Abstract: A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

Abstract: An apparatus for aligning the cores of the two optical waveguides. The apparatus includes a control loop for receiving an aligning signal launched through the core of one of the optical waveguides. The control loop may effectuate the aligning signal to propagate through the cores of the optical waveguides. The control loop may include a detector for generating a detecting signal in response to detecting the aligning signal. Moreover, the control loop may include a machine-vision system for generating a manipulation signal in response to the detecting signal. The control loops may also include a controller for physically aligning one of the optical waveguides with respect to the other optical waveguide in response to the manipulation signal. The controller may perform the physically alignment by means of a robotic tool. The apparatus may also include a means for splicing the optical waveguides.

Abstract: An apparatus comprising a substrate having a trench therein, the trench extending to an edge of the substrate, a waveguide array positioned in the trench, the waveguide array extending to the edge of the substrate, and a ferrule attached at or near the edge of the substrate and spanning a width of the waveguide array, the ferrule being directly in contact with a surface of the waveguide array. A process comprising positioning a waveguide in a trench on a substrate, the waveguide extending to an edge of the substrate, and attaching a ferrule at or near the edge of the substrate, the ferrule including a recess having a bottom, wherein the bottom is in direct contact with a surface of the waveguide.

Abstract: A bench-joining optical component and a first optical component are aligned on a first optical bench, and then rigidly coupled to the first bench, in order to form a first portion of an optical subassembly. Following completion of the first portion, all components in the first portion are pre-aligned and fixed with respect to each other, moving as a unit. A third optical component is aligned and permanently coupled to a second optical bench, in order to form a second portion of the optical sub-assembly. The first and second portions of optical sub-assembly are combined by positioning an exposed side of the bench joining optical component on the second bench, aligning the bench-joining optical component with the third optical component on the second bench, and permanently securing the bench-joining optical component to the second bench.

Abstract: Electrets are used in a variety of MEMS-based actuator devices. The electret is able to store electrical charge for a long time with negligible charge leakage. Therefore, when an electret is incorporated into a MEMS device that requires actuation, the device can be initially biased to any desired actuation state for a long period of time without the use of external bias voltages. Such a MEMS-based device may include a MEMS-based actuator having at least a first deflectable member and at least a second member. The first deflectable member and the second member are provided with a floating electrode and a second electrode. A charge on the first floating electrode is selected so as to position the first deflectable member at a desired separation distance from the second member. The device may be used to align an optical component or to change the electrical characteristics of an electrical element.

Abstract: An optical module includes a base portion; a surface type optical element receiving or emitting light; an optical waveguide being mounted on the base portion; a holding member being mounted on the base portion; a cap being mounted on the base portion; and a fixing member. The optical waveguide includes on an end portion of the optical waveguide light input/output end face that transmits light therebetween. The holding member positions and holds the surface type optical element and one end portion of the optical waveguide. The cap includes a light transmitting window provided in a position opposing to the other end portion of the optical waveguide. The cap at least partially covers the optical element and the optical waveguide. The fixing member fixes the other end portion of the optical waveguide and the cap.

Abstract: An integrated type optical coupling device capable of easily accurately performing an optical arrangement between a narrow-pitch multi-channel optical waveguide and an optical fiber array and a master used in fabricating the same are provided. By forming a fixing projection between the optical fibers, the dynamic stability of the optical fiber array is increased and the optical arrangement between the optical waveguide and the optical fiber is easily accurately performed by hand. Accordingly, the cost required for the alignment is reduced and the alignment error due to the rolling of the optical fiber is not generated. In addition, the multi-step metal master is fabricated by using a photoresist film for X-ray exposure, and the narrow-pitch multi-channel optical coupling device is fabricated in a hot embossing method using the same, thereby the high-integrated device can be fabricated at a low price.

Abstract: An optical communication module is provided with a platform to provide an accurate axial alignment with optical transceiving subassemblies. In the optical communication module, axes of the optical transceiving sub-assemblies are aligned by virtue of previously established axial alignment of the platform, and the platform is fixed to a main body by inserting an insertion jaw of a cover into an insertion groove formed on an upper surface of the platform. After the optical transceiving subassemblies are inserted into the platform having the axial alignment required for a system, a bonding agent is filled into spaces defined in the platform, thereby preventing the axes from deviated by an external force.

