Capacitive Patents (Class 381/174)
  • Patent number: 11174152
    Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: November 16, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng
  • Patent number: 11146893
    Abstract: The present invention relates to a sensor arrangement, to a corresponding method of assembling such a sensor arrangement, and to a sensor system. The sensor arrangement comprises at least one transducer element for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand; and a sensor substrate comprising the transducer element. The sensor substrate is mountable on a circuit carrier in a way that a media channel penetrating the circuit carrier allows access of the at least one measurand to the transducer element. The circuit carrier has an electrically conductive solderable first sealing pattern which surrounds the media channel at least partly and which is aligned with a solderable second sealing pattern arranged on the sensor substrate, so that a soldered sealing connection, which at least partly surrounds the media channel, is formed between the first sealing pattern and the second sealing pattern.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: October 12, 2021
    Assignee: TE CONNECTIVITY SOLUTIONS GMBH
    Inventor: Predrag Drljaca
  • Patent number: 11128959
    Abstract: A MEMS microphone including a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip includes a bulk material with an aperture covered and closed by a mesh. The mesh includes a layer of the filter chip with parallel through-going first holes structured in the layer. The filter chip is arranged in or on the carrier board such that the mesh covers the sound opening.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: September 21, 2021
    Assignee: TDK Corporation
    Inventors: Pirmin Hermann Otto Rombach, Dennis Mortensen, Jan Tue Ravnkilde, Kurt Rasmussen, Morten Ginnerup
  • Patent number: 11128950
    Abstract: Disclosed is a speaker module, comprising a module housing and a speaker unit accommodated in the module housing. The speaker unit partitions a module cavity encircled by the module housing into two cavities, namely a front acoustic cavity and a rear acoustic cavity. A separator component is provided within the rear acoustic cavity. The separator component partitions the rear acoustic cavity into an accommodating cavity and a sound-absorbing cavity. The sound-absorbing cavity is filled with sound-absorbing particles. An antistatic material is added into the housing material of the module housing at where the sound-absorbing cavity is located, or the antistatic material is coated on the surface of the module housing at where the sound-absorbing cavity is located, and the antistatic material is either an electrically-conductive material or an antistatic agent.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: September 21, 2021
    Assignee: GOERTEK INC.
    Inventors: Xiaodong Cao, Jinli Liu
  • Patent number: 11111137
    Abstract: A method for manufacturing a micromechanical sensor, including the steps: providing a MEMS wafer that includes a MEMS substrate, a defined number of etching trenches being formed in the MEMS substrate in a diaphragm area, the diaphragm area being formed in a first silicon layer that is situated at a defined distance from the MEMS substrate; providing a cap wafer; bonding the MEMS wafer to the cap wafer; and forming a media access point to the diaphragm area by grinding the MEMS substrate.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: September 7, 2021
    Assignee: Robert Bosch GmbH
    Inventor: Johannes Classen
  • Patent number: 11092538
    Abstract: A gas sensor includes a multi-wafer stack of a plurality of layers and a measurement chamber. The plurality of layers includes a first layer comprising a sensor element that has a microelectromechanical system (MEMS) membrane; and a second layer comprising an emitter element configured to emit electromagnetic radiation. The measurement chamber is interposed between the first layer and the second layer. The measurement chamber is configured to receive a measurement gas and further receive the electromagnetic radiation emitted by the emitter element as the electromagnetic radiation travels along a radiation path from a first end of the measurement chamber to a second end of the measurement chamber that is opposite to the first end.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: August 17, 2021
    Inventors: Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Horst Theuss, Wilhelm Wiedmeier, Juergen Woellenstein
  • Patent number: 11089408
    Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: August 10, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Chun Yin Tsai
  • Patent number: 11076222
    Abstract: An electro-acoustic transducer includes: a housing; a fixed electrode; a diaphragm that oscillates in accordance with a potential difference between the diaphragm and the fixed electrode generated based on the electric signal, the diaphragm being provided to face the fixed electrode; and a support part that supports the partial region of the diaphragm toward the fixed electrode, the support part including a displacement part that is displaced in a direction in which the diaphragm is displaced in response to a change in pressure inside the housing, and a contacting part contacts the partial region of the diaphragm, wherein a distance between the diaphragm and the fixed electrode in the partial region is less than a distance between the diaphragm and the fixed electrode outside the partial region.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: July 27, 2021
