Abstract: A method of processing component carriers includes supplying a plurality of arrays, each comprising a plurality of component carriers, to a human operator for optical inspection, displaying a respective array on a display, and providing a user interface enabling the human operator to input a judgment concerning a quality classification of a displayed array without a mandatory manual handling of the array by the human operator.

Abstract: A lithographic apparatus and associated method of controlling a lithographic process. The lithographic apparatus has a controller configured to define a control grid associated with positioning of a substrate within the lithographic apparatus. The control grid is based on a device layout, associated with a patterning device, defining a device pattern which is to be, and/or has been, applied to the substrate in a lithographic process.

Abstract: An information processing apparatus for supporting a user's task for identifying a defect in an object based on a target image that is a photographed image of the object, includes: a selecting unit that selects, based on an user's input, one from one or more reference images to which is referred by the user for identifying a defect in the object; a display unit that comparably displays the target image and the selected reference image on a certain display device; a specifying unit that receives an user's operation for specifying a defect in the target image displayed by the display unit; and a generating unit that generates a new reference image based on a partial area, of the target image, including the specified defect. A new reference image generated by the generating unit is added to the one or more reference images selectable by the selecting unit.

Abstract: A component mounting system includes a component mounting device including a component mounting unit configured to mount a component on a substrate, and a controller, and a server configured to be communicable with the controller. The controller is configured or programmed to acquire a plurality of types of operating state changes that are likely to cause a quality defect, and to transmit, to the server, information according to the types of the operating state changes. The server is configured to provide information indicating an inspection type for the substrate based on the information according to the types of the operating state changes.

Abstract: A printed circuit board inspection apparatus can inspect the mounting state of a component by generating depth information on the component mounted on a printed circuit board by using a pattern of light reflected from the component and received by an image sensor, inputting the generated depth information into a machine-learning-based model, obtaining depth information with reduced noise from the machine-learning-based model, and using depth information with reduced noise.

Abstract: A connected layer feature is generated by connecting outputs of a plurality of layers of a hierarchical neural network obtained by processing an input image using the hierarchical neural network. An attribute score map representing an attribute of each region of the input image is generated for each attribute using the connected layer feature. A recognition result for a recognition target is generated and output by integrating the generated attribute score maps for respective attributes.

Abstract: A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

Abstract: An information processing apparatus includes a control unit that creates a plurality of learning information items including an input image and a teacher image as an expected value by image-processing the input image in accordance with a scenario described with a program code, and supplies the created plurality of learning information items to a machine learning module that composes an image processing algorithm by machine learning.

Abstract: Techniques for performing ray tracing operations are provided. The techniques include identifying bounding-box-surface-area-weighted centroid of a group of primitives associated with a bounding box of a bounding volume hierarchy (“BVH”); generating candidate splits at the centroid, the candidate splits defining geometry subgroups; identifying a candidate split having a lowest surface area bounding box; and generating nodes for the BVH that include geometry of the geometry subgroups of the identified candidate split.

Abstract: Methods and systems for enhanced defect detection based on images collected by at least two imaging detectors at different times are described. In some embodiments, the time between image measurements is at least 100 microseconds and no more than 10 milliseconds. In one aspect, one or more defects of interest are identified based on a composite image of a measured area generated based on a difference between collected images. In a further aspect, measurement conditions associated with the each imaged location are adjusted to be different for measurements performed by at least two imaging detectors at different times. In some embodiments, the measurement conditions are adjusted during the time between measurements by different imaging detectors. Exemplary changes of measurement conditions include environmental changes at the wafer under measurement and changes made to the optical configuration of the inspection system.

Abstract: One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.

