Fiber To Thin Film Devices Patents (Class 385/49)
  • Patent number: 10761280
    Abstract: A hermetic optical subassembly includes an optical bench having a mirror directing optical signals to/from an optical waveguide, a carrier supporting a photonic device, and an intermediate optical bench having a mirror directing optical signals between the photonic device and the optical bench. The optical bench and the intermediate optical bench optically aligns the photonic device to the waveguide along a desired optical path. In one embodiment, the photonic device is an edge emitting laser (EML). The mirror of the optical bench may be passively aligned with the mirror of the intermediate optical bench. The assembled components are hermetically sealed. The body of the optical benches are preferably formed by stamping a malleable metal material to form precise geometries and surface features. In a further aspect, the hermetic optical subassembly integrates a multiplexer/demultiplexer, for directing optical signals between a single optical fiber and a plurality of photonic devices.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: September 1, 2020
    Assignee: CUDOQUANTA FLORIDA, INC
    Inventors: Robert Ryan Vallance, Jeremy Burke, Rand Dannenberg
  • Patent number: 10620377
    Abstract: The various technologies presented herein relate to integrating an IC having at least one waveguide incorporated therein with a v-groove array IC such that an optical fiber located in a v-groove is aligned relative to a waveguide in the IC maximizing optical coupling between the fiber and the waveguide. The waveguide IC and the v-groove array IC are bonded in a stacked configuration. Alignment of the waveguide IC and the array IC in the stacked configuration enables advantage to be taken of lithographic accuracy of features formed with respect to the Z-direction. Further, kinematic pins and sockets are utilized to provision accuracy in the X- and Z-directions, wherein advantage is taken of the placement accuracy and fabrication tolerance(s) which can be utilized when forming the and sockets. Accordingly, automated alignment of the waveguide IC and the array IC is enabled, facilitating accurate alignment of the respective waveguides and fibers.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: April 14, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: David Bruce Burckel, Todd Bauer, Michael David Henry, Andrew Pomerene
  • Patent number: 10527792
    Abstract: An optical waveguide termination comprising a light-receiving inlet for receiving light to be terminated, a curved section extending from the inlet and having a continuously decreasing radius of curvature, and a light-terminating tip at an end of the curved section. The curved section may define a spiral waveguide, for example a logarithmic spiral, having a waveguide width that continuously decreases from the inlet to the tip.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: January 7, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Patrick Dumais
  • Patent number: 10530473
    Abstract: A system for monitoring a signal on an optical fiber includes a fiber optic connector having a housing couplable to a receptacle. An optical fiber that transmits a first optical signal has first fiber core at least partially surrounded by a cladding and has a first end terminating proximate the housing. The first optical signal is transmitted along the first fiber core. An optical tap has a first tap waveguide arranged and is configured to receive at least part of the first optical signal as a first tap signal. The first tap waveguide comprises an output port for the first tap signal for directing the tap signal to a detector unit. In other embodiments, a detector unit detects light from the optical signal that is propagating along the fiber cladding. The system is intended to permit a technician to easily and quickly, without having to remove a connector, determine whether an optical signal is propagating along a fiber cable.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: January 7, 2020
    Assignee: CommScope Connectivity Belgium BVBA
    Inventors: Koen Huybrechts, Jan Watté, Stefano Beri
  • Patent number: 10520679
    Abstract: An optical system includes a photonics chip, a bridge waveguide structure formed on the chip, and an optical fiber disposed over the chip and optically aligned with the bridge waveguide structure. A cavity between the bridge waveguide structure and the chip is at least partially filled with an adhesive resin and a filler material having a coefficient of thermal expansion (CTE) less than that of the adhesive resin. The filler material may include filler particles dispersed throughout the adhesive resin, or a discrete layer of material separate from the adhesive resin. The composite adhesive material filling the cavity has an effective coefficient of thermal expansion less than the coefficient of thermal expansion of conventional adhesive resins. This lower effective CTE improves the survivability of the overlying bridge waveguide structure following thermal cycling of the optical system.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: December 31, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Sarah Knickerbocker, Jorge Lubguban, Tracy Tong
