For Reducing Thermal Inertia (epo) Patents (Class 374/E1.022)
  • Patent number: 12154798
    Abstract: A temperature measurement unit includes a measurement substrate on which a sensor configured to measure a temperature is mounted, an information processor configured to acquire a result of detection by the sensor, and a cable connecting the sensor and the information processor to each other. The information processor is configured to be detachably installed on an installation part facing a heating area provided with a hot plate, with a cooling area interposed therebetween. The cable is configured to be able to follow movement of the measurement substrate when a cooling plate on which the measurement substrate is placed is moved from the cooling area to the heating area and the measurement substrate is placed on the hot plate in a state in which the information processor is installed on the installation part.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: November 26, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Yutaka Mizobe
  • Patent number: 10871404
    Abstract: A thermal sensor includes a first resistor and a first capacitor. The first resistor is a thermistor. A first current source is coupled to the first resistor and the first capacitor. The first current source alternately charges the first resistor and the first capacitor each to a reference voltage, Vtherm. An output of the thermal sensor is a function of a resistance-capacitance (RC) time constant of the first resistor and the first capacitor.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: December 22, 2020
    Assignee: Birad—Research & Development Company Ltd.
    Inventors: Anatoli Mordakhay, Joseph Shor