Abstract: An automated test equipment (ATE) includes a test interface board assembly. The test interface board includes a socket configured to provide electrical couplings from the test interface board to a device under test (DUT). The socket is further configured to accept an active thermal interposer (ATI) device while the DUT is disposed in the socket. The socket includes a plurality of spring-loaded roller retention devices configured to retain one or more devices in the socket. The ATE further includes a Z-axis interface plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the DUT into the socket and an ATI placement plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the ATI device into the socket.

Abstract: A low thermal conductivity fixed thermocouple with a heat sink package specifically designed for electrically heated vacuum furnaces having an overall cylindrical hot zone diameter of 36 inches or less, and preferably containing all metal reflective radiation shields or graphite felt insulation packages that experience high conductive losses in the low temperature ranges during vacuum heating which result in large discrepancies between the furnace temperature readings and the actual workload temperature.

Abstract: An inspection method for a heatsink according to the present disclosure includes a measurement preparation step of placing the heatsink in a place where radiated-heat quantities can be measured by first and second thermal sensors, each of the first and second thermal sensors including a temperature sensor and a heat-concentrating mirror with a heat-receiving surface curved in a concave shape, the first and second thermal sensors being disposed in different places in a state where a heat-receiving line is inclined from a direction in which the fin protrudes by a predetermined angle, a measurement step of acquiring first and second radiated-heat quantities from the first and second thermal sensors, respectively, and a determination step of determining that a coating state of the coating is fine when a total value of the first and second radiated-heat quantities is larger than a predetermined range defined in advance.

Abstract: A double temperature sensor with a receiving element for measuring a near-surface temperature of the ambient air and the skin surface. The double temperature sensor with a receiving element includes an insulating block, two temperature sensors and a receiving element. At least the receiving element (8) and/or the insulating block (4) are designed in terms of the material structure such that the horizontal heat conduction is low compared to the vertical heat conduction.

Abstract: An electronic device according to the present invention includes: at least one heat sensing section (13), which includes a first contact portion (24) and of which a physical property varies responsive to an incoming infrared ray; a detector circuit section, which includes a second contact portion (42) and which senses the variation in the physical property of the heat sensing section (13); and a driving section (112), which is able to change a first state, in which the first and second contact portions (24, 42) are in contact with each other and electrically connected to each other, into a second state, in which the first and second contact portions (24, 42) are out of contact with each other and electrically disconnected from each other, and vice versa.

Abstract: A temperature sensing system for a flange mounted device is provided. The temperature sensing system (100) can be comprised of a flexible wiring board (102). The temperature sensing system can be further comprised of a temperature sensing device (122) mounted to the flexible wiring board. The flexible wiring board can have one or more conductive traces (114a, 114b, 114c) disposed thereon. The conductive traces can form an electrical connection with the temperature sensing device. The temperature sensing system can also comprise a thermal pad directly connected to the temperature sensing device. The thermal pad can be formed of a thermal conductor. The thermal pad can also have a thermal contact surface. The thermal contact surface can be sized and shaped for direct physical contact with a portion of the device (302), wherein thermal energy is communicated directly from the thermal pad to the temperature sensing device. A method for sensing a temperature of a flange mounted device is also provided.