Abstract: An optical device mounted substrate assembly includes a ceramic substrate having a first recess, an optical device mounted on the ceramic substrate and having one of a light emitting portion and a light receiving portion, the optical device being to be optically connected to one of an optical waveguide and an optical fiber connector in way as to align optical axes of the optical wave guide or the optical fiber connector with each other, a resin layer disposed in the first recess and having a second recess smaller in diameter than the first recess, and an alignment guide member fitted in the second recess and having a protruded portion protruding from a front surface of the ceramic substrate and fittingly engageable in an alignment hole of one of the optical waveguide and the optical fiber connector. A fabrication method of such a substrate assembly is also provided.

Abstract: An optical fiber coupling, for example, an optical switch, for coupling a light source with a light-receiving end face of an optical waveguide comprises a lens for focusing a light beam emitted from the light source at a focal point on the light-receiving end face of the optical waveguide. An adaptive coupler positioned in the optical path is responsive to a beam steering control signal for steering and aligning the focal point relative to the light-receiving end face of the optical waveguide.

Abstract: An optical fiber axial alignment method and related method, and an optical fiber fusion splicing method and related device are disclosed wherein a butt alignment section 9 has a butt alignment groove portion 7 to allow at least one pair of optical fibers 3 to be positioned such that distal ends of optical fibers 3 mutually but one another. Optical fiber guide sections 21 on both sides of the butt alignment section 9 have guide grooves 23, whose centers are positioned on substantially straight lines interconnecting centers of at least one pair of opposing butt alignment groove portions formed on the butt alignment section 9, and are able to elevate above the butt alignment section 9.

Abstract: An alignment apparatus for optical components includes chemically co-etched parts which may be assembled with high tolerances and in a repeatable manner. The resulting construction, together with a translatable stage and/or a micrometer, allows for rapid and extremely precise alignment of the mounted optics.

Abstract: An optical device includes an apparatus for laterally shifting an optical beam. The optical device may be used in a focusing apparatus coupling an optical beam from a source waveguide to a receiving waveguide. The device may be an optical isolator that is mounted on supports that are slidably engaged with one another. The engagement may be at curved surfaces, to allow one support to rotate relative to the other. By rotating the optical isolator, a beam from the source waveguide and focused through the isolator may be selectively steered to couple it into the second waveguide. Such beam steering may be useful where the second waveguide has been misaligned from its optimum location. The beam steering may also be used to correct for post-weld displacement, where a lens of the focusing apparatus or other optical component has been misaligned during assembly.

Abstract: A subassembly includes a supporting substrate having a V-shaped groove at which a member is disposed, a laser diode mounted at the supporting substrate, and a lens element, which includes a lens portion formed at a surface of an optical substrate and a projection portion having a contour which places the projection portion in contact with the V-shaped groove at the supporting substrate when the lens element is mounted, and which is positioned relative to the laser diode. An optical module includes the subassembly, a package used to package the subassembly and an interface. The interface includes an optical fiber to be optically coupled with the laser diode via the lens element and is positioned as it comes in contact with the package.

Abstract: An optical interface between an optical fiber and a photodiode is provided. The optical fiber has an end. The optical interface includes a lens located such that a chief ray of an optical signal outputted at said end traverses a center of the lens. The lens may be a ball lens or a lens having an orientation such that the chief ray is incident substantially normal to a center of the lens.

Abstract: Active optical alignment of plastic chip-scale-package (450) laser and photo detecting diode devices (420) is provided by use of an active probe (120) to make alignment structures (300), such as précising holes, that are used to align the optical device (420) into a transmit/receive module. An optical connector (140), such as an optical fiber, transmits light to, or receives light from, the optical device (420). Using an electrical contact (115, 120), laser diode devices are lighted or photo detecting diode devices are electrically interfaced. The optical connector (140) steps to, locates and contacts each optical device on a fabricated frame of multiple devices. The optical connector (140) is manipulated to an optimal coupling position where the best signal, either optical or electrical, is obtained. An optimal position for making the précising holes, e.g., using a machining laser, is determined as an offset from the optimal position of the optical connector.