  • Patent number: 10495830
    Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: December 3, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
  • Patent number: 10488603
    Abstract: A multi-tiered optical assembly includes a ferrule body having a mating face, a rear face, and a pair of spaced apart sidewalls, with the mating face, the rear face, and the sidewalls defining an opening. The ferrule body further includes a first support level, and a second support level, with the second support level being vertically spaced from the first support level. First and second flexible optical waveguide members each include at least one waveguide. The first waveguide member is disposed at the first support level and extends between the mating face and the rear face, and the second waveguide member is disposed at the second support level and extends between the mating face and the rear face.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: November 26, 2019
    Assignee: Molex, LLC
    Inventor: Malcolm H. Hodge
  • Patent number: 10459165
    Abstract: The present invention relates to an optical module, and more specifically, to an optical module which allows an optical coupling loss of an optical signal to be minimized and a frequency bandwidth thereof to be maximized. The optical module according to an embodiment of the present invention includes: a circuit substrate; an electronic element mounted on one surface of the circuit substrate; an optical element mounted on another surface perpendicular to the one surface of the circuit substrate; a capacitor mounted between the electronic element and the optical element; and an optical waveguide array on which an optical waveguide is disposed.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: October 29, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Won Bae Kwon, Jong Jin Lee, Eun Kyu Kang, Jeong Eun Kim, Soo Yong Jung
  • Patent number: 10453985
    Abstract: The present disclosure relates to an integrated light emitting device. The integrated light emitting device comprises a substrate of semiconductor material, a light emitting unit integrated into the semiconductor material, and at least one cavity formed into the semiconductor material between the substrate and the light emitting unit. At least portions of the at least one cavity may be formed by Silicon-On-Nothing (SON) process steps.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: October 22, 2019
    Assignee: Infineon Technologies Dresden GmbH
    Inventor: Thoralf Kautzsch
  • Patent number: 10409014
    Abstract: A photonic integrated circuit (PIC) package includes a PIC die including electro-optical circuitry having an optical waveguide system therein and a V-groove fiber optic receptacle on a first surface thereof. The V-groove fiber optic receptacle positions an optical element, e.g., optical fiber(s), for optical coupling with the optical waveguide system. An optical element is operatively coupled to the optical waveguide system and positioned in the V-groove fiber optic receptacle. A magnetic force inducer (MFI) is positioned to forcibly direct the optical element into position in the V-groove fiber optic receptacle in response to application of a magnetic field from a direction opposite the V-groove fiber optic receptacle in the first surface. During assembly, a magnetic field may be applied to the MFI to generate the magnetic force. After adhering the optical element, the magnetic field may remain to allow the PIC package to be moved with more security.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: September 10, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Koushik Ramachandran, Benjamin V. Fasano
  • Patent number: 10393962
    Abstract: A method for assembling a semiconductor device includes: receiving a first chip including a plurality of first bonding pads, a first standoff and a second standoff, wherein a first solder is deposited on each of the first bonding pads; depositing a second solder on each of the first and second standoffs; arranging a second chip over the first chip, wherein the second chip includes a plurality of second bonding pads, and at least one of the second bonding pads has a corresponding first bonding pad; heating the second chip over a melting point of the second solder to melt the second solder, and placing the second chip on the first chip to touch and solidify the second solder on each of the first and second standoffs; performing a reflow process to melt the first solder on each of the first bonding pads so that at least one of the first solders touches a corresponding second bonding pad; and waiting a predetermined period of time to allow the second chip to move until a side edge of the second chip touches a wav