Abstract: A method of training a detection system is able to acquire volume image data in an additively manufactured object for the detection of process irregularities, and comprises the steps of: a) receiving process irregularity data referring to a selected location within an additively manufactured reference object in which selected location a predefined process irregularity occurred during the additive manufacture of the object, b) acquiring volume image data of a volume of the reference object comprising at least the selected location by said detection system, c) identifying within the volume image data characteristic data which represent a difference between the volume image data of the selected location in comparison with the volume image data of at least one other location of the reference object and/or of a number of other additively manufactured objects in which no process irregularity has occurred and/or no process irregularity is suspected, d) assigning to the predefined process irregularity the characteris

Abstract: A method of defect detection in packaging containers for liquid food is disclosed, where packaging containers are produced in a machine. The method comprises capturing image data of the packaging containers, defining image features in the image data representing defects in the packaging containers, associating the image features with different categories of defects, inputting the image features to a machine learning-based model for subsequent detection of categories of defects in packaging containers based on the image features, determining time stamps for the occurrence of defects in said subsequent detection, determining associated production parameters of the packaging containers in the machine for the occurrence of defects based on the time stamps, and correlating said occurrence and category of the defects with said production parameters. A system for defect detection in packaging containers is also disclosed.

Abstract: According to one embodiment, provided is a chip recognition system that recognizes a chip on a gaming table in an amusement place having the gaming table, the chip recognition system including: a game recording apparatus that records, as an image, a state of chips stacked on the gaming table, using a camera; an image analysis apparatus that performs an image analysis on the recorded image of the state of chips; a plurality of chip determination apparatuses including at least a first artificial intelligence apparatus that determines a number of the chips stacked, using an image analysis result obtained by the image analysis apparatus; and a second artificial intelligence apparatus that decides a correct number of the chips stacked, when the plurality of chip determination apparatuses obtain different determination results for the number of the chips stacked.

Abstract: A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.

Abstract: Provided is a pattern inspection method including: irradiating a substrate with an electron beam, a pattern being formed on the substrate; acquiring an inspection image as a secondary electron image of the pattern; setting a pixel value equal to or less than a first threshold value minus a half of a predetermined detection width of the inspection image and a pixel value equal to or more than the first threshold value plus a half of the predetermined detection width of the inspection image to unprocessed; acquiring a difference image between the inspection image having the pixel value having less than the first threshold value minus the half of the predetermined detection width and the pixel value having more of the first threshold value plus the half of the predetermined detection width being set to unprocessed and a reference image of the inspection image; and performing inspection on the basis of the difference image.

Abstract: An example test system includes a test carrier to hold devices for test; a device shuttle to transport the devices; and a robot to move the devices between the test carrier and the device shuttle. The device shuttle is configured to move, towards a stage of the test system containing the robot, a first device among the devices that has not been tested. The device shuttle is configured to move in a first dimension. The robot is configured to move the first device from the device shuttle to the test carrier. The robot is configured to move in a second dimension that is different from the first dimension.

Abstract: A system and method for inspection and cosmetic grading of objects is provided. Camera and lighting assemblies capture images of an object and create a 2D composite image which is processed by an image processing module with a deep learning machine algorithm to detect surface defects in the object. Detected defects are localized and measured for depth of defect by an advanced optical sensor, providing a 3D representation of defects. A cosmetic grading algorithm determines the cosmetic grade of the object and the optimal path of disposition for the item based on the grade.

Abstract: Metrology target design methods and verification targets are provided. Methods include using OCD data related to designed metrology target(s) as an estimation of a discrepancy between a target model and a corresponding actual target on a wafer, and adjusting a metrology target design model to compensate for the estimated discrepancy. The dedicated verification targets may include overlay target features and be size optimized to be measurable by an OCD sensor, to enable compensation for inaccuracies resulting from production process variation. Methods also include modifications to workflows between manufacturers and metrology vendors which provide enabled higher fidelity metrology target design models and ultimately higher accuracy of metrology measurements.

Abstract: A printed circuit board inspection apparatus obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.

Abstract: Systems and techniques for image segmentation into overlapping tiles are described herein. In an example, an anomaly detection system for super-high-resolution images is adapted to divide the image into tiles with a size and overlap between each tile, wherein the size and overlap is determined using a machine-learning model. The anomaly detection system may be further adapted to use a classifier model for each tile to identify anomaly presence in the tile, wherein the classifier model is trained using a data set of tile size images that are labeled according to anomaly presence in each tile size image. The anomaly detection system may be further adapted to determine a classification for the image based on results from the classifier model for the tiles. The anomaly detection system may be further adapted to output the classification.

Abstract: A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such as unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.

