Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

Abstract: An electromechanical microsystem including two electromechanical transducers, a first deformable diaphragm and a cavity hermetically containing a deformable medium keeping a constant volume under the action of a change in the external pressure. The first diaphragm forms at least one portion of a first wall of the cavity and has a freely deformable area. The free area cooperates with an external member so that its deformation induces, or is induced by, a movement of the external member. The electromechanical transducers are configured so that a first electromechanical transducer forms a portion of the first wall of the cavity, and a second electromechanical transducer forms at least one portion of the wall opposite to the first wall of the cavity.

Abstract: An electrostatic transducer, a diaphragm (2) therefor, and corresponding methods of manufacture are disclosed. The electrostatic transducer is preferably for use in a motor vehicle. A composite laminated diaphragm (2) is manufactured by providing a first insulating layer (4), providing a conductive layer (6) on a surface of the first insulating layer (4), and bonding a second insulating layer (10) to the conductive layer (6) such that the second insulating layer (10) extends over the conductive layer (6). The first and second insulating layers (4, 10) each comprise a sheet of uncharged insulating material. The thickness of the composite laminated diaphragm (2) is less than 20 ?m.

Abstract: Provided are a silicon-based microphone device and an electronic device. The silicon-based microphone device comprises a circuit board, a shielding housing and at least two differential silicon-based microphone chips, wherein at least two sound inlet holes are provided on the circuit board, the shielding housing covers one side of the circuit board and forms a sound cavity with the circuit board, the silicon-based microphone chips are all located inside the sound cavity, the differential silicon-based microphone chips are respectively disposed at the sound inlet holes, and a back cavity of each differential silicon-based microphone chip is communicated with the sound inlet hole at the corresponding position, each of the differential silicon-based microphone chips comprises a first microphone structure and a second microphone structure, all of the first microphone structures are electrically connected, and all of the second microphone structures are electrically connected.

Abstract: A method for activating a gas, wherein an electrically conductive aeromaterial having a pore space comprising the gas is electrically contacted and at least one electric current, which varies over time, flows through the aeromaterial, wherein the aeromaterial exhales gas from the pore space when the electrical power consumption is increased and inhales gas from the surroundings of the aeromaterial when the power consumption is decreased, and wherein a temporally pulsed current having predefined pulse power levels, pulse durations and pulse spacings is fed through the aeromaterial and the temperature of the aeromaterial is changed by the time-varying current by 100° C. or more within one second or less. The invention also relates to an electrothermal gas actuator and to uses of a gas actuator.

Abstract: A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber.

Abstract: Presented herein are implantable sound sensors that include a non-uniform diaphragm mechanically coupled to a vibrating structure of a recipient's middle or inner ear. The non-uniform diaphragm includes a central region and a peripheral region, where the thickness of the central region is greater than the thickness of the peripheral region.

Abstract: An earphone includes a resonance circuit that outputs an adjusted signal obtained by making a signal component of a predetermined frequency contained in an electric signal outputted from a sound source device larger than a signal component of another frequency, a fixed electrode that is fixed to a housing, a diaphragm that is provided facing the fixed electrode and that vibrates according to a potential difference generated between the diaphragm and the fixed electrode on the basis of the adjusted signal, a contact part that contacts a partial region of the diaphragm and presses the partial region against the fixed electrode, and a sound emitting part that emits sound generated by vibration of the diaphragm to the outside of the housing.

Abstract: An acoustic package structure includes a substrate, a covering structure and an acoustic chip. The covering structure is disposed on the substrate and has a plurality of first openings. The acoustic chip is disposed between the substrate and the covering structure, wherein the acoustic chip includes a membrane.