    Assignee: Audio-Technica Corporation
    Inventors: Koichi Irii, Hiroshi Akino
  • Patent number: 11070900
    Abstract: A microphone including a light emitting part can be miniaturized. The microphone includes: a microphone unit; an impedance converter that converts output impedance of the microphone unit; a light source that notifies an operation state of the microphone unit; a conversion substrate on which the impedance converter is mounted; a light source substrate on which the light source is mounted; and a connection substrate to which a signal line for transmitting a signal from the impedance converter and a power line for transmitting power to the light source are connected. The conversion substrate, the light source substrate, and the connection substrate are three-dimensionally connected to one another to constitute one substrate unit.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: July 20, 2021
    Assignee: Audio-Technica Corporation
    Inventor: Satoshi Yoshino
  • Patent number: 11051554
    Abstract: An aerosol delivery device is provided that includes a housing, microelectromechanical systems-based (MEMS-based) sensor and microprocessor. The MEMS-based sensor is within the housing and configured to detect a pressure on the MEMS-based sensor caused by airflow through at least a portion of the housing. The MEMS-based sensor is configured to convert the pressure to an electrical signal, and output the electrical signal. The microprocessor is configured to receive the electrical signal from the MEMS-based sensor, and control operation of at least one functional element of the aerosol delivery device based thereon.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: July 6, 2021
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: Wilson Christopher Lamb, Frederic Philippe Ampolini, Sr., Raymond Charles Henry, Jr.
  • Patent number: 11051106
    Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: June 29, 2021
    Assignee: FORTEMEDIA, INC.
    Inventors: Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng, Shih-Chin Gong
  • Patent number: 11041992
    Abstract: A hinge between a first part and a second part of a microelectromechanical system including a first element and a second element free to move relative to each other in an out-of-plane direction is disclosed. The hinge includes a first rigid part; a second part fixed to a first face of the first part by one end and anchored to the second element by a second end, the second part deforming in bending in the out-of-plane direction; and a third part fired to a first face of the first part by a second end, and anchored to the first element by a second end, the third part deforming in bending in the out-of-plane direction. In an undeformed state, the second part and the third part each includes one face located in the same plane orthogonal to the out-of-plane direction.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: June 22, 2021
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Samer Dagher, Loic Joet
  • Patent number: 11032651
    Abstract: The present application provides a piezoelectric microphone, including a substrate having a back cavity and a piezoelectric cantilever diaphragm fixed to the substrate. The piezoelectric cantilever diaphragm includes a first diaphragm located at its center and suspended above the back cavity, and a second diaphragm fixed to the substrate and provided around the first diaphragm. The second diaphragm includes a fixed end fixed to one side of the substrate and a movable end close to the first diaphragm side and suspended above the back cavity. The piezoelectric microphone further includes one or more elastically stretchable members each connecting the first diaphragm with the movable end. The piezoelectric microphone of the present disclosure has better performance.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: June 8, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Lian Duan, Rui Zhang
  • Patent number: 11032652
    Abstract: A terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed at the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, and an MEMS chip accommodated in the accommodation space. A position of the substrate corresponding to the MEMS chip is disposed with a sound inlet connected to the outside, wherein a position where the signal let out board corresponding to the silicon microphone is disposed with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate disposed with the housing is provided with a pad which is electrically connected with the signal let out board.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: June 8, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Kai Wang, Hu Chen
  • Patent number: 10999669
    Abstract: A combinatorial inner module is installed primarily inside a wireless earphone, including a circuit loop, a lower cover and an upper cover. The circuit loop is provided with a first circuit board and a second circuit board which is extended from the first circuit board. The upper cover is disposed above the lower cover to fix the first circuit board between the upper cover and the lower cover. Moreover, the upper cover includes a first side wall which is formed with an angle with respect to the lower cover and is used to install the second circuit board, forming an included angle between the second circuit board and the first circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: May 4, 2021
    Assignee: CONCRAFT HOLDING CO., LTD.
