Abstract: In a hydrogen tank, discharge of a hydrogen gas may cause lowering of the temperature to a value at which it is assumed that disconnection has occurred in a thermistor. A temperature detection system for the hydrogen tank estimates the possibility that the temperature of the hydrogen tank is below this temperature value, according to the ambient temperature and the internal pressure. Only when there is no possibility that the temperature is below the value, disconnection is judged to have occurred.

Abstract: A technique for an infrared radiation thermometer used for thermography detects measurement abnormality of the infrared radiation thermometer and estimates the causes of the measurement abnormality such as contamination of an objective lens and a malfunction in a mechanism section of the infrared radiation thermometer.

Abstract: A method and apparatus for automated field calibration of temperature sensors uses a series of readings including a reading of a known source, such as an LED, for use in calculating a factor that is compared to a reference for adjusting the sensor output signal. Calibration readings are taken more frequently after start up to compensate for sensor drift during storage, as opposed to less frequent readings during operation to compensate for slower sensor drift while operational.

Abstract: The present invention relates to an optical fiber temperature sensor capable of reducing an error in a temperature measurement. The sensor comprises an optical fiber, an optical frequency difference adjusting section, a light source system, a spectrum measuring section, a temperature calculating section, and a correcting section. The light source system outputs, into different ends of the optical fiber, probe light and pumping light of which each center frequency is set corresponding to an instruction from the optical frequency difference indicating section respectively. The temperature calculating section calculates a temperature of an object based on BGS in a first domain measured by the spectrum measuring section. On the other hand, the correcting section outputs a correction instruction to the light source system so that BGS center frequency of a second domain may be in agreement with a reference value thereof.

Abstract: A method for measuring temperature of a rotating body such as a steam turbine is provided. The method includes striking a light beam onto the rotating body onto the rotating body and measuring a reflectance of the light beam from the rotating body. The method further includes obtaining a temperature of the rotating body based upon the measured reflectance.

Abstract: A temperature calibration device uses Peltier cells for heating and cooling. The Peltier cells are connected to a relay that connects the cells to each other in one configuration for heating and a different configuration for cooling. The Peltier cells also receive supply voltages having different magnitudes and polarities for heating and cooling. By changing the manner in which the Peltier cells are connected to each other and using different supply voltages for heating and cooling, the cells are able to operate closer to their specified maximum temperature differential without sacrificing the useful life of the cells.

Abstract: The present invention relates to a method of measuring a temperature and/or temperature distribution at a resolution <1 &mgr; m in an object and to a device for performing such method, more particularly to a microscope for performing such method. The method comprises applying a molecular thermometer embedded in a matrix layer on an object, photoexciting the said molecular thermometer with a light source of said microscope and measuring emission of radiation from said molecular thermometer with two photodetectors of said microscope. A first intensity at a first wavelength is measured by said first detector, a second intensity at a second wavelength is measured by said second.detector, and a ratio of said intensities is calculated and used to determine a temperature with a calibrated curve. Said microscope is a confocal microscope or a stimulated emission depletion (STED) microscope.

Abstract: A method enables measurement of an inverter loss within a motor control circuit for an appliance. The method includes applying a constant DC current generated from a first AC supply voltage to a motor winding through an inverter at a first duty cycle, measuring a first voltage corresponding to the current through the motor at a motor current sense resistor, computing a first ratio of the first measured voltage at the motor current sense resistor to a first DC input voltage corresponding to the first AC supply voltage, identifying a second duty cycle from the first computed ratio, comparing the second duty cycle to the first duty cycle, and identifying a first inverter loss factor from the difference between the first duty cycle and the second duty cycle.

Abstract: A method for on-orbit calibration of the temperature sensors of a simulated blackbody is disclosed. The method may include selecting a simulated blackbody traveling in a micro-gravity environment and comprising a sensor, a container positioned proximate the senor and containing a material, and a heat transfer device positioned proximate the at least one container. The heat transfer device may transition the material through a phase change. The temperature sensor may monitor the temperature of the material during the phase change. A correction may be calculated to correct any disparity between the temperature reported by the temperature sensor during the phase change and the known plateau temperature corresponding to that phase change. The correction may be applied to subsequent temperature readings obtained using the temperature sensor.