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: August 27, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Yves Martin, Jae-Woong Nah
  • Patent number: 10357843
    Abstract: Disclosed herein are methods and apparatuses for scoring a glass article, including positioning a plasma flame of a plasma torch and the glass article in close proximity to one another; and moving the plasma torch across a surface of the glass article to form at least one indentation in the surface, wherein the at least one indentation is formed from the plasma flame melting at least a portion of the glass surface to form a scoring line, without penetrating through a total thickness of the glass article.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: July 23, 2019
    Assignee: Corning Incorporated
    Inventors: Monty Eugene Barnes, Dennis William Buckley, Ritesh Satish Lakhkar
  • Patent number: 10359572
    Abstract: Provided is a device and method for detecting an optical signal. The optical signal detecting device may include an optical de-multiplexer configured to de-multiplex an input optical signal to optical signals of different wavelengths; an optical coupling lens configured to allow the optical signals of different wavelengths to be incident; an optical signal reflector configured to reflect the optical signals of different wavelengths emitted from the optical couple lens; and an optical detector configured to detect the reflected optical signals of different wavelengths.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: July 23, 2019
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sae-Kyoung Kang, Joon Ki Lee, Jie Hyun Lee, Joon Young Huh
  • Patent number: 10302869
    Abstract: A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: May 28, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Nicolas Boyer, Richard D. Langlois, Paul Francis Fortier
  • Patent number: 10288810
    Abstract: A system including a first component having a lensed facet; and a second component optically coupled to the first component, the second component having a tapered facet, the tapered facet and lensed facet spaced from each other so as to establish evanescent-wave coupling between the first component and the second component.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: May 14, 2019
    Assignee: ASML Holding N.V.
    Inventors: Louis Zhongliang Lu, Tao Chen, Francisco Javier Berrios, Jiazong Zhang
  • Patent number: 10218125
    Abstract: An electrical connector includes: a contact module comprising an insulative housing having a base portion and a tongue portion, and a number of conductive terminals affixed to the insulative housing and each comprising a contacting portion exposed to a surface of the tongue portion, a soldering portion and a connecting portion connecting the contacting portion and the soldering portion; and a metal shell comprising a pair of locking grooves depressed forwardly from a rear surface thereof; wherein the insulative housing comprises a pair of mounting portions located at two lateral sides of a rear end thereof, the mounting portions are stuck in the locking grooves when the contact module is assembled to the metal shell along a rear-to-front direction, and a lower portion of each mounting portion is resisted against the rear surface of the metal shell.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: February 26, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jin-Guo Qiu, Jun Zhao, Wei Wen
  • Patent number: 10209465
    Abstract: A light shield may be formed in photonic integrated circuit between integrated optical devices of the photonic integrated circuit. The light shield may be built by using materials already present in the photonic integrated circuit, for example the light shield may include metal walls and doped semiconductor regions. Light-emitting or light-sensitive integrated optical devices or modules of a photonic integrated circuit may be constructed with light shields integrally built in.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: February 19, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Ruizhi Shi, Yang Liu, Ari Novack, Yangjin Ma, Kishore Padmaraju, Michael J. Hochberg
  • Patent number: 10209477
    Abstract: A micro-optics assembly and a method for assembling the micro-optics assembly are provided. The micro-optics assembly may include an optical bench having an opening, a cylindrical body disposed in the opening and having a solder well, a heating element thermally coupled to the solder well, and an optical element. The optical element may include a frame having a post and a micro-optic mounted in the frame. The post may be secured in a solid solder material disposed within the solder well in the cylindrical body. The solder may be reflowable such that the micro-optics assembly is reconfigurable without the need for optical realignment components permanently mounted to the optical bench.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: February 19, 2019
    Assignee: Lockheed Martin Coherent Technologies, Inc.
