Abstract: An acoustic apparatus includes a back plate, a diaphragm, and at least one pillar. The diaphragm and the back plate are disposed in spaced relation to each other. At least one pillar is configured to at least temporarily connect the back plate and the diaphragm across the distance. The diaphragm stiffness is increased as compared to a diaphragm stiffness in absence of the pillar. The at least one pillar provides a clamped boundary condition when the diaphragm is electrically biased and the clamped boundary is provided at locations where the diaphragm is supported by the at least one pillar.

Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, a diaphragm being disposed between the substrate and the back plate and being spaced apart from the substrate and the back plate and at least one anti-buckling portion provided between the substrate and the diaphragm. The diaphragm covers the cavity and the diaphragm senses an acoustic pressure to create a displacement. The anti-buckling portion is configured to temporarily support the diaphragm in case of a warpage of the diaphragm to prevent a buckling of the diaphragm. Thus, the MEMS microphone can prevent the diaphragm from generating a warpage by more than a predetermined degree, so that the diaphragm can have a tensile stress and the buckling phenomenon of the diaphragm can be prevented.

Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and an anchor extending from a circumference of the diaphragm to be connected with an end portion of the diaphragm. The diaphragm is spaced apart from the substrate and the back plate to covers the cavity, and the diaphragm senses an acoustic pressure to generate a displacement. The anchor extends from a circumference of the diaphragm to be connected with an end portion of the diaphragm, and is connected with the substrate to support the diaphragm. Thus, the MEMS microphone can prevent a portion of an insulation layer located around the anchor from remaining and can prevent a buckling phenomenon of the diaphragm from occurring.

Abstract: According to one embodiment, a laminated film includes a first adhesive layer, a first insulating layer which faces the first adhesive layer, a first metal layer which is located between the first adhesive layer and the first insulating layer, and a first porous layer which is located between the first adhesive layer and the first insulating layer and faces the first metal layer.

Abstract: A micro-electro-mechanical system (MEMS) transducer including an enclosure defining an interior space and having an acoustic port formed through at least one side of the enclosure. The transducer further including a compliant member positioned within the interior space and acoustically coupled to the acoustic port, the compliant member being configured to vibrate in response to an acoustic input. A back plate is further positioned within the interior space, the back plate being positioned along one side of the compliant member in a fixed position. A filter is positioned between the compliant member and the acoustic port, and the filter includes a plurality of axially oriented pathways and a plurality of laterally oriented pathways which are acoustically interconnected and dimensioned to prevent passage of a particle from the acoustic port to the compliant member.

Abstract: The present invention provides a microphone including: a microphone unit including a vibration plate that vibrates in response to sound; a unit board disposed rearward of the vibration plate; a first ground pattern disposed on the rear surface of the unit board; a unit casing accommodating the microphone unit and the unit board; a contact region of the unit casing, the contact region being in contact with the first ground pattern; a main board having a side face having a second ground pattern, the second ground pattern being in contact with the contact region; and an adhesive joining the side face of the main board to the microphone unit.

Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity.

Abstract: A MEMS transducer structure comprises a substrate comprising a cavity. A membrane layer is supported relative to the substrate to provide a flexible membrane. A peripheral edge of the cavity defines at least one perimeter region that is convex with reference to the center of the cavity. The peripheral edge of the cavity may further define at least one perimeter region that is concave with reference to the center of the cavity.

Abstract: An electroacoustic MEMS transducer, having a substrate of semiconductor material; a through cavity in the substrate; a back plate carried by the substrate through a plate anchoring structure, the back plate having a surface facing the through cavity; a fixed electrode, extending over the surface of the back plate; a membrane of conductive material, having a central portion facing the fixed electrode and a peripheral portion fixed to the surface of the back plate through a membrane anchoring structure; and a chamber between the membrane and the back plate, peripherally delimited by the membrane anchoring structure.