    Inventors: Chin-Hsing Lee, Jin-Bo Peng, Chang-Hsien Tung
  • Patent number: 10993041
    Abstract: A MEMS microphone includes a substrate having a cavity, a back plate being disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, the diaphragm being spaced apart from the substrate and the back plate, covering the cavity to form an air gap between the back plate, and being configured to generate a displacement with responding to an acoustic pressure and a plurality of anchors extending from an end portion of the diaphragm to be integrally formed with the diaphragm, the anchors being arranged along a circumference of the diaphragm to be spaced apart from each other, and having lower surfaces making contact with an upper surface of the substrate to support the diaphragm. Thus, the MEMS microphone may have improved rigidity and flexibility.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: April 27, 2021
    Assignee: DB HITEK CO., LTD.
    Inventor: Jong Won Sun
  • Patent number: 10993042
    Abstract: A microphone is provided, including a base having a chamber; and a capacitor system fixed to the base. The capacitor system includes a backplate fixed to the base and a diaphragm located in the chamber. The backplate and the diaphragm form a capacitor structure. The diaphragm is fixed to the backplate and partitions the chamber into a front chamber and a back chamber. The backplate is provided with a sound receiving hole in communication with the front chamber. The base or the backplate is provided with a vent hole for communicating the back chamber with the outside. The microphone provided by the present disclosure has the advantages of high reliability.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: April 27, 2021
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventor: Jinyu Zhang
  • Patent number: 10958997
    Abstract: A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) may be illuminated by a light guide disposed within the housing, which scatters light emitted from lights disposed within the housing. In some instances, a hole may pass through a printed circuit board to allow acoustic signals to be received by the microphone disposed below the printed circuit board. An input/output (I/O) interface module with multiple buttons and inputs may be installed in the hole. The multiple buttons and I/O ports of the I/O interface module may be aligned along an axis vertical relative to the housing and centered with respect to each other.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: March 23, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Mann Chamberlin, Chia Hung Kuo, Jacob William Beatty, Duane Everard Whyte, Adrian Roy Ramiscal Santos, Isabella Talley Lewis
  • Patent number: 10932064
    Abstract: The present invention provides a condenser microphone, comprising a substrate, and a back plate and a vibrating diaphragm which are arranged on the substrate; the back plate is arranged on the upper side and/or the lower side of the vibrating diaphragm; and the vibrating diaphragm is provided with a protruding layer or a corrugated membrane structure layer. With the above invention, the area of the vibrating diaphragm and the capacitance at the lateral side of the condenser microphone can be increased, so as to achieve the effect of improving the sensitivity of the condenser microphone.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: February 23, 2021
    Inventors: Mengjin Cai, Junkai Zhan
  • Patent number: 10900854
    Abstract: Provided are a pressure sensor which exhibits exceptional performance and a method of producing the same. The pressure sensor includes: a silicon substrate having a cavity; a diaphragm which is formed of a metallic glass and has a tensile stress in a range in which a resonant frequency is higher than an audible range; and a counter electrode which is insulated from the diaphragm and has a plurality of holes. The diaphragm and the counter electrode are disposed on the silicon substrate to face each other with a gap therebetween, the diaphragm and the counter electrode being released from the silicon substrate by the cavity.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: January 26, 2021
    Assignee: Tohoku University
    Inventors: Shuji Tanaka, Joerg Froemel
  • Patent number: 10887714
    Abstract: A manufacturing method for a microphone is provided. The microphone includes a case that is vibrated by a vibration signal. A sound inlet through which a sound signal is input is formed at a portion of the case and a first sound element is formed in the case at a position corresponding to the sound inlet. The first sound element receives the sound signal and the vibration signal to output a first initial signal. A second sound element is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal. A semiconductor chip is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: January 5, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Ilseon Yoo