Abstract: Temperature sensing circuitry is used for thermal management of an electronic device. The temperature sensing circuitry includes at least one thermistor placed at or near a component of the electronic device. The temperature sensing circuitry also includes a high-precision resistor for calibration purposes. The resistance of the resistor is equivalent to the resistance of the thermistor at a reference temperature. A calibration reading is obtained using a set current that is being passed through the resistor. An error present in the temperature sensing circuitry is determined based on the calibration reading and a design value. A temperature measurement associated with the component is then made using the thermistor, while the set current is being passed through the thermistor. The error is corrected in the temperature measurement of the component. Other embodiments are also described.

Abstract: To provide a fluorescent temperature sensor capable of identifying easily the location of a failure. A fluorescent temperature sensor for producing a temperature signal from fluorescent light from a fluorescent material and that has been optically stimulated comprises a light projecting module having an LED for projecting light at the fluorescent material and a second photodiode for receiving light emitted from the LED and a light receiving module having a first photodiode for receiving the light emitted from the fluorescent material, where the location of a failure in the sensor can be identified based on, at least, the output signal from the second photodiode.

Abstract: The presently described embodiments are directed to a calibration method and system for thin film thermistors that are locally heated with integrated thin film heaters. Initially, print head temperature is either measured or referenced. Then, transient thermistor resistances are measured and used to determine the thermistor resistance at a higher temperature. Notably, this calibration method is advantageously implemented as a step of an existing process without having to expose the print heads to operating temperatures. In some implementations of the presently described embodiments, trimming of the thermistors may be required once calibrated.

Abstract: A device for calibrating a fiber-optic temperature measuring system has a broadband light source, a coupling-in device, which can couple light generated by the light source for calibration into an optical fiber of the temperature measuring system, a coupling-out device, which can couple components of the light source-generated light that are backscattered in the optical fiber out of the optical fiber. An evaluation device performs a calibration of the temperature measuring system on the basis of the backscattered components of the light.

Abstract: Methods and apparatus for wafer temperature measurement and calibration of temperature measurement devices may be based on determining the absorption of a layer in a semiconductor wafer. The absorption may be determined by directing light towards the wafer and measuring light reflected from the wafer from below the surface upon which the incident light impinges. Calibration wafers and measurement systems may be arranged and configured so that light reflected at predetermined angles to the wafer surface is measured and other light is not. Measurements may also be based on evaluating the degree of contrast in an image of a pattern in or on the wafer. Other measurements may utilize a determination of an optical path length within the wafer alongside a temperature determination based on reflected or transmitted light.

Abstract: The object of the invention is to provide a method of calibrating an optical FMCW backscattering measurement system that improves the precision of the measurement. The problem is solved by a method comprising the steps of A. Converting said received sensor signal to a complex received electrical signal as a function of said modulation frequency fm, said complex received electrical signal being represented by a magnitude part and a phase angle part as a function of said modulation frequency fm; B. Performing a transformation of said received electrical signal to provide a backscattering signal as a function of location between said first and second ends of said sensor and beyond said second end; C. From said backscattering signal as a function of location determining characteristics of a curve representative of said backscattering signal beyond said second end; D.

Abstract: A sensor device formed on a semiconductor substrate. The device comprises a thermal radiation sensor including a sensing cell and a referencing cell which are co-operable for providing a first output signal indicative of the temperature fluctuation resulting from incident radiation. A gradient sensor including a pair of cells spatially located on the semiconductor substrate is provided which are co-operable to provide a second output signal indicative of the temperature gradient across the semiconductor substrate for facilitating calibrating the first output signal. At least one of the cells of the gradient sensor is not common to the cells of the thermal radiation sensor.

Abstract: An apparatus for ascertaining and/or monitoring at least one temperature. The apparatus includes, according to a first variable, at least one temperature sensor, at least one reference temperature sensor, and at least one heating/cooling unit, which is thermally coupled with the temperature sensor and with the reference temperature sensor. According to a second variant, the invention includes that at least one reference temperature sensor, and the temperature sensor and the reference temperature sensor are embodied and placed in such a manner that they measure essentially the same temperature. At least one head transmitter is provided, which connects the temperature sensor and the reference temperature sensor with the head transmitter in such a manner that the head transmitter receives the data measured by the temperature sensor and the reference temperature sensor. At least one memory unit is provided, in which the measured data of the temperature sensor and the reference temperature sensor are storable.