Abstract: An image measurement system includes a controller, a projector for emitting illumination light in accordance with a radiation pattern, an imaging unit, and a display unit. The controller includes a display control module for displaying on a display unit an image of a field of view captured by the imaging unit in a state in which illumination light is emitted, a receiving module for receiving a setting of a mask area in association with the image displayed on the display unit, the mask area being an area in which the quantity of illumination light should be reduced compared with another area in the field of view, and an updating module for updating the radiation pattern in accordance with the set mask area, based on a correspondence in position between the radiation pattern of the projector and a projection pattern produced in the field of view by the radiation pattern.

Abstract: A method and apparatus for separating real DVC via defects from nuisance based on Net Tracing Classification of eBeam VC die comparison inspection results are provided. Embodiments include performing an eBeam VC die comparison inspection on each via of a plurality of dies; determining DVC vias based on the comparison; performing a Net Tracing Classification on the DVC vias; determining S/D DVC vias based on the Net Tracing Classification; and performing a die repeater analysis on the S/D DVC vias to determine systematic design-related DVC via defects.

Abstract: A pattern width deviation measurement method includes measuring width dimensions of a plurality of figure patterns in an optical image from data of gray-scale value profiles of the optical image, using a threshold of a gray-scale value level variably set depending on design dimension information including design width dimension of a corresponding figure pattern of a plurality of figure patterns, and at which influence of a focus position on width dimension becomes smaller, measuring width dimensions of a plurality of corresponding figure patterns in a reference image from data of gray-scale value profiles of the reference image, respectively using the threshold for the corresponding figure pattern of a plurality of figure patterns, and calculating, for each of measured width dimensions of a plurality of figure patterns in the optical image, an amount deviated from a measured width dimension of a corresponding figure pattern in the reference image.

Abstract: An image processing apparatus according to an embodiment includes processing circuitry. The processing circuitry sets a reference position in an area extracted by performing first processing on first image data. The processing circuitry sets a processing condition based on a pixel value at the reference position. The processing circuitry changes a threshold included in the processing condition in stages and performs second processing for extracting an area corresponding to the threshold on the first image data at each stage, thereby generating second image data including a result of the second processing at each stage.

Abstract: The present disclosure provides a method and a device of inspecting a sealant coating on a substrate. An image of a sample substrate is captured. The sample substrate is selected from a plurality of substrates. A non-coating area is identified from the image of the sample substrate. Abnormal points are identified in the non-coating area. Positions of the abnormal points are recorded. An image of a sealant-coated substrate having a sealant coating on one of the plurality of substrates is captured. Defect positions of the sealant coating are identified from the image of the sealant-coated substrate. Defects located in a non-coating area of the sealant-coated substrate at positions corresponding to the positions of the abnormal points identified based on the sample substrate are considered as normal.

Abstract: An image processing apparatus includes an acquirer which acquires a blurred image and a generator which acquires a first blur estimation area of at least a part of the blurred image to generate an estimated blur, and the generator determines a second blur estimation area based on a signal variation in the first blur estimation area, generates the estimated blur by performing iterative calculation processing that repeats correction processing and estimation processing, and determines the second blur estimation area having a signal variation larger than the signal variation in the first blur estimation area when the signal variation in the first blur estimation area is smaller than a first threshold value.

Abstract: An image processing apparatus includes an acquirer which acquires a blurred image, and a generator which acquires a blur estimation area of at least a part of the blurred image to generate an estimated blur based on the blur estimation area, and the generator generates the estimated blur by performing iterative calculation processing that repeats correction processing and estimation processing, the correction processing correcting a blur included in information relating to a signal in the blur estimation area to generate information relating to a correction signal, and the estimation processing estimating a blur based on the information relating to the signal and the information relating to the correction signal, and generates, as the information relating to the correction signal, information relating to a plurality of correction signals by using a plurality of different calculation expressions in at least one correction processing during the iterative calculation processing.

Abstract: The invention relates to a method for automated determination of a reference point of an alignment mark on a substrate of a photolithographic mask, which method comprises the following steps: (a) performing a first line scan within a start region of the substrate in a first direction on a surface of the substrate, the alignment mark being arranged within the start region, for locating a first element of the alignment mark; (b) performing a second line scan within the start region in at least a second direction, which intersects the first direction, on the surface of the substrate for locating a second element of the alignment mark; (c) estimating the reference point of the alignment mark from the located first element and the located second element of the alignment mark; and (d) imaging a target region around the estimated reference point of the alignment mark in order to determine the reference point of the alignment mark, with the imaging being carried out at a higher resolution than the performance of the

Abstract: Provided is a method and apparatus for recognizing material of objects by extracting physical properties of objects in a camera photo based on the combined analysis of information obtained by a camera and a radar unit.