  • Patent number: 10886455
    Abstract: A method of forming a piezoelectric microphone with an interlock/stopper and a micro-bump and a resulting device are provided. Embodiments include forming a membrane over a Si substrate having a first and second sacrificial layer disposed on opposite surfaces thereof, the membrane being formed on the first sacrificial layer, forming a first HM over the membrane, forming first and second vias through the first HM, forming a first pad layer in the first and second vias and over an exposed top thin film, forming a trench to the first sacrificial layer between the first and second vias and a gap between the trench and second via, patterning a second HM over the membrane, in the first and second vias, the trench and the gap, and forming a second pad layer over the second HM and in exposed areas around the first and second vias to form pad structures.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: January 5, 2021
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
    Inventors: Jia Jie Xia, Rakesh Kumar, Minu Prabhachandran Nair, Nagarajan Ranganathan
  • Patent number: 10880629
    Abstract: A device for detecting acoustic waves may include a housing having a housing wall with an inner surface, and an acoustic wave sensor provided at least partially inside the housing and configured to detect acoustic waves. The inner surface of the housing wall is made in at least half of its entire area of a thermally insulating material.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: December 29, 2020
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, David Tumpold, Gueclue Onaran
  • Patent number: 10873815
    Abstract: An electret condenser microphone with a low noise figure and a method for producing the same are disclosed. An electret variable condenser is first installed into a housing, and then an ASIC amplifier and a printed circuit board are installed into the housing. The ASIC amplifier is electrically connected to the electret variable condenser. It reduces the noise figure effectively and ensures the normal transmission of the effective sound. In particular, it ensures the stability and reliability of the ASIC amplifier during use. The process is simple, the production efficiency is high, and the processing cost is low.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: December 22, 2020
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Huming Zheng, Tseng-Feng Wen, Yu Zhang, Feng Tong
  • Patent number: 10863283
    Abstract: A MEMS microphone for a frame-free device, comprising a substrate, wherein the substrate comprises a first substrate region provided with an acoustic sensor, an ASIC chip, and a MEMS chip, and a second substrate region provided with a plurality of pads; both the first substrate region and the second substrate region are disposed at the same side of the substrate; an acoustic through-hole is disposed at the back of the first substrate region; a microphone connection structure further comprises a flexible circuit board, wherein the flexible circuit board electrically connects the plurality of pads of the MEMS microphone to a circuit board of the frame-free device; the acoustic through-hole is aligned with an acoustic opening of the frame-free device; by adopting the MEMS microphone for a frame-free device, the MEMS microphone may be more widely used in many high-tech industries and has better acoustic performance over the conventional MEMS microphone.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: December 8, 2020
    Assignee: ZILLTEK TECHNOLOGY (SHANGHAI) CORP.
    Inventor: Jinghua Ye
  • Patent number: 10848876
    Abstract: A MEMS microphone includes a cavity extending portion that increases the size of the cavity. The cavity extending portion can be sloped or stepped in order to create a desired profile of the extended cavity shape. Thus, the volume of the cavity may be increased in order to decrease the compliance and to increase a Signal to Noise Ratio.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: November 24, 2020
    Assignee: DB HITEK CO., LTD.
    Inventor: Min Hyun Jung
  • Patent number: 10841710
    Abstract: A package structure of MEMS microphone is provided. The MEMS microphone includes a MEMS microphone chip disposed on a circuit board. The MEMS microphone chip comprises a first bonding pad, including a metal pad on a top of the MEMS microphone chip; and a protection layer fully enclosing a sidewall of the metal pad and also partially disposed on a top of the metal pad. A circuit chip is disposed on the circuit board, wherein the circuit chip comprises a second bonding pad. A bonding wire is connected between the first bonding pad and the second bonding pad.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: November 17, 2020
    Assignee: Solid State System Co., Ltd.