Abstract: Circuitry is disclosed for the calibration of heating element and ambient temperature sensors, comprising: a) an amplifier having positive and negative inputs, and an output; b) one or more heating MOS transistors selectably coupled in parallel and having 1) a heating transistor drain coupled to the positive input of the amplifier; 2) a heating transistor source configured to receive a supply voltage; and 3) a heating transistor gate coupled to the amplifier output; c) one or more ambient MOS transistors selectably coupled in parallel and having 1) an ambient transistor drain, 2) an ambient transistor gate coupled to the amplifier output; and 3) an ambient transistor source configured to receive the supply voltage; d) a temperature difference resistance configured: 1) to be coupled at least partially between an ambient connection and the ambient transistor drain; and 2) to be coupled at least partially between the ambient connection and the negative input of the amplifier.

Abstract: A temperature sensor diagnostic system for a vehicle comprises a deviation calculation module, a limits determination module, and a fault diagnostic module. The deviation calculation module calculates a deviation coefficient based on a time constant of a temperature sensor and a period between first and second temperatures measured by the temperature sensor, wherein the second temperature is measured after the first temperature. The limits determination module determines upper and lower temperature limits based on the first temperature and the deviation coefficient. The fault diagnostic module selectively diagnoses a fault in the temperature sensor when the second temperature is one of greater than the upper temperature limit and less than the lower temperature limit.

Abstract: In one example embodiment, a board for measuring device temperatures comprises a base and one or more fingers extending from the base. The base and the one or more fingers comprise a flexible material. One or more first temperature sensors are disposed on the one or more fingers. One or more second temperature sensors are disposed on the base. Each of the first and second temperature sensors comprises a partially thermally isolated temperature sensor.

Abstract: This invention relates a method to use a bipolar transistor as temperature sensor and/or self-calibrated thermometer which is immune to errors generated by parasitic elements as resistances and ideality factors and their evolution. In this invention the product of the collector current values ICmi(VEBmi) as a function of the emitter-base forward bias voltage VEBim; ICi(VEBi)×exp(?qVEBi/kT0) is plotted as a function of the emitter-base forward bias voltage VEBim. T0 is a parameter which ensures that a region of the above mentioned plot results with a slope equal to zero, while simultaneously represents the transistor absolute temperature at the moment at which the collector current ICmi is obtained as a function of the forward bias VEBmi.

Abstract: Methods and systems for calibrating a temperature control system in a vapor deposition chamber. A temperature sensor senses temperature within a semiconductor processing chamber and generates an output signal. A temperature control system controls a chamber temperature by controlling a heating apparatus based on the output signal. A method includes instructing the control system to target a setpoint temperature, and depositing a layer of material onto a surface in the chamber by a vapor deposition process. A variation of a property of the layer is measured while depositing the layer, the property known to vary cyclically as a thickness of the layer increases. The measured property is allowed to vary cyclically for one or more cycles. If there is a difference between a time period of one or more of the cycles and an expected time period associated with the setpoint temperature, the temperature control system is adjusted based on the difference.

Abstract: A method of calibrating an adjustable control device using a knob assembly with adjustable temperature scale. A knob and a bezel that bears the temperature scale are assembled and the temperature scale is calibrated without physically changing any internals within the adjustable control device. The knob and bezel are secured to the adjustable control device so that the knob and bezel assembly can transmit an input load from a user through to the adjustable control device and so that the bezel can be rotated relative to the knob which remains fixed to an input shaft of the control for calibration purposes.

