Abstract: The temperature measurement device provided in the present disclosure includes: a first housing; a second housing having a tip for insertion into food; an insulated connection part connected to the first housing and the second housing separately; a handle connected to the first housing; and a circuit board unit at least located inside the first housing and the second housing, wherein the circuit board unit is connected to a food temperature sensing unit, a battery unit, and an antenna unit; wherein, the first housing and the second housing respectively act as a first electrode unit and a second electrode unit of the temperature measurement device, and the first electrode unit and the second electrode unit are used to charge the battery unit.

Abstract: A temperature abnormality detection system of the present invention includes a first temperature sensor that measures a first temperature indicated by a target device and a second temperature sensor that measures a second temperature indicated by ambient air around the target device. A temperature difference between the first temperature and the second temperature is calculated, and when this temperature difference becomes a predetermined threshold value or more, it is determined that a temperature abnormality of the target device has occurred.

Abstract: A heat amount measuring method includes a first step of providing a heat-transferring component that transfers and receives heat to and from a heating component and measuring, while the heating component is generating heat, a first heat amount of heat transmitted from the heating component to the heat-transferring component, a first heating component temperature, and a first substrate temperature, a second step of changing an output of the heat-transferring component and measuring a second heat amount of heat transmitted from the heating component to the heat-transferring component, a second heating component temperature, and a second substrate temperature, and a third step of calculating a heat amount of heat transmitted from the heating component to a substrate by using the first heat amount, the first heating component temperature, the first substrate temperature, the second heat amount, the second heating component temperature, and the second substrate temperature.

Abstract: The present invention relates to real time discharging droplet compensating apparatus and method capable of compensating a discharging degree in real time by feeding-back drop information. To this end, the present invention provides a real time discharging droplet compensating apparatus which is configured by including a discharge control unit controlling the driving of an inkjet head; and a drop measurement unit provided below a substrate to measure drop information of a droplet to be discharged on the substrate and feed-back the measured drop information to the drop measurement unit, wherein the discharge control unit compensates a nozzle waveform of discharging the droplet by using the drop information. Therefore, according to the present invention, the position, size, and volume information of the drop are measured at the same time to be fed-back to the inkjet head unit in real time, thereby acquiring drop information without movement of a separate head unit.

Abstract: The present invention discloses a cable temperature sensing device, which consists of a plurality of temperature sensing modules disposed on an identical cable. By such arrangement, the temperature sensing modules are configured to measure a plurality of temperature values from different positions on the cable, and then convert the plurality of temperature values to a cable temperature data through a temperature reading module.

Abstract: Method for determining the state of a fire-resistant lining of a vessel containing molten metal in particular in which maintenance data, production data, and wall thicknesses at least at locations with the highest degree of wear are measured or ascertained together with additional process parameters of at least one identical/similar vessel after the vessel has been used. The data is collected and stored in a data structure. A calculating model is generated from at least some of the measured or ascertained data or parameters, and the data or parameters are evaluated using the calculating model using calculations and subsequent analyses. Thus, related or integral ascertaining processes and subsequent analyses can be carried out, on the basis of which optimizations relating to both the vessel lining as well as the complete process of the molten metal in the vessel are achieved.

Abstract: An apparatus is disclosed. The apparatus includes a circuit, a conductor interconnecting a portion of the circuit, and a processor configured to determine a temperature of the conductor and adjust at least one parameter related to the conductor in response to the determined temperature rising above a threshold. The at least one parameter includes a lifetime estimate for the conductor. A method of operating an apparatus including a circuit and a conductor interconnecting a portion of the circuit is disclosed. The method includes determining a temperature of the conductor, and adjusting at least one parameter related to the conductor in response to the determined temperature rising above a threshold. The parameter includes a lifetime estimate for the conductor.

Abstract: A measurement arrangement for detecting damage to components that are made of at least one fiber-reinforced plastic material, has a plurality of temperature sensors that are arrangeable or arranged on a component at a spacing from one another. In order to provide a measurement arrangement, by means of which temperature data can be cost-effectively obtained during the production and operation of a component and for it to thus be possible for damage to the component to be recorded and monitored, the plurality of temperature sensors on the component form a sensor array and a change in the thermal material properties of the component is detected by means of the sensor array.