Abstract: A MEMS microphone, includes a base with a back cavity and a capacitor system fixed to the base. The capacitor system includes a back plate above the base and a diaphragm opposite to the back plate for forming an insulated gap. The back plate includes a body part and multiple spaced fixation parts extending from the body part, and the diaphragm includes a vibrating part and a connecting part extending from the vibrating part. An orthographic projection of the body part of the back plate along a vibration direction of the diaphragm is completely located on the diaphragm; and at least a part of an orthographic projection of the fixation parts along the vibration direction is located on the diaphragm.

Abstract: A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of the diaphragm to a backplate of the microelectromechanical microphone. The rigid dielectric member can extend between the backplate and the diaphragm. In certain embodiments, the dielectric member can be hollow, forming a shell that is centrosymmetric or has another type of symmetry. In other embodiments, the dielectric member can define a core-shell structure, where an outer shell of a first dielectric material defines an inner opening filled with a second dielectric material. Multiple dielectric members can rigidly attach the diaphragm to the backplate. An extended dielectric member can rigidly attach a non-planar diaphragm to a backplate.

Abstract: A MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum includes a membrane carrier, a membrane that is connected in its edge area to the membrane carrier, and may vibrate along a z-axis with respect to the membrane carrier, and a stopper mechanism, which limits the vibrations of the membrane in at least one direction. The stopper mechanism includes at least one reinforcing element, which is arranged on one side of the membrane, and an end stop opposite to the reinforcing element. In a neutral position of the membrane, the end stop is spaced at a distance from the membrane and against which the reinforcing element abuts at a maximum deflection. A sound transducer arrangement includes such a MEMS sound transducer.

Abstract: A microphone includes a conducting vibrating diaphragm; a back plate opposed to the vibrating diaphragm and including a plurality of through holes; a first electrode formed in a middle of the back plate; a second electrode formed at an edge of the back plate; and a support portion located between the first electrode and the second electrode for supporting the vibrating diaphragm when the vibrating diaphragm is electrified. When the sound pressure is applied in the middle of the vibrating diaphragm and drives the vibrating diaphragm to deform, the middle of the vibrating diaphragm moves relative to the first electrode, and the edge of the vibrating diaphragm moves relative to the second electrode, at this time, the first electrode and the second electrode generate reversed electric signals.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: In an embodiment, a semiconductor device includes a semiconductor substrate including a front surface, an LDMOS transistor structure in the front surface, a conductive interconnection structure arranged on the front surface, and at least one cavity arranged in the front surface.

Abstract: A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer.

Abstract: A hole plate and a MEMS microphone arrangement are disclosed. In an embodiment a hole plate includes a substrate with a first main surface, a second main surface, and a lateral surface and a perforation structure formed within the substrate, the perforation structure having a plurality of through-holes through the substrate, wherein the through-holes and the lateral surface are a result of a simultaneous dry etching step.

Abstract: Radio-frequency (RF) devices are fabricated by providing a field-effect transistor (FET) formed over a an oxide layer formed on a substrate layer and removing at least a portion of the substrate layer to form an opening exposing at least a portion of a backside of the oxide layer, the opening being positioned to enhance RF performance for one or more components of the RF device.

Abstract: An acoustic resonator device for reproducing sound in audio headphones having acoustic transducers coupled to resonating structures composed of various materials which react to the vibrations of the transducers. The resonator structures are designed with large surface areas by using projections of rigid materials of various shapes, sizes and quantities. These projections also resonate at different frequencies. The acoustic resonator reproduces sound from audio sources without compression waves being directed into the ear. These compression waves emanate from more typical audio drivers found in most headphones and can lead to listening fatigue as well as discomfort. The acoustic resonator device also produces a haptic effect which produces a richer sound, especially in the low frequency range. More than one acoustic transducer and resonator assembly is used to reduce distortion by dividing the frequency response into low and high/mid frequency ranges.

Abstract: The invention proposes a MEMS component having a crystalline base body (GK), a recess (AN) and a structured assembly (A) which closes said recess, in which an opening (OG) is structured in a first functional layer (MN), the effective opening cross section thereof varying as a function of the pressure difference on the two sides of the first functional layer (MN).