    Inventors: Chien-Hsing Lee, Tsung-Min Hsieh, Cheng-Wei Tsai
  • Patent number: 10827282
    Abstract: The present disclosure provides a terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed on the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, an MEMS chip and a waterproof member. The substrate is configured with a sound inlet connected to the outside. The waterproof member is sandwiched between the MEMS chip and the substrate. A position where the signal let out board corresponds to the silicon microphone is configured with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate where the housing is assembled, is provided with at least one pad electrically connected with the signal let out board.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: November 3, 2020
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Kai Wang, Hu Chen
  • Patent number: 10764693
    Abstract: The present application teaches microphones and manufacturing methods therefor and relates to the field of semiconductor technologies. In some implementations, a method may include: providing a substrate structure, the substrate structure including a substrate and a first insulating layer covering a first part of the substrate; forming a first electrode plate layer, the first electrode plate layer covering a part of the first insulating layer; and forming a second insulating layer, the second insulating layer covering a part of a region of the first insulating layer which is not covered by the first electrode plate layer and a part of the first electrode plate layer, where when seen from the top, the first electrode plate layer and the second insulating layer form an angle, the angle exposes a second part of the substrate, and a degree ? of the angle is larger than or equal to 90° and is smaller than or equal to 180°. The present application can improve a problem of unexpected holes formed in the microphone.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: September 1, 2020
    Assignees: Semiconductor Manufacturing (Shanghai) International Corporation, Semiconductor Manufacturing (Beijing) International Corporation
    Inventors: Jian Zhang, Xin Ming Lv
  • Patent number: 10753858
    Abstract: Shown is a wafer arrangement for a gas sensor including a first substrate and a sescond substrate. The first substrate includes a MEMS membrane associated with a sensor element and an emitter element configured to emit electromagnetic radiation. The second substrate is arranged on top of the first substrate and defines at least a portion of a chamber disposed adjacent to the MEMS membrane.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: August 25, 2020
    Assignees: Infineon Technologies AG, Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
    Inventors: Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Horst Theuss, Wilhelm Wiedmeier, Juergen Woellenstein
  • Patent number: 10750266
    Abstract: A microphone connector assembly comprises a receptacle and a sleeve. The receptacle includes a housing, a first cavity formed within the housing, a frame, a protrusion formed on the frame, and a first electrical block supported by the frame and positioned within the first cavity. The sleeve includes an outer shell, a second cavity formed within the outer shell, a keyway, and a second electrical block positioned within the second cavity. The sleeve is insertable into the receptacle such that the protrusion enters the keyway and the first and second electrical blocks engage one another.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: August 18, 2020
    Assignee: Shure Acquisition Holdings, Inc.
    Inventors: Christopher Meyer, Walter Harwood
  • Patent number: 10743111
    Abstract: An MEMS microphone is provided, including a base having a back cavity, and a capacitor system disposed on the base, the capacitor system including a backplate and a diaphragm disposed oppositely to the backplate. The diaphragm includes a body portion and a plurality of venting portions connected to the body portion, each of the plurality of venting portions includes a venting aperture penetrating through the diaphragm and a membrane flap partially fixed to the diaphragm and located in the venting aperture. The MEMS microphone further includes an insulation connecting pillar having one end fixedly connected to the backplate and another end fixedly connected to the membrane flap. Compared with the related art, the venting portion is fixedly connected to the backplate through the insulation connecting pillar, so that the venting portion is not easily warped, thereby improving reliability of the MEMS microphone.
    Type: Grant
    Filed: December 30, 2018
    Date of Patent: August 11, 2020
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Rui Zhang, Jinyu Zhang, Ting Kang
  • Patent number: 10728674
    Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: July 28, 2020
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Li-Chi Tsao, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Patent number: 10715924
    Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: July 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Chun Yin Tsai
  • Patent number: 10715927
    Abstract: The present application discloses a MEMS microphone, including: a substrate having a cavity; and a capacitor system mounted on the substrate. The capacitor includes a back plate connected to the substrate; and a diaphragm forming a capacitor with the back plate. The back plate includes a back plate main body and a first connecting portion extending from the back plate main body toward the substrate, the first connecting portion connects with the substrate, and the diaphragm connects to the back plate main body. The vibration or the stress from the substrate will not transferred to the diaphragm, but released via the first connecting portion.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: July 14, 2020
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventor: Jinyu Zhang
  • Patent number: 10715928
    Abstract: The present invention provides a capacitive microphone having a capability of acceleration noise cancelation. The microphone includes (1) a moveable functional membrane comprising a basic functional membrane with an area Ao; and (2) a moveable reference membrane comprising a basic reference membrane. The basic reference membrane has one or more holes through the membrane's thickness, and the moveable reference membrane would be identical to the moveable functional membrane if the basic reference membrane does not have said one or more holes. The total area of said one or more holes is Ah, and a hole density HD is defined as Ah/Ao (%), and HD is in the range of e.g. from 0.012% to 2.647%.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: July 14, 2020
    Assignee: GMEMS TECH SHENZHEN LIMITED
    Inventors: Guanghua Wu, Xingshuo Lan, Yunlong Wang
  • Patent number: 10715930
    Abstract: According to an embodiment, an optical MEMS transducer includes a diffraction structure including alternating first reflective elements and openings arranged in a first plane, a reflection structure including second reflective elements and configured to deflect with respect to the diffraction structure, and an optical element configured to direct a first optical signal at the diffraction structure and the reflection structure and to receive a second optical signal from the diffraction structure and the reflection structure. The second reflective elements are arranged in the first plane when the reflection structure is at rest. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: July 14, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ulf Bartl, Alfons Dehe
  • Patent number: 10715922
    Abstract: A device comprising: a sensor; and a first circuit configured to detect when an input stimulus to the sensor satisfies one or more detection criteria, and further configured to produce a signal upon detection that causes adjustment of performance of the device; and a second circuit for processing input following detection, wherein the second circuit is configured to increase its power level following detection, relative to a power level of the second circuit prior to detection.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: July 14, 2020
    Assignee: Vesper Technologies Inc.