Abstract: A method for manufacturing a temperature measure unit of a thermometer to measure an object temperature and convert to an electric signal through the temperature measure unit that is sent to a central processing unit located in the thermometer to be processed and converted to an information obtainable by users through an output unit located in the thermometer, the method includes: providing a substrate with surfaces attached a first transmission circuit and a second transmission circuit in a spaced manner; providing a thermistor chip positioned against the substrate such that one side of the thermistor chip forms electric connection with the first transmission circuit and an opposite side forms electric connection with the second transmission circuit; and providing a transmission plate with desired electric conductivity and thermal conductivity to achieve thermal transfer and electric connection between the thermistor chip and the second transmission circuit.

Abstract: By correcting temperature measurements above a surface (such as the ground) for the first-order filtering associated with the thermal inertia of a temperature sensor (such as a thermocouple) that performed the temperature measurements, the heat flux conveyed from the surface by air can be accurately determined without requiring a calibration procedure. Instead, a predefined calibration value may be used. This predefined calibration value may be a function of a size of the temperature sensor and/or a distance between the temperature sensor and the ground. Moreover, the predefined calibration value may have a fixed value for a given size of the temperature sensor. In addition, the measurement of the heat flux conveyed from the surface can be used to accurately determine the residual heat flux that vaporizes water from the surface without a calibration procedure.

Abstract: A temperature measurement device includes a first surface temperature measurement part performing a measurement to be used as a first surface temperature; a first reference temperature measurement part performing a measurement to be used as a first reference temperature; a first external air temperature measurement part performing a measurement to be used as a first external air temperature: a second surface temperature measurement part performing a measurement to be used as a second surface temperature; a second reference temperature measurement part performing a measurement to be used as a second reference temperature; a second external air temperature measurement part performing a measurement to be used as a second external air temperature; a deep-part temperature computation part computing the deep-part temperature of a subject to be measured; and an external air temperature computation part computing the external air temperature of the external air.

Abstract: Temperatures in microelectronic integrated circuit packages and components may be measured in situ using carbon nanotube networks. An array of carbon nanotubes strung between upstanding structures may be used to measure local temperature. Because of the carbon nanotubes, a highly accurate temperature measurement may be achieved. In some cases, the carbon nanotubes and the upstanding structures may be secured to a substrate that is subsequently attached to a microelectronic package.

Abstract: The invention relates to a device for thermal adaptation, comprising at least one surface element arranged to assume a determined thermal distribution, said surface element comprising a first heat conducting layer, a second heat conducting layer, said first and second heat conducting layers being mutually thermally isolated by means of an intermediate insulation layer, wherein at least one thermoelectric element is arranged to generate a predetermined temperature gradient to a portion of said first layer. The invention also relates to an object such as a craft.

Abstract: The present inventions, in one aspect, are directed to a temperature sensing apparatus comprising a micromachined thermistor configured to output voltage and/or current signals which are/is correlated to an ambient temperature. The micromachined thermistor includes a micromachined thermistor structure suspended over and released from the substrate, wherein the micromachined thermistor structure includes a temperature dependent characteristic (e.g., resistance to an electrical current), and electrical contacts connected to the micromachined thermistor structure, wherein the electrical contacts are adapted to conduct the voltage and/or current signals. The apparatus, in one aspect, includes measurement circuitry, to generate data which is representative of the ambient temperature using the electrical resistance of the micromachined thermistor structure.

Abstract: Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.

Abstract: A fault diagnosis device conducts a fault diagnosis in a temperature sensor. At starting an internal combustion engine, a thermal equilibrium condition may be established and temperature deviations of temperatures detected by at least two reference temperature sensors from each other may be equal to or less than a predetermined value, with the temperatures detected by the reference temperature sensors being greatly deviated from one detected by a temperature sensor being diagnosed. In this case, if the temperatures detected by the reference temperature sensors do not drop by a predetermined temperature or more from starting the engine until a predetermined time elapses, the fault diagnosis device determines that the temperature sensor being diagnosed is faulty.

Abstract: An I/O circuit for measuring temperatures uses multiple cold-junction compensation sensors permanently affixed near the terminals of the terminal block in order to compensate significant temperature variation across the terminals of the I/O module (up to 3° C.) that can substantially affect the accuracy of thermocouple measurements. The use of these multiple sensors is enabled by a compensation system that corrects for the distance between the built-in sensors and the terminals, a multiplexer that accommodates the additional signal burden produced by the sensors, and a compensation system that allows low-cost sensors to be used and calibrated to as little as a single high accuracy sensor. In one embodiment, a third temperature sensor with relatively higher accuracy is used to compensate for lower accuracy of permanently affixed sensors.

