Abstract: A vibration sensor comprising a pressure detecting arrangement adapted to detect generated pressure variations, and provide an output signal in response to the detected pressure variations, and a pressure generating arrangement adapted to generate pressure variations in response to movements thereof wherein the pressure generating arrangement is secured to an exterior surface portion of the pressure detecting arrangement. In a preferred embodiment the pressure detecting arrangement comprises a stand-alone and self-contained MEMS microphone unit comprising a MEMS microphone cartridge and a signal processing unit.

Abstract: The application describes MEMS transducers comprising a flexible membrane supported at a supporting edge relative to a substrate and further comprising one or more unbound edges. The shape of the unbound edge is selected so that the flexible membrane tends to bend along more than one bend axis in the region of the supporting edge.

Abstract: The present disclosure relates generally to microphones and related components. One example micro electro mechanical system (MEMS) motor includes a first diaphragm; a second diaphragm that is disposed in generally parallel relation to the first diaphragm, the first diaphragm and second diaphragm forming an air gap there between; and a back plate disposed in the air gap between and disposed in generally parallel relation to the first diaphragm and the second diaphragm.

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.

Abstract: A membrane component comprises a membrane structure comprising an electrically conductive membrane layer. The electrically conductive membrane layer has a suspension region and a membrane region. In addition, the suspension region of the electrically conductive membrane layer is arranged on an insulation layer. Furthermore, the insulation layer is arranged on a carrier substrate. Moreover, the membrane component comprises a counterelectrode structure. A cavity is arranged vertically between the counterelectrode structure and the membrane region of the electrically conductive membrane layer. In addition, an edge of the electrically conductive membrane layer projects laterally beyond an edge of the insulation layer by more than half of a vertical distance between the electrically conductive membrane layer and the counterelectrode structure.

Abstract: A top port MEMS microphone package includes a substrate having a back volume expanding aperture therein. A MEMS microphone electronic component is mounted to the substrate directly above the back volume expanding aperture such that an aperture of the MEMS microphone electronic component is in fluid communication with the back volume expanding aperture. A lid having a lid cavity is mounted to the substrate. The back volume expanding aperture couples the aperture of the MEMS microphone electronic component to the lid cavity. By coupling the lid cavity to the aperture with the back volume expanding aperture, the resulting back volume is essentially the size of the entire top port MEMS microphone package. In this manner, the noise to signal ratio is minimized thus maximizing the sensitivity of the top port MEMS microphone package as well as the range of applications.

Abstract: A transducer includes a first substrate and an integrated circuit coupled to the first substrate. A sensor is electrically coupled to the integrated circuit and includes a second substrate having a first surface and a second surface opposite the first surface. The second substrate has scribe boundaries defining an outer edge of the second substrate and a chamber extending from the first surface towards but not reaching the second surface. A chamber extends from the second surface to meet the chamber from first surface. Scribe trenches in the second surface at the scribe boundaries have a width from the scribe boundary towards the chamber extending from the second surface. A membrane extends over the first surface and over the chamber extending from first surface. A plate extends from the first surface of the second substrate over the membrane.

Abstract: Disclosed is a loudspeaker, comprising a casing (7) and a vibration system. The vibration system comprises a vibrating diaphragm (3) and a sound coil (4) fixed at a side of the vibrating diaphragm. A joint portion is arranged at an edge of the vibrating diaphragm (3). The joint portion is bonded and fixed to the casing (7). A recessed adhesive accommodating structure (71) is arranged at an end face connecting the casing (7) to the joint portion. The adhesive accommodating structure (71) is arranged corresponding to an adhesive surface between the vibrating diaphragm (3) and the casing (7), and is an annular structure. According to the present invention, the loudspeaker's acoustic performance is stabilized, while the vibrating diaphragm (3) and the casing (7) can be firmly connected to each other.