    Inventors: Robert J. Littrell, Ronald Gagnon, Karl Grosh
  • Patent number: 10689247
    Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: June 23, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng
  • Patent number: 10687146
    Abstract: A speaker assembly including a frame and a magnet assembly positioned within the frame. The magnet assembly may include a magnet and a top plate. The assembly further including a sound radiating surface suspended over the magnet assembly. The sound radiating surface includes a flexible circuit. A suspension suspending the sound radiating surface over the magnet assembly is further provided. The suspension may be over molded to the sound radiating surface and the frame. A voice coil extends from a bottom side of the sound radiating surface and electrically connects to the flexible circuit.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: June 16, 2020
    Assignee: Apple Inc.
    Inventors: Anthony P. Grazian, Christopher Wilk, Hongdan Tao, Scott P Porter, Michael Asfaw
  • Patent number: 10680159
    Abstract: A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: June 9, 2020
    Assignee: SnapTrack, Inc.
    Inventors: Thomas Metzger, Jürgen Portmann
  • Patent number: 10638236
    Abstract: A MEMS sound transducer includes a backplate and a membrane held by an edge fixing such that the membrane is deflectable along a deflection direction toward the backplate. The MEMS sound transducer further includes an elevation element arranged between the membrane and the backplate and having a first height along the deflection direction. The MEMS sound transducer also includes a supporting structure and a spacer element arranged between the membrane and the supporting structure and having a second height along the deflection direction, the second height being greater than the first height. The supporting structure is the backplate or is a supporting element arranged opposite the backplate, such that the membrane is arranged between the backplate and the supporting element.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 28, 2020
    Assignee: Infineon Technologies AG
    Inventor: Wolfgang Klein
  • Patent number: 10631089
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for selecting distributed mode loudspeaker electrodes using an output frequency. One of the methods includes determining, for a piezoelectric transducer, a subset of frequencies, from a range of frequencies, at which to output a sound; selecting, based on the subset of frequencies, one or more electrode pairs from two or more electrode pairs included in the piezoelectric transducer to generate the sound; and providing, by a drive module connected to each of the two or more electrode pairs, current to each of the selected one or more electrode pairs to cause the piezoelectric transducer to generate a force that, when provided to a load, causes the load to generate the sound within the subset of frequencies.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: April 21, 2020
    Assignee: Google LLC
    Inventor: Neil John Harris
  • Patent number: 10626012
    Abstract: A semiconductor device having a lid, and method of making a semiconductor device having a lid is disclosed. The semiconductor device includes a substrate. A device is positioned at the substrate. A lid made of a semiconductor material is positioned over the device to form a protective cavity about the device. The lid is formed using a semiconductor process. In other examples, the lid may be made of a nonconductive material, such as a polymer material. The lids may be formed as part of a batch process.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: April 21, 2020
    Assignee: Infineon Technologies AG
    Inventors: Franz-Xaver Muehlbauer, Dominic Maier, Thomas Kilger
  • Patent number: 10616687
    Abstract: A microphone includes a substrate including an acoustic hole; a supporting layer disposed along a circumference of the substrate; and a vibrating film disposed on the supporting layer and spaced apart from the substrate, wherein the vibrating film includes a first vibrating region positioned at a portion corresponding to the acoustic hole; a second vibrating region connected to the first vibrating region, and including an air inlet; and a third vibrating region connected to the second vibrating region through a plurality of connection parts.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: April 7, 2020
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Hyunsoo Kim, Ilseon Yoo
  • Patent number: 10609474
    Abstract: An air pulse generating element is disclosed. The air pulse generating element includes a front faceplate; a back faceplate; a front supporting element; a back supporting element; a folded membrane, configured to form a front chamber and a back chamber, and comprising a plurality of membrane units; wherein the plurality of membrane units are parallel and sequentially connected and an end of the folded membrane is connected to the back faceplate via the back supporting element and another end of the folded membrane is connected to the front faceplate via the front supporting element; and a plurality of valves controlling a plurality of air flow channels between the front chamber toward either a front space or a back space; wherein the plurality of membrane units are configured to perform horizontal deformation to squeeze air in and out of the front or back chamber with operations of the plurality of valves.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: March 31, 2020
    Assignee: xMEMS Labs, Inc.