    Inventors: David Hwang, Andrew Jonathan Gleason, Michael L. Tartaglia
  • Patent number: 10168497
    Abstract: An apparatus may include a photonic device with at least a first waveguide having a light-conducting core bounded by at least one cladding layer, at least a second waveguide having a light-conducting core bounded by at least one cladding layer, wherein the first waveguide is aligned to couple with the second waveguide, wherein alignment of the first waveguide with the second waveguide with respect to at least one axis C coincides with at least one stop area of the photonic device resting on a stop surface of a corresponding support structure on a substrate, wherein the stop area is a stop in a recess from a surface of the photonic device. A method to fabricate the apparatus may include the recess is formed by etching of the photonic device, and/or the support structure is formed by etching of the substrate.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: January 1, 2019
    Assignee: RWTH Aachen
    Inventors: Florian Merget, Jeremy Witzens, Alvaro Moscoso-Martir
  • Patent number: 10168483
    Abstract: The present invention makes it possible to prevent an optical loss in association with mode field diameter conversion and to prevent deformation in a mode field converter. The present invention includes: (a) temporarily fixing an end surface of an optical fiber (1) to an end surface of a core part (8) via a highly-viscous resin (3); and (b) after the step (a), while butting the end surface of the optical fiber (1) against the end surface of the core part (8) through the highly-viscous resin (3), fixing the optical fiber (1) to a semiconductor optical device (100) at a place away from the end surface of the optical fiber (1).
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: January 1, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Hiroki Ishihara, Ryokichi Matsumoto
  • Patent number: 10151888
    Abstract: Methods and associated apparatuses are described that provide an optical waveguide structure configured for use within an optoelectronic connector. The optical waveguide structure includes a base member having a first surface defining a plurality of trenches including an optical transmission medium and one or more channels including an adhesive material. The optical waveguide structure includes a lid member having a first surface, where the first surface of the lid member is disposed against the first surface of the base member to form the optical waveguide structure. The one or more channels having the adhesive material serve to secure the lid member to the base member, and the plurality of trenches having an optical transmission medium allow optical signals to pass therethrough.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: December 11, 2018
    Assignee: Mellanox Technologies, Ltd.
    Inventors: Pierre Avner Badehi, Yaniv Kazav, Soren Balslev, Anna Sandomirsky
  • Patent number: 10147854
    Abstract: A solution for packaging an optoelectronic device using an ultraviolet transparent polymer is provided. The ultraviolet transparent polymer material can be placed adjacent to the optoelectronic device and/or a device package on which the optoelectronic device is mounted. Subsequently, the ultraviolet transparent polymer material can be processed to cause the ultraviolet transparent polymer material to adhere to the optoelectronic device and/or the device package. The ultraviolet transparent polymer can be adhered in a manner that protects the optoelectronic device from the ambient environment.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: December 4, 2018
    Assignee: Sensor Electronic Technology, Inc.
    Inventors: Maxim S. Shatalov, Saulius Smetona, Alexander Dobrinsky, Michael Shur, Mikhail Gaevski
  • Patent number: 10133016
    Abstract: An optical module for connecting a photoelectric conversion device on a substrate to a ferrule connected to an optical fiber includes a body configured to be mounted on the substrate, a first lens disposed on the body at a side thereof connectable to the ferrule, a second lens disposed on the body at a side thereof facing the substrate, and a core disposed in the body between the first lens and the second lens, wherein a refractive index of the core is higher than a refractive index of the body.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: November 20, 2018
    Assignee: FUJITSU COMPONENT LIMITED
    Inventors: Hongfei Zhang, Shigemi Kurashima, Satoshi Moriyama, Shinichiro Akieda, Rie Gappa, Mitsuki Kanda
  • Patent number: 10110311
    Abstract: An optical transceiver includes a substrate, a first transceiver module, a second transceiver module and an optical fiber module. The substrate defines an optical transceiver end. The first transceiver module and the second transceiver module are disposed on an outer surface of the substrate, and the first transceiver module is located between the optical transceiver end and the second transceiver module. The optical fiber module includes a first optical fiber and a second optical fiber. The first optical fiber is coupled to the first transceiver module, and the second optical fiber is coupled to the second transceiver module. A part of the second optical fiber is located above the first transceiver module.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: October 23, 2018
    Assignee: Prime World International Holdings Ltd.