Abstract: A microphone includes: a vibration electrode disposed in an upper portion of a substrate which has an acoustic hole; a fixed electrode separated from the upper portion of the vibration electrode by a reference distance and having an insulation membrane on each of an upper surface and a lower surface of the fixed electrode; and a piezoelectric electrode having a plurality of beams disposed in a radial direction outwards from a center of an upper portion of the fixed electrode and uniformly maintaining a space between the vibration electrode and the fixed electrode by bending the fixed electrode in one direction according to an input voltage.

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.

Abstract: A device is provided that comprises a membrane that includes one or more layers of an electrically resistive material. The device also comprises a film disposed along a surface of the membrane to form a coil. The film includes one or more layers of an electrically conductive material. The device also comprises a support structure coupled to a periphery of the membrane. The device also comprises a magnet arranged to provide a magnetic field that is substantially parallel to the surface of the membrane. The device also comprises a signal conditioner configured to provide an electrical signal to the coil to generate an electrical current flowing through the coil. The electrical current interacts with the magnetic field to cause a vibration of the membrane. Characteristics of the vibration are based on at least the electrical signal provided by the signal conditioner.

Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate to be spaced apart from the back plate, including venting holes communicating with the cavity, and sensing an acoustic pressure to create a displacement, a first insulation layer interposed between the substrate and the diaphragm to support the diaphragm, and the first insulation layer including an opening formed at a position corresponding to the cavity to expose the diaphragm, a second insulating layer formed over the substrate to cover an upper face of the back plate and an insulating interlayer formed between the first insulation layer and the second insulation layer, and the insulation interlayer being located outside the diaphragm and supporting the second insulation layer to make the back plate be spaced from the diaphragm.

Abstract: A system and method of using the system are provided. The system can include at least one source, a plurality of sensors, and a processing device. The source can emit one or more low frequency sounds. The sensors can sense the low frequency sounds and transform the low frequency sounds into one or more signals including a plurality of data values. The processing device can be communicatively operable with the sensors to receive the signals and determine positioning information of the sensors based on the data values.

Abstract: The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.

Abstract: The present invention provides a lateral microphone including a MEMS microphone. In the microphone, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to the fixed backplate, instead of moving toward/from the fixed backplate. A motional sensor is used in the microphone to estimate the noise introduced from acceleration or vibration of the microphone for the purpose of compensating the microphone output through a signal subtraction operation. In an embodiment, the motional sensor is identical to the lateral microphone, except that the movable membrane in the motional sensor has air ventilation holes for lowering the movable membrane's air resistance, and making the movable membrane responsive only to acceleration or vibration of the microphone.

Abstract: The present disclosure relates to a micro electro-mechanical system (MEMS) device comprising a fixed electrode, a moveable electrode that is moveable with respect to the fixed electrode and an output terminal for outputting a transducer output signal indicative of a capacitance between the fixed electrode and the moveable electrode. A package is provided which houses the fixed electrode and the moveable electrode, the package defining a first volume on a first side of the moveable electrode. The moveable electrode is moveable within the first volume in response to sound or pressure waves incident on the moveable electrode. A power dissipation element is disposed within the package. The power dissipation element is configured to receive a generated stimulus signal and to dissipate heat into the first volume so as to modulate the pressure of air within the first volume in accordance with the received generated stimulus signal.

Abstract: A package for a top port microphone with an enlarged back volume. The package includes on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.

Abstract: An acoustic apparatus includes a back plate, a diaphragm, and at least one pillar. The diaphragm and the back plate are disposed in spaced relation to each other. At least one pillar is configured to at least temporarily connect the back plate and the diaphragm across the distance. The diaphragm stiffness is increased as compared to a diaphragm stiffness in absence of the pillar. The at least one pillar provides a clamped boundary condition when the diaphragm is electrically biased and the clamped boundary is provided at locations where the diaphragm is supported by the at least one pillar.

Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and an anchor extending from a circumference of the diaphragm to be connected with an end portion of the diaphragm. The diaphragm is spaced apart from the substrate and the back plate to covers the cavity, and the diaphragm senses an acoustic pressure to generate a displacement. The anchor extends from a circumference of the diaphragm to be connected with an end portion of the diaphragm, and is connected with the substrate to support the diaphragm. Thus, the MEMS microphone can prevent a portion of an insulation layer located around the anchor from remaining and can prevent a buckling phenomenon of the diaphragm from occurring.

Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, a diaphragm being disposed between the substrate and the back plate and being spaced apart from the substrate and the back plate and at least one anti-buckling portion provided between the substrate and the diaphragm. The diaphragm covers the cavity and the diaphragm senses an acoustic pressure to create a displacement. The anti-buckling portion is configured to temporarily support the diaphragm in case of a warpage of the diaphragm to prevent a buckling of the diaphragm. Thus, the MEMS microphone can prevent the diaphragm from generating a warpage by more than a predetermined degree, so that the diaphragm can have a tensile stress and the buckling phenomenon of the diaphragm can be prevented.

Abstract: According to one embodiment, a laminated film includes a first adhesive layer, a first insulating layer which faces the first adhesive layer, a first metal layer which is located between the first adhesive layer and the first insulating layer, and a first porous layer which is located between the first adhesive layer and the first insulating layer and faces the first metal layer.

Abstract: A micro-electro-mechanical system (MEMS) transducer including an enclosure defining an interior space and having an acoustic port formed through at least one side of the enclosure. The transducer further including a compliant member positioned within the interior space and acoustically coupled to the acoustic port, the compliant member being configured to vibrate in response to an acoustic input. A back plate is further positioned within the interior space, the back plate being positioned along one side of the compliant member in a fixed position. A filter is positioned between the compliant member and the acoustic port, and the filter includes a plurality of axially oriented pathways and a plurality of laterally oriented pathways which are acoustically interconnected and dimensioned to prevent passage of a particle from the acoustic port to the compliant member.

Abstract: The present invention provides a microphone including: a microphone unit including a vibration plate that vibrates in response to sound; a unit board disposed rearward of the vibration plate; a first ground pattern disposed on the rear surface of the unit board; a unit casing accommodating the microphone unit and the unit board; a contact region of the unit casing, the contact region being in contact with the first ground pattern; a main board having a side face having a second ground pattern, the second ground pattern being in contact with the contact region; and an adhesive joining the side face of the main board to the microphone unit.

Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity.

Abstract: A MEMS transducer structure comprises a substrate comprising a cavity. A membrane layer is supported relative to the substrate to provide a flexible membrane. A peripheral edge of the cavity defines at least one perimeter region that is convex with reference to the center of the cavity. The peripheral edge of the cavity may further define at least one perimeter region that is concave with reference to the center of the cavity.

Abstract: An electroacoustic MEMS transducer, having a substrate of semiconductor material; a through cavity in the substrate; a back plate carried by the substrate through a plate anchoring structure, the back plate having a surface facing the through cavity; a fixed electrode, extending over the surface of the back plate; a membrane of conductive material, having a central portion facing the fixed electrode and a peripheral portion fixed to the surface of the back plate through a membrane anchoring structure; and a chamber between the membrane and the back plate, peripherally delimited by the membrane anchoring structure.

Abstract: A MEMS microphone, includes a base with a back cavity and a capacitor system fixed to the base. The capacitor system includes a back plate above the base and a diaphragm opposite to the back plate for forming an insulated gap. The back plate includes a body part and multiple spaced fixation parts extending from the body part, and the diaphragm includes a vibrating part and a connecting part extending from the vibrating part. An orthographic projection of the body part of the back plate along a vibration direction of the diaphragm is completely located on the diaphragm; and at least a part of an orthographic projection of the fixation parts along the vibration direction is located on the diaphragm.

Abstract: A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of the diaphragm to a backplate of the microelectromechanical microphone. The rigid dielectric member can extend between the backplate and the diaphragm. In certain embodiments, the dielectric member can be hollow, forming a shell that is centrosymmetric or has another type of symmetry. In other embodiments, the dielectric member can define a core-shell structure, where an outer shell of a first dielectric material defines an inner opening filled with a second dielectric material. Multiple dielectric members can rigidly attach the diaphragm to the backplate. An extended dielectric member can rigidly attach a non-planar diaphragm to a backplate.