Abstract: A method is provided for making ferrules for connecting optical fibers to other optical fibers or to an optical input device such as an optical chip. The method utilizes ceramic greensheets or silicon wafers. In one method, the greensheets are stacked and laminated and then fiber optic through openings are provided in the laminate for holding the fibers. The laminate is then sintered forming the ferrule.

Abstract: A photonic integrated chip having low insertion loss and facilitating alignment of the optical fiber with an optical device, preferably a waveguide or optical detector. The photonic integrated chip includes an optical fiber having a substantially spherical lens attached to one end. The device includes an etched via that receives the spherical lens attached to the optical fiber. An optical device is aligned with the via opposite the spherical lens such that light transmitted through the spherical lens is transmitted to the optical device. An anti-reflection coating is preferably applied on the end of the optical device abutting the via and the surface of the spherical lens to reduce scattering and insertion loss during transmission of data from the spherical lens to the optical device. Index matching fluid is alternatively disposed between the spherical lens and the via for this same purpose.

Abstract: A controlling apparatus and a controlling method of an optical switching device are capable of automatically correcting angle deviations of tilt-mirrors to thereby reduce an optical loss.

Abstract: An optical fiber array includes an alignment substrate, a plurality of ferrules, and a plurality of optical fibers. The alignment substrate has a plurality of guide holes which are two-dimensionally arrayed and extend through the substrate. The ferrules are respectively inserted into the guide holes in the same direction and have through holes in the central portions. The optical fibers are fitted and held in the respective through holes. The guide hole is formed into a cylindrical shape having a diameter substantially equal to the outer diameter of the ferrule. The light incident/exit end face of the optical fiber is exposed on one end face of the ferrule.

Abstract: In a method for coupling an optical waveguide to a light emitting diode (LED) within a resin case, an input end of the optical waveguide is mounted proximal to a surface formed in the resin case parallel to a light-emitting face of the LED. The optical waveguide and the resin case can be bonded by a light or thermally curable resin that is applied and subsequently solidified. The light or thermally curable resin may be a photopolymer sensitive to light emerging from the waveguide. An automated coupling system is provided to optimize the coupling conditions using the in-coupled light efficiency feedback and controller. Finally a method is described allowing the coupling efficiency to be controlled using external excitation forces or light intensity variations, using electro-optic, magneto-optic, thermo-optic, light polarization sensitive or nonlinear properties of the filler material used between the resin case and waveguide.

Abstract: Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

Abstract: A manipulator for a fiber optic cable assembly (FOCA) provides microradian accuracy in control of the direction of a beam emanating from the FOCA. Such manipulators can control FOCAs to control the incidence angles of beams at a beam combiner in a beam-combining unit. Accordingly, fewer additional optical elements are required for control of input paths in the beam-combining unit. The manipulator and the beam-combining unit are accurate enough for use in an interferometer that combines beams with different frequencies and polarizations. One such interferometer includes a Zeeman split laser providing a heterodyne beam. A beam splitter separates frequency components of the beams, and AOMs increase the frequency separation between the separated beams. The separated beams can be sent via optical fibers to the beam-combining unit, which combines the beams for use in interferometer optics.

Abstract: A holder for holding optical fibers has pin inserting holes to which corresponding positioning pins are pierced from one end to another. An optical fiber fixing plate has fixing holes corresponding to the optical fibers and pin inserting holes corresponding to the positioning pins. On an equipping surface of the fixing plate is formed a reinforcement layer having piercing holes corresponding to the fixing holes and pin piercing holes corresponding to the pin inserting holes. Each optical fiber is fixed and adhered by inserting to each fixing hole while the pins are inserted to the pin inserting holes of the holder, pin piercing holes of the reinforcement layer and the pin inserting holes of the fixing plate. A front surface of the fixing plate is planarized by polishing the surface. Positions of the optical fibers are easily defined at an end surface of the optical fiber holder with high precision.