Abstract: A microphone system includes a microphone and a pre-amplification conditioning circuit configured within a housing and comprising a pair of matched JFETs configured in a differential pair with common-source configuration and, when biased, are operable to receive and amplify the differential microphone output signal. The microphone further includes a pair of BJTs configured as a complimentary feedback transistor pair with each of the pair of BJTs coupled in parallel to a corresponding one of the pair of matched JFETs, and a current sink coupled to the matched JFETs and corresponding emitter electrodes of the BJTs and operable to maintain a fixed total direct current through each of the matched JFETs and BJTs, which reduces the JFETs corresponding electrical load, reduces signal noise, and increases a maximum amplified microphone output signal level at the drains of the matched JFETs.

Abstract: In an embodiment, a method for fabricating a Microelectromechanical System (MEMS) microphone includes depositing, on a frontside of a wafer, a first oxide layer over a silicon nitride thin film and over and adjacent the wafer, wherein the silicon nitride thin film is disposed over the wafer, depositing a membrane protection layer over the first oxide layer between a first side of a first cavity formed in the wafer and a second side of a second cavity formed in the wafer, depositing a second oxide layer over and adjacent the membrane protection layer, depositing a first membrane nitride layer over the second oxide layer, depositing a membrane polysilicon layer over the first membrane nitride layer, depositing a second membrane nitride layer over the membrane polysilicon layer, depositing a third oxide layer over the second membrane nitride layer and depositing a fourth oxide layer over the third oxide layer.

Abstract: A MEMS microphone includes a substrate, a connecting base, and a capacitance system. Connecting ports are formed on the connecting base, where the at least two connecting ports are recessed outwards from an inner wall of the connecting base and are disposed at intervals. The capacitance system includes a system main body and connecting pins. A system main body of the capacitance system is fixed to the connecting ports of the connecting base through the connecting pins. In addition, the slit is formed between the outer side of the system main body and the inner wall of the connecting base, the capacitance system is stably and reliably assembled in the connecting base through a connecting structure where the connecting pins are matched with the connecting ports, and compliance of vibration of the system main body of the capacitance system is increased through matching the connecting pins with slit.

Abstract: The present invention discloses a Micro-Electro-Mechanical System MEMS) chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

Abstract: Presented herein are devices/apparatuses having indicator lights (visual indicators), such as light emitting diodes (LEDs), positioned underneath/below the outer surface of a housing of the device. However, the indicator lights positioned below the outer surface of the housing, sometimes referred to herein as “sub-surface” or “sub-housing” indicator lights, are optically coupled to the outer surface of the housing via one or more optical connectors (e.g., light guides, light pipes, light diffusers, etc.). As such, the light emitted by the sub-surface indicator lights is still visible at the outer surface of the device housing.

Abstract: The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.

Abstract: A loudspeaker device comprising a loudspeaker unit comprising a diaphragm with a first and second surface (such as the front and rear surface of the diaphragm, respectively) and an enclosure in which the loudspeaker unit is mounted such that the first surface of the diaphragm is in acoustic communication with the surroundings of the loudspeaker device. The device further comprises an internal cavity formed in the enclosure and being in acoustic communication with the surroundings of the loudspeaker device via an acoustic element. In the device, the second surface of the diaphragm is in acoustic communication with the internal cavity. The acoustic element can be varied between a state in which sound energy generated by the loudspeaker unit in the internal cavity can be emitted to the surroundings via the acoustic element and a state in which sound energy is substantially prevented from entering the surroundings via the acoustic element.

Abstract: An electronic device, including a first substrate, a partition wall structure, a pressurizing component, a second substrate, a shell, and multiple first conductive parts, is provided. The first substrate has a through hole, and a first surface and a second surface that are opposite to each other. The partition wall structure is disposed on the first surface and surrounds to form a first chamber. The pressurizing component is disposed on the partition wall structure and covers the first chamber. The pressurizing component includes at least a mass and a vibration membrane. The shell is disposed on the second substrate and jointly forms a second chamber with the second substrate. The first chamber is formed in the second chamber. The multiple first conductive parts are disposed between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.