Abstract: A microphone includes a conducting vibrating diaphragm; a back plate opposed to the vibrating diaphragm and including a plurality of through holes; a first electrode formed in a middle of the back plate; a second electrode formed at an edge of the back plate; and a support portion located between the first electrode and the second electrode for supporting the vibrating diaphragm when the vibrating diaphragm is electrified. When the sound pressure is applied in the middle of the vibrating diaphragm and drives the vibrating diaphragm to deform, the middle of the vibrating diaphragm moves relative to the first electrode, and the edge of the vibrating diaphragm moves relative to the second electrode, at this time, the first electrode and the second electrode generate reversed electric signals.

Abstract: A MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum includes a membrane carrier, a membrane that is connected in its edge area to the membrane carrier, and may vibrate along a z-axis with respect to the membrane carrier, and a stopper mechanism, which limits the vibrations of the membrane in at least one direction. The stopper mechanism includes at least one reinforcing element, which is arranged on one side of the membrane, and an end stop opposite to the reinforcing element. In a neutral position of the membrane, the end stop is spaced at a distance from the membrane and against which the reinforcing element abuts at a maximum deflection. A sound transducer arrangement includes such a MEMS sound transducer.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer.

Abstract: In an embodiment, a semiconductor device includes a semiconductor substrate including a front surface, an LDMOS transistor structure in the front surface, a conductive interconnection structure arranged on the front surface, and at least one cavity arranged in the front surface.

Abstract: A hole plate and a MEMS microphone arrangement are disclosed. In an embodiment a hole plate includes a substrate with a first main surface, a second main surface, and a lateral surface and a perforation structure formed within the substrate, the perforation structure having a plurality of through-holes through the substrate, wherein the through-holes and the lateral surface are a result of a simultaneous dry etching step.

Abstract: Radio-frequency (RF) devices are fabricated by providing a field-effect transistor (FET) formed over a an oxide layer formed on a substrate layer and removing at least a portion of the substrate layer to form an opening exposing at least a portion of a backside of the oxide layer, the opening being positioned to enhance RF performance for one or more components of the RF device.

Abstract: An acoustic resonator device for reproducing sound in audio headphones having acoustic transducers coupled to resonating structures composed of various materials which react to the vibrations of the transducers. The resonator structures are designed with large surface areas by using projections of rigid materials of various shapes, sizes and quantities. These projections also resonate at different frequencies. The acoustic resonator reproduces sound from audio sources without compression waves being directed into the ear. These compression waves emanate from more typical audio drivers found in most headphones and can lead to listening fatigue as well as discomfort. The acoustic resonator device also produces a haptic effect which produces a richer sound, especially in the low frequency range. More than one acoustic transducer and resonator assembly is used to reduce distortion by dividing the frequency response into low and high/mid frequency ranges.

Abstract: The invention proposes a MEMS component having a crystalline base body (GK), a recess (AN) and a structured assembly (A) which closes said recess, in which an opening (OG) is structured in a first functional layer (MN), the effective opening cross section thereof varying as a function of the pressure difference on the two sides of the first functional layer (MN).

Abstract: A MEMS sensor is disclosed. The MEMS sensor includes a housing having an acoustic port, a base plate forming an accommodation cavity together with the housing, a MEMS chip accommodated in the accommodation cavity, and a control mechanism having a first working position and a second working position. At the first working position, the acoustic port communicates the accommodation cavity with an external space of the housing, while at the second working position, the control mechanism isolates the accommodation cavity from the external space of the housing.

Abstract: A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter electrode element. The low pressure region has a pressure less than an ambient pressure.