Abstract: Micromachined passive alignment assemblies and methods of using and making the same are provided. The alignment assemblies are used to align at least one optical element. The alignment assemblies may be configured with kinematic, pseudo-kinematic, redundant or degenerate support structures. One alignment assembly comprises a base and a payload, which supports at least one optical element. The payload may be coupled to the base via connecting structures. The base, the payload and/or the connecting structures may have internal flexure assemblies for preloading a connection, thermal compensation and/or strain isolation.

Abstract: A V-groove is formed in a platform of single crystal silicon by anisotropic wet etching based on its crystal orientation, and a convexity of an optical element chip is fitted in an intermediate portion of the V-groove. Quadrangular frustoidal convexities are formed in rows and columns on a single crystal silicon wafer by anisotropic wet etching, then a photonic crystal filter element is formed as an optical element on the protruding end face of each convexity, and the wafer is cut for each optical element into individual optical element chips. When optical fibers are disposed in the V-groove at both sides of the chip, cores of the optical fibers and light inlet and outlet ports of the optical element are aligned with each other.

Abstract: The invention provides an optical module that enables to increase the optical coupling efficiency without being dependent on the thickness of a substrate. The optical module, detachably coupled to a connector provided at one end side of an optical fiber, can include a substrate having a first hole, a translucent layer arranged so as to cover, at least, the first hole on one surface side of the substrate, and an optical element that is arranged inside the first hole and on the translucent layer and carries out transmission or reception of light signal to/from the optical fiber through the translucent layer.

Abstract: An optical matrix switch station (1) is shown mounting a plurality of optical switch units (15, 17), each of which includes a mirror (29), moveable in two axes, for purpose of switching light beams from one optical fiber to another. A mirror assembly (41) is formed from a single body of silicon and comprises a frame portion (43), gimbals (45), mirror portion (47), and related hinges (55). Magnets (53, 54) and air coils (89) are utilized to position the central mirror surface (29) to a selected orientation. The moveable mirror and associated magnets along with control LED's (71) are hermetically packaged in a header (81) and mounted with the air coils on mounting bracket (85) to form a micromirror assembly package (99) mounted in each optical switch unit.

Abstract: An optical demultiplexer includes a first light bandpass filter that receives an input light beam at a first angle of incidence, passes a first light wavelength, and reflects a reflected beam, and a second light bandpass filter that receives the reflected beam at a second angle of incidence and passes a second light wavelength. A beam redirection element such as a reflective surface receives the reflected beam from the first light bandpass filter and redirects the reflected beam toward the second light bandpass filter at the second angle of incidence.

Abstract: An apparatus and method for cleaving an optical fiber waveguide comprises a support base, a fixed fiber support including a fixed fiber base and a self-aligning fiber holder, a fiber pull tension assembly including a tension assembly base and a rotatable pull clamp, a tension spring, and a scribing knife assembly. The self-aligning fiber holder and the pull clamp support the fiber in an adjustable tension applied by the tension spring. The knife assembly comprises a blade carriage reciprocally driven on a linear slide by a motor drive assembly through a crank and a crank actuator. On the blade carriage is mounted a scribing blade borne on a blade arm that is upwardly biased. A guide pin on the blade arm engages a generally parallelogram-shaped guide track in the fixed fiber base. The guide track has an upper track and a lower track. During forward motion of the blade carriage, the guide pin travels in the lower track, thereby depressing the blade arm.

Abstract: Is provided a method of forming a polymer waveguide for passive alignment to an optical fiber in an optical module. A groove mounting an optical fiber thereon is formed on a substrate, and a shielding layer pattern is formed to selectively shield the groove. Polymer layers for an optical waveguide, which extend to the shielding layer pattern, are formed on the substrate, and the layers are patterned, thereby forming a polymer waveguide. The shielding layer is removed, and the groove is exposed. An optical fiber aligned to the optical waveguide is mounted on the exposed groove.

Abstract: An apparatus for passively aligning first and second substrates having micro-components disposed thereon when the substrates do not include patterned surfaces which face each other. The apparatus includes a first depression which cooperates with an alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the first substrate and a second depression which cooperates with a second alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the second substrate. The first and second depression of the alignment apparatus and the alignment spheres cooperate to passively align micro-components disposed on each of the substrates.