Abstract: A haptic interface of the ‘mid-air’ type, including a control circuit, a plurality of ultrasonic transducers connected to the circuit, which includes a first set of transducers emitting at a first ultrasound carrier frequency and at least a second set of transducers emitting at a second ultrasound carrier frequency different from the first; the control circuit being configured for modulating the signals sent to the transducers in order to generate, with the ultrasound waves emitted by at least a part of the transducers of the first set, an acoustic pressure detectable by touch within at least a first focal region, and generate, with the ultrasound waves emitted by at least a part of the transducers of the second set, an acoustic pressure detectable by touch within at least a second focal region.

Abstract: Various implementations include in-ear wearable audio devices. In certain implementations, the in-ear audio devices include an eartip with a body having first and second ends, an inner wall extending between the first and second ends defining a hollow passage to conduct acoustic energy, and a deformable outer wall connected to the inner wall of the body at the first end and tapering away from the inner wall toward the second end, where the deformable outer wall is functionally graded from the first end to the second end to comply with an entrance of an ear canal of a user. In additional implementations, the eartip includes a retaining structure, and at least one of the inner wall or the outer wall of the body, or the retaining structure, has an integral electronic component and/or an electronic component signal trace.

Abstract: Provided is a monolithic metal-insulator transition device. The monolithic metal-insulator transition device includes a substrate including a driving region and a switching region, first and second source/drain regions on the driving region, a gate electrode between the first and second source/drain regions, an inlet well region formed adjacent to an upper surface of the substrate on the switching region, a control well region having a different conductivity type from the inlet well region between the inlet well region and a lower surface of the substrate, a first wiring electrically connecting the first source/drain region and the control well region, and a second wiring electrically connecting the second source/drain region and the inlet well region.

Abstract: A method may include receiving, by a transducer driving system, a first signal for driving an amplifier that drives an electromagnetic load and receiving, by the transducer driving system, a second signal driven by the amplifier in order to control a feedback loop of the transducer driving system. The method may also include detecting unexpected spectral content in the second signal, declaring an indicator event based on the detected unexpected spectral content, determining whether the indicator event occurs in an undesired pattern, and in response to the indicator event occurring in the undesired pattern, modifying a behavior of the transducer driving system.

Abstract: The present invention provides a bone conduction microphone including a housing and a circuit board connected with the housing. The circuit board has an acoustic channel. The microphone further includes a vibration assembly forming a first conduction cavity and a second conduction cavity. The vibration assembly includes a vibration member and a frame. The frame, the vibration member and the circuit board form a first conduction cavity. The frame, the vibration member and the circuit board form a second conduction cavity. The vibration of the vibration member is conducted to one side of the vibration diaphragm, and is also conducted to the other side of the vibration diaphragm. Compared with the related art, the bone conduction microphone of the present invention can effectively improve the sensitivity and the signal to noise ratio.

Abstract: A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber.

Abstract: The present invention provides a vibration motor including a housing with an accommodation space, a vibration member and a fixed member accommodated in the accommodation space, and an elastic support member suspending the vibration member. The elastic support member has an elastic arm, a first fixed part, and a second fixed part. Both the first fixed part and the second fixed part are bent toward the same side of the elastic arm, and the vibration member is located between the first fixed part and the second fixed part. The elastic stress of the elastic support member is effectively improved and the service life of the elastic support member is improved.

Abstract: Embodiments relate to an audio system that performs equalization of audio signals based on one or more diffuse field head-related transfer functions (HRTFs) and device-specific data. User-specific data and device-specific data (i.e., transducer-specific data) are applied to an acoustic model to predict an acoustic response for a user. An equalization filter is then determined using the acoustic response and the one or more diffuse field HRTFs. The equalization filter is applied to a processed version of an audio signal to create a modified version of the audio signal. The modified version of the audio signal is presented to the user via a transducer array of the audio system. The audio system can further include a microphone assembly that reduces the Helmholtz resonance effect.