Abstract: A method, image processing system, and computer-readable recording medium for item defect inspection are provided. The method is as follows. A test image and a reference image of a test item are received. A test block and a corresponding reference block are obtained from the test image and the reference image to generate a test block image and a reference block image. The test block image and the reference block image are respectively partitioned into multiple sub-blocks. All interfering sub-blocks are identified and filtered out from the test block image and the reference block image, and a shift calibration parameter is obtained accordingly. The test block in the test image is calibrated based on the shift calibration parameter to generate a calibrated test block image. The calibrated test block image and the reference block image are compared to obtain defect information of the test item corresponding to the test block.

Abstract: An inspection system for and method of inspecting deposits printed on workpieces through a printing screen, the system comprising: a camera unit movable relative to a printing screen, where comprising a body including a plurality of apertures, and a workpiece on which deposits are printed through the apertures of the printing screen; and a control unit operable to control the camera unit such as to capture images of at least one pair of corresponding regions of the printing screen and the workpiece, and process the images to determine, for each of a plurality of points defining the image of the printing screen, whether the point is of aperture, and, only where the point is of aperture, determine whether the corresponding point of the corresponding image of the workpiece, as defined by a corresponding plurality of points, is of deposit, thereby enabling a determination of a print characteristic of deposits printed on the workpiece from a relationship of the points determined to be of deposit to the points dete

Abstract: A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such as unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.

Abstract: The invention provides a method for iris based biometric recognition. The method includes receiving an image from an image sensor and determining whether the received image includes an iris. The steps of receiving and determining are repeated until the received image includes an iris. Responsive to determining that a received image includes an iris, iris information corresponding to such received image is compared with stored iris information corresponding to at least one iris and a match decision or a non-match decision is rendered based on an output of the comparison. The invention additionally provides a system and computer program product configured for iris based biometric recognition.

Abstract: A method of detection of faults on circuit boards comprising the steps of capturing an image (14) of each of a plurality of circuit boards (10) and dividing each of the captured images (14) into a plurality of image segments, each having an image characteristic value. One of the circuit boards 10 is selected for testing and each image segment is compared with corresponding image segments of each other circuit boards (10) to define a plurality of differential image characteristic values. The differential image characteristic values for each image segment are ranked from lowest to highest and an nth differential image characteristic value is selected. An overlay image comprising a representation of the selected differential image characteristic values is created and displayed over the selected circuit board.

Abstract: Provided is a method for evaluating and decomposing a semiconductor device level for triple pattern lithography in semiconductor manufacturing. The method includes generating a conflict graph and simplifying the conflict graph using various methods to produce a simplified conflict graph which can either be further simplified or evaluated for decomposition validity. The disclosure also provides for applying decomposition validity rules to a simplified conflict graph to determine if the conflict graph represents a semiconductor device layer that is decomposable into three masks. Methods of the disclosure are carried out by a computer and instructions for carrying out the method may be stored on a computer readable storage medium.

Abstract: A method and system for imaging an object to be inspected and obtaining an optical image; creating a reference image from design pattern data; preparing an inspection recipe including one or more templates and parameter settings necessary for the inspection; checking the pattern and the template against each other, and selecting the reference image which corresponds to the template; detecting first and second edges in the selected reference image in accordance with the parameter setting using determined coordinates as a reference; detecting first and second edges in the optical image, this optical image corresponds to the selected reference image; and determining an inspection value by acquiring the difference between the line width of the optical image and the reference image using the first edge and second edge of the reference image and the first edge and second edges of the optical image.

Abstract: Defect management systems and methods are disclosed. A system for managing defects on an object includes an automatic defect classification (ADC) module, a lithographic plane review (LPR) module, and a defect progression monitor (DPM) module in communication with the ADC module and the LPR module. The DPM module is adapted to obtain information regarding a defect disposed on the object from the ADC module and the LPR module and determine if a repair or cleaning is needed of the object.

