (21) is provided for detecting a rising amount of the temperature based on a compared result of the data comparing circuits, and a buzzer (103) is provided for informing the rise of the temperature based on a signal of the temperature rise detecting means.

Abstract: A method and an apparatus for sorting particulate solids material. The material is subjected to a microwave field and absorbs energy to an extent depending upon the dielectric properties of the individual particles. The absorbed energy heats the particles, and pyrodetectors detect the heat radiation. Detector output signals control pressurized air jets to remove particles from the waste material which are detected to be colder than the remainder of the bulk.

Abstract: A thermocouple selection switch for monitoring thermocouples positioned within tunnel furnace cars allows a plurality of thermocouples to be monitored, while, at the same time, avoiding the requirement of precisely aligning the tunnel furnace car with an external probe. The selection switch is comprised of a plurality of switch stations, each of which contain longitudinally extending contact rails which when contacted with an external probe at any point along the length of the contact rails establishes electrical contact with opposite sides or wires of thermocouple.

Abstract: The thermometer includes an oscillation unit having a time constant circuit with a compound resistor including a reference resistor and a temperature sensitive resistor. The compound resistor is switched between the reference and temperature sensitive resistors. A comparator compares the oscillation frequencies of the oscillation unit by switching over the compound resistor between the reference and temperature sensitive resistors at a variable sampling interval, and outputs digital data corresponding to the temperature sensed by the temperature sensitive resistor. The digital data corresponding to the sensed temperature are converted and displayed on a temperature data display unit. The resistive value of the reference resistor and the sampling time are switchable according to the range of temperature measurement. The temperature data conversion unit has several sections which are switchably selected according to particular ranges of temperature measurement.

Abstract: A system for monitoring data signals representing a number of parameters of a plant or apparatus, periodically superimposes test signals on to some of the data signals so as to produce combined signals representing unacceptable states of the parameters. The selection of the data signals on which the test signals are superimposed is changed at each periodic examination in a predetermined sequence, so that a pattern of acceptable and unacceptable signals is produced as an output to be compared with a reference pattern.

Abstract: An electronic thermometer apparatus includes an indoor temperature sensor, an outdoor temperature sensor, a single display unit capable of displaying exchangeably and alternately the indoor and the outdoor temperatures, means for automatically displaying alternately the indoor and outdoor temperature in a normal mode, means responding to the closing of a change-over switch in the course of the alternate display to thereby display the temperature other than that displayed immediately before the closing of said switch continuously until the switch is again opened, and means for allowing the alternate display of the indoor and outdoor temperatures to be effected automatically in response to the opening of the change-over switch.

Abstract: A method and apparatus for simulating thermal images of various target dees and backgrounds as they would appear when viewed with a thermal viewer. A number of test elements of varying thicknesses are arranged in such a manner that upon solar heating the thermal signature thereof will represent the particular target for which the elements have been arranged, thereby eliminating the need for having to physically pursue the acquisition of the actual target for test purposes.

Abstract: Disclosed is an electronic thermometer which comprises a first and a second sensing portions for detecting temperature at different two positions and each producing an output corresponding to the detected temperature; a display for displaying a temperature in a mode selected from a first mode in which the temperature detected by the first temperature sensing portion is continuously displayed, a second mode in which the temperature detected by the second temperature sensing portion is continuously displayed, and a third mode in which the temperatures respectively detected by the first and second temperature sensing portions are alternately displayed; and a selector for selectively connecting the respective outputs of the first and second temperature sensing portions to the display; and a controller for selecting the display mode of the display.

Abstract: An apparatus for measuring a temperature comprises a first resistance, the resistance value of which depends on the temperature to be measured, a second resistance, a multiple switch with a plurality of inputs and an output, wherein the resistances each are connected to a corresponding input, a supply source which can be coupled with both resistances through a switch and a processing unit for controlling the switch and the multiple switch and for determining the temperature in dependence on the voltages measured at the supply source being switched on and off respectively, in the subsequent positions of the multiple switch. The output of the multiple switch is connected to an input of a voltage/frequency converter through a voltage source, an output of the voltage/frequency converter being connected to the processing unit.

Abstract: A camera contains a row of diodes sensitive to infrared radiation and mounted on a turntable for rotation about the optical axis of the camera. The signals from the diodes provide a temperature profile of a band across the width of a strip of hot rolled steel moving in a direction orthogonal to the optical axis and to the length of the row of diodes. Since the diodes are low accuracy devices, their measurements are compensated by normalizing co-efficients derived by comparison with the signal provided by an optical pyrometer viewing the central part of the steel strip in the region of the optical axis. To enable all diodes to be calibrated, calibration is effected with the turntable rotated 90.degree. to align all the diodes with the central part of the strip as viewed by the pyrometer. The camera may be mounted on one arm of a C-frame having X-ray tubes in an arm and X-ray detectors in the other arm for the purpose of measuring the thickness profile of the strip in known way.

Abstract: A multiple thermocouple system for rapidly monitoring wall temperatures of a metal vessel and identifying those thermocouples having voltages and temperature readings above a predetermined level. In the system, a number of first metal insulated conductor wires are metal bonded to the metal vessel to provide hot first junctions, and a second conductor utilizes the vessel metal wall as a portion of the conductor together with an additional metal insulated conductor wire connected to the metal wall. The conductors of each thermocouple pair are connected to the terminals of a rapid switching device and subsequently connected by the switching device to a voltage measuring means, which can be a digital readout type millivoltmeter. If desired, the voltage output of each thermocouple pair can be compared by a computer with the voltage output from a conventional dual conductor reference thermocouple attached to the vessel wall to determine temperature deviations.

Abstract: A system for correlating condition-indicative signals fed sequentially from a series of sensors, such as thermocouples installed in ports on the surface of a rotating kiln at various longitudinal and angular coordinates along the total length of the kiln, with the signals printout on a multipoint recorder mounted remotely from the kiln is disclosed wherein two photoelectric devices are disposed at fixed points adjacent the kiln for sensing the passage of a series of sensor-location indicator tabs mounted on and rotating with the kiln.

Abstract: A system for monitoring the internal conditions in a rotary kiln is disclosed wherein a series of sensors, such as thermocouples, are installed in ports at various longitudinal and angular coordinates along the total length of the kiln for providing temperature signal samples in the form of sequenced millivolt signals, and a single thermocouple is provided which is insertable in a second series of ports along the kiln to permit immediate localized temperature sensing. The sequenced millivolt signals and the single thermocouple millivolt signals are both fed to respective millivolt-to-milliamp converters mounted on a heat shield on the kiln surface, which shield also mounts two sets of continuous slip rings encircling the kiln. The respective milliamp signals are communicated from the converters to the respective slip ring sets from which they are picked off by suitable stationary contact means disposed adjacent the kiln and conducted to appropriate recorders in a control room.

Abstract: A system for monitoring the temperature of a plurality of bearings and motors, for example in a grain elevator, includes a plurality of sensors associated with the respective bearings and motors whose temperatures are to be monitored. A first circuit energizes a display for providing a readout of the temperature at each sensor location, and a second circuit compares the temperature at each sensor with a maximum desired temperature for its associated bearing or motor, and energizes an alarm when this desired maximum is exceeded. A third circuit drives a display indentifying the sensor being monitored by the first and second circuits. A malfunction detector circuit produces an observable indication in response to an open circuit condition at any of the sensors.