Abstract: An optical fiber connection arrangement includes an alignment sleeve for coaxially aligning optical fibers mounted in ferrules. A gap between the ends of the optical fibers allows some light to escape. A sensor responds to the leaked light, and the resulting signal is processed to determine whether light signal is present or absent.

Abstract: An optical waveguide such as an optical fiber extends across a semi-rigid substrate or optical back plane and is made of conformal materials having indices of refraction selected to provide substantially total internal reflection of light transmitted within a core. An optical pin is made of substantially rigid optically transmissive materials. A receptacle in the substrate or optical backplane removably receives and holds the optical pin to allow a beveled terminal end of the pin to penetrate the core of the optical fiber to establish a gap-less interface that provides an optical path between the core and the pin.

Abstract: An optical switch and method for assembling are described. Optical arrays are mounted on a flex plate with an interface between them. The direction of certain forces on the flex plate allows coupling/decoupling of the optical arrays. The flex plate includes an area which exhibits a different flex profile than the remainder of the flex plate and that is located beneath the optical arrays interface. Flexing of the flex plate optically couples the optical arrays. A tool with grooves is used to align the optical arrays relative to each other. The tool uses grooves and spheres to mate with the optical arrays in such a way as to provide an appropriate interface between the optical arrays.

Abstract: A positioning and measuring station for photoelectric elements includes a base, a platen, a five-axis driving module and a retaining member. The platen is for holding a measuring object. The five-axis driving module is located between the base and the platen for driving the platen axially with respect to X, Y and Z axes, or rotatable on a plane or tiltable against a plane relative to the base. The retaining member is located on one side of the platen to dynamically adjust the extending distance of the platen so that the measuring object may be leaned thereon for alignment to define the holding position of the measuring object on the platen.

Abstract: A self-contained means to move a media or component, such as fiber (12) or other miniature object, such as a lens, into a desired position is given. The fiber (12) or component is moved in various dimensions to achieve the desired location and is locked into position after the move. An input electrical signal, such as a voltage or current controls movement. A thermal actuator comprises the micro-positioner (80) using semiconductor technology in one embodiment. In another embodiment, of the present invention, a thermal or electrostatic actuator uses mechanical gears to move the fiber. Another embodiment of the present invention is implemented using mechanical technology such as microelectromechanical system (MEMS) technology. Another embodiment of the present invention, utilizes piezoelectric materials to facilitate fiber movement.

Abstract: An optical-electrical interface includes an alignment interface and an optoelectronic die. The alignment interface is mounted to a substrate and includes a waveguide port to receive an external waveguide from a first side. The alignment interface includes a conductor disposed on a second side of the alignment interface to couple to a conductor on the substrate. The optoelectronic die is mounted to the second side of the alignment interface. The optoelectronic die includes an electrical port coupled to the conductor disposed on the alignment interface, an optoelectronic device coupled to the electrical port and an optical port aligned to optically couple the optoelectronic device to the external waveguide through the alignment interface.

Abstract: A stage positioning system and method for aligning optical components according to a figure of merit is disclosed. The system includes a stage assembly having six axes of freedom wherein the pivot point of the stage assembly motion is user definable and preferably outside the envelope formed by the stage assembly. The stage assembly includes three sub-assemblies. A base sub-assembly provides x and z axes motion, a yaw stage provides yaw about the y axis, and a three-axis stage provides y motion as well as pitch and roll about the x and z axes, respectively.

Abstract: A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.

Abstract: An inexpensive optical module that avoids misalignment of optical axes and is fixed together with high reliability. Optical elements are aligned with each other and then fixed to a connecting member. The connecting member has first and second bonding surfaces. A relatively large area of the first and second bonding surfaces contacts the optical elements. The connecting member has a simple structure. This facilitates the manufacturing of the connecting member. The distance between the optical elements and the connecting member is minimized. Thus, the optical element is fixed together with high reliability.

Abstract: A coupler assembly for an optical backplane system having a backplane and two or more circuit packs connected to that backplane. Each circuit pack has an optical transceiver and the backplane has an optical pipe (e.g., an array of waveguides) adapted to guide optical signals between the transceivers of different circuit packs. A coupler assembly is provided for each transceiver to couple light between that transceiver and the optical pipe. Advantageously, the coupler assembly has a movable optical element that can accommodate possible misalignment between the backplane and the circuit pack. In one embodiment, the movable optical element is an array of MEMS mirrors, each mirror adapted to direct light between an optical transmitter or receiver and the corresponding waveguide of the optical pipe.