Abstract: A MEMS sensor is disclosed. The MEMS sensor includes a housing having an acoustic port, a base plate forming an accommodation cavity together with the housing, a MEMS chip accommodated in the accommodation cavity, and a control mechanism having a first working position and a second working position. At the first working position, the acoustic port communicates the accommodation cavity with an external space of the housing, while at the second working position, the control mechanism isolates the accommodation cavity from the external space of the housing.

Abstract: A MEMS microphone includes a first diaphragm element, a counter electrode element, and a low pressure region between the first diaphragm element and the counter electrode element. The low pressure region has a pressure less than an ambient pressure.

Abstract: A differential pressure gradient micro-electro-mechanical system (MEMS) microphone for measuring an acoustic characteristic of a loudspeaker. The microphone includes a MEMS microphone housing and a compliant membrane mounted in the MEMS microphone housing, the compliant membrane dividing the MEMS microphone housing into a first chamber and a second chamber. The first chamber includes a primary port open to a first side of the compliant membrane and the second chamber includes a secondary port open to a second side of the compliant membrane, and the primary port and the secondary port are tuned with respect to one another to control a pressure difference between the first side and the second side of the compliant membrane such that at least 10 dB of attenuation is observed in a microphone signal output relative to a microphone having a sealed first or second chamber.

Abstract: A Micro-Electro-Mechanical System (MEMS) microphone and a method for forming the same are provided. The method includes: providing a first substrate including a first surface and a second surface opposite to each other; providing a second substrate including a third surface and a fourth surface opposite to each other; bonding the first surface of the first substrate and the third surface of the second substrate to each other; removing a second base of the second substrate to form a fifth surface opposite to the third surface of the second substrate; forming a cavity between the first substrate and the sensitive region of the second substrate; and forming a first conductive plug from the side of the fifth surface of the second substrate, with the first conductive plug passing through to at least one of the conductive layers.

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

Abstract: A microphone sensor provides, a receiving space disposed on a cover and a control module and positioned with a sound sensing module in the receiving space. The microphone sensor includes a cover having a receiving groove formed at a lower portion and an air inlet that a sound signal flow in through within a control module coupled to the lower portion of the cover. Furthermore, a sound sensing module is coupled to the control module and positioned at the receiving groove.

Abstract: A microphone is disclosed. The microphone includes a housing and a circuit board cooperatively forming an accommodation space to accommodate a MEMS chip. The housing forms a first sound channel and the circuit board forms a second sound channel. Further, the microphone includes a controller for controlling the switch of the first and second sound channels.

Abstract: A capacitive silicon microphone comprises: a first dielectric layer sets on a substrate with a back cavity, a lower polar plate which is located over the back cavity, a first elastic member of which an inner edge is connected with the edge of the lower polar plate and an outer edge is located on the upper surface of the first dielectric layer, a second dielectric layer which is located on the outer edge of the first elastic member and right above the first dielectric layer, an upper polar plate which has a plurality of release holes and is formed above the lower polar plate with an air gap in between, a second elastic member of which an inner edge is connected with the edge of the upper polar plate and an outer edge is located on the upper surface of the second dielectric layer.

Abstract: Microphone systems and methods of determining absolute sensitivities of a MEMS microphone. The microphone system includes a speaker, a MEMS microphone, and a controller. The speaker is configured to generate an acoustic pressure. The MEMS microphone includes a capacitive electrode, a piezoelectric electrode, and a backplate. The capacitive electrode is configured to generate a first capacitive response based on the acoustic pressure and generate a first mechanical pressure based on a capacitive control signal. The piezoelectric electrode is coupled to the capacitive electrode. The piezoelectric electrode is configured to generate a first piezoelectric response signal based on the acoustic pressure and generate a second piezoelectric response signal based on the first mechanical pressure.

Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.