Abstract: A method for monitoring at least two temperature sensors of a turbomachine that is aligned along a reference plane, the two temperature sensors being located in the same transverse plane of the turbomachine, the method including detecting the stoppage of the turbomachine; waiting for a period at least equal to a predetermined threshold period; measuring the temperature with each of the two temperature sensors; comparing the two temperatures measured.

Abstract: An instrumentation rake assembly comprises a rake tower capped at an immersed end and mated to a lead carrier at a base end. The rake tower comprises a curved wall oriented along a longitudinal axis and supporting a plurality of probe holders. The curved wall has an inner surface defining an internal passage for carrying instrumentation from the probe holders to the lead carrier. In another aspect, an instrumentation rake assembly comprises a plurality of rake towers, each having a base end and an immersed end, and each rake tower being coupled at its immersed end to one or more other rake towers.

Abstract: A circuit arrangement disposed on a substrate, in particular integrated onto a semiconductor chip, has at least two power components which are arranged adjacent one another and which are assigned at least one temperature sensor. For a number n of power components, at least n+1 temperature sensor elements are arranged on the substrate such that each of at least n?1 temperature sensor elements has an approximately equal distance to two power components, or each of the n power components has an approximately equal distance to two temperature sensor elements. An analyzing circuit is provided in order to detect an excess temperature. The analyzing circuit analyzes at least the two temperature sensor elements lying closest to a power component with respect to an excess temperature.

Abstract: A combination fire detection and fire suppression system may include a fire detection system configured to detect an undesirably high temperature associated with an area. The fire detection system may include a temperature sensor including a temperature sensor array and a fire alerting system associated with the temperature sensor. The fire alerting system may be configured to receive information from the temperature sensor and generate a warning signal based on an undesirably high temperature associated with the area. The fire detection system may include a fire control panel configured to receive the warning signal. The system may also include a fire suppression system including a fire suppressant delivery system configured to provide at least one fire suppressant agent to the area associated with the undesirably high temperature.

Abstract: A method to reduce large temperature over/undershoot in a computer system. Using workload data, the method proactively modifies controls of mechanical cooling system to anticipate power and take appropriate actions to maintain temperature. Workload control modifies workload and scheduling to reduce power transients and subsequent temperature deviations. In addition, workload control allows more even distribution of temp across chips, allowing for even wear and reduction of small/ripple/noise temp oscillations. A system and program product for carrying out the method are also provided.

Abstract: The specification discloses brewing apparatus and a method for testing for end of fermentation of a fermenting brew. It has been determined that, once fermentation is complete, the temperature of a brew (such as beer) shows a tendency to stratify in horizontal layers. However, the activity of fermentation disrupts the tendency of the brew to stratify. Accordingly, the brewing apparatus comprises at least two temperature sensors positioned to measure a temperature difference between the temperature at a first height of the brew and the temperature at a second height of the brew. End of fermentation is identified if the temperature difference is greater than a threshold difference.

Abstract: The present invention is directed to, inter alia, systems and methods for calculating a temperature associated with an analyte measurement component of a biosensing instrument (such as a blood glucose monitor), with a test strip that is inserted in a biosensing instrument, or both. The present systems and methods may employ at least two temperature sensors, and the acquired temperature information may be used to modulate data regarding an analyte in a biological sample, thereby providing a more accurate measurement of the analyte.

Abstract: A magnetic sensor inspection apparatus has a rectangular frame including a stage, a probe card, and a plurality of magnetic field generating coils. A wafer-like array of magnetic sensors is mounted on the stage, which is movable in horizontal and vertical directions. The probe card includes a plurality of probes which are brought into contact with a plurality of magnetic sensors encompassed in a measurement area. The magnetic field generating coils are driven to generate a magnetic field toward the stage. A plurality of magnetic field environment measuring sensors is arranged in the peripheral portion of the probe card surrounding the probes. A magnetic field controller controls magnetic fields generated by the magnetic field generating coils based on the measurement result of the magnetic field environment measuring sensors. Thus, it is possible to concurrently inspect a wafer-like array of magnetic sensors with the probe card.