Abstract: In a method for monitoring the functionality of a temperature sensor that can deliver an electrical signal as a function of the measured temperature and is disposed, in particular, in the cooling water circuit of an internal combustion engine, the persistence of the temperature sensor in the high signal range is made possible by a method encompassing the following steps: Characterizing the sensor as possibly faulty if the sensor indicates, upon engine shutdown, at least a maximum value of the cooling fluid temperature; determining a first gradient of the cooling fluid temperature, measured by the possibly faulty sensor, up to a first point in time after engine shutdown, and characterizing the sensor as fault-free if the gradient exceeds a minimum value; determining a second gradient of the cooling fluid temperature, measured by the possibly faulty sensor, between the point in time and a point in time after engine shutdown, and characterizing the sensor as fault-free if the second gradient exceeds a minimum va

Abstract: A method and apparatus are provided for calibrating digital thermal sensors. A processor chip with a plurality of digital thermal sensors receives an analog voltage. A test circuit coupled to the processor chip receives a clock signal and a register coupled to the test circuit outputs a value on each clock cycle to a digital thermal sensor in the plurality of digital thermal sensors. The digital thermal sensor transitions an output state in response to the value of the register received in the digital thermal sensor equaling a temperature threshold of the digital thermal sensor. The value of the register at the point of transition is used to calibrate the digital thermal sensor. An incrementer increments the value of the register on each clock cycle in response to the value of the register received in the digital thermal sensor failing to equal the temperature threshold of the digital thermal sensor.

Abstract: A system and method is disclosed that reliably determines the transmissivity of a substrate. By determining the transmissivity of a calibration substrate, for instance, a temperature measuring device can be calibrated. The method and system are particularly well suited for use in thermal processing chambers that process semiconductor wafers used for forming integrated circuit chips.

Abstract: Temperature detection circuitry is selectively coupled to a thermistor and one of two sources representing the impedance at respective ends of the expected range of temperature to which the thermistor is to be exposed. The offset of an amplifier and a scale factor to account for gain set of the amplifier are determined in an automatic calibration process while coupled to the source(s), and thereafter temperature readings are taken from the thermistor. During the calibration process, if the gain or scale factor are outside of expected ranges, a failure is determined and an alarm given and/or a heater is disabled.

Abstract: Disclosed are embodiments of an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.

Abstract: An improved method and apparatus for setting a trip-point temperature value for detection of an over-temperature condition in a chip when a reading from a main temperature sensor exceeds the trip-point temperature value. In one embodiment, the trip-point temperature value is set to a known temperature limit value offset by a temperature difference, ?T. ?T is calculated by taking the difference between a reading of the main temperature sensor and a reading of another temperature sensor, remote from the main temperature sensor, while a heat-generating circuit is enabled. The main temperature sensor is distal from heat-generating circuit on the chip and the remote temperature sensor is proximate the heat-generating circuit. For multiple heat-generating circuits on the chip, a ?T is determined for each of the heat-generating circuits, and the largest ?T is used to calculate the trip-point temperature value. Advantageously, the largest ?T determination may be done only once.

Abstract: There are occasions when an intermittent abnormality occurs in a water temperature sensor that is of a type that does not cause a sudden change in a detection value of the water temperature sensor. The movement of the detection value of the water temperature sensor when this type of abnormality occurs may be, for example, a movement in which the detection value of the water temperature sensor becomes lower even through warm up has been proceeding after engine start up has begun. When this type of movement of the detection value occurs, if the detection value of the water temperature sensor reduces, after engine start up has begun, to a value lower than that when start up began, it is immediately determined based on this fact that an abnormality of the water temperature sensor is occurring.

Abstract: A temperature sensor and device and system including same comprise a switched capacitor circuit configured to generate a noise voltage in response to switching and circuitry configured to generate a relative temperature output signal proportional to an absolute temperature output signal in response to the noise voltage. The device includes a temperature sensors temperature sensitive device logic and temperature compensation logic configured to receive the absolute temperature and generate an adjustment signal to adapt the temperature sensitive device logic in response thereto. A related method for sensing temperature includes amplifying a noise voltage from a switched capacitor circuit in a plurality of parallel amplifier channels and removing amplifier noise from each of the plurality of parallel amplifier channels to form a relative output signal proportional to an absolute temperature.

Abstract: Certain exemplary embodiments can provide a system, which can comprise a thermocouple input module. The thermocouple input module can be adapted to determine one or more calibration factors. The thermocouple input module can be adapted to store the calibration factors. The thermocouple input module can be adapted to apply the calibration factors to an incoming thermocouple voltage value to obtain an adjusted thermocouple voltage value.