Abstract: A differential pressure gradient micro-electro-mechanical system (MEMS) microphone for measuring an acoustic characteristic of a loudspeaker. The microphone includes a MEMS microphone housing and a compliant membrane mounted in the MEMS microphone housing, the compliant membrane dividing the MEMS microphone housing into a first chamber and a second chamber. The first chamber includes a primary port open to a first side of the compliant membrane and the second chamber includes a secondary port open to a second side of the compliant membrane, and the primary port and the secondary port are tuned with respect to one another to control a pressure difference between the first side and the second side of the compliant membrane such that at least 10 dB of attenuation is observed in a microphone signal output relative to a microphone having a sealed first or second chamber.

Abstract: A Micro-Electro-Mechanical System (MEMS) microphone and a method for forming the same are provided. The method includes: providing a first substrate including a first surface and a second surface opposite to each other; providing a second substrate including a third surface and a fourth surface opposite to each other; bonding the first surface of the first substrate and the third surface of the second substrate to each other; removing a second base of the second substrate to form a fifth surface opposite to the third surface of the second substrate; forming a cavity between the first substrate and the sensitive region of the second substrate; and forming a first conductive plug from the side of the fifth surface of the second substrate, with the first conductive plug passing through to at least one of the conductive layers.

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

Abstract: A microphone sensor provides, a receiving space disposed on a cover and a control module and positioned with a sound sensing module in the receiving space. The microphone sensor includes a cover having a receiving groove formed at a lower portion and an air inlet that a sound signal flow in through within a control module coupled to the lower portion of the cover. Furthermore, a sound sensing module is coupled to the control module and positioned at the receiving groove.

Abstract: A microphone is disclosed. The microphone includes a housing and a circuit board cooperatively forming an accommodation space to accommodate a MEMS chip. The housing forms a first sound channel and the circuit board forms a second sound channel. Further, the microphone includes a controller for controlling the switch of the first and second sound channels.

Abstract: A capacitive silicon microphone comprises: a first dielectric layer sets on a substrate with a back cavity, a lower polar plate which is located over the back cavity, a first elastic member of which an inner edge is connected with the edge of the lower polar plate and an outer edge is located on the upper surface of the first dielectric layer, a second dielectric layer which is located on the outer edge of the first elastic member and right above the first dielectric layer, an upper polar plate which has a plurality of release holes and is formed above the lower polar plate with an air gap in between, a second elastic member of which an inner edge is connected with the edge of the upper polar plate and an outer edge is located on the upper surface of the second dielectric layer.

Abstract: Microphone systems and methods of determining absolute sensitivities of a MEMS microphone. The microphone system includes a speaker, a MEMS microphone, and a controller. The speaker is configured to generate an acoustic pressure. The MEMS microphone includes a capacitive electrode, a piezoelectric electrode, and a backplate. The capacitive electrode is configured to generate a first capacitive response based on the acoustic pressure and generate a first mechanical pressure based on a capacitive control signal. The piezoelectric electrode is coupled to the capacitive electrode. The piezoelectric electrode is configured to generate a first piezoelectric response signal based on the acoustic pressure and generate a second piezoelectric response signal based on the first mechanical pressure.

Abstract: A condenser microphone unit that has a capacitor element with a large effective area and a high signal-noise ratio but does not have frequency-dependence occurring with sound waves beyond the audio frequency range. A solid cylindrical fixed electrode pole is used as a fixed electrode. A diaphragm includes a rectangular synthetic resin film having a length smaller than or equal to the axis length of the fixed electrode pole, and a width equal to a circumferential length of the fixed electrode pole, the synthetic resin film including an electrode film on one face and ribs on the other face and entirely partitioned by the ribs into a plurality of diaphragm regions. The synthetic resin film is attached to an entire outer periphery of the fixed electrode pole such that the ribs are in contact with the outer periphery.

Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.

Abstract: A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element.

Abstract: Methods and apparatus to collect media identifying data are disclosed. An example system to monitor media includes a printed circuit board defining a sound hole, the sound hole including a cylindrical portion and a chamfered opening, the sound hole having an effective length-to-width ratio of about 1.25; a memory including machine readable instructions; and a processor to execute the instructions to process the audio data collected through the sound hole to obtain media identifying data.