Abstract: The invention relates to a zero heat flux temperature sensing device (100) for sensing a core body temperature of an object (113). The zero heat flux temperature sensing device (100) comprises a layer (107), a first temperature gradient sensor (105), a first heat flux modulator (103) and a heat flux modulator controller (102). The layer (107) has an opposing first side (112) and second side (108). In use the first side (112) is nearest to the object (113). The layer (107) is for obtaining a first temperature difference over the layer (107) in response to a first heat flux in a first direction from the first side (112) to the second side (108). The first temperature gradient sensor (105) senses at the first side (112) of the layer (107) a second temperature difference in a second direction. The second direction extends from a first border of the first side (112) towards a second border of the first side (112).

Abstract: A diverse and redundant resistance temperature detector (“D&R RTD”) is provided. The D&R RTD is utilized in obtaining temperature readings in environments, such as fluids and gasses, by measuring electrical characteristics of the D&R RTD that are influenced by the temperature. Furthermore, the D&R RTD's are arranged such that a plurality of measurements can be obtained, which provides sufficient diversity and redundancy of the measurements for enhanced diagnostics to be performed, such as optimization for fast dynamic response, calibration stability, in-situ response time testability, and in-situ calibration testability.

Abstract: A calibration apparatus for temperature probes comprising an elongate calibration chamber (1) with an opening (2) for receiving an insert (3) that has passages (4) for receiving temperature probes (6), and wherein the chamber (1) has several heat energy elements (-11) that are controlled by temperature probes (12-14). In the insert as such one or more external probes (7) are provided, each of which has one or more temperature sensors to the effect that at least two sensors (19, 20 or 15, 17) are provided at respective dissimilar distances to an end of the insert (3). The latter sensors are connected to electronic regulation (20, 23) and measurement units (21, 24) for regulating the supply of power to the heat energy elements.

Abstract: A portable temperature sensing probe having a plurality of thermocouples is inserted into a tank mounted on a truck or other receptacle at the time of loading a hot liquid, e.g., molten sulfur. The probe and at least a portion of the associated wiring or leads are attached to the loading pipe and/or discharge nozzle, and the probe is inserted into the interior of the tank before the molten sulfur is discharged. The signals from the plurality of thermocouples are amplified and the corresponding temperature information is transmitted to a display and control device. Due to the significant differential between the temperature of the rising molten sulfur and the vapors in the tank overhead space, the signals generated indicate which of the thermocouple are in contact with molten sulfur or the vapor zone. The generated signals adjust the shut-off valve that controls the flow of molten sulfur into the tank.

Abstract: Flexible circuits 2, 3 are formed on a flexible insulating sheet 1. A thermal sensor 4 is connected between the circuits 2, 3. The thermal sensor 4 and connecting parts 5 are integrally covered with an elastic insulating resin 6. While the insulating sheet 1 is bent together with the insulating resin 6, the thermal sensor 4 is pushed onto an object to be sensed 8 via the insulating sheet 1. A plurality of thermal sensors 4 are connected in series in a longitudinal direction of the insulating sheet 1. The insulating resin 6 covers the thermal sensors 4 and the connecting parts 5.

Abstract: A thermal measurement system that includes a light collection device and a detection system in communication with the device. The detection system includes two detection subsystems, wherein one subsystem is configured to detect light from a surface of an object, while the other subsystem is configured to detect light from the surface and a gas. The present invention has been described in terms of specific embodiment(s), and it is recognized that equivalents, alternatives, and modifications, aside from those expressly stated, are possible and within the scope of the appending claims.

Abstract: A temperature measurement device includes a first surface temperature measurement part performing a measurement to be used as a first surface temperature; a first reference temperature measurement part performing a measurement to be used as a first reference temperature; a first external air temperature measurement part performing a measurement to be used as a first external air temperature; a second surface temperature measurement part performing a measurement to be used as a second surface temperature; a second reference temperature measurement part performing a measurement to be used as a second reference temperature; a second external air temperature measurement part performing a measurement to be used as a second external air temperature; a deep-part temperature computation part computing the deep-part temperature of a subject to be measured; and an external air temperature computation part computing the external air temperature of the external air.