Abstract: A controller of a hob is connected to a temperature sensor of a radiation based heating element. In principle, two different groups of temperature sensors can be used, whose resistance values differ by approximately a factor of three. When the hob is first used, the resistance of the temperature sensor is measured at room temperature and is classified in one of the two groups of temperature sensors on the basis of a limit value between the two typical temperature profiles of the groups of temperature sensors. On the basis of this, calibration of the controller is carried out for the purpose of adjusting to the established group to which the temperature sensor belongs.

Abstract: A temperature detection circuit includes a first voltage source circuit to generate a first voltage having a temperature dependence by utilizing a work function difference of gate electrodes of a plurality of field effect transistors, a second voltage source circuit to generate a reference voltage having no temperature dependence by utilizing a work function difference of gate electrodes of a plurality of field effect transistors, a correction circuit configured to correct the reference voltage and output a corrected voltage, and a subtraction amplifier configured to subtract the corrected voltage from the first voltage, amplify a resulting subtracted voltage, and output a resulting amplified voltage as a correction voltage signal to adjust a temperature coefficient of the correction voltage signal.

Abstract: To calibrate a thermocouple, a calibrating thermocouple, made of the same thermocouple material as a detecting thermocouple, is used. An absolute thermoelectric power Ero, of the calibrating thermocouple is determined in advance, and the detecting thermocouple is assumed to have the same Ero. An internal resistance rs of the detecting thermocouple is obtained, and a short-circuit current Is is measured with a measured temperature difference ?Ts using an operational amplifier, and the temperature difference ?Ts is calculated. An offset of the operational amplifier is also calibrated. The thermocouples and switches are connected to an inverting input terminal of the operational amplifier, so that the sensors can be selected. Alternatively, these are connected to a non-inverting input terminal, allowing a plurality of the thermocouples to be switched, while a small resistor r is connected to the inverting terminal thereof, to provide an equivalent current detection type thermocouple.

Abstract: A TGT measurement system comprises a plurality of thermocouples connected in parallel to a distributor, and a data storage device carrying calibration data relating to at least one of the thermocouples.

Abstract: When it is predicted that an engine is going to be started in the near future, a heater portion of an air flow meter is energized so as to be heated in advance. Prior to the pre-heating, an intake air temperature is sensed by a temperature sensing portion of the air flow meter. After completion of start-up of an intake air temperature sensor, a difference between the intake air temperature sensed by the intake air temperature sensor and the previously sensed intake air temperature is obtained. When the difference is above a predetermined value, it is judged that the intake air temperature sensor or the air flow meter is in an abnormal condition.

Abstract: Methods and apparatus for distributed temperature sensing (DTS) along a single mode or multimode optical waveguide or fiber include a calibration of initial Brillouin-based DTS measurements using Raman-based DTS measurements to enable accurate subsequent Brillouin-based DTS measurements. Such calibration may occur while the fiber is deployed in the environment in which temperature is to be sensed and thereby corrects influences on Brillouin scattered light from stress or strain along the fiber. Further, calibration may utilize one or more discrete temperature sensors to correct errors in one or both of the Brillouin-based DTS measurements and the Raman-based DTS measurements.

Abstract: A method and an article of manufacture are provided to monitor a temperature sensing circuit and detect a fault therein. The method comprises monitoring sensor readings output from a plurality of temperature sensing circuits. An average sensor reading is determined, calculated from the sensor readings output from a subset of the temperature sensing circuits. Each of the sensor readings is compared to the average sensor reading. A fault is identified when one of the sensor readings deviates from the average sensor reading by an amount greater than a threshold, more particularly when one of the sensor readings deviates from the average sensor reading by an amount greater than the threshold at least a quantity of X times out of Y sensor readings.

Abstract: The invention relates to a method for detecting an abnormality of a temperature sensor. A plurality of temperature sensors are preliminarily grouped for each of predetermined attachment areas of a machine tool, and after a temperature of each part is measured in S1, the detected temperatures are classified in S2 for each of the grouped attachment areas, and then sorted in descending order in S3. Subsequently, a difference ?T between any closest two of the detected temperatures is obtained in S4, and then compared with a preset limit value ? in S5, when ?T exceeds the limit value ?, temperature sensors in a corresponding attachment area are determined abnormal in S6, and an alarm is displayed.