Abstract: An electrostatic transducer, a diaphragm (2) therefor, and corresponding methods of manufacture are disclosed. The electrostatic FIG. 1 transducer is preferably for use in a motor vehicle. A composite laminated diaphragm (2) is manufactured by providing a first insulating layer (4), providing a conductive layer (6) on a surface of the first insulating layer (4), and bonding a second insulating layer (10) to the conductive layer (6) such that the second insulating layer (10) extends over the conductive layer (6). The first and second insulating layers (4, 10) each comprise a sheet of uncharged insulating material. The thickness of the composite laminated diaphragm (2) is less than 20 ?m.

Abstract: The present disclosure discloses a MEMS chip including a capacitance system and a substrate with a back cavity. The capacitance system includes a back plate and a membrane; the substrate is located on one side of the membrane away from the back plate, including a first surface opposite to the membrane, a second surface opposite to the first surface, and an inner wall connecting the first surface and the second surface and enclosing the back cavity; the inner wall includes a first opening close to the membrane, having a first width along a first direction perpendicular with a vibration direction of the membrane, and a second opening away from the membrane, having a second width smaller than the first width along the first direction. The resonance frequency of the MEMS chip has been effectively improved and the SNR is simultaneously high.

Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.

Abstract: An acoustic transducer includes a diaphragm and multiple vibrators to drive the diaphragm. The diaphragm has multiple cutouts and includes multiple arrangement portions. The multiple vibrators are disposed on the multiple arrangement portions, respectively. At least one of the multiple arrangement portions is disposed between two of the multiple cutouts adjacent to each other and supported at both ends thereof.

Abstract: Provided is a transducer that can be manufactured without using a volatile adhesive or an organic solvent. A transducer is provided with: a first electrode sheet provided with a plurality of first through-holes; a dielectric layer, of which a first surface is disposed on the first-electrode-sheet side; and a first fusion-bonding layer formed from a fusion-bonding material, the first fusion-bonding layer joining together, by fusion bonding of the fusion-bonding material, a boundary region between a body portion of the dielectric layer and a first inner surface of the first electrode sheet and a boundary region between the body portion of the dielectric layer and a first inner circumferential surface of at least some of the plurality of first through-holes.

Abstract: In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.

Abstract: A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.

Abstract: A method of manufacturing a semiconductor structure includes following operations. A first substrate is provided. A plate is formed over the first substrate. The plate includes a first tensile member, a second tensile member, a semiconductive member between the first tensile member and the second tensile member, and a plurality of apertures penetrating the first tensile member, the semiconductive member and the second tensile member. A membrane is formed over and separated from the plate. The membrane include a plurality of holes. A plurality of conductive plugs passing through the plate or membrane are formed. A plurality of semiconductive pads are formed over the plurality of conductive plugs. The plate is bonded to a second substrate. The second substrate includes a plurality of bond pads, and the semiconductive pads are in contact with the bond pads.

Abstract: A microphone system includes a microphone and a pre-amplification conditioning circuit configured within a housing and comprising a pair of matched JFETs configured in a differential pair with common-source configuration and, when biased, are operable to receive and amplify the differential microphone output signal. The microphone further includes a pair of BJTs configured as a complimentary feedback transistor pair with each of the pair of BJTs coupled in parallel to a corresponding one of the pair of matched JFETs, and a current sink coupled to the matched JFETs and corresponding emitter electrodes of the BJTs and operable to maintain a fixed total direct current through each of the matched JFETs and BJTs, which reduces the JFETs corresponding electrical load, reduces signal noise, and increases a maximum amplified microphone output signal level at the drains of the matched JFETs.

Abstract: Ultrasonic transducers that are capable of generating increased levels of ultrasound, as well as receiving ultrasonic waves with increased sensitivity. The ultrasonic transducers include a back cover, a protective front cover, a backplate, and a vibrator film layer disposed between the backplate and the protective front cover. The backplate includes a plurality of grooves formed on a surface thereof facing the vibrator film layer. Each groove includes upper edges having cross-sectional contours that gradually tend toward the deepest part of the groove to allow a larger area of the backplate to be closer to the vibrator film layer, thereby increasing the resulting electric field, and, consequently, increasing the output power and sensitivity of the ultrasonic transducer.