Abstract: A predefined mathematical relationship that is stored in the memory of a computing system is accessed, wherein the relationship refers to temperatures of a number of points in the system, wherein the points together define a zone. The mathematical relationship yields a representative temperature for the zone. Temperature data from sensors in the system is obtained and applied to thermal models, to estimate the temperatures of at least some of the points that define the zone. The representative temperature for the zone is computed using the estimated temperatures as input to the mathematical relationship. A decision is then made on whether or not to change a power consuming activity limit in the system, based on the computed representative temperature. Other embodiments are also described and claimed.

Abstract: In a device and method for taking temperature readings on an HVAC system, a first probe is connectable in thermal communication with the HVAC system for taking a first temperature reading thereof. A second probe is connectable in thermal communication with the HVAC system for taking a second temperature reading thereof that is independent of the first temperature reading. A digital display is connectable to the first and second probes for displaying the first and second temperature readings.

Abstract: A method of and associated device for measuring temperature of an internal surface of a pipe, including: a) at least one temperature-sensitive element that is moved away from a probe, radially with respect to the fore-and-aft axis of the pipe, so as to bring the temperature-sensitive element(s) into contact against the internal surface of the pipe, b) wherein the contact force applied between the sensitive element(s) of the probe and the internal surface is increased until the contact force reaches a defined value at any point on the surface.

Abstract: The fastening apparatus for fastening elements includes a combustion chamber, a housing for a gas cartridge, means for injecting gas from a cartridge into the combustion chamber and a management module. An engine thermistor is provided to be subjected to the temperature of the chamber, as well as a second cartridge thermistor intended to be subjected to the temperature of the gas cartridge disposed in the cartridge housing. Both thermistors are mounted for transmitting their temperature information to the management module. The management module is operable for managing temperature information and determining the opening time of the injection means.

Abstract: A controller and method for controlling the temperature of a steam room. The controller comprises a backing plate and a housing that serves as a moisture barrier. The housing comprises an overlay portion and mounts to the backing plate. A circuit board is mounted to the backing plate. One or more primary temperature sensors are mounted to the circuit board and located within the housing, are spaced above the circuit board, and are biased against the overlay portion. One or more secondary temperature sensors are located within the housing to sense a temperature of a backside of the respective one of more primary temperature sensors wherein an estimation of a temperature of the steam room is obtained.

Abstract: A system for in-place visualization of sensed data is provided. The system includes a formable sheet comprising a display and sensors embedded within the sheet underneath the display. The display will display information relating to sensed data on a portion of the display corresponding to locations of the sensors located underneath the display. As a result, the display displays the information above or directly above the sensors that output data.

Abstract: A heat treatment apparatus includes: a furnace body including a heating part; a processing vessel wherein a space having a plurality of regions is formed between the furnace body and the processing vessel; an in-furnace temperature sensor disposed corresponding to each of the plurality of regions in the space; an in-furnace temperature calculating unit configured to calculate an in-furnace temperature based on signals from each of the in-furnace temperature sensors; and a control unit configured to control the heating part based on the in-furnace temperature calculated by the in-furnace temperature calculating unit. The in-furnace temperature sensor disposed in the reference region includes: a first thermocouple formed of an R thermocouple or an S thermocouple; and a second thermocouple formed of a thermocouple other than the R thermocouple or the S thermocouple. The in-furnace temperature sensor disposed in the other region includes the second thermocouple.

Abstract: A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.

Abstract: A measuring device for a heat exchanger includes a pressure pipe arrangement that is spaced using webs and that has a heating side and an isolation side and that is implemented with at least one heat flow sensor. A heat flow sensor is arranged on the heating side in such a way that at least two temperatures T1 and T2 and the temperature difference thereof can be detected there, and additionally at least one temperature sensor for measuring a temperature T3 is arranged on the isolation side and at a distance to the heat flow sensor.

Abstract: The invention relates to a method and arrangement for measuring at least one physical magnitude, such as temperature, flow or pressure of the cooling fluid flowing in an individual cooling element cycle (3) of a cooling element (1) in a metallurgical furnace. The arrangement includes a supply header (2) for distributing the cooling fluid and for feeding it to the cooling element cycles (3) of the cooling elements (1), and a collection header (4) for collecting and receiving cooling fluid from the cooling element cycles (3) of the cooling elements (1). The arrangement includes a survey line (5) that is by intermediation of a valve arrangement (6) in fluid connection with at least one cooling element cycle (3), so that the cooling fluid is conducted alternatively through the survey line (5) to the collection header (4) or past the survey line (5) to the collection header (4).