Abstract: A condenser microphone unit that has a capacitor element with a large effective area and a high signal-noise ratio but does not have frequency-dependence occurring with sound waves beyond the audio frequency range. A solid cylindrical fixed electrode pole is used as a fixed electrode. A diaphragm includes a rectangular synthetic resin film having a length smaller than or equal to the axis length of the fixed electrode pole, and a width equal to a circumferential length of the fixed electrode pole, the synthetic resin film including an electrode film on one face and ribs on the other face and entirely partitioned by the ribs into a plurality of diaphragm regions. The synthetic resin film is attached to an entire outer periphery of the fixed electrode pole such that the ribs are in contact with the outer periphery.

Abstract: A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element.

Abstract: Methods and apparatus to collect media identifying data are disclosed. An example system to monitor media includes a printed circuit board defining a sound hole, the sound hole including a cylindrical portion and a chamfered opening, the sound hole having an effective length-to-width ratio of about 1.25; a memory including machine readable instructions; and a processor to execute the instructions to process the audio data collected through the sound hole to obtain media identifying data.

Abstract: A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.

Abstract: A semiconductor structure includes a first device and a second device. The first device includes a plate including a plurality of apertures, a membrane disposed opposite to the plate and including a plurality of corrugations facing the plurality of apertures, and a conductive plug extending from the plate through the membrane. The second device includes a substrate and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate is an epitaxial (EPI) silicon layer or a silicon-on-insulator (SOI) substrate.

Abstract: An apparatus includes a microphone and a gasket. The microphone includes a base having an inner surface and an outer surface. The inner surface is generally parallel with the outer surface. The base has a port extending from the outer surface to the inner surface. The microphone includes a micro electro mechanical system (MEMS) transducer coupled to the inner surface of the base over the port. The microphone has a cover coupled to the base and the cover encloses the MEMS transducer. The gasket is coupled to the outer surface of the base and forms a channel. The channel has a first end and a second end. The first end communicates with the port of the microphone, and the second end of the channel is generally aligned with an edge of the base.

Abstract: A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micromachined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.

Abstract: A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.

Abstract: An acoustic apparatus includes a back plate, a diaphragm, and at least one pillar. The diaphragm and the back plate are disposed in spaced relation to each other. At least one pillar is configured to at least temporarily connect the back plate and the diaphragm across the distance. The diaphragm stiffness is increased as compared to a diaphragm stiffness in absence of the pillar. The at least one pillar provides a clamped boundary condition when the diaphragm is electrically biased and the clamped boundary is provided at locations where the diaphragm is supported by the at least one pillar.

Abstract: An acoustic sensor adapted to convert acoustic vibration to a change in an electrostatic capacitance to detect the acoustic vibration is provided. The acoustic sensor includes a semiconductor substrate, a back plate including a fixed plate arranged to face a surface of the semiconductor substrate, and a fixed electrode film arranged on the fixed plate, and a vibrating electrode film arranged to face the back plate with a space formed therebetween. The vibrating electrode film includes a plate-like vibrating member that vibrates in response to sound pressure. The vibrating electrode film is fixed to the back plate with a fixing unit thereof including one or more fixing portions each including a fixing protruding end that is arranged on a protruding end of a leg portion protruding from an edge of the vibrating member. The vibrating member has an edge portion surrounding at least a part of the fixing protruding end.

Abstract: A microphone includes a case including a plurality of sound holes; a first sound device installed at positions corresponding to at least two sound holes in the case; a second sound device spaced apart from the first sound device in the case and installed at a position corresponding to at least one sound hole; and a semiconductor chip electrically connected to the first sound device and the second sound device, where the at least two sound holes formed in the positions corresponding to the first sound device are each formed in upper and lower surfaces of the case on the basis of the first sound device.

Abstract: A method of forming semiconductor devices, such as capacitive type MEMS acoustic transducers, in a semiconductor includes forming a mask layer on a back surface of the semiconductor wafer and removing first etch portions of the mask layer and scribe trench portions of the mask layer. Each scribe trench portion is positioned in the mask layer to define a corresponding scribe boundary of a plurality of the semiconductor devices being formed in the semiconductor wafer. Etching the semiconductor wafer through the first etch portions and the scribe trench portions may be done simultaneously to form external back chambers and scribe trenches, respectively, in the semiconductor wafer. The semiconductor wafer is then cut along cutting lines in the scribe trenches to singulate individual MEMS acoustic transducers. The etching through the first and second etch portions and the scribe trench portions are dry etching of the semiconductor substrate in one embodiment.

Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.

Abstract: In the present disclosure a semiconductor device comprises a plate including a plurality of apertures. The semiconductor device also comprises a membrane disposed opposite to the plate and including a plurality of corrugations, a dielectric surrounding and covering an edge of the membrane, and a substrate. The semiconductor device further includes a metallic conductor comprising a first portion extending through the dielectric, and a second portion over the substrate, where the second portion is bonded with the first portion.

Abstract: A device is provided. The device includes: a sensor adapted to receive an acoustic wave and generate an electrical signal in response to receipt of the acoustic wave; clock frequency detection circuitry adapted to receive a clock signal, detect a frequency of the clock signal and generate information representative of the frequency; and digital filter circuitry coupled to the clock frequency detection circuitry. The digital filter circuitry is adapted to: receive the clock signal and the information representative of the frequency; access a first set of one or more digital filter coefficient values; and selectively change the first set of the one or more digital filter coefficient values to a second set of one or more digital filter coefficient values based on the information representative of the frequency, wherein the one or more digital filter coefficient values are included within a plurality of digital filter coefficient values.

Abstract: An acoustic transducer has a back plate having a fixed electrode, a diaphragm that is opposed to the back plate with a gap interposed therebetween and that serves as a movable electrode, and a stopper protruding from a face of the back plate or the diaphragm, which is on a side of the gap. The stopper includes a conductive section electrically isolated from the fixed electrode and the movable electrode. The conductive section comes in contact with a front face of the fixed electrode or the movable electrode opposed to the stopper through deformation of the diaphragm.

Abstract: A mobile telephone includes a cartilage conduction unit for making contact with the ear cartilage. The cartilage conduction unit is provided to at least one of two corner parts at an upper side of the mobile telephone. The mobile telephone can include a surface of an outer wall and a cartilage conduction vibration source arranged inward from the surface of the outer wall, the vibration of the cartilage conduction vibration source being transmitted to the surface of the outer wall, wherein when the surface of the outer wall is brought into contact with at least a part of the ear cartilage around the entrance part to the external auditory meatus without making contact with the auricular helix, the sound pressure inside the external auditory meatus at about 1 cm from the entrance part of the external auditory meatus has an at least 10 dB increase compared to the non-contact state.

Abstract: A sensing circuit includes: a follower transistor, having a control terminal; a follower terminal for connection to a load; a bias-current generator, coupled to the follower terminal; and a feedback stage, configured to control the bias-current generator as a function of an input signal on the control terminal of the follower transistor.

Abstract: A MEMS microphone including a plurality of overtravel stops (OTS) connected to a perimeter of a membrane of the MEMS microphone. The OTS are released from a backplate layer during manufacturing and are configured to contact the backplate to restrict movement of the OTS and thus restrict movement of the membrane of the MEMS microphone. Embodiments of the invention provide, in particular, an overtravel stop that limits movement of the membrane in a radial direction.

Abstract: An acoustic sensor is provided for improving shock resistance performance, along with a method for manufacturing the acoustic sensor. In the acoustic sensor, a fixing plate is provided by a semiconductor manufacturing process, a frame wall has a curved shape in at least a portion of the periphery of the fixing plate, the frame wall being coupled to the semiconductor substrate. A sacrifice layer removed from the inner side of the fixing plate in the manufacturing process remains at least on a portion of the inner side of the frame wall. Roughness of the remaining sacrifice layer is smaller than roughness of a sound shape reflecting structure in which a shape similar to the external shape of sound holes is repeated. Roughness of the sound shape reflecting structure is formed when removing the sacrifice layer using etching liquid supplied from the plurality of sound holes in the semiconductor manufacturing process.