Abstract: A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.

Abstract: The Application relates to optically transparent electrostatic transducers. In some embodiments, the transducers comprise graphene. Such transducers are capable of functioning as acoustic sensors and/or transmitters as a singulated device or in an array configuration. Also provided are methods of manufacturing and using such transducers.

Abstract: A MEMS microphone includes a substrate having a cavity, a diaphragm disposed over the substrate to cover the cavity, an anchor extending from and end portion of the diaphragm to surround a periphery of the diaphragm, the anchor being fixed to a lower surface of the substrate to support the diaphragm from the substrate, a back plate disposed over the diaphragm, the back plate being spaced apart from the diaphragm to define an air gap therebetween and having a plurality of acoustic holes, an upper insulation layer covering an upper surface of the back plate to hold the back plate, and a strut positioned on the anchor, the strut being connected to the upper insulation layer and making contact with a lower surface of the anchor to support the upper insulation layer and to be spaced from the diaphragm.

Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.

Abstract: A method, computer program product, and computing system for receiving a signal from each microphone of a plurality of microphones, thus defining a plurality of signals. Harmonic distortion associated with at least one microphone may be determined. One or more harmonic distortion-based augmentations may be performed on the plurality of signals based upon, at least in part, the harmonic distortion associated with the at least one microphone, thus defining one or more harmonic distortion-based augmented signals.

Abstract: A microphone assembly comprising a housing, a single flexible diaphragm, and a rigid backplate. The backplate may be coated with a parylene configured to help reduce the flatness deviation of the backplate across the diameter of the backplate. A plurality of openings may extend from the top portion of the backplate to the bottom portion of the backplate.

Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

Abstract: A MEMS acoustic sensor includes a substrate, a back plate, a diaphragm, a dielectric layer and a connecting portion. The diaphragm is disposed between the substrate and the back plate and includes a vibration portion. The dielectric layer is formed between the substrate and the diaphragm and has a cavity corresponding to the vibrating portion. The connecting portion is located in the cavity and connects the vibrating portion and the substrate.

Abstract: A one-piece sound port adapter for a microphone assembly includes a body member configured to be fitted over a sound port of the microphone assembly. The body member includes an acoustic channel defined in part by a cavity having a sound inlet and a sound outlet, where the sound outlet is acoustically coupled to the sound port. A wall portion of the body member extends into the cavity and configured to modify an acoustic property of the acoustic channel. When mounted, the one-piece sound port adapter converts the microphone assembly from a top or bottom port microphone assembly to a side-port microphone assembly.

Abstract: Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

Abstract: Example flap actuation systems and related methods are disclosed herein. An example flap actuation system includes a first actuator, a second actuator, a first drive arm coupled to the first actuator and to a flap, a second drive arm coupled to the second actuator and to the flap, a first cam, and a first output shaft. The first cam is to couple to the first drive to enable the first actuator to actuate the flap via the first drive arm. The example flap actuation system includes a second cam and a second output shaft. The first cam is to be uncoupled from the first drive arm in response to a failure of the first actuator. The second actuator is to actuate the flap via the first drive arm and the second drive arm in response to the failure of the first actuator.

Abstract: Disclosed are a voice recognition system and a display device using the same. The disclosed voice recognition system includes a plate structure, a vibration sensor, and a voice recognition device. The plate structure vibrates based on propagation of a voice wave generated from a user, and the vibration sensor is provided in contact with the plate structure to detect the vibration of the plate structure. The voice recognition device recognizes voice of the user by receiving a signal output from the vibration sensor.

Abstract: An implementation of a MEMS device includes a constrained diaphragm comprising a surface, the diaphragm having a net compressive stress; and a backplate comprising a surface facing the surface of the diaphragm, the surface of the backplate having a center, and a post extending from the surface of the backplate, wherein the post is located at or near a center of the surface and limits a maximum deflection of the diaphragm.