Abstract: A device for detecting temperature variations of the substrate of an integrated circuit chip, including, in the substrate, implanted resistors connected as a Wheatstone bridge, wherein each of two first opposite resistors of the bridge is covered with an array of metal lines parallel to a first direction, the first direction being such that a variation in the substrate stress along this direction causes a variation of the unbalance value of the bridge.

Abstract: An ice detection system, in particular to a system for detecting icing conditions and a system for detecting the presence of ice formed on a structure, and the methods for doing the same. Two heaters of the ice protection system (experiencing substantially the same environmental conditions) are driven to different temperatures (the first greater than or equal to 0° C., and the second less than 0° C.). The difference in the powers required to drive the two heaters indicates the prevailing environmental conditions. A heater of the ice protection system is driven and the rate of change of surface temperature is measured over several periods. A substantial deviation from a rate of change of surface temperature, which indicates the presence of ice on the surface of the structure, is detected.

Abstract: A system and method are disclosed wherein differential heat transfer resistances are used to effectively and efficiently detect the early onset of deposit accumulation in industrial fluid processes and fluid transport vehicles. According to one embodiment, a probe is provided in conjunction with a heat source, a water source and a probe. The probe is comprised of a heat transfer surface, a first part of which is covered only by a thin metal layer. The second or remaining portion of the heat transfer surface is covered by a heat flux sensor and a thin metal layer. The metal layers of both the first and second areas of the probe are connected, and water flows across the full heat transfer surface. Deposition forms on a portion of the heat transfer surface as a result of slow water flow and elevated water temperature. The temperatures of the heat source, water source, and heat flux are measured. The deposition rate as a rate of change of heat transfer resistance is measured.

Abstract: A method of using a temperature sensor to determine the temperature of an object is described. The method comprises bringing the temperature sensor into thermal contact with the object to be measured. The temperature sensor is then used to acquire a plurality of temperature readings, the plurality of temperature readings being acquired prior to the temperature sensor reaching thermal equilibrium with the object. At least some of the plurality of temperature readings are then used to determine a pseudo-stable temperature at which the rate of change of temperature readings with time is less than a predetermined rate. The actual temperature of the object may then be predicted from the pseudo-stable temperature.

Abstract: Systems and methods for dissipating heat generated during an electrical function are disclosed. In particular, the disclosed systems and methods can be used for dissipating heat generated during low impedance measurement on a multimeter. In some embodiments, the multimeter can include a first thermistor coupled in series with a resistor in a measurement path, a second thermistor, and a switch coupled to the measurement path and the second thermistor for selectively including the second thermistor in the measurement path during a low impedance measurement.

Abstract: A device for analyzing a beam profile of a laser beam includes a carrier plate, a plurality of first temperature-sensitive measuring elements, in particular diodes, which are arranged in a preferably matrix-like arrangement on a first side of the carrier plate at a plurality of measuring locations, and a plurality of second temperature-sensitive measuring elements, in particular diodes, which are arranged in another preferably matrix-like arrangement on a second side of the carrier plate. One of the first measuring elements is arranged in each case opposite one of the second measuring elements and is thermally coupled to the first measuring element using strip conductors which extend through the carrier plate. Such a device can be included in a laser processing machine and used in an associated method for analyzing a beam profile of a laser beam.

Abstract: According to certain embodiments, an electro-magnetic radiation detector includes a sensor coupled to multiple nanostructures and an electro-magnetic radiation indicating device. The nanostructures are adapted to absorb electro-magnetic energy and generate heat according to the absorbed electro-magnetic energy. The sensor is adapted to measure the heat generated by the plurality of nanostructures and to generate a first signal according to the measured heat. The electro-magnetic radiation indicating device is operable to receive the signal from the sensor and indicate a level of electro-magnetic energy absorbed by the plurality of nanostructures according to the received signal.

Abstract: An array element for a temperature sensor array circuit. The array element includes a switch transistor; and a temperature sensor element having an impedance which varies as a function of temperature, the temperature sensor element being connected in parallel with a source and drain of the switch transistor.