    Inventors: Jemm Yue Liang, Chiung C. Lo, Wen-Chien Chen, Chun-I Chang
  • Patent number: 10609461
    Abstract: A waterproof speaker device includes a plate member, a speaker unit and a waterproof frame. The plate member includes an encircling block wall and a sound hole. The encircling block wall is provided on the plate member, and the sound hole passes through the plate member and is located within the encircling block wall. The encircling block wall is quadrilateral and includes four first positioning portions, and the first positioning portions are respectively located at four corners of the encircling block wall. The speaker unit is near the sound hole, and the encircling block wall surrounds the speaker unit. The waterproof frame is located between the encircling block wall and the speaker unit. The waterproof frame is quadrilateral and includes four second positioning portions, the second positioning portions are respectively located at four corners of the waterproof frame, and the first positioning portions respectively match the second positioning portions.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: March 31, 2020
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Chi-Chen Lo
  • Patent number: 10575093
    Abstract: A computationally implemented system and method that is designed to, but is not limited to: electronically determining positioning status of one or more portions of one or more humans relative to one or more locations of demodulation of one or more acoustic ultrasonic signals into one or more acoustic audio signals said one or more acoustic ultrasonic signals originating from a portable electronic device; and electronically alerting said one or more humans from said portable electronic device regarding said positioning status of one or more portions of one or more humans relative to one or more locations of demodulation of one or more acoustic ultrasonic signals into one or more acoustic audio signals when said positioning status includes a first characterization. In addition to the foregoing, other method aspects are described in the claims, drawings, and text forming a part of the present disclosure.
    Type: Grant
    Filed: January 25, 2014
    Date of Patent: February 25, 2020
    Assignee: Elwha LLC
    Inventors: Michael H. Baym, William David Duncan, Roderick A. Hyde, Edward K. Y. Jung, Richard T. Lord, Robert W. Lord, Nathan P. Myhrvold, Lowell L. Wood, Jr.
  • Patent number: 10559293
    Abstract: A digital microphone device includes circuitry that can reduce the risk of noise caused due to an idle tone frequency component in a digital signal output by the digital microphone device. In stereo mode and other applications where interference occurs between two or more such microphones, each microphone device includes a digital output having a corresponding idle tone frequency, one of which is offset to shift noise components outside of a desired frequency range.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: February 11, 2020
    Assignee: Knowles Electronics, LLC
    Inventors: Henrik Thomsen, Yu Du
  • Patent number: 10547924
    Abstract: The invention discloses a novel microphone structure and a flip-type electronic device, comprising: a first layer plate, an acoustic sensor and a circuit chip being connected to the first layer plate; a second layer plate, covered on the first layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through-holes located at two opposite sides or two adjacent sides of the microphone acoustic cavity. The beneficial effects of the technical schemes of the invention include: two acoustic through-holes are provided on the microphone acoustic cavity of the novel microphone structure, and the two acoustic through-holes are disposed on two opposing sides or two adjacent sides of the microphone acoustic cavity, such that sound received from inside corresponds to that received from outside when using the flip-type electronic device.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: January 28, 2020
    Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua Ye