Abstract: Apparatus is disclosed for precision alignment and assembly of opto-electronic components relative to one another, the apparatus comprising a selected optical component having a periphery forming at least one flat surface; a holding block having at least one attachment region corresponding to the at least one flat surface of the selected optical component; a positioning mechanism having a first portion and a second portion, the first portion configured to position the selected optical component relative to another opto-electronic component, and the second portion configured to position the holding block relative to the selected optical component and in contact with a platform in attachment with the another opto-electronic component; and an attachment component disposed between the selected optical component and the holding block, and the attachment component disposed between the holding block and the platform so as to fix the selected optical component in position relative to the another opto-electronic compo

Abstract: A temperature resistant waveguide is mounted to an SMT LED package to provide a complete module that can withstand temperatures found in a solder reflow process without deformation or damage. The waveguide is composed of a high temperature thermoplastic and is coupled to the LED using automated equipment with optical markings for precise positioning and construction. The SMT LED module is automatically located on a printed circuit board and exposed to temperatures for a solder reflow process. The high temperature thermoplastic does not deform during the solder reflow process, thereby providing a robust SMT LED module that can be automatically manufactured and placed on a printed circuit board, without additional steps or human intervention.

Abstract: A semiconductor laser (41) is fixed onto a base part (22) with a submount (32) and a reference optical axis (5) is determined by the semiconductor laser (41). A groove (222) having a U-shaped section is formed on a bonding part (221), and solder (31) is applied in the groove (222) and melted and a collimator lens (42) supported by a supporting arm (61) is moved to the groove (222). A light beam emitted from the semiconductor laser (41) is guided through the collimator lens (42) to an image pickup part (7), where an image representing the state of the light beam is acquired. The collimator lens (42) is positioned with respect to the reference optical axis (5) on the basis of the image and fixed onto the base part (22) out of contact therewith, with the solder interposed therebetween. This simplifies a structure of an optical element module (11) in which the collimator lens (42) is positioned with respect to the reference optical axis (5) with high accuracy.

Abstract: Fiber, lens and sensor arrays and their precision alignment for optical devices with free space light propagation is disclosed. Fabrication methods of arrays and their assembly are also proposed. In one implementation, a device includes a fiber alignment module holding fibers in parallel to form a fiber array. The fiber alignment module includes first and second alignment plates, and a spacer plate engaged between the first and second alignment plates. Each alignment plate includes an array of through holes to respectively hold the fibers. A lens array can be engaged to the fiber alignment module to align lenses to their corresponding fibers. Passive alignment features may be formed at interfacing surfaces of different layers to assist the alignment. Applications of these integrated fiber, lens and sensor arrays to optical cross-connect switches and reconfigurable add-drop multiplexers are also disclosed.

Abstract: Described are various optical, opto-electrical and electrical components and subsystems. Some embodiments include input and output waveguides supporting opposing facets separated by a gap. The degree to which the opposing facets are aligned with respect to one another controls the light intensity in the output waveguide. An active closed-loop control mechanism dynamically controls the extent of waveguide alignment to maintain a desired output intensity. In other embodiments, the path between opposing facets can be selectively blocked by a micro blade. Still other embodiments combine switching with optical power equalization for ease of integration.

Abstract: Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

Abstract: A light beam preparation arrangement includes a light tunnel, a rotatable unit, and a drive unit. In one aspect, a fixation rigidly attaches the light tunnel directly to the drive unit. In another aspect, temperature of the light tunnel in controlled. In another aspect, the rotatable unit is spaced a distance from the light tunnel, and the distance is controlled. In another aspect, alignment between the light tunnel and the rotatable unit is controlled. In another apsect, the light tunnel is hollow and a gas flows though the tunnel.

Abstract: A planar-mounted optical waveguide transmitter-receiver module has a plurality of separated silicon substrates and a PLC substrate hybrid-integrated. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and an adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of the optical waveguide (PLC) substrate, in which is formed an optical waveguide.