    Inventor: Huan-Yu Lin
  • Patent number: 10073228
    Abstract: The present invention relates to a method for manufacturing vertical optical coupling structures (1) between first optical or optoelectronic components (2) and second optical or optoelectronic components (3). Said vertical optical coupling structures are made by: (1) depositing a main layer (A) onto a substrate (25) including second optical or optoelectronic components; and (ii) lithography and/or physico-chemical etching of the main layer. Each vertical optical coupling structure is made such as to be located facing and making contact with a second optical component located in the substrate. The unitary main layer comprises generally frusto-conical coupling portions (12) consisting of a material having a refractive index greater than the refractive index of air.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: September 11, 2018
    Assignees: CNAM—Conservatoire National Des Arts Et Metiers, Chambre de Commerce et D'Industrie de Region Paris Ile de France (ESIEE Paris)
    Inventors: Jean-Luc Polleux, Carlos Araujo-Viana
  • Patent number: 10020888
    Abstract: An optical transmitter may generate a first optical signal having a first wavelength and a second optical signal having a second wavelength. The optical transmitter may output the first and second optical signals to a link without performing a multiplexing operation. The optical transmitter may output part of the first optical signal to the link while part of the second optical signal is being output to the link. An optical receiver may receive the first and second optical signals, via the link, as separate optical signals. The optical receiver may receive part of the first optical signal from the link while part of the second optical signal is being received from the link. The optical receiver may provide the first and second optical signals to a photodetector array that includes a first photodetector to detect the first optical signal and a second photodetector to detect the second optical signal.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: July 10, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: Gunes Aybay, Valery Kugel
  • Patent number: 9995624
    Abstract: To improve light use efficiency and thereby achieve even higher sampling rates. An optical measurement device includes: a light source configured to emit illumination light including a plurality of wavelength components; an optical system configured to introduce an axial chromatic aberration into the illumination light from the light source and to receive reflection light reflecting from a measurement object where at least a portion of the measurement object lies along a line extending from the optical axis of the optical system; a spectrometer for separating the reflection light received at the optical system into wavelength components, and a detector including a plurality of light receiving elements arranged one-dimensionally to correspond to the dispersion direction of the spectrometer.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: June 12, 2018
    Assignee: OMRON Corporation
    Inventors: Hisayasu Morino, Jun Takashima, Kenichi Matoba, Masayuki Hayakawa, Naoki Fujiwara, Mariko Marukawa
  • Patent number: 9933578
    Abstract: Embodiments of the present invention are directed to fiber optic element devices, methods for aligning fiber optic elements, and batch formation methods for creating such fiber optic alignment devices.
    Type: Grant
    Filed: June 11, 2016
    Date of Patent: April 3, 2018
    Assignee: Microfabrica Inc.
    Inventor: Richard T. Chen
  • Patent number: 9897752
    Abstract: An optical end coupling type silicon optical integrated circuit is provided using an SOI substrate. This optical integrated circuit is constituted so as to connect with an external optical circuit at an end coupling part and have signal light incident to an optical circuit that includes a curved part. In the plane of the optical integrated circuit, the position of one end coupling part selected from among any thereof and the position of any multimode optical waveguide element to which a respective optical waveguide is connected via a respective curved part satisfy a positional relationship defined on the basis of a beam divergence angle [theta] of stray light.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: February 20, 2018
    Assignee: PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASSOCIATION
    Inventors: Shigeki Takahashi, Junichi Fujikata
  • Patent number: 9885835
    Abstract: Waveguide connectors and methods of forming the same include heating a polymer waveguide having one or more waveguide cores and alignment features to a first temperature. A ferrule having alignment features is heated to the first temperature, the ferrule having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature. The polymer waveguide is positioned on the ferrule without a waveguide backfilm. The alignment features of the polymer waveguide are bonded to the corresponding alignment features of the ferrule.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: February 6, 2018
    Assignee: International Business Machines Corporation
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Patent number: 9880363
    Abstract: An optical device includes: an optical element with a surface including one of a light-receiving portion and a light-emitting portion; a resin layer provided over the one of light-receiving portion and the light-emitting portion; and a resin lens provided over the resin layer, wherein the resin layer includes a first shape larger than a second shape of the resin lens in a direction parallel to the surface.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: January 30, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Mariko Kase, Takashi Shiraishi
  • Patent number: 9823419
    Abstract: An optical system may include a substrate that includes an etched region and a laser-induced breakage region. The optical system may further include an optical waveguide disposed on the substrate. The optical system may further include an optical device coupled to the optical waveguide within the etched region. The laser-induced breakage region may produce a predetermined coupling gap between the optical waveguide and the optical device.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: November 21, 2017
    Assignee: Ciena Corporation
    Inventors: Francois Pelletier, Michel Poulin, Marie-Josée Picard, Christine Latrasse
  • Patent number: 9804349
    Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: October 31, 2017
    Assignee: FINISAR CORPORATION
    Inventors: Maziar Amirkiai, Tao Wu, Mark Donovan, Hongyu Deng
  • Patent number: 9798089
    Abstract: Fiber optic connector assemblies and method for assembling the same are disclosed. In one embodiment, a fiber optic connector assembly includes an optical fiber having an inner glass region, a polymer layer surrounding the inner glass region, and a windowed portion, wherein the inner glass region is exposed at the windowed portion. The fiber optic connector assembly further includes a connector body having a demarcation region at a first end, wherein the optical fiber is disposed within the connector body such that at least a portion of the windowed portion is positioned in the demarcation region, and the optical fiber is adhered to the connector body at the windowed portion. In another embodiment, the demarcation region includes an opening in the outer jacket that exposes the at least a portion of the windowed portion of the plurality of optical fibers and the optical fibers are adhered to a portion of the cable.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: October 24, 2017
    Assignee: Corning Optical Communications LLC
    Inventors: Micah Colen Isenhour, Dennis Michael Knecht, James Phillip Luther, Reginald Roberts
  • Patent number: 9766406
    Abstract: An optical subassembly (1) includes a photonic integrated circuit (2), an external optical system (4) and an optical interface (6) that is arranged between the PIC and the external optical system. The optical subassembly includes a third material (7) and a fourth material (8). The third material (7) at least partially fills the optical interface between the PIC and the external optical system in order to minimize contamination of any kind. The fourth material (8) being in contact at least with the third material for sealing at least the third material from ambient moisture. In this way a low-cost near-hermetic environmental protection barrier (7, 8) may be provided. An optical system (14) including the optical subassembly and a method of fabricating such an optical subassembly are also described.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: September 19, 2017
    Assignee: EFFECT PHOTONICS B.V.
    Inventors: Robert William Musk, Tim Koene
  • Patent number: 9759876
    Abstract: A multi-channel optical module includes a stem configured to allow an optical active element transmitting and receiving an optical signal to be installed thereon, an optical module frame connected to the stem and configured to have an optical element forming an optical path corresponding to the optical active element, and an external housing configured to house the optical module frame therein and coupled to the stem, wherein the optical element includes a lens and a filter unit disposed in the optical path and an optical waveguide element to which an optical fiber is connected.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: September 12, 2017
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jeong Eun Kim, Hyun Seo Kang, Hyoungjun Park, Keo-Sik Kim, Ji Hyoung Ryu, Eun Kyoung Jeon, Young Soon Heo
  • Patent number: 9703057
    Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively provided on opposite end portions of an elongated insulation layer and including a first electric wiring of a first electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion provided on a portion of the insulation layer extending from the opto-electric module portions, and including an elongated optical waveguide on a back surface of the insulation layer optically coupled with the optical elements, and having a light signal transmission core. Further, an electrically conductive dummy pattern is provided on the front surface of the insulation layer in the interconnection portion for reinforcing the interconnection portion. The electrically conductive dummy pattern reinforces the interconnection portion to protect the waveguide from bending and twisting, while ensuring the flexibility of the interconnection portion.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: July 11, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuichi Tsujita, Naoki Shibata
  • Patent number: 9685741
    Abstract: A cable connector assembly comprises a cable, a connector connected with the cable. The connector comprises a plurality of contacts electrically connecting the cable, an insulative housing retaining the contacts, a metal shell having a top shell and a bottom shell assembled with each other around the insulative housing, and a fixing member fixing the cable. The bottom shell includes a rear wall having a opening for the cable to be inserted into. The top shell includes a top wall and a tongue piece extending from the top wall to the cable. The fixing member includes a main body fastening the cable and a soldering portion extending from the main body and soldering with the rear wall of the bottom shell.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: June 20, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jerry Wu, Jun Chen, Fan-Bo Meng
  • Patent number: 9612400
    Abstract: A multi-core optical fiber (100) comprises a plurality of optical cores (1, . . . , 8) to respectively transmit light and a plurality of cleaves (110a, 100b, 110c, 110d, 110e, 110f, 110g, 110h) extending from a surface (102) of the multi-core optical fiber (100) into the multi-core optical fiber. A first cleave (110a) comprises a surface (111a) to couple light out of the optical fiber, wherein a first optical core (1) ends at the surface (111a) of the first cleave (110a). An at least one second cleave (110b, . . . , 110h) comprises a surface (111b, . . . , 111h) to couple light out of the optical fiber, wherein at least one second optical core (2, . . . , 8) ends at the surface (111b, . . . , 111h) of the at least one second cleave (110b, . . . , 110h). The first and the at least one second cleave (110a, . . . , 110h) are staggered along the longitudinal axis (101) of the multi-core optical fiber (100).
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: April 4, 2017
    Assignee: CCS TECHNOLOGY, INC.
    Inventors: Douglas Llewellyn Butler, Andreas Matiss, Eric Stephan ten Have
  • Patent number: 9551845
    Abstract: The present disclosure relates to a method for manufacturing one or more optical engine packages, each optical engine package comprising a silicon photonic die. The method includes receiving a substrate comprising a package portion and a cutting area adjacent to the package portion, assembling the optical engine package on the substrate such that an edge-coupled waveguide of the silicon photonic die overlaps a boundary between the cutting area and the package portion, and cutting the optical engine package and the substrate in the cutting area to expose the edge-coupled waveguide for optical coupling thereof to an optical fiber core.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: January 24, 2017
    Assignee: Microsemi Storage Solutions (U.S.), Inc.
    Inventor: Daniel Kim
  • Patent number: 9497860
    Abstract: Exemplary embodiments of methods and apparatuses to provide an electro-optical alignment are described. An electrical connector is formed on a printed circuit board substrate that extends onto a side surface of the substrate to form an electrical turn. An optoelectronic die is placed onto the printed circuit board substrate. The optoelectronic die on the printed circuit board substrate is erected over a mounting board to provide optical coupling substantially parallel to the mounting board.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: November 15, 2016
    Assignee: LATTICE SEMICONDUCTOR CORPORATION
    Inventor: Kihong Kim
  • Patent number: 9465164
    Abstract: Disclosed is an electronic apparatus including a circuit element including a first main surface, a first electrode provided in the first main surface, an optical element including a second main surface and being configured to either transmit or receive an optical signal, a second electrode provided in the second main surface, a window which is provided in the second main surface and through which the optical signal passes, a wiring layer provided on the first main surface and the second main surface, the wiring layer electrically connecting the first electrode and the second electrode, and an optical waveguide, which is provided on the second main surface and optically connected to the window, the optical signal passing through the optical waveguide.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: October 11, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Shinya Sasaki, Akio Sugama
  • Patent number: 9459417
    Abstract: In an integrated optical receiver or transmitter, both the displacement of an optical axis caused by thermal changes and the property degradation of an optical functional circuit are inhibited. A planar lightwave circuit having a substrate and a waveguide-type optical functional circuit formed thereon composed of a material different from that of the substrate, and includes a waveguide region formed only of an optical wavelength that is in contact with a side forming an emission-end face of the optical waveguide for propagating the light emitted from the optical functional circuit or an incident-end face of an optical waveguide for propagating the light incident on the optical functional circuit. The planar lightwave circuit is fixed to a fixing mount only at the bottom of the substrate where the waveguide region is formed.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: October 4, 2016
    Assignees: Nippon Telegraph and Telephone Corporation, NTT Electronics Corporation
    Inventors: Yusuke Nasu, Ryoichi Kasahara, Ikuo Ogawa, Kenya Suzuki, Fumihiro Ebisawa
  • Patent number: 9417404
    Abstract: Waveguide connectors and methods of forming the same include heating a polymer waveguide having one or more waveguide cores and alignment features to a first temperature. A ferrule having alignment features is heated to the first temperature, the ferrule having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature. The polymer waveguide is positioned on the ferrule without a waveguide backfilm. The alignment features of the polymer waveguide are bonded to the corresponding alignment features of the ferrule.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: August 16, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Patent number: 9356163
    Abstract: A method for monolithically integrating semiconductor waveguides, photodetectors and logic devices, i.e., field effect transistors, on a same substrate is provided. The method includes the use of a double semiconductor-on-insulator substrate that includes from bottom to top, a handle substrate, a first insulator layer, a first semiconductor material layer, a second insulator layer, and a second semiconductor material layer. The waveguides, photodetectors and logic devices can be formed in different regions of the substrate and are present atop a first insulator layer of the double semiconductor-on-insulator substrate.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: May 31, 2016
    Assignee: International Business Machines Corporation
    Inventors: Fei Liu, Christine Q. Ouyang, Alexander Reznicek, Jeremy D. Schaub
  • Patent number: 9348094
    Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: May 24, 2016
    Assignee: Skorpios Technologies, Inc.
    Inventors: Daming Liu, John Zyskind
  • Patent number: 9335480
    Abstract: An edge coupling method comprising positioning a first photonic device such that a first edge coupler of the first photonic device is at least partially aligned with a first alignment waveguide of a second photonic device and such that a second edge coupler of the first photonic device is at least partially aligned with a second alignment waveguide of the second photonic device, wherein the first edge coupler widens towards an edge of the first photonic device and the second edge coupler widens towards the edge, and wherein the first edge coupler and the second edge coupler are optically coupled to each other by an interconnect, transmitting a light through the first alignment waveguide, detecting the light at the second alignment waveguide, and aligning the first photonic device and the second photonic device based on the detecting.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: May 10, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Dritan Celo
  • Patent number: 9335473
    Abstract: A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: May 10, 2016
    Assignee: Taiwan Semiconductor Manfacturing Company, Ltd.
    Inventors: Jui Hsieh Lai, Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao
  • Patent number: 9331787
    Abstract: An optical communication device includes a printed circuit board (PCB), a light emitting element, a light receiving element, and a light waveguide. The PCB includes a substrate. The substrate includes a first end surface and a second end surface opposite to the first end surface. The light emitting element is electrically connected to the first end surface. The light receiving element is electrically connected to the second end surface. The light waveguide includes a light incident end and a light emergent end. The light waveguide is embedded in the substrate. The light incident end is exposed to the first end surface and optically aligned with the light emitting element along a transmitting direction of the light waveguide. The light emergent end is exposed to the second end surface and optically aligned with the light receiving element along the transmitting direction of the light waveguide.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: May 3, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kuo-Fong Tseng
  • Patent number: 9323014
    Abstract: An apparatus includes a base substrate, a light rotation module and a flexible printed circuit board (PCB). The light rotation module has a bottom surface mounted on the base substrate and a top surface coupled to one or more optoelectronic transducers, and is configured to direct optical signals between the respective optoelectronic transducers and optical ports on a side perpendicular to the top surface. The flexible printed circuit board (PCB) includes a first end that is attached to the top surface of the light rotation module and has the optoelectronic transducers mounted thereon, a second end attached to the base substrate, and conductive traces disposed between the first and second ends to direct electrical signals between the optoelectronic transducers and the base substrate.
    Type: Grant
    Filed: May 28, 2012
    Date of Patent: April 26, 2016
    Assignee: MELLANOX TECHNOLOGIES LTD.
    Inventor: Shmuel Levy