Abstract: An optical system is effective to illuminate and scan an interior wall of an object having an interior bore, such as a stent. The system includes a light source, an object support having a light conducting portion, an image taking lens, and a line scan camera. The interior bore and the light conducting portion of the object support are in axial alignment with a center optical axis of the image taking lens. A drive mechanism engages the object without impacting the axial alignment. Various aspect of this optical system include a rotating wheel or transparent plate as the drive mechanism. The object support may be an opaque rod having a light conducting portion or a transparent rod.

Abstract: The embodiments described herein relates to systems and method for testing user content of given mobile communication devices. According to one aspect, there is provided a method for testing user content of given mobile communication devices that includes the steps of providing at least one model image associated with at least one graphical user interface (“GUI”) screen of a model mobile communication device corresponding to the given mobile communication device, obtaining at least one test image associated with at least one GUI screen of the given mobile communication device, comparing the test image with the model image, and determining whether the user content of the given mobile communication device is different from the desired content of the model mobile communication device.

Abstract: Methods and apparatus to identify components from images of components are disclosed. An example method includes generating first keypoint signatures of an object from at least one image of the object and identifying the object using the first keypoint signatures. Identifying the object comprises: comparing the first keypoint signatures to assembly reference keypoint signatures at a first level in a hierarchical database, the assembly reference keypoint signatures comprising keypoint signatures of multiple views of assemblies containing sets of components; and based on the comparison of the first keypoint signatures to the assembly reference keypoint signatures, comparing the first keypoint signatures to component keypoint signatures at a second level in a hierarchical database lower than the first level, the component reference keypoint signatures comprising keypoint signatures of the components.

Abstract: Provided is a method of inspecting a substrate. The method includes: receiving an image of a pad area of substrate; determining and registering a start point pixel; tracing pixels having the same gradation as the start point pixel; determining a boundary area; designating a direction code to next point pixel on the basis of a current point pixel; extracting maximum distance pixel coordinates; and detecting a defect of the pad area.

Abstract: A method and system for imaging an object to be inspected and obtaining an optical image; creating a reference image from design pattern data; preparing an inspection recipe including one or more templates and parameter settings necessary for the inspection; checking the pattern and the template against each other, and selecting the reference image which corresponds to the template; detecting first and second edges in the selected reference image in accordance with the parameter setting using determined coordinates as a reference; detecting first and second edges in the optical image, this optical image corresponds to the selected reference image; and determining an inspection value by acquiring the difference between the line width of the optical image and the reference image using the first edge and second edge of the reference image and the first edge and second edges of the optical image.

Abstract: A method for controlling the functional output of a verification tool upon receipt of a circuit description comprises searching for a predetermined base pattern in the circuit description. The method further comprises searching for predetermined sub-patterns that are assigned to the base pattern, in the circuit description. The method further comprises the validation of each found sub-pattern based on a predetermined rule to minimize the set of reported errors that based on verification of the circuit description.

Abstract: A template matching module is configured to program a processor to apply multiple differently-tuned object detection classifier sets in parallel to a digital image to determine one or more of an object type, configuration, orientation, pose or illumination condition, and to dynamically switch between object detection templates to match a determined object type, configuration, orientation, pose, blur, exposure and/or directional illumination condition.

Abstract: The present invention relates to the acquisition of tilted series images of a minute sample in a short time. The present invention relates to: measuring in advance the relation between an amount of focus shift and a degree of coincidence at the time of acquiring tilted series images; calculating backwards a focus shift from the degree of coincidence on the basis of this relation; correcting the focus shift by controlling a stage, an objective lens, and the like; and thus acquiring the tilted series images. In addition, the present invention relates to: acquiring a reference image in advance at the time of photographing the tilted series images; obtaining the correlation between an acquired image and the reference image; and performing, if the degree of coincidence is equal to or smaller than a set value, processing such as the transmission of a warning message and the stop of an image acquisition sequence.

Abstract: Provided is a method of inspecting a substrate. The method includes: receiving an image of a pad area of substrate; determining and registering a start point pixel; tracing pixels having the same gradation as the start point pixel; determining a boundary area; designating a direction code to next point pixel on the basis of a current point pixel; extracting maximum distance pixel coordinates; and detecting a defect of the pad area.

